JPH10147089A - Non-contact ic card and production thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an excellently strong non-contact IC card accommodating an IC module, and an easy production method of the same. SOLUTION: By welding the periphery of the open hole of the center core 21 and the periphery mold resin of the IC module 10 with a ultrasonic welder at the time of forming an open hole to be fitted with an IC module 10 in a plastic sheet to be the center core 21 so as to insert the resin-molded IC module 10 to the open hole for laminating an over sheet, the module and the center core sheet can be fixed so that the production of a non-contact IC card can be facilitated. Further, generation of malfunction by curved deformation can be prevented owing to the improvement of the IC card strength.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a card in which a flat electronic component such as an IC module is included in a card base material, and more particularly to a non-contact type IC card and a method of manufacturing the same.

[0002]

2. Description of the Related Art An IC is embedded in a plastic card base material.
A card that contains a module and exchanges signals with the outside via a terminal plate is known as a contact-type IC card and is already widely used. On the other hand, recently, a non-contact type IC card, which transmits and receives signals without using an external device via a terminal board, has been used. In general, such a non-contact type IC card is manufactured by forming an opening in a core sheet, fitting an IC module into the opening, overlaying an oversheet, and hot-press molding. In the case of a contact type IC card, even if an IC module is included therein, a terminal plate larger than the module is provided on the surface, so that there is no problem that the internal IC module causes deformation such as unevenness on the card surface. .

Here, the card base material has a thickness of 0.76 m.
Insulating plastic sheet laminates such as hard vinyl chloride (PVC) sheets formed to about m are often selected. In a conventional contact type IC card, a concave portion is formed in a single-layer card substrate by counterbore or the like, and the above-described IC module 10 is embedded and mounted in the concave portion, or the card substrate is formed into a three-layer sheet structure. An IC card is obtained by punching out a hole for fitting an IC module into a plastic sheet serving as a center core, fitting the module into the hole, and overlaying the module with an oversheet and performing hot-pressing.

[0004]

However, non-contact type ICs
In the case of a card, since there is no terminal board on the surface, the conventional IC
As in the case of a card, a hole where the IC module fits into a base material serving as a center core is punched out, the IC module is fitted into the hole, and the oversheet is laminated. This may cause a problem such as misalignment and poor appearance of the card. Also, if a reinforcing sheet is used on the module to improve this, the adhesion between the reinforcing sheet and the plastic sheet will be weak, and the strength and appearance of the card will be impaired due to delamination etc. There is. Accordingly, the present invention has been completed on the present invention by studying a non-contact type IC card in which unevenness does not appear on the card surface and a method of manufacturing the card.

[0005]

According to a first aspect of the present invention, there is provided a non-contact type IC card including a plurality of plastic sheets laminated on each other and an IC module contained in a card base material. IC card in which a coil portion and an IC chip are integrally molded into a resin in a planar shape
The module is fitted in an opening formed in a plastic sheet serving as a center core, and the periphery of the opening of the center core sheet and the mold resin around the IC module in the opening are partially welded by an ultrasonic welder. A non-contact type IC card characterized by being welded to a non-contact type IC card. Because of such an IC card, the strength is high, and problems such as malfunction are unlikely to occur.

According to a second aspect of the present invention, there is provided a method of manufacturing a non-contact type IC card in which an IC module is included in a card substrate.
(2) a step of forming an opening in which the IC module fits in a plastic sheet serving as a center core, (2) a step of fitting an IC module in which a coil portion and an IC chip are integrally molded into a resin sheet into the opening; 3) a step of partially welding and fixing the periphery of the opening of the center core and the peripheral resin of the IC module with an ultrasonic welder;
(4) a step of superimposing and press-molding the oversheet laminated on the plastic sheet surface serving as the center core;
In a non-contact type IC card manufacturing method. With this manufacturing method, an IC card having high strength can be easily manufactured.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 5 shows a non-contact type IC
It is a figure showing a module. Since the non-contact type IC module 10 transmits and receives signals to and from the outside by the action of an electric field, a circular winding coil 12 is usually formed around the IC chip 11. The coil part is 30-5
A fine wire having a diameter of 0 μm is formed by being wound in multiple multilayers.
In order to reliably transmit and receive signals to and from an external device, when the working distance with the device is increased, the outer shape of the coil portion serving as an antenna also increases. Further, the IC chip becomes larger according to its function, and a device such as a capacitor 13 may be added. The coil portion and the IC chip are connected by a thin wire. FIG. 5 (A) shows an external device and 10 cm.
The outer diameter of an IC module for remote operation intended for operation at a distance of about 30 mm is about 30 mm. FIG.
(B) and (C) are for short-distance operation applications that enable operation at a distance of about 5 cm. Since (C) performs only simple functions, the IC chip is also downsized. The outer diameter of the module is about 15 to 18 mm.

[0008] In such an IC module, the winding coil portion and the IC chip are integrally molded with a thermoplastic or thermosetting resin such as an epoxy resin. The thickness of the module after molding is 0.45 mm to 0.60 m
m, and the upper and lower surfaces of the coil and the IC chip are completely covered with resin, and are parallel smooth surfaces. A portion 14 made of only the mold resin and having a width of about 0.5 mm to 2.0 mm is also formed on the outer peripheral portion of the coil. In such an IC module, a coil or an IC chip is placed on a flat metal plate, a molten or uncured resin is flown, and the resin is cured by pressing the resin in parallel from the upper surface. It is formed by punching.

FIG. 1 is a sectional view for explaining a non-contact type IC card of the present invention. FIG. 1A shows an opening (through-hole) formed in a center core 21 serving as a central layer of a card base, into which an IC module 10 is fitted, and oversheets 22 and 23 provided on upper and lower surfaces of the center core. Indicate a state in which are stacked. A feature of the present invention is that the periphery of the opening of the center core and the mold resin around the IC module in the opening are partially welded by an ultrasonic welder to enhance the strength of the card and improve the surface flatness. Another object of the present invention is to facilitate the card manufacturing process.
FIG. 1B shows another embodiment of the present invention, in which an opening (non-through hole) is formed in a center core 21 serving as a central layer of a card base, and an IC module 10 is fitted therein.
The periphery of the opening of the center core and the mold resin around the IC module in the opening are partially welded by an ultrasonic welder, and the oversheet 2 is formed on the upper and lower surfaces of the center core.
2 and 23 are shown stacked. FIG.
(C) shows still another embodiment of the present invention, in which an opening (non-through hole) is formed in a center core 21 serving as a central layer of a card base material.
Is formed, and the IC module 10 is fitted therein, and the periphery of the opening of the center core and the mold resin around the IC module in the opening are partially welded by an ultrasonic welder, and only on the upper surface of the center core. This shows a state where the oversheets 22 are stacked.

Next, a method of manufacturing a non-contact type IC card according to the present invention will be described with reference to FIGS. FIG. 2 is a perspective view showing a manufacturing process of the non-contact type IC card of the present invention. First, as shown in FIG. 2A, an opening 21h in which the IC module 10 is fitted is formed in a plastic sheet 21 serving as a center core by means such as punching, and the IC module is fitted. Although the size of the IC module and the aperture are almost the same, generally there is some clearance, and it is better to make the aperture slightly larger.

The position of the opening in the IC card is as follows:
Until now, no standard has been defined for non-contact type IC cards, so there is no particular restriction. In the case of the non-contact type, since there is no problem that an IC card having an IC chip in a specific positional relationship must be inserted into a certain device, a problem occurs even if the position of the opening is freely set. There are few things. FIG. 2B shows a state where the IC module is fitted into the center core. A clearance 21c has a small width around the IC module.

Next, the periphery of the opening of the center core 21 in which the IC module is fitted and the molding resin around the IC module in the opening are partially welded by an ultrasonic welder, so that the IC module is located at the center of the periphery. It is temporarily attached to the core sheet (FIG. 2C). Welding by the welder does not need to cover the entire circumference of the IC module.
It is sufficient if up to three spots are welded in a spot shape.
In FIG. 2C, reference numeral 15m denotes a welded portion formed by a welder. In this process, the thin IC module is only fitted to the thin plastic sheet,
If an excessive pressure is applied, the IC module may fall off or cause a positional shift.

FIG. 3 is a sectional view showing a manufacturing process of the non-contact type IC card of the present invention. 3 (A) to 3 (C) show a process which overlaps with FIG. 2 although there is a difference between a perspective view and a sectional view. Next, as shown in FIG. 3 (C), when the periphery of the opening of the center core and the molding resin around the IC module in the opening are partially welded by the ultrasonic welder 15, the IC molding resin becomes the center around the periphery. The two are welded to the core to maintain a fixed positional relationship. That is, even if the center core is vibrated or shaken,
The C module does not fall off or displace. At this time, even if one resin to be welded is a thermosetting resin, if the other resin is a thermoplastic resin, it is possible to fix the IC module so that one resin covers the other resin. It is possible. In addition, since the IC module is finally fixed in the center core sheet by the oversheet laminated on the upper surface or the upper and lower surfaces,
The welding by the ultrasonic welder is for the purpose of preventing the IC module from falling off or moving, and is not intended for full-scale bonding.

After laminating the oversheets 22 and 23 on the upper and lower surfaces of the plastic sheet on which the IC module is mounted (FIG. 3D), smooth metal plates 31 and 32 for the template are formed.
The card base material is inserted between them, and they are heated and pressed to be integrally molded (FIG. 3E). As a result, the welding position by the ultrasonic wave is melted and integrated with the hard vinyl chloride resin layer to be in a completely planar state. At least in the state of hot pressing, it is in a state of high temperature and high pressure, the upper and lower surfaces of the card base are in a state completely parallel to the plane of the metal plate, and the unevenness after removal from the template is the equilibrium state after that It is considered to be based on the change of Although only one card is shown in FIG. 3, in practice, a multi-faced sheet (generally, about 30 rows of 5 columns and 6 rows) is used. In the case of pressing, it is a common method to form several card bases simultaneously by stacking metal plates in several stages. The molding heating temperature differs depending on the laminated material, but in the case of a rigid vinyl chloride sheet, heating at about 150 ° C. is required.

FIG. 4 is a sectional view showing another manufacturing process of the non-contact type IC card of the present invention. In this case, first, as shown in FIG.
A hole (non-through hole) into which the module fits is formed by a counterboring machine. Next, the IC module is fitted into the hole, and the periphery of the opening of the center core and the mold resin portion around the IC module in the opening are partially welded by an ultrasonic welder. Thereafter, molding is performed in the same manner as in FIG. However, in the case of this manufacturing method, since the thin core sheet 21t remains under the portion where the IC module of the center core is fitted, the influence of the shape of the IC module on the card surface is small. Therefore, it is possible to omit the oversheet laminated on the lower surface of the center core. In the case of the manufacturing method shown in FIG.
It is rare for the C module to fall off the hole,
It is difficult to ensure that the IC module does not deviate from the hole position of the card base material due to an impact during the processing step or the like.

[0016]

【Example】

(Examples relating to material) (1) Card base material: As the card base material, a hard vinyl chloride sheet is usually used, but it is not particularly limited to a vinyl chloride sheet. It may be a resin sheet of polypropylene, polyester resin, ABS resin, polycarbonate, styrene resin, or a mixture thereof.
Since materials other than the vinyl chloride sheet have poor self-fusing property due to heating, it is appropriate to laminate the card sheet layers through an adhesive. (2) As a mold resin of an IC module, a resin that plays a role of protecting the module from an external environment such as moisture, impact, and contamination is required, and characteristics such as heat resistance, moisture resistance, and low stress are required. Further, due to the problem of productivity, high fluidity, high curability, and low thermal expansion are required. Materials satisfying these requirements include epoxy resins such as novolak type epoxy resins, acid anhydride type epoxy resins, and silicone-modified epoxy resins.

(Example of non-contact type IC card production) Non-plastic rigid vinyl chloride sheet (glass transition temperature Tg; 150 ° C., thickness) serving as a center core of a card in which cards can be arranged in 5 rows and 6 columns (0.56 mm), 30 circular openings of 16.8 mm in diameter for fitting the IC module were punched out at predetermined positions by a punching blade. In a state where the plastic sheet having the holes formed by the punching was placed on a flat vacuum suction board, the position of the IC module was regulated, and the IC module was fitted into each fitting hole. IC module has a diameter of 1
It is a 6.6 mm circular shape, which is entirely molded with a thermoplastic epoxy resin, and has a thickness of 0.56 mm.
It is. A circular clearance having a width of 0.2 mm is formed around the IC module. Around the opening of the center core and the molding resin around the IC module in the opening, an ultrasonic welder with a rated output of 28 KHz and 100 W (“UE100Z28S-1” manufactured by Ultrasonic Industry Co., Ltd.)
E ") and partially welded (in a size of about 4 mm in diameter) and fixed.

After the IC module is fixed to the center core sheet, a vinyl chloride sheet having a thickness of 0.12 mm is laminated above and below the center core sheet, and both sides of the sheet are mirror-finished stainless steel plates. Then, hot pressing was performed. Raise the maximum temperature to 150 ° C and
After pressing for 0.7 minutes, the card base material having a thickness of 0.76 mm was taken out and punched into individual IC cards.

(Comparative Example Regarding Non-Contact Type IC Card Production) A non-contact type IC card of a comparative example was experimentally manufactured under the same conditions as in the above-mentioned embodiment, but without welding by an ultrasonic welder.

(Embodiment relating to evaluation of IC card) Non-contact type IC obtained by the above embodiment and comparative example
For each of the 30 cards, a bending test was performed on each sample card base material (length in the long side direction: 54.0 mm). The bending test was performed under ADL conditions (bending deflection: 14.5).
mm), a bending stress was applied in the long side direction of the card, and bending was performed 1,000 times at a rate of 30 times / minute. Thereafter, each sample was examined for the presence or absence of a malfunction. As a result, no malfunction occurred in the IC card of the example, whereas two malfunctions occurred in the comparative example.

[0021]

According to the non-contact type IC card of the present invention, since the IC module is fixed in the opening of the center core sheet by welding with an ultrasonic welder, the IC module is firmly fixed to the card base material. In addition, malfunctions are less likely to occur due to an external pressure with respect to the bending of the card. Further, according to the method for manufacturing a non-contact type IC card of the present invention, the IC module is prevented from falling off or displaced in the manufacturing process, and an IC card having such characteristics can be easily manufactured.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a non-contact type IC card of the present invention.

FIG. 2 is a perspective view illustrating a manufacturing process of the non-contact type IC card of the present invention.

FIG. 3 is a cross-sectional view illustrating a manufacturing process of the non-contact type IC card of the present invention.

FIG. 4 is a sectional view showing another manufacturing process of the non-contact type IC card of the present invention.

FIG. 5 is a diagram showing a non-contact type IC module.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 IC module 11 IC chip 12 Coil 13 Capacitor 14 Ring-shaped mold resin part 15 Ultrasonic welder 15m Welding part 21 Center core 22, 23 Oversheet 21h Center core opening 21t Thin core sheet 31, 32 Metal plate

Claims (2)

[Claims] 1. A non-contact type IC card in which an IC module is included in a card base material formed by laminating a plurality of plastic sheets, wherein a coil portion and an IC chip are resin-molded in an integrated plane. The IC module is fitted into an opening formed in a plastic sheet serving as a center core, and the periphery of the opening of the center core sheet and the molding resin around the IC module in the opening are ultrasonically welded. A non-contact type IC card which is partially welded. 2. A method of manufacturing a non-contact type IC card in which an IC module is included in a card base material, wherein (1) a step of forming an opening for fitting the IC module in a plastic sheet serving as a center core; 2) A step of fitting an IC module in which the coil portion and the IC chip are integrally molded into a resin into the opening, and (3) a portion around the opening of the center core and the molding resin around the IC module by an ultrasonic welder. Process of welding and fixing,
(4) a step of superimposing and press-molding the oversheet laminated on the plastic sheet surface serving as the center core;
Are carried out in order, thereby producing a non-contact type IC card.