JP2000155820A - Noncontact ic card and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To lower the cost of a card by simplifying the process by mounting an IC chip directly on a card base material, and drawing and forming an antenna coil directly on the card base material. SOLUTION: The IC chip 21 is mounted in an opening bored in the card base material 11 in the center and protected by upper and lower base materials. When the antenna coil 22 is drawn on the card base material 11, a conductor 221 and a terminal are connected and then the conductor 221 is pressed against the paper surface in the state with a capillary tip and drawn along the loop expected line 22s of a coil at the same time, so that the conductor 221 is led out of the tip of the capillary. In this state, ultrasonic weld bonding is continuously carried out to form the antenna coil 22. In case of paper, the conductor 221 is embedded in the paper by nearly a half as much as its diameter. Further, coating resin slightly melts in this state to temporarily fix the conductor 221 to the paper, so the process after that can stably be carried out.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a non-contact IC card and a method for manufacturing the same. In particular, the present invention relates to a low-cost card that can be made into an integrated line in production and can use paper material, and a method for producing the card.

[0002]

2. Description of the Related Art Conventionally, a contactless IC card has an IC chip mounted on a printed circuit board or the like, wire-bonded and resin-molded, and further connected to a winding coil, for example, an inlay, an inlet and an IC component connected to a coil of a coated copper wire. A non-contact IC card was manufactured by preparing a module called a module, sandwiching the module with a plastic sheet, obtaining a plate-like module by thermocompression bonding with or without an adhesive layer, and punching out a card. However, non-contact IC cards manufactured by these methods are difficult to produce as low-cost cards because of the diversified processes and expensive raw materials, which hinders the development of IC cards for various applications. I was In addition, if it is a paper substrate, environmental problems at the time of disposal can be reduced. It should be noted that a known technique for producing a non-contact IC card at a low cost using a paper base or the like is not particularly detected. Japanese Patent Application Laid-Open No. 9-315056 introduces a technology of a non-contact type IC card in which a molten resin is injected into a label using paper or the like by injection molding to integrate them, but it requires a complicated process. This is different from the one for the purpose of a simple process as in the present invention.

[0003]

SUMMARY OF THE INVENTION Accordingly, the present invention has been made to provide a low-cost card which has the possibility of producing an integrated line in production and which can use paper materials, and a method for producing the same. . Although the present invention does not limit the card base material to paper, any non-contact IC card made of paper is suitable as a prepaid card such as a telephone card, especially as a disposable card, and has environmental problems (plastic incineration problems). ) Does not occur.

[0004]

A first aspect of the non-contact IC card according to the present invention for solving the above-mentioned problems is that at least one layer of a paper base and another base are provided via an adhesive layer or In a non-contact IC card that is stacked without interposition, an IC chip is mounted in an opening formed in the one-layer paper base material, and both terminals of the IC chip are connected to a surface of the paper base material. A non-contact IC card to which an antenna coil formed of a resin-coated conductive wire is connected. With such a non-contact IC card, the cost can be reduced and mass production is possible.

A second aspect of the non-contact IC card of the present invention for solving the above-mentioned problems is that at least one layer of a plastic substrate and another substrate are laminated with or without an adhesive layer. In this non-contact IC card, an IC chip is mounted in an opening formed in the one-layer plastic substrate, and both terminals of the IC chip are covered with a resin coating formed on the surface of the plastic substrate. A non-contact IC card to which an antenna coil made of a conducting wire is connected. Such a non-contact IC card has high durability, low cost, and high productivity.

The first aspect of the method for manufacturing a non-contact IC card according to the present invention for solving the above problems is a step of forming an opening for mounting an IC chip in a paper base material, and mounting the IC chip in the opening. Step: After connecting to one terminal of the IC chip using a resin-coated conductor, an antenna coil is formed on a paper substrate by direct drawing using the resin-coated conductor, and the antenna coil is temporarily fixed to the paper substrate. A method of manufacturing a non-contact IC card, further comprising: a step of connecting to another terminal of the IC chip; and a step of laminating another card base material with or without an adhesive layer. is there. With this manufacturing method, non-contact IC cards in which an IC chip is mounted on a paper base can be mass-produced at low cost.

A second aspect of the method of manufacturing a non-contact IC card according to the present invention for solving the above problems is a step of forming an opening for mounting an IC chip in a plastic base material, and mounting the IC chip in the opening. Step: After connecting to one terminal of the IC chip using the resin-coated conductor, the antenna coil is formed on the plastic substrate by direct drawing using the resin-coated conductor, and the antenna coil is temporarily fixed to the plastic substrate. And a step of connecting another terminal of the IC chip with another terminal, and a step of laminating another card base with or without an adhesive layer.
C card manufacturing method. Because of such a manufacturing method, a non-contact I in which an IC chip is mounted on a plastic substrate
Mass production of C cards at low cost.

A third aspect of the non-contact IC card of the present invention for solving the above problems is that the non-contact IC card is manufactured according to the first of the first aspects of the non-contact IC card manufacturing method of the present invention. A fourth aspect of the non-contact IC card according to the present invention is a non-contact IC card manufactured according to the second aspect of the non-contact IC card manufacturing method of the present invention.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a non-contact IC card of the present invention and a method of manufacturing the same will be described with reference to the drawings. FIG. 1 is a view showing one embodiment of a non-contact IC card of the present invention. An example is shown in which a non-contact IC card is composed of three layers of base material. FIG. 1A shows a non-contact IC
FIG. 1B is a plan view of the card, and FIG. 1B is a cross-sectional view of a portion taken along line AA in FIG. In the plan view of FIG. 1A, since it is a non-contact IC card, it does not have an external connection terminal portion on the card surface, and nothing appears on the surface except for a printed pattern or the like in appearance. In FIG. 1A, a chain line indicates that there is a conductive wire serving as the IC chip 21 and the antenna coil 22 inside the card.

In the sectional view of FIG. 1B, three layers of card substrates 11, 12, and 13 are adhered with an adhesive layer 15, and
It is shown that the chip 21 is attached to the opening 18 provided in the central card base 11 and is protected by the upper and lower bases 12 and 13. The card substrate can be made of various materials other than paper, such as vinyl chloride resin, polyethylene terephthalate (PET) resin, polypropylene resin, polycarbonate resin, acrylic resin, and polystyrene resin.
ABS resin, polyamide resin, polyacetal resin and the like can be mentioned.

The material of the antenna coil 22 must be a resin-coated conductive wire, and a preferred example is a resin-coated copper wire. The ends of the antenna coil are both terminals (pads) 211 and 212 of the IC chip.
Connected to each other. The terminals are preferably gold bump terminals in order to form a good connection. It is preferable that both terminals of the IC chip, the connection between the antenna coil 22 and the upper surface of the IC chip 21 be molded with a sealing agent 23 such as epoxy resin which covers the chip.

An adhesive is applied to the antenna coil surface of the base material 11 formed as described above or a card base material 12 via an adhesive layer 15 such as an adhesive sheet. 13 are stacked. However, when one or both substrates are heat-meltable, the adhesive layer may not be needed. Printed information by printing and decorative patterns can be provided on the surface of the substrate on the card surface side. In this card configuration, the base material 11 is a paper base material,
The substrates 2 and 13 may be plastic substrates, and the substrate 11 may be a plastic substrate and the substrates 12 and 13 may be paper substrates. Further, all of the substrates may be paper substrates or plastic substrates. As for the thickness of the base material, if the base material 11 side on which the IC chip is mounted has a predetermined thickness, the other base material may be a thin layer having a protective coating or may be provided by a coating process.

Next, a method of manufacturing the non-contact IC card of the above embodiment will be described. First, the base material 11 having a thickness of about の of the thickness of the card (typically 0.76 mm)
Prepare When the substrate is a paper substrate, uncoated paper is desirable. This is because coated paper, such as clay-coated paper, is liable to peel off the antenna from the coated portion when the antenna coil is temporarily fixed by a conductive wire later. From the viewpoint that delamination does not occur, the paper on the other side to be laminated is also preferably uncoated paper. As the material of the paper used,
Paper having a strong paper-to-paper strength is preferable, and examples thereof include card paper, high-quality paper, paperboard, and resin-impregnated paper. In the case of resin-impregnated paper, paper impregnated with acrylic resin, epoxy resin, or the like is preferable. It is also possible to print in advance on the front side of the card. However, it is also possible to print after finishing the card without printing in this state.

Next, the opening 1 into which the IC chip 21 is inserted
8 is provided on the base material 11. For this, a method using a punching blade die can be adopted. Depending on the shape of the punching die, a circular shape or a rectangular shape can be arbitrarily formed from a planar shape. For example, if the IC chip is 1.5 mm square, an opening into which the chip can sufficiently enter can be formed by pressing a 2 mm square punching die.

FIG. 2 shows a state in which an IC chip is mounted in the opening of the card base material. FIG. 2A shows a state in which the IC chip is inserted into the opening 18 using the collet 41,
FIG. 2B shows a state in which a wire is connected to a terminal (bump) while the IC chip is held by being attracted to a collet. The IC chip is sucked into the suction port 411 of the collet, and the collet is inserted into the opening 18 until the upper surfaces of the terminals 211 and 212 are substantially equal to the upper surface of the base material. On this occasion,
The card base 11 is fixed to the pedestal 42. In this state, as shown in FIG. 2B, ultrasonic bonding of the coated conductive wire 221 to one of the terminal (usually made of aluminum) of the IC chip or the gold bump terminal of the IC chip is performed by a capillary. This is performed by supplying a resin-coated conductor through the capillary of the ultrasonic weld bonder 44 to the tip where ultrasonic waves oscillate, and pressing the end of the conductor against the IC chip terminal to apply ultrasonic waves.

At this time, since the coating resin is melted and removed, the metal of the terminal metal and the metal of the conductive wire are melted and joined to enable electrical conduction. The terminals 211 and 212 of the IC chip
The fact that the gold bump is processed over a large area facilitates the bonding of the covered conductor. Normally, IC pad is 100
Although it is a μm square, it is easier to connect (bond) the antenna coil 22 later by plating the passivation film and expanding the pad area to about 300 μm square.

In order to form an antenna coil, 2-5 μm is required.
It is preferable to use a resin-coated wire having a diameter of about 50 to 100 μm, which is resin-coated with a thickness of about m. Copper is most preferable as the conductive wire material from the viewpoint of conductivity and cost. The paper substrate can absorb the undulations of the conductive wire having a considerable diameter, but the hard plastic substrate has a certain limitation because the embedding in the substrate described later is reduced. The resin-coated wire is preferable because, when forming an antenna coil loop on the card base material surface, if an ultrasonic welder is used, the resin can be melted and the conductor wire can be temporarily fixed to the base material. The coating resin may be a commonly used enamel resin or urethane resin, but may be another resin. The diameter of the conducting wire needs to be adjusted not only according to the characteristics of the base material but also according to the characteristics of the IC chip and the number of turns of the coil. Although it depends on the characteristics of the IC chip, in the case of a 100 μm diameter copper wire,
So-called ISO1 corresponding to 13.56 MHz frequency
In an IC conforming to the 4443 standard, good results can be obtained with a coil having three to four turns.

FIG. 3 shows a state in which an antenna coil is drawn on a card base material. After connecting the conductor and the terminal, the conductor is pulled out from the tip of the capillary by pulling the conductor along the scheduled loop line 22s while pressing the conductor on the paper surface with the tip of the capillary as it is. In this state, the antenna coil 22 can be formed by continuing the ultrasonic weld bonding. In the case of paper, the conducting wire is in a state where about half of its diameter is embedded in the paper. In addition, in this state, the coating resin is slightly melted, and the conductor is temporarily fixed to the paper, so that the subsequent steps can be performed stably. Although it depends on the shape of the tip of the weld bonder, it is possible to draw a coil having a pitch of about 0.5 mm in the case of a winding shape. When the base material is plastic, the amount of embedding is small, but since the coating resin is melted, the conductive wire and the base material are temporarily fixed. In FIG. 3, a chain-shaped outer frame indicates a card finishing line 19.

FIG. 4 shows a state in which the antenna coil has been drawn on the card base material. After drawing the last turn of the coil (drawing the coil wire), it crosses over its own wire turn previously drawn, that is, draws like a jumper wire, and terminates bonding to other terminals of the IC chip. . If the welder is routed without applying ultrasonic waves to the portion that will become the jumper wire 222, an electrical short is not formed, but even if welding is performed by applying ultrasonic waves, it must be as high as when connecting to a terminal. If the coating resin does not completely disappear, there is no short circuit.

In order to improve the moisture resistance of the IC and to reinforce the bonding strength, it is effective to apply a potting agent onto the IC chip and harden it.
The IC chip subjected to the gold bump processing has relatively high moisture resistance, and this resin dropping step can be omitted. At the stage where the drawing of the antenna coil is completed or the stage where the above-mentioned potting is completed, the suction of the collet is stopped and the IC is stopped.
Even if the chip is removed from the collet and the base material is released from being fixed to the pedestal 42, the IC chip is connected to the antenna coil and does not fall out of the opening.

When the base material is a paper base material or the like, an adhesive is applied slightly thicker to the other card base material 12 to be laminated, and a coil is formed by attaching the IC to the surface of the adhesive layer 15 first. The base material 11 coated with an adhesive is overlaid on the back surface of the base material 11 and bonded by pressure bonding. afterwards,
A non-contact IC card formed to a predetermined thickness is obtained by punching to the card dimensions (the antenna coil 22 naturally fits within the card inner dimensions). The card substrate to which the adhesive has been applied can also be printed in advance.
In the case of a paper substrate, the printed surface can be protected by printing on the surface that will be the front side of the card, and in the case of a transparent plastic sheet, by printing on the adhesive layer side. In the case of a vinyl chloride resin sheet, since the sheets are bonded by heat fusion under heating and pressure, they can be laminated without using an adhesive.

FIG. 8 is a diagram showing another embodiment of the non-contact IC card of the present invention. 3 shows a cross section when a non-contact IC card is composed of four layers of card base materials. In this case, the center sheets serving as the centers are 11 and 12,
The oversheets 13 and 14 are laminated on the upper and lower sides. It is suitable when printing is provided on the outer surface side of the card of the center sheet to protect the printing layer with a transparent oversheet.
In these card configurations, the base material 11 can be a paper base material and the base materials 12, 13, and 14 can be plastic base materials.
3, 14 may be a paper base. The thickness of the base material to be the oversheet may be a thin layer having a thickness of about a protective coating, or may be provided by an application step.

In the above description, a manufacturing method using a so-called bare chip as an IC chip used for an IC card is described, but a method using a module packaged in advance with a resin is also possible. Hereinafter, the manufacturing method will be described with reference to the drawings. FIG. 5 is a diagram showing an IC module packaged with a resin. FIG. 5A is a perspective view thereof, and FIG.
2A shows a layer cross section taken along line AA. As shown in FIG. 5, a lead frame 3 made of a tin-plated thick copper plate
The IC chip 31 is die-bonded to the second die pad portion. Connect the two terminals 211 and 212 to the lead frame terminal 3
21 and 322 are wire-bonded, transfer-molded by a mold, and packaged with a mold resin 25 such as an epoxy resin. Both terminals are punched out from both ends of the package as leads (Fig. 5
(B)). Since the resin package portion usually has a thickness of about 400 μm, a deeper opening is required than in the case of a bare chip, and the thickness of the base material must be increased.

FIG. 6 shows a manufacturing process of a non-contact IC card using a resin package IC module. FIG.
FIG. 6 shows a cross section of the completed non-contact IC card in the same case, and FIG.
2 shows a cross section taken along line AA when the card is completed. When the resin package IC module 21 is used, an opening through which the module can be inserted into a slightly thick card base material is formed by punching. The size and shape are adjusted to the resin part of the package. Both terminals 321 and 322 of the lead are placed so as to be located on the card substrate surface. In this case, the IC chip suction portion of the collet is once projected from the inside of the opening to the upper surface of the card base material, and then the IC chip is mounted and sucked and lowered until the lower surfaces of the metal lead frames 321 and 322 contact the card base surface. After that, drawing of the antenna coil is performed. It is also preferable to apply and fix a polyester-based adhesive or the like in advance on the surfaces where the lower surfaces of the metal lead frames 321 and 322 and the card base material are in contact.

The antenna coil is formed with the card base 11 fixed to the pedestal 42 as in the previous embodiment.
After bonding the resin-coated conductor to one of the leads at both ends, the antenna coil 22 is similarly drawn on the card base material, and the other end is bonded to the other lead. The card substrates 12 and 13 on the front and back sides are bonded together via the adhesive layer 15 or by heat fusion, and are punched into a card shape to complete a non-contact IC card.

As described above, in the method for manufacturing a non-contact IC card according to the present invention, the formation of the antenna coil can be continuously drawn using the bonding tool, and the connection between the IC chip and the antenna can be performed. Since the same tool can be used for bonding, there is no need to prepare a substrate on which an antenna coil pattern is formed or a winding coil for an antenna in advance, and continuous processing can be performed on the same base material. May be consistent. Conventionally, printed wiring and photo-etching techniques have been required to form antenna patterns, and the preparation of various materials and the complexity of the processes have been a major obstacle to reducing the cost of non-contact IC cards. In addition, the present manufacturing method has a possibility of eliminating those obstacles. Furthermore, in the present manufacturing method, a paper or plastic card base material can be manufactured without a substantial difference whether it is in the form of a sheet or a continuous roll. Found.

[0027]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a contactless IC card according to an embodiment of the present invention; FIG. (Example 1) An example of a non-contact IC card composed of three layers of paper material and a method of manufacturing the same will be described. Fine paper without a coat layer having a thickness of 0.2 mm was used as the paper base material 11, and fine paper without a coat layer having a thickness of 0.3 mm was used as the paper base materials 12 and 13. IC chip 21 of paper substrate 11
The mounting portion is pressed with a punching blade mold with a pressure of 50 kg, and approximately 2.
An opening 18 of 0 mm square was formed. A thickness of 0.
In order to mount IC chips for non-contact IC cards of 18 mm and 1.5 mm square, the card base material was fixed to the pedestal 42, the IC chip was sucked and held by the collet 41, and the IC chip was inserted into the opening (FIG. 2). (A)). The terminal pads of the IC chip were previously subjected to gold bump processing so that the terminal size was 300 μm × 300 μm square.

Next, while the card base material was fixed to the base, the connection between the IC chip and the antenna coil and drawing were performed. For the antenna coil 22, a copper wire having a diameter of 100 μm and an enamel coating having a thickness of 3 μm was used.
This copper wire is passed through a capillary of an ultrasonic weld bonder 44 having a rated frequency of 28 KHz and an output of 100 W, and
1 was pressed against one of the gold bump portions of the IC chip, and ultrasonic waves were applied thereto for bonding (FIG. 3). After bonding to the bumps, the weld bonder was pressed against the paper surface as it was, and then drawn on the paper surface along the predetermined antenna loop line, and finally bonded to the other gold pump to complete the antenna coil 22 (FIG. 4). The pitch between the lines of the antenna coil is 1.0 mm, and approximately 45 mm ×
It was formed into four turns in a rectangular shape of 60 mm. In addition, in the part which becomes the jumper wire 222, the width 5
No ultrasound was applied for mm. Finally, a copper wire was bonded to the other terminal of the IC chip. The antenna coil was fixed with the enamel melted and temporarily fixed to the paper.

After the antenna coil was formed, epoxy resin was dropped by potting and cured so as to cover the connection between the terminals 211 and 212 of the IC chip and the antenna coil 22 and the upper surface of the IC chip 21, and then molded. A vinyl acetate-based adhesive is applied to one side of a paper substrate 12 (high quality paper) to be laminated on the antenna coil forming surface to a thickness of 20 μm, and a paper substrate 13 (high quality paper) laminated on the surface opposite to the antenna coil forming surface. (Paper) was coated with a vinyl acetate-based adhesive to a thickness of 10 μm, and the paper base material on which the IC chip was mounted was sandwiched in a sandwiched state, and adhered by applying light pressure. Finally, the non-contact IC card was punched out to the card size to complete. Thus, a card having a thickness of 0.80 to 0.84 mm,
A smooth card having no copper wire irregularities on the surface was completed (FIG. 1B).

(Example 2) An example of a non-contact IC card composed of three layers of vinyl chloride resin sheets and a method of manufacturing the same will be described. A white rigid vinyl chloride resin sheet having a thickness of 0.3 mm was used as a card base material 11 serving as a center sheet. In addition, a white rigid vinyl chloride resin sheet having a thickness of 0.3 mm was used as the card bases 12 and 13 for oversheets to be laminated. The thickness of the IC chip is 8
A lead frame tin-plated on a 0 μm thick copper plate
An IC module was used in which a C chip was die-bonded, two terminals were wire-bonded to a lead frame, and packaged with epoxy resin by transfer molding. The size of the module is 0.35mm in height and 5 in width
mm and a length of 20 mm (including the lead portion).

The punching die was pressed against the IC chip mounting portion of the core sheet 11 with a pressure of 50 kg, and the width was 6 mm and the length was 10 mm.
A rectangular opening 18 of mm was formed. In order to mount a 0.35 mm-thick non-contact IC card IC chip in this opening, the card base material is fixed to the pedestal 42, and the sucking portion of the collet is once projected onto the card base material surface, and is attached to the sucking portion. IC
The mold section was suction-held and returned to the opening, and the IC module was inserted. Next, while the card base material was fixed to the base, the leads of the IC module and the antenna coil were connected and drawn.

For the antenna coil 22, a diameter of 50 μm
And a copper wire coated with a urethane resin having a thickness of 3 μm. This copper wire was rated at 28 KH in the same manner as in Example 1.
Bonding was performed using an ultrasonic weld bonder having a power of 100 W in z. After bonding to the lead terminal 322 at one end, the weld bonder is pressed against the surface of the vinyl chloride substrate as it is, and is drawn along the expected antenna loop line. Finally, the antenna coil is bonded to the other lead terminal 321 by approximately 45 mm. It was formed into four turns in a rectangular shape of × 60 mm. The pitch between the coils was 1.0 mm. The antenna coil was fixed by temporarily fixing the urethane resin to the surface of the PVC sheet substrate by melting (FIG. 6). After the antenna coil was formed, epoxy resin was dropped by potting, cured, and molded so as to cover the connection between the terminals 211 and 212 of the IC chip and the antenna coil 22 and the upper surface of the IC chip 21.

After molding, card bases 11, 12, 13
Were laminated, sandwiched between metal plates having mirror surfaces, introduced into a press machine, and pressed by applying heat and pressure (140 ° C., 25 kgf / cm ² , 15 minutes) to form an integral card base. Finally, a non-contact IC card was punched out to the size of the card (FIG. 7). As a result, a card having a thickness of 0.9 mm and having no copper wire irregularities or the like on the surface was completed.

[0034]

According to the non-contact IC card of the present invention, the IC chip can be directly mounted on the card base material, and the antenna coil can be drawn directly on the card base material. Can be reduced.
In particular, when a paper substrate is used, environmental problems can be solved, and the cost can be further reduced. In the method for manufacturing a non-contact IC card according to the present invention, since a unique method is used for forming an antenna coil and connecting the antenna coil to the IC chip, there is a possibility that a non-contact IC card is manufactured in a consistent line. Mass production of cards is possible.

[Brief description of the drawings]

FIG. 1 is a diagram showing one embodiment of a non-contact IC card of the present invention.

FIG. 2 shows a state in which an IC chip is mounted in an opening of a card base material.

FIG. 3 shows a state in which an antenna coil is drawn on a card base material.

FIG. 4 shows a state in which an antenna coil has been drawn on a card base material.

FIG. 5 is a diagram showing an IC module packaged with a resin.

FIG. 6 shows a manufacturing process of a non-contact IC card using a resin package IC module.

FIG. 7 shows a cross section of a completed non-contact IC card when a resin package IC module is used.

FIG. 8 is a diagram showing another embodiment of the non-contact IC card of the present invention.

[Explanation of symbols]

 11, 12, 13, 14 Card base material 15 Adhesive layer 18 Opening 19 Card finish line 21 IC chip 22 Antenna coil 23 Sealant 24 Wire bonding 25 Mold resin 31 IC chip 32 Metal lead frame 41 Collet 42 Pedestal 44 Ultra Sonic weld bonder 211, 212 Terminal 221 Conductor 222 Jumper wire

Claims (27)

[Claims] 1. A non-contact I comprising at least one layer of a paper substrate and another substrate laminated with or without an adhesive layer.
In the C card, an IC chip is mounted in an opening formed in the one-layer paper base, and both terminals of the IC chip are connected to a resin-coated conductive wire formed on the surface of the paper base. A non-contact IC card to which an antenna coil is connected. 2. The method according to claim 1, wherein the other base material is one or more paper base materials, and the other one paper base material is laminated via an adhesive layer with the paper base material on which the antenna coil is formed. The non-contact IC card according to claim 1, wherein: 3. The non-contact IC card according to claim 1, wherein the paper substrate on which the antenna coil is formed is uncoated paper. 4. The non-contact IC card according to claim 1, wherein the paper substrate on which the antenna coil is formed is a resin-impregnated paper. 5. The non-contact IC card according to claim 1, wherein the conductor is a copper wire. 6. The non-contact IC card according to claim 1, wherein the conductive wire coated with the resin is temporarily fixed to the paper substrate by a molten coating resin. 7. The other base material is one or a plurality of plastic base materials, and the other one plastic base material is laminated with or without an adhesive layer on a paper base material on which an antenna coil is formed. The non-contact IC card according to claim 1, wherein 8. The non-contact IC card according to claim 1, wherein the terminals of the IC chip are subjected to gold bump processing. 9. The non-contact IC card according to claim 1, wherein the IC chip is packaged and has external leads to be connected to a conductive wire. 10. A non-contact IC card in which at least one layer of a plastic substrate and another substrate are laminated with or without an adhesive layer, an opening formed in the one layer of the plastic substrate. A non-contact IC wherein an IC chip is mounted, and an antenna coil composed of a resin-coated conductive wire formed on the surface of the plastic substrate is connected to both terminals of the IC chip.
card. 11. The other substrate is one or a plurality of plastic substrates, and the other one plastic substrate is laminated with a plastic substrate on which an antenna coil is formed with or without an adhesive layer. The non-contact IC card according to claim 10, wherein: 12. A plastic base material comprising a resin selected from vinyl chloride resin, polyethylene terephthalate resin, polypropylene resin, polycarbonate resin, acrylic resin, polystyrene resin, ABS resin, polyamide resin, and polyacetal resin. The contactless IC card according to claim 10. 13. The non-contact IC card according to claim 10, wherein the conductor is a copper wire. 14. The non-contact IC card according to claim 10, wherein the resin-coated conductive wire is temporarily fixed to the plastic substrate by a molten coating resin. 15. The method according to claim 15, wherein the other substrate is one or more paper substrates, and the other one paper substrate is laminated via an adhesive layer with the plastic substrate on which the antenna coil is formed. The non-contact IC card according to claim 10, wherein: 16. The non-contact IC card according to claim 10, wherein the terminals of the IC chip are subjected to gold bump processing. 17. The non-contact IC card according to claim 10, wherein the IC chip is packaged and has external leads to be connected to a conductive wire. 18. A step of forming an opening for mounting an IC chip in a paper base material, a step of mounting an IC chip in the opening, and connecting the terminal to one terminal of the IC chip using a resin-coated conductor, Forming an antenna coil on a paper base by direct drawing using a coated conductor, temporarily fixing the antenna coil on the paper base, and connecting it to another terminal of the IC chip, bonding other card base with adhesive Laminating with or without intervening layers
Manufacturing method of C card. 19. The method for manufacturing a non-contact IC card according to claim 18, wherein the paper substrate forming the antenna coil is uncoated paper. 20. The method for manufacturing a non-contact IC card according to claim 18, wherein the paper substrate forming the antenna coil is a resin-impregnated paper. 21. A step of forming an opening for mounting an IC chip in a plastic substrate, a step of mounting an IC chip in the opening, and a step of connecting to one terminal of the IC chip using a resin-coated conductor, and Forming an antenna coil on a plastic substrate by direct drawing using a coated lead wire, temporarily fixing the antenna coil to the plastic substrate, connecting the other terminals of the IC chip to other terminals, and bonding other card substrates with an adhesive Laminating with or without layers,
A method for manufacturing a non-contact IC card, comprising: 22. The method for manufacturing a non-contact IC card according to claim 18, wherein the resin-coated conductive wire is a copper wire coated with a resin. 23. The method of manufacturing a non-contact IC card according to claim 18, wherein the terminals of the IC chip are subjected to gold bump processing. 24. The method for manufacturing a non-contact IC card according to claim 18, wherein the IC chip is packaged and has external leads to be connected to a conductive wire. 25. Before laminating the other card substrate,
23. The method according to claim 18, further comprising a step of coating a liquid resin by dripping and curing the upper surface of the C chip terminal and a joint between the IC chip terminal and the resin-coated conductor. A method for manufacturing a non-contact IC card. 26. A non-contact IC manufactured by the method for manufacturing a non-contact IC card according to claim 18. Description:
C card. 27. A non-contact IC manufactured by the method for manufacturing a non-contact IC card according to claim 21.
C card.