JPH11328352A - Connection structure between antenna and ic chip, and ic card - Google Patents

Connection structure between antenna and ic chip, and ic card

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Publication number
JPH11328352A
JPH11328352A JP10136768A JP13676898A JPH11328352A JP H11328352 A JPH11328352 A JP H11328352A JP 10136768 A JP10136768 A JP 10136768A JP 13676898 A JP13676898 A JP 13676898A JP H11328352 A JPH11328352 A JP H11328352A
Authority
JP
Japan
Prior art keywords
antenna
ic chip
resin layer
ic
coining portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP10136768A
Other languages
Japanese (ja)
Inventor
Futoshi Hosoya
Seiichi Nishino
太 細谷
誠一 西野
Original Assignee
Tokin Corp
株式会社トーキン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokin Corp, 株式会社トーキン filed Critical Tokin Corp
Priority to JP10136768A priority Critical patent/JPH11328352A/en
Publication of JPH11328352A publication Critical patent/JPH11328352A/en
Application status is Withdrawn legal-status Critical

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector

Abstract

PROBLEM TO BE SOLVED: To stably produce a thin IC card. SOLUTION: The IC card has the IC chip 1, a metal bump 2 provided on the IC chip 1, antennas (antenna part 3 and antenna coining part 4) connected to the bump 2, a coating resin layer 5 and a cover layer 6 provided so that the antennas and IC chip are held from above and below, and a resin layer 7 provided between the coating resin layer 5 and cover layer 6. The antenna coining part 4 is in a flat shape and the IC chip 1 and antenna coining part 4 are connected to each other through the bump 2.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明はICチップとアンテナとの接続構造、及びICチップとアンテナとを用いる非接触型のICカード、ICチップとアンテナとの接続方法、及びICカードの製造方法に属する。 Connection structure between the present invention an IC chip and an antenna BACKGROUND OF THE INVENTION, and the non-contact type IC card using an IC chip and an antenna, a method of connecting the IC chip and the antenna, and the method of manufacturing the IC card It belongs.

【0002】 [0002]

【従来の技術】従来、このICチップとアンテナとを接続するための技術分野において、もっとも多く用いられる接続方法として、プリント基板にICチップをマウントしワイヤボンディング線にてプリント基板上へ接続するCOB法が確立されている。 Conventionally, in the art for coupling the IC chip and the antenna, connecting most as many connection method used at Mount the IC chip to the printed circuit board wire bonding wire to a printed circuit board COB the law has been established. このプリント配線を経由しコイル接続用のパッドとコイルCu(銅)線を半田材で接続する方法が用いられる。 How to connect the pads and the coil Cu (copper) wire for through to coil connecting the printed circuit by solder material is used.

【0003】さらに、別の方法としては、ワイヤボンディング線の他に、ICチップのパッド上にバンプを形成し、フィリップチップ技術によってプリント基板と半田とを接続する方法が用いられる。 [0003] Further, as another method, in addition to the wire bonding lines, to form a bump on the IC chip pad, the method of connecting the printed circuit board solder and the flip chip technology is used. そのほか、基板との接続に異方性導電シートや導電ペーストで接続する方法もある。 In addition, there is a method of connecting an anisotropic conductive sheet and conductive paste to connect to the substrate.

【0004】 [0004]

【発明が解決しようとする課題】しかしながら、ワイヤボンディング法は、ループ高さが200μあり、モジュールを薄くできなく、COB用の基板は材料費が高いという問題がある。 [SUMMARY OF THE INVENTION However, the wire bonding method, there 200μ loop height, can not be thin module substrate for COB has a problem of high material costs.

【0005】一方、Au(金)などの金属バンプを用いる方法は、バンプ上面の引きちぎり部分の形状が安定しないという問題がある。 On the other hand, a method using a metal bump such as Au (gold), the shape of the tear portion of the bump top there is a problem of unstable.

【0006】また、バンプは上面形状が突起状になっていることから、半田や接着剤などで接続する場合に安定しないという問題がある。 [0006] The bump from the upper surfaces have become protruding, there is a problem of unstable when connecting with solder or adhesive. また、導電ペースト等では接合部に抵抗を持ち、電気的特性が悪いという問題がある。 Further, the conductive paste or the like has a resistance at the junction, electrical characteristics is poor.

【0007】それ故に、本発明の課題は、ICチップとアンテナ線を容易に接続でき、パッドとアンテナ線との接続信頼性を高めることができるICチップとアンテナとの接続構造、およびICカード、ICチップとアンテナとの接続方法、及びICカードの製造方法を提供することにある。 [0007] Therefore, an object of the present invention, IC chip and the antenna wire can be easily connected, pads and connection structure between an IC chip and an antenna which can increase the reliability of connection between the antenna wire, and an IC card, method of connecting the IC chip and the antenna, and to provide a manufacturing method of the IC card.

【0008】また、ICカードを構成する樹脂材が変質しない低温によって組立でき、環境に配慮した安価なI Further, it assembled by cold resin material constituting the IC card is not altered, inexpensive I environmentally friendly
Cカードのモジュールを得ることができるICチップとアンテナとの接続構造、ICカード、ICチップとアンテナとの接続方法、及びICカードの製造方法を提供することにある。 A connection structure between an IC chip and an antenna which can obtain the module C card, IC card, a method of connecting the IC chip and the antenna, and to provide a manufacturing method of the IC card.

【0009】 [0009]

【課題を解決するための手段】本発明によれば、アンテナとICチップとの接続構造において、前記アンテナはアンテナ線をコイル状に巻くことによって作られているアンテナコイニング部を有し、該アンテナコイニング部が平坦形状を呈しており、前記ICチップと前記アンテナコイニング部とが金属バンプを介して相互に接続されていることを特徴とするアンテナとICチップとの接続構造が得られる。 According to the present invention SUMMARY OF], in the connecting structure between the antenna and the IC chip, the antenna has an antenna coining portion being made by winding an antenna wire into a coil shape, the antenna coining portion has exhibited a flat shape, the connecting structure between the antenna and the IC chip, wherein said IC chip and said antenna coining portion are connected to each other via the metal bumps can be obtained.

【0010】また、本発明によれば、アンテナとICチップとを含むICカードにおいて、前記アンテナはアンテナ線をコイル状に巻くことによって作られているアンテナコイニング部を有し、該アンテナコイニング部が平坦形状を呈しており、前記ICチップと前記アンテナコイニング部とが金属バンプを介して相互に接続されており、さらに、前記アンテナ及び前記ICチップが樹脂層によって覆われており、該樹脂層上の少なくとも一方面に外被樹脂層が設けられていることを特徴とするICカードが得られる。 Further, according to the present invention, the IC card comprising an antenna and IC chip, wherein the antenna has an antenna coining portion being made by winding an antenna wire coiled, the antenna coining portion and exhibits a flat shape, the IC chip and are interconnected with the antenna coining portion via the metal bumps, further wherein the antenna and the IC chip is covered by the resin layer, the resin layer IC card, characterized in that the jacket resin layer is provided to obtain at least one surface of.

【0011】また、本発明によれば、アンテナとICチップとの接続方法において、前記アンテナはアンテナ線をコイル状のアンテナコイニング部を有し、前記ICチップ上に設けた導電パッド上に金属バンプを形成し、前記アンテナ線をコイル状に巻くことによって前記アンテナコイニング部を形成し、前記バンプを実装する前記アンテナコイニング部を平坦化し、コイニングされた前記アンテナコイニング部の実装エリアに前記バンプを接続することを特徴とするICチップの接続方法が得られる。 Further, according to the present invention, in the method of connecting the antenna and the IC chip, the antenna and the antenna wire has a coiled antenna coining portion, a metal bump on the conductive pad provided on the IC chip forming a said antenna wire to form the antenna coining portion by coiling and flattening the antenna coining portion for mounting the bumps, connect the bumps to the mounting area of ​​the antenna coining portion that is coined IC chip connection method which is characterized in that is obtained.

【0012】さらに、本発明によれば、アンテナとIC [0012] Furthermore, according to the present invention, the antenna and the IC
チップとを含むICカードの製造方法において、前記アンテナはアンテナ線をコイル状に巻くことによって作られているアンテナコイニング部を有し、前記ICチップ上に設けた導電パッド上に金属バンプを形成し、アンテナ線をコイル状に巻くことによって前記アンテナコイニング部を形成し、前記バンプを実装する前記アンテナコイニング部を平坦化し、コイニングされた実装エリアに前記バンプを接続し、前記アンテナ及び前記ICチップを樹脂層によって覆い、該樹脂層上の少なくとも一方面に樹脂材を設け、該樹脂層上に仮固定して、前記アンテナコイニングに前記ICチップに形成された前記バンプを接続し、その後、カバー樹脂層で積層張り合わせることを特徴とするICカードの製造方法が得られる。 In the IC card manufacturing method, including a chip, the antenna has an antenna coining portion being made by winding an antenna wire into a coil, a metal bump is formed over the conductive pad provided on the IC chip the antenna wire forming the antenna coining portion by coiling, the bump and planarizing the antenna coining portion that implements, connecting the bumps to the coined mounting area, the antenna and the IC chip covered by the resin layer, a resin material provided on at least one surface on the resin layer, and temporarily fixed to the resin layer, and connecting the bump formed on the IC chip to the antenna coining, then, the cover resin IC card manufacturing method, characterized by laminating laminating a layer is obtained.

【0013】 [0013]

【作用】本発明では、ICチップ1上への金などの金属バンプの形成は、加工費の最も安価なワイヤボンディングバンプ形成法を用いる。 In the present invention, the formation of the metal bumps such as gold to the IC chip 1 above, using the least expensive wire bonding bump forming method of processing costs. バンプ形成後、加工せずそのままの形状で接続する。 After bump formation, connected as it shape without processing.

【0014】アンテナに接続する際に圧力をかけて面押し状態にした後、超音波にてバンプとアンテナの端部とを接続する。 [0014] After the surface-pressed state under pressure when connecting to the antenna, connecting the end portion of the bump and the antenna using an ultrasonic. 形成されたアンテナは樹脂材へ仮固定する。 Formed antenna is temporarily fixed to the resin material. 仮固定には樹脂層としてホットメルト接着材を用いる。 The temporarily fixed using a hot melt adhesive as the resin layer. 構成材料が変形や変質しない作業温度、条件を採用する。 Working temperature of the material is not deformed or altered, using the conditions.

【0015】アンテナ線は樹脂材に仮固定されるので、 [0015] Since the antenna line is temporarily fixed to the resin material,
自動化しやすく、バンプを介しての接続は接続信頼性も高くなる。 Easily automated connection through bumps is higher connection reliability. 接合部分は金属接合の為、電気的な特性が良い。 Joining portion for metal bonding, electrical characteristics are good. また、アンテナの仮固定に樹脂層を用いることで、 Further, by using the resin layer to temporarily fix the antenna,
基層へのダメージ無く、面押しと超音波を併用し低温での接続を行う。 Without damage to the base layer, a combination of surface pressing and ultrasonic make a connection at a low temperature.

【0016】 [0016]

【発明の実施の形態】以下、本発明の非接触型のICカードの一実施の形態例を図面を参照して説明する。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an embodiment example of a non-contact type IC card of the present invention with reference to the drawings. 図1 Figure 1
は、非接触型のICカードにおける具体的な実施の形態例を示している。 Shows an embodiment of a specific embodiment in the non-contact type IC card.

【0017】図1を参照して、ICカードは、ICチップ1と、このICチップ1上に設けたAu(金)などの複数の金属バンプ2と、バンプ2に接続した複数のアンテナ(アンテナ部3およびアンテナコイニング部4) [0017] Referring to FIG. 1, IC card, the IC chip 1, a plurality of metal bumps 2, such as Au (gold) provided on the IC chip 1, a plurality of antennas (antenna connected to the bump 2 part 3 and the antenna coining portion 4)
と、アンテナおよびICチップ1を上下から挟むようにに設けた外被樹脂層5およびカバー層6と、外被樹脂層5およびカバー層6間に設けた樹脂層7とを有している。 When, and a mantle resin layer 5 and the cover layer 6 provided on so as to sandwich the antenna and the IC chip 1 from above and below, and a resin layer 7 provided between the outer cover resin layer 5 and the cover layer 6.

【0018】ICチップ1上には、電極となる導電パッド(図示せず)がAl(アルミニウム)やAl合金を蒸着等で形成されている。 [0018] On the IC chip 1, (not shown) conductive pads as an electrode is formed in such depositing Al (aluminum) or Al alloy. なお、非接触型のICカードでは、アンテナコイルが必要であり、ICチップ1のパッドとアンテナ線の接続方式によって信頼性とコストとが大きく異なる。 In the non-contact IC card, it requires the antenna coil, significantly different reliability and cost by the pad and the antenna line connection scheme IC chip 1.

【0019】この実施の形態例では、信頼性も高く、量産性の良いワイヤボンディングバンプ方式によってAl [0019] In embodiments of the present invention, a highly reliable, Al by mass productivity good wire bonding bump method
パッド面にバンプ2を形成する。 Forming bumps 2 on the pad surface. ICチップ1上にバンプ2を形成後、加工せずそのままの形状でアンテナを接続する。 After the formation of the bumps 2 on the IC chip 1, to connect the antenna without changing shape without processing.

【0020】アンテナコイニング部4は、0.05μm [0020] The antenna coining section 4, 0.05μm
以上の金属層を有している。 It has more metal layers. アンテナコイニング部4にバンプ2を接続する際には、圧力を1バンプ当たり15 When connecting the bump 2 to the antenna coining portion 4, per bump pressure 15
〜20gかけてアンテナコイニング部4へ面押し状態にした後、超音波にてバンプ2とAu(金)処理されたアンテナの端部分を接続する。 After the state pushed face to the antenna coining portion 4 over to 20 g, to connect the end portions of the antenna bump 2 and Au (gold) treated with ultrasound. 形成されたアンテナは、樹脂層7へ仮固定する。 Forming antennas provisionally fixed to the resin layer 7. 仮固定にはホットメルト材を用いる。 The temporarily fixed using a hot melt material. 構成材料が変形や変質しない作業温度、条件を採用する。 Working temperature of the material is not deformed or altered, using the conditions.

【0021】一方、アンテナを形成するためのアンテナ線は、仕様に応じて30〜150μのCu(銅)線を使用する。 Meanwhile, an antenna wire for forming the antenna uses a Cu (copper) wire 30~150μ according to specifications. 一般的には、50μ線が巻き性や埋め込み性から採用される。 In general, 50.mu. line is taken from the winding property and filling property. アンテナ線は、巻き線機によって巻かれてアンテナが形成される。 Antenna wire is wound by the winding machine antenna is formed. その後、アンテナの先端部分を30〜50μに叩いて平坦化してアンテナコイニング部4を形成する。 Then, to form the antenna coining portion 4 is flattened by hitting the tip portion of the antenna 30~50Myu.

【0022】アンテナの先端は、簡単な方法としてスポット無電解の金めっきによってAu処理をしておく。 The tip of the antenna, leaving the Au treated by gold plating spot electroless as an easy way. 通常は、インレットと呼ばれる中間層にアンテナが仮固定、もしくは埋め込まれるが、本実施の形態例では一方の表面に使用される樹脂層7に仮固定する。 Typically, the antenna is provisionally fixed to the intermediate layer, called the inlet, or is embedded, in the present embodiment is temporarily fixed to the resin layer 7 used on one surface.

【0023】実際のICチップ1の搭載は、一般的なフィリップチップ実装機を用いて、フェイスダウンで実装する。 [0023] The actual mounting of the IC chip 1, by using a general flip chip mounting machine, be implemented in face-down. ICチップ1は、2つのパッドしかないため、アンテナの先端位置精度もそれほど厳しくなく、ワーク押さえでアンテナの端部を固定して実装する。 IC chip 1, since only two pads, tip position accuracy of the antenna is also not so stringent, implemented by fixing the ends of the antenna in the workpiece retainer. アンテナ線を固定する樹脂層7としてのホットメルト材は、80℃ The hot melt material as a resin layer 7 for fixing the antenna wire, 80 ° C.
以上で軟化することと超音波接続でパワーが逃げやすいので常温条件で作業する。 Since power is elusive by ultrasonic connection which softens at least to work at room temperature conditions.

【0024】基本的にはAu−Auの超音波接続で、常温接続であることからPETフィルム等も変形しないことから、実装の反対面は表層として利用できる。 [0024] In essentially the ultrasonic bonding of Au-Au, since no deformation PET film or the like because it is cold connection, the opposite surface of the mounting can be used as a surface layer.

【0025】 [0025]

【発明の効果】本発明によれば、ICパッドにアンテナコイルを金属結合で接続でき、配線基板や、導電接着剤を使用しないので安価にできる効果がある。 According to the present invention, the antenna coil can be connected by metal bonding to the IC pad, there is an effect that can be inexpensively because without using the wiring board and the conductive adhesive.

【0026】また、インレットと呼ばれる中間層を省略できるので高さ方向を十分にコントロール出来、薄型化ICカードを安定して生産することができる。 Further, it is possible omit the intermediate layer, called the inlet well can control the height direction, it is possible to stably produce thin IC card.

【0027】また、ICチップとアンテナ線を容易に接続することができ、パッドとアンテナ線との接続信頼性を高めることができる。 Further, the IC chip and the antenna wire can be easily connected, it is possible to improve the connection reliability between the pad and the antenna line.

【0028】さらに、ICカードを構成する樹脂材が変質しない低温で組立られ、環境に配慮した安価なICカードのモジュールを提供することができる。 Furthermore, assembled at a low temperature where the resin material constituting the IC card is not deteriorated, it is possible to provide a module of inexpensive IC card environmentally friendly.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明のICカードの一実施の形態例を示す断面図である。 1 is a cross-sectional view showing an embodiment of an IC card of the present invention.

【符号の説明】 DESCRIPTION OF SYMBOLS

1 ICチップ 2 バンプ 3 アンテナ材 4 アンテナコイニング部 5 外被樹脂層 6 カバー層 7 樹脂層 1 IC chip 2 bump 3 antenna member 4 antenna coining portion 5 enveloping resin layer 6 covering layer 7 resin layer

フロントページの続き (51)Int.Cl. 6識別記号 FI // H01L 25/00 G06K 19/00 H Front page continued (51) Int.Cl. 6 identifications FI // H01L 25/00 G06K 19/00 H

Claims (12)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 アンテナとICチップとの接続構造において、前記アンテナはアンテナ線をコイル状に巻くことによって作られているアンテナコイニング部を有し、該アンテナコイニング部が平坦形状を呈しており、前記I 1. A connecting structure between the antenna and the IC chip, the antenna has an antenna coining portion being made by winding an antenna wire coiled, the antenna coining portion has exhibited a flat shape, said I
    Cチップと前記アンテナコイニング部とが金属バンプを介して相互に接続されていることを特徴とするアンテナとICチップとの接続構造。 Connection structure between the antenna and the IC chip and the C chip and the antenna coining portion is characterized by being connected to each other via the metal bumps.
  2. 【請求項2】 請求項1記載のアンテナとICチップとの接続構造において、前記アンテナ及び前記ICチップが樹脂層によって覆われていることを特徴とするアンテナとICチップとの接続構造。 2. A connecting structure of the connection structure between the antenna and the IC chip according to claim 1, the antenna and the IC chip which the antenna and the IC chip and being covered by the resin layer.
  3. 【請求項3】 請求項1記載のアンテナとICチップとの接続構造において、前記アンテナコイニング部は、 3. A connecting structure between the antenna and the IC chip of claim 1, wherein the antenna coining portion,
    0.05μm以上の金属層を有していることを特徴とするアンテナとICチップとの接続構造。 Connection structure between the antenna and the IC chip, characterized in that it has a 0.05μm or more metal layers.
  4. 【請求項4】 アンテナとICチップとを含むICカードにおいて、前記アンテナはアンテナ線をコイル状に巻くことによって作られているアンテナコイニング部を有し、該アンテナコイニング部が平坦形状を呈しており、 4. The IC card comprising an antenna and IC chip, wherein the antenna has an antenna coining portion being made by winding an antenna wire coiled, the antenna coining portion has exhibited a flat shape ,
    前記ICチップと前記アンテナコイニング部とが金属バンプを介して相互に接続されており、さらに、前記アンテナ及び前記ICチップが樹脂層によって覆われており、該樹脂層上の少なくとも一方面に外被側樹脂層が設けられていることを特徴とするICカード。 Wherein it is interconnected IC chip and said antenna coining portion via the metal bumps, further wherein the antenna and the IC chip is covered by the resin layer, the outer in at least one surface on said resin layer IC card, wherein a side resin layer is provided.
  5. 【請求項5】 請求項4記載のICカードにおいて、前記樹脂層がホットメルト接着材であることを特徴とするICカード。 5. The IC card according to claim 4, wherein, the IC card, wherein the resin layer is a hot-melt adhesive.
  6. 【請求項6】 請求項4記載のICカードにおいて、前記アンテナコイニング部は、0.05μm以上の金属コーティング層を有していることを特徴とするICカード。 6. The IC card according to claim 4, wherein the antenna coining portion, IC card, characterized in that it has a 0.05μm or more metal coating layer.
  7. 【請求項7】 アンテナとICチップとの接続方法において、前記アンテナはアンテナ線をコイル状のアンテナコイニング部を有し、前記ICチップ上に設けた導電パッド上に金属バンプを形成し、前記アンテナ線をコイル状に巻くことによって前記アンテナコイニング部を形成し、前記バンプを実装する前記アンテナコイニング部を平坦化し、コイニングされた前記アンテナコイニング部の実装エリアに前記バンプを接続することを特徴とするアンテナとICチップの接続方法。 7. A method of connecting the antenna and the IC chip, the antenna and the antenna wire has a coiled antenna coining portion, a metal bump is formed over the conductive pad provided on the IC chip, the antenna the antenna coining portion is formed by winding a wire in a coil shape, and planarizing the antenna coining portion for mounting the bumps, characterized in that connecting the bumps to the mounting area of ​​the antenna coining portion that is coined method of connecting the antenna and the IC chip.
  8. 【請求項8】 請求項7記載のアンテナとICチップの接続方法において、前記アンテナ及び前記ICチップを樹脂層によって覆い、該樹脂層上の少なくとも一方面に外被樹脂層を設けることを特徴とするアンテナとICチップの接続方法。 8. The connection method according to claim 7, wherein the antenna and the IC chip, and wherein the antenna and the IC chip is covered by the resin layer, providing a jacket resin layer on at least one surface on said resin layer antenna and IC chip of the connections to.
  9. 【請求項9】 請求項7記載のアンテナとICチップの接続方法において、前記アンテナ線と前記ICチップに形成された前記バンプを80℃以下の温度にて、圧接と超音波とを併用して接続することを特徴とするアンテナとICチップの接続方法。 9. A connection method according to claim 7, wherein the antenna and the IC chip, the antenna wire and the bump formed on the IC chip at 80 ° C. below the temperature, in combination with the pressure and ultrasound antenna and IC chip connection method, characterized in that the connection.
  10. 【請求項10】 アンテナとICチップとを含むICカードの製造方法において、前記アンテナはアンテナ線をコイル状に巻くことによって作られているアンテナコイニング部を有し、前記ICチップ上に設けた導電パッド上に金属バンプを形成し、アンテナ線をコイル状に巻くことによって前記アンテナコイニング部を形成し、前記バンプを実装する前記アンテナコイニング部を平坦化し、コイニングされた実装エリアに前記バンプを接続し、前記アンテナ及び前記ICチップを樹脂層によって覆い、該樹脂層上の少なくとも一方面に外被樹脂層を設け、前記樹脂層上に仮固定して、前記アンテナコイニングに前記ICチップに形成された前記バンプを接続し、 10. The antenna and the IC card manufacturing method of including the IC chip, the antenna has an antenna coining portion being made by winding an antenna wire coiled conductive provided on the IC chip the metal bumps formed on the pad, the antenna wire to form the antenna coining portion by coiling, the bump and planarizing the antenna coining portion that implements, the bump connected to the mounting area, which is coined , the antenna and the IC chip is covered by the resin layer, the jacket resin layer provided on at least one surface on the resin layer, and temporarily fixed on the resin layer, formed on the IC chip to the antenna coining connecting the bump,
    その後、カバー樹脂層で積層張り合わせることを特徴とするICカードの製造方法。 Thereafter, the manufacturing method of the IC card, characterized by laminating laminating a cover resin layer.
  11. 【請求項11】 請求項10記載のICカードの製造方法において、前記アンテナコイニング部に0.05μm 11. The method of manufacturing an IC card according to claim 10, 0.05 .mu.m in the antenna coining portion
    以上の金属コーティング層を形成することを特徴とするICカードの製造方法。 IC card manufacturing method characterized by forming the above metal coating layer.
  12. 【請求項12】 請求項10記載のICカードの製造方法において、前記アンテナ線と前記ICチップに形成された前記バンプを80℃以下の温度にて、圧接と超音波とを併用して接続することを特徴とするICカードの製造方法。 12. The method of manufacturing an IC card according to claim 10, in the antenna line and the IC chip formed the bumps 80 ° C. temperature below connects a combination of the pressure and ultrasound IC card manufacturing method, characterized in that.
JP10136768A 1998-05-19 1998-05-19 Connection structure between antenna and ic chip, and ic card Withdrawn JPH11328352A (en)

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