JP2001052137A - Semiconductor package, production thereof and semiconductor device with incorporated semiconductor package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor package suitable for a semiconductor device such as non-contact IC card and capable of communication without contact, a method capable of highly efficiently producing the semiconductor package and the semiconductor device improved in durability, flatness and mass productivity. SOLUTION: An antenna coil 2a formed from a lead frame or wiring tab and an IC chip 4 directly connecting both the terminal parts of the relevant antenna coil 2a to a pad part are integrally sealed by a mold resin 6 and a semiconductor package 1A is provided. By casing this semiconductor package 1A with a substrate composed of an adhesive agent layer and a cover sheet, for example, the semiconductor device such as non-contact IC card can be provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package suitable for a non-contact type semiconductor device for wirelessly transmitting and receiving signals from a reader / writer and transmitting / receiving signals to / from the reader / writer, and a method of manufacturing the same. The present invention relates to a semiconductor device equipped with the semiconductor package.

[0002]

2. Description of the Related Art A semiconductor device, such as a card type, a tag type or a coin type, on which an IC is mounted has an abundant amount of information and a high security performance. Is progressing. Among them, a non-contact type semiconductor device developed recently has a structure in which an external terminal is not provided on a base, and a power supply from a reader / writer and transmission / reception of signals between the reader / writer are performed wirelessly. In addition to the fact that the external terminals are not substantially damaged as described above, not only are they easy to handle such as storage and can withstand long-term use, but they also have superior security performance because they are not easily tampered with. It is expected to spread to a wider field in the future.

A non-contact type semiconductor device of this type is a bare IC.
A circuit module including a chip and an antenna coil for wireless communication is buried in a base, but in a conventional non-contact type semiconductor device, an antenna coil is formed by pattern formation or solder connection as a circuit module. The bare IC chip is connected to the wiring board by wire bonding or flip chip bonding, or the antenna coil is directly connected to the pad of the bare IC chip by solder connection, welding, conductive paste connection or crimp connection, etc. Has been proposed.

[0004]

However, among the above-mentioned conventional circuit modules, those using a wiring board are:
Since the wiring substrate must be embedded in the base, it is difficult to reduce the thickness of the non-contact type semiconductor device, and a bare IC chip or the like mounted on the wiring substrate protrudes from the surface of the wiring substrate. Therefore, there is a problem that it is difficult to manufacture a non-contact type semiconductor device having high flatness.

[0005] On the other hand, the use of a wound coil is effective for reducing the thickness and improving the flatness of a non-contact type semiconductor device, but it is necessary to wind a wire having a diameter of about 20 µm to 100 µm. Not only is it difficult to accurately wind an antenna coil having a predetermined shape, but also it is difficult to handle each step after winding, and it is difficult to manufacture a non-contact type semiconductor device with high efficiency. .

The present invention has been made in view of the above circumstances, and an object thereof is to provide a thin and easy-to-handle circuit module (in this specification,
This is called a “semiconductor package”. ), And a method capable of manufacturing such a semiconductor package with high efficiency, and a semiconductor device such as a non-contact IC card which is thin and has high flatness and excellent mass productivity. It is in.

[0007]

In order to solve the above-mentioned problems, the present invention relates to a semiconductor package, in which an IC chip and an antenna coil for wireless communication whose both ends are connected to pad portions of the IC chip are integrated. In this configuration, resin molding is performed. In this specification, “direct connection”
This means that the antenna coil is directly connected to the pad portion of the IC chip without any other members, and that the antenna coil is connected to a bump made of gold, solder, nickel, etc. formed on the pad portion of the IC chip. Including.

As described above, when the IC chip and the antenna coil are integrally resin-molded, the rigidity of the antenna coil and the bare IC chip is increased, so that the handling can be facilitated, the bare IC chip is broken, and the antenna coil is disconnected. Can be prevented. In addition, if a precision injection molding technique is applied, a thin package can be obtained, so that a circuit module (semiconductor package) can be thinner than a case where a wiring board is used. Further, since the surface of the package can be formed flat, a semiconductor device having high flatness can be obtained when applied to a semiconductor device such as a non-contact IC card.

Although it is possible to use a wound coil as the antenna coil, it is particularly preferable to use a coil cut from either a lead frame or a wiring tab in order to increase the productivity of the semiconductor package.

[0010] Both ends of the antenna coil can be directly connected to the pad portion of the IC chip, or indirectly via a metal wire. When both ends of the antenna coil are directly connected to the pad portion of the IC chip, the connection methods include solder connection, welding, conductive paste connection, ACF connection (connection using an anisotropic conductive adhesive), and crimp connection. Can be used. On the other hand, when both ends of the antenna coil are indirectly connected to the pad portion of the IC chip via a metal wire, wire bonding can be used as the connection method.

The resin mold may be made of any known resin material as long as it has a required hardness after curing. However, the resin mold has a high hardness so that it can be easily injection molded and has a smooth surface. It is particularly preferable to use a highly crosslinkable thermosetting resin because it can be molded.

On the other hand, with regard to the method of manufacturing the semiconductor package, a step of connecting an IC chip to an antenna coil of a required shape formed on a lead frame or a wiring tab, and a step of integrally molding the antenna coil and the periphery of the IC chip with a resin mold And extracting a required semiconductor package by cutting unnecessary portions of the lead frame.

The lead frame and the wiring tab can be formed in a ribbon shape in which a large number of antenna coils are formed at regular intervals. In addition, a lead frame or a wiring tab formed in a ribbon shape can be sequentially fed into a resin mold, whereby required resin molding can be continuously performed. Therefore, after connecting the IC chip to the antenna coil of a required shape formed on the lead frame or the wiring tab, the lead frame to which the IC chip is connected is fed into a mold for resin molding to perform resin molding. Coil and IC
Since a substrate for mounting the chip is not required, and the periphery of the antenna coil and the IC chip can be continuously resin-molded, the productivity of a desired semiconductor package and, consequently, a semiconductor device mounted with the same is significantly increased. Can be.

Further, as for the semiconductor device, a semiconductor package formed by integrally resin-molding an IC chip and an antenna coil for wireless communication having both ends connected to the pad portion of the IC chip is provided in a base having a predetermined shape. It was configured to be buried.

As described above, a semiconductor package in which an IC chip and an antenna coil for wireless communication are integrally molded with a resin is thin, and is excellent in handleability and durability and has high surface flatness. By embedding the semiconductor package in the base, it is possible to manufacture a semiconductor device having a small thickness, excellent durability, and high surface flatness with high efficiency.

The base may be composed of a cover sheet and an adhesive layer provided on one side of the cover sheet, or a cover sheet, an adhesive layer provided on one side of the cover sheet, It can also be composed of a nonwoven fabric interposed in the adhesive layer.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first example of a semiconductor package according to the present invention will be described with reference to FIGS. FIG. 1 is a partially cutaway plan view of the semiconductor package according to the first embodiment, and FIG. 2 is an enlarged sectional view of a main part of the semiconductor package according to the first embodiment.

As is clear from these figures, the semiconductor package 1A according to the first embodiment has an antenna coil 2a having a one-turn structure, and lead terminal portions 3 formed at both ends of the antenna coil 2a. The lead terminal part 3
IC chip 4 directly connected to the antenna, a protruding portion 5 protruding outward from the antenna coil 2a, and a mold for integrally sealing the antenna coil 2a, the lead terminal portion 3, the IC chip 4 and the protruding portion 5. And a resin 6.

The antenna coil 2a, the lead terminal portion 3 and the protruding portion are integrally formed by providing a conductive film on the surface of a thin metal plate or a synthetic resin sheet, and as shown in FIG. It is arranged horizontally inside.
As described in more detail below, the antenna coil 2a, the lead terminal portion 3, and the protruding portion may be formed from a lead frame or may be formed from a wiring tab. it can. As the IC chip 4, a bare IC chip in which a gold bump 7 is applied to a pad portion (not shown) serving as an input / output terminal is used. Depending on the total thickness of the semiconductor device to be manufactured, the bare IC chip 4 is obtained by subjecting a silicon wafer to polishing by mechanical or chemical means or a combination thereof to reduce the thickness to a desired thickness. Can also be used.

The lead terminal 3 and the bare IC chip 4
As shown in FIG. 2, they are electrically connected via gold bumps 7 formed on the pad portions of the IC chip 4. As a method of connecting the lead terminal portion 3 and the bare IC chip 4, solder connection, welding, conductive paste connection, ACF connection, crimp connection, or the like can be used.

The mold resin 6 can be molded using any known resin material as long as it has a required hardness after curing. It is particularly preferable to use a highly crosslinkable thermosetting resin because it can be molded into a resin. The total thickness of the mold resin 6 can be arbitrarily adjusted as needed, but can be formed to about 0.3 mm to 0.5 mm.

In the semiconductor package 1A of this embodiment, since the antenna coil 2a and the bare IC chip 4 are integrally resin-molded, the rigidity of the antenna coil 2a and the bare IC chip 4 is increased, and handling, particularly, of the antenna coil 2a, is performed. Handling is easy and the antenna coil 2
a and disconnection of the bare IC chip 4 can be prevented. Further, a substrate for mounting the antenna coil and the IC chip is not required, and can be formed to a thickness of about 0.3 mm to 0.5 mm as described above, and the surface thereof is formed flat. Therefore, when the present invention is applied to a semiconductor device such as a non-contact IC card, a thin semiconductor device having high flatness can be obtained.

Next, a method of manufacturing the semiconductor package 1A according to the first embodiment will be described with reference to FIGS. 3 is a plan view of a main part of a lead frame or a wiring tab serving as a base of an antenna coil. FIG. 4 is a plan view of a main part of a lead frame or a wiring tab to which a bare IC chip 4 is connected.
FIG. 5 is a plan view of a main part of a lead frame or a wiring tab in which the antenna coil 2a and the bare IC chip 4 are resin-molded.

First, as shown in FIG. 3, an antenna coil 2a having a one-turn structure, lead terminal portions 3 formed at both ends of the antenna coil 2a, a package support portion 8 which becomes a protruding portion 5 after cutting, and , Positioning holes 9 and transport holes 10 are formed in a longitudinal direction at a required pitch in a ribbon-shaped or tape-shaped lead frame or wiring tab 21A.
Prepare

Next, as shown in FIG. 4, the gold bump 7 formed on the pad portion of the bare IC chip 4 is directly connected to the lead terminal portion 3 of the lead frame or the wiring tab 21A. As a direct connection method between the lead terminal portion 3 and the gold bump 7, as described above, solder connection, welding, conductive paste connection, ACF connection, or crimp connection can be used.

Next, the lead frame or the wiring tab 21A on which the bare IC chip 4 is mounted is sent to a mold (not shown) using the positioning holes 9 and the transport holes 10, and as shown in FIG. The antenna coil 2a, the lead terminal portion 3, the IC chip 4, and a part of the package support portion 8 are integrally resin-molded. As described above, by holding the bare IC chip 4 by the lead frame or the wiring tab 21A, the bare IC chip 4 can be installed at the center position in the thickness direction of the semiconductor package without using a substrate.

Finally, the package supporting portion 8 protruding from the mold resin 6 is cut to obtain the semiconductor package 1A shown in FIGS. In FIG. 1, a part of the protruding portion 5 protrudes outward from the outer surface of the mold resin 6. However, the gist of the present invention is not limited to this, and the in-plane of the outer surface of the mold resin 6 is not limited thereto. With package support 8
Is cut, the protrusion of the protrusion 5 from the outer surface of the mold resin 6 can be prevented.

Thus, the lead frame or the wiring tab 2
When the semiconductor package 1A is manufactured using the semiconductor package 1A, each process can be completely automated, so that the productivity of a desired semiconductor package and a semiconductor device having the semiconductor package mounted thereon can be significantly increased.

Hereinafter, a second example of the semiconductor package according to the present invention will be described with reference to FIGS. FIG. 6 shows the second
FIG. 7 is an enlarged cross-sectional view of a main part of a semiconductor package according to a second embodiment.

As is apparent from these figures, the semiconductor package 1B according to the second embodiment includes an antenna coil 2b having a spiral structure, lead terminals 3 formed at both ends of the antenna coil 2b, An IC chip 4 directly connected to a lead terminal portion 3;
The antenna coil 2 b, the lead terminal 3, the IC chip 4, and the mold resin 6 that integrally seals the protrusion 5 are formed.

The semiconductor package 1B of the present embodiment is characterized by using an antenna coil 2b having a spiral structure as an antenna coil, and the configuration of other parts is the same as that of the semiconductor package 1A according to the first embodiment. Since the configuration is the same, the same reference numerals are given to the corresponding portions in the drawings, and description thereof will be omitted. Also, regarding the manufacturing method,
Since it is the same as the method of manufacturing the semiconductor package 1A according to the first embodiment, FIG. 8 corresponding to FIGS. 3 to 5 showing the method of manufacturing the semiconductor package 1A according to the first embodiment.
The description is omitted with reference to FIGS.

The semiconductor package 1B according to the present embodiment has the same effects as the semiconductor package 1A according to the first embodiment, and uses the spiral-shaped antenna coil 2b, so that the semiconductor package 1A according to the first embodiment is used. This has the effect that the semiconductor package can be made smaller in size.

Hereinafter, a third example of the semiconductor package according to the present invention will be described with reference to FIGS. FIG.
FIG. 12 is a partially cutaway plan view of a semiconductor package according to the third embodiment, and FIG. 12 is an enlarged sectional view of a main part of the semiconductor package according to the third embodiment.

As apparent from these figures, the semiconductor package 1C according to the third embodiment has an antenna coil 2b having a spiral structure, lead terminals 3 formed at both ends of the antenna coil 2b, and a die pad. 11, the IC chip 4 set on the die pad 11, the gold bump 7 formed on the pad portion of the IC chip 4, and the lead terminal portions 3 formed on both ends of the antenna coil 2b. The gold wire 12 and the antenna coil 2
and a molding resin 6 for integrally sealing the antenna coil 2b, the lead terminal portion 3, the die pad 11, the IC chip 4, the gold wire 12, and the projection portion 5. ing.

The die pad 11 includes an antenna coil 2b,
The lead terminals 3 and the protrusions 5 are made of the same material, and are arranged in parallel with the antenna coil 2b. The connection between the gold bump 7 and the lead terminal portion 3 can be made by wire bonding. Since the configuration of other parts is the same as the configuration of the semiconductor package 1A according to the first embodiment, corresponding parts in the drawings are denoted by the same reference numerals and description thereof is omitted.

The semiconductor package 1C of this embodiment has the same effects as the semiconductor package 1A of the first embodiment and the semiconductor package 1B of the second embodiment, and also has leads formed at both ends of the antenna coil. Instead of the configuration in which the IC chip 4 is directly connected to the terminal portion 3, the IC pad 4 is mounted on the die pad 11 arranged in parallel with the antenna coil 2b.
Since the chip 4 was set and the gold bumps 7 formed on the pad portions of the IC chip 4 and the lead terminals 3 formed on both ends of the antenna coil 2b were connected by the gold wires 12, The degree of freedom in designing the antenna coil 2b can be increased, and the communication distance can be further increased.

Next, a method of manufacturing the semiconductor package 1C according to the third embodiment will be described with reference to FIGS. FIG. 13 is a plan view of a main part of a lead frame or a wiring tab serving as a base of an antenna coil, FIG. 14 is a plan view of a main part of a lead frame or a wiring tab to which a bare IC chip 4 is connected, and FIG. FIG. 3 is a plan view of a main part of a lead frame or a wiring tab on which an IC chip 4 is resin-molded.

First, as shown in FIG. 13, an antenna coil 2b having a spiral structure, lead terminals 3 formed at both ends of the antenna coil 2b, a die pad 11,
A ribbon-shaped or tape-shaped lead frame or wiring tab 21C in which a number of package supporting portions 8 to be projected portions 5 after cutting, positioning holes 9 and transport holes 10 are formed at a required pitch in the longitudinal direction is prepared. .

Next, as shown in FIG. 14, the bare IC chip 4 is set on the die pad 11 formed on the lead frame or the wiring tab 21C. The setting of the bare IC chip 4 can be performed by, for example, bonding or the like. Next, as also shown in FIG. 14, the gold bump 7 formed on the pad portion of the IC chip 4 and the antenna coil 2 are formed.
b and the lead terminal portions 3 formed at both ends of the gold wire 1
Connect with 2. As a connection method of the gold wire 12, wire bonding can be applied.

Next, a lead frame or a wiring tab 21C to which the antenna coil 2b and the bare IC chip 4 are connected.
Is sent to a mold (not shown) using the positioning holes 9 and the transport holes 10, and as shown in FIG.
Antenna coil 2a, lead terminal 3, die pad 1
1. A part of the IC chip 4 and a part of the package supporting portion 8 are integrally resin-molded.

Finally, the package supporting portion 8 protruding from the mold resin 6 is cut to obtain the semiconductor package 1C shown in FIGS. Also in this case, the tip of the protruding portion 5 can be made to protrude outward from the outer surface of the mold resin 6 or can be arranged in the outer surface of the mold resin 6.

The semiconductor package manufacturing method of this embodiment is also the first method.
It has the same effect as the semiconductor package manufacturing method according to the embodiment.

Hereinafter, the structure of a card-type non-contact type semiconductor device equipped with the semiconductor packages 1A, 1B and 1C according to the above embodiments, that is, a non-contact type IC card, and a method of manufacturing the same will be described.

FIG. 16 is a partially cutaway plan view of the non-contact type IC card according to the present invention, and FIG. 17 is a sectional view of the non-contact type IC card shown in FIG.

As shown in FIGS. 16 and 17, the non-contact type IC card 30 of the present embodiment has a semiconductor package 1A (1
B, 1C) and the semiconductor package 1A (1B, 1C).
C) and a base 31 embedded therein.

The base 31 is composed of an adhesive layer 32 and a cover sheet 33 attached to the surface of the adhesive layer 32, as shown in FIGS. A nonwoven fabric 34 can be interposed in the adhesive layer 32 as shown in FIG. 17 in order to increase the strength and rigidity of the base 31.

As the adhesive constituting the adhesive layer 32,
Any adhesive known in the art can be used as long as it has the required strength after curing.However, since it can be bonded by a roll press or a static pressure press and hardly warps after curing, it can be used as a heat-sensitive adhesive. It is particularly preferred to use a plastic elastomer or a mixture of a thermoplastic elastomer and a resin.

The cover sheet 33 can be made of any insulating resin sheet, but is made of polyethylene terephthalate (PET), vinyl chloride (PVC) or the like because of its high strength and excellent adhesiveness and printability. It is particularly preferred to use.

The non-contact type IC card 30 of this embodiment comprises a semiconductor package 1A (1B, 1C) in which an IC chip and an antenna coil for wireless communication are integrally molded with a resin.
Since it can be manufactured simply by burying it in the device 1, it can be manufactured with high efficiency. Further, since the semiconductor package 1A (1B, 1C) having high strength and excellent flatness is embedded in the base 31, durability and flatness of the semiconductor device can be improved.

Hereinafter, the non-contact type IC according to the embodiment will be described.
A method for manufacturing the card 30 will be described.

<First Example of Semiconductor Device Manufacturing Method> In a first example of a manufacturing method, the semiconductor package 1A (1B, 1C) is
Adhesive layer 32 and cover sheet 3 with nonwoven fabric 34 interposed
3 is characterized in that it is casing with a base 31 composed of

First, as shown in FIG. 18, semiconductor packages 1A (1B, 1C) are temporarily attached to one side of a nonwoven fabric 34 having compressibility and self-compression bonding property. Here, the compressibility of the nonwoven fabric 34 means that when the semiconductor package 1A (1B, 1C) is pressed against the nonwoven fabric 34 under heating, the whole or a part of the semiconductor package 1A (1B, 1C) is The self-pressing property refers to a property that can be buried in the fiber, and the term “self-compression bonding property” means that, when compressed under heating, the fibers constituting the nonwoven fabric 34 and other members, for example, the semiconductor package 1A (1B, 1C) 2 and others. Refers to the property that a non-woven fabric can be adhered to maintain a certain shape. The temporary attachment of the semiconductor packages 1A (1B, 1C) to the non-woven fabric 34 is performed by pressing the semiconductor packages 1A (1B, 1C) against one surface of the non-woven fabric 34 formed in a tape shape or a ribbon shape under heating and arranging the semiconductor packages 1A at a constant pitch. Performed by

The semiconductor package 1A (1B, 1B, 1B) of the nonwoven fabric 34 to which the semiconductor package 1A (1B, 1C) is temporarily attached.
1C) A non-woven fabric 34 of the same or different type as the non-woven fabric 34 is placed on the mounting surface, and these two non-woven fabrics 34 are press-bonded under heating. As a result, the flexible IC module 3 in which a large number of semiconductor packages 1A (1B, 1C) are sandwiched between the tape-shaped or ribbon-shaped nonwoven fabrics 34 at a constant pitch.
5 is obtained.

Next, a cover sheet 33 is adhered to the front and back surfaces of the flexible IC module 35 thus manufactured via the adhesive layer 32, and the semiconductor package 1A (1B, 1C) is casing. As shown in FIG. 19, the casing of the semiconductor package 1A (1B, 1C) is bonded to the flexible IC module 35 wound in a roll shape and one surface formed in a tape or ribbon shape and wound in a roll shape. A cover sheet 33 having an agent layer 32 is prepared, and a roller 4 is provided on both sides of the flexible IC module 35 pulled out from the roller 41.
This is performed by bonding the cover sheet 33 pulled out from the base plates 2 and 43 via the adhesive layer 32. FIG.
In the figure, reference numeral 44 denotes a pull-out roller, reference numeral 45 denotes a transport roller, reference numeral 46 denotes a bonding roller for temporarily attaching the flexible IC module 35 and the cover sheet 33, and reference numeral 47 denotes a temporarily attached flexible IC module 35.
And a thermocompression roller for thermocompression-bonding the joined body of the cover sheet 33 and the card sheet 48 having a predetermined thickness. The adhesive layer 32 provided on one side of the cover sheet 33 is melted in the process of passing through
The flexible IC module 35 and the two cover sheets 33 are integrally joined.

Incidentally, in the example of FIG.
Was used to manufacture the card stock 48, but instead of such a configuration, the card stock 48 can be manufactured using a static pressure press device.

Finally, the card blank 48 is cut to obtain a non-contact type IC card 30 having a predetermined shape and dimensions.

According to the semiconductor device manufacturing method of this example, the flexible IC module 35 and the cover sheet 33 can be formed in a tape shape or a ribbon shape, and the processing and processing in each step can be performed automatically and continuously. Therefore, the productivity of the desired non-contact type IC card 30 can be significantly increased.

<Second Example of Semiconductor Device Manufacturing Method> A second example of the semiconductor device manufacturing method includes a semiconductor package 1A (1B,
1C) is characterized in that it is casing with a base 31 composed of an adhesive layer 32 and a cover sheet 33.

The semiconductor package 1A (1B, 1C) is
As shown in FIG. 20, the cover sheet 33 having the adhesive layer 32 formed on one side is temporarily attached to the adhesive layer forming surface.
The semiconductor package 1A (1B, 1B) for the adhesive layer 32
C) is temporarily attached to the semiconductor package 1 on the adhesive layer forming surface of the cover sheet 33 formed in a tape shape or a ribbon shape.
A (1B, 1C) is pressed under heating and arranged at a constant pitch.

Next, the semiconductor package 1A (1B, 1
C), a cover sheet 33 of the same type or a different type as the cover sheet 33 is attached to the surface of the cover sheet 33 to which the cover sheet 33 is temporarily attached, and the semiconductor package 1A (1
B, 1C). Semiconductor package 1A
As shown in FIG. 21, the casing (1B, 1C)
The cover sheet 33 to which the semiconductor package 1A (1B, 1C) is temporarily attached and the semiconductor package 1A (1B, 1C)
This is performed by winding a cover sheet 33 having no cover sheet together with a roll sheet, and bonding both cover sheets 33 drawn out from the rollers 51 and 52 with the adhesive layer 32 inside. Also in FIG. 21, reference numeral 44 denotes a pull-out roller, reference numeral 45 denotes a transport roller, reference numeral 46 denotes a bonding roller for temporarily attaching the cover sheet 33, and reference numeral 47 denotes a predetermined pressure-bonded body of the temporarily attached cover sheet 33. 4 shows a thermocompression roller for producing a card blank 48 having a thickness. The adhesive layer 32 provided on one side of each cover sheet 33 is melted in the process of passing through the thermocompression roller 47, and the semiconductor package 1A (1B, 1C) is bonded to the adhesive layer 8
And two cover sheets 33 are integrally connected. Thus, the card blank 48 is produced.

Incidentally, in the example of FIG.
Was used to manufacture the card stock 48, but instead of such a configuration, the card stock 48 can be manufactured using a static pressure press device.

Finally, the card blank 48 is cut to obtain a non-contact type IC card 30 having a predetermined shape and dimensions.

According to the manufacturing method of this embodiment, the same effects as those of the first manufacturing method can be obtained, and the productivity of the non-contact type IC card 1 can be further increased because no nonwoven fabric is used.

In the above embodiment, the non-contact type IC card 30 has been described as an example. However, a semiconductor device other than a card type, for example, a tag type or coin type semiconductor device may be manufactured by the same method. Can be. Further, the semiconductor package molded in a mold can be formed into a tag shape or a coin shape, and the semiconductor package can be used as it is as a semiconductor device.

[0065]

As described above, in the semiconductor package of the present invention, since the antenna coil and the bare IC chip are integrally resin-molded, the rigidity of the antenna coil and the bare IC chip is increased, and the handling of the antenna coil is improved. And the breaking of the antenna coil and the destruction of the bare IC chip can be prevented. Also, 0.
Since it can be formed to a thickness of about 3 mm to 0.5 mm and its surface can be formed flat,
When applied to a semiconductor device such as a non-contact IC card, a thin, highly flat semiconductor device can be obtained.

According to the semiconductor package manufacturing method of the present invention, since a semiconductor package is manufactured using a lead frame or a wiring tab, a substrate on which an antenna coil and an IC chip are mounted becomes unnecessary, and each step can be completed. Thus, the productivity of a desired semiconductor package and a semiconductor device having the semiconductor package mounted thereon can be significantly increased.

Furthermore, the semiconductor device of the present invention can be manufactured simply by embedding a semiconductor package in which an IC chip and an antenna coil for wireless communication are integrally molded in a resin in a base, so that the semiconductor device can be manufactured with high efficiency. In addition, since a semiconductor package with high strength and excellent flatness is embedded in the base,
The durability and flatness of the semiconductor device can be improved.

[Brief description of the drawings]

FIG. 1 is a partially broken plan view of a semiconductor package according to a first embodiment.

FIG. 2 is a sectional view of the semiconductor package according to the first embodiment;

FIG. 3 is a plan view of a lead frame or a wiring tab applied to the manufacture of the semiconductor package according to the first embodiment.

FIG. 4 is a plan view showing a state where an IC chip is mounted on the lead frame or the wiring tab of FIG. 3;

5 is a plan view showing a state where a resin mold is applied to the lead frame or the wiring tab of FIG. 3 on which an IC chip is mounted.

FIG. 6 is a partially broken plan view of a semiconductor package according to a second embodiment.

FIG. 7 is a sectional view of a semiconductor package according to a second embodiment.

FIG. 8 is a plan view of a lead frame or a wiring tab applied to the manufacture of a semiconductor package according to the second embodiment.

FIG. 9 is a plan view showing a state where an IC chip is mounted on the lead frame or the wiring tab of FIG. 8;

FIG. 10 is a plan view showing a state where a resin mold is applied to the lead frame or the wiring tab of FIG. 8 on which an IC chip is mounted.

FIG. 11 is a partially broken plan view of a semiconductor package according to a third embodiment.

FIG. 12 is a sectional view of a semiconductor package according to a third embodiment;

FIG. 13 is a plan view of a lead frame or a wiring tab applied to manufacture of a semiconductor package according to a third embodiment.

FIG. 14 is a diagram showing an IC in a lead frame or a wiring tab shown in FIG. 13;
It is a top view showing the state where a chip was mounted.

FIG. 15 is a plan view showing a state where a resin mold is applied to the lead frame or the wiring tab of FIG. 13 on which an IC chip is mounted.

FIG. 16 is a partially cutaway plan view of the non-contact type IC card according to the present invention.

FIG. 17 is a diagram illustrating an example of the contactless IC card shown in FIG.
It is A section sectional drawing.

FIG. 18 is a sectional view of a nonwoven fabric to which a semiconductor package is temporarily attached.

FIG. 19 is a configuration diagram showing a casing means of the flexible IC module.

FIG. 20 is a cross-sectional view of a cover sheet to which a semiconductor package is temporarily attached.

FIG. 21 is a configuration diagram showing a casing means of a semiconductor package.

[Explanation of symbols]

 1A, 1B, 1C Semiconductor package 2a, 2b Antenna coil 3 Lead terminal 4 IC chip 5 Projection 6 Mold resin 7 Gold bump 8 Package support 9 Positioning hole 10 Transport hole 11 Die pad 12 Gold wire 21A, 21B, 21C Lead Frame or wiring tab 30 Non-contact type IC card 31 Base 32 Adhesive layer 33 Cover sheet 34 Non-woven fabric 41, 42, 43, 51, 52 Roller 44 Pull-out roller 45 Transport roller 46 Laminating roller 47 Thermocompression roller 48 Card stock

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Mitsuo Kamagaya 1-88 Ushitora, Ibaraki-shi, Osaka F-term in Hitachi Maxell, Ltd. (Reference) 2C005 MA10 MA11 MA14 NA09 NA34 NB08 NB11 NB34 PA18 QC09 RA07 TA22 5B035 AA04 AA07 BA05 BB09 CA01 CA23

Claims (11)

[Claims] 1. A semiconductor package wherein an IC chip and an antenna coil for wireless communication having both ends connected to pad portions of the IC chip are integrally molded with a resin. 2. The semiconductor package according to claim 1, wherein the antenna coil is cut from one of a lead frame and a wiring tab. 3. The semiconductor package according to claim 1, wherein both ends of said antenna coil are directly connected to pad portions of said IC chip. 4. The semiconductor package according to claim 3, wherein the connection between the pad portion of the IC chip and both ends of the antenna coil is performed by one of a solder connection, a welding, a conductive paste connection, an ACF connection, and a crimp connection. A semiconductor package characterized by being performed. 5. The semiconductor package according to claim 1, wherein a pad portion of the IC chip and both ends of the antenna coil are indirectly connected via a metal wire. 6. The semiconductor package according to claim 5, wherein the connection between the pad portion of the IC chip and both ends of the antenna coil is performed by wire bonding. 7. The semiconductor package according to claim 1, wherein said resin mold is made of a highly crosslinkable thermosetting resin. 8. A step of connecting an IC chip to an antenna coil having a required shape formed on a lead frame or a wiring tab, a step of integrally resin-molding the periphery of the antenna coil and the periphery of the IC chip, and eliminating the need for the lead frame. Cutting the portion to take out a required semiconductor package. 9. A semiconductor package formed by integrally resin-molding an IC chip and a wireless communication antenna coil having both ends connected to pad portions of the IC chip, and embedded in a base body having a predetermined shape. Semiconductor device. 10. The semiconductor device according to claim 9, wherein said base comprises a cover sheet and an adhesive layer provided on one surface of said cover sheet. 11. The semiconductor device according to claim 9, wherein the base comprises a cover sheet, an adhesive layer provided on one surface of the cover sheet, and a non-woven fabric interposed in the adhesive layer. A semiconductor device characterized by the above-mentioned.