JP2951552B2 - Method for manufacturing flat electric wiring material and mold used for the method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film-like material such as a flat cable or a flexible printed circuit board manufactured by laminating a foil conductor so as to be sandwiched between two insulating films having an adhesive layer. The present invention relates to a method of manufacturing a flat electric wiring material, particularly, the thickness of the metal foil constituting the circuit conductor is relatively thick, and in manufacturing the circuit conductor by processing the metal foil into a required shape, for example, etching, Provided is a means suitable for application to flat electric wiring members, which is more advantageous to perform by mechanical means such as pressing than chemical means such as plating.

[0002]

2. Description of the Related Art For a flat cable having a circuit conductor formed of a relatively thick metal foil because a large current capacity is required, the time required for manufacturing can be shortened. It is common to fabricate circuit conductors by processing.

A plurality of circuit conductors constituting a flat cable are arranged on an insulating film while maintaining a predetermined relative position, and are bonded together. At this time, it is necessary to consider that a circuit conductor processed into a shape that forms an electric circuit is susceptible to damage such as bending by a slight external force. For this reason, when manufacturing circuit conductors by punching metal foil, how to transfer multiple easily-damaged circuit conductors to the process of bonding them on the insulating film while maintaining the mutual positional relationship Is the biggest problem.

An example of a conventional method for manufacturing a flat cable will be described with reference to FIG.
0938). In this conventional example, the carrier tape 2
An adhesive is applied in the same shape as the circuit conductor through the mask 4, then the metal foil 9 is bonded, only the metal foil 9 is cut by the half-cut press 11, and unnecessary portions of the metal foil 9 are removed. Only part 12 is left. Unnecessary portions of the metal foil 9 are not adhered to the carrier tape 2 and can be easily removed. Next, an insulating film is laminated on the carrier tape 2 by a heating roll laminator, and the conductor portion 12 adhered to the carrier tape 2 is adhered to the insulating film. Then, the carrier tape 2 is wound around a carrier removing roll and removed. I do. Thereafter, another insulating film is bonded to the other surface of the circuit conductor, and the outer shape is cut to obtain a flat cable. In the figures, 1 and 8 are rolls,
3 is a masking mechanism, 5 is a nozzle for applying an adhesive 6,
Reference numeral 7 denotes a synchronization point provided on the carrier tape 2 for positioning by the masking mechanism 3, and reference numeral 10 denotes a laminator.

As another example of a method of transferring the punched circuit conductor, there is a method of using a punching die used for punching a metal foil without using a carrier tape. This method will be described below with reference to FIGS.
FIG. 5 is a partial sectional view of a mold used in this conventional example. The male mold 21 has a blade 2 that matches the shape of the circuit conductor.
1a is provided, and the female mold 22 is provided with a blade portion 22a that also matches the shape of the circuit conductor, and the metal foil 23 is disposed between the male mold 21 and the female mold 22. Further, the insulating film 24 having the adhesive layer 24a is arranged so as to be laminated on the female mold 22.

By moving the male mold 21 in the direction of arrow A from the state shown in FIG. 5, the metal foil 23 can be punched out to form a circuit conductor. FIG. 6 shows this state. In FIG. 6, a part of a metal foil 23 is punched out by a male mold 21 and a female mold 22 to form a circuit conductor 25.
The male mold 21 is further moved in the direction of the arrow A from the state shown in the figure, and the circuit conductor 25 is projected from the blade portion 22a of the female mold 22 and pressed and joined to the adhesive layer 24a of the insulating film 24. When the adhesive layer 24a is made of a thermoplastic adhesive, it is preferable to heat the adhesive layer 24a in advance.

Next, all steps of this method will be described with reference to FIG. In FIG. 7, the metal foil 23 and the insulating film 24 having the adhesive layer 24a supplied from the left to the right are processed by the press 26 as described above, and the circuit conductor 25 is formed on the insulating film 24. The sheet is sent out to the right side of the press machine 26 in the state of being bonded. Next, the insulating film 34 having the same adhesive layer as the insulating film 24 is supplied as shown in the drawing and is bonded by the laminating roll 27. Next, the outer shape stamping press mold 28
Thus, a flat cable 29 as a finished product is obtained by punching out the outer shape. The remaining insulating film 3 punched out
0 is discarded after being wound by the winding roll 31. Note that the guide rolls 32 are appropriately arranged in order to smoothly transfer each material in the above steps.

[0008]

However, the above-mentioned method of manufacturing a flat cable has the following problems. 1) In the first method, the metal foil 9 is applied to the carrier tape 2 on which an adhesive is selectively applied in a shape corresponding to the shape of the circuit conductor.
Are temporarily bonded, and the metal foil 9 is half-cut to form a circuit conductor. Next, the circuit conductor is transferred by transferring the circuit conductor to an insulating film that is to be an original insulating layer of the flat cable. In this method, the carrier tape 2 used once cannot be reused because of damage due to half-cutting and contamination of the adhesive, and so the use of the carrier tape 2 causes an increase in cost, and the process becomes redundant. ing.

2) In the second method, since a circuit conductor is bonded to an insulating film immediately after punching, a carrier tape is not required, and the process is simplified as compared with the first method. By the way, the female mold 22 has a small blade portion 22a having a shape corresponding to the circuit conductor, so that the mechanical strength is reduced. Therefore, in order to increase the mechanical strength,
It is necessary to make the female mold as thick as possible. on the other hand,
The height of the blade portion 21a of the male mold 21 needs to be slightly larger than the thickness of the female mold 22, as is apparent from FIGS. Therefore, if the thickness of the female mold 22 is increased in order to secure the mechanical strength, the height of the blade 21a of the male mold 21 must also be increased. As a result, the strength of the blade 21a of the male mold 21 is increased. And there is a problem that it is difficult to manufacture a mold having a long life. SUMMARY OF THE INVENTION An object of the present invention is to solve the problems of the above-described conventional manufacturing method, to simplify the steps, and to provide a manufacturing method that does not require an auxiliary material such as a carrier tape.

[0010]

SUMMARY OF THE INVENTION The present invention provides a method of manufacturing a flat electric wiring material which solves the above problems and a mold used in the method. The metal foil is formed of a male and a female mold. A step of holding a circuit conductor component formed by punching into a predetermined shape with a mold in a female mold,
A step of projecting the circuit conductor component from within the female mold and attaching the circuit conductor component to an insulating film with an adhesive on one surface of the circuit conductor component, and then another insulating film with an adhesive on the other surface of the circuit conductor component A method for manufacturing a flat electric wiring material, characterized by having a step of attaching
A projecting pin is inserted into the bottom of the female blade, and the female is relatively movable with respect to the male. The mold used is the second invention.

[0011]

As described above, when a circuit conductor component formed by punching from a metal foil using a metal mold is held and transferred in a female mold, the female mold becomes a carrier, and a carrier tape becomes unnecessary. In addition, since the projecting pin is inserted from the bottom of the blade and the bottom of the blade is closed, the female mold constituting the above-mentioned mold has a high mechanical strength. No, the mold life is longer than the conventional one.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings. FIG. 1 is a partial cross-sectional view of a die for punching a circuit conductor component used in one embodiment of the method for manufacturing a flat electric wiring material according to the present invention. This mold is composed of a male die 43 having a blade portion 43a having a shape corresponding to the shape of the circuit conductor component, and a female die 44 similarly having a blade portion 44a having a shape matching the shape of the circuit conductor component. ing. Unlike the conventional female mold shown in FIGS. 5 and 6, the bottom of the blade portion 44a of the female mold 44 of the present invention is closed by inserting a round pin-shaped protruding pin 45a.
The plurality of protruding pins 45a are provided on the protruding plate 45. By moving the protruding plate 45 vertically with respect to the female mold 44, the plurality of protruding pins 45a are It protrudes from the bottom of 44a (the state of FIG. 2) or is housed in the blade portion 44a.

In FIG. 1, a metal foil 41 disposed between a male die 43 and a female die 44 has a blade portion 43a and a blade portion 44a.
And the circuit conductor component 42 is formed.
From this state, the male mold 43 is moved in the direction of arrow A, and the remaining metal foil 41 from which the circuit conductor component 42 has been punched is removed from the male mold 43. In this state, the punched circuit conductor component 42 is held in the blade portion 44 a of the female mold 44.

Next, FIG. 2 shows a state after the female mold 44 is moved to the next step along, for example, a guide rail (not shown) while holding the circuit conductor component 42 in the blade portion 44a. . In FIG. 2, after the female mold 44 is arranged so as to face the surface of the insulating film 46 having the adhesive layer 46a, the projecting plate 45 is moved in the direction of arrow A, so that the circuit conductor component 42 is The insulating film 46 protrudes from the blade portion 44a of the mold 44.
Paste to. The backing plate 47 is used to hold the insulating film 46 in a flat shape during the bonding, and is performed when the adhesive layer 46a of the insulating film 46 is made of a thermoplastic adhesive. Is desirably heated in advance by a heater.

The steps of the method of manufacturing a flat cable using the above-described mold will be described with reference to the schematic process diagram shown in FIG. In FIG. 3, all the materials are supplied from the left side of the figure, and shift to the right in the figure as the processing proceeds. The steps are as follows. That is, 1) The circuit conductor component 42 is punched out of the metal foil 41 by the press machine 48 as described in FIG. 2) Next, while holding the circuit conductor component 42 in the blade portion 44a, the female mold 44 is moved in the direction of the joining machine 49 along a guide rail (not shown) or the like, and will be described with reference to FIG. As described above, the circuit conductor component 42 is bonded to the insulating film 46. Thereafter, the female mold 44 is returned to the press machine 48, and the next circuit conductor component 42 is punched. 3) Next, the insulating film 46 on which the circuit conductor components 42 are bonded is sent rightward in the drawing by the bonding machine 49, and the insulating film 51 having an adhesive layer is further bonded by the laminating roll 50 in the same manner as the insulating film 46. Match. 4) Next, a flat cable 53 is completed by punching out the outer shape by the outer shape punching press 52. In addition,
The remaining insulating film 54 after punching out the flat cable 53 is taken up by a take-up roll 55 and discarded as appropriate. In the present embodiment, the female mold is moved, but the male mold may be moved, and the insulating film with the adhesive may be transferred onto the fixed female mold.

[0016]

As described above, according to the method of manufacturing a flat electric wiring material of the present invention, a circuit conductor component formed by punching a metal foil into a predetermined shape by using a male mold and a female mold. Holding in a female mold, and then
A step of projecting the circuit conductor component from within the female mold and attaching the circuit conductor component to an insulating film with an adhesive on one surface of the circuit conductor component, and then another insulating film with an adhesive on the other surface of the circuit conductor component A step of applying a carrier tape between the steps of the circuit conductor component, and a step of applying an adhesive to the carrier tape, and a circuit conductor component attached to the carrier tape. This eliminates the need for a step of replacing the film with an insulating film, simplifies the manufacturing process, and has an excellent effect that the manufacturing cost is reduced as compared with the related art. Further, in the method for producing a flat electric wiring material, a mold comprising a male mold and a female mold, wherein a protruding pin is inserted into the bottom of the female blade, and the female mold is replaced with a male mold The use of a mold that is relatively movable, on the other hand, has the effect of increasing mechanical strength and prolonging the life of the mold as compared with a conventional female mold.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional explanatory view of a die for punching a circuit conductor component used in one embodiment of a method for manufacturing a flat electric wiring material according to the present invention.

FIG. 2 is an explanatory cross-sectional view of the female mold of the mold in a step of bonding an insulating film to a circuit conductor component.

FIG. 3 is a process explanatory view of the above embodiment.

FIG. 4 is an explanatory view of a conventional flat cable manufacturing method.

FIG. 5 is a partial cross-sectional view of an open state of a mold used in a conventional method for manufacturing a flat electric wiring material.

FIG. 6 is a partial sectional view of the mold in a closed state.

FIG. 7 is an explanatory view of a conventional method for manufacturing a flat electric wiring material.

[Explanation of symbols]

 41 Metal Foil 42 Circuit Conductor Component 43 Male 43a, 44a Blade 44 Female 45 Protruding Plate 45a Protruding Pin 46, 51, 54 Insulating Film 46a Adhesive Layer 47 Backing Plate 48, 52 Press 49 Joining Machine 50 Laminating Roll 53 Flat cable 55 Take-up roll

Claims (2)

(57) [Claims] 1. A step of holding a circuit conductor component formed by punching a metal foil into a predetermined shape with a male mold and a female mold in a predetermined shape, and then placing the circuit conductor component in the female mold. And sticking to one side of the circuit conductor component an insulating film with an adhesive,
Affixing an insulating film with another adhesive to another surface of the circuit conductor component. 2. A mold comprising a male mold and a female mold,
2. The manufacturing method according to claim 1, wherein a protrusion pin is inserted into the bottom of the female blade, and the female is movable relative to the male. The mold used for the method.