JP2894218B2 - Method and apparatus for manufacturing flexible wiring - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a flexible wiring in which a copper foil is punched into a wiring shape by a press machine and then laminated on a film by a heating and pressing roll. The present invention relates to a method and an apparatus for manufacturing a flexible wiring in which the amount of heat stored in a copper foil is secured and the temperature of a film-side heat compression roll is lowered without excessively increasing the temperature of the copper foil-side heat compression roll.

[0002]

2. Description of the Related Art In a conventional method and apparatus for manufacturing a flexible wiring, a bonding machine that heats and presses a copper foil punched by a press onto a base film coated with a heat-sensitive adhesive is used for a pair of high-temperature bonding. A heat-pressing roller method is adopted in which the copper foil and the base film are sandwiched and overlapped by a roll kept in the above-described manner, the adhesive applied to the base film is melted, and the copper foil and the base film are bonded. A specific example will be described with reference to FIG. FIG.
FIG. 3 is a conceptual diagram of a bonding machine in a flexible wiring manufacturing apparatus for bonding a copper foil to a base film. In a flexible wiring manufacturing apparatus, a long copper foil wound in a roll shape is discharged as a product through various presses and a bonding machine via an auxiliary roll. At this time, the long copper foil sent out from the roll passes through a predetermined press machine to reach the bonding machine shown in FIG. This bonding machine uses the base film 51
Are wound, and a pair of copper foil side rolls 54 and a film side roll 55 for heating and pressing the base film 51 and the copper foil 53 to each other are provided.

[0003] A heat-sensitive adhesive is applied to a surface of the base film 51 which is in contact with the copper foil 53.
The copper foil roll 54 and the film roll 55 are maintained at 180 ° C. to melt the base film 51 and the adhesive. Therefore, the base film 51 sent out from the base film drum 52 and the copper foil 53 punched and sent by the press machine are combined with the copper foil side roll 5.
4 and the film side roll 55 is sent to the contact point, where the heat is applied by both rolls, the adhesive melts,
The copper foil 53 is adhered to the base film 51 to form one flexible wiring.

[0004]

As described above, when the heat-sensitive adhesive is applied to the base film 51 and the copper foil 53 and the base film 51 are bonded to each other, the adhesive is appropriately melted to reduce the adhesive force. In order to ensure this, it is necessary to keep the temperature of the copper foil side roll 54 and the film side roll 55, which are the thermocompression bonding rolls, at a high temperature. At such a temperature, the heat-pressing rolls are
This is because, since both are heated from the back side of the bonding surface, a temperature is required to supply the amount of heat necessary to melt the heat-sensitive adhesive applied to the base film 51. For example, this time requires a temperature of 180 ° C.

However, at such a roll temperature, the copper foil 53
Bonding the base film 51 to the base film 51 has the following problems. That is, if the temperature of the film-side roll 55 is set to a temperature of 180 ° C. in the base film 51, the heat-sensitive adhesive is sufficiently melted by the amount of heat,
The base film 51 itself thermally expands and is stretched because tension is applied when the film is fed. On the other hand, when the base film 51 cools, it contracts conversely. Further, since the copper foil 53 has almost the same coefficient of thermal expansion and no deformation due to the tension as compared with the base film 51, thermal stress is generated in the flexible wiring to which the two are bonded, as shown in FIGS. It becomes wavy or curled. Therefore, when the flexible wiring was to be attached to the product, it could not be attached properly.

In addition, such a phenomenon that the flexible wiring becomes wavy or curled can be achieved by lowering the temperature of the roll 55 on the film side.
It is mentioned as one means to prevent and eliminate elongation. However, simply lowering the temperature of the film-side roll 55 does not sufficiently melt the adhesive applied to the base film 51 due to an insufficient amount of heat supplied to the adhesive, and secures an adhesive force to the copper foil 53. become unable. Therefore,
If the temperature of the copper foil roll 54 is raised instead of lowering the temperature of the film roll 55 to secure the amount of heat supplied to the adhesive, the copper foil 53 is conversely overheated and burnt. For this reason, the surface treatment layer of the copper foil 53 that has been surface-treated with the rolled copper is discolored, and the surface contact resistance is changed and the appearance in quality is deteriorated.

Accordingly, an object of the present invention is to provide a method and apparatus for manufacturing a flexible wiring having a bonding machine capable of suppressing deformation of a base film and performing bonding with sufficient strength.

[0008]

According to the present invention, there is provided a method for manufacturing a flexible wiring, comprising: a transparent or translucent base film having an adhesive surface coated with a heat-sensitive adhesive on one side and supplied in a roll form; In a method of manufacturing a flexible wiring having a predetermined length by bonding a copper foil that is punched into a predetermined shape to form a wiring path, in heating and pressing the base film and the copper foil, preheating set to a predetermined high temperature A pre-heating step of preliminarily applying heat to the copper foil by the roll, a pair of heat-pressing rolls including a copper foil-side roll having the same temperature as the roll provided in the pre-heating step, and a base film-side roll set at a predetermined low temperature And a thermocompression bonding step of thermocompression bonding a copper foil and a base film. Further, in the method for manufacturing a flexible wiring according to the present invention, the preheating roll set at a temperature of 180 ° C. may include a preheating step of applying heat to the copper foil to be conveyed;
A production process comprising a thermocompression bonding step of thermocompression bonding a copper foil and a base film by a pair of thermocompression bonding rolls of a copper foil side roll set at a temperature of 80 ° C. and a base film side roll set at a temperature of 120 ° C. Preferably, it is a method.

Further, the apparatus for manufacturing a flexible wiring according to the present invention is characterized in that a transparent or translucent base film which has an adhesive surface coated with an adhesive on one side and is wound and supplied in a roll shape is punched into a predetermined shape. In a flexible wiring manufacturing apparatus for manufacturing a flexible wiring of a predetermined length, the bonding machine has an effect of thermal expansion deformation on the base film. A low-temperature roll set to a degree that is not high, and a high-temperature roll set to a temperature sufficient to melt the adhesive applied to the base film on the copper foil side punched and sent to the predetermined shape. And a pre-heating roll, which is a path for sending out the copper foil and has a temperature substantially the same as that of the high-temperature roll on the copper foil side provided in front of the heat compression roll. Those having a Le. Also,
In the manufacturing apparatus of the flexible wiring of the present invention, the temperature of the roll on the copper foil side constituting one of the pair of thermocompression bonding rolls is 180 ° C., and the temperature of the roll on the base film side constituting the other is 120 ° C. Preheating roll temperature is 1
Desirably, the temperature is 80 ° C.

[0010]

According to the method for manufacturing a flexible wiring having the structure of the first aspect and the apparatus for manufacturing a flexible wiring having the structure of the third aspect, the copper foil supplied in a long shape is formed into a predetermined shape by a press machine. Forming a wiring path by punching, laminating the copper foil on which the wiring path was formed with a base film coated with a heat-sensitive adhesive, and bonding the copper foil to the base film by heating with a bonding machine Create flexible wiring.

In the above-mentioned bonding machine for bonding a copper foil and a base film, the copper foil and the base film are sandwiched and pressed by a pair of heating and pressing rolls. At this time, a pair of heating and pressing rolls are held by a preheating roll maintained at a high temperature. The calorie is supplied to the copper foil sent to the heating and pressing roll in the foreground. Thereafter, a predetermined amount of heat is supplied to the base film by the low-temperature base film side roll of the pair of thermocompression bonding rolls, and the preliminarily preliminary heat is supplied by the high-temperature copper foil side roll of the pair of thermocompression bonding rolls. Heat is further supplied to the copper foil to which heat has been given by the heating roll, and sufficient heat is stored in the copper foil to melt the adhesive applied to the base film. Therefore, even if the temperature of the roll on the base film side is low and the amount of heat is small, the adhesive is sufficiently melted and firmly adhered.

According to the method for manufacturing a flexible wiring having the configuration of the second aspect and the apparatus for manufacturing a flexible wiring having the configuration of the fourth aspect, in the bonding machine constituting the manufacturing apparatus for the flexible wiring, The copper foil that is punched out and forms a wiring path is sandwiched and pressed by a pair of heating and pressing rolls.
The preliminary heating roll set at 0 ° C. supplies heat to the copper foil sent to the heating and pressing roll before the pair of heating and pressing rolls. Then, one of the pair of heat-press rolls
A predetermined amount of heat is supplied to the base film by the roll on the base film set to 20 ° C., and the pre-heating is first performed by the roll on the copper foil side set to 180 ° C. of the pair of heating and pressing rolls. Heat is further supplied to the copper foil to which heat has been given by the roll, and sufficient heat is stored in the copper foil to melt the adhesive applied to the base film. Therefore, even if the temperature of the roll on the base film side is low and the amount of heat is small, the adhesive is sufficiently melted and firmly adhered.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of a method for manufacturing a flexible wiring and an apparatus for manufacturing the same according to the present invention will be described with reference to the drawings. FIG. 1 is a conceptual diagram illustrating a manufacturing process of a flexible wiring. The copper foil 1 is supplied to the process as a rolled copper foil drum 1a. The copper foil 1 is drawn out to the transport line, and the first female die 1 in the first punching process is provided.
It is punched into the shape shown in FIG. 2 by 1a and the first male mold 11b. That is, the U-shaped punches 12 are alternately and continuously formed, and at the same time, the pilot holes 13 are punched on both sides of the copper foil 1 at predetermined intervals.

Next, the copper foil 1 is conveyed while being regulated by the punched pilot holes 13. Thereby, the copper foil 1
Can be conveyed at accurate intervals to the first punching dies 11a and 11b, and the U-shaped punches 12 can be formed at accurate intervals. Here, since the plus copper foil pattern 15 and the minus copper foil pattern 16 (see FIG. 6) are integrated by the connecting portion, the copper foil punching 12 is maintained while maintaining the mutual positional relationship. 1 can be transported. In this first punching process,
When the terminal information is given to the control device of the first punching machine (not shown), the first punching machine feeds the copper foil 1 one time without performing the punching operation. Thereby, a copper foil terminal forming portion is formed on the copper foil 1.

Next, the copper foil 1 is transported to a second punching step. The position information of the terminal forming portion formed on the copper foil 1 is as follows.
It is reported to the control device of the second punching machine. And
The second punching machine does not perform the punching operation when the information of the terminal forming section is not given, but feeds the copper foil 1 by one blank, and operates only when the information of the copper foil terminal forming section is given. . That is, the terminal forming portion is punched into the shape shown in FIG. 3 by the second male mold 22b and the second female mold 22a in the second punching step to form the copper foil terminal portion 17. Here, the side part 17a of the copper foil terminal part 17 is an end part 17b shown in FIG.
It is taken a little longer. Also at this time, the copper foil 1 is conveyed while being regulated by the punched pilot holes 13. As a result, the copper foil 1 is removed from the first punching die 11a, 1
1b can be conveyed at precise intervals.

Next, the base film 2 is supplied from the base film drum 2a. Here, a heat-sensitive adhesive is applied to a surface that comes into contact with the base film 2 and the copper foil 1. Then, the adhesive is melted by being heated by a bonding machine including a preliminary heating roll 3 and a pair of heating and pressing rolls 4 and 5 described below, and the copper foil 1 is bonded to the base film 2. This state is shown in FIG.
(A). FIG. 4B shows a cross-sectional view taken along the line BB.

Next, the third female mold 33a in the third punching step
As shown in FIG. 5A, the connection portion punching 14 is punched by the third male mold 33b. Here, as shown in FIG. 5B, the connection portion punching 14 punches out both the copper foil 1 and the base film 2 at the same time. As a result, as shown in FIG.
And the negative copper foil pattern 16 are separated. The positioning of the base film 2 and the copper foil 1 in the third punching step is performed in the lateral direction at the end of the base film 2 and the flow direction is performed by a CCD camera or the like (not shown).

Next, in a fourth punching step, the mounting hole 18 is pierced and the flexible wiring 10 is cut to a required length. That is, the fourth male mold 44b and the fourth female mold 4
4a, the final portion of the previous flexible wiring 10 is linearly cut to form the final end 20, and at the same time, the mounting hole 18 and the step portion 19 shown in FIG. 6 are formed in the base film 2 at the left end of the flexible wiring 10. I do. Next, a predetermined length of the flexible wiring 10 is fed without operating the fourth punching machine. This length is determined by counting the pilot holes 13 and positioning the length shorter than the pitch of the pilot holes 13 is controlled by a feed motor. After sending the flexible wiring 10 for a predetermined length, the fourth male mold 4
4b and the fourth female mold 44a, the flexible wiring 1
At the same time as forming the final end 20 by linearly cutting the final portion of No. 0, the mounting hole 18 and the step portion 19 shown in FIG. 6 are formed in the base film 2 at the front end of the next flexible wiring 10. Thereby, the flexible wiring 10 having a predetermined length
Is completed. The completed flexible wiring 10 is stored in the product storage pallet 31.

Next, the details of the bonding machine of the apparatus for manufacturing a flexible wiring, which is a characteristic part of the present embodiment, will be described. FIG. 7 is a conceptual diagram illustrating a configuration of the bonding machine. This bonding machine is configured between the second and third punching steps as described above, and the copper foil 1 is provided with the second male mold 22b and the second female mold 22.
First, a preliminary heating roll 3 is provided on a traveling path that has passed through a. Next, a pair of a copper foil roll 4 and a film roll 5 sandwich the base film 2 supplied from the base film drum 2a and the copper foil 1 having passed through the preheating roll 3 so as to sandwich the two pieces vertically. Is provided. The preheating roll 3 and the copper foil roll 4 on the copper foil 1 side are maintained at a high temperature of 180 ° C., while the film roll 5 on the base film 2 side is maintained at a low temperature of 120 ° C. .

In this embodiment, the preheating roll 3
The temperature of the copper foil-side roll 4 was set to 180 ° C. because the adhesive applied to the base film 2 is a temperature necessary for obtaining a sufficient adhesive strength. That is, the adhesive applied to the base film acts as shown in FIG. Specifically, first, as shown in FIG. 8A, a heat-sensitive adhesive (a nitrile rubber-based adhesive is used in this embodiment) on a base film (a polyester film is used in this embodiment) 2. 6) is applied with a thickness of about 15 to 20 μm. Then, as shown in FIG. 8B, heat is applied to melt the adhesive 6 on the base film 2. Further, when the copper foil 1 is pressed against the surface on which the adhesive 6 is applied, the adhesive 6 sandwiched between the copper foil 1 and the copper foil 1 and the base film 2
Are firmly bonded.

FIG. 9 shows the temperature characteristics of the relationship between the temperature transmitted to the adhesive 6 and the adhesive strength at that time. FIG. 9 is a graph in which the vertical axis indicates the adhesiveness, ie, the adhesive strength, and the horizontal axis indicates the temperature transmitted to the adhesive 6. The adhesiveness on the vertical axis indicates the state where the entire adhesive surface exhibits an anchor effect by an index of 1.
00. Then, according to this graph, the tackiness sharply rises when the temperature transmitted to the adhesive 6 exceeds 100 ° C., and when the temperature exceeds about 180 ° C., the tackiness increases by an index of 10
It turns out that it is stabilized at 0. Accordingly, as described above, in the present embodiment, about 18
Heat is supplied at a temperature of 0 ° C. For this reason, the temperature of the copper foil side roll 4 is set to 180 (± 8) ° C., and the copper foil 1 alone cannot provide the adhesive with a sufficient amount of heat to be applied to the adhesive at the time of thermocompression bonding. 3 was maintained at 180 (± 8) ° C. so that the copper foil 1 could store heat in advance. On the other hand, at a temperature exceeding 180 ° C., it is possible to sufficiently adhere,
Since the copper foil 1 would be burned at a temperature greatly exceeding 180 ° C., the temperature was set to 180 (± 8) ° C. for each roll.

Therefore, the second male mold 22b and the second female mold 2
The copper foil 1 that has passed through 2a is first supplied with heat by a preheating roll 3 maintained at a temperature of 180 ° C., and then the copper foil roll 4 maintained at a temperature of 180 ° C. Conveyed. On the other hand, the base film 2 sent out from the base film drum 2a is transported to the film-side roll 5 maintained at a temperature of 120 ° C. Therefore, the copper foil 1 and the base film 2 sandwiched between the pair of heating and pressing rolls 4 and 5 are bonded to the adhesive 6 applied to the base film 2.
[FIG. 8 (a)] is pressed by the heat-pressing rolls 4, 5 by the heat received by the copper foil 1 further by the copper-foil-side roll 4 and the heat received by the film-side roll 5 via the base film 2. Is melted when
(B)], pressure is applied by the heating and pressing rolls 4 and 5, and the two are adhered by the anchor effect [FIG.
(C)].

According to the method and the apparatus for manufacturing a flexible wiring having the bonding machine having such a configuration, the temperature of the film-side roll 5 is reduced to 120 ° C. Thermal expansion did not occur, and generation of a product that was wavy or curled could be prevented. Also,
As described above, the temperature of the film-side roll 5 is set to 120 ° C.
Despite the low temperature, the calorie is previously given to the copper foil 1 by the preheating roll 3 set at 180 ° C., so that the calorie is again reduced by the copper foil side roll 4 set at a temperature of 180 ° C. By giving, the copper foil 1 can have a sufficient amount of heat to melt the adhesive 6 applied to the base film 2 without burning the copper foil 1 with an excessive amount of heat. Therefore, the copper foil 1 and the base film 2 are not expanded without thermally expanding the base film 2.
Can be firmly bonded.

It should be noted that the present invention is not limited to the above embodiment, and various changes can be made without departing from the spirit of the present invention. For example, in the above embodiment, the temperature of the heat-sensitive pressure-sensitive adhesive roll on the base film side was set to 120 ° C.
This can be changed to an appropriate temperature depending on the material used for the base film and the tension applied to the base film.

[0025]

According to the method and the apparatus for manufacturing a flexible wiring of the present invention, in a bonding machine, a heat quantity is previously given to a copper foil by a preheating roll, and then the temperature is set to a low temperature of the pair of heating and pressure bonding rolls. A small amount of heat is supplied to the base film by the base film side roll, and further heat is applied to the copper foil by the copper foil side roll set at the same temperature as the preheating roll, so that the deformation of the base film is suppressed and the strength is sufficient. It has become possible to provide a manufacturing method and a manufacturing apparatus for a flexible wiring having a bonding machine capable of performing the bonding.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram showing an apparatus for manufacturing a flexible wiring according to an embodiment of the present invention.

FIG. 2 is a plan view showing a copper foil punched in a first punching step.

FIG. 3 is a plan view showing a copper foil punched in a second punching step.

FIG. 4 is a view showing a flexible wiring bonded in a bonding process.

FIG. 5 is a view showing a flexible wiring punched in a third punching step.

FIG. 6 is a plan view showing a configuration of a flexible wiring.

FIG. 7 is a conceptual diagram illustrating a bonding machine according to a flexible wiring manufacturing apparatus.

FIG. 8 is a conceptual diagram showing a bonding state of a heat-sensitive adhesive applied to a base film.

FIG. 9 is a diagram showing temperature characteristics of a heat-sensitive adhesive applied to a base film.

FIG. 10 is a conceptual diagram showing a bonding machine according to a conventional flexible wiring manufacturing apparatus.

FIG. 11 is a perspective view showing a flexible wiring wavy due to thermal stress.

FIG. 12 is a perspective view showing a flexible wiring in which a curl is formed at an end portion by thermal stress.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Copper foil 2 Base film 3 Preheating roll 4 Heat press roll 5 Heat press roll

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-2-158335 (JP, A) JP-A-4-367293 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H05K 3/20 H05K 3/04

Claims (4)

(57) [Claims] 1. A transparent or translucent base film having an adhesive surface coated with a heat-sensitive adhesive on one side and supplied in a roll shape, and a copper foil punched into a predetermined shape to form a wiring path. A flexible wiring manufacturing method for manufacturing a flexible wiring of a predetermined length, wherein a preheating step of applying a heat amount to the copper foil in advance by a preheating roll set at a predetermined high temperature, and a preheating step are provided. A copper foil side roll at the same temperature as the roll, and a thermocompression bonding step of thermocompression bonding the copper foil and the base film by a pair of thermocompression rolls with a base film side roll set at a predetermined low temperature. Flexible wiring manufacturing method. 2. The method of manufacturing a flexible wiring according to claim 1, wherein a preheating roll set at a temperature of 180 ° C. applies a heat amount to the copper foil to be conveyed; A heat-pressing step of heat-pressing the copper foil and the base film with a pair of heat-pressing rolls of a set copper foil-side roll and a base film-side roll set at a temperature of 120 ° C. Wiring manufacturing method. 3. A transparent or translucent base film having an adhesive surface coated with a heat-sensitive adhesive on one side and supplied in a roll shape, and a copper foil punched into a predetermined shape to form a wiring path. In a flexible wiring manufacturing apparatus for manufacturing a flexible wiring of a predetermined length, a low-temperature roll set to such an extent that the base film is not affected by thermal expansion deformation. A pair of heat-pressing rolls comprising a high-temperature roll set at a temperature sufficient to melt the adhesive applied to the base film on the copper foil side which is punched and sent to the predetermined shape, A flexi-feed path for sending out the copper foil, comprising a pre-heating roll having a temperature substantially equal to a high-temperature roll on the copper foil side provided in front of the heating and pressing roll. Bull wiring manufacturing equipment. 4. The apparatus for manufacturing a flexible wiring according to claim 3, wherein the temperature of the roll on the copper foil side constituting one of the pair of heat-pressing rolls is 180 ° C., and the temperature of the roll on the base film side constituting the other of the pair. An apparatus for manufacturing a flexible wiring, wherein the temperature is 120 ° C., and the temperature of the preheating roll is 180 ° C.