JPH0923063A - Manufacture of multilayered wiring circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily prepare many wiring circuit boards, eliminate deviation between wiring boards, and improve connection position precision, by preparing wiring circuit boards provided with frames, and stacking and bonding a plurality of wiring circuit boards obtained by cutting off the frames. SOLUTION: A wiring circuit boad provided with a frame wherein a wiring circuit board part 1A in which wiring circuit 1b is formed is reinforced by a frame 1f is cut off from the frame. In the stage that the wiring circuit board 1B is cut off from the frame, guide holes 1g are formed in the wiring circuit board 1B. Guide pins 2 are inserted into the guide holes 1g. Between an upper jig plate 3a and a lower jig plate 3b wherein guide holes are formed at the same plane positions as the guide holes 1g, the wiring circuit boards are loaded, and heated and pressed. An adhesive material 1a part of the wiring circuit board is fused and then hardened. Hence a connection part 1c and the wiring circuit 1b part are connected together, and electric continuity is obtained, so that a plurality of the wiring circuit boards 1B are unified in a body and a multilayered wiring circuit board 1C is obtained.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a workstation,
The present invention relates to a method for manufacturing a multilayer printed circuit board used in electronic devices such as personal computers.

[0002]

2. Description of the Related Art As a conventional technique relating to a multilayer printed circuit board used in electronic equipment and a method for manufacturing the same, Japanese Patent Application Laid-Open No. Hei.
No. 282832 (Prior Art 1), Japanese Patent Laid-Open No. 1-24
5594 (Prior Art 2), JP-A-61-1795.
97 (Prior Art 3), JP-A-58-147359.
Japanese Patent Laid-Open Publication No. 61-277428 (Prior Art 4) and Japanese Patent Laid-Open No. 61-277428 (Prior Art 5) are known. That is, the conventional technique 1
Has a ceramic insulating layer, and at least a part of the outer surface of the laminate having a conductor layer formed on at least one of the surface and the inside is heated and fired while applying a pressing force to obtain a multilayer ceramic sintered body. The method for producing a multilayer ceramic sintered body for producing a. In the prior art 2, a power distribution pattern is formed on a conductive sheet on one surface of a core having conductive sheets on both sides of an insulating layer having a dielectric constant of less than 3, and an adhesive layer is sandwiched between them. Forming a sub-assembly by stacking the two cores facing each other with the power distribution pattern facing each other and forming a signal circuit pattern on a conductive sheet on both outer surfaces of the sub-assembly; By forming a via between the signal circuit patterns on both outer surfaces,
A method for manufacturing a printed circuit board assembly is described, which comprises stacking a plurality of assemblies to form a printed circuit board assembly. Prior art 3
And a step of forming a plurality of first conductive layers as lower wirings on the underlying layer, and forming a second conductive layer as a contact post at a predetermined plurality of locations on the first conductive layer with being separated from each other. A step of depositing an epoxy resin on the exposed surface of each of the underlying layer, the first conductive layer and the second conductive layer; and curing the epoxy resin while pressing the surface of the epoxy resin. A multi-layer including a step of exposing the surface of the second conductive layer and a step of forming a plurality of third conductive layers on the surface of the epoxy resin as upper wirings that selectively bond with the exposed surface of the second conductive layer. A wiring forming method is described. Further, Prior Art 4 describes an adhesive pressing technique which is suitable for manufacturing a multilayer printed wiring board obtained by forming a copper clad laminate into multiple layers. Prior art 5 describes a technique of vacuum heating and press-molding a laminated plate in an autoclave.

[0003]

In any of the above-mentioned conventional techniques, a large number of wiring circuit boards are easily prepared, the positional deviation between the wiring circuit boards is eliminated, and the connection position accuracy is improved. There has been a problem that manufacturing of a printed circuit board at low cost has not been sufficiently considered.

SUMMARY OF THE INVENTION An object of the present invention is to provide a multilayer wiring circuit board which is capable of manufacturing a multilayer wiring circuit board having a high reliability by significantly reducing the manufacturing cost in order to solve the above-mentioned problems of the prior art. It is to provide a manufacturing method. Another object of the present invention is to easily prepare a large number of wiring circuit boards, eliminate misalignment between the wiring circuit boards, improve the accuracy of connection positions, and manufacture a highly reliable multilayer wiring circuit board at low cost. It is an object of the present invention to provide a method for manufacturing a multilayer printed circuit board that can be manufactured. Another object of the present invention is to improve the accuracy of connection positions by continuously separating the printed circuit boards from the frame and transferring them to the pressure-bonding lower mold with respect to a large number of the printed circuit boards, and eliminating the displacement between the printed circuit boards. It is an object of the present invention to provide a method for manufacturing a multilayer wired circuit board, which can be carried out in a low cost and which can be manufactured at low cost.

[0005]

In order to achieve the above object, the present invention comprises a printed circuit board in which a wiring circuit is formed on an insulating base material for electrically connecting the printed circuit boards to each other. Wiring circuit board part that is configured to reinforce the wiring circuit board part with a frame, and the wiring is performed by cutting the frame wiring circuit board prepared in this preparation step so that the frame is cut off. A cutting step for obtaining a circuit board; and an adhering step for manufacturing a multilayer wiring circuit board by stacking a plurality of wiring circuit boards obtained in the cutting step and collectively adhering them using an adhesive material. Is a method of manufacturing a multilayer printed circuit board. The present invention also has a frame configured to reinforce a wiring circuit board portion constituted by a wiring circuit board in which a wiring circuit is formed on an insulating base material for electrically connecting the wiring circuit boards to each other with a frame. A preparatory step of continuously preparing a plurality of wiring circuit boards in a sheet shape or a film shape, and cutting to obtain a wiring circuit board by cutting the frame to the wiring circuit board prepared in this preparation step. And a bonding step of manufacturing a multilayer wiring circuit board by stacking a plurality of wiring circuit boards obtained in the cutting step and bonding them together using an adhesive material. Is a manufacturing method.

Further, the present invention relates to an adhesive material for spatially adhering wiring circuit boards to each other and a wiring circuit board formed with an insulating base material for electrically connecting the wiring circuit boards to each other. A preparatory step of preparing a wired circuit board with a frame configured to reinforce the configured wired circuit board portion with a frame, and cutting so that the frame is separated from the wired circuit board with a frame prepared in this preparatory step. Multi-layer wiring characterized by including a cutting step for obtaining a wiring circuit board by the above and a bonding step for manufacturing a multi-layer wiring circuit board by stacking a plurality of wiring circuit boards obtained by this cutting step and bonding them at once. It is a method of manufacturing a circuit board. Further, the present invention is composed of an adhesive material for spatially adhering the wiring circuit boards to each other and a wiring circuit board formed with an insulating base material to electrically connect the wiring circuit boards to each other. For the preparatory step of continuously preparing a plurality of sheet-shaped or film-shaped wiring circuit boards with a frame configured to reinforce the wiring circuit board portion with respect to the framed wiring circuit board prepared in this preparation step A cutting process to obtain a printed circuit board by cutting so as to separate the frame, and an adhering process for manufacturing a multilayer printed circuit board by stacking a plurality of the printed circuit boards obtained in the cutting process and collectively bonding them. A method of manufacturing a multi-layer printed circuit board having the above.

Further, the present invention is characterized in that, in the method for manufacturing a multilayer wiring circuit board, a plurality of sheets are stacked in the bonding step with reference to a guide hole formed in each wiring circuit board. Further, the present invention is characterized in that, in the method for manufacturing a multilayer wiring circuit board, the adhesive material in the wiring circuit board portion is prepared as an adhesive material layer in the preparing step. The present invention also has a frame configured to reinforce a wiring circuit board portion constituted by a wiring circuit board in which a wiring circuit is formed on an insulating base material for electrically connecting the wiring circuit boards to each other with a frame. A preparatory step of preparing a wired circuit board, a cutting step of cutting the framed wired circuit board prepared in the preparatory step so as to obtain a wired circuit board, and a wiring obtained in the cutting step. And a bonding step of manufacturing a multilayer wiring circuit board by stacking a plurality of circuit boards and bonding them together by thermocompression bonding. The present invention also has a frame configured to reinforce a wiring circuit board portion constituted by a wiring circuit board in which a wiring circuit is formed on an insulating base material for electrically connecting the wiring circuit boards to each other with a frame. A preparatory step of continuously preparing a plurality of wiring circuit boards in a sheet shape or a film shape, and cutting to obtain a wiring circuit board by cutting the frame to the wiring circuit board prepared in this preparation step. And a bonding step of manufacturing a multilayer wiring circuit board by stacking a plurality of wiring circuit boards obtained in the cutting step and bonding them all at once by thermocompression bonding using an adhesive material. It is a manufacturing method of a wired circuit board.

Further, according to the present invention, a wiring circuit board portion formed of a wiring circuit board in which a wiring circuit is formed on an insulating base material for electrically connecting the wiring circuit boards is reinforced by a frame. The preparatory step of preparing the wired circuit board with a frame and the wired circuit board with a frame prepared in this preparatory step are sequentially cut using a cutting die to separate the frame, and the wired circuit board is held by suction on the die. And a cutting step obtained by the above, and a plurality of wiring circuit boards sequentially adsorbed and held by the die in this cutting step are transferred onto a die for crimping to stack a plurality of sheets,
And a bonding step for manufacturing a multilayer wiring circuit board by collectively heat-pressing and bonding using the crimping mold to manufacture a multilayer wiring circuit board. The present invention also has a frame configured to reinforce a wiring circuit board portion constituted by a wiring circuit board in which a wiring circuit is formed on an insulating base material for electrically connecting the wiring circuit boards to each other with a frame. A preparatory step of continuously preparing a plurality of wiring circuit boards in a sheet shape or a film shape, and sequentially cutting the wiring circuit board with a frame prepared in this preparation step using a cutting die to cut the frame. A cutting step of sucking and holding the wiring circuit board in the mold, and a plurality of wiring circuit boards that are sequentially sucked and held by the mold in this cutting step are transferred to a mold for crimping to stack a plurality of them, and the mold for crimping And a bonding step of manufacturing the multilayer wiring circuit board by collectively heat-pressing and bonding with each other to manufacture a multilayer wiring circuit board.

Further, according to the present invention, a wiring circuit board portion constituted by a wiring circuit board in which a wiring circuit is formed on an insulating base material for electrically connecting the wiring circuit boards to each other is reinforced by a frame. The preparatory step of preparing the framed wired circuit board and the framed wired circuit board prepared in the preparatory step are sequentially cut using a cutting die to separate the frame and guide holes are drilled for wiring. A cutting process in which the circuit board is adsorbed and held in the mold, and a plurality of wiring circuit boards that are adsorbed and held in the mold in this cutting process are transferred onto the mold for crimping with the guide hole as a reference, and a plurality of sheets are stacked. And a bonding step of manufacturing the multilayer wiring circuit board by collectively heat-pressing and bonding using the crimping mold to manufacture the multilayer wiring circuit board. The present invention also has a frame configured to reinforce a wiring circuit board portion constituted by a wiring circuit board in which a wiring circuit is formed on an insulating base material for electrically connecting the wiring circuit boards to each other with a frame. A preparatory step of continuously preparing a plurality of wiring circuit boards in a sheet shape, and sequentially cutting the wiring circuit board with a frame prepared in this preparation step using a cutting die to cut the frame and forming guide holes. A cutting step in which the wiring circuit board is punched and held by suction on the mold, and the wiring circuit board sequentially sucked and held by the mold in this cutting step is transferred onto the crimping mold with the guide hole as a reference. And a bonding step of manufacturing a multilayer wiring circuit board by stacking a plurality of sheets and collectively performing thermocompression bonding and bonding using the crimping mold to thereby manufacture a multilayer wiring circuit board. .

According to the present invention, in the method for manufacturing a multilayer wiring circuit board, in the preparing step, the wiring circuit board portion is prepared with an adhesive material layer for bonding the wiring circuit boards to each other. To do. Further, the present invention provides a wiring circuit board portion including an adhesive material for spatially adhering the wiring circuit board members and a wiring circuit for electrically connecting the wiring circuit board members, and a frame for reinforcing the circuit board portion. After cutting the parts other than the frame in the wired circuit board with a frame made up of, the multiple printed circuit boards with the guide holes for spatial positioning between the printed circuit boards are stacked and bonded together. Is a method of manufacturing a multilayer printed circuit board. Further, the present invention is to laminate a sheet in which a plurality of framed wired circuit boards are continuously cut after cutting a portion other than the frame in a roll state, and when the wired circuit boards are stacked, guide holes are provided. It is characterized in that a part of the frame of the wired circuit board with the frame before cutting the reference is used. Further, according to the present invention, the thermal expansion of the mold having the guide pin inserted into the guide hole for performing the spatial positioning between the wiring circuit boards at the time of bonding is larger than the thermal expansion of any of the plurality of wiring circuit boards. In addition, in order to spatially bond the printed circuit boards or to electrically connect the printed circuit boards to each other, the multilayer printed circuit board is manufactured by applying pressure after heating. Further, the present invention, in the step of stacking a plurality of wiring circuit boards and collectively adhering them, from the central portion to the outer peripheral portion of the wiring circuit boards by a pressure head, radially expanding the crimping surface to perform crimping, or It is characterized by sequentially crimping from one end surface. Further, in the present invention, as the pressure head structure, a surface contacting the wiring circuit board has a rectangular pressing surface, and the contact state of the surface with the wiring circuit board surface is the pressure of the liquid sealed in the pressure head. And a load for pressing the pressure head can be adjusted.

[0011]

With the above structure, a large number of wiring circuit boards can be easily prepared and supplied, and furthermore, the bonding and the connection of the wiring circuits can be performed at the same time, so that the manufacturing cost is greatly reduced and the reliability is high. It is possible to manufacture a multilayer printed circuit board having properties. Further, with the above configuration, it is composed of an adhesive material for spatially adhering the wiring circuit boards to each other and a wiring circuit board formed with an insulating base material to electrically connect the wiring circuit boards to each other. A wiring circuit board with a frame composed of a wiring circuit board portion and a frame that reinforces the wiring circuit board portion is used, and after cutting a portion other than this frame, spatial positioning between the wiring circuit board is performed. Since multiple wiring circuit boards with guide holes are stacked and bonded together to manufacture a multilayer wiring circuit board, the spatial positioning of the wiring circuit boards and the electrical connection should be performed at the same time with a small misalignment. Therefore, it is possible to manufacture a multilayer wiring circuit board having a high reliability with a significantly reduced manufacturing cost. Further, with the above-described configuration, a plurality of wiring circuit boards with a frame are formed into a continuous sheet, which is preliminarily supplied in a roll state, and the portions other than the frame are cut and then laminated, so that the wiring circuit boards are bonded together. The process before entering the process can be simplified, the manufacturing cost can be significantly reduced, and the multilayer wiring circuit board having high reliability can be manufactured.

Further, according to the above structure, since a part of the cut wiring circuit board is used as a guide hole for forming the guide holes when the wiring circuit boards are stacked, a guide that copes with variations in board dimension change before and after cutting. The holes can be formed, and the deviation between the printed circuit boards at the time of stacking can be reduced. With the above configuration, the thermal expansion of the mold, which is provided with the guide pins to be inserted into the guide holes for spatially positioning between the wiring circuit boards at the time of bonding, is larger than that of any one of the wiring boards. Since it is also made large, the guide pins automatically apply tensile force to each wiring circuit board, and the spatial adhesion between the wiring circuit boards and the bonding process for electrically connecting the wiring circuit boards It is possible to reduce the deviation between the substrates that occurs in step 2. Further, according to the above configuration, in the step of stacking a plurality of wiring circuit boards and collectively adhering the wiring circuit boards, the pressure head sequentially presses the wiring circuit boards from the central portion, so that bubbles generated during the bonding can be efficiently transferred to the outside of the boards. It is possible to manufacture a multilayer wiring circuit board that can be discharged and has high reliability without residual bubbles.

[0013]

Embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows an outline of a method for manufacturing a multilayer printed circuit board according to the present invention. FIG. 1A shows a cross section of the printed circuit board before being multilayered. The wired circuit board 1B includes an adhesive material layer 1a for spatially bonding the wired circuit boards, a wired circuit 1b for electrically connecting the wired circuit boards 1B, and a connection portion 1c. In addition, a through hole is formed in the electrically insulating material (insulating material portion) 1d of the wired circuit board 1B to electrically connect the front and back of the wired circuit board, and the conductor 1e is formed.
Is buried. That is, a double-sided copper-clad sheet is coated with a resist on the front surface side, exposed and developed to pattern the resist so that through holes can be formed, the copper film on the surface is etched and removed, and then the resist is peeled off. After that, for example, laser light is irradiated to form through holes by laser processing. Next, a resist is applied to the surface of the above-mentioned sheet, exposed and developed to form a resist film so that a plating film does not grow on the surface of the copper film other than the through hole, and the through hole 1d is made of copper or a copper alloy by via plating. The conductor 1e is embedded. Then, after removing the resist film, a resist is applied to the copper film on the surface to form the wiring circuit 1b, a wiring circuit pattern of the resist is formed by exposure and development, and a copper film is etched on the surface to remove the copper film from the copper film. The wiring circuit 1b is formed. On the back surface, a resist is applied to form the connection portion 1c, a resist connection portion pattern is formed by exposure and development, and a copper film is etched on the back surface to form the connection portion 1c made of a copper film. The surface of the wiring circuit 1b and the surface of the connection portion 1c may be formed with an adhesion layer such as chromium or titanium so that they can be adhered to each other when laminated. Further, a bonding metal film such as a nickel alloy and an anti-oxidation film such as gold may be formed by electroless plating so that the surface of the wiring circuit 1b and the surface of the connecting portion 1c can be closely bonded when laminated. For example, regarding the surface, the wiring circuit 1b made of copper or a copper alloy may be further formed on the surface of the copper film pattern by plating.

The adhesive material layer 1a is formed on the printed circuit board 1B.
It serves to bond the two to each other and to tightly bond the wiring portion 1c and the wiring circuit 1b. The adhesive material layer 1a may be prepared and supplied separately from the printed circuit board 1B. Further, the adhesive material layer 1a may be formed on the printed circuit board 1B as shown in FIG. That is, when the number of layers is increased, the connection portion 1c and the wiring circuit 1b are connected by pressure and temperature, and electrical conduction is obtained.

FIG. 1B is a view of the wired circuit board with a frame as viewed from above. The wired circuit board with a frame is shown in FIG.
Wiring circuit board portion 1 provided with wiring circuit 1b shown in
A and a frame 1f that reinforces the printed circuit board portion 1A. The frame 1f was made of an iron-nickel-cobalt alloy, which is a material having a small linear expansion coefficient used for a lead frame of a semiconductor connecting portion. One of the purposes of using the frame 1f is that the wiring circuit portion is very thin in order to obtain a high-density wiring, and thus it is easy to feel pain when the steps of forming a wiring circuit or during movement between steps are performed. Therefore, the frame 1f is for protecting it. FIG. 1C is a diagram showing the printed circuit board 1B in a state where the wiring portion is taken out from the framed printed circuit board of FIG. 1B. A guide hole 1g for spatially positioning the printed circuit boards 1B is provided in the peripheral portion of the printed circuit board 1B. The method for taking out the printed circuit board 1B and the method for forming the guide hole 1g will be described in detail later. FIG. 1D is a view showing a cross section when a plurality of the printed circuit boards 1B are stacked and laminated. The spatial positions of the printed circuit boards 1B are the same as each other by inserting the guide pins 2 into the guide holes 1g of the printed circuit board 1B, and further, the upper jig plate 3a having the guide holes formed in the same plane position as the guides 1g It is loaded between the ingredient plates 3b. FIG.
By heating and pressing from the top and bottom in the state of (d), the adhesive material 1a portion of the printed circuit board is melted and cured, and the connecting portion 1c
And the wiring circuit 1b are connected to each other so that electrical conduction is possible, the plurality of wiring circuit boards 1B are integrated, and then the upper jig plate 3a, the lower jig plate 3b and the guide pins 2 are formed.
If is removed, the multilayer printed circuit board 1C is obtained.

Multilayer printed circuit board 1 thus obtained
C does not need to form a through hole for electrical connection between the electric circuit layers of the wiring circuit board thereafter, and can supply a plurality of wiring circuit boards efficiently as described in the next embodiment. Also, there is a feature that the deviation between the printed circuit boards can be made very small. FIG. 2 is a diagram showing an embodiment for supplying the printed circuit board 1B. In order to efficiently supply a plurality of wiring circuit boards 1B, the sheet-shaped wiring circuit board 3 with a frame has the electrical connecting portions 1b and 1c and the electrically insulating material (insulating material portion) 1d described in FIG. The purpose is to reinforce the portion 1A and the portion 3A of the printed circuit board 1B provided with the adhesive material layer 1a for holding the spatial position of the above, and to suppress the dimensional change that occurs when forming the printed circuit. It is composed of a frame 3a and a positioning hole 3b. The positioning holes 3b prevent deformation of the frame 3a itself when forming a plurality of wiring circuits, and the wiring circuit board 1
Reference and wiring circuit board 1B for mechanism for sending B
Is a reference when forming the. The framed sheet-shaped wired circuit board 3 configured as described above is long in a strip shape because it includes a plurality of wired circuit boards. For this reason, if the sheet-shaped wiring circuit board 3A with a roll-shaped frame is formed as shown in FIG. 3, the wiring circuit forming step of the wiring circuit board portion, the adhesive material applying step, and the connecting portion forming step are continuously performed. Because it can be done, manufacturing can be done with high efficiency. At the same time, storage and transportation between processes can be performed efficiently. Therefore, the manufacturing cost for forming a plurality of printed circuit boards can be reduced.

Next, a method for accurately laminating and integrating the printed circuit boards 1B of the embodiments shown in FIGS. 1 and 2 will be described with reference to the following embodiments. FIG. 4 is a schematic diagram of a process of taking out the sheet-shaped wired circuit board 3A with a frame shown in FIGS. 2 and 3 from the frame 3a and stacking the wired circuit boards 1B. The spatial position of the framed sheet-shaped wired circuit board 3A is determined by the holding device 4. The holding device 4 fixes the roll-shaped portion of the framed sheet-shaped wired circuit board 3A to prevent positioning in the plane and sagging of the framed sheet-shaped wired circuit board 3A. In order to prevent this slack, the positioning hole 3b described in FIG. 2 is used. After spatially positioning the sheet-like wired circuit board with a frame in this manner, the frame 3a portion and the wired circuit board 1B are separated using the upper frame cutting die 5 and the lower frame cutting die 6. The printed circuit board 1B separated from the frame 3a is held by the frame-cutting upper die 5 and held on the laminated stage 7
Move up and stack the printed circuit boards 1B.

FIG. 5 is a detailed cross-sectional view of the framed portion explained in FIG. The frame cutting upper die 5 is a sheet punching punch 5.
a, a sheet holding frame 5b and a guide hole punch 5c, and a sheet holding vacuum suction hole 5d is provided in the sheet punch 5a. The lower frame cutting die 6 is composed of a sheet punching die 6a and a sheet holding block 6b. The sheet punching die 6a is provided with a sheet guide mechanism 6c, and the sheet holding block 6b is provided with a guide hole punching die hole 6d. ing. First, the sheet-shaped wired circuit board 3A with a frame is spatially fixed by a guide mechanism 6c provided on the sheet-cutting die 6a of the lower frame-cutting die 6. After that, when the frame portion 3a is removed from the framed sheet-shaped wired circuit board 3A, the sheet pressing frame 5b presses the wired circuit board so as not to deform the surface of the wired circuit board. After that, the sheet punching punch 5a is brought into contact with the sheet surface in order to pull out the frame 3a. In order to prevent in-plane deformation during sheet removal, the sheet holding vacuum suction holes 5d are placed in a vacuum state to fix the wiring circuit board portion 1A, and to prevent further deformation, the sheet holding block 6b and the wiring circuit board With the surfaces contacting each other, that is, with the printed circuit board portion 1A sandwiched between the sheet punching punch 5a and the sheet holding block 6b, the sheet punching die 6a
Move down. When the printed circuit board 1B is separated from the frame, the guide hole punching punch 5c is lowered to form the guide hole in the printed circuit board 1B. After that, the guide hole punching punch 5c is retracted, and the frame cutting upper die 5 is attached to the printed circuit board 1.
Raise while holding B. In the above state, the frame cutting die 5 moves to the upper part of the laminated stage 7 shown in FIG.
A lower crimping die 8 is installed on the stacking stage 7, and the crimping lower die 8 is constituted by a guide pin 8a having the same position and size as the guide hole 1g for positioning the printed circuit boards 1B. .

Next, a method of stacking the printed circuit boards will be described with reference to FIG. By inserting the guide hole portion of the frame removing upper die 5 into the guide pin 8a portion of the crimping lower die 8, the wiring circuit boards are automatically laminated. In this state, the vacuum suction of the sheet-holding vacuum suction hole 5d is stopped, and the upper die 5 for removing the frame
, The wiring circuit board is placed in the state shown in FIG.
It will be in a state of overlapping. After a series of these operations are repeated a plurality of times to stack the wired circuit boards 1B, the crimping upper mold 9 is mounted on the stacked wired circuit boards as shown in FIG. The upper die 9 for crimping is provided with a guide hole 9a so that the guide pin 8a of the lower die 8 for crimping can be inserted. In the state shown in FIG. 8, the wiring circuit board 1B is inserted into a hot press (not shown) and heated and pressed to simultaneously perform spatial bonding and electrical connection between the printed circuit boards 1B. The material of the upper and lower molds for crimping and the crimping method at this time will be described in detail below. First, due to the heating at the time of crimping, the in-plane thermal expansion of the laminated printed circuit board 1B is caused by the upper and lower molds 8, 9
If it is larger than the thermal expansion of, the in-plane dimension of the printed circuit board 1B tends to be unstable. In order to avoid this, it is necessary to select a material for the crimping dies 8 and 9 that is larger than the thermal expansion of the printed circuit board 1B. In this embodiment, a copper material is used as the material of the molds 8 and 9 for pressure bonding. Further, in the crimping method, if pressure for crimping to the printed circuit board 1B is applied before heating, the deviation of stacking at room temperature is restricted by the frictional force between the printed circuit boards, so the stacking accuracy limit is small. The deviation due to the lamination of the printed circuit board 1B at room temperature depends on the mechanical accuracy of the guide pin 8a and the guide hole, but is about ± 0.05 mm. In order to reduce this deviation, only heating is performed without applying a pressing force, and a tensile force is applied to the wiring circuit board due to a difference in thermal expansion between the upper and lower molds 8 and 9 and the wiring circuit board 1B. The gap between the guide pin 8a and the guide hole can be reduced. If a pressure is applied in this state to connect the electrical joint portions 1b and 1c and to bond the electrical insulating material (insulating material portion) 1d, it is possible to manufacture an integrated multi-layer circuit wiring board with a very small interlayer displacement. it can.

Next, an embodiment of the crimping method will be described with reference to FIGS. 9 and 10. In the method for manufacturing a multilayer printed circuit board according to the present invention, it is necessary to connect the wiring circuit connecting portions 1b and 1c at the same time. Therefore, the wiring circuit connecting portion 1
Since the load for causing the deformation necessary for the connection of b and 1c is large, the pressure is not transmitted to the melted adhesive material 1a during the adhesion and the adhesive material 1a does not flow,
Voids may remain between the printed circuit boards after the multilayer structure. In order to prevent the voids from remaining, the pressure head mechanism 10 shown in FIG. 9 applies pressure radially to the surface of the printed circuit board. The printed circuit board laminated on the lower jig plate 8 and the pressure head mechanism 10 are installed in a box (not shown) set to a temperature required for bonding. While a normal hot press can only apply a pressure of about 200 kg / cm ² to the entire surface of the printed circuit board, the pressure head 1 of this embodiment
Immediately below 0, a pressure of about 10 times the above value can be obtained. Therefore, if the surface of the printed circuit board is moved radially while being pressurized, the voids remaining between the boards can be reduced. On the other hand, when the multilayer printed circuit board is molded while being pressed with a constant pressure, a plate thickness distribution is generated in the plane of the multilayer circuit board. That is, since the central portion of the substrate surface is farther from the molten resin outflow portion (substrate end surface), the molten resin material is less likely to flow, and the plate thickness increases. On the other hand, in the outer peripheral portion (near the substrate end surface) within the surface of the printed circuit board, the flow of the molten adhesive material is large because the adhesive material outflow surface of the substrate end surface is close, and the plate thickness is thin.
Therefore, in order to make the plate thickness distribution uniform within the substrate surface, it is necessary to reduce the pressing force of the pressure head at the outer peripheral portion within the substrate surface. FIG. 10 is a sectional view showing details of the pressure head mechanism capable of controlling the pressure. The pressurizing portion of the pressurizing head mechanism is covered with a metal plate 11 whose surface shape can be deformed into a convex shape, and the amount of unevenness of the metal plate 11 can be adjusted by the hydraulic pressure of the pressure adjusting oil 12. The pressure is set high when the pressure head is in contact with the central part of the substrate, and is small when it moves to the peripheral part, thereby producing a multilayer wiring circuit board without leaving a gap between the boards after pressure bonding. it can. Therefore, a highly reliable multilayer printed circuit board can be manufactured.

[0021]

According to the present invention, a large number of printed circuit boards can be easily prepared and supplied, and furthermore, the bonding and the connection of the printed circuit boards can be simultaneously performed, and the manufacturing cost is greatly reduced. Thus, it is possible to manufacture a multilayer wiring circuit board having high reliability. Further, according to the present invention, an adhesive material for spatially adhering the wiring circuit boards to each other and a wiring circuit board on which an insulating circuit is formed to electrically connect the wiring circuit boards to each other are formed. A wired circuit board with a frame composed of a wired circuit board portion to be formed and a frame that reinforces the wired circuit board portion is used, and after the portion other than this frame is cut, spatial positioning is performed between the wired circuit board. Since a multilayer wiring circuit board is manufactured by stacking a plurality of wiring circuit boards with guide holes formed therein and adhering them in a batch, the spatial positioning of the wiring circuit boards and the electrical connection can be made small at the same time. Therefore, it is possible to manufacture a multi-layer printed circuit board having a high reliability with a significantly reduced manufacturing cost.

Further, according to the present invention, a wiring circuit board with a plurality of frames is formed into a continuous sheet, which is preliminarily supplied in a roll state, and the portions other than the frame are cut and then laminated to form a wiring. It is possible to simplify the process before entering the crimping process of the circuit boards, significantly reduce the manufacturing cost, and manufacture the multilayer wiring circuit board having high reliability. Further, according to the present invention, since a part of the printed circuit board after cutting is used as the guide hole for forming the guide hole when the printed circuit boards are stacked, the guide hole corresponding to the variation in board dimensional change before and after cutting. Can be drilled,
It is possible to reduce the deviation between the printed circuit boards at the time of stacking. Further, according to the present invention, the thermal expansion of the mold formed by installing the guide pin inserted into the guide hole for spatially positioning between the wiring circuit boards at the time of bonding is caused by the thermal expansion of any one of the wiring boards. Since it is formed larger than the expansion, the guide pin automatically applies a tensile force to each wiring circuit board, and the spatial adhesion between the wiring circuit boards and the adhesive for electrically connecting the wiring circuit boards together. This has the effect of making it possible to reduce the deviation between the substrates that occur during the process. According to the present invention, in the step of stacking a plurality of printed circuit boards and collectively adhering the printed circuit boards, the pressure head sequentially presses the printed circuit boards from the central portion, so that bubbles generated during the adhering to the outside of the boards. It is possible to efficiently discharge and to produce a highly reliable multilayer printed circuit board having no residual bubbles.

[Brief description of drawings]

FIG. 1 is a schematic view showing a method for manufacturing a multilayer printed circuit board according to the present invention, in which (a) shows a cross section of the printed circuit board before being multilayered, and (b) is a plan view of the framed wired circuit board. ,
(C) shows a wired circuit board with a frame separated, and (d) is a view showing a cross section when a plurality of wired circuit boards are stacked and laminated.

FIG. 2 is a diagram showing a sheet-shaped wired circuit board with a frame according to the present invention.

FIG. 3 is a diagram showing a sheet-shaped wired circuit board with a frame in a rolled state according to the present invention.

FIG. 4 is a schematic view showing a method for laminating a printed circuit board according to the present invention.

FIG. 5 is a diagram showing a cross-section of a framed portion according to the present invention.

FIG. 6 is a diagram showing a stacked state in which a large number of printed circuit boards according to the present invention are stacked.

FIG. 7 is a diagram showing a stacking method for stacking a large number of printed circuit boards according to the present invention.

FIG. 8 is a diagram showing a state before a large number of printed circuit boards according to the present invention are laminated and adhered.

FIG. 9 is a diagram showing a bonding operation by stacking a large number of printed circuit boards according to the present invention by a pressure head mechanism.

FIG. 10 is a diagram showing details of a pressure head portion of a pressure head mechanism for laminating and adhering a large number of printed circuit boards according to the present invention.

[Explanation of symbols]

1A ... wiring circuit board portion, 1B ... wiring circuit board, 1C ...
Multilayer printed circuit board 1a ... Adhesive material (adhesive material layer), 1b ... Wiring circuit, 1c
... Connection part 1d ... Electrical insulating material (insulating material base material) 1e ... Conductor, 1
f ... Frame 1g ... Guide hole, 2 ... Guide pin, 3 ... Sheet-shaped wired circuit board with frame 3A ... Roll-shaped sheet-shaped wired circuit board 3a ... Frame, 3b ... Positioning hole, 4 ... Holding device, 5 ... Upper die for frame cutting 5a ... Sheet punching, 5b ... Sheet holding frame, 5c ...
Guide punch punch 5d ... vacuum suction hole for holding sheet, 6 ... lower die for frame cutting 6a ... sheet punching die, 6b ... sheet holding block 6c ... sheet guide mechanism, 6d ... guide punching die hole 7 ... stacking stage, 8 ... Crimping lower mold, 8a ... Guide pin portion 9 ... Crimping upper mold, 9a ... Guide hole, 10 ... Pressure head mechanism 11 ... Metal plate, 12 ... Pressure adjusting oil

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takashi Inoue 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Stock Production Technology Research Institute, Hitachi, Ltd. (72) Inventor Yoshitaka Tsutsui 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Production Engineering Research Laboratory, Hitachi, Ltd.

Claims (13)

[Claims] 1. With a frame configured to reinforce a wiring circuit board portion constituted by a wiring circuit board in which a wiring circuit is formed on an insulating base material to electrically connect the wiring circuit boards to each other by a frame. A preparatory step of preparing a wired circuit board, a cutting step of cutting the framed wired circuit board prepared in the preparatory step so as to obtain a wired circuit board, and a wiring obtained in the cutting step. And a bonding step of manufacturing a multilayer wiring circuit board by stacking a plurality of circuit boards and bonding them together by using an adhesive material. 2. With a frame configured to reinforce a wired circuit board portion composed of a wired circuit board in which a wired circuit is formed on an insulating base material for electrically connecting the wired circuit boards to each other by a frame. A preparatory step of continuously preparing a plurality of wiring circuit boards in a sheet shape or a film shape, and cutting so as to cut the frame to the wiring circuit board with a frame prepared in this preparation step to obtain a wiring circuit board And a bonding step of manufacturing a multilayer wiring circuit board by stacking a plurality of wiring circuit boards obtained in the cutting step and bonding them together using an adhesive material. Manufacturing method. 3. An adhesive material for spatially adhering the wiring circuit boards to each other and a wiring circuit board having wiring circuits formed on an insulating base material for electrically connecting the wiring circuit boards to each other. A preparatory step of preparing a wired circuit board with a frame configured to reinforce the wired circuit board portion by a frame, and a wiring circuit by cutting the framed wired circuit board prepared in this preparatory step so as to separate the frame. A multilayer wiring circuit board, comprising: a cutting step for obtaining a board; and an adhesion step for manufacturing a multilayer wiring circuit board by stacking a plurality of the wiring circuit boards obtained in the cutting step and bonding them at once. Production method. 4. An adhesive material for spatially adhering wiring circuit boards to each other and a wiring circuit board having wiring circuits formed on an insulating base material for electrically connecting the wiring circuit boards to each other. A preparation step of continuously preparing a plurality of sheet-shaped or film-shaped wiring circuit boards with a frame configured to reinforce the wiring circuit board portion with respect to the framed wiring circuit boards prepared in this preparation step A cutting step to obtain a printed circuit board by cutting so that the frame is cut off, and an adhering step of manufacturing a multilayer printed circuit board by stacking a plurality of the printed circuit boards obtained in the cutting step and bonding them together. A method for manufacturing a multilayer printed circuit board, comprising: 5. The method for manufacturing a multilayer printed circuit board according to claim 3, wherein in the adhering step, a plurality of sheets are stacked with reference to a guide hole formed in each printed circuit board. 6. The method for manufacturing a multilayer wired circuit board according to claim 3, wherein in the preparing step, the adhesive material in the wired circuit board portion is prepared as an adhesive material layer. 7. With a frame configured to reinforce with a frame a wiring circuit board portion composed of a wiring circuit board in which a wiring circuit is formed on an insulating base material for electrically connecting the wiring circuit boards to each other. A preparatory step of preparing a wired circuit board, a cutting step of cutting the framed wired circuit board prepared in the preparatory step so as to obtain a wired circuit board, and a wiring obtained in the cutting step. And a bonding step of manufacturing a multilayer wiring circuit board by stacking a plurality of circuit boards and bonding them together by thermocompression bonding. 8. With a frame configured to reinforce with a frame a wiring circuit board portion composed of a wiring circuit board in which a wiring circuit is formed on an insulating base material for electrically connecting the wiring circuit boards to each other. A preparatory step of continuously preparing a plurality of wiring circuit boards in a sheet shape or a film shape, and cutting so as to cut the frame to the wiring circuit board with a frame prepared in this preparation step to obtain a wiring circuit board And a bonding step of manufacturing a multilayer wiring circuit board by stacking a plurality of wiring circuit boards obtained in this cutting step and bonding them all at once by thermocompression bonding using an adhesive material. Manufacturing method of printed circuit board. 9. With a frame configured to reinforce a wiring circuit board portion constituted by a wiring circuit board in which a wiring circuit is formed on an insulating base material for electrically connecting the wiring circuit boards to each other with a frame. A preparatory step of preparing a wired circuit board and a framed wired circuit board prepared in this preparatory step are sequentially cut using a cutting die to separate the frame, and the wired circuit board is adsorbed and held by the die. A cutting step and a plurality of wiring circuit boards that are sequentially suction-held in the mold in this cutting step are transferred onto a crimping mold to stack a plurality of sheets, and the crimping mold is used to collectively heat-press and bond. And an adhering step of manufacturing a multilayer printed circuit board. 10. With a frame configured to reinforce with a frame a wiring circuit board portion composed of a wiring circuit board in which a wiring circuit is formed on an insulating base material for electrically connecting the wiring circuit boards to each other. A preparatory step of continuously preparing a plurality of wiring circuit boards in a sheet shape or a film shape, and sequentially cutting the wiring circuit board with a frame prepared in this preparation step using a cutting die to cut the frame. A cutting step of sucking and holding the wiring circuit board in the mold, and a plurality of wiring circuit boards that are sequentially sucked and held by the mold in this cutting step are transferred onto the mold for crimping And a bonding step of manufacturing the multilayer wiring circuit board by collectively heat-pressing and bonding using. 11. With a frame configured to reinforce a wiring circuit board portion composed of a wiring circuit board in which a wiring circuit is formed on an insulating base material for electrically connecting the wiring circuit boards to each other with a frame. A preparatory step of preparing a wired circuit board, and the wired circuit board with a frame prepared in this preparatory step are sequentially cut using a cutting die so as to separate the frame, and guide holes are drilled to form the wired circuit board. A cutting step of sucking and holding in a mold, and a plurality of wiring circuit boards sequentially sucked and held in the mold in this cutting step are transferred onto the mold for pressure bonding with the guide hole as a reference, and a plurality of them are stacked. And a bonding step of manufacturing the multilayer wiring circuit board by thermocompression bonding and bonding all at once using a mold for use in manufacturing. 12. With a frame configured to reinforce with a frame a wiring circuit board portion composed of a wiring circuit board in which a wiring circuit is formed on an insulating base material for electrically connecting the wiring circuit boards to each other. A preparatory step of continuously preparing a plurality of wiring circuit boards into a sheet shape, and sequentially cutting the wiring circuit board with a frame prepared in this preparatory step so as to separate the frame by using a cutting die and guide holes. A cutting step in which the wiring circuit board is punched and held by suction on the mold, and the wiring circuit boards sucked and held by the mold in this cutting step are transferred onto the crimping mold with reference to the guide holes. A method of manufacturing a multilayer wiring circuit board, comprising a step of stacking a plurality of sheets, and then thermocompressing and bonding them all at once using the pressure bonding die to manufacture a multilayer wiring circuit board. 13. The preparing step, wherein the wiring circuit board portion is prepared with an adhesive material layer for adhering the wiring circuit board parts to each other. 13. The method for manufacturing a multilayer printed circuit board according to item 12.