JP2014225070A - Conductivity-imparting transfer foil, data carrier, and conductive pattern formation method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a conductivity-imparting transfer foil 7 and a conductive pattern formation method capable of offering a data carrier 10 in which a conductive layer applied by a thermal transfer method has stable conductivity regardless of a surface form such as fineness of fibers, the surface form possessed by a material itself to be served as a substrate 1 for a data carrier 10, and has reliability not only in initial characteristics but also in load in use.SOLUTION: A conductivity-imparting transfer foil 7 has a structure laminating, on a film base material 9, a release layer 12, a metal layer 3, and an adhesive layer 2. The conductivity-imparting transfer foil 7 is configured to be thermally transferred in a pattern shape to a data carrier base material 1. The adhesive layer 2 includes a conductive material 11. The content of the conductive material 11 is 5-80 wt.%. The thickness of the adhesive layer 2 is 0.5-5.0 μm.

Description

  The present invention relates to a conductivity-imparting transfer foil for providing a machine-readable conductive pattern on a non-conductive substrate, a data carrier provided with a conductive pattern using the conductivity-imparting transfer foil, and a method for forming a conductive pattern.

  There are computers and networks everywhere in society, and ubiquitous computing that can freely access computers anytime, anywhere can support business and living comfortably, is easy to handle and economical. There is a need for an information carrier that can be read accurately and that is reliable for copy protection and tampering.

  An information carrier including a non-conductive substrate, a non-conductive adhesive layer, and a conductive information layer is used to form an information layer with a conductive pattern using a conductivity-imparting transfer foil. A method has been proposed in which the number, size, shape, and position of information layers are converted into data using a capacitive reading device that cannot be optically recognized (Patent Document 1).

  However, a conductive layer applied by thermal transfer on a non-conductive substrate is easily cracked by, for example, the fibers of the non-conductive substrate material itself, and its conductivity is unstable. In some cases, the conductivity could not be maintained during use.

Special table 2012-507811 gazette

  The conductive layer pattern applied by the thermal transfer method is not affected by the surface shape such as the fiber texture of the material itself that is the substrate for the data carrier, and can provide stable electrical conductivity, not only the initial characteristics, Provided is a conductivity-imparting transfer foil and a method for forming a conductive pattern, which can provide a reliable data carrier even with respect to a load during use.

As a means for solving the above-mentioned problems, the invention according to claim 1 is a configuration in which a peeling protective layer, a metal layer, and an adhesive layer are laminated on a film base material. A conductivity imparted transfer foil that is thermally transferred in a pattern,
It is a conductivity-imparting transfer foil characterized in that a conductive substance is contained in the adhesive layer.

  The invention according to claim 2 is the conductivity-imparted transfer foil according to claim 1, wherein the content of the conductive substance in the adhesive layer is 5 to 80% by weight.

  The invention according to claim 3 is the conductivity-imparting transfer foil according to claim 1 or 2, wherein the adhesive layer has a thickness of 0.5 to 5.0 μm. .

  Further, the invention described in claim 4 is characterized in that the conductive pattern for causing the device to read is formed by thermal transfer using the conductivity-imparting transfer foil according to any one of claims 1 to 3. It is a data carrier.

  The invention according to claim 5 is the data carrier according to claim 4, wherein the surface roughness of the data carrier substrate is 0.05 to 1.0 μm.

  Moreover, the invention described in claim 6 is characterized in that the conductive pattern for causing the device to read is formed by thermal transfer using the conductivity-imparting transfer foil according to any one of claims 1 to 3. This is a method of forming a conductive pattern.

  During use, the metal layer 3 may be cracked due to the load applied to the data carrier, and the current is interrupted by the crack. However, since the adhesive layer 2 contains the conductive material 11, the crack is small. In the case of, energization is not interrupted and the conductivity can be maintained, so that a fatal accident does not occur.

It is the cross-sectional conceptual diagram which showed the structure of the electroconductivity provision transfer foil 7 which provided electroconductivity to the adhesive bond layer 2 of this invention. It is the cross-sectional conceptual diagram which showed the process of performing pattern transfer from the electroconductive provision transfer foil 7 to the data carrier base material 1 using the heat stamp 8 of this invention. Using the heat stamp 8 of the present invention, the transfer was performed from the conductivity-imparting transfer foil 7 to the data carrier substrate 1, and the metal layer 3 and the conductive adhesive layer 2 were transferred in a pattern. FIG. It is the cross-sectional conceptual diagram which showed the state which transferred and formed the electroconductive pattern from the electroconductivity provision transfer foil 7 of this invention to the data carrier base material 1. FIG. FIG. 3 is a conceptual cross-sectional view showing a state in which a conductive pattern is transferred and formed on the data carrier substrate 1, the pattern cannot be seen, and security is improved. It is the cross-sectional conceptual diagram which showed the data carrier by which the printing layer was provided in the front and back of this invention. FIG. 5 is a conceptual cross-sectional view showing a process of transferring and forming a conductive pattern from a conductivity-imparting transfer foil 7 using a thermal head 13.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. FIG. 1 is a conceptual diagram showing the configuration of a conductivity-imparting transfer foil 7 according to the present invention. Are stacked.

  The adhesive of the adhesive layer 2 containing the conductive substance 11 can be an oxidation polymerization type, a heat drying type, or a UV curing type. As the conductive substance 11, silver powder, copper powder, graphite or the like is used. it can. As an addition amount of the conductive substance 11 to the adhesive, it is preferable to add 5 to 80% of the conductive substance 11 described above.

  If the amount of the conductive material 11 is too small, the metal layer will be disconnected when cracks occur, and if it is too large, the ink will not be suitable, and not only will the transfer foil be produced, but also the transfer suitability will deteriorate.

  FIG. 2 shows a process of performing pattern transfer from the conductivity-imparting transfer foil 7 to the data carrier substrate 1 using the heat stamp 8. The heating stamp 8 has a pattern to be transferred and formed in a convex shape. The surface of the adhesive layer 2 of the conductivity-imparting transfer foil 7 is attached to the data carrier substrate 1, and the heating stamp 8 is formed from the film substrate side. As shown in FIG. 3, the metal layer 3 and the adhesive layer 2 are transferred onto the data carrier substrate 1 in the pattern of the heat stamp 8 as shown in FIG. 3, resulting in the shape shown in FIG. The total film thickness of the metal layer 3 and the adhesive layer 2 of the conductivity imparting transfer foil 7 is preferably 0.1 to 10 μm.

  If the film thickness is thin, not only the adhesiveness but also the metal layer will be broken when cracked, and if it is too thick, the foil will be broken.

  FIG. 5 shows a state in which a concealing layer 4 is provided to make the conductive pattern invisible, and what pattern shape is obtained by providing the concealing layer 4 can be understood without machine reading. Therefore, security as a medium can be improved.

  FIG. 6 shows the final shape of the data carrier 10, and the printing layer 5 is provided on the front and back sides.

  The film substrate 9 is required to have heat resistance and strength that does not soften and deform due to heat pressure in thermal transfer. For example, polyethylene terephthalate, polyethylene naphthalate, polypropylene, cellophane, acetate, polycarbonate, polysulfone, polyimide, polyvinyl alcohol, aromatic polyamide , Synthetic resin films such as aramid and polystyrene, and papers such as condenser paper and paraffin paper can be used singly or in combination, among others, physical properties, workability, cost, etc. In consideration, a polyethylene terephthalate film is preferable. In addition, the thickness is in the range of 2 to 50 μm in consideration of operability and workability, but in consideration of handling properties such as transfer suitability and workability, the thickness is about 2 to 9 μm. preferable.

  As the metal layer 3, copper, aluminum, silver, tin, or the like may be provided by vapor deposition or the like, or copper foil, aluminum foil, silver foil, tin foil, graphite, or the like may be attached.

  Examples of the binder resin used for the release layer 12 include butyral resin, polyester resin, acrylic resin, polyvinyl chloride resin, vinyl chloride-vinyl acetate copolymer resin, ethylene-vinyl acetate copolymer resin, polyamide resin, and styrene-butadiene. 1 type or 2 types or more mixtures are appropriately selected from thermoplastic resins such as copolymer resins and cross-linked products thereof, phenol resin melamine resins, unsaturated polyester resins, alkyd resins, polyimide resins, and epoxy resins. You can select and use.

  As the data carrier base material 1, when the metal layer 3 and the adhesive layer 2 are transferred, the data carrier base material is picked up, and the metal layer 3 that is a thin film is difficult to crack, For example, a coated paper or a synthetic paper having a low surface roughness is preferred. Specifically, the surface roughness of the data carrier substrate is preferably 0.05 to 1.0 μm.

  Outside this range, if the surface roughness is high, the metal layer is cracked and disconnected, and if it is low, the adhesion may be weak.

  Regarding the paper pattern, it is preferable that the vertical direction of the paper pattern and the foil design data is the same direction, and this makes it possible to prevent disconnection of energization due to a crack in the foil design when the foil picks up the pattern. .

  As base materials other than paper, polyethylene terephthalate (PET), polycyclohexane 1,4-dimethylphthalate (PCT), polystyrene (PS), polymethyl methacrylate (MMA), transparent ABS (MABS), polyvinyl chloride ( PVC), polypropylene (PP), polyethylene (PE) and the like may be used.

  A 25 μm thick polyethylene terephthalate film with a release / protection layer made of thermoplastic acrylic resin, chlorinated rubber resin, or a mixture of this chlorinated rubber resin and nitrocellulose, acetylcellulose, cellulose acetate butyrate, polystyrene or vinyl chloride resin. 0.1 to 10 μm, an aluminum vapor deposition film thereon is provided with a thickness of 50 nm, an adhesive containing a conductive material having the following composition is applied, and the adhesive layer is dried to 3 μm. Provided.

<Adhesive layer ink composition>
Vinyl chloride vinyl acetate copolymer resin 15.0 parts by weight Acrylic resin (Tg. 20 ° C.) 10.0 parts by weight Carbon powder 3 parts by weight Silica 1.0 part by weight Methyl ethyl ketone 44.0 parts by weight Toluene 30.0 parts by weight Using a conductivity imparted transfer foil, a data carrier substrate having a thickness of 200 μm and a surface roughness of 0.8 μm, a transfer temperature of 120 ° C., a pressure of 2000 kg / cm ² , and a heating time of 0.3 seconds. Under conditions, a patterned metal layer 3 and an adhesive layer 2 were provided.

  As the concealing layer 4, a material in which a material composed of a platelet-like interference pigment coated with titanium oxide or metal oxide is added to a binder is suitable, and a pattern shape transferred onto the data carrier substrate 1 is used. The pattern can be concealed on the metal layer 3 and the adhesive layer 2, and picture printing is provided on both or one side of the data carrier 10.

For comparison, a data carrier 10 was prepared using an adhesive layer ink composition having the following composition obtained by removing carbon powder from the adhesive layer ink composition used in the examples.
Vinyl chloride vinyl acetate copolymer resin 15.0 parts by weight Acrylic resin (Tg. 20 ° C.) 10.0 parts by weight Silica 1.0 part by weight Methyl ethyl ketone 44.0 parts by weight Toluene 30.0 parts by weight For Examples and Comparison A bending test was performed on the manufactured data carrier to confirm the degree of conduction, but it was found that the reliability of the data carrier of the present invention was high.

  The data carrier 10 using the metal layer 3 of the present invention and the adhesive layer 2 containing a conductive substance can also be used for an antenna portion of an RFID or a non-contact IC card, even if the metal layer 3 cracks during use. Even if, the conductive layer 11 is included in the adhesive layer 2, so that electrical continuity can be obtained without causing a fatal accident.

1 ... Data carrier substrate (paper)
DESCRIPTION OF SYMBOLS 2 ... Adhesive layer 3 ... Metal layer 4 ... Concealment layer 5 ... Print layer 6 ... Conductive pattern 7 ... Conductivity provision transfer foil 8 ... Heat stamp 9 ... Film substrate 10 ... Data carrier 11 ... Conductive substance 12 ... Release layer 13 ... Thermal head 14 ... Substrate

Claims (6)

In a configuration in which a release protective layer, a metal layer, and an adhesive layer are laminated on a film substrate,
A conductivity-imparting transfer foil that is thermally transferred in a pattern to a data carrier substrate,
A conductivity-imparting transfer foil characterized in that a conductive substance is contained in the adhesive layer.   The conductivity-imparting transfer foil according to claim 1, wherein the content of the conductive substance in the adhesive layer is 5 to 80% by weight.   The conductivity-imparting transfer foil according to claim 1 or 2, wherein the adhesive layer has a thickness of 0.5 to 5.0 µm.   A data carrier using the conductivity-imparting transfer foil according to claim 1, wherein a conductive pattern for causing a device to read the data carrier substrate is formed by thermal transfer.   5. The data carrier according to claim 4, wherein the surface roughness of the data carrier substrate is 0.05 to 1.0 [mu] m.   Using the conductivity-imparting transfer foil according to any one of claims 1 to 3, a conductive pattern for causing a device to read the data carrier base material by thermal transfer is formed. Method.

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