JP2002269526A - Ic label - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC label recordable of information on the surface, which is free of the risk with regard to security in that an internal IC circuit of wiring circuit is seen through, excellent in strength and water resistance, usable both outdoors and indoors and further both in the atmosphere and in water, usable as a sticker for frozen food vessel, industrial product, various chemical vessel or the like and usable for physical distribution management, manufacturing process management, or the like. SOLUTION: This IC label comprises a thermoplastic resin film layer A laminated and stuck to at least one side of an IC circuit layer B or an IC circuit protective layer C containing the IC circuit layer B via an adhesive layer D.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an IC label including an IC capable of writing and reading data, in which a wiring circuit for transmitting and receiving data and an IC circuit are provided in a laminated structure. The IC label obtained by the present invention can record information on the surface, does not have security concerns that the internal IC circuit and wiring circuit can be seen through, has excellent strength and water resistance, and can be used indoors and outdoors. Regardless, it can be used in the air or water, and can be used for containers for frozen foods, industrial products, stickers for various chemical containers, etc., distribution management use, manufacturing process management use, and the like.

[0002]

2. Description of the Related Art In recent years, cards that include an IC module and that transmit and receive data without contact via external readers and writers have begun to spread. IC labels have been proposed for similar uses. For example, Japanese Patent Application Laid-Open No. 11-277961
And Japanese Patent Application Laid-Open No. 11-277963,
JP-A-134460 and JP-A-11-231782 disclose the structure and use example of an IC label.

[0003]

SUMMARY OF THE INVENTION The present invention realizes information recording aptitude, security, strength, and water resistance so that the use of an IC label as disclosed in the above-mentioned patent document can be further expanded. The purpose is to provide an IC label.

[0004]

SUMMARY OF THE INVENTION The present invention defines a specific lamination structure, defines the characteristics of a thermoplastic resin film on a surface to be used, and forms an IC circuit layer having an IC circuit and a wiring circuit inside or on the surface thereof. Despite having excellent holding strength, strength and water resistance, the appearance looks like a conventional mere paper label and does not give a sense of incongruity. That is, in the present invention, the thermoplastic resin film layer (A) is provided on at least one surface of the IC circuit layer (B) or the IC circuit protective layer (C) including the IC circuit layer (B) via the adhesive layer (D). IC formed by laminating and laminating an adhesive layer (G) on one side
Label, provide.

In a preferred embodiment of the IC label of the present invention, the thermoplastic resin film layer (A) and the IC circuit layer (B)
It is preferable to provide a light shielding layer (E) between them. Further, it is preferable to provide a thermoplastic resin film layer (F) and an adhesive layer (D) between the light shielding layer (E) and the IC circuit layer (B).
Also, the IC circuit layer (B) is smaller than the IC label,
The thickness of the circuit layer (B) is equal to or less than the thickness of the IC circuit protection layer (C). Adhesive layer (D) between thermoplastic resin film layer (A) and IC circuit protection layer (C)
Is preferably provided. It is preferable to provide a light shielding layer (E) between the thermoplastic resin film layer (A) and the IC circuit protection layer (C). Further, it is preferable to provide an adhesive layer (D) and a thermoplastic resin film layer (F) between the thermoplastic resin film layer (A) and the adhesive layer (D).

[0006] These IC labels preferably have a whiteness of 85% or more, and a total light transmittance of 15% or less. The thermoplastic resin film layer (A)
It is preferable that the opacity is 80% or more and the whiteness is 90% or more. Thermoplastic resin film layer (A)
However, it is preferable that the porosity calculated by the following equation is 10 to 60%. Porosity (%) = [(ρ ₀ −ρ) / ρ ₀ ] × 100 (where, ρ ₀ is the true density of the film and ρ is the density of the film.) Thermoplastic resin film layer (A ) And the thermoplastic resin used for the thermoplastic resin film layer (F) are preferably a polyolefin-based resin and / or a polyester-based resin, and the polyolefin-based resin is preferably a propylene-based resin. Further, it is preferable to provide a recording layer on the surface of the thermoplastic resin film layer (A).

Hereinafter, the present invention will be described in detail. Each layer in the present invention is as follows. (1) Thermoplastic resin film layer (A) The thermoplastic resin film layer (A) of the present invention comprises a thermoplastic resin and inorganic fine powder and / or organic filler. As the thermoplastic resin used, high-density polyethylene, medium-density polyethylene, ethylene-based resin such as low-density polyethylene, or propylene-based resin, polymethyl-1-pentene, polyolefin-based resin such as ethylene-cyclic olefin copolymer, Nylon-6, nylon-
6,6, Nylon-6,10, Nylon-6,12 and other polyamide resins, polyethylene terephthalate and copolymers thereof, polyethylene naphthalate, thermoplastic polyester resins such as aliphatic polyester, polycarbonate, atactic polystyrene, Thermoplastic resins such as syndiotactic polystyrene and polyphenylene sulfide; These may be used in combination of two or more.

[0008] Among them, it is preferable to use a polyolefin resin. Further, among the polyolefin-based resins, a propylene-based resin and a high-density polyethylene are more preferable in terms of cost, water resistance, and chemical resistance. As such a propylene-based resin, a propylene homopolymer, isotactic or syndiotactic and polypropylene exhibiting various degrees of stereoregularity, propylene as a main component, and ethylene, butene-1, hexene-1, A copolymer with an α-olefin such as heptene-1,4-methylpentene-1 is used. This copolymer may be a binary, ternary, or quaternary system, and may be a random copolymer or a block copolymer.

[0009] As the inorganic fine powder, the particle size is usually 0.0
1 to 15 μm, preferably 0.01 to 8 μm, more preferably 0.03 to 4 μm can be used. Specifically, powders such as calcium carbonate, calcined clay, silica, diatomaceous earth, talc, titanium oxide, barium sulfate, and alumina can be used. As the organic filler, it is preferable to select a resin different from the thermoplastic resin as the main component. For example, when the thermoplastic resin film is a polyolefin resin film, as the organic filler, polyethylene terephthalate, polybutylene terephthalate, polycarbonate, nylon-6, nylon-6,6, a homopolymer or cyclic olefin cyclic olefin Examples thereof include copolymers of olefin and ethylene having a melting point of 120 to 300 ° C or a glass transition temperature of 120 to 280 ° C.

If necessary, stabilizers, light stabilizers, dispersants, lubricants and the like may be added. As the stabilizer, a sterically hindered phenol-based, phosphorus-based, amine-based stabilizer, etc.
0.01 to 1% by weight, as a light stabilizer, 0.001 to 1% by weight of a sterically hindered amine, a benzotriazole-based or benzophenone-based light stabilizer, a dispersant of an inorganic fine powder, for example, a silane coupling agent, A higher fatty acid such as an acid or stearic acid, metal soap, polyacrylic acid, polymethacrylic acid or a salt thereof may be blended in an amount of 0.01 to 4% by weight.

The thermoplastic resin film forming the thermoplastic resin film layer (A) of the present invention may have a single-layer structure or a two-layer structure consisting of a base layer and a surface layer. It may be a three-layer structure having a surface layer, a multi-layer structure having another resin film layer between the base layer and the surface layer, or may be stretched in at least one axial direction. When the multilayer structure is stretched, the number of stretching axes is 1 axis / 1 axis, 1 axis / 2 axes, 2 axes /
1-axis / 1-axis / 2-axis, 1-axis / 2-axis / 1
Axis, 2 axes / 1 axis / 1 axis, 1 axis / 2 axes / 2 axes, 2 axes / 2 axes / 1 axis, 2 axes / 2 axes / 2 axes, and in the case of a layer structure of more layers The number of stretching axes is arbitrarily combined.

When the thermoplastic resin film layer (A) is a single-layer polyolefin resin film and contains an inorganic fine powder and / or an organic filler, the polyolefin resin usually contains 40 to 99.5% by weight of inorganic resin. It comprises 60 to 0.5% by weight of a fine powder and / or an organic filler, preferably 50 to 97% by weight of a polyolefin-based resin, and 50 to 3% by weight of an inorganic fine powder and / or an inorganic filler. When the thermoplastic resin film has a multilayer structure and the base layer and the surface layer contain an inorganic fine powder and / or an organic filler, the base layer is usually made of a polyolefin resin 4.
0 to 99.5% by weight, inorganic fine powder and / or organic filler 60 to 0.5% by weight, and the surface layer is a polyolefin resin 25 to 100% by weight, inorganic fine powder and / or organic filler 75 to 0% by weight. %, Preferably the base layer is 50 to 97% by weight of the polyolefin resin, the inorganic fine powder and / or the organic filler is 50 to 3% by weight, and the surface layer is 30 to 97% by weight of the polyolefin resin.
It consists of 70 to 3% by weight of inorganic fine powder.

If the content of the inorganic fine powder and / or the organic filler contained in the base layer having a single-layer structure or a multi-layer structure exceeds 60% by weight, the stretched resin film is liable to break at the time of transverse stretching after longitudinal stretching. If the amount of the inorganic fine powder and / or the organic filler contained in the surface layer exceeds 75% by weight, the surface strength of the surface layer after the transverse stretching is low, and the surface layer is easily broken by a mechanical impact during use. Not preferred.

[Formation of thermoplastic resin film] The method of forming the thermoplastic resin film for forming the thermoplastic resin film layers (A) and (F) is not particularly limited, and various known methods can be used. Examples include cast molding, calender molding, rolling molding, inflation molding, extrusion of molten resin using a single-layer or multilayer T-die or I-die connected to a screw type extruder, thermoplastic resin and organic solvent. And removal of solvent and oil after cast molding or calender molding of a mixture with oil and oil, molding from a thermoplastic resin solution and solvent removal, and the like. In the case of stretching, various known methods can be used, and specific examples include longitudinal stretching using a difference in peripheral speed between roll groups, and transverse stretching using a tenter oven.

[Stretching] Various known methods can be used for stretching. As a specific example, in the case of an amorphous resin, the temperature is equal to or higher than the glass transition temperature of the thermoplastic resin used, and in the case of a crystalline resin, Can be carried out in a known temperature range suitable for each thermoplastic resin from the glass transition point temperature of the non-crystalline portion to the melting point of the crystalline portion or less, the longitudinal stretching using a peripheral speed difference of the roll group, a tenter oven. Examples include transverse stretching, rolling, and simultaneous biaxial stretching using a combination of a tenter oven and a linear motor.

The stretching ratio is not particularly limited, and is appropriately selected depending on the purpose and the characteristics of the thermoplastic resin used. For example, when a propylene homopolymer or a copolymer thereof is used as the thermoplastic resin, when it is stretched in one direction, it is about 1.2 to 12 times, preferably 2 to 10 times,
In the case of biaxial stretching, the area ratio is 1.5 to 60 times, preferably 10 to 50 times. When using other thermoplastic resins, when stretched in one direction, it is 1.2 to 10 times, preferably 2 to 5 times, and in the case of biaxial stretching, the area ratio is 1.5 to 20 times, preferably Is 4 to 12 times. Further, a heat treatment at a high temperature is performed as necessary.

The stretching temperature is a temperature which is lower by 2 to 150 ° C. than the melting point of the thermoplastic resin to be used, and when the resin is a propylene homopolymer (melting point: 155 to 167 ° C.)
The temperature is 110-120 ° C for 4 ° C, high-density polyethylene (melting point 121-134 ° C), and 104-115 ° C for polyethylene terephthalate (melting point 246-252 ° C). The stretching speed is from 20 to 350 m / min. When the thermoplastic resin film contains an inorganic fine powder or an organic filler, fine cracks are generated on the film surface, and fine pores are generated inside the film. The thickness of the stretched thermoplastic resin film is in the range of 20 to 350 μm, preferably 35 to 300 μm.

[Physical Properties of Stretched Film] The physical properties of the thermoplastic resin film forming the thermoplastic resin film layer (A) used in the present invention after the stretching are determined according to JIS-P-81.
Opacity based on No. 38 is 80 to 100%, more preferably 85 to 100%, and JIS-L-1015
90-100%, more preferably 95%
~ 100%. If the opacity deviates from this range, the internal IC circuit layer (B) can be seen through, and the color of the light shielding layer (E) can be seen through, which is not preferable. Further, if the whiteness deviates from this range, the identification of characters and image information recorded on the surface of the IC label becomes unclear, and the appearance is also undesirable.

The thermoplastic resin film layer (A) has a porosity calculated by the following equation of 10 to 60%, preferably 10 to 60%.
~ 35%, more preferably 15 ~ 25%. 10%
If it is less than 60%, it is difficult to reduce the weight, and if it is more than 60%, it is easy to cause difficulty in the strength as an IC label. Porosity (%) = [(ρ ₀ −ρ) / ρ ₀ ] × 100 In the formula, ρ ₀ represents the true density of the stretched film, and ρ represents the density of the stretched film (JIS-P-8118). Unless the material before stretching contains a large amount of air, the true density is approximately equal to the density before stretching.

[Formation of Surface Modified Layer] In order to prevent the static charge of the thermoplastic resin film forming the thermoplastic resin film layer (A) and to improve various printing suitability, at least the surface side is subjected to a surface treatment to modify the surface. Preferably, a layer is formed. The surface treatment method is a combination of a surface oxidation treatment and a surface treatment agent. As the surface oxidation treatment, a corona discharge treatment, a flame treatment, a plasma treatment, a glow discharge treatment, an ozone treatment and the like generally used for a film are used alone or in combination. Among these, corona treatment and frame treatment are preferable, and the amount of treatment is 600 to 12,000 J / m ² (10 to 10 in case of corona treatment).
200 W · min / m ² ), preferably 1,200 to 9.0
00J / m ² (20~180W · min / m ^2), when the frame processing, 8,000~200, 000J / m ^2, preferably 20, 000~100, 000J / m ² is used.

[Surface Treatment Agent] The surface treatment agent in the former stage is mainly selected from the following primers and antistatic polymers, and may be used alone or as a mixture of two or more components. From the viewpoints of improving adhesion during dry lamination and preventing static charge, a preferable surface treatment agent is a primer or a combination of a primer and an antistatic polymer.

Primers Examples of the primer include polyethyleneimine, such as polyethyleneimine, an alkyl-modified polyethyleneimine having 1 to 12 carbon atoms, poly (ethyleneimine-urea), an ethyleneimine adduct of polyamine polyamide, and an epichlorohydrin adduct of polyamine polyamide. -Based polymer, acrylamide-acrylate copolymer,
Acrylic amide-acrylic ester-methacrylic ester copolymers, polyacrylamide derivatives, acrylate polymers such as oxazoline group-containing acrylate polymers and polyacrylates, polyvinylpyrrolidone, polyethylene glycol, polyvinyl Alcohol, water-soluble resin such as resin, polyvinyl acetate, polyurethane, ethylene-vinyl acetate copolymer,
Water-dispersible resins such as polyvinylidene chloride, chlorinated polypropylene and acrylonitrile-butadiene copolymer are used.

Of these, preferred are polyethyleneimine-based polymers, urethane resins, polyacrylates, etc., more preferred are polyethyleneimine-based polymers, and further preferred are those having a degree of polymerization of 20 to 3,000. Polyethyleneimine, an ethyleneimine adduct of polyamine polyamide, or a modified polyethyleneimine modified with an alkyl halide, alkenyl halide, cycloalkyl halide or benzyl halide group having 1 to 24 carbon atoms.

Antistatic Polymer Examples of the antistatic polymer include cationic, anionic and amphoteric polymer types, and examples of the cationic type include polymers having a quaternary ammonium salt structure or a phosphonium salt structure, and nitrogen-containing acryl. Acrylic or methacrylic polymers having nitrogen having a quaternary ammonium salt structure, and styrene-maleic anhydride copolymers or alkali metal salts thereof, and alkali metal salts of ethylene-acrylic acid copolymers as anionic polymers Or an alkali metal salt of an ethylene-methacrylic acid copolymer, and examples of the amphoteric system include an acrylic or methacrylic polymer having a betaine structure of nitrogen, particularly an acrylic or methacrylic having a quaternary ammonium salt structure of nitrogen. Based polymer is preferred .

The molecular weight of the antistatic polymer depends on the polymerization temperature,
The level can be set to an arbitrary level depending on the polymerization conditions such as the type and amount of the polymerization initiator, the amount of the solvent used, and the chain transfer agent. Generally, the molecular weight of the resulting polymer is between 1,000 and 1,000.
000, especially 1,000 to 500,000
A range of 0 is preferred. The surface treatment agent at the former stage of the present invention may contain the following optional components as necessary.

Optional Component 1: Crosslinking Agent By adding a crosslinking agent, the coating film strength and water resistance can be further improved. Examples of the crosslinking agent include epoxy compounds such as glycidyl ether and glycidyl ester, epoxy resins, and water-dispersible resins such as isocyanate, oxazoline, formalin, and hydrazide. The amount of the cross-linking agent to be added is usually within a range of 100 parts by weight or less based on 100 parts by weight of the active ingredient excluding the solvent of the surface modifier.

Optional Component 2: Alkali Metal Salt or Alkaline Earth Metal Salt An alkali metal salt or an alkaline earth metal salt is added to the surface modifier, and these salts include water-soluble inorganic salts such as carbonic acid Examples include sodium, sodium bicarbonate, potassium carbonate, sodium sulfite, and other alkaline salts, and sodium chloride, sodium sulfate, sodium nitrate, sodium tripolyphosphate, sodium pyrophosphate, ammonium alum, and the like. The amount of the optional component is usually 50 parts by weight or less based on 100 parts by weight of the active ingredient excluding the solvent for the surface modifier. Optional component 3: The surface modifier further includes a surfactant,
Defoamers, water-soluble or water-dispersible finely divided powdered substances and other auxiliaries can also be included. The amount of the optional component is usually 20 parts by weight or less based on 100 parts by weight of the active ingredient excluding the solvent for the surface modifier.

[Formation of Surface Treatment Layer] Each component of the above surface treatment layer is used after being dissolved in water or a hydrophilic solvent such as methyl alcohol, ethyl alcohol, or isopropyl alcohol. It is preferably used. Solution concentration is usually 0.1-20% by weight,
Preferably it is about 0.1 to 10% by weight. The coating method is performed by a roll coater, blade coater, bar coater, air knife coater, size press coater, gravure coater, reverse coater, die coater, lip coater, spray coater, etc., and performs a smoothing or drying process as necessary. After that, excess water and hydrophilic solvent are removed. The coating amount is 0.005 to 5 g / m ² , preferably 0.01 to ² g / m ² as a solid content after drying.
m ² .

When the thermoplastic resin film forming the thermoplastic resin film layer (A) is a stretched film, the surface treatment layer may be coated in a single step or in multiple steps regardless of before or after longitudinal or transverse stretching. It may be mechanic. After the above-mentioned surface treatment or after the formation of the surface treatment layer, the surface of the thermoplastic resin film layer (A) may have a writability imparting layer, a print quality improving layer, a thermal transfer receiving layer, a heat transfer recording layer, if necessary. The layer, the ink jet receiving layer and the like can be provided by the same coating method as that for forming the surface treatment layer.

The thermoplastic resin film layer (A) may be laminated on one side of the IC circuit layer (B) or the IC circuit protective layer (C), or may be laminated on both sides. In the case of laminating on both surfaces, the same thermoplastic resin film layer (for example, A / ...) is provided on both sides of the IC circuit layer (B) or the IC circuit protection layer (C).
/B/../A) or thermoplastic resin film layers (A), (A ') (for example, A /..//
B /../ A ') may be used. The opacity of the thermoplastic resin film layer (A ') is not particularly limited, and may be transparent or opaque.

(2) IC Circuit Layer (B) The IC circuit layer (B) of the present invention is formed such that the IC circuit protective layer (C) extends in all directions in the IC label and the thickness direction as viewed from the side, that is, Surface direction is thermoplastic resin film layer (A)
It is preferably installed so as to be completely concealed and not to be seen at all from the surface and the side. Therefore, when viewed from a plane, the IC circuit layer (B) is smaller than the area of the IC label,
When viewed from the side, the thickness of the IC circuit layer (B) is equal to or less than the thickness of the IC circuit protection layer (C).

The IC circuit layer (B) has an IC
It is provided by forming a circuit and a wiring circuit. The IC circuit and the antenna circuit are electrically conducted. As the substrate material for the circuit board, a rigid type such as general paper phenol, glass epoxy, and composite, a flexible type such as a polyimide film and a polyester film, and a composite type of both can be used. A wiring circuit is a method in which a metal conductor is formed into a coil shape by using an adhesive on the substrate material, or a method in which a film is deformed by applying heat and pressure to be provided and provided, and a metal such as copper or aluminum is provided. A method of etching and providing a metal part of a substrate material, a method of transferring and providing a metal foil formed of a conductive metal such as silver on a substrate, and printing and drying by silk screen printing using a conductive paste paint. And a method of providing it on a substrate.

The IC circuit layer (B) is formed by mounting an IC circuit on the substrate on which the wiring circuit is formed as described above, and electrically connecting the antenna circuit and the IC circuit. For mounting an IC circuit on a substrate, TAB (tape automated bonding), COB (chip-on-board), or flip-chip mounting is used. For the mounting of the IC circuit and the connection with the antenna circuit, normal soldering or a conductive adhesive can be used. However, it is necessary to adopt a material having a temperature condition that can withstand the circuit board material during processing. The IC circuit layer (B) can be embedded (packaged) with an epoxy resin or the like to protect the mounted IC circuit or wiring circuit. The thickness of the IC circuit layer (B) is 150 μm to 1 mm after being embedded in the epoxy resin.

(3) IC Circuit Protective Layer (C) The IC circuit protective layer (C) used in the present invention may be the same as that used for the thermoplastic resin film layer (A), and may be a general stretched film. A non-stretched thermoplastic resin film can be used. However, when the IC circuit layer (B) is not packaged, electrical conduction or the like must not occur between the IC circuit layer (B) and the IC circuit protection layer (C), and therefore, the volume direction Is preferably 10 ⁸ Ω · cm or more, more preferably 10 ¹⁰ Ω · cm or more. The surface electric resistance of the surface in contact with the IC circuit board layer is 10
⁸ Ω / □ or more is preferable, and 10 ⁹ Ω / □ is more preferable.
That is all.

In order to protect the IC circuit layer (B), the IC circuit protection layer (C) is provided on the IC circuit layer (B) in a plan view.
Is provided with a through-hole of a size that can accommodate therein, that is, a punched hole. For the processing, a punching die used for punching a paper, a film, a metal plate or the like can be used. The punching shape is IC
It can be arbitrarily changed according to the shape of the circuit layer (B) viewed from the plane. Furthermore, protection of the IC circuit layer (B) and IC
In order to eliminate irregularities on the front and back surfaces of the label, the thickness of the IC circuit protection layer (C) is preferably thicker than the IC circuit layer (B). On the other hand, in order to prevent unnecessary movement of the IC circuit board layer in the IC label, the thickness of the IC circuit protection layer (C) is larger than the thickness of the IC circuit layer (B) by 0 to 100 μm, preferably 0 to 100 μm. It is preferably 50 μm thick.

(3) Thermoplastic resin film layer (F) The thermoplastic resin film layer (F) used in the present invention comprises:
In addition to the same films used for the thermoplastic resin film layer (A), general stretched and non-stretched thermoplastic resin films can be used. However, since electrical conduction or the like must not occur in the IC circuit layer (B), the electric resistance in the volume direction is preferably 10 ⁸ Ω · cm or more, more preferably 10 ¹⁰ Ω · cm or more. The surface electric resistance of the surface in contact with the IC circuit layer is preferably at least 10 ⁸ Ω / □, more preferably at least 10 ⁹ Ω / □. The thickness is 5-30
0 μm, preferably 10 to 150 μm.

(4) Light hiding layer (E) Between the thermoplastic resin film layer (A) and the IC circuit layer (B) or between the thermoplastic resin film layer (A) and the thermoplastic resin film layer (F) Light shielding layer (E) formed between
Is a layer having the smallest visible light transmittance per unit thickness among all the layers constituting the present invention.
Total light transmittance at 0 to 780 nm (JIS-K-7
105) (0.5% or less). Such a light concealing layer (E) is formed by performing black solid printing by offset or gravure printing on one surface of the thermoplastic resin film (A) or (F), transferring by pressing a metal vapor-deposited foil such as aluminum, When forming by using transfer evaporation and direct evaporation, or when laminating the thermoplastic resin films (A) and (F) together using an adhesive, a black filler such as carbon black is used in the adhesive. It is formed by a method in which a large amount of a white filler such as titanium oxide whiskers and titanium oxide fine particles is contained.

(5) Adhesive Layer (D) As the adhesive layer (D), one having an adhesive force at the time of laminating and bonding in the present IC label manufacturing process can be used. Usually, it can be pressure-bonded at room temperature or in a heated state. A general heat sealer can be used. As an adhesive, for example, a liquid anchor coating agent, for example, as a polyurethane-based anchor coating agent, EL-15 manufactured by Toyo Morton Co., Ltd.
0 (brand name) or BLS-2080A and BLS-20
A mixture of 80B can apply AD-503 (trade name) manufactured by the company as a polyester anchor coating agent. Anchor coating agent weighs 0.5 to 25 g / m
It is coated to a ^2. Further, in order to improve the concealment of the IC label, it is also possible to use an adhesive containing a pigment such as titanium oxide fine particles.

(6) Pressure-sensitive adhesive layer (G) The type and thickness (coating layer) of the pressure-sensitive adhesive layer (G) can be variously selected depending on the type of the adherend, the environment in which it is used, the strength of adhesion, and the like. It is. A commonly used aqueous or solvent-based pressure-sensitive adhesive can be applied and dried to form a natural rubber-based, synthetic rubber-based, or acrylic-based pressure-sensitive adhesive. It can be used in the form dispersed in water, such as John or emulsion. It is also possible to use a pressure-sensitive adhesive containing a pigment such as titanium white in order to improve the concealability of the label.

(7) Printing The obtained IC label may be provided with a recording layer to form an electrophotographic system, sublimation heat transfer, melt heat transfer, direct thermal, rewritable marking, and ink jet printer, as well as letterpress printing, gravure printing. printing,
It can be used for flexographic printing, solvent-type offset printing, ultraviolet-curing offset printing, and rotary printing in the form of a sheet or a roll.

[Physical Properties of IC Label] The IC label of the present invention must satisfy the following physical properties. -Whiteness The IC label of the present invention has a whiteness (JIS-L
-1015) is 85% or more, preferably 90 to 100.
%. If it is less than 85%, the identification of characters and image information recorded on the surface of the IC label becomes unclear, and the appearance is also undesirable. -Total light transmittance The IC label of the present invention has a wavelength 380 of light from the printing surface side.
Total light transmittance at 780 nm (JIS-K-71)
05) is 15% or less, preferably 13% or less. If it exceeds 15%, the internal IC circuit layer (B) is seen through, and the coloring of the concealing layer (E) provided as necessary is undesirably seen through. -Thickness The IC label of the present invention has a thickness of 150 µm to 2 mm, preferably 200 µm to 1 mm, more preferably 250 to 2 mm.
800 μm. If it is less than 150 μm, the strength is insufficient and the internal IC circuit layer (B) is easily broken, and if it exceeds 2 mm, the IC label is too stiff and difficult to handle.

[0042]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described more specifically with reference to the following examples, but the present invention is not limited to these examples. Table 1 shows the thermoplastic resin and the inorganic fine powder used in the present invention. [I] Production of Thermoplastic Resin Film Layer (A) (Production Example 1) Composition (A1) of propylene homopolymer a; 81% by weight, 3% by weight of high-density polyethylene and 16% by weight of calcium carbonate mixed at 270 ° C. After being kneaded with an extruder set at a temperature of, the mixture was extruded into a sheet and further cooled by a cooling device to obtain a non-stretched sheet. Then
After the sheet was heated again to a temperature of 150 ° C., it was stretched five times in the machine direction to obtain a five-fold machine-stretched film.

Propylene homopolymer b; 54% by weight;
Composition (A2) mixed with 46% by weight of calcium carbonate
Is kneaded at 210 ° C. by another extruder, and extruded into a sheet shape by a die, which is laminated on both sides of the 5-fold longitudinally stretched film obtained in the above step, and a laminated film having a three-layer structure is formed. Obtained. Next, after cooling the laminated film having the three-layer structure to a temperature of 60 ° C., it is heated again to a temperature of about 155 ° C., stretched 7.5 times in the transverse direction using a tenter, and stretched at a temperature of 165 ° C. Annealing treatment, cooling to a temperature of 60 ° C., slitting of the ears, and a three-layer structure (uniaxial stretching / biaxial stretching / uniaxial stretching) having a thickness of 60 μm (A2 / A1
/ A2 = 10 μm / 40 μm / 10 μm) with a whiteness of 96%, opacity of 87%, porosity of 32%,
A thermoplastic resin film having a density of 0.79 g / cm ³ was obtained.

(Production Example 2) Propylene homopolymer a; 6
A composition (A1) obtained by mixing 5% by weight, 10% by weight of high-density polyethylene and 25% by weight of calcium carbonate and a composition (A2) obtained by mixing 99% by weight of propylene homopolymer b and 1% by weight of titanium dioxide; Melt flow rate (MF
R: 230 ° C., 2.16 kg load) 100% by weight of polypropylene (melting point: about 164 to 167 ° C.) at 4 g / 10 min.
(A3) was converted to 2 by using three separate extruders.
The mixture was melt-kneaded at 50 ° C. Then, after supplying to one co-pressing die and laminating | stacking in a die (A2 / A1 / A3), it extruded in sheet shape and cooled to about 60 degreeC with the cooling roll, and obtained the laminated film.

After reheating this film to 145 ° C.
The film was stretched 5 times in the longitudinal direction by utilizing the peripheral speed difference between a number of roll groups, reheated again to about 150 ° C., and stretched 8.5 times in the transverse direction with a tenter. Then, after annealing at 160 ° C., it is cooled down to 60 ° C., and slits are formed in the ears to obtain a three-layer structure (biaxial stretching / biaxial stretching / biaxial stretching) having a thickness of 100 μm.
m (A2 / A1 / A3 = 3 μm / 94 μm / 3 μm) to obtain a thermoplastic resin film having a whiteness of 96%, an opacity of 90%, a porosity of 40%, and a density of 0.66 g / cm ³ . .

(Production Example 3) The same operation as in Production Example 1 was carried out, and a three-layer structure (uniaxial stretching / biaxial stretching / uniaxial stretching) having a thickness of 130 μm (A2 / A1 / A3 = 25 μm / 80 μm /
A thermoplastic resin film having a whiteness of 96%, an opacity of 92%, a porosity of 30%, and a density of 0.77 g / cm ³ was obtained.

[II] Production of IC Circuit Protection Layer (C) (Preparation Example 4) In Preparation Example 1, the die lip opening and the extrusion amount of the composition were adjusted, and the thickness was 300 μm (A2 / A1 / A).
2 = 60 μm / 180 μm / 60 μm) to obtain a thermoplastic resin film having a whiteness of 96%, an opacity of 99%, a porosity of 36%, and a density of 0.78 g / cm ³ .

(Production Example 5) Propylene homopolymer b; 9
7 parts by weight, a composition (A2) containing 3 parts by weight of calcium carbonate, and propylene homopolymer c; 98 parts by weight,
A composition (A1) containing 2 parts by weight of titanium dioxide,
After melt-kneading at a temperature of 220 ° C. in separate extruders, the mixture is supplied into one die, and (A2) / (A
1) / (A2), and extruded to obtain a white unstretched resin laminated film (a) having a three-layer structure (thickness:
60 μm / 160 μm / 60 μm).

While the white unstretched resin laminated film (a) obtained by extrusion from the die into the thermoplastic resin film obtained in Production Example 1 is still in a softened state, the unstretched resin laminated film is By thermally laminating (a), a thermoplastic resin film (60 μm thick)
/ Unstretched resin laminated film (a) (wall thickness 280 μm) /
A composite laminated resin film (thickness: 400 μm) of a thermoplastic resin film (thickness: 60 μm) was obtained. 94% whiteness, 90% opacity, 11% porosity, 0.86 g / cm ³ density
Met.

(Preparation Example 6) The lip opening of the die and the extrusion amount of the composition were adjusted in Preparation Example 5 to obtain a white unstretched resin laminated film (a) having a three-layer structure (thickness: 60 μm /
280 μm / 60 μm). The obtained unbonded product having a thickness of 400 μm has a whiteness of 25%, an opacity of 25%, and a porosity of 0%.
% And a density of 0.92 g / cm ³ .

[III] Production of IC circuit layer (B) (Production example 7) An electrolytic copper foil having a thickness of 35 μm is adhered to one surface of a polyimide film having a thickness of 50 μm with a bonding sheet, and an antenna circuit is formed by etching. did. After surface polishing, water washing and drying, an IC circuit (thickness 2
00 μm), and embed the surface with epoxy resin.
The C circuit layer (B) (thickness: 300 μm) was obtained. (Production Example 8) An antenna circuit was printed on one surface of a polyester film having a thickness of 125 µm by silk screen printing using an isocyanate-based solvent-based silver paste, dried with hot air, and then left in a constant temperature bath at 80 ° C for 3 hours. I took it out. Then, an IC circuit (thickness 200
μm) and the surface was embedded with an epoxy resin to obtain an IC circuit layer (B) (thickness: 375 μm).

[0052]

Example 1 The thermoplastic resin film layer (A) and the thermoplastic resin film obtained in Production Example 1 were used as the thermoplastic resin film layer (A ′), and the surface of the thermoplastic resin film layer (A) was The coating amount after drying the solvent-based paint composed of acrylic urethane-based resin and calcium carbonate is 1 g /
It was coated with a gravure coater so as to obtain a print layer of m ² . Gravure printing of characters and image information was performed on the printing layer, and black beta gravure printing (thickness: 2 μm) was performed on the opposite surface of the printing layer so that the black density was 1.65, to obtain a light shielding layer (E).

A polyester-based anchor coat agent (manufactured by Toyo Morton Co., Ltd .: AD) was used as an adhesive layer (D) on the light-shielding layer (E) of the thermoplastic resin film layer (A) and the thermoplastic resin film layer (A '). -503; trade name) 4 g / m ²
(Proportion of solid component) Coated, IC circuit layer (B) of Production Example 8
It crimped simultaneously to the surface and the opposite surface. Further, a solvent-based acrylic pressure-sensitive adhesive is applied to the silicon-treated surface of the release paper based on glassine paper with a comma coater so that the coated amount after drying is 8 g / m ^2, and the pressure-sensitive adhesive layer ( G). Next, the IC circuit layer (B) of the thermoplastic resin film layer (A ')
And the pressure-sensitive adhesive layer (G) is pressed against
E / D / B / D / A '/ G / release paper with release paper I
C label was obtained. The obtained IC label with release paper is
The release paper is peeled off before use. Physical properties measured by peeling the release paper were: thickness: 510 μm, whiteness: 90%.

Measurement of total light transmittance: total light transmittance (JIS) at a wavelength of 380 to 780 nm of light of an IC label.
-K-7105) was measured using a spectrophotometer (U-3310, manufactured by Hitachi, Ltd.). The total light transmittance was 6.0%. Printed surface visibility: The visibility of the printed IC label as viewed from the thermoplastic resin film layer (A) side was evaluated as follows, and the results are shown in Table 2 together with the above physical properties. ：: Characters and image information recorded on the surface of the IC label are clearly identified, and the internal IC circuit layer (B) is not seen through. Δ: Character or image information recorded on the surface of the IC label is unclear, or the internal IC circuit layer (B) is seen through. ×: The identification of characters and image information recorded on the surface of the IC label is unclear, and the internal IC circuit layer (B) is seen through.

[0055]

Example 2 A thermoplastic resin film layer (A) and the thermoplastic resin film obtained in Production Example 1 were used as the thermoplastic resin film layer (A '), and a print layer similar to that of Example 1 was formed. Separately, a transparent polyethylene terephthalate film (PET) (trade name: Lumirror # 25) manufactured by Toray Industries having a thickness of 23 μm is used as the thermoplastic resin film layer (F), and a polyurethane anchor coating agent (Toyo Morton ( Co., Ltd., EL-150: trade name) is applied so that the coating amount after drying is 1 g / m ^2, and after half-drying, the thickness is 1
An aluminum vapor-deposited layer having a thickness of 00 nm was provided as a light shielding layer (E).
As the adhesive layer (D), a polyester-based anchor coating agent (AD-503; trade name, manufactured by Toyo Morton Co., Ltd.) was used at a rate of 4 g / m ² (solid content). On the other hand, in the same manner as in Example 1, an adhesive layer (G) was formed. Next, in the same manner as in Example 1, printing / A / D / E / F / D / B / D / A '
/ G / IC label with release paper having a structure of release paper. An IC label with release paper was produced. Physical properties measured by peeling the release paper were: thickness: 540 μm, whiteness: 92%, and total light transmittance: 6.0%.

[0056]

Example 3 In Example 1, except that the thermoplastic resin film (A) used in Example 1 and the thermoplastic resin film (A ′) were changed to the 100 μm film obtained in Production Example 2, Printing / A / E /
An IC label with a release paper having a structure of D / B / D / A '/ G / release paper was prepared. Physical properties measured by peeling the release paper were: thickness: 590 μm, whiteness: 94%, and total light transmittance: 6.0%.

[0057]

Example 4 The thermoplastic resin film (A ′) was obtained from Example 3.
) Except for printing / A /
An IC label with a release paper having a structure of E / D / B / G / release paper was prepared. Physical properties measured by peeling the release paper were as follows: thickness: 490 μm, whiteness: 92%, total light transmittance: 6.
5%. Further, after peeling off the release paper, the adhesive was adhered to each other to obtain an airline tag.

[0058]

Example 5 Thermoplastic resin film obtained in Production Example 1
Acrylic urethane resin and carbonic acid on the surface of layer (A)
1 g of solvent-based paint made of calcium after drying
/ M ^TwoCoating with a gravure coater so that
And Separately, polyethylene terephthalate with a thickness of 23 μm
Film (PET) (Lumirror # 2, manufactured by Toray Industries, Inc.)
5) as thermoplastic resin film layers (F) and (A ')
Then, a black bed tag is applied to both sides so that the black density becomes 1.65.
Ravier printing (thickness 2μm) is applied to make the light shielding layer (E)
Was. Separately, the IC circuit of the IC circuit layer (B) of Production Example 7 and
The antenna circuit part is punched into a 35 mm square,
36 mm square on the IC circuit protective layer (C) obtained in Production Example 4
Punched holes were formed.

Next, on the thermoplastic resin film layer (F) and the light-hiding layer (E) on one side of (A '), a polyester-based anchor coating agent as an adhesive layer (D) was added at 4 g / m ² (solid content). %) Coated and punched out, crimped on one side of the IC circuit protective layer (C) obtained in Production Example 4, and A / D / E
/ F / E / D / C. Next, the IC circuit layer (B) of Production Example 7 was inserted into the punched hole portion of the IC circuit protective layer (C) opposite to the thermoplastic resin film layer (A), and the light-shielding layer (E) and the adhesive layer The adhesive layer (D) of the thermoplastic resin film layer (A ') provided with (D) is pressure-bonded, and A / D / E / F
/ E / D / B + C / D / E / A '/ E.

Next, a solvent-based acrylic pressure-sensitive adhesive was applied to the silicon-treated surface of the release paper made of glassine paper as a base material using a comma coater and dried so that the coated amount after drying was 20 g / m ^2. The pressure-sensitive adhesive layer (G) was pressure-bonded to the surface of the thermoplastic resin film layer (A ') opposite to the IC circuit layer (B) side. Next, punching into a size of 55 mm × 85 mm, offset printing of character and image information on a printing layer by a card printer, and printing / A / D / E / F / E / D /
An IC label having a structure of B + C / D / E / A '/ E / G / release paper was obtained. The obtained non-contact IC label with release paper is used after peeling off the release paper. The release paper was peeled off to evaluate various physical properties and visibility. The obtained IC label had a thickness of 445 μm, a whiteness of 90%, and a total light transmittance of 5.0%.

[0061]

Example 6 In Example 5, the thermoplastic resin film layer (A) used in Example 5 was replaced with 100% of the thermoplastic resin film layer obtained in Production Example 2.
print / A / D / E / F / E / D / B + C / D / E /
An IC label having a structure of A '/ E / G / release paper was prepared.
The release paper was peeled off to evaluate various physical properties and visibility. Table 2 shows the evaluation results.

[0062]

[Embodiment 7] In Embodiment 5, the IC used in Embodiment 5 is used.
The circuit protective layer (C) was changed to the composite laminated resin film of 400 μm obtained in Production Example 5, and the IC circuit layer (B) used in Example 5 was replaced with the polyester film base obtained in Production Example 8. Print / A / D / E / F / E / D / B + C / D / E / A 'in the same manner as in Example 5 except for the change.
An IC label having a structure of / E / G / release paper was produced. The release paper was peeled off to evaluate various physical properties and visibility. Table 2 shows the evaluation results.

[0063]

[Embodiment 8] In Embodiment 7, the IC used in Embodiment 7 is used.
Printing / A / D / E / F / E / D / B + C / in the same manner as in Example 7, except that the circuit protective layer (C) was changed to the 400 μm non-stretched resin laminated film obtained in Production Example 6. D /
An IC label having a structure of E / A '/ E / G / release paper was prepared. The release paper was peeled off to evaluate various physical properties and visibility. Table 2 shows the evaluation results.

[0064]

Example 9 In Example 8, 30% by weight of titanium oxide whisker was contained in the adhesive layer (D) as the light shielding layer (E) without using the thermoplastic resin film layers (F) and (A '). A two-part urethane-based adhesive is applied on one side of the thermoplastic resin film layer (A) with a comma coater so that the weight after drying is 50 g / m ² , and then the IC circuit layer is semi-dried. (B) Both sides were pressed and laminated. After leaving for 8 hours, the curing adhesion is completed, and printing / A / E + D / B + C / G
/ An IC label having a structure of release paper was produced. The release paper was peeled off to evaluate various physical properties and visibility. Table 2 shows the evaluation results. Further, after peeling off the release paper, the adhesive was adhered to each other to obtain an airline tag.

[0065]

Example 10 In Example 9, the adhesive layer (D) did not contain titanium oxide whiskers, and the black density was 1.65 on the surface opposite to the printed layer of the thermoplastic resin film layer (A). Black beta gravure printing (2 μm thickness) was performed to provide a light shielding layer (E) to obtain an IC label having a structure of printing / A / E / D / B + C / G / release paper. The release paper was peeled off to evaluate various physical properties and visibility. Table 2 shows the evaluation results.
Further, after peeling off the release paper, the adhesive was adhered to each other to obtain an airline tag.

[0066]

Comparative Example 1 The procedure of Example 9 was repeated, except that the adhesive layer (D) did not contain titanium oxide whiskers.
An IC label having a structure of print / A / D / B + C / G / release paper was prepared. The release paper was peeled off to evaluate various physical properties and visibility. Table 2 shows the evaluation results.

[0067]

[Table 1]

[0068]

[Table 2]

[0069]

According to the present invention, information can be recorded on the surface, there is no security concern that the internal IC circuit and wiring circuit can be seen through, and the strength and water resistance are excellent. Regardless, it can be used in air or water, and can be used for frozen food containers, industrial products, various chemical containers, distribution management applications, manufacturing process management applications, etc.
A C-label was obtained.

 ──────────────────────────────────────────────────の Continued on the front page F term (reference) 2C005 MA02 MA06 MA09 MA10 MA11 MA12 MA19 MB10 NA08 NB03 NB06 NB07 NB09 NB22 NB27 PA03 PA04 PA14 PA18 PA20 PA21 PA22 PA29 RA03 RA06 RA07 RA11 RA12 RA16 RA22 RA23 5B035 AA07 BA03 BB09

Claims (19)

[Claims] 1. A thermoplastic resin film layer (A) on at least one surface of an IC circuit layer (B) or an IC circuit protection layer (C) including the IC circuit layer (B) via an adhesive layer (D).
An IC label formed by laminating and laminating an adhesive layer (G) on one side. 2. The IC according to claim 1, wherein the IC circuit layer (B) is smaller than the IC label, and the thickness of the IC circuit layer (B) is less than the thickness of the IC circuit protection layer (C).
label. 3. The IC label according to claim 1, wherein a light shielding layer (E) is provided on at least one side of the IC circuit layer (B) or at least one side of the IC circuit protection layer (C). 4. A thermoplastic resin film layer (F) and an adhesive layer (D) are provided between the light shielding layer (E), the IC circuit layer (B) or the IC circuit protective layer (C). 4. The IC label according to any one of claims 1 to 3. 5. The whiteness degree is 85% or more.
The IC label according to any one of the above. 6. The IC label according to claim 1, wherein the total light transmittance is 15% or less. 7. The method according to claim 1, wherein the thermoplastic resin film layer (A) has an opacity of 80% or more and a whiteness of 90% or more.
C label. 8. The thermoplastic resin film layer (A) has a porosity calculated by the following equation of 10 to 60%.
The IC label according to any one of the above. Porosity (%) = [(ρ ₀ −ρ) / ρ ₀ ] × 100 (where ρ ₀ is the true density of the film and ρ is the density of the film.) 9. The thermoplastic resin used for the thermoplastic resin film layer (A) and / or the IC circuit protective layer (C),
9. The IC label according to claim 1, which is a polyolefin resin and / or a polyester resin. 10. The IC label according to claim 9, wherein the polyolefin resin is a propylene resin. 11. The method according to claim 1, wherein a recording layer is provided on the surface of the thermoplastic resin film layer (A).
C label. 12. The I according to claim 1, wherein
Aviation tag using C label. 13. The whiteness degree is 85% or more.
Or the IC label according to 12. 14. The IC label according to claim 11, which has a total light transmittance of 15% or less. 15. The IC according to claim 11, wherein the thermoplastic resin film layer (A) has an opacity of 80% or more and a whiteness of 90% or more. label. 16. The thermoplastic resin film layer (A) has a porosity calculated by the following equation of 10 to 60%.
16. The IC label according to any one of items 15 to 15. Porosity (%) = [(ρ ₀ −ρ) / ρ ₀ ] × 100 (where ρ ₀ is the true density of the film and ρ is the density of the film.) 17. The method according to claim 11, wherein the thermoplastic resin used for the thermoplastic resin film layer (A) and the IC circuit protective layer (C) is a polyolefin resin and / or a polyester resin. The described IC label. 18. The IC label according to claim 17, wherein the polyolefin resin is a propylene resin. 19. The IC label according to claim 11, wherein a recording layer is provided on the surface of the thermoplastic resin film layer (A).