1357125 九、發明說明 【發明所屬之技術領域】 本發明係關於配載著ic晶片之非接觸式固體識別 置，尤其關於具有優良信賴性的1C標籤及1C標籤薄片 關。 【先前技術】 φ 近年來，利用1C標籤之非接觸式個體識別系統， 作爲用以管理物品之生命週期全體的系統，而在製造、 流、販賣、再回收之所有業態中受到注目。尤其是，利 UHF波或微波之電波方式的1C標籤，係因爲藉由於1C 片裝設外部天線之構造而具有數公尺之通信距離之特徵 而受到注目，現在以大量商品之物流管理、製造物歷程 理、以及安全管理等爲目的而進行系統的構築。包含利 13.56MHz頻帶之電磁感應方式的1C標籤在內，利用該 鲁之實証實驗持續在服裝、家電、航空、出版、農業等之 業界實施進行，且已經於服裝等之部份業界中實施實用 此外’例如’日立製作所股份有限公司開發出將於 背面各形成1個外部電極的1C晶片（以下，稱爲兩面 極晶片），夾入於激發縫隙型雙極天線之構造（參照曰 特開2004- 1 27230號公報）。具有激發縫隙之雙極天線 造，藉由改變該縫隙之寬度及長度，可以整合天線之阻 及1C晶片之輸入阻抗，而得到良好之通信特性。 裝 相 係 物 用 晶 > 管 用 等 各 化 表 電 本 構 抗 -5- 1357125 【發明內容】 對於爲了以使用ic標籤之非接觸式個體識別系統來 實現大量商品之物流及物品管理來說，必須於各商品逐一 裝設1C標籤。因此，可以低成本本大量生產1C標籤之技 術及使1C標籤容易裝設於各種形狀之技術成爲不可或缺 的技術。關於以低成本大量生產1C標籤之技術方面，本 發明者已提出1C標籤製造之中間形態之用以連接1C晶片 及天線之被稱爲1C標籤核心標籤之構造及其製造方法。 另一方面’ 1C標籤之裝設方面，必須選擇適合各種 物品之形狀及材質之1C標籤來實施裝設。現在之一般的 1C標籤，係利用聚氯乙烯及聚對苯二甲酸乙二酯（PET) 等之有機樹脂薄膜成型成卡片狀者、加工於紙標籤者、或 成型成配合熱可塑性樹脂及熱硬化性樹脂等之用途之形狀 者等’通常係利用細繩或粘著劑等裝設於被附著體、或裝 入捆包箱中。 尤其是’裝設1C標籤之面爲球面時及被附著體爲布 等之容易變形的素材時’若1C標籤本身會接觸到人體， 則要求1C標籤應具有柔軟性。具有柔軟性之IC標籤，如 以彈性體等之具有柔軟性樹脂所成型者，一般而言，該等 通常係以使用模具等之成型加工來進行製造。利用模具成 型之1C標籤之製造方法，例如，實施下側之樹脂層之成 型並將1C標籤核心標籤固定於其上後，再實施上側之樹 脂層之成型之方法。依據上述方法，可以將1C標籤完全 封入於樹脂層’而可得到耐水性等之良好信賴度。然而， 1357125 因爲下側之樹脂層及上側之樹脂層係分別成型，必須將 1C標籤核心標籤逐一插入等，故生產性會顯著降低，而 增加加工費用，亦即，有1C標籤成本較高之問題。此外 ，利用形成複數個1C標籤核心標籤之薄片時，因爲薄片 之端面露出於1C標籤表面，可能導致1C標籤之耐水性等 的信賴性降低。 本發明有鑑於前述問題，藉由具有以具柔軟性且1C Φ標籤核心標籤之端面未露出之樹脂完全覆蓋之構造，可高 效率製造且低成本提供之高信賴性的1C標籤及1C標籤薄 片。 亦即，本發明如以下所示。 1、一種1C標籤薄片，係由複數個無線通信用1C晶 片、藉由連接前述1C晶片之複數收送訊天線基板所構成 之1C標籤核心標籤、以及形成於前述1C標籤核心標籤之 表背面之熱可塑性樹脂層所構成的1C標籤薄片，其特徵 Φ爲藉由具有： (a) 製作形成有複數個前述1C標籤核心標籤的1C 標籤核心標籤薄片的步驟； (b) 將前述1C標籤核心標籤薄片暫時固定於第1熱 可塑性樹脂薄片的步驟； (c) 僅將暫時固定於前述第1熱可塑性樹脂薄片上 的前述1C標籤核心標籤薄片之1C標籤核心標籤部以預定 之大小分離成島狀，並剝離除去不要部份的步驟；以及 (d )以利用第2熱可塑性樹脂薄片與前述第1熱可 1357125 塑性樹脂薄片夾持前述1C標籤入口之方式，重疊前述第 2熱可塑性樹脂薄片，並進行熱壓的步驟之1C標鐵薄片 的製造法製造而成。 2、 如第1項所記載之1C標籤薄片，其中，前述第1 熱可塑性樹脂薄片及第2熱可塑性樹脂薄片係長條形。 3、 如第1或2項所記載之1C標籤薄片，其中，前述 熱可塑性樹脂層係由選自苯乙烯•丁二烯系、聚烯系、胺 甲酸乙酯系、聚酯系、聚醯胺系、聚矽氧系中任一樹脂的 樹脂所構成。 4、 如第1〜3項中任一項所記載之1C標籤薄片，其 中，前述熱可塑性樹脂層係彈性體。 5' —種1C標籤，係由無線通信用1C晶片、由連接 有前述1C晶片之收送訊天線基板所構成之1C標籤核心標 籤、以及形成於前述1C標籤核心標籤之表背面之熱可塑 性樹脂層所構成的1C標籤，其特徵爲藉由具有： (a) 製作形成有複數個前述1C標籤核心標籤之1C標籤 核心標籤薄片的步驟； (b) 將前述1C標籤核心標籤薄片暫時固定於第1熱可塑 性樹脂薄片的步驟； (c) 僅將暫時固定於前述第1熱可塑性樹脂薄片上之前 述1C標籤核心標籤薄片的1C標籤核心標籤部以預定之大 小分離成島狀，並剝離除去不要部份之步驟； (d) 以利用第2熱可塑性樹脂薄片與前述第1熱可塑性 樹脂薄片夾持前述1C標籤核心標籤之方式，重疊前述第 -8 - 1357125 2熱可塑性樹脂薄片，並進行熱壓之步驟；以及 (e)將前述1C標籤薄片的前述1C標籤核心標籤部，以 大於在前述（c)之步驟中分離成島狀之大小之方式進行 切斷的步驟之1C標籤薄片的製造法製造而成。 6、 如第5項所記載之1C標籤，其中，前述第1熱可 塑性樹脂薄片及第2熱可塑性樹脂薄片係長條形。 7、 如第5或6項所記載之1C標籤，其中，前述熱可 鲁塑性樹脂層係由選自苯乙烯•丁二烯系、聚烯系、胺甲酸 乙酯系、聚酯系、聚醯胺系、聚矽氧系中任一之樹脂的樹 脂所構成。 8、 如第5〜7項之其中任一項所記載之1C標籤，其 中，前述熱可塑性樹脂層係彈性體。 依據本發明，可以得到以下之效果。由無線通信用 1C晶片、藉由連接前述1C晶片之收送訊天線基板所構成 之1C標籤核心標籤、以及形成於前述1C標籤核心標籤之 Φ表背面的熱可塑性樹脂層所構成，具有柔軟性且1C標籤 核心標籤之端面未露出，並利用樹脂完全覆蓋之構造，藉 此可高效率製造且低成本提供的高信賴性的1C標籤及1C 標籤薄片。 【實施方式】 本發明之1C標籤薄片係由複數之無線通信用1C晶片 、藉由連接前述1C晶片之複數之收送訊天線基板所構成 之1C標籤核心標籤、以及由形成於前述1C標籤核心標籤 -9- 1357125 之表背面之熱可塑性樹脂層所構成之ic標籤薄片。本 明之1C標籤係由無線通信用1C晶片、藉由連接前述 晶片之收送訊天線基板所構成之1C標籤核心標籤、以 形成於前述1C標籤核心標籤之表背面之熱可塑性樹脂 所構成之1C標籤。 以下，參照圖面，針對本發明之實施形態進行詳細 明。此外，以下之實施形態係例示，本發明並未受限於 等實施形態。第1圖〜第8圖係本發明之1C標籤及1C 籤薄片之製造方法之一例。 第1圖係由複數個無線通信用1C晶片1 0及連接前 1C晶片之複數收送訊用天線基板11所構成之1C標籤 心標籤12，連續形成於PET薄膜13上之1C標籤核心 籤薄片。1C標籤核心標籤薄片之形狀亦可以爲長條形》 第2圖係表示將第1熱可塑性樹脂薄片14暫時固 於第1圖之1C標籤核心標籤薄片之步驟者。作爲暫時 定之方法，亦可以利用熱可塑性樹脂薄片表面的粘著性 或者，亦可加熱至溶融溫度附近之溫度，其後，再實施 輕易剝離之程度之壓附。 第3圖係表示於暫時固定著前述第1熱可塑性樹脂 片之1C標籤核心標籤薄片的1C標籤核心標籤部周圍， 僅切斷1C標籤核心標籤薄片之方式輕輕地壓附切刃， 將1C標籤核心標籤分離成島狀之狀態。 第4圖係表示將暫時固定著前述第1熱可塑性樹脂 片之1C標籤核心標籤薄片之不要部份之端面之一部份 發 1C 及 層 說 該 標 述 核 標 定 固 可 薄 以 而 薄 進 -10 - 1357125 行剝離而向上拉來進行剝離除去的步驟者。 第5圖係是將第2熱可塑性樹脂薄片16以夾持核心 標籤之方式重疊於第1熱可塑性樹脂薄片的步驟。 第6圖係揭示於第5圖的步驟後，實施熱壓使熱可塑 性樹脂薄片彼此融結所得之1C標籤薄片。熱可塑性樹脂 薄片之形狀亦可以爲長條形，此時，可以得到長條形之 1C標籤薄片。爲了防止1C標籤薄片內發生氣泡，熱壓以 φ在真空下實施爲佳。加熱溫度係熱可塑性樹脂薄片之溶融 溫度附近，壓力則只要IC標籤核心標籤不會破損且第1 熱可塑性樹脂薄片與第2熱可塑性樹脂薄片之間可得到充 份之密著力之範圍即可。 第7圖係揭示將第6圖之1C標籤薄片的1C標籤核心 標籤部切斷成大於第3圖及第4圖之步驟中分離成之島狀 大小的步驟與利用該步驟所得之1C標籤。切斷成大於分 離成之島狀之大小的理由，係爲了防止從1C標籤核心標 φ籤之端面露出。藉由使1C標籤核心標籤完全被封入樹脂 內，1C標籤之側面爲第1熱可塑性樹脂薄片及第2熱可 塑性樹脂薄片所溶融之層所覆蓋，故可防止水分之浸入及 1C標籤核心標籤與第1及第2熱可塑性樹脂薄片之界面 之剝離等，因而可得到良好之信賴性。 第8圖係揭示1C標籤核心標籤薄片及熱可塑性樹脂 薄片爲長條形時之1C標籤薄片之連續製造方法。首先， 利用暫時壓附頭1 8將長條形之1C標籤核心標籤薄片1 7 暫時固定A於第1長條形之熱可塑性樹脂薄片19上。其 -11 - 1357125 次，以切斷刃20壓附第1長條形之熱可塑性樹脂薄片19 上之1C標籤核心標籤薄片17進行切斷B，將1C標籤核 心標籤分離成島狀後。剝離並捲取1C標籤核心標籤薄片 之不必要部份。此外，於分離成島狀之1C標籤核心標籤 上重疊第2長條形之熱可塑性樹脂薄片21，並以壓附頭 22實施熱壓C。藉由此方式，可以連續地製造1C標籤核 心標籤薄片23。 本發明所使用之熱可塑性樹脂層或熱可塑性樹脂薄片 φ ，可以爲苯乙烯·丁二烯系、聚烯系、胺甲酸乙酯系、聚 酯系、聚醯胺系、聚矽氧系當中之其中任一者，以具有柔 軟性之彈性體爲佳。 實施例 首先，製作如第1圖所示之1C標籤核心標籤薄片。 1C標籤核心標籤係於寬度70mm、長度3 20mm之PET薄 膜上以6.35mm間距形成50個，鋁之收送訊天線係寬度 擊 爲2.5mm、長度爲48mm。1C晶片係利用（株）日立製作 所製之[# -chip]。 將該1C標籤核心標籤薄片重疊於寬度100mm、長度 3 50mm、厚度0.5mm之胺甲酸乙酯系彈性體薄片上，實施 120°C、lkgf/cm2、20秒之冲壓，進行暫時固定。其後， 如第4圖所示，以形成1C標籤核心標籤薄片之1C標籤核 心標籤之周圍寬度4mm、長度50mm之形狀且只切斷薄片 之方式輕輕壓附切斷刃，將1C標籤核心標籤分離成島狀 -12- 1357125 。此外’將1C標籤核心標籤薄片之端部之—部份向上拉 取進行剝離，剝離除去1C標籤核心標籤薄片之不要部份 整體。 此外，將與前述相同大小之另一胺甲酸乙酯系彈性體 薄片以夾持核心標籤之方式進行重疊，並實施熱壓。冲壓 條件爲 120°C、10kgf/cm2、20 秒。 將利用此方式所得到之1C標籤薄片，如第7圖所示 ^ ，切成1C標籤核心標籤之周圍爲寬度 6.35mm、長度 6 0mm之大小，而得到50個之1C標籤核心標籤之端面未 露出之完全被樹脂覆蓋之1C標籤》 由無線通信用1C晶片、由連接前述1C晶片之收送訊 天線基板所構成之1C標籤核心標籤、以及形成於前述1C 標籤核心標籤之表背面之熱可塑性樹脂層所構成，並且具 有具柔軟性且1C標籤核心標籤之端面未露出，被樹脂完 全覆蓋的構造，藉此可良好效率製造且低成本提供有良信 φ賴性的1C標籤及1C標籤薄片。 【圖式簡單說明】 第1圖係揭示本發明之1C標籤核心標籤薄片之一例 的圖。 第2圖係揭示本發明之1C標籤及1C標籤薄片的製造 步驟之一例的圖。 第3圖係揭示本發明之1C標籤及1C標籤薄片的製造 步驟之一例的圖 -13- 1357125 第4圖係揭示本發明之ic標籤及 步驟之一例的圖。 第5圖係揭示本發明之ic標籤及 步驟之一例的圖。 第6圖係揭示本發明之1C標籤薄 第7圖係揭示本發明之1C標籤之 第8圖係揭示本發明之1C標籤| 【主要元件符號說明】 10 : 1C晶片 11 :收送訊用天線基板 12 : 1C標籤核心標籤 13 : PET薄膜 第1熱可塑性樹脂薄片 1 5 :不要部份 16:第2熱可塑性樹脂薄片 17 : 1C標籤核心標籤薄片 18 :暫時壓著頭 1 9 :第1長條形之熱可塑性樹脂 2〇 :切斷刃 2 1 :第2長條形之熱可塑性樹脂 22 :壓附頭 23 : 1C標籤核心標籤薄片 1C標籤薄片的製造 1C標籤薄片的製造 片之一例的圖。 一例的圖。 片之製造方法的圖 片 片 -14-1357125 IX. Description of the Invention [Technical Field] The present invention relates to a non-contact solid identification device equipped with an ic wafer, and more particularly to a 1C tag and a 1C tag sheet having excellent reliability. [Prior Art] φ In recent years, the non-contact type individual identification system using the 1C tag has been attracting attention in all the formats of manufacturing, streaming, selling, and recycling as a system for managing the entire life cycle of articles. In particular, the 1C tag of the UHF wave or the microwave wave type is attracting attention because of the communication distance of several meters by the structure of the external antenna installed in the 1C piece, and now it is managed and manufactured by a large number of products. The system is constructed for the purpose of material history and safety management. The 1C tag, which includes the electromagnetic induction method in the 13.56 MHz band, has been continuously implemented in the clothing, home appliances, aviation, publishing, agriculture, etc., and has been implemented in some industries such as clothing. In addition, for example, Hitachi, Ltd. has developed a 1C wafer (hereinafter referred to as a double-sided wafer) in which one external electrode is formed on the back surface, and is sandwiched between the excitation slit type dipole antennas (see 曰特开 2004). - 1 27230). By creating a dipole antenna with an excitation gap, by changing the width and length of the slit, it is possible to integrate the impedance of the antenna and the input impedance of the 1C chip to obtain good communication characteristics. For the phase and the management of a large number of commodities for the use of the non-contact individual identification system using the ic tag, A 1C label must be installed one by one for each item. Therefore, the technology for mass production of 1C labels at a low cost and the technique for easily mounting 1C labels in various shapes are indispensable technologies. Regarding the technology for mass-producing 1C tags at a low cost, the inventors have proposed a structure called a 1C tag core tag for connecting a 1C chip and an antenna in an intermediate form of 1C tag manufacturing, and a method of manufacturing the same. On the other hand, in terms of the installation of 1C tags, it is necessary to select a 1C tag suitable for the shape and material of various articles. The current 1C label is formed by forming an organic resin film such as polyvinyl chloride or polyethylene terephthalate (PET) into a card, processed on a paper label, or molded into a thermoplastic resin and heat. The shape or the like of the use of the curable resin or the like is usually attached to the adherend by a string or an adhesive or the like, or is placed in a packing box. In particular, when the surface on which the 1C label is attached is a spherical surface and the object to be attached is a material that is easily deformed, such as cloth, the 1C label is required to have flexibility if the 1C label itself comes into contact with the human body. The flexible IC tag is molded by a flexible resin such as an elastomer. Generally, these are usually produced by molding using a mold or the like. A method of manufacturing a 1C label formed by a mold, for example, a method of forming a resin layer on the lower side and fixing a 1C label core label thereto, and then forming a resin layer on the upper side. According to the above method, the 1C label can be completely sealed in the resin layer', and good reliability such as water resistance can be obtained. However, since the resin layer on the lower side and the resin layer on the upper side are separately molded, it is necessary to insert the 1C label core labels one by one, so that the productivity is remarkably lowered, and the processing cost is increased, that is, the cost of the 1C label is high. problem. Further, when a sheet in which a plurality of 1C label core labels are formed is used, since the end surface of the sheet is exposed on the surface of the 1C label, reliability such as water resistance of the 1C label may be lowered. In view of the above problems, the present invention provides a highly reliable 1C label and 1C label sheet which can be efficiently manufactured and provided at low cost by having a structure in which a resin having a flexible end face of a 1C Φ label core label is not completely covered. . That is, the present invention is as follows. A 1C label sheet comprising a plurality of 1C chips for wireless communication, a 1C label core label formed by a plurality of receiving antenna substrates connected to the 1C chip, and a back surface formed on the front surface of the 1C label core label. The 1C label sheet composed of the thermoplastic resin layer is characterized in that: (a) a step of forming a 1C label core label sheet in which a plurality of the 1C label core labels are formed; (b) the aforementioned 1C label core label a step of temporarily fixing the sheet to the first thermoplastic resin sheet; (c) separating only the 1C label core label portion of the 1C label core label sheet temporarily fixed to the first thermoplastic resin sheet into an island shape by a predetermined size; And removing the unnecessary portion from the portion; and (d) overlapping the second thermoplastic resin sheet so that the first thermoplastic resin sheet and the first heat-resistant 1357125 plastic resin sheet are sandwiched between the 1C label inlets, and It is manufactured by the manufacturing method of 1C standard iron sheet which performs the hot-pressing process. 2. The 1C label sheet according to the item 1, wherein the first thermoplastic resin sheet and the second thermoplastic resin sheet are elongated. The 1C label sheet according to the first or second aspect, wherein the thermoplastic resin layer is selected from the group consisting of styrene butadiene, polyolefin, urethane, polyester, and polyfluorene. It is composed of a resin of any of an amine-based or polyoxygen-based resin. The 1C label sheet according to any one of the items 1 to 3, wherein the thermoplastic resin layer is an elastomer. 5'-type 1C tag is a 1C chip for wireless communication, a 1C tag core tag composed of a receiving antenna substrate to which the 1C chip is connected, and a thermoplastic resin formed on the back surface of the 1C tag core tag. The 1C label formed by the layer is characterized in that: (a) a step of forming a 1C label core label sheet on which a plurality of the 1C label core labels are formed; (b) temporarily fixing the 1C label core label sheet to the first (1) a step of forming a thermoplastic resin sheet; (c) separating only the 1C label core label portion of the 1C label core label sheet temporarily fixed on the first thermoplastic resin sheet into an island shape by a predetermined size, and peeling off the unnecessary portion (d) The thermoplastic resin sheet of -8 - 1357125 2 is superposed on the first thermoplastic resin sheet and the first thermoplastic resin sheet is sandwiched between the first and second thermoplastic resin sheets, and hot pressed. And (e) separating the aforementioned 1C label core label portion of the 1C label sheet by an amount larger than an island shape in the step (c) The method of manufacturing the 1C label sheet in which the cutting step is performed is carried out. The 1C label according to the item 5, wherein the first thermoplastic resin sheet and the second thermoplastic resin sheet are elongated. 7. The 1C label according to Item 5 or 6, wherein the thermorubber plastic resin layer is selected from the group consisting of styrene butadiene, polyolefin, urethane, polyester, and poly It is composed of a resin of any of a guanamine-based or polyoxynene-based resin. The 1C label according to any one of the items 5 to 7, wherein the thermoplastic resin layer is an elastomer. According to the present invention, the following effects can be obtained. The 1C chip for wireless communication, the 1C label core label formed by connecting the receiving antenna substrate of the 1C chip, and the thermoplastic resin layer formed on the back surface of the Φ surface of the 1C label core label, and having flexibility Moreover, the end surface of the 1C label core label is not exposed, and the structure is completely covered with the resin, whereby the highly reliable 1C label and the 1C label sheet which are efficiently manufactured and provided at low cost can be manufactured. [Embodiment] The 1C label sheet of the present invention is composed of a plurality of 1C chips for wireless communication, a 1C label core label formed by a plurality of receiving and transmitting antenna substrates connected to the 1C chip, and a 1C label core formed by the 1C label core. Label -9- 1357125 The ic label sheet composed of the thermoplastic resin layer on the back of the watch. The 1C tag of the present invention is a 1C chip for wireless communication, a 1C tag core tag composed of a receiving antenna substrate to which the wafer is connected, and a 1C formed of a thermoplastic resin formed on the front and back surfaces of the 1C tag core tag. label. Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Further, the following embodiments are exemplified, and the present invention is not limited to the embodiments. Figs. 1 to 8 are examples of a method of manufacturing a 1C label and a 1C label sheet of the present invention. The first drawing is a 1C label core label 12 composed of a plurality of 1C wafers 10 for wireless communication and a plurality of receiving and receiving antenna substrates 11 connected to the front 1C wafer, and 1C label core sheets continuously formed on the PET film 13. . The 1C label core label sheet may have a long strip shape. Fig. 2 is a view showing a step of temporarily fixing the first thermoplastic resin sheet 14 to the 1C label core label sheet of Fig. 1 . As a temporary method, the surface of the thermoplastic resin sheet may be adhered or heated to a temperature near the melting temperature, and thereafter, the pressure may be easily peeled off. Fig. 3 is a view showing the periphery of the 1C label core label portion of the 1C label core label sheet in which the first thermoplastic resin sheet is temporarily fixed, and the cutting edge is gently pressed only by cutting the 1C label core label sheet. The label core label is separated into an island state. Figure 4 is a view showing a part of the end face of the unnecessary portion of the 1C-label core label sheet on which the first thermoplastic resin sheet is temporarily fixed, and the layer is said to be thin and thin. 10 - 1357125 The line is peeled off and pulled up for the step of peeling off. Fig. 5 is a step of superposing the second thermoplastic resin sheet 16 on the first thermoplastic resin sheet so as to sandwich the core label. Fig. 6 is a view showing a 1C label sheet obtained by hot pressing to fuse the thermoplastic resin sheets to each other after the step of Fig. 5. The shape of the thermoplastic resin sheet may also be elongated, and in this case, a long strip of 1C label sheet can be obtained. In order to prevent air bubbles from occurring in the 1C label sheet, it is preferred that the hot pressing be performed under vacuum in φ. The heating temperature is in the vicinity of the melting temperature of the thermoplastic resin sheet, and the pressure may be such that the IC label core label is not damaged and a sufficient range of adhesion between the first thermoplastic resin sheet and the second thermoplastic resin sheet can be obtained. Fig. 7 is a view showing a step of cutting the 1C-label core label portion of the 1C label sheet of Fig. 6 to be larger than the island shape separated in the steps of Figs. 3 and 4, and the 1C label obtained by the step. The reason for cutting into a larger size than the island shape is to prevent exposure from the end face of the 1C label core mark φ. By completely enclosing the 1C label core label in the resin, the side surface of the 1C label is covered by the layer in which the first thermoplastic resin sheet and the second thermoplastic resin sheet are melted, thereby preventing moisture intrusion and the 1C label core label and Since the interface between the first and second thermoplastic resin sheets is peeled off, etc., good reliability can be obtained. Fig. 8 is a view showing a continuous manufacturing method of a 1C label sheet in which a 1C label core label sheet and a thermoplastic resin sheet are elongated. First, the elongated 1C-label core label sheet 17 is temporarily fixed to the first elongated thermoplastic resin sheet 19 by the temporary pressing head 18. In the case of -11 - 1357,125, the 1C label core label sheet 17 on the first elongated thermoplastic resin sheet 19 is pressed by the cutting blade 20 to cut B, and the 1C label core label is separated into island shapes. Strip and wind up unnecessary parts of the 1C label core label sheet. Further, the second elongated thermoplastic resin sheet 21 is superposed on the 1C label core label separated into islands, and the hot press C is applied by the press head 22. In this way, the 1C label core label sheet 23 can be continuously manufactured. The thermoplastic resin layer or the thermoplastic resin sheet φ used in the present invention may be a styrene-butadiene-based, a polyolefin-based, a urethane-based, a polyester-based, a polyamide-based or a polyoxynene system. Any of them is preferably a flexible elastomer. EXAMPLES First, a 1C label core label sheet as shown in Fig. 1 was produced. The 1C label core label is formed on a PET film having a width of 70 mm and a length of 20 mm at a pitch of 6.35 mm, and the aluminum receiving and transmitting antenna has a width of 2.5 mm and a length of 48 mm. The 1C wafer system is manufactured by Hitachi, Ltd. [# -chip]. The 1C label core label sheet was placed on an urethane-based elastomer sheet having a width of 100 mm, a length of 3 50 mm, and a thickness of 0.5 mm, and was pressed at 120 ° C, lkgf/cm 2 , and 20 seconds to be temporarily fixed. Then, as shown in Fig. 4, the 1C label core is lightly pressed by the shape of the 1C label core label forming the 1C label core label sheet having a width of 4 mm and a length of 50 mm and cutting the sheet only. The label is separated into islands -12- 1357125. Further, the portion of the end portion of the 1C-label core label sheet was pulled up and peeled off, and the unnecessary portion of the 1C-label core label sheet was peeled off. Further, another urethane-based elastomer sheet of the same size as described above was superposed by sandwiching the core label, and hot pressing was performed. The stamping conditions are 120 ° C, 10 kgf / cm 2 , 20 seconds. The 1C label sheet obtained by this method is cut into a width of 6.35 mm and a length of 60 mm around the core label of the 1C label as shown in Fig. 7, and the end faces of 50 1C label core labels are not obtained. The exposed 1C label completely covered by the resin, the 1C chip for wireless communication, the 1C label core label composed of the receiving antenna substrate to which the 1C chip is connected, and the thermoplasticity formed on the back surface of the 1C label core label The resin layer is formed of a resin, and has a structure in which the end surface of the 1C-label core label is not exposed and is completely covered with the resin. This makes it possible to manufacture the 1C label and the 1C label sheet with good reliability and low cost. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing an example of a 1C label core label sheet of the present invention. Fig. 2 is a view showing an example of a manufacturing procedure of the 1C label and the 1C label sheet of the present invention. Fig. 3 is a view showing an example of a manufacturing procedure of the 1C label and the 1C label sheet of the present invention. Fig. 13 - 1357125 Fig. 4 is a view showing an example of an ic label and a step of the present invention. Fig. 5 is a view showing an example of an ic label and a step of the present invention. Fig. 6 is a view showing a 1C label thin film of the present invention. Fig. 8 is a view showing a 1C label of the present invention. The 1C label of the present invention is disclosed. [Main element symbol description] 10 : 1C wafer 11 : receiving and transmitting antenna Substrate 12 : 1C label core label 13 : PET film first thermoplastic resin sheet 1 5 : unnecessary portion 16: second thermoplastic resin sheet 17 : 1C label core label sheet 18 : temporary pressing head 1 9 : first long Strip-shaped thermoplastic resin 2〇: Cutting blade 2 1 : 2nd strip-shaped thermoplastic resin 22 : Pressing head 23 : 1C label core label sheet 1C label sheet manufacturing 1C label sheet manufacturing sheet Figure. An example of a picture. Picture of the manufacturing method of the sheet -14-