200824033 九、發明說明 【發明所屬之技術領域】 本發明係關於配載著1C晶片之非接觸式固體識別裝 置，尤其是，與具有優良信賴度之1C標籤及1C標籤薄片 相關。 【先前技術】 近年來，利用1C標籤之非接觸式個體識別系統，被 當做用以管理物品之生命週期全體之系統使用，而受到製 造、物流、販賣、再循環之所有業態的重視。尤其是，利 用UHF波或微波之電波方式之1C標籤，藉由於1C晶片 裝設外部天線之構造而具有數公尺之通信距離之特徵，受 到各業的矚目，而不斷地構築以大量商品之物流管理、製 造物歷程管理、以及安全管理等爲目的之系統。包含利用 13.5 6MHz頻帶之電磁感應方式之1C標籤在內，利用該等 之實証實驗持續在服裝、家電、航空、出版、農業等之各 業界實施，且已經於服裝等之部份業界實施實用化。 此外，例如，株式會社日立製作所開發出將表背面各 形成1個外部電極之1C晶片（以下，稱爲兩面電極晶片 )夾於激發縫隙型雙極天線之構造（參照日本特開2004-1 2 7 2 3 0號公報）。具有激發縫隙之雙極天線構造，藉由 改變該縫隙之寬度及長度，可以整合天線之阻抗及1C晶 片之輸入阻抗，而得到良好之通信特性。 200824033 【發明內容】 爲了以利用1C標籤之非接觸式個體_ 大量商品之物流及物品管理，必須於各商 1C標籤。因此，可以低成本本大量生產1C 使1C標籤容易裝設於各種形狀之技術成爲 術。以低成本大量生產1C標籤之技術方面 提出1C標籲製造之中間形態之用以連結1C 被稱爲1C標籤入口之構造及其製造方法。 另一方面，1C標籤之裝設方面，必須 物品之形狀及材質之1C標籤來實施裝設。 IC標籤，係利用氯乙烯及聚對酞酸乙二酯 機樹脂薄膜成型成卡片狀者、加工於紙標籲 配合熱塑性樹脂及熱硬化性樹脂等之用途之 常係利用細繩或粘著劑等裝設於被附著體、 中〇 尤其是，裝設1C標籤之面爲球面且被 之容易變形之素材時，若1C標籤本身會接 要求1C標籤應具有柔軟性。具有柔軟性之 彈性體等之具有柔軟性樹脂所成型者，一般 常係以使用模具等之成型加工來進行製造。 之1C標籤之製造方法，例如，實施下側之 並將ic標鑛入口固定於其上後，再實施上 成型之方法。依據上述方法，可以將1C標 樹脂層，而可得到耐水性等之良好信賴度。 ;別系統來實現 品之逐一裝設 標籤之技術及 不可或缺的技 ，本發明者已 晶片及天線之 選擇適合各種 現在之一般的 (PET )等之有 者、或成型成 形狀者等，通 或裝入捆包箱 附著體爲布等 觸到人體’則 1C標籤，如以 而言，該等通 利用模具成型 樹脂層之成型 側之樹脂層之 籤完全封入於 然而，因爲下 -5- 200824033 側之樹脂層及上側之樹脂層係分別成型，必須將1c標 入口逐一插入等，故生產性會顯著降低，而增加加工費 ，亦即，有1C標籤成本較高之問題。此外，利用形成 數個1C標籤入口之薄片時，因爲薄片之端面露出於1c 籤表面，可能導致1C標籤之耐水性等之信賴度降低。 本發明有鑑於前述問題，藉由具有以具柔軟性且 標籤入口之端面未露出之樹脂完全覆蓋之構造，提供可 良好效率及低成本製造之高信賴度之1C標籤及1C標籤 片。 亦即，本發明如以下所示。 1、係由複數之無線通信用1C晶片、由連結著前 1C晶片之複數之傳送及接收天線基板所構成之1C標籤 口、以及由形成於前述1C標籤入口之表背面之熱塑性 脂層所構成之1C標籤薄片，其特徵爲： 利用具有： (a) 用以製作形成著複數之前述1C標籤入口之 標籤入口薄片之製程； (b) 將前述1C標籤入口薄片暫時固定於第1熱塑 樹脂薄片之製程； (c) 只將暫時固定於前述第1熱塑性樹脂薄片上 前述1C標籤入口薄片之1C標籤入口部以既定之大小分 成島狀並剝離除去不要部份之製程；以及 (d )以第2熱塑性樹脂薄片及前述第1熱塑性樹 薄片夾持前述1C標籤入口之方式，重疊前述第2熱塑 籤 用 複 標 1C 以 薄 述 入 樹 1C 性 之 離 脂 性 -6 - 200824033 樹脂薄片並進行熱壓之製程； 之1C標籤薄片之製造法所製造。 2、 如申請專利範圍第1項所記載之IC標籤薄片，其 中，前述第1熱塑性樹脂薄片及第2熱塑性樹脂薄片係長 條形。 3、 如申請專利範圍第1或2項所記載之I c標籤薄片 ，其中，前述熱塑性樹脂層係由從苯乙烯·丁二烯系、聚 烯系、胺甲酸乙酯系、聚酯系、聚醯胺系、矽系當中之其 中任一之樹脂所選擇之樹脂所構成。 4、 如申g靑專利軺圍％ 1〜3項之其中任一'項所記載之 I C標籤薄片，其中，前述熱塑性樹脂層係彈性體。 5、 係由無線通信用IC晶片、由連結著前述I c晶片 之之傳送及接收天線基板所構成之IC標籤入口、以及由 形成於前述1C標籤入口之表背面之熱塑性樹脂層所構成 之1C標籤，其特徵爲：利用具有：（a )用以製作形成著 複數之前述1C標籤入口之1C標籤入口薄片之製程；（b )將前述1C標籤入口薄片暫時固定於第1熱塑性樹脂薄 片之製程；（c )只將暫時固定於前述第1熱塑性樹脂薄 片上之前述1C標籤入口薄片之1C標籤入口部以既定之大 小分離成島狀並剝離除去不要部份之製程；（d )以第2 熱塑性樹脂薄片及前述第1熱塑性樹脂薄片夾持前述1C 標籤入口之方式，重疊前述第2熱塑性樹脂薄片並進行熱 壓之製程；以及（e)將前述1C標籤薄片之前述1C標籤 入口部以大於前述（c )之製程分離成島狀之大小之方式 -7- 200824033 進行切斷之製程；之1C標籤之製造法所製造。 6、 如申請專利範圍第5項所記載之ic標籤，其中， 前述第1熱塑性樹脂薄片及第2熱塑性樹脂薄片係長條形 〇 7、 如申請專利範圍第5或6項所記載之1C標籤，其 中’則述熱塑性樹脂層係由從苯乙烯·丁二烯系、聚烯系 、胺甲酸乙酯系、聚酯系、聚醯胺系、矽系當中之其中任 一之樹脂所選擇之樹脂所構成。 8、 如申請專利範圍第5〜7項之其中任一項所記載之 I C標籤，其中，前述熱塑性樹脂層係彈性體。 依據本發明，可以得到以下之效果。藉由由無線通信 用1C晶片、由連結著前述1C晶片之傳送及接收天線基板 所構成之1C標籤入口、以及由形成於前述1C標籤入口之 表背面之熱塑性樹脂層所構成之具柔軟性且IC標籤入口 之端面未露出之樹脂完全覆蓋之構造，可以提供可以良好 效率及低成本製造之高信賴度之IC標籤及1C標籤薄片。 【實施方式】 本發明之1C標籤薄片係由複數之無線通信用1C晶片 、由連結著前述1C晶片之複數之傳送及接收天線基板所 構成之1C標籤入口、以及由形成於前述IC標籤入口之表 背面之熱塑性樹脂層所構成之1C標籤薄片。本發明之IC 標籤係由無線通信用IC晶片、由連結著前述IC晶片之傳 送及接收天線基板所構成之1C標籤入口、以及由形成於 -8- 200824033 前述1C標籲入口之表背面之熱塑性樹脂層所構成之1C標 籤。 以下，參照圖面，針對本發明之實施形態進行詳細說 明。此外，以下之實施形態係例示，本發明並未受限於該 等實施形態。第1圖〜第8圖係本發明之1C標籤及1C標 籤薄片之製造方法之一例。 第1圖係由複數之無線通信用1C晶片1 0及由連結著 前述1C晶片之複數之傳送及接收用天線基板1 1所構成之 1C標籤入口 12連續形成於PET薄膜13上之1C標籤入口 薄片。1C標籬入口薄片之形狀亦可以爲長條形。 第2圖係將第1熱塑性樹脂薄片14暫時固定於第1 圖之1C標籤入口薄片之製程。暫時固定之方法，亦可以 利用熱塑性樹脂薄片表面之粘著性，或者，亦可加熱至溶 融溫度附近之溫度，其後，再實施可輕易剝離之程度之壓 附。 第3圖係於暫時固定著前述第1熱塑性樹脂薄片之 1C標籤入口薄片之1C標籁入口部之周圍，以只切斷1C 標籤入口薄片之方式輕輕地壓附切刃，而將1C標籤入口 分離成島狀之狀態。 第4圖係將暫時固定著前述第1熱塑性樹脂薄片之 1C標籤入口薄片之不要部份之端面之一部份向上拉取進 行剝離之剝離除去製程。 第5圖係將第2熱塑性樹脂薄片1 6以夾持入口之方 式重疊於第1熱塑性樹脂薄片之製程。 -9- 200824033 第6圖係於第5圖之製程後，實施熱壓使熱塑性樹脂 薄片彼此融結而得到之1C標籤薄片。熱塑性樹脂薄片之 形狀亦可以爲長條形，此時，可以得到長條形之1C標籤 薄片。爲了防止1C標籤薄片內發生氣泡，熱壓以在真空 下實施爲佳。加熱溫度係熱塑性樹脂薄片之溶融溫度附近 ，壓力則只要1C標籤入口不會破損且第1熱塑性樹脂薄 片及第2熱塑性樹脂薄片之間可得到充份之密著力之範圍 即可。 第7圖係將第6圖之1C標籤薄片之1C標籤入口部切 斷成大於第3圖及第4圖之製程所分離成之島狀大小之切 斷製程及利用該製程所得到之1C標籤。切斷成大於分離 成之島狀之大小的理由，係爲了防止從1C標籤入口之端 面露出。藉由使1C標籤入口完全被封入樹脂內，1C標籤 之側面爲第1熱塑性樹脂薄片及第2熱塑性樹脂薄片所溶 融之層所覆蓋，故可防止水分之浸入及1C標籤入口與第 1及第2熱塑性樹脂薄片之界面之剝離等，因而可得到良 好之信賴度。 第8圖係1C標籤入口薄片及熱塑性樹脂薄片爲長條 形時之1C標籤薄片之連續製造方法。首先，利用暫時壓 附頭18將長條形之1C標籤入口薄片17暫時固定A於第 1長條形之熱塑性樹脂薄片1 9上。其次，以切刃20壓附 第1長條形之熱塑性樹脂薄片19上之1C標籤入口薄片 17進行切斷B，將1C標籤入口分離成島狀後。剝離並捲 取1C標籤入口薄片之不必要部份。此外，於分離成島狀 -10- 200824033 之1C標籤入口上重疊第2長條形之熱塑性樹脂薄片21， 並以壓附頭2 2實施熱壓C。藉由此方式，可以連續地製 造1C標籤入口薄片23。 本發明所使用之熱塑性樹脂層或熱塑性樹脂薄片，可 以爲苯乙烯·丁二烯系、聚烯系、胺甲酸乙酯系、聚酯系 、聚醯胺系、矽系當中之其中任一者，以具有柔軟性之彈 性體爲佳。 實施例 首先，製作如第1圖所示之1C標籤入口薄片。1C標 籤入口係於寬度 70mm、長度 320mm之 PET薄膜上以 6.3 5mm間距形成5 0個，鋁之傳送及接收天線係寬度爲 2.5mm、長度爲48mm。1C晶片係利用（株）日立製作所 製之[// -chip]。 將該1C標籤入口薄片重疊於寬度100mm、長度 3 5 0mm、厚度0.5mm之胺甲酸乙酯系彈性體薄片上，實施 120°C、lkgf/cm2、20秒之冲壓，進行暫時固定。其後， 如第4圖所示，以形成1C標籤入口薄片之1C標籤入口之 周圍寬度4mm、長度50mm之形狀且只切斷薄片之方式輕 輕壓附切刃，將1C標籤入口分離成島狀。此外，將1C標 籤入口薄片之端部之一部份向上拉取進行剝離，剝離除去 1C標籤入口薄片之不要部份之全體。 此外，將與前述相同大小之另一胺甲酸乙酯系彈性體 薄片以夾持入口之方式進行重疊’並實施熱壓。冲壓條件 -11 - 200824033 爲 120。。、10kgf/cm2、20 秒。 將利用此方式所得到之1C標籤薄片，如第7圖所示 ，切成1C標籤入口之周圍爲寬度6.35mm、長度60mm之 大小，而得到50個之1C標籤入口之端面未露出之完全被 樹脂覆蓋之1C標籤。 可以提供由無線通信用IC晶片、由連結著前述I C晶 片之汾傳送及接收天線基板所構成之1C標籤入口、以及 由形成於前述IC標籤入口之表背面之熱塑性樹脂層所構 成，並且具有具柔軟性且1C標籤入口之端面未露出之被 樹脂完全覆蓋之構造之可以良好效率及低成本製造之高信 賴度之1C標籤及1C標籤薄片。 【圖式簡單說明】 第1圖係本發明之1C標籤入口薄片之一例圖。 第2圖係本發明之1C標籤及1C標籤薄片之製造製程 之一例圖。 第3圖係本發明之1C標籤及1C標籟薄片之製造製程 之一例圖。 第4圖係本發明之1C標籤及1C標籤薄片之製造製程 之一例圖。 第5圖係本發明之1C標籤及1C標籤薄片之製造製程 之一例圖。 第6圖係本發明之I C標籤薄片之一例圖。 第7圖係本發明之1C標籤之一例圖。 -12- 200824033 第8圖係本發明之1C標籤薄片之製造方法圖。 【主要元件符號說明】 10 : 1C晶片 1 1 :傳送及接收用天線基板 12 : 1C標籤入口 13 ： PET薄膜 1 4 :第1熱塑性樹脂薄片 1 5 :不要部份 1 6 :第2熱塑性樹脂薄片 17 : 1C標籤入口薄片 1 8 :暫時壓著頭 1 9 :第1長條形之熱塑性樹脂薄片 2 0 :切刃 2 1 :第2長條形之熱塑性樹脂薄片 22 :壓附頭 23 : 1C標籤入口薄片 -13-BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact solid identification device equipped with a 1C wafer, and more particularly to a 1C tag and a 1C tag sheet having excellent reliability. [Prior Art] In recent years, the non-contact type individual identification system using the 1C tag has been used as a system for managing the entire life cycle of articles, and has been paid attention to by all the formats of manufacturing, logistics, sales, and recycling. In particular, the 1C tag using the UHF wave or the microwave wave method has a feature of a communication distance of several meters due to the structure of the external antenna mounted on the 1C chip, and has been attracting attention from various industries, and has been continuously constructed with a large number of products. A system for logistics management, manufacturing process management, and safety management. Including the 1C label of the electromagnetic induction method using the 13.5 6MHz band, the empirical experiments have been carried out in various industries such as clothing, home appliances, aviation, publishing, and agriculture, and have been put into practical use in some industries such as clothing. . In addition, for example, Hitachi, Ltd. has developed a structure in which a 1C wafer (hereinafter referred to as a double-sided electrode wafer) in which one external electrode is formed on the back surface of the front surface is sandwiched between the excitation slit type dipole antennas (see Japanese Patent Laid-Open No. 2004-1 2). Bulletin 7 2 3 0). A dipole antenna structure having an excitation slit can be integrated with the impedance of the antenna and the input impedance of the 1C wafer by changing the width and length of the slit to obtain good communication characteristics. 200824033 [Description of the Invention] In order to manage the logistics and items of a large number of products using the 1C tag, it is necessary to label each business with 1C. Therefore, it is possible to mass-produce 1C at a low cost and to make the 1C label easy to install in various shapes. The technical aspect of mass production of 1C tags at low cost proposes a structure in which an intermediate form of 1C standard manufacturing is used to connect 1C to a 1C tag inlet and a manufacturing method thereof. On the other hand, in terms of the installation of the 1C label, the 1C label of the shape and material of the article must be installed. The IC tag is formed by using a resin film of vinyl chloride and a polyethylene terephthalate resin film to form a card, and is used for the use of a paper mark, a thermoplastic resin, a thermosetting resin, etc., using a string or an adhesive. When the 1C label itself is connected to the 1C label, it should be flexible if it is mounted on the attached body or the middle, especially if the surface on which the 1C label is mounted is spherical. A molded resin having a flexible elastomer or the like is usually produced by molding using a mold or the like. For the method of manufacturing the 1C label, for example, after the lower side is applied and the ic standard ore inlet is fixed thereto, the upper molding method is carried out. According to the above method, the 1C standard resin layer can be obtained, and good reliability such as water resistance can be obtained. The system of the inventors has selected the chip and the antenna to be suitable for all kinds of general (PET) or the like, or formed into a shape, etc., in order to realize the technology of labeling one by one and the indispensable technology. The 1C label is attached to the body of the packing box for the cloth or the like, and the label of the resin layer on the molding side of the mold-forming resin layer is completely enclosed, however, because - 200824033 The resin layer on the side and the resin layer on the upper side are separately molded, and the 1c standard inlet must be inserted one by one, so that the productivity is remarkably lowered, and the processing cost is increased, that is, the cost of the 1C label is high. Further, when a sheet having a plurality of 1C label inlets is used, since the end surface of the sheet is exposed on the surface of the 1c label, the reliability of the water resistance of the 1C label or the like may be lowered. In view of the above problems, the present invention provides a 1C label and a 1C label sheet which are highly reliable and can be manufactured with high efficiency and low cost by having a structure which is completely covered with a resin which is not exposed to the end surface of the label inlet. That is, the present invention is as follows. 1. A 1C chip for wireless communication, a 1C tag port composed of a plurality of transmission and reception antenna substrates connected to a front 1C chip, and a thermoplastic resin layer formed on the back surface of the 1C tag inlet. The 1C label sheet is characterized by: (a) a process for producing a label inlet sheet forming a plurality of the 1C label inlets; (b) temporarily fixing the 1C label inlet sheet to the first thermoplastic resin (c) a process in which the 1C label inlet portion of the 1C label inlet sheet temporarily fixed to the first thermoplastic resin sheet is divided into islands by a predetermined size and stripped of the unnecessary portion; and (d) The second thermoplastic resin sheet and the first thermoplastic tree sheet are sandwiched between the 1C label inlets, and the second thermoplastic labeling reference 1C is superimposed to introduce the resin-removing grease -6 - 200824033 resin sheet. Hot pressing process; manufactured by the manufacturing method of 1C label sheet. 2. The IC label sheet according to the first aspect of the invention, wherein the first thermoplastic resin sheet and the second thermoplastic resin sheet are elongated. The Ic label sheet according to the first or second aspect of the invention, wherein the thermoplastic resin layer is derived from a styrene-butadiene-based, a polyolefin-based, an urethane-based, or a polyester-based, A resin selected from the group consisting of a polyamine or a lanthanide resin. 4. The I C label sheet according to any one of the items 1 to 3, wherein the thermoplastic resin layer is an elastomer. 5. An IC chip for wireless communication, an IC tag inlet formed of a transmission and reception antenna substrate to which the IC chip is connected, and a 1C composed of a thermoplastic resin layer formed on the front and back surfaces of the 1C tag inlet. The label is characterized in that: (a) a process for producing a 1C label inlet sheet forming a plurality of the 1C label inlets; (b) a process of temporarily fixing the 1C label inlet sheet to the first thermoplastic resin sheet (c) only the 1C label inlet portion of the 1C label inlet sheet temporarily fixed to the first thermoplastic resin sheet is separated into an island shape by a predetermined size and peeled off the unnecessary portion; (d) the second thermoplastic a resin sheet and the first thermoplastic resin sheet sandwiching the 1C label inlet, superimposing the second thermoplastic resin sheet and performing a hot pressing process; and (e) making the 1C label inlet portion of the 1C label sheet larger than the foregoing (c) The process of separating into the size of an island -7-200824033 The process of cutting is performed; the manufacturing method of the 1C label. 6. The ic label according to the fifth aspect of the invention, wherein the first thermoplastic resin sheet and the second thermoplastic resin sheet are elongated strips 7 and the 1C label according to claim 5 or 6 of the patent application, The thermoplastic resin layer is a resin selected from the group consisting of styrene-butadiene-based, polyene-based, urethane-based, polyester-based, polyamidiamine-based, and fluorene-based resins. Composition. The I C label according to any one of claims 5 to 7, wherein the thermoplastic resin layer is an elastomer. According to the present invention, the following effects can be obtained. It is softened by a 1C chip for wireless communication, a 1C tag inlet formed of a transmission and reception antenna substrate to which the 1C chip is connected, and a thermoplastic resin layer formed on the front and back surfaces of the 1C tag inlet. The structure in which the end face of the IC tag inlet is not completely covered with the resin can provide a highly reliable IC tag and a 1C label sheet which can be manufactured with good efficiency and low cost. [Embodiment] The 1C label sheet of the present invention is composed of a plurality of 1C chips for wireless communication, a 1C tag inlet formed of a plurality of transmission and reception antenna substrates to which the 1C chips are connected, and an inlet formed at the IC tag. A 1C label sheet composed of a thermoplastic resin layer on the back side of the watch. The IC tag of the present invention is a semiconductor chip for wireless communication, a 1C tag inlet formed of a transmitting and receiving antenna substrate to which the IC chip is bonded, and a thermoplastic formed on the back surface of the surface formed by the above-mentioned 1C mark of -8-200824033 1C label composed of a resin layer. Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Further, the following embodiments are exemplified, and the present invention is not limited to the embodiments. Figs. 1 to 8 are diagrams showing an example of a method for producing a 1C label and a 1C label sheet of the present invention. The first drawing is a 1C label entry in which a plurality of 1C wafers 10 for wireless communication and a 1C label inlet 12 composed of a plurality of transmission and reception antenna substrates 11 connected to the 1C wafer are continuously formed on the PET film 13. Sheet. The shape of the 1C fence inlet sheet may also be elongated. Fig. 2 is a process for temporarily fixing the first thermoplastic resin sheet 14 to the 1C label inlet sheet of Fig. 1 . The temporary fixing method may also utilize the adhesion of the surface of the thermoplastic resin sheet, or may be heated to a temperature near the melting temperature, and thereafter, the pressure can be easily peeled off. Fig. 3 is a view showing the periphery of the 1C label entrance portion of the 1C label inlet sheet in which the first thermoplastic resin sheet is temporarily fixed, and the cutting edge is gently pressed to cut only the 1C label inlet sheet, and the 1C label is attached. The inlet is separated into an island state. Fig. 4 is a peeling removal process in which a part of the end face of the unnecessary portion of the 1C label inlet sheet of the first thermoplastic resin sheet is temporarily pulled up and peeled off. Fig. 5 is a view showing a process in which the second thermoplastic resin sheet 16 is superposed on the first thermoplastic resin sheet by sandwiching the inlet. -9- 200824033 Fig. 6 is a 1C label sheet obtained by hot pressing to fuse thermoplastic resin sheets to each other after the process of Fig. 5. The shape of the thermoplastic resin sheet may also be elongated, and in this case, a long strip of 1C label sheet can be obtained. In order to prevent bubbles from occurring in the 1C label sheet, hot pressing is preferably performed under vacuum. The heating temperature is in the vicinity of the melting temperature of the thermoplastic resin sheet, and the pressure may be such that the 1C label inlet is not damaged and a sufficient range of adhesion between the first thermoplastic resin sheet and the second thermoplastic resin sheet is obtained. Fig. 7 is a cutting process for cutting the 1C label entrance portion of the 1C label sheet of Fig. 6 to be larger than the island size separated by the processes of Figs. 3 and 4, and the 1C label obtained by the process. . The reason for cutting into a size larger than the island shape to be separated is to prevent exposure from the end face of the 1C label inlet. By completely enclosing the 1C label inlet in the resin, the side surface of the 1C label is covered by the layer in which the first thermoplastic resin sheet and the second thermoplastic resin sheet are melted, thereby preventing moisture intrusion and the 1C label inlet and the first and the third. 2 The peeling of the interface of the thermoplastic resin sheet and the like can provide a good reliability. Fig. 8 is a view showing a continuous manufacturing method of a 1C label sheet in which a 1C label inlet sheet and a thermoplastic resin sheet are elongated. First, the elongated 1C label inlet sheet 17 is temporarily fixed to the first elongated thermoplastic resin sheet 19 by the temporary pressing head 18. Then, the 1C label inlet sheet 17 on the thermoplastic resin sheet 19 of the first elongated shape is pressed by the cutting edge 20 to cut B, and the 1C label inlet is separated into an island shape. Strip and roll up the unnecessary portion of the 1C label entry sheet. Further, the second elongated thermoplastic resin sheet 21 is superposed on the 1C label inlet separated into islands -10- 200824033, and the hot pressing C is performed by the press head 2 2 . In this way, the 1C label inlet sheet 23 can be continuously produced. The thermoplastic resin layer or the thermoplastic resin sheet used in the present invention may be any one of a styrene-butadiene-based, a polyolefin-based, an urethane-based, a polyester-based, a polyamide-based, and a fluorene-based system. It is preferred to have a soft elastomer. EXAMPLES First, a 1C label inlet sheet as shown in Fig. 1 was produced. The 1C label entrance is formed on a PET film having a width of 70 mm and a length of 320 mm at a pitch of 6.3 5 mm, and the aluminum transmission and reception antenna has a width of 2.5 mm and a length of 48 mm. The 1C wafer system is manufactured by Hitachi, Ltd. [//-chip]. The 1C label inlet sheet was placed on an urethane-based elastomer sheet having a width of 100 mm, a length of 350 mm, and a thickness of 0.5 mm, and was pressed at 120 ° C, lkgf/cm 2 , and 20 seconds to be temporarily fixed. Then, as shown in Fig. 4, the 1C label inlet is separated into islands by gently pressing the cutting edge so that the 1C label inlet of the 1C label inlet sheet has a width of 4 mm and a length of 50 mm and cuts only the sheet. . Further, one portion of the end portion of the 1C label inlet sheet was pulled up and peeled off, and the entire portion of the unnecessary portion of the 1C label inlet sheet was peeled off. Further, another urethane-based elastomer sheet having the same size as described above was laminated so as to sandwich the inlet, and hot pressing was performed. Stamping conditions -11 - 200824033 is 120. . , 10kgf / cm2, 20 seconds. The 1C label sheet obtained by this method is cut into a width of 6.35 mm and a length of 60 mm around the entrance of the 1C label as shown in Fig. 7, and the end surface of the 50 1C label entrance is not completely exposed. 1C label covered with resin. The IC chip for wireless communication, the 1C tag inlet formed by the transfer and reception antenna substrate to which the IC chip is connected, and the thermoplastic resin layer formed on the front and back surfaces of the IC tag inlet can be provided, and have A highly reliable 1C label and 1C label sheet which are flexible and have a structure in which the end surface of the 1C label inlet is not exposed and completely covered by the resin, which can be manufactured with good efficiency and low cost. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing an example of a 1C label inlet sheet of the present invention. Fig. 2 is a view showing an example of a manufacturing process of the 1C label and the 1C label sheet of the present invention. Fig. 3 is a view showing an example of a manufacturing process of the 1C label and the 1C standard sheet of the present invention. Fig. 4 is a view showing an example of a manufacturing process of the 1C label and the 1C label sheet of the present invention. Fig. 5 is a view showing an example of a manufacturing process of the 1C label and the 1C label sheet of the present invention. Fig. 6 is a view showing an example of an I C label sheet of the present invention. Fig. 7 is a view showing an example of the 1C tag of the present invention. -12- 200824033 Fig. 8 is a view showing a method of manufacturing the 1C label sheet of the present invention. [Description of main component symbols] 10 : 1C wafer 1 1 : Antenna substrate for transmission and reception 12 : 1C label inlet 13 : PET film 1 4 : 1st thermoplastic resin sheet 1 5 : Unavoidable part 1 6 : 2nd thermoplastic resin sheet 17 : 1 C label inlet sheet 1 8 : Temporary pressing head 1 9 : First elongated thermoplastic resin sheet 2 0 : Cutting edge 2 1 : 2nd elongated thermoplastic resin sheet 22 : Pressing head 23 : 1C Label entry sheet-13-