JP4542855B2 - Laminated body for IC wristband, method for producing the same, and IC wristband - Google Patents

Description

  The present invention relates to an IC wristband laminate for producing an IC wristband used for the management of hospitalized patients, and a method for manufacturing the same. Further, the present invention relates to an IC wristband produced from the wristband laminate.

  In order to prevent inpatients from being mixed up, wristbands with identification data such as name, age, blood type, etc. may be attached to the wrists and ankles of inpatients. As a wristband for that purpose, for example, a surface base material and a back surface base material on which the surface can be printed are integrated to form a band hole (see Patent Documents 1 and 2). Although this wristband may be wound around the ankle or the like, it is generally attached to the wrist, so it will be referred to as a “wristband” for convenience in this specification.

In recent years, a wristband equipped with an IC chip (IC wristband) has been attached to inpatients, and not only inpatient identification data, but also medical information histories such as examination histories and medication histories are written to the wristbands as needed. A medical information management system for managing medical information has been proposed (see, for example, Patent Document 3).
JP 2001-137017 A JP 2003-164307 A Japanese Patent Laid-Open No. 2004-046582

For the purpose of preventing medical errors and improving medical efficiency, the medical information management system as described above is expected to become more widespread in the future. In that case, although a significant increase in demand for IC wristbands is expected, a wristband that can be easily manufactured and is suitable for mass production and a manufacturing method thereof have not been known.
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a laminate for an IC wristband that can be easily manufactured and is suitable for mass production, a manufacturing method thereof, and an IC wristband.

The laminated body for an IC wristband of the present invention is such that an information recording base material in which an IC inlet is attached to an outer surface base material through an adhesive layer when the IC wristband is used, and a back surface base material are bonded. Integrated through the agent layer,
An incision for contouring a wristband having a predetermined shape including an IC inlet is formed.
In the laminated body for an IC wristband of the present invention, it is preferable that an embossed layer having an embossed surface is provided on the surface of the back substrate opposite to the adhesive layer side.
In the laminated body for IC wristband of the present invention, the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer is preferably an emulsion-type pressure-sensitive adhesive, and the adhesive constituting the adhesive layer is preferably a solventless adhesive.
The IC wristband of the present invention is obtained by cutting along the notch from the above-described IC wristband laminate.
The method for producing a laminate for an IC wristband of the present invention is as follows:
A coating step of forming an adhesive layer by applying an adhesive on one surface of the IC inlet,
IC inlet laminate manufacturing process for obtaining an IC inlet laminate by bonding an IC inlet to release paper by the adhesive layer;
The IC inlet peeling the IC inlet from the release paper of the laminate, peeled through the IC inlet adhesive layer, the information recording substrates bonded to wear on one side of the surface substrate to be outside when using the IC wristband IC inlet pasting process to produce
A back substrate pasting step for obtaining a laminated body with an IC by pasting a back substrate through an adhesive to the surface of the information recording substrate on the IC inlet pasting side;
It has a notch formation process which forms the notch which outlines the wristband of a predetermined shape provided with IC inlet in a layered product with IC.
In the manufacturing method of the laminated body for IC wristbands of the present invention, it is preferable to apply an adhesive in advance on one side of the back substrate before the back substrate attaching step.
In the method for producing a laminate for an IC wristband of the present invention, the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer is preferably an emulsion-type pressure-sensitive adhesive, and the adhesive constituting the adhesive layer is preferably a solventless adhesive. .
In addition, although the wristband in this invention is usually wound around a wrist, it is a concept including the case where it is wound around an ankle.

The laminated body for IC wristband and the IC wristband of the present invention can be easily manufactured and are suitable for mass production.
According to the method for producing a laminate for IC wristband of the present invention, the laminate for IC wristband can be easily produced, and mass production is possible.

One embodiment of the laminate for an IC wristband of the present invention will be described.
1 and 2 are views showing an IC wristband laminate of the present embodiment. In this IC wristband laminate 1, an information recording base material 10 in which an IC inlet 12 is attached to a front surface base material 11 via a first adhesive layer 13 and a back surface base material 20 are second. And a notch 41 that outlines a wristband 40 having a predetermined shape provided with the IC inlet 12 is formed. Moreover, the embossing layer 50 in which the embossing was formed is provided in the surface 21 on the opposite side to the 2nd adhesive agent layer 30 side of the back surface base material 20. FIG.

(Information recording substrate)
[Surface substrate]
Although it does not restrict | limit especially as the surface base material 11, In order to print identification data, such as a hospitalized patient's name, what has printability, such as a thermal transfer printing, thermal printing, inkjet printing, a laser marking, at least one side is preferable. . In order to impart printability, a recording layer corresponding to each printing method may be provided on the surface.
Moreover, since water and chemicals may adhere when using an IC wristband, the surface base material 11 is preferably provided with water resistance, oil resistance, and chemical resistance. Examples of those having water resistance, oil resistance, and chemical resistance include plastic films and synthetic paper made of polyethylene terephthalate, polypropylene, polyethylene, ethylene-vinyl acetate copolymer (EVA), polyurethane, and the like. Furthermore, examples of the synthetic paper include those formed by biaxially stretching polypropylene, polyethylene terephthalate, etc. to form a large number of microvoids (Yupo, etc.). Among these, those using synthetic paper made of polypropylene are preferable because they have printability, water resistance, oil resistance, chemical resistance, and high tensile strength. More preferably, a stretchable material is convenient.
The thickness of the surface substrate 11 is preferably 50 to 300 μm.
Further, the surface base material 11 may be printed in advance.

[IC inlet]
The IC inlet 12 includes a circuit element having an IC and an antenna connected to the circuit element. As shown in FIG. 3, the IC inlet of the present embodiment is a film having an inlet base 12a and a circuit element 12b, and the circuit element 12b is electrically connected to the semiconductor (IC) chip 12c and the IC chip 12c. And a planar antenna 12d formed in a loop shape for transmitting and receiving information connected to each other. The thickness of the IC inlet 12b is preferably 20 to 100 μm.

The IC chip 12c used for the IC inlet 12 is compatible with a carrier frequency of 13.56 MHz, 2.45 GHz, UHF band, a vertical and horizontal length of 0.5 to 10 mm, and a thickness of about 50 to 300 μm. Is used.
Specifically, as the IC chip 12c, (1) an electronic circuit is formed on a silicon wafer by using a technique such as lithography and doping, ground to a predetermined thickness, a connection terminal is formed, and a predetermined chip size is obtained. (2) Dicing processed (bare chip), (2) Bare chip is connected to a metal plate (lead frame) in which a terminal portion is formed on a metal plate such as stainless steel or 4,2 alloy by wire bonding or the like, and gold An example is a packaged chip in which an epoxy resin is encapsulated and then heat-cured and molded after being placed in a mold.
In the bear chip, the terminals are formed by protruding terminals (bumps) by gold plating, solder plating, or the like at the connection terminal portion in the bear chip. In the packaged chip, the terminal of the bare chip and the terminal of the lead frame are connected by a gold wire or the like.
Examples of such IC chip 12c include those sold by Infineon, such as MCC 1-1-2 (bear chip) and MCC 2-2-1 (packaged chip).
The IC chip 12c preferably has a security function from the viewpoint of protecting personal information.
A plurality of IC chips 12c may be provided in one IC wristband.

The antenna 12d in the IC inlet 12 is formed by (1) an etching method, (2) a winding method, or the like.
(1) Etching method: A copper foil or aluminum foil having a thickness of 10 to 50 μm is bonded via a hot melt adhesive having a melting point of about 100 ° C. to 150 ° C., and a resist layer having a thickness of several μm is obtained by a method such as gravure printing. Provide on it. Next, the antenna pattern is exposed with a block film to remove an unnecessary resist layer, and then an unnecessary metal foil layer is removed by etching. Thereafter, the substrate is immersed in an alkaline solution to remove the resist layer, thereby forming an antenna pattern.
(2) Winding method: A copper wire having a diameter of 80 to 200 μm is continuously sent out from a heated nozzle, and at least a part of the copper wire is embedded in the film so as to form a loop-shaped antenna pattern.
By such an antenna formation method, a metal foil or a metal wire is wired on the inlet base 12a to form the antenna 12d.

  When a loop antenna is formed by the above antenna forming method, an antenna terminal to which the IC chip 12c is connected is often arranged inside the loop antenna. In that case, in order to connect the loop antenna and the antenna terminal, a lead wire is provided on the back side of the film (the surface on which the antenna and the antenna terminal are not formed), and the lead wire and the antenna or the antenna terminal are crimped and connected. To do.

  As a method of connecting the connection terminal of the IC chip 12c and the terminal of the antenna 12d, when the IC chip 12c is a bare chip, (1) a wire bonding method in which a terminal portion is directly connected by a gold wire, and (2) an antenna connection part A flip chip bonding method in which an ACF (anisotropic conductive film) or ACP (anisotropic conductive paste) is bonded to the IC chip, and an IC chip 12c is disposed thereon, and the terminal portion is made conductive by heating and pressing at about 200 ° C. Etc. can be adopted. Here, ACF and ACP are particles in which fine particles of gold and silver are dispersed in a resin and are not normally conductive, but are conductive when pressed and brought into contact with each other.

[First adhesive layer]
As the adhesive constituting the first adhesive layer 13, a known adhesive or pressure-sensitive adhesive can be used. Among them, an adhesive is preferable because an information recording substrate can be produced using an auto labeler, and production efficiency is further increased. As the pressure-sensitive adhesive, for example, rubber-based, acrylic-based, vinyl ether-based, silicone-based, urethane-based emulsion type, solvent type, and hot-melt type pressure-sensitive adhesives can be used. The pressure-sensitive adhesive may contain additives such as a tackifier. Furthermore, among the pressure-sensitive adhesives, an emulsion-type pressure-sensitive adhesive is more preferable because it is less irritating to the skin.
Examples of the adhesive include epoxy-based solventless adhesives, rubber-based solvent-based adhesives, silicone-based and polyester-based emulsion-type adhesives, and solvent-type adhesives.

  The thickness of the first adhesive layer 13 is preferably 10 to 50 μm. If the thickness of the first adhesive layer 13 is less than 10 μm, the adhesion between the surface substrate 11 and the IC inlet 12 may be insufficient, and if it exceeds 50 μm, the first adhesive layer 13. Tends to be difficult to form.

(Back substrate)
The back substrate 20 is not particularly limited, and examples thereof include plastic films made of polyamide, polyethylene terephthalate, polypropylene, polyethylene, EVA, and synthetic paper. Among these, PET, PP, and polypropylene synthetic paper are preferable because of their high water resistance, oil resistance, chemical resistance, and tensile strength. More preferably, a stretchable material is convenient.
The thickness of the back substrate is preferably 25 to 100 μm.

(Second adhesive layer)
As the adhesive constituting the second adhesive layer 30, a known adhesive or pressure-sensitive adhesive can be used. Among them, the adhesive is solidified and hardly protrudes from the end portion when using the IC wristband, and is attached to the skin. Since it does not adhere easily, it is preferably used. Examples of the adhesive include those similar to the first adhesive.
Of the adhesives, a solvent-free type containing no organic solvent is preferred because the irritation to the skin becomes smaller. Examples of the solventless adhesive include heat-seal adhesives such as epoxy resins, silicone resins, polyethylene resins, EVA, and hot melt adhesives.

  It is preferable that the thickness of the 2nd adhesive agent layer 30 is 30-200 micrometers. If the thickness of the second adhesive layer 30 is less than 30 μm, the adhesion between the information recording substrate 10 and the back substrate 20 may be insufficient, and if it exceeds 200 μm, the second adhesive agent. The formation of the layer 30 tends to be difficult.

(Embossed layer)
In the case of forming the embossed layer 50, the embossed layer 50 is a layer that is in direct contact with the skin. Examples of the material having low skin irritation include polyethylene and EVA.
Further, the height of the embossed convex portion in the embossed layer 50 is preferably 10 to 150 μm. If the height of the embossed convex portion is 10 μm or more, the area where the IC wristband comes into contact with the skin can be reduced, and air permeability can be secured, so that the skin can be prevented from being stuffy. Therefore, in addition to being hygienic, the feeling of wearing of the inpatient is improved. Further, if the height of the convex portion is 150 μm or less, the emboss can be easily formed.

(IC wristband)
The IC wristband 40 is obtained by cutting the IC wristband laminate 1 described above along a notch 41 that outlines a wristband having a predetermined shape including the IC inlet 12. The wristband 40 in the present embodiment has a belt-like shape, and a band portion 42 in which a plurality of band holes 42 a, 42 a... Are formed in a line along the length direction, and the band portion 42. The fixing hole 43 is formed with a set hole 43a through which a stopper is passed together with the band hole 42a, and is positioned between the band part 42 and the fixing part 43. And a recording unit 44 provided.
The cut 41 is not particularly limited as long as the wristband can be cut by hand. For example, the cut 41 may be a cut formed continuously leaving one surface base material or one back surface base material, or perforated. It may be.

  When using this IC wristband, before cutting out from the IC wristband laminate 1, the identification data of the inpatient is printed on the recording unit 44 by thermal transfer printing, thermal printing, inkjet printing, laser marking, or the like. The IC wristband 40 on which the identification data is printed is cut out from the IC wristband laminate and wound around the wrist or the like. Then, the band hole 42a corresponding to the thickness of the wrist is selected, and fixed to the selected band hole 42a and the set hole 43a through a stopper (not shown). The stopper used here is non-removable after being fixed, and prevents the IC wristband 40 from being removed during hospitalization. When removing the IC wristband 40 from the wrist or the like, the IC wristband 40 is cut.

  The IC wristband laminate 1 and the IC wristband 40 are flexible enough to wrap around a wrist or the like. In order to prevent the IC wristband 40 from being removed, it is preferable that the tensile strength is high. Specifically, the tensile strength is preferably 3.5 to 15 MPa, and more preferably 4.5 to 10 MPa. Tensile strength was measured using a test piece obtained by cutting an IC wristband having a width of 15 mm in which elliptical band holes having a major axis of 4 mm and a minor axis of 3 mm were formed at intervals of 6 mm to an appropriate length.

The IC wristband laminate 1 and the IC wristband 40 described above include the information recording base material 10 in which the IC inlet 12 is attached to the front surface base material 11 via the first adhesive layer 13, and the back surface base. The material 20 is integrated through the second adhesive layer 30. Therefore, as will be described later, various automated manufacturing apparatuses such as an IC inlet sticking apparatus and a back surface base material sticking apparatus can be applied and can be easily manufactured.
Further, since the IC inlet 12 is not exposed, the identification data of the hospitalized patient can be printed using a general-purpose printer without being caught by the paper feeding unit of the printer.
Furthermore, since the notch 41 which outlines the wristband 40 of a predetermined shape is formed, the wristband 40 can be cut out and attached to the hospitalized patient after printing.

In addition, although the embossed layer 50 was provided in the laminated body 1 for IC wristbands and the wristband 40 of embodiment mentioned above, the embossed layer does not need to be provided in this invention. When the embossed layer is not provided, it is preferable that the back substrate 20 that directly contacts the skin is made of a material that is less irritating to the skin. Moreover, it is preferable that the surface 21 on the opposite side to the 2nd adhesive agent layer 30 side of the back surface base material 20 is embossed.
Furthermore, instead of providing the emboss layer 50, a large number of through holes may be formed in the entire IC wristband to impart air permeability, or the entire IC wristband may be made of a material having air permeability.
The shape of the IC wristband 40 is not limited to the above-described embodiment, and the width may be partially different.

(Production method)
Next, the manufacturing method of the laminated body 1 for IC wristbands is demonstrated.
[Coating process]
To manufacture the laminate 1 described above, for example, first, a large number of circuit elements 12b are provided on one surface of the inlet base material 12a at intervals, and the first surface is provided on the other surface of the inlet base material 12a. An adhesive is applied to provide the first adhesive layer 13. Examples of means for applying the first adhesive include a reverse roll coater, a knife coater, a bar coater, a slot die coater, a lip coater, an air knife coater, a reverse gravure coater, and a vario gravure coater.

[IC inlet laminate manufacturing process]
Next, as shown in FIG. 4, the first adhesive layer 13 is bonded to the central portion of the release paper 14 wider than the first adhesive layer 13. And the through-holes 14a, 14a ... are formed in the side edge part of the release paper 14 in which the 1st adhesive agent layer 13 is not laminated | stacked at fixed intervals. As a method for forming the through holes 14a, 14a,... At the side edges of the release paper 14 at regular intervals, there is a method using a marginal punch.
Next, as shown in FIG. 5, a punching process in which the periphery of the circuit element 12b is punched out to the front of the release paper 14, and the unnecessary inlet base material 12a and the first adhesive layer 13 around the circuit element 12b are formed. The scrap removal is applied. As a result, the IC inlet 12 having one circuit element 12b is formed on the inlet base material 12a that has been punched and scraped, and the IC inlet 12 passes through the first adhesive layer 13. As a result, an IC inlet laminated body 15 affixed to the release paper 14 is obtained.
The IC inlet laminated body 15 can be manufactured by a procedure other than the above procedure. For example, after forming the through holes 14a, 14a ... in the release paper 14, the inlet base 12a may be stuck, or the through holes 14a, 14a,. -May be formed.

[IC inlet pasting process]
Next, the IC inlet 12 is attached to one surface of the surface base material 11 through the first adhesive layer 13 applied to the IC inlet 12.
FIG. 6 shows an IC inlet sticking device used in the IC inlet sticking process. The IC inlet pasting apparatus 100 includes an IC inlet transport unit 110 that transports the IC inlet laminate 15 toward the pasting place, and a laminate guide roll (IC inlet laminate) that guides the traveling direction of the IC inlet laminate 15. A first laminated body guide roll 120a, a second laminated body guide roll 120b) from the wound body 15a side, and a release paper peeling roll 130 used to remove the release paper 14 from the IC inlet laminated body 15, Place for attaching release paper winding roll 140 for winding release paper 14 peeled from IC inlet laminate 15 and surface base material 11 (see FIG. 7) in which through holes 11a are formed at regular intervals on the side edges. A surface base material guide means 150 that is adjacent to the surface base material transporting means 150 for transporting toward the surface and the release paper peeling roll 130 and guides the traveling direction of the surface base material 11. 160, in which includes an information recording substrate take-up roll 170 for taking up the information recording substrate 10. Here, the IC inlet transport means 110 is provided between the second laminated body guide roll 120b and the release paper peeling roll 130, and the surface base material transport means 150 includes the surface base material guide roll 160 and the information recording base. It is provided between the material winding roll 170. Further, the sticking place refers to a place where the IC inlet 12 of the IC inlet laminate 15 and the surface base material 11 stick.

In this IC inlet sticking apparatus 100, the surface of the IC inlet laminate 15 from the second laminate guide roll 120b to the release paper peeling roll 130, and the information recording substrate take-up roll from the surface substrate guide roll 160 The second laminated body guide roll 120b, the release paper peeling roll 130, the surface base material guide roll 160, and the information recording base material take-up roll 170, so that the surface base material 11 surface up to 170 is coplanar. Is arranged.
The IC inlet laminate 15 is attached to the sticking apparatus 100 so that the release paper 14 contacts the laminate guide rolls 120a and 120b and the release paper peeling roll 130.

As shown in FIG. 8, the IC inlet transport means 110 in the IC inlet sticking apparatus 100 includes a plurality of first pins 111 inserted into the through holes 14 a, 14 a... Of the release paper in the IC inlet laminate 15. 111, a belt 112 provided with first pins 111, 111, a motor 113 for moving the belt 112 via a driving pulley 113a and a driven pulley 113b, and movement of the first pin 111 And a first control unit 114 for controlling the speed. In the IC inlet conveying means 110, the interval between the adjacent first pins 111, 111 corresponds to the interval between the through holes 14a, 14a,.
Similarly, the surface base material transport means 150 is provided with second pins 151, 151... And second pins 151, 151... To be inserted into the through holes 11 a of the surface base material 11. , A motor 153 that moves the belt 152 via a driving pulley 153a and a driven pulley 153b, and a second controller 154 that controls the moving speed of the second pins 151, 151. It is a thing. In the surface base material conveyance means 150, the space | interval of adjacent 2nd pins 151 and 151 respond | corresponds to the space | interval of the through-holes 11a of the surface base material 11, 11a.

  In the IC inlet adhering method using the adhering apparatus 100, first, the second pins 151, 151... Of the surface substrate conveying means 150 are inserted into the through holes 11a, 11a. insert. The belt 152 provided with the second pins 151, 151... Is rotated by the motor 153 controlled by the second control unit 154, and the first pins 151, 151. Move at a predetermined moving speed. Thereby, the surface base material 11 is drawn out from the wound body 11b of the surface base material, and the surface base material 11 is conveyed in a predetermined direction at a predetermined speed. When the transport amount reaches a certain amount, the motor 113 of the IC inlet transport means 110 is driven to start the movement of the first pin 111. Here, the fixed amount in the transport amount of the surface base material corresponds to an interval in the length direction of the IC inlet 12 sticking portion on the surface base material 11. Then, the belt 112 provided with the first pins 111, 111... Is rotated by the rotation of the motor 113 controlled by the first control unit 114, and the first pins 111, 111. The IC inlet laminate 15 is moved while being sequentially inserted into the through holes 14a, 14a. Thereby, as shown in FIG. 6, the IC inlet laminated body 15 is fed out from the wound body 15a of the IC inlet laminated body, and is peeled through the first laminated body guide roll 120a and the second laminated body guide roll 120b. It is conveyed toward the paper peeling roll 130.

  At this time, the first pin 111 of the IC inlet transport unit 110 and the second pin 152 of the substrate transport unit 150 are moved in the same direction at the same speed, and the release paper is peeled from the second laminate guide roll 120b. The IC inlet laminated body 15 between the rolls 130 and the surface base material 11 between the surface base material guide roll 160 and the information recording base material take-up roll 170 are run in the same direction at the same speed.

Then, as shown in FIGS. 6 and 9, the traveling direction of the IC inlet laminated body 15 conveyed by the IC inlet conveying means 110 is abruptly bent by the release paper peeling roll 130. Although the release paper 14 of the IC inlet laminated body 15 follows the bending, the IC inlet 12 and the first adhesive layer 13 attached thereto do not follow, so the IC inlet 12 and the first adhesive agent. Layer 13 separates from release paper 14. While the release paper 14 is taken up and removed by the release paper winding roll 140, the IC inlet 12 separated from the release paper 14 moves to the surface base material 11 side (attachment place) running in the same direction, and finally It adheres to the surface base material 11 through the first adhesive layer 13. Thus, the IC inlet 12 moves onto the surface base material 11 when the first adhesive layer 13 adheres to the surface base material 11. Then, the IC inlet conveying means 110 is operated until all of the IC inlets 12 are transferred onto the surface substrate 11, the IC inlet laminate 15 is conveyed, and the IC inlet 12 is adhered to the surface substrate 11.
After the IC inlet 12 is attached to the surface base material 11, the IC inlet transport means 110 is stopped until the surface base material 11 is transported a certain amount again. On the other hand, the conveyance of the surface base material 11 is continued, and the information recording base material 10 obtained by sticking the IC inlet 12 to the surface base material 11 is wound up by the information recording base material winding roll 170.

[Back side substrate pasting process]
Next, the back surface base material 20 is stuck to the information recording base material 10 via the second sticking agent. In FIG. 10, the back surface base material sticking apparatus which sticks the back surface base material 20 to the information recording base material 10 is shown. This back surface base material sticking apparatus 200 includes an information recording base material feed roll 210 to which a wound body 10a of an information recording base material is attached, and a back surface base material feed roll 220 to which a back surface base material 20 is attached. An application means 230 for applying the second adhesive 231 and two adjacent rolls 241a and 241b, and a first pressure-bonding section 240 for pressure-bonding the information recording substrate 10 and the back substrate 20; With an extruder 250 having a T-die, an embossing roll 260 that cools the molten resin 251 discharged from the extruder 250 and has an emboss formed on the peripheral surface, and an IC that winds up the resulting laminate 271 with an IC And a roll 270 for winding the laminated body.

And using the said back surface base material sticking apparatus 200, for example, while simultaneously feeding out the information recording base material 10 from the information recording base material feed roll 210, the back surface base material 20 is let out from the back surface base material feed roll 220, The back surface The second adhesive agent 231 is applied to one surface of the substrate 20 by the application means 230 to form the second adhesive agent layer 30. Then, the surface of the information recording substrate 10 on the IC inlet 12 side and the back substrate 20 are bonded to each other through the second adhesive layer 30, and these are bonded by the first pressing portion 240. In this way, if the second adhesive 231 is applied in advance to one side of the back substrate 20, it is not necessary to apply the adhesive on the IC inlet which is easily damaged, thus preventing the occurrence of defective products. it can.
Next, the molten resin 251 discharged from the extruder 250 is laminated on the surface 21 of the back substrate 20 opposite to the second adhesive layer 30 side. Then, the laminated molten resin 251 is cooled by an embossing roll 260 and embossed to form an embossed layer 50 to obtain a laminated body 271 with an IC. The obtained laminated body 271 with IC is wound up by a roll 270 for winding the laminated body with IC.

[Incision forming process]
Next, the side edge portion (portion in which the through hole is formed) of the laminated body 271 with the IC is cut out, and thereafter, the punching blade having the wristband outline of the predetermined shape is formed on the laminated body 271 with the IC from the surface base material 11 side. The notch 41 that outlines the wristband including the IC inlet 12 is formed from the front surface base material 11 to the back surface base material 20. Next, as shown in FIG. 11, perforations are formed in the width direction at regular intervals to form cut lines 60, and cut along the cutting lines 70, 70... So that the IC wristbands 40 are provided in a row. .
In this way, the information recording base material 10 and the back surface base material 20 are integrated through the second adhesive layer 30 as shown in FIG. 1 and FIG. An IC wristband laminate in which cuts 41 that outline the wristband 40 are formed is obtained.

  In the manufacturing method of the laminated body for IC wristband described above, the IC inlet 12 is attached to one surface of the surface base material 11 via the first adhesive applied to the IC inlet 12 in the application step. In this method, the information recording substrate 10 is prepared, and the back substrate 20 is bonded to the surface of the information recording substrate 10 on the IC inlet 12 bonding side via a second bonding agent. In such a method, since the IC inlet sticking apparatus 100 and the back surface base material sticking apparatus 200 can be used, it is easy to automate, manufacture is simple, and a list of predetermined shapes including the IC inlet 12 is provided. By forming the notches 41 that outline the band 40, a plurality of IC wristbands 40 (5 in the illustrated example) can be manufactured simultaneously. Therefore, this manufacturing method is a method suitable for mass production. Moreover, as the IC inlet sticking apparatus 100 and the back surface base material sticking apparatus 200, since the existing adhesive label manufacturing apparatus can be applied, new capital investment can be reduced.

  Further, in the above-described manufacturing method, in the supply of the IC inlet laminated body 15 and the front surface base material 11, the through holes 11a and 14a formed at regular intervals on the side edges thereof, the IC inlet transport means 110, and the back surface base material transport. This is a method using the means 150. According to this method, even if the IC inlet laminated body 15 or the surface base material 11 is sent out at a high speed, the position hardly shifts, so that the IC inlet laminated body 15 or the surface base material 11 can be conveyed accurately and at high speed. Further, in this method, the first pin is controlled after the surface base material 11 is conveyed by a predetermined amount by controlling the control unit 114, 154 so that the IC inlet 12 is adhered to a predetermined position of the surface base material 11. 111 is moved and the IC inlet laminated body 15 is conveyed. Therefore, the first adhesive layer 13 of the IC inlet laminated body 15 exposed by removing the release paper 14 can be accurately and rapidly attached to a predetermined position of the surface base material 11. That is, the IC inlet 12 can be adhered to a predetermined position of the surface base material 11 accurately and at high speed.

  In addition, in the manufacturing method mentioned above, although the embossing layer 50 was formed using the extruder 250 and the embossing roll 260 in the back surface base material sticking process, when not providing an embossing layer, the extruder 250 and the embossing roll 260 are used. The embossing layer formation by is omitted.

It is a top view which shows one Embodiment of the laminated body for IC wristbands concerning this invention. It is the expanded sectional view which expanded the A-A 'cross section of FIG. It is a top view explaining an IC inlet. It is a figure explaining the manufacturing process of the IC inlet laminated body concerning embodiment shown in FIG.1 and FIG.2, (a) is a top view, (b) is B-B 'sectional drawing. It is a figure which shows the IC inlet laminated body which concerns on embodiment shown to FIG. 1 and FIG. 2, Comprising: (a) is a top view, (b) is C-C 'sectional drawing. It is a schematic diagram which shows an example of an IC inlet sticking apparatus. It is a top view which shows the base material used with the IC inlet sticking apparatus of FIG. It is a principal part enlarged view of the IC inlet sticking apparatus of FIG. It is a principal part enlarged view of the IC inlet sticking apparatus of FIG. It is a schematic diagram which shows an example of a back surface base material sticking apparatus. It is a top view which shows a laminated body with IC.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Laminated body for IC wristband 10 Information recording base material 11 Front surface base material 12 IC inlet 13 1st adhesive layer 20 Back surface base material 21 The surface on the opposite side to the 2nd adhesive layer side of a back surface base material 30 Second adhesive layer 40 Wristband 41 Notch 50 Emboss layer 271 Laminate with IC

Claims (7)

The information recording base material in which the IC inlet is attached to the outer surface base material through the pressure-sensitive adhesive layer and the back surface base material are integrated via the adhesive layer when the IC wristband is used ,
A laminated body for an IC wristband, wherein a notch for contouring a wristband having a predetermined shape provided with an IC inlet is formed. The laminated body for an IC wristband according to claim 1, wherein an embossed layer in which an emboss is formed is provided on a surface opposite to the adhesive layer side of the back substrate. The laminate for an IC wristband according to claim 1 or 2, wherein the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer is an emulsion-type pressure-sensitive adhesive, and the adhesive constituting the adhesive layer is a solventless type adhesive. An IC wristband obtained by cutting the IC wristband laminate according to any one of claims 1 to 3 along a cut. A coating step of forming an adhesive layer by applying an adhesive on one surface of the IC inlet,
IC inlet laminate manufacturing process for obtaining an IC inlet laminate by bonding an IC inlet to release paper by the adhesive layer;
The IC inlet peeling the IC inlet from the release paper of the laminate, peeled through the IC inlet adhesive layer, the information recording substrates bonded to wear on one side of the surface substrate to be outside when using the IC wristband IC inlet pasting process to produce
A back substrate pasting step for obtaining a laminated body with an IC by pasting a back substrate through an adhesive to the surface of the information recording substrate on the IC inlet pasting side;
A method for producing a laminate for an IC wristband, comprising: forming a notch for contouring a wristband having a predetermined shape provided with an IC inlet in the laminate with IC. The method for producing an IC wristband laminate according to claim 5, wherein an adhesive is applied in advance to one side of the back substrate before the back substrate attaching step. The method for producing a laminate for an IC wristband according to claim 5 or 6, wherein the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer is an emulsion-type pressure-sensitive adhesive, and the adhesive constituting the adhesive layer is a solventless type adhesive.

Images