JP2008234245A - Ic tag label and method for manufacturing ic tag label - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC tag label adapted for the purpose of high waterproof property, and a method for manufacturing the IC tag label. <P>SOLUTION: The method comprises steps of placing an inlet having an IC chip and an antenna connected onto a base film between a first transparent plastic film having a first hot-melt adhesive layer on the reverse side and a second transparent plastic film having a second hot-melt adhesive layer on the main surface side; adhering and integrating the first transparent plastic film, the inlet and the second transparent plastic film by softening and curing the first and second hot-melt adhesive layers; adhering an upper sheet formed of paper or a plastic film to the upper side of the adhered and integrated structure, adhering a release sheet to the lower side of the adhered and integrated structure so as to be releasable; punching a predetermined area having the inlet to which the IC chip and the antenna are connected while leaving the release sheet; and peeling and removing the part outside the punched area from the release sheet. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an IC tag label having an inlet in which an IC chip and an antenna are connected on a plastic film, and a method of manufacturing the IC tag label.

An IC tag label having an inlet in which an IC chip and an antenna are connected on a plastic film is attached to an article for information management, and then desired information is written and stored via a reader / writer, and if necessary Since the stored information can be repeatedly read, it can be used in a wide range of fields such as transportation, distribution, sales management, factory process management, merchandise delivery, and baggage handling.
In addition, as the usage of IC tag labels expands, IC tag labels to be affixed to articles placed outdoors and IC tag labels to be affixed to articles that are highly likely to get wet during transportation or the like are also required.

Prior art of these IC tag labels and IC tag label manufacturing methods include Patent Document 1 and Patent Document 2.
However, since the above-mentioned prior art IC tag labels do not have high waterproof properties, it is considered that rainwater may enter the IC chip on the plastic film and damage the IC chip when wet. Therefore, there is a problem that an IC tag label having higher waterproofness is required.

JP 2007-26302 A JP 2006-301900 A

  Therefore, the present invention is used for applications requiring high waterproof properties, such as IC tag labels to be affixed to articles placed outdoors and IC tag labels to be affixed to articles that are highly likely to get wet during transportation. An adaptive IC tag label and a method of manufacturing the IC tag label are provided.

  In the IC tag label of the present invention, an upper sheet made of paper or a plastic film, an adhesive layer, a transparent plastic film, a first hot melt adhesive layer, and an IC chip and an antenna are connected to the base film. An inlet, a second hot melt adhesive layer, a transparent plastic film, a pressure-sensitive adhesive layer, and a release sheet are sequentially laminated.

  In the IC tag label of the present invention, the peeling sheet is formed of a continuous belt-like sheet, and a plurality of portions constituting the non-contact IC tag label are provided on the peeling sheet so as to be peeled at equal intervals. Features.

  Furthermore, the IC tag label of the present invention is characterized in that the adhesive of the hot melt adhesive layer is polyurethane or an ethylene vinyl acetate copolymer.

  Next, the manufacturing method of the IC tag label of the present invention includes a first transparent plastic film having a first hot melt adhesive layer on the back surface and a second transparent plastic having a second hot melt adhesive layer on the surface. An IC chip and an inlet connected to an antenna are sandwiched between a base film and a film, and the adhesive of the first hot melt adhesive layer and the second hot melt adhesive layer is softened and then cured. Step of bonding and integrating the first transparent plastic film, the inlet and the second transparent plastic film, and then adhering an upper sheet made of paper or plastic film to the upper side of the bonded and integrated structure, Further, a step of adhering the release sheet to the lower side of the bonded and integrated structure in a peelable manner, and then the IC chip and the unbonded structure. From the step of removing the predetermined region having the inlet to which the na is connected, leaving only the release sheet, and removing the die-cut outer portion from the release sheet. It is characterized by becoming.

  The method for producing an IC tag label of the present invention includes a step of printing on the first transparent plastic film of the non-contact IC tag label, and an adhesive of the transparent plastic film on the printed first transparent plastic film. It has the step which sticks with an agent, It is characterized by the above-mentioned.

  In the non-contact IC tag label of the present invention, an inlet in which an IC chip and an antenna are connected on a plastic film has two transparent sheets via a first hot melt adhesive layer and a second hot melt adhesive layer. Since it has a structure sandwiched between plastic films, there is an effect that moisture can be prevented from entering the IC chip from the outside.

  In addition, the IC tag label manufacturing method of the present invention includes a first transparent plastic film having a first hot-melt adhesive layer on the back surface and a second transparent plastic film having a second hot-melt adhesive layer on the surface. In between the IC chip and the inlet connected to the antenna on the plastic film, the adhesive of the first hot melt adhesive layer and the second hot melt adhesive layer is softened and then cured. Since the first transparent plastic film, the inlet, and the second transparent plastic film are bonded and integrated, an IC tag label that can prevent moisture from entering the IC chip from the outside can be manufactured. There is an effect.

  Further, the method for producing an IC tag label of the present invention has an effect that the printed part can be protected from rain water since the transparent plastic film is stuck on the printed first transparent plastic film with an adhesive.

Hereinafter, an IC tag label and an IC tag label manufacturing method according to embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a plan view showing an IC tag label according to the embodiment, in which a plurality of IC tag labels are continuously provided at equal intervals on a strip-shaped release sheet, and FIG. 1 shows a cross-sectional view of an IC tag label according to an embodiment.
The IC tag label 1 according to the embodiment includes an upper sheet 3 made of paper or a plastic film, an adhesive layer 4, a transparent plastic film 5, a first hot-melt adhesive layer 6, and an IC chip on the base film 7. 11 and an antenna 12 connected to each other, a second hot melt adhesive layer 8, a transparent plastic film 9, and an adhesive layer 10 are sequentially laminated on the strip-shaped release sheet 2. Have.

In FIG. 2, the first hot melt adhesive layer 6 is shown in a state where the base film 7 and the antenna 12 are separated from each other. However, the adhesive of the first hot melt adhesive layer 6 is Since it is softened and then cured to be in an adhesive state, the transparent plastic film 5 is bonded and integrated with the base film 7 and the antenna 12 by the first hot melt adhesive layer 6.
That is, between the transparent plastic film 5 and the base film 7, the IC chip 11 and the antenna 12 are protected in a sealed state by the first hot melt adhesive layer 6.

  Since the peeling sheet 2 is peelably adhered by the pressure-sensitive adhesive layer 10 formed on the back surface of the transparent plastic film 9, the pressure-sensitive adhesive layer is formed after peeling the IC tag label 1 from the peeling sheet 2. 10, the IC tag label 1 can be stuck anywhere by being pressed against a desired article to be stuck.

As shown in FIG. 3, the inlet 13 to which the IC chip 11 and the antenna 12 are connected forms the antenna coil 12 on the base film 7, and the IC chip 11 is attached to both ends 12 a and 12 b of the antenna coil 12. ing.
The end of the antenna coil 12 located outside is connected to the conducting member 14 provided on the back surface of the base film 7, and the other end of the conducting member 14 is connected to the coil connected to the IC chip 11. Has been.

The adhesive used for the first hot melt adhesive layer 6 and the second hot melt adhesive layer 8 is, for example, polyurethane or an ethylene vinyl acetate copolymer.
When the first hot melt adhesive layer 6 and the second hot melt adhesive layer 8 are heated, the adhesive softens and then hardens to become an adhesive state. In the case where the transparent plastic film 5 is bonded to the inlet 13 with the first hot melt adhesive layer 6, the antenna coil 12 and the IC chip 11 are waterproofed. is there.

Next, a method for manufacturing an IC tag label according to an embodiment of the present invention will be described with reference to FIGS.
First, as shown in FIG. 4A, a strip-shaped first transparent plastic film having a first hot-melt adhesive layer on the back surface and a strip-shaped second film having a second hot-melt adhesive layer on the surface. An inlet connected to the IC chip and the antenna is sandwiched between the transparent plastic film and the base film.
And as shown in FIG.4 (b), after softening the adhesive agent of a 1st hot-melt-adhesive adhesive layer and a 2nd hot-melt-adhesive adhesive layer, it is made to harden and the strip-shaped 1st transparent plastic film and The inlet and the band-shaped second transparent plastic film are bonded and integrated.

Next, as shown in FIG.4 (c), the outer peripheral part of the inlet 13 is die-cut-processed by desired size, leaving only the peeling sheet 2 using the die-cutting blade 20. FIG.
Then, as shown in FIG. 4 (d), the outer portion punched by the punching blade 20 is removed, and an IC tag label having a predetermined shape is formed on the peeling sheet 2 so as to be peelable from the peeling sheet 2.

  FIG. 4 shows a state in which an IC tag label is manufactured from one inlet 13, but a plurality of inlets 13 are arranged at equal intervals and continuously processed, so that the strip-shaped release sheet 2 is In addition, a large amount of IC tag labels can be formed in a short time.

Next, FIG. 5 shows a processing procedure when a non-contact IC tag label is printed.
First, as shown in FIG. 5 (a), a desired printing process is performed on the upper surface of the upper sheet 3 of the non-contact IC tag label that is detachably pasted on the strip-shaped peeling sheet 2, and the print 15 is printed. indicate.

  Thereafter, as shown in FIG. 5 (b), a transparent plastic film 16 is pasted on the upper side of the printed upper sheet 3 with an adhesive 17, and the printed surface is transparent as shown in FIG. 5 (c). A non-contact IC tag label protected with a plastic film 16 is prepared.

It is an IC tag label which concerns on embodiment of this invention, Comprising: It is a top view which shows the state by which the several IC tag label was continuously provided at equal intervals on the strip | belt-shaped peeling sheet. It is sectional drawing of the IC tag label which concerns on embodiment of this invention. It is a figure which shows the structure of the inlet of the IC tag label which concerns on embodiment of this invention. It is a figure which shows the manufacturing method of the IC tag label which concerns on embodiment of this invention. It is a figure which shows the manufacturing method of the IC tag label which concerns on embodiment of this invention.

Explanation of symbols

1 IC tag label
2 Peeling sheet
3 Upper seat
4 Adhesive layer
5,9 Transparent plastic film
6 First hot melt adhesive layer
7 Base film
8 Second hot melt adhesive layer
10 Adhesive layer
11 IC chip
12 Antenna
12a, 12b Both ends of antenna coil
13 Inlet
14 Conducting member
20 die cutting blade

Claims (5)

  An upper sheet made of paper or plastic film, an adhesive layer, a transparent plastic film, a first hot melt adhesive layer, an inlet in which an IC chip and an antenna are connected to the base film, and a second hot An IC tag label, wherein a melt adhesive layer, a transparent plastic film, a pressure-sensitive adhesive layer, and a release sheet are sequentially laminated.   2. The IC according to claim 1, wherein the peeling sheet is a continuous belt-like sheet, and a plurality of portions constituting a non-contact IC tag label are provided on the peeling sheet so as to be peeled at equal intervals. Tag label.   2. The IC tag label according to claim 1, wherein the adhesive of the hot melt adhesive layer is polyurethane or an ethylene vinyl acetate copolymer.   An IC chip on the base film between a first transparent plastic film having a first hot-melt adhesive layer on the back surface and a second transparent plastic film having a second hot-melt adhesive layer on the surface; The inlet to which the antenna is connected is sandwiched and the adhesive of the first hot melt adhesive layer and the second hot melt adhesive layer is softened and then cured to cure the first transparent plastic film, the inlet, and the second Adhering and integrating the transparent plastic film, and then adhering an upper sheet made of paper or plastic film to the upper side of the bonded and integrated structure, and further to the lower side of the bonded and integrated structure A step of adhering the peeling sheet in a peelable manner, and then a predetermined area having an inlet to which the IC chip and the antenna are connected. A method for producing an IC tag label, comprising: a step of punching the mold leaving only the stripping sheet; and a step of stripping and removing the die-cut outer portion from the stripping sheet . The method includes a step of printing on the first transparent plastic film of the non-contact IC tag label, and a step of sticking the transparent plastic film with an adhesive on the printed first transparent plastic film. The manufacturing method of the IC tag label of Claim 4.

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