JP2008146553A - Ic tag label and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC tag label for preventing an adhesive from being forced out when an IC tag label is stuck to an adherend, or preventing the IC tag label from being caught by an obstacle and a method for manufacturing the IC tag label. <P>SOLUTION: A transparent or translucent protection film 7 is stuck from the upper face side each of a plurality of IC tags 3 so that the plurality of IC tags 3 stuck to the peeled face of a band-shaped release paper 5 can be completely covered. Each protection film 7 is shaped so as to be relatively larger than the IC tag 3, and so as to be smaller than the release paper 5, and so as not to be overlapped with the protection film 7 of the adjacent IC tag 3. Also, adhesion processing is performed to the face of the protection film 7 which is into contact with the IC tag 3 and the release paper 5 so that the IC tag 3 can be stuck to the adherend. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an IC tag label that can be attached to an adherend and a method for manufacturing the same.

  Current IC tags generally have a multilayer structure and a thickness because an inlet with an antenna pattern and an IC chip is attached to a plastic base film, and the inlet is covered with a coating substrate (Patent Document) 1, see Patent Document 2).

JP 2006-285709 A JP 2006-301900 A

  In order to allow the IC tag to be attached to the adherend, there is an IC tag label in which an adhesive process is performed on one surface of the adherend side of the IC tag. The IC tag label is manufactured, shipped, stored, and transported by being affixed to a release paper so as to cover the pressure-sensitive adhesive surface in order to maintain adhesiveness until it is actually affixed to an adherend.

  FIG. 8 is a view showing a conventional IC tag label 100, and FIG. 9 is a flowchart for explaining the manufacturing method thereof.

As shown in FIG. 8A, a conventional IC tag label 100 has a plurality of IC tags 103, 103,... Continuously arranged and pasted on a single strip-shaped release paper 5. .
In addition, as shown in FIG. 9, the manufacturing method first sticks an inlet formed with an antenna pattern and an IC chip, which are parts that become the core of the IC tag, on one surface of the base film (step S101). A release paper 105 is attached to the other surface of the base film (step S102). Next, in order to protect the antenna pattern and the IC chip formed on the inlet, it is covered with a plastic film or a paper material covering substrate (step S103). At the stage where the steps S101 to S103 are completed, the IC tag layer formed by laminating the base film, the inlet, and the covering base material is attached to the release paper 105 via the adhesive layer 141.

  Next, a cutting line is applied around the IC tag portion, which is the portion where the antenna pattern and the IC chip are formed, in the IC tag layer by a method called half cut, and an unnecessary portion around the IC tag layer is formed by a method called scrap raising. The release paper 105 is peeled off and removed (step S104). Thus, the completed IC tag label 100 is what is shown to FIG. 8 (A). FIG. 8B is a cross-sectional view taken along line A-A ′ in FIG. As described above, the IC tags 103, 103,... Have a layer structure in which the base film 110, the inlet 131, and the covering base material 135 are laminated via the adhesive layers 141, 143, 144, respectively. An antenna pattern and an IC chip are formed on the layer.

However, as described above, since the IC tag 103 has a layer structure having a plurality of adhesive layers, there are many adhesives protruding from each adhesive layer. Management problems arise. This is particularly a problem when IC tag labels are reused.
Further, the IC tag label is thick because of its layer structure, and when it is attached to the adherend, a step is generated between the adherend and the IC tag label. And the obstacle becomes easy to get caught by the level | step difference, and it might peeled off from the to-be-adhered body depending on the case.

  The present invention has been made in view of such problems, and the object thereof is an IC tag label capable of preventing the sticking of an adhesive when stuck to an adherend and the catching on an obstacle, and the production thereof. It is to provide a method.

  In order to achieve the above object, a first invention is an IC tag label in which an IC tag having an antenna pattern and an IC chip is attached to a release paper, and the IC tag is a protective film larger than the IC tag. An IC tag label characterized by being coated.

  The protective film is a transparent film.

  The protective film can be adhered to an adherend.

  According to a second aspect of the present invention, in the method of manufacturing an IC tag label in which an IC tag having an antenna pattern and an IC chip is attached to a release paper, the surface of the release paper to which the IC tag is attached is placed on the IC tag. The method for producing an IC tag label, comprising: a step of covering with a protective film; and a step of forming the protective film into a shape larger than the IC tag.

  The protective film is a transparent film.

  The protective film can be adhered to an adherend.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the IC tag label which can prevent the protrusion of the adhesive at the time of affixing on a to-be-adhered body, and the catch to an obstruction, and its manufacturing method.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a diagram showing an IC tag label 1 according to an embodiment of the present invention, and FIG. 2 is a diagram showing an inlet 31 of the IC tag 3 in the inner layer of the IC tag 3.

  As shown in FIG. 1 (A), the IC tag label 1 has a plurality of IC tags 3, 3,... Continuously attached to the peeled surface of a single strip-shaped release paper 5. A transparent or translucent protective film 7, 7,... Is attached from the upper surface side so as to completely cover the IC tags 3, 3,.

FIG. 1B is a cross-sectional view taken along line AA ′ in FIG.
As shown in FIG. 1 (B), the IC tag 3 is affixed to the release paper 5 via an adhesive layer 41, and the protective film 7 is further covered with an adhesive layer 42 so as to cover the IC tag 3 from the upper surface. Are attached to the IC tag 3 and the release paper 5.

The protective film 7 is formed in a shape that is slightly larger than the IC tag 3 and smaller than the release paper 5 and does not overlap with the protective film 7 of the adjacent IC tag 3. For example, each side around the IC tag 3 is molded so as to be largely surrounded by at least about 5 mm.
Further, a plastic film thinner than the IC tag 3 is used for the protective film 7. Specifically, for example, the thickness may be about 50 μm. Examples of the material include polyethylene terephthalate (PET).
In addition, the protective film 7 has an adhesive process on the surface in contact with the IC tag 3 and the release paper 5, and can adhere to the adherend. That is, when the IC tag 3 is attached to the adherend, the IC tag 3 is peeled off and attached to the adherend while the protective film 7 is still attached to the upper surface from the release paper 5.

  The release paper 5 is paper that has been subjected to release processing by applying a silicone resin or the like to one side of a base material in order to make it easier to release the adhesive. The pressure-sensitive adhesive used in the pressure-sensitive adhesive layers 41 and 42 is for enabling the IC tag 3 and the protective film 7 peeled off from the release paper 5 to be attached to the adherend, and as a resin composition thereof, Various materials such as natural rubber, nitrile rubber, epoxy resin, vinyl acetate emulsion, acrylic, acrylate copolymer, polyvinyl alcohol, and phenol resin can be used.

Each IC tag 3 attached to the IC tag label 1 has a non-contact communication function and a memory function, and has an inlet 31 in an inner layer thereof.
As shown in FIG. 2, the inlet 31 of the IC tag 3 is obtained by forming an antenna pattern 33 on a film 32 by etching or printing and connecting IC chips 34 to both ends of the antenna pattern 33.
The antenna pattern 33 has a coil shape as in the example shown in FIG.
The IC chip 34 includes a communication function unit, a control unit, and a memory.
The configuration of the inlet 31 including the antenna pattern 33 and the IC chip 34 is the same as that of a normal IC tag inlet.

  In FIG. 2, an inlet 31 in which one antenna pattern 33 and one IC chip 34 are formed on one film 32 is illustrated. A strip-shaped inlet 31 on which an antenna pattern 33 and a plurality of IC chips 34 are formed is used. That is, the inlet 31 in which a plurality of antenna patterns 33 and a plurality of IC chips 34 are continuously arranged at predetermined intervals in the longitudinal direction of the belt-like film 32 is used, and individual antenna patterns are formed in a later manufacturing process. .. Are cut into a predetermined shape to form individual IC tags 3, 3,...

Next, a manufacturing method of the IC tag label 1 and a layer structure of the IC tag label 1 will be described with reference to FIGS.
FIG. 3 is a flowchart for explaining the flow of the manufacturing method of the IC tag label 1, FIG. 4 is a diagram showing a layer structure formed at each stage of the manufacturing process of the IC tag label 1, and FIG. FIG. 6 is a diagram illustrating a state of cutting, FIG. 6 is a diagram illustrating a label sheet 16 that is entirely covered with a protective film 7, and FIG. is there.

  First, as shown in step S1 of FIG. 3 and FIG. 4A, the above-described strip-shaped inlet 31 is attached to one surface of the strip-shaped base film 10 having the adhesive layers 41 and 43 on both surfaces.

  At the stage shown in FIG. 4A, a release paper 11 having the same shape as the base film 10 is stuck on the other surface of the base film 10.

  Next, as shown in step S2 of FIG. 3 and FIG. 4 (B), the release paper 11 is peeled off from the other surface of the base film 10, that is, the surface opposite to the surface to which the inlet 31 is pasted. A pattern 5 is pasted. The width of the release paper 5 is generally wider than the width of the base film 10 in consideration of the sticking out of the adhesive from the adhesive layers 41 and 43. For example, the width of the release film 5 is 70 mm while the width of the base film 10 and the inlet 31 is 65 mm.

Then, as shown in step S3 of FIG. 3 and FIG. 4C, in order to protect the antenna pattern 33 and the IC chip 34 formed on the inlet 31, a coating base is formed on the inlet 31 via the adhesive layer 44. The material 35 is pasted. As the base material 10 or the inlet 31, a belt-like plastic film or paper is used for the covering base 35, and the thickness thereof is about 100 μm, for example.
As described above, the IC tag layer 30 formed by laminating the inlet 31 and the covering substrate 35 on the base film 10 is in the state of the strip-shaped label sheet 15 attached to the release paper 5 via the adhesive layer 41. .

  Next, as shown in step S <b> 4 of FIG. 3, the IC tag 3, which is a portion where the antenna pattern 33 and the IC chip 34 are formed, is formed on the label sheet 15 with the IC tag layer 30 attached to the release paper 5. As a molding process of the IC tag 3, die cutting by a method called half-cutting and removal of unnecessary portions by a method called scrap raising are performed.

  Half-cutting is a process in which a cutting line is put only in the IC tag layer 30 of the label sheet 15 using a punching die having a predetermined shape, and the release paper 5 is cut so as not to penetrate the punching die. Specifically, a rotary punching die having a metal piece blade projecting from the surface in contact with the label sheet 15 is used. The position of the cutting die blade is adjusted according to the shape of the IC tag 3. The surface of the label sheet 15 on the side of the covering base 35 is pressed against the punching die with a predetermined pressing force, and cutting is performed while discharging the label sheet 15 as the punching die rotates.

FIG. 5 illustrates a state in which the label sheet 15 is cut by the punching blades 6a and 6b.
As shown in FIG. 5, the lengths of the punching blades 6 a and 6 b are adjusted so as to penetrate the IC tag layer 30 but not reach the release paper 5. The positions of the blades 6a and 6b are adjusted so that a cutting line is inserted around the position where the antenna pattern 33 and the IC chip 34 are arranged.

  In the example shown in FIG. 5, the range sandwiched between the blade 6a and the blade 6b is a portion where the IC tag 3 of FIG. 1 exists, and the outer portions of the blade 6a and the blade 6b are unnecessary portions, and the scrap raising step Is peeled off from the release paper 5.

  The scrap raising is a process of separating the IC tag layer 30 of the label sheet 15 by the cutting line formed in the above-described half-cut process, and peeling and removing unnecessary portions from the release paper 5. Here, a cutting line is provided so as to surround the periphery of the IC tag 3, which is a portion where the antenna pattern 33 and the IC chip 34 are formed, and a portion outside this cutting line is removed as an unnecessary portion, and is shown in FIG. In the IC tag label 1 shown, the protective film 7 is not yet attached.

  Further, as shown in step S5 of FIG. 3 and FIG. 6, the surface of the label sheet 15 formed with the IC tag 3 and affixed to the release paper 5 is adhesively bonded to one side. Is covered with a band-shaped protective film 7 to which a label sheet 16 is formed.

6A is a view of the label sheet 16 as viewed from above, and FIG. 6B is a cross-sectional view taken along line AA ′ in FIG. 6A.
At the stage of the label sheet 16, the IC tags 3, 3,... Attached to the release paper 5 are covered with a single band-shaped protective film 7. Then, as shown in FIG. 6B, a pressure-sensitive adhesive is applied to the surface of the protective film 7 that is in contact with the IC tag 3 and the release paper 5. The protective film 7 is stuck so that the upper surface of ... may be covered. Note that the IC tag 3 in FIG. 6B has the same laminated structure (including the base film 10, the inlet 31, and the covering base material 35) as the IC tag layer 30 in FIG. 4C and FIG. However, for the sake of simplicity, the entire IC tag layer 30 is shown as the IC tag 3 and the layer boundaries are not shown.

  Thereafter, as shown in step S6 of FIG. 3, the protective film 7 is placed around each IC tag 3 with respect to the label sheet 16 in a state where the upper surfaces of the IC tags 3, 3,. Molded into a shape that encircles the entire area. For forming the protective film 7, half-cutting and scraping are performed in the same manner as the IC tag 3 is formed.

FIG. 7 illustrates a state in which the protective film 7 is half-cut with the punching blades 6c and 6d.
As shown in FIG. 7, the lengths of the punching blades 6 c and 6 d are adjusted so as to penetrate the protective film 7 but not reach the release paper 5. In addition, the positions of the blades 6c and 6d are adjusted so that a cutting line is inserted outside the IC tag 3 by a predetermined distance.

  In the example shown in FIG. 7, the range between the blade 6c and the blade 6d is a portion where the protective film 7 of FIG. 1 is present, and the outer portion of the blade 6c and the blade 6d is an unnecessary portion, and the waste raising step Is peeled off from the release paper 5.

  As described above, the IC tag label 1 shown in FIG. 1 is completed. When the IC tag 3 is attached to the adherend, the IC tag 3 is peeled off from the release paper 5 together with the protective film 7 and attached to the adherend. When affixed to the adherend, the protective film 7 becomes the outermost edge.

  As described above, the IC tag label 1 of the present embodiment shown in FIG. 1 is covered with the protective film 7 larger than the IC tag 3 from the upper surface of the IC tag 3 attached to the release paper 5. Therefore, even if the IC tag 3 has a plurality of layers laminated via the adhesive layer, the adhesive that protrudes from each adhesive layer is blocked by the protective film 7, so that it may protrude outside the protective film 7. There will be no dust and dirt. Moreover, since it protects with the protective film 7, damage to the IC tag 3 can be prevented.

  Moreover, by using the thin protective film 7, the level | step difference of the release paper 5 and the IC tag 3 can be covered gently, and the catch at the time of sticking to a to-be-adhered body can be prevented. Furthermore, since the protective film 7 is made of a transparent or translucent material, it is easy to visually recognize the position of the IC tag itself even when it is attached to the adherend, and an easy-to-use IC tag label can be provided. .

  Note that the shape of the IC tag 3 and the shape of the protective film 7 shown in the present embodiment are examples, and in particular, there are various sizes and shapes of the IC tag 3 depending on its function and performance. In any shape of the IC tag 3, the shape of the protective film 7 covering the IC tag 3 is set so as to completely cover the IC tag 3 according to the shape of each IC tag 3. Any material that can be molded may be used.

  The preferred embodiments of the IC tag label and the manufacturing method thereof according to the present invention have been described above with reference to the drawings, but are not limited to the above-described embodiments. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the technical idea described in the claims, and these are naturally within the technical scope of the present invention. It is understood that it belongs.

The figure which shows the IC tag label 1 which concerns on this invention The figure which shows the inlet 31 in the inner layer of IC tag 3 The flowchart explaining the flow of the manufacturing method of the IC tag label 1 The figure which shows the layer structure formed in each step of the manufacturing process of the IC tag label 1 The figure explaining a mode that IC tag 3 is half-cut with a punching die The figure which shows the label sheet 16 of the state which coat | covered the protective film 7 on the whole label sheet 15 to which the IC tag 3 is affixed The figure which shows a mode that the protective film 7 is half-cut with a punch about the label sheet 16 The figure which shows the conventional IC tag label 100 Flowchart for explaining a conventional IC tag label manufacturing method

Explanation of symbols

1 .... IC tag label 3 .... IC tag 31 ... Inlet 33 ... Antenna pattern 34 ... IC chip 41 ... Adhesive layer 42 .... Adhesive layer 5 .... Release paper 7 .... Protective film 10 .... Base film 35 ... Coating substrate

Claims (6)

An IC tag label in which an IC tag having an antenna pattern and an IC chip is attached to a release paper,
The IC tag label, wherein the IC tag is covered with a protective film larger than the IC tag.   The IC tag label according to claim 1, wherein the protective film is a transparent film.   2. The IC tag label according to claim 1, wherein the protective film can be adhered to an adherend. In the manufacturing method of an IC tag label in which an IC tag having an antenna pattern and an IC chip is attached to a release paper,
Coating the surface of the release paper to which the IC tag is attached with a protective film from above the IC tag;
Forming the protective film into a shape larger than the IC tag;
An IC tag label manufacturing method comprising:   5. The method for producing an IC tag label according to claim 4, wherein the protective film is a transparent film.   5. The method of manufacturing an IC tag label according to claim 4, wherein the protective film can be adhered to an adherend.

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