JP2004094502A - Method for forming antenna wiring pattern - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for forming an antenna wiring pattern for manufacturing a coil-shaped antenna wiring pattern in a non-contact data carrier with satisfactory working efficiency and high working precision, which is suitable for mass production. <P>SOLUTION: One face of a conductive layer 111 is coated with a thermoplastic adhesive layer 112, and the conductive layer 111 is press-fitted and laminated through the adhesive layer 112 on the face of a base material 113. Then, peripheral shape snap blades 121 of an antenna wiring pattern 111A are formed, and the conductive layer part 111 and the adhesive layer part 112 are torn while the base material 113 is linked by using a snap die 120 where projecting heating part 122 is formed between the snap blades 121. Then, the heating part 122 is heated, and the bonding performance of the base material 113 and the conductive layer 111 is improved. The above mentioned processes are almost simultaneously carried out in this order, and then the conductive layer 111 other than the antenna wiring pattern part 111A is peeled. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for forming an antenna wiring pattern for a non-contact data carrier, and in particular, to form an antenna wiring pattern from a processing material having a conductive layer formed on a surface of a base material via an adhesive layer. About the method.
[0002]
[Prior art]
In view of the confidentiality of information, the use of IC cards has gradually spread, and in recent years, non-contact type IC cards that exchange information without contacting a read / write device (reader / writer) have been used. In recent years, various non-contact IC tags in the form of sheets or tags, in which an IC carrying data is connected to antenna wiring, have been proposed and used in products, packaging boxes, etc. to prevent shoplifting, distribution systems, and the like. It has come to be.
Such non-contact type IC tags and non-contact type IC cards are capable of receiving and transmitting radio waves of a predetermined frequency, and are also called RFID (Radio Frequency Identification) data carriers. Is provided with a coil-shaped antenna wiring pattern, and a resonance circuit is formed by the antenna wiring pattern and the capacitance element and the like, so that a radio wave of a predetermined frequency can be received and transmitted.
[0003]
Resonant tags that have antenna wiring but do not require an IC are also used in products, packaging boxes, and the like to prevent shoplifting, distribution systems, and the like.
Also, recently, a non-contact type IC tag or a non-contact type in which a coil-on-chip type IC provided with an antenna wiring pattern on a terminal surface of an IC chip as a data carrier is mounted in a non-contact manner. IC cards have also been proposed.
In addition, here, the non-contact IC tag and the resonance tag are also referred to as a non-contact tag, and the non-contact IC tag and the resonance tag and the non-contact IC card using the antenna wiring are included. Is referred to as a non-contact data carrier.
[0004]
A coil-shaped antenna wiring pattern in a non-contact data carrier has been mainly manufactured by forming a resist pattern on an aluminum layer laminated on a base material and etching the resist pattern.
However, in the case of using the etching method, equipment for resist plate making and equipment for etching are required, and a resist pattern must be prepared for each product. There was a limit to raising it.
[0005]
On the other hand, when the coil-shaped antenna wiring pattern in the non-contact data carrier is directly formed by using a punching blade, the blade forming portion that has become a convex portion formed by etching is further processed by a human or a machine. A method has been adopted in which flat press punching is performed using a pinnacle blade formed by shaving into a blade shape.
However, it is difficult to form a punching blade close to 1 mm or less in one mold due to the production of the punching blade formed by this method. To cope with this, the present inventor has disclosed in Japanese Patent Application No. 2001-222555. Thus, a method has been proposed in which two types of punching blades are used to press-punch each of the punching blades and combine them to form an antenna wiring pattern having a desired shape.
For example, when forming an antenna wiring pattern having the shape shown in FIG. 4A, two types of punching blades having the shapes shown in FIGS. 4B and 4C are used.
A method using these two types of punching blades will be briefly described with reference to FIG.
The process shown in FIG. 5 is performed by using an adhesive layer 442 on a base material 441 such as polyester. 5-0. For a processing material in which an aluminum layer 443 having a thickness of 6 mm is laminated, a first punching die 420 shown in FIG. 4B and a second punching die 430 shown in FIG. The adhesive layer 442 is subjected to punching to form an antenna wiring pattern 410 as shown in FIG.
FIG. 5 is a process sectional view showing the fabrication of the antenna wiring pattern along F1-F2 in FIG.
First, a predetermined position is punched by the first punching die 420. (FIG. 5A) Next, another predetermined position is punched out by the second die 430. (FIG. 5 (b))
At this stage, the shape shown in FIG. 4A has been punched at the boundary of the antenna wiring pattern.
Next, the convex heating part having the antenna wiring pattern shape shown in FIG. 4A is pressed against the antenna wiring pattern part having the boundary part punched out, and the area in contact with the convex part is heated. The adhesiveness is improved only in that region. (FIG. 5 (c))
Thereafter, by removing an unnecessary aluminum layer between the lines of the antenna wiring pattern, a desired antenna wiring pattern is formed on the base substrate 1. (FIG. 5 (d))
In this way, the antenna wiring pattern is formed using the two types of punching blades.
[Problems to be solved by the invention]
As described above, the method of forming an antenna pattern by using two types of punching blades can reduce the distance between antenna lines. However, since two types of punching blades are used, the position control of the two types of punching blades is performed. In addition, it is difficult to control the position of the convex heating portion having the antenna wiring pattern shape, and the work efficiency is poor, which is unsuitable for mass production.
The present invention provides a method for forming a coil-shaped antenna wiring pattern in a non-contact data carrier, which has high work efficiency, is suitable for mass production, and can be processed with high accuracy. It is what we are going to offer.
[0007]
[Means for Solving the Problems]
The method for forming an antenna wiring pattern of the present invention is a method for forming an antenna wiring pattern for a non-contact data carrier from the processing material using the conductive layer as a processing material for preparing an antenna wiring pattern, After the laminating step of coating and forming a thermoplastic adhesive layer on one surface of the conductive layer, and further pressing and laminating the conductive layer on the surface of the base substrate via the adhesive layer, or together with the laminating step, the antenna wiring pattern An outer shape of the outer shape is formed, and a punch having an antenna wiring pattern shape with a convex heating portion formed between the outer shapes is used. The conductive layer and the adhesive layer are cut off while the base material is connected at the pressed position and the base is connected. The heating step is carried out almost simultaneously in this order, in which the area in contact with the heating section is heated by pressing together with the corner forming section, and the area in contact with the heating section is heated only to improve the adhesiveness between the base material and the conductive layer. A cooling step is performed, wherein cooling is performed if necessary, and a conductive layer other than the antenna wiring pattern portion is peeled off to form a desired antenna wiring pattern on the base material.
In the above, the cutting blade is an engraving blade.
Further, in the above, the heat supply source to the heating unit is a dielectric heating type heater.
Further, in the above, the punching step is such that, while rotating the roll-shaped rotary die with a rotary cutter attached to a roll-shaped rotary die, the conductive layer portion is cut by a blade at a position along the side line thereof. And the adhesive layer portion.
Further, in the above, the adhesive layer of the conductive layer portion that is not in contact with the base substrate and the heating section is a first base substrate and a first adhesive layer, respectively. A second adhesive layer having a higher adhesiveness than the first adhesive layer is disposed on the entire surface of one surface of the second base substrate different from the material, and the conductive layer laminated on the first base substrate is provided. The second base substrate is pressed against the layer side via the second adhesive layer, and is further separated, so that the antenna wiring pattern portion is provided on the second base substrate side via the second adhesive layer. The conductive layer portion other than the above and the first adhesive layer on the first base substrate side of the conductive layer portion are transferred and removed.
In the above, the conductive layer is an aluminum layer or a copper layer.
In the above, the non-contact data carrier is an IC tag.
In addition, the engraving blade referred to herein is a metal that is formed by shaving a metal using an NC machine. It has a processing accuracy of about 4 mm pitch width.
If necessary, a heat-treated or chrome-plated blade is used.
In addition, to tear the conductive layer portion and the adhesive layer portion means that the conductive layer portion and the adhesive layer portion are penetrated by a punching blade so as to penetrate the conductive layer portion and the adhesive layer portion.
[0008]
[Action]
The method for forming an antenna wiring pattern according to the present invention, by adopting such a configuration, makes it possible to produce a coil-shaped antenna wiring pattern in a non-contact data carrier with high working efficiency, suitable for mass production, and with high precision in processing. It is possible to provide a method for forming an antenna wiring pattern.
Specifically, after a laminating step in which a thermoplastic adhesive layer is applied and formed on one surface of the conductive layer, and further a pressure-sensitive adhesive layer is laminated on the surface of the base substrate via the adhesive layer, or Along with, forming a punching blade of the outer peripheral shape of the antenna wiring pattern, and, using a punching die formed with a convex heating portion of the antenna wiring pattern shape between the punching blades, the punching blade of the outer peripheral shape of the antenna wiring pattern, Pressed against the material for processing, at the pressed position, in a state where the base material is connected, torn the conductive layer portion and the adhesive layer portion, a punching step, a convex heating portion of the antenna wiring pattern shape, The heating step is performed almost simultaneously in this order, in which the area in contact with the antenna forming section is pressure-contacted, the area in contact with the heating section is heated, and only that area is improved in the adhesiveness between the base material and the conductive layer. Cool as needed , By peeling off the conductive layer other than the antenna wiring pattern portion to form the desired antenna wiring pattern on the base substrate, by carrying out the stripping step, we have achieved this.
That is, a punching step and a heating step are performed in this order by using a punching die in which a punching blade having an outer peripheral shape of the antenna wiring pattern is formed, and a convex heating unit having the antenna wiring pattern shape is formed between the punching blades. Since the steps are performed almost simultaneously, there is no problem of the positional accuracy of the punching blades of the two dies and the positional accuracy of the convex heating portion of the antenna wiring pattern shape as in the process shown in FIG. It can be formed on the base substrate.
In particular, by using an engraving blade as the punching blade, it is possible to form an antenna wiring pattern with high processing accuracy.
In addition, since the heat supply source to the heating unit is a dielectric heating type heater, it is possible to uniformly heat the convex heating unit, and as a result, the heating of the adhesive layer heated by the heating unit is uniform. That can be done.
In the punching step, the punching blade is a rotary cutter attached to a roll-shaped rotary die, and while rotating the roll-shaped rotary die, the conductive layer portion and the adhesive layer are cut by a blade at a position along the side line thereof. Or in the peeling step, the peeling step has a stronger adhesiveness than the first adhesive layer over the entire surface of one surface of the second base material different from the first base material. By disposing a second adhesive layer, the second base substrate is pressed against the conductive layer side laminated on the first base substrate via the second adhesive layer, and further separated from the conductive layer. The conductive layer portion other than the antenna wiring pattern portion and the first adhesive layer of the conductive layer portion on the first base substrate side are transferred to the second base substrate side via the second adhesive layer. In particular, it can be produced with good mass productivity. That.
Examples of the conductive layer include an aluminum layer and a copper layer. However, the conductive layer is not limited thereto as long as it has conductivity and has good workability.
This is particularly effective when the non-contact data carrier is an IC tag.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of a method for forming an antenna wiring pattern according to the present invention will be described with reference to the drawings.
FIG. 1 is a process cross-sectional view showing steps of a first example and a second example of an embodiment of a method of forming an antenna wiring pattern according to the present invention, and FIG. 2A is a first example shown in FIG. FIG. 2B is a schematic cross-sectional view of a punching die at a position A1, and FIG. 2B is a cross-sectional view showing a peeling step at a position A2. 3 (a) is a view from the A0 side in FIG. 2 (a), and FIG. 3 (b) is a view showing a shape of a punching blade for pulling out the outer periphery of the unit antenna wiring pattern.
The thin arrow in FIG. 2 indicates the moving direction.
In FIG. 1, solid arrows indicate steps of the first example, and dotted arrows indicate steps of the second example.
In FIG. 1, 111 is a conductive layer, 111A is an antenna wiring pattern, 111B is a conductive layer of a peeling portion, 112 is a (thermoplastic) adhesive layer (also referred to as a first adhesive layer), 112a is a melting portion, 112b is a portion that does not melt, 113 is a base substrate (also referred to as a first base substrate), 115 is a substrate having a conductive layer provided with an adhesive layer (also simply referred to as a substrate), 116 is a laminate, 118 Is a punching blade forming area of a unit pattern shape, 120 is a punching die, 121 is a punching blade, 122 is a heating unit, 123A is a concave portion, 123B is a concave portion, 130 is a rotary die (also simply referred to as a roll), and 140 is a press-contact roll. (Also referred to as a pressing roll or simply a roll), 150 is a cooling roll (also referred to as a chill roll), 160 is a second base substrate supply roll, 170 is a product winding roll, 180 Substrate, 185 is a substrate, 190 is the substrate, the second base substrate 191, 192 second adhesive layer, 195 is a base material.
[0010]
A first example of an embodiment of a method for forming an antenna wiring pattern according to the present invention of this example will be described.
A first example is a method in which a conductive layer is used as a processing material for manufacturing an antenna wiring pattern, and an antenna wiring pattern for a non-contact data carrier is formed from the processing material. A laminating step of applying and forming a thermoplastic adhesive layer 112, and further pressing and laminating the conductive layer 111 on the surface of the base substrate 113 via the adhesive layer 112, and an engraving blade having an outer peripheral shape of the antenna wiring pattern. A punching blade is formed, and a punching die having an antenna wiring pattern-shaped convex heating section 122 formed between the punching blades is used, and a punching blade having an outer peripheral shape of the antenna wiring pattern is pressed against the material for processing, At the press-contact portion, while the base material is connected, the conductive layer portion and the adhesive layer portion are cut off, and the punching step and the convex heating portion 122 having the antenna wiring pattern shape are performed by the antenna. A heating step of heating the region in contact with the heating portion 122 by pressing together with the forming portion and improving the adhesiveness between the base material 113 and the conductive layer 111 only in that region is performed almost simultaneously in this order. Further, a peeling step of forming a desired antenna wiring pattern on the base substrate 113 by peeling off the conductive layer 111 other than the antenna wiring pattern portion is performed.
In this example, the processing is performed by, for example, the apparatus shown in FIG.
[0011]
Hereinafter, a first example will be described with reference to FIGS. 2 and 3 based on FIG.
First, a thermoplastic adhesive layer 112 is applied and formed on one surface of the conductive layer 111, and a base material 115 having an adhesive layer provided on the conductive layer is prepared (FIG. 1A). At the same time as the base substrate 113 (FIG. 1B) for support and lamination, the punching step and the heating step are performed almost simultaneously in this order by the punching die 120 (FIG. 1D).
In the apparatus shown in FIG. 2 (a), a belt-shaped base material 115 and a base material are transported and supplied between a rotary die 130 having a punching die and a roll 140 for pressing. The base material 115 and the base material are rotated while being sandwiched and pressed by 130 and the press roll 140, and this step is performed almost simultaneously.
In this case, as shown in FIG. 3, the pressure welding is performed at a position in a direction along the line B <b> 1-B <b> 2 of the rotary die 130 (this is also referred to as a side line direction).
When the unit punching blade pattern 118 is like the pattern shown in FIG. 3B, its B3-B4 cross section is as shown in FIG. 2B.
In addition, FIG. 1D shows a state in which the outer peripheral shape of the antenna wiring pattern is pressed and pressed, and the conductive layer 111 and the adhesive layer 112 are cut off at the pressed position while the base material 113 is connected. In this state, a stopped state is shown.
In this state, in the antenna wiring pattern forming region, the conductive layer 111 is in contact with the heating portion 122 between the punching blades 121, and in the other region where the antenna wiring pattern is not formed, the conductive layer 111 A space is formed in the concave portion 123 of FIG.
As the conductive layer 111, an aluminum foil having a thickness of 15 μm to 50 μm is generally used in terms of conductivity and workability, but a copper foil can also be used.
As the thermoplastic adhesive layer 112, a PET (polyethylene terephthalate) film having a thickness of about 38 μm to 100 μ is usually used for the base material 113, so that a polyester-based adhesive having a thickness of 2 μm to 5 μm is used.
An engraving blade is used as the punching blade 121. The engraving blade is generally manufactured by cutting MS steel or the like using an NC machine and performing heat treatment (H-022-85) or chrome plating as needed. And 0. Processing up to a pitch width of about 35 mm is possible.
The thermoplastic adhesive layer 112 presses the convex heating portion 122 having the antenna wiring pattern shape to the antenna wiring pattern forming portion whose outer peripheral portion is pulled out by the punching blade, and applies heat and pressure to the portion. The conductive layer 111 and the base material 113 are melt-bonded.
[0012]
Heating to the adhesive layer 112 is mainly conducted by heat. In the antenna wiring pattern forming area, heat is well transmitted from the heating unit 121 to the adhesive layer 112 via the conductive layer 111 to form another antenna wiring pattern. In regions where heat is not applied, heat is difficult to be transmitted.
In this example, since the heat supply source to the heating unit 122 is a dielectric heating type heater (not shown), it is possible to uniformly heat the convex heating unit 121. The heating of the adhesive layer 112 to be heated by the heating unit 121 can be made uniform.
In FIG. 1D, reference numeral 112a denotes a portion that is melted by heating, and when cooled and completely cured, the adhesion between the conductive layer and the base material is improved.
Reference numeral 112b denotes a portion that does not melt, and there is almost no change in the adhesiveness of the adhesive layer 112.
The conductive layer 111 in the region of the portion 112a to be melted is an antenna wiring pattern portion.
[0013]
Next, the punching die 120 was separated from the base material side, and the whole conductive layer was cooled, and a cooling treatment for hardening the melted adhesive layer was performed (FIG. 1E). A part of the conductive layer of the area 112b where the adhesiveness is not improved is removed together with the adhesive layer of the part, leaving the antenna wiring pattern 111A (111) as a part of the conductive layer. (Fig. 1 (f))
In the apparatus shown in FIG. 2A, cooling is performed while transporting the cooling roll 150 such that the surface of the conductive layer 111 is attached to the roll 150.
Then, after cooling, as shown in FIG. 3C, a second base substrate 191 having a second adhesive layer 192 having adhesiveness stronger than that of the adhesive layer 112 provided on one surface thereof, and a second adhesive layer While being conveyed such that the conductive layer 111 side is in contact with the conductive layer 111 via 192, the conductive layer 111 is sandwiched and separated between the rolls 171 and 172, leaving the antenna wiring portion pattern and leaving the adhesive layer 112 corresponding to the other conductive layer portion 111. Is transferred to the second base material side, thereby removing and removing.
Here, the adhesive force of the adhesive layer 112 at the melted, cooled, and cured portions is greater than the adhesive force of the second adhesive layer.
Thus, the antenna wiring pattern 111A is formed on the base substrate 113.
[0014]
Next, a second example of an embodiment of a method for forming an antenna wiring pattern according to the present invention will be described.
In the first example, the laminating step of the base material 115 and the base substrate 113 and the punching step, which are performed simultaneously, are performed separately in the order of the laminating step and the punching step. This is performed in the same manner as in the first example, and the processes after the punching step are basically the same as those in the first example, and description thereof will be omitted.
Needless to say, the apparatus shown in FIG. 2 can be applied to the second example.
In FIG. 2A, the base material 116 after the laminating step (FIG. 1B) may be transported and supplied between the rotary die 130 provided with a punching die and the press-contact roll 140.
[0015]
The apparatus shown in FIG. 2A processes a strip-shaped base material while continuously transporting the strip-shaped base material to form an antenna wiring pattern on the strip-shaped base material 111. The second example is not limited to this.
The present invention is also applicable to a case where a sheet-shaped substrate is processed for a single sheet.
The apparatus shown in FIG. 2 is a rotary die cutter for punching a base material between a rotary die 130 having a punching die and a roll 140 for press-contacting around the die, and pulling out a large or dense antenna wiring pattern. In some cases, this is advantageous, but in other cases, a flat press method can be employed.
In the case of the apparatus shown in FIG. 2 (a), the contact is made only in the B1-B2 direction (side line direction) shown in FIG. 3 (a), so that the contact area is small, and the pressure for pulling out is small as a whole. It is possible to cope with a case where a large or dense antenna wiring pattern is removed.
Further, the apparatus shown in FIG. 2 employs a peeling step of transferring to the second base material 191 side, but there is also a method of peeling using a hand or a suction part or the like.
[0016]
【The invention's effect】
The present invention provides, as described above, a method of forming an antenna wiring pattern in a non-contact data carrier, which has a high working efficiency, is suitable for mass production, and can be processed with high accuracy. Made it possible.
[Brief description of the drawings]
FIG. 1 is a process cross-sectional view showing processes of a first example and a second example of an embodiment of a method for forming an antenna wiring pattern of the present invention.
FIG. 2A is a schematic configuration diagram of an apparatus for implementing the method of forming an antenna wiring pattern of the first example shown in FIG. 1, and FIG. 2B is a cross section of a punching die at a position A1. FIG. 2B is a cross-sectional view showing a peeling step at the position A2.
3 (a) is a view from the A0 side of FIG. 2 (a), and FIG. 3 (b) is a view showing a shape of a punching blade for extracting the outer periphery of a unit antenna wiring pattern; .
FIG. 4 is a diagram showing an antenna wiring pattern to be manufactured and a shape of a punching blade.
FIG. 5 is a process sectional view of a conventional method for processing an antenna wiring pattern using a punching blade.
[Explanation of symbols]
111 Conductive layer 111A Antenna wiring pattern 111B Conductive layer 112 at peeled part (thermoplastic) adhesive layer (also referred to as first adhesive layer)
112a Melted portion 112b Non-melted portion 113 Base material (also referred to as first base material)
115 Substrate in which adhesive layer is disposed on conductive layer (also simply referred to as “substrate”)
116 laminated body 118 punching blade forming area 120 of unit pattern shape punching die 121 punching blade 122 heating unit 123A recess 123B recess 130 rotary die (also simply called roll)
140 Roll for pressure contact (also called press roll or simply roll)
150 Cooling roll (also called chill roll)
160 second base substrate supply roll 170 product take-up roll 180 substrate 185 substrate 190 substrate 191 second base substrate 192 second adhesive layer 195 substrate 410 antenna wiring pattern 420 first punch Mold 421 Extraction blade 421A Extraction section 430 Second extraction mold 431 Extraction blade 431A Extraction section 441 Base substrate 442 Adhesive layer 443 Aluminum layer

Claims (7)

A method for forming an antenna wiring pattern for a non-contact data carrier from the processing material using the conductive layer as a processing material for manufacturing an antenna wiring pattern, wherein a thermoplastic adhesive layer is formed on one surface of the conductive layer. After the laminating step of pressing and laminating the conductive layer on the surface of the base substrate via the adhesive layer, or together with the laminating step, forming an outer shape of the outer periphery of the antenna wiring pattern, and Using a punching die formed with a convex heating portion of the antenna wiring pattern shape between the punching blades, pressing the punching blade of the outer peripheral shape of the antenna wiring pattern against the material for processing, and pressing the base material at the press-contacted portion In the connected state, the conductive layer portion and the adhesive layer portion are cut off, and a punching step is performed. The convex heating portion having the antenna wiring pattern shape is pressed into contact with the antenna forming portion to form a region in contact with the heating portion. Is heated, and only in that region, the heating step of improving the adhesion between the base material and the conductive layer is performed almost simultaneously in this order. Forming a desired antenna wiring pattern on the base material by peeling the conductive layer, and performing a peeling step. 2. The method according to claim 1, wherein the punching blade is an engraving blade. 3. The method according to claim 1, wherein the heat supply source to the heating unit is a dielectric heater. The punching step according to any one of claims 1 to 3, wherein the punching blade is a rotary cutter attached to a roll-shaped rotary die. A method for forming an antenna wiring pattern, which comprises cutting off a layer portion and an adhesive layer portion. 5. The method according to claim 1, wherein the adhesive layer of the conductive layer that is not in contact with the base material and the heating unit is a first base material and a first adhesive layer, respectively. A second adhesive layer having a higher adhesiveness than the first adhesive layer was provided on the entire surface of one surface of a second base substrate different from the base substrate, and was laminated on the first base substrate. The second base substrate is pressed against the conductive layer via the second adhesive layer, and further separated from the conductive layer, so that the antenna wiring is formed on the second base substrate side via the second adhesive layer. A method for forming an antenna wiring pattern, comprising transferring and removing a conductive layer portion other than a pattern portion and a first adhesive layer of the conductive layer portion on a first base substrate side. 6. The method according to claim 1, wherein the conductive layer is an aluminum layer or a copper layer. 7. The method according to claim 1, wherein the non-contact data carrier is an IC tag.

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