JP2007022025A - Molding machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compression type molding machine which is free from wasting an encapsulating material while preventing malfunctional encapsulation. <P>SOLUTION: The molding machine which is so configured that a molding object is encapsulated by supplying a molding material with respect to each encapsulating unit into a compression molding die comprises a resin supplying part 100 which meters to divide and supply the molding material required for encapsulating the molding object, a checking part 300 which checks by re-metering whether the amount of the molding material divided and supplied by the resin supplying part 100 is within a predetermined range or not, and a discarding part 400 which discards the divided molding material when decided that the amount is out of the predetermined range. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention mainly relates to a molding apparatus that continuously seals electronic components and the like by compression molding.

  Conventionally, as described in Patent Document 1, a molding apparatus 1 for sealing an electronic component such as a semiconductor element with a resin is known (see FIG. 3).

  In this molding apparatus 1, a large number of spherical resin tablets 2 are arranged inside the resin supply path 5 connected to the storage chamber 6. The resin tablet 2 is restricted from flowing into the storage chamber 6 by the separation unit 4. The air cylinder 3 can operate the separation unit 4 according to the amount of resin required. That is, for example, when four spherical resin tablets are required, the air cylinder 3 is operated four times so that the four resin tablets flow into the storage chamber 6.

  The resin tablet stored in the storage chamber 6 is subsequently transferred into the mold 8 to seal the product to be molded.

JP-A-8-78444

  However, even when the resin as the molding material is supplied while being measured by some method (the operation of the air cylinder 3 and the separation unit 4 in the molding apparatus 1 described above), the supply amount is not always correct. . For example, in the example of the molding apparatus 1 described above, where the air cylinder should operate once and supply one resin tablet, two or more resin tablets are accidentally supplied to the storage room side, Conversely, it may happen that no supply is made.

  Furthermore, even if the supply amount itself is correct, a part of the resin may be lost during the transfer to the mold.

  In such a case, excessive or insufficient resin is supplied to the product to be molded, and sealing abnormality and resin waste (decrease in yield of molding material) occur.

  The present invention has been made to solve these problems, and provides a compression-type molding apparatus that prevents a sealing abnormality and eliminates waste of molding material.

  The present invention provides a molding apparatus for supplying a molding material into a compression molding die for each sealing unit and sealing the molding product, and a molding material necessary for sealing the molding product. A supply means for dividing and supplying while measuring, a determination means for determining whether or not the amount of the divided molding material divided and supplied by the supply means is within a predetermined range, and the determination means The above-mentioned problems are solved by providing a discarding unit that discards the divided molding material determined not to fall within the predetermined range.

  Thereby, it is possible to provide a compression-type molding apparatus that can surely perform sealing using a divided molding material that matches a predetermined condition and more reliably prevent a sealing abnormality. Note that “discard” as used in the present invention means to remove from the line at that time (not to be molded using the divided molding material as it is), and to necessarily discard the divided molding material itself. It is not a thing.

  The determination by the determination means is performed after collating the first management data given to the molded product and the second management data given to the divided molding material. It may be.

  As a result, it is possible to cope with even a small amount and a variety of production lines without confusion, and to appropriately deal with loss due to dropping from the line, resupply of divided molding materials, and the like.

  Furthermore, as a result of the determination, when a divided molding material that is not within the predetermined range is generated, it is determined that the divided molding material is supplied from the supply means after the divided molding material and is within the predetermined range. You may make it provide the stock means which can stock a division | segmentation molding material temporarily.

  As a result, in a continuous sealing operation, when an abnormal supply of molding material (divided molding material is outside the allowable range) is detected, normal (within the allowable range) among other divided molding materials that have already been weighed and supplied. ) Can be temporarily stocked, and further waste of the molding material can be prevented.

  Further, a calculation means for calculating a required amount of the divided molding material for the molded article is provided, and the first management data includes data relating to the required quantity calculated by the calculation means. Also good.

  Thereby, even if the amount of the molding material required for the continuously supplied workpieces is different, it is not necessary to reset the necessary amount.

  The supply means may be capable of re-supplying a divided molding material that replaces the divided molding material discarded by the discarding means based on the first management data.

  As a result, the alternative molding material can be re-supplied without detecting the molded product again, and it is not necessary to remove the molded product that should have been sealed by the discarded molding material from the line. An increase in the cycle time of the apparatus can be prevented.

  In addition, “weighing” in the present invention does not simply mean weight, but has a broad meaning including concepts such as dimensions, volume, number, etc. If any one of these is measured, Included in the category “Weighing”.

  According to the present invention, it is possible to provide a compression-type molding apparatus that prevents sealing abnormality and further eliminates waste of molding material.

  An example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a diagram schematically illustrating a flow from the supply of a resin and a substrate to the sealing. Here, “resin” is shown as a representative example of a molding material, and “substrate” is shown as a representative example of a molded product, and is intended to be limited to this. Absent. In FIG. 2, the resin and the substrate are expressed as management data that is an identification mark given to each.

  The molding apparatus of the present embodiment includes a resin supply unit 100, a determination unit 300, a resin disposal unit 400, a resin stock unit 500, a calculation unit 600, and a sealing unit 700.

  The resin supply unit (supply unit) 100 includes a known resin supply mechanism 105, and a molding material necessary for sealing the molded product is set based on a preset value or data from the calculation unit 600. (Details of this point will be described later), and it can be divided and supplied while measuring. The resin supply unit 100 according to the present embodiment further includes a resin tableting mechanism 110 that compresses the measured and supplied resin into a shape suitable for sealing. Various modes of the resin supplied by the resin supply mechanism 105 are conceivable, for example, there are various modes such as powder and granules.

  The determination unit (determination unit) 300 determines whether or not the amount of resin (divided molding material) divided and supplied from the resin supply unit 100 is within a predetermined range immediately before sealing. Therefore, the resin tableted by the resin tableting mechanism 110 can be measured and determined again.

  That is, the determination unit 300 includes an arithmetic processing unit such as a microcomputer (not shown), and whether the re-weighed resin amount is normal (within an allowable range) or abnormal (out of the allowable range) based on a preset setting value. Can be determined.

  The resin discarding unit (discarding unit) 400 discards the resin determined by the determination unit 300 to be not within the predetermined range.

  The resin stock unit (stock unit) 500 is supplied by the resin supply unit 100 after the resin when a resin that is not within the predetermined range is generated as a result of the determination by the determination unit 300, and the predetermined range. Resin determined to be in stock is temporarily stocked. That is, at the stage where the resin to be discarded is determined (confirmed) by the resin discarding unit 400, the determination unit 300 selects “of the resins already supplied from the resin supply unit 100 due to the supply timing”. Resin determined to be “normal” can be temporarily stocked.

  The calculation unit (calculation means) 600 can detect and recognize the number of chips mounted on a substrate, which is a molded product, and can calculate the required amount of resin. The calculation unit 600 in the present embodiment detects (recognizes) the number of chips and calculates the amount of resin that is required, but is not limited to this. For example, it may be calculated by detecting the size, thickness, position, etc. of the chip, or may be calculated by combining these.

  The sealing portion 700 is a portion where the substrate and the resin are actually sealed, and corresponds to the cavity 7 in the molding apparatus 1 described as the conventional example.

  Next, management data used in the present embodiment will be described with reference to FIG.

  Symbol A is a configuration example of substrate management data given to a substrate which is a molded product as first management data, and symbol B is a resin management given to resin which is a molding material as second management data. It is a structural example of data.

  The board management data A includes the ID number 10 unique to each board, the number of chips 20 recognized by the calculation unit 600, the theoretical required amount (required resin amount) 30 calculated based on the number of chips 20 and the like. It is.

  On the other hand, in the resin management data B, in addition to the substrate management data A, in addition to the ID number 10, the number of chips 20 and the theoretical required amount 30, the result of measurement when being measured and supplied by the resin supply unit 100 is obtained. A certain actual measurement value 40, a remeasurement value 50 that is a remeasurement result in the determination unit 300, a determination result 60, and the like are included. This configuration is shown as an example of the embodiment, and not all data is an essential configuration for the present invention.

  Next, the operation of the molding apparatus in this embodiment will be described.

  In this molding apparatus, the sealing operation is sequentially performed. That is, the supply of the next resin is not started after the one substrate and the resin are completely sealed, but the subsequent resin is sequentially supplied continuously until the resin is supplied and sealed. It is what is done.

  First, a substrate to be sealed with resin is detected by the chip recognition function in the arithmetic unit 600, and the required resin amount is calculated by the arithmetic unit 600 by recognizing the number of mounted chips. . Following this, data such as the unique ID number 10 and the number of chips 20 and the calculated theoretical required amount 30 of resin are given as a part of the substrate management data A to the detected substrate. Here, it is sufficient that at least the data of the ID number 10 and the theoretical required amount 30 are included, and the data of the number of chips 20 is not necessarily required.

  “Applying data” may be directly attached to the board in the form of characters, symbols, etc., for example, indirectly using a storage means such as a RAM for a specific object such as a captured image ( (Virtual) may be attached. The same applies to resin management data B described later.

  Thereafter, the substrate is carried to the sealing portion 700.

  On the other hand, using the substrate management data A given to the substrate, the resin supply unit 100 measures and supplies an amount of resin necessary for sealing. Further, these data (10, 20, 30) are also given as a part of the resin management data B to the measured and supplied resin. Further, the measured value when measured here is added to the resin management data B as the actual measured value 40. In this way, by providing management data to each of the continuously supplied workpieces and divided molding materials, management can be performed regardless of the supply order.

  The resin supplied by the resin supply unit 100 is sequentially tableted by a resin tableting mechanism 110 provided in the resin supply unit 100 to be in a state suitable for sealing.

  Next, the resin after tableting is re-weighed by the determination unit 300. The measurement value that is the result is further added to the resin management data B as the re-measurement value 50.

  Subsequently, after an arithmetic processing unit such as a microcomputer provided in the determination unit 300 collates the data of the theoretical required amount 30 and the data of the reweighing value 50, the error is within a predetermined range set in advance. The determination result 60 is added to the resin management data B. The resin requirement 30 at this time may use the substrate management data A side or the resin management data B side. By doing so, it is possible to cope with even a small amount and a variety of production lines without any confusion, and to appropriately deal with loss due to dropping from the line, resupply of divided molding materials, and the like. In the present embodiment, various data are used as the resin management data B. However, it is sufficient that at least the ID number 10 and the reweighing value 50 that can grasp the correspondence with the substrate are included.

  As a result of the determination, if it is determined to be normal (the error is within the allowable range), it is carried to the sealing unit 700. On the other hand, if it is determined that there is an abnormality (the error is outside the allowable range), the resin is carried to the resin disposal unit 400 and the resin is discarded. By discarding the abnormal resin in this way, sealing abnormality can be prevented.

  Here, even when it is determined that the resin is abnormal in this way (when a divided molding material that is not within the predetermined range is generated), the resin subsequent to the abnormal resin has already been sequentially supplied. Among these already supplied resins, the resin whose determination result by the determination unit 300 is normal is transported to the resin stock unit 500 and temporarily stored.

  In the present embodiment, since the substrate management data A and the resin management data B exist, the stocked resin can be compared with the corresponding substrate without any problem, and only the resin determined to be abnormal can be discarded.

  That is, the resin supply unit 100 according to the present embodiment also serves as a re-supply unit that re-supplys the resin that replaces the resin discarded by the discard unit 400, and replaces the resin that has become abnormal as a result of the determination. Priority is given to the resin to be used. At this time, the resin supply unit 100 as the resupply means resupplys the resin based on the theoretical required amount 30 of the substrate management data A and / or the resin management data B.

  By using such a re-feeding means, it is no longer necessary to remove the substrate that was originally planned to be sealed by the resin determined to be abnormal from the sealing line, or to detect the substrate again. An increase in time can be prevented.

  Note that the re-supplied resin is also re-weighed by the determination unit 300, and is conveyed to the sealing unit 700 when normal and to the resin disposal unit 400 when abnormal, and further re-supplied.

  When the re-supplied resin is carried to the sealing unit 700, the corresponding resin stocked in the resin stock unit 500 is sequentially carried to the sealing unit 700.

  In the present embodiment, the arithmetic unit 600 has a chip number recognition function and detects the number of chips on each substrate. As a result, the types of substrates that are continuously supplied are different, and even if the required amount of resin is different, manual resetting of the amount of resin is unnecessary. However, in the case where all the substrates that are continuously supplied are of the same type, such a calculation unit is not necessarily required, and a necessary amount may be set in advance by a manual operation.

  The present invention can be widely used in a compression molding apparatus including a sealing apparatus.

Schematic diagram of flow from resin and substrate supply to sealing Configuration diagram of substrate management data and resin management data The molding apparatus described in Patent Document 1

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... ID number 20 ... Number of chips 30 ... Theoretical required amount 40 ... Actual measurement value 50 ... Reweighing value 60 ... Determination result 100 ... Resin supply part 105 ... Resin supply mechanism 110 ... Resin tableting mechanism 300 ... Determination part 400 ... Resin Disposal part 500 ... resin stock part 600 ... calculation part 700 ... sealing part

Claims (5)

A molding apparatus that supplies a molding material into a compression mold for each sealing unit and seals a molded product,
A supply means for dividing and supplying the molding material necessary for sealing the molded article while measuring;
Determination means for determining whether or not the amount of the divided molding material divided and supplied by the supply means is within a predetermined range set in advance;
A molding apparatus comprising: a discarding unit that discards the divided molding material determined to be not within the predetermined range by the determination unit. In claim 1,
The determination by the determination means is performed after collating the first management data given to the molded article and the second management data given to the divided molding material. A forming device. In claim 1 or 2,
Further, as a result of the determination, when a divided molding material that is not within the predetermined range is generated, the divided molding is supplied by the supply means after the divided molding material and is determined to be within the predetermined range. A molding apparatus comprising stock means capable of temporarily stocking material. In claim 2 or 3,
Furthermore, a calculation means for calculating a necessary amount of the divided molding material corresponding to the molded product,
The molding apparatus according to claim 1, wherein the first management data includes data relating to a necessary amount calculated by the calculation means. In any of claims 2 to 4,
The molding device according to claim 1, wherein the supply means is capable of re-supplying a divided molding material that replaces the divided molding material discarded by the discarding means, based on the first management data.

Images