JP2009253128A - Amount-of-resin decision device and resin sealing device including amount-of-resin decision device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To determine a required amount of resin easily, with accuracy of a required level without memorizing data of each semiconductor chip in advance. <P>SOLUTION: A resin sealing device 1, which seals a substrate 100 having a semiconductor chip multi-layer 102 with resin, includes a memory 10 which memorizes previously the volume Va of the whole multi-layer 102 when the multi-layer is normally laminated, a laser sensor 40 which detects the height of laminated layers H of the multi-layer 102, a means which provides imaginary areas of the number of provided thresholds e+1 by providing the thresholds e of the number less than n-2 between the bottom surface 102B and upper surface 102A of the multi-layer 102 when the number of layers of the multi-layer 102 in normal is n, a means which corresponds a predetermined rate of the volume Va of the whole multi-layer for each imaginary area, a means which selects any imaginary area based on the detected result of the laser sensor 40, and a means which supplies resin after increasing/reducing by increasing/reducing the resin equivalent to the predetermined rate corresponding to the selected imaginary area for a reference volume. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a technical field of a resin sealing device that seals a molded product on which a semiconductor chip is mounted with a resin.

  Since semiconductor components are easily affected from the outside as they are, they are sealed with a thermosetting resin or the like after being mounted on a substrate.

  When resin sealing is performed, a semiconductor component (semiconductor chip) is sealed in the cavity by using a cavity formed by matching the mold with the substrate clamped by an opposing resin sealing mold. Like to do.

  In recent years, semiconductor parts called stacked packages have been used in the field of mobile phone SRAM and the like. This is a stack of a plurality of semiconductor chips, and advanced functions can be expanded, so that the demand is rapidly expanding.

  However, in this type of semiconductor component, the number of stacked components may be uneven due to a defect in a previous process (such as a semiconductor stacking process). In this case, since the semiconductor component has not reached the planned number of layers (normal number of layers), the amount of resin to be filled in the cavity (the amount of resin required for sealing) is also set to the set value ( It will deviate from the reference amount. In particular, in the case of a resin sealing device using a compression molding method, the cavity is closed (unlike transfer molding), and the amount of resin cannot be increased or decreased during the compression process. Directly connected to product defects. Even in the case of transfer molding, since it is necessary to input the resin after allowing for the amount of resin that may be insufficient due to poor stacking, the resin cost may be higher than necessary.

  In Patent Document 1, as a technique for such a problem, the height of the semiconductor chip is measured by reading the focal length of the reflected light obtained by irradiating the semiconductor chip with laser light, and from this height measurement value. There has been proposed a technique for determining a chip stacking amount and calculating an amount of resin to be compensated for an insufficient semiconductor component or an amount of resin to be not compensated.

  More specifically, information (semiconductor chip thickness data, semiconductor chip volume data, etc.) for each stacked semiconductor chip is stored in advance. Then, it is determined how many semiconductor chips are laminated (or not laminated) from the semiconductor chip thickness data and the height measurement value, and further laminated (or not laminated). Using the volume data for each semiconductor chip, the amount of resin to be filled (or not to be filled) is calculated.

  In addition, for example, a method of detecting the presence / absence of a semiconductor chip and adjusting the amount of resin to be supplied by imaging with a camera from the stacking height direction of the semiconductor chips is also known.

JP 2006-134917 A

  However, although the method of Patent Document 1 has a merit that the accuracy of the resin supply amount is high, the amount of data that should be stored in advance (to be input) becomes enormous, and the calculation processing becomes complicated. In addition, there is a high possibility that an incorrect value is input when inputting a large amount of data. If an incorrect value is input, even if the stacking height is detected with high accuracy, it is impossible to seal the resin with an accuracy corresponding to the detected height. From a different perspective, it means that the resin cannot be sealed unless these data are available. For example, if the department that holds the detailed data of the chips to be stacked is different from the department that performs the sealing work (usually even a manufacturer is considered to be different), information beyond the department is required to start the resin sealing work. Exchange is required.

  Further, the value obtained by adding the data of each semiconductor chip and the value when actually stacked are not always the same. For example, if there is an adhesive layer for adhering semiconductor chips, an error may occur in the actual stacking height. Also, the actual stacking height can vary depending on the individual bonding mode. If these errors are accumulated, for example, when only 5 sheets are stacked, it may be determined that 6 sheets are stacked, which causes a large error in the final resin supply amount. In addition, when it is necessary to re-input the data of each chip for some reason, if the individual data is lost afterwards, it becomes impossible to operate the apparatus. In particular, it is envisaged that these problems can become more apparent in proportion to the increase in the number of stacked semiconductor chips.

  On the other hand, with the method of detecting the presence or absence of a semiconductor chip with a single camera, the presence or absence of a semiconductor chip can be easily detected, but it is difficult to determine how many are stacked, for example, Whether only one sheet is stacked or five sheets are stacked, the same detection result is “present”. That is, the amount of resin to be supplied cannot be accurately determined. It is envisaged that this problem may become more prominent in proportion to an increase in the number of stacked semiconductor chips.

  The present invention has been made to solve such problems, and can determine the required amount of resin more easily and with a required level of accuracy without storing data of individual semiconductor chips in advance. The present invention provides a resin sealing device and a resin amount determination device that can perform the above.

  The present invention is a resin sealing device that seals a molded article having a laminated body on which conductor chips are laminated with a resin, and the volume of the entire laminated body when the laminated body is normally laminated. Means for storing in advance, stacking height detecting means for detecting the stacking height of the stack, and when the normal stack number of the stack is n, n− between the bottom surface and the top surface of the stack Means for setting a threshold value in the stacking height direction of 2 or less to set a virtual area corresponding to the set threshold number + 1, and means for associating a predetermined ratio of the volume of the entire stack with each virtual area And a means for selecting any one of the virtual areas based on a detection result of the detection means, and a resin corresponding to the predetermined ratio corresponding to the selected virtual area is increased or decreased with respect to a reference amount. And means for supplying the resin after the increase and decrease, It is intended to solve the above problems by obtaining.

  With such a configuration, it is not necessary to input data on the thickness and volume of each semiconductor chip stacked in advance. That is, it is sufficient to prepare a volume value of the entire laminated body when it is normally laminated, and a complicated operation of inputting a large number of data is not necessary. Further, when the selection of which virtual region the stacking height of the semiconductor chip is in is completed by the stacking height detecting means, it is only necessary to increase or decrease the predetermined amount of resin that is associated in advance from the reference amount. Further, processing such as adding data for each semiconductor chip is unnecessary, and the amount of data to be processed can be reduced and the processing speed is also improved. Furthermore, the amount of resin to be supplied can be adjusted in a stepwise manner as compared with the presence / absence determination by the camera. Further, the accuracy of the resin amount can be easily dealt with by changing the number of thresholds set according to the property or type of the product, for example.

  Further, the stack height detecting means is constituted by a pair of sensors arranged so as to sandwich the molded product from the stack height direction, and the upper surface of the stacked body and the stacked body of the molded product are You may detect by measuring the surface which is not laminated | stacked with the said sensor. In this way, even when the molded product itself (for example, the substrate) on which the semiconductor chips are laminated is warped or the molded product vibrates at the time of detection, the original (accurate) ) The stacking height can be detected.

  In addition, the following effects are exhibited particularly when the molded product has a plurality of the laminated bodies arranged in a matrix (in the case of so-called MAP sealing).

  At the current technical level, most of the plurality of laminated bodies are normally laminated, and few have a few laminated layers. Under such circumstances, there are cases where detailed management based on the data of each semiconductor chip is rejected. That is, it is possible to determine that a normal laminated body that occupies the majority is abnormal due to a data input error, a cumulative error of the laminated layer, and the like, and adjust the resin supply amount based on the determination. However, as in the present invention, by setting the number of thresholds to n−2 or less (in other words, roughly setting the thresholds), even if there is some cumulative error, the majority of normal laminates are inherently As described above, it can be determined as “normal”, and the above inconvenience can be eliminated.

  The present invention is a resin amount determining device that determines a resin amount to be supplied to a resin sealing device that seals a molded product having a stacked body on which semiconductor chips are stacked with resin. Means for preliminarily storing the volume of the entire laminated body when the body is normally laminated, laminated height detecting means for detecting the laminated height of the laminated body, and the normal number of laminated bodies of the laminated body is n Means for setting a virtual area corresponding to the set threshold number + 1 by setting a threshold value in the stacking height direction of n-2 or less between the bottom surface and the top surface of the stacked body, and the virtual area A means for associating a predetermined proportion of the volume of the entire laminate, a means for selecting any one of the virtual regions based on a detection result of the detection means, and the predetermined proportion corresponding to the selected virtual region The resin equivalent to It is also possible to catch the resin amount determination apparatus characterized by comprising, means for supplying the resin after the increase or decrease in terms of reduced is.

  By applying the present invention, it is possible to determine the required amount of resin more easily and with a required level of accuracy without storing data of individual semiconductor chips in advance.

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a schematic configuration diagram of a resin sealing device 1 which is an example of an embodiment of the present invention. Although the present invention is applied as a device constituting a part of the resin sealing device, the basic configuration of the resin sealing device itself is not particularly different from the conventional configuration. The explanation will be focused on the “determination device for required resin amount”.

  For convenience of explanation, the surface of the substrate on which the semiconductor chips are stacked is referred to as “front surface” or “upper surface”, and the opposite side is referred to as “back surface” or “bottom surface”. However, it is not intended to exclude the case where semiconductor chips are stacked on both sides of the substrate.

<Configuration of resin amount determination device>
The resin amount determining device 2 includes a pair of first and second laser sensors arranged so as to sandwich a substrate (molded product) 100 having a semiconductor chip stacked body 102 from the stacking height direction (vertical direction in FIG. 1). (Stacking height detection means) 40A and 40B are provided. The first and second laser sensors 40A and 40B are synchronized, and are movable in the front-rear direction of the drawing at a predetermined timing. On the other hand, the substrate 100 is held by a substrate transport mechanism (not shown) and can be moved in the left-right direction in the drawing at a predetermined timing.

  In this embodiment, a plurality of semiconductor chip stacks 102 are arranged on the lower surface side of the substrate 100, but there is no problem even if it is on the upper surface side. Further, from the drawing, it can be seen that five semiconductor chip stacks 102 are arranged in the left-right direction of the substrate 100. Similarly, the semiconductor chip stacks 102 are also arranged in the front-back direction of the drawing. That is, the semiconductor chip stacked body 102 is arranged on the substrate 100 in a matrix.

  The first laser sensor 40A disposed above the substrate 100 is capable of detecting the position (height) of the back surface of the substrate 100 by receiving the reflection of the laser emitted from itself. On the other hand, the second laser sensor 40A disposed below the substrate 100 receives the reflection of the laser emitted from itself, and detects the position (height) of the upper surface 102A of the semiconductor chip 102 and / or the surface of the substrate 100. It is possible to do.

  The first and second laser sensors 40 </ b> A and 40 </ b> B are connected to the calculation unit 20 and can transmit the detection result to the calculation unit 20 in real time. The calculation unit 20 is also connected to the storage unit 10 and the resin supply unit 30.

  The storage unit 10 can store various data. Here, when the semiconductor chip stacked body 102 is normally stacked, the volume Va of the entire stacked body 102, threshold data e1, e2,..., Virtual regions a, b. The ratio of the resin amount corresponding to the area (details will be described later) is stored. These data may be manually input to the storage unit 10 or may be automatically loaded using another information source (for example, device information of the previous process). Good. It is also possible to store data sent from the calculation unit 20.

  The arithmetic unit 20 can read out data stored in the storage unit 10. In addition, the data sent from the first and second laser sensors 40A and 40B is taken in and compared with other data or a predetermined calculation is performed. Further, in some cases, the data after comparison and calculation is transmitted to the storage unit 10.

  The resin supply unit 30 cuts out a required amount of resin from a resin (for example, a powdery resin, a granular resin, a liquid resin, etc.) stored in a hopper or the like and prepares a resin sealing device (or a preliminary when the resin is preformed). Molding equipment). The resin supply device 30 receives data on the amount of resin to be cut out from the calculation unit 20.

  In the above description, the pair of laser sensors 40A and 40B is used as the stacking height detection means, but other configurations may be adopted as long as the stacking height H of the semiconductor chip can be detected. For example, if a contact-type displacement sensor is used, even one sensor can sufficiently function, and the structure is simple and can be realized at low cost. Further, it is also possible to irradiate a laser beam with a certain wide width from a predetermined oblique direction on the substrate, and at the same time, arrange a camera, for example, in a vertical direction with respect to the substrate as detection means. With such a configuration, the stacking height of a large number of stacked bodies can be measured in a short time. Moreover, you may comprise a detection means with the several camera arrange | positioned in a different direction. With such a configuration, since it is possible to measure on a surface, it becomes possible to measure a large number of laminated bodies at a time. In addition, it is also possible to detect the stacking height of the semiconductor chip stack by determining the focal length of the laser or photographing the intensity of interference fringes with a camera.

<Operation of resin amount determination device>
The substrate 100 carried out from a stocker (not shown) is sequentially transferred to the mold by the substrate transfer mechanism. In the middle of the conveying process, the resin amount determination device 2 operates to determine the resin amount to be supplied to the mold.

  When the substrate 100 is transferred between the first and second laser sensors 40A and 40B, lasers are emitted from the first and second laser sensors 40A and 40B. The distance D between the first laser sensor 40A and the second laser sensor 40B is known. Therefore, by subtracting the value d1 measured by the first laser sensor 40A and the value d2 measured by the second laser sensor 40B from the known D, the stacking height H of the semiconductor chip stacked body 102 and the substrate 100 are subtracted. It is possible to calculate the total value X of the thicknesses T of the two.

  X = D- (d1 + d2) Formula (1)

  Further, the thickness T of the substrate 100 itself can be similarly obtained by measuring a position other than the position where the semiconductor chip stacked body 102 is stacked by the first and second laser sensors 40A and 40B. For example, in the case of the same type of substrate, if only the first substrate is measured, the subsequent measured value can be used as the thickness T of the substrate 100. Of course, as the thickness T of the substrate 100, a value input in advance as known information can be used.

  Next, by subtracting the thickness T of the substrate itself from the total value X, the stacking height H of the semiconductor chip stack 102 can be calculated.

  H = XT ... Formula (2)

  These calculations are performed by the calculation unit 20.

<About threshold and virtual area>
As shown in the conceptual diagram of FIG. 2 (note that the vertical direction is inverted in FIG. 2), threshold values e1 and e2 are set in the storage unit 10 in advance. The number of threshold values can be changed in accordance with the required accuracy of the amount of resin to be supplied. The number of the threshold values when the normal number of stacked layers (number of stacked layers) of the semiconductor chip stacked body 102 is n, It is necessary to set the number to n-2 or less. In the case of a number of n-1 or more, this is substantially equivalent to inputting the thickness data of each semiconductor chip in advance, which is an effect of the present invention, which is “an individual semiconductor chip laminated in advance”. This is because the effect of “no need to input sheet thickness or volume data” can be exhibited.

  In the embodiment described here, the threshold value is set to two (e1, e2) when the number of stacked semiconductor chip stacks 102 when normally stacked is six. That is, the number of thresholds is set to 6-2 or less. Specifically, the boundary between the second semiconductor chip and the third semiconductor chip counted from the substrate 100 side is set as the threshold value e1, and similarly, the fourth semiconductor chip counted from the substrate 100 side and the fifth semiconductor chip 5 The boundary with the first semiconductor chip is set as the threshold value e2.

  As a result, the upper surface 102A to the threshold value e2 of the semiconductor chip stacked body 102 is the virtual region a, the threshold value e2 to the threshold e1 is the virtual region b, and the threshold value e1 to the bottom surface of the semiconductor chip stacked body 102 (ie, the surface of the substrate 100). Is set as the virtual area c. Further, for each virtual region, a predetermined ratio with respect to the volume Va of the entire stacked body when the semiconductor chip stacked body 102 is normally stacked is set in association with each other. Here, 0% of Va is associated with virtual area a, 50% of Va is associated with virtual area b, and 100% of Va is associated with virtual area c. Of course, this ratio itself can be changed to an optimal value as appropriate.

  The correspondence relationship among these virtual areas, threshold values, and resin amount ratios is stored in the storage unit 10 as a table as shown in FIG. 3, for example.

  When the calculated stacking height H of the semiconductor chip stack 102 is calculated by the calculation unit 20, it is determined which virtual region the value of H corresponds to. Since each virtual region is associated with a predetermined ratio with respect to Va, a resin amount σ (an amount obtained by multiplying Va by a predetermined ratio; hereinafter, sometimes simply referred to as “adjustment amount”) is obtained.

  The adjustment amount σ calculated by the calculation unit 20 is transmitted to the resin supply unit 30. In addition, the resin supply unit 30 increases or decreases the reference amount (reference cutout amount) at the time of resin supply based on the received data, and the adjusted resin is supplied to a mold or the like. Here, the reference amount (reference cutout amount) is held by the resin supply unit 30, but for example, this reference amount is also stored in advance in the storage unit 10, and the adjustment unit σ is increased or decreased by the calculation unit 20. A configuration in which the measured value is transmitted to the resin supply unit 30 may be adopted.

  The adjustment amount σ can be an increase function or a decrease function with respect to the reference amount (reference cutout amount). For example, when the reference amount (reference cutout amount) is the required amount of resin when all the semiconductor chip stacks are normally stacked, it functions as an increasing function. On the other hand, when the reference amount (reference cutout amount) is the required amount of resin when no semiconductor chip stack is stacked, it functions as a decreasing function.

  For example, when the adjustment amount σ is an increasing function and the stacking height H is in the imaginary region b, the resin having an amount of 50% of Va is added to the reference amount.

  Here, one semiconductor chip laminated body 102 is taken out and described, but when a plurality of semiconductor chip laminated bodies 102 are arranged on one substrate 100, the adjustment amount σ is set for each substrate. The data is added and transmitted to the resin supply unit 30.

  As described above, in the resin amount determination device 2, it is not necessary to input data on the thickness and volume of each semiconductor chip stacked in advance. That is, it is sufficient to prepare the value of the volume Va of the entire laminated body 102 when normally laminated, and a complicated operation of inputting a lot of data is unnecessary. Further, if the selection of which virtual region the stacking height H of the semiconductor chip stack 102 is within is completed by the laser sensors 40A and 40B, the predetermined amount of resin corresponding to the predetermined amount is increased or decreased from the reference amount. It is not necessary to add the data for each semiconductor chip, and the amount of data to be processed can be reduced and the processing speed can be improved. Furthermore, it is possible to adjust the amount of resin to be supplied in a stepwise manner as compared with the presence / absence determination by one camera. Further, the accuracy of the resin amount can be easily dealt with by changing the number of threshold values set in accordance with, for example, the property or type of the product.

  In the present embodiment, the first and second laser sensors 40A and 40B are arranged and configured so as to sandwich the substrate 100 from the stacking height direction, and the upper surface 102A of the semiconductor chip stack and the back surface ( The surface where the semiconductor chip stack is not stacked) is measured by a sensor. Therefore, for example, even when the substrate 100 itself is warped or the substrate 100 is vibrating at the time of detection, the original (accurate) stacking height H can be detected. Of course, this arrangement is not an essential component of the present invention.

  In addition, when a plurality of semiconductor chip stacked bodies 102 are arranged in a matrix on the substrate 100 as in this embodiment (so-called MAP sealing), the following points are particularly effective. At the current technical level, most of the plurality of laminated bodies are normally laminated, and few have a few laminated layers. Under such circumstances, there are cases where detailed management based on the data of each semiconductor chip is rejected. That is, it is possible to determine that a normal laminated body that occupies the majority is abnormal due to a data input error, a cumulative error of the laminated layer, and the like, and adjust the resin supply amount based on the determination. However, as in the present invention, by setting the number of thresholds to n−2 or less (in other words, roughly setting the thresholds), even if there is some cumulative error, the majority of normal laminates are inherently As described above, it can be determined as “normal”, and the above inconvenience can be eliminated.

  4 and 5, a second detection example is shown as another embodiment. Here, when the semiconductor chips are normally stacked, the number of stacked layers is 8, and the number of thresholds is 3 (that is, a number of 8-2 or less). As a result, the number of virtual areas is 4 (3 + 1). Since the basic idea is the same as that of the first detection example described above, a detailed description thereof will be omitted. Further, according to the present invention, as in this example, the threshold value can be freely set at a position other than the boundary between the chips.

  The present invention can obtain a remarkable effect particularly when applied to a resin sealing device using a compression molding method.

Schematic configuration diagram of a resin sealing device which is an example of an embodiment of the present invention Conceptual diagram showing a first detection example of the stacking height of semiconductor chips The table figure which showed the relationship of the area | region, threshold value, and resin amount which are used in the 1st detection example Second detection example of stacking height of semiconductor chips The table figure which showed the relationship of the area | region, threshold value, and resin amount which are used in the 2nd detection example

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Resin sealing apparatus 2 ... Resin amount determination apparatus 10 ... Memory | storage part 20 ... Operation part 30 ... Resin supply part 40 ... Stacking height detection means 40A ... 1st laser sensor 40B ... 2nd laser sensor 100 ... Substrate 102 ... Semiconductor Chip laminated body 102A ... Upper surface (semiconductor chip laminated body) 102B ... Bottom surface (semiconductor chip laminated body)

Claims (4)

A resin sealing device that seals a molded article having a laminate in which conductor chips are laminated with resin,
Means for storing in advance the volume of the entire laminate when the laminate is normally laminated;
Lamination height detection means for detecting the lamination height of the laminate,
When the number of normal layers of the laminate is n, by setting a threshold value in the laminate height direction of n-2 or less between the bottom surface and the top surface of the laminate, the number of the set threshold values is only +1 Means for setting a virtual region;
Means for associating a predetermined proportion of the total volume of the laminate with each virtual region;
Means for selecting any one of the virtual regions based on a detection result of the detection means;
Means for increasing or decreasing the resin corresponding to the predetermined ratio corresponding to the selected virtual region with respect to a reference amount, and supplying the increased / decreased resin. . In claim 1,
The stack height detecting means is composed of a pair of sensors arranged so as to sandwich the molded product from the stack height direction,
The resin sealing device, wherein the sensor detects the upper surface of the laminate and the surface of the molded product on which the laminate is not laminated, by measuring with the sensor. In claim 1 or 2,
The molded article has a plurality of the laminated bodies arranged in a matrix. A resin sealing device, wherein: A resin amount determination device that determines a resin amount to be supplied to a resin sealing device that seals a molded product having a laminated body on which conductor chips are stacked with resin,
Means for storing in advance the volume of the entire laminate when the laminate is normally laminated;
Lamination height detection means for detecting the lamination height of the laminate,
When the number of normal layers of the laminate is n, by setting a threshold value in the laminate height direction of n-2 or less between the bottom surface and the top surface of the laminate, the number of the set threshold values is only +1 Means for setting a virtual region;
Means for associating a predetermined proportion of the total volume of the laminate with each virtual region;
Means for selecting any one of the virtual regions based on a detection result of the detection means;
Means for increasing or decreasing a resin corresponding to the predetermined ratio corresponding to the selected virtual region with respect to a reference amount, and supplying the increased or decreased resin. .

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