KR20130029720A - Dividing device - Google Patents

Abstract

PURPOSE: A dividing device is provided to reduce working hours by easily accommodating chips. CONSTITUTION: A sustaining table(31) includes cutting lines on a workpiece and a groove for a cutting blade(43). A cutting unit(4) includes the cutting blade for the workpiece. A drying unit dries chips divided by the cutting unit. A bulk accommodating unit(15) storages the chips. A chip falling unit(16) drops the chips.

Description

Splitter {DIVIDING DEVICE}

The present invention relates to a dividing apparatus for dividing a workpiece along a plurality of dividing scheduled lines, wherein a plurality of dividing scheduled lines are formed in a lattice shape on the surface thereof and having a plurality of regions partitioned by the plurality of dividing scheduled lines.

In a semiconductor device manufacturing process, circuits, such as IC and LSI, are formed in many area | regions arrange | positioned at the grid | lattice form on the surface of a substantially disk-shaped semiconductor wafer, and each area | region in which the said circuit was formed is a division planned line called a predetermined street. Each semiconductor chip is manufactured by cutting along. The semiconductor chips divided in this way are packaged and widely used in electric devices such as mobile phones and personal computers.

BACKGROUND Electronic devices such as mobile phones and personal computers are required to be lighter in weight and smaller in size, and a package technology capable of miniaturizing a package of a semiconductor chip called a chip size package (CSP) has been developed. As one of the CSP technologies, a package technology called Quad Flat Non-lead Package (QFN) has been put into practical use. In this package technology called QFN, a plurality of semiconductor chips are formed in a matrix form on an electrode plate such as a copper plate in which a plurality of connection terminals corresponding to the connection terminals of the semiconductor chip are formed, and the division scheduled lines to be divided for each semiconductor chip are formed in a lattice shape. It arrange | positions and a CSP board | substrate (package board | substrate) is formed by integrating an electrode plate and a semiconductor chip by the resin part which molded resin from the back surface side of a semiconductor chip. This package board | substrate is cut | disconnected along a dividing line, and it divides into individual packaged chip size package (CSP).

In the dividing apparatus for dividing the package substrate along the dividing scheduled line, the dividing apparatus for dividing the package substrate into individually packaged chip size packages (CSPs) has an escape groove for evacuating the blade of the cutting blade in a region corresponding to the dividing scheduled line. A cutting means including a holding table which is formed and provided with suction holes in a plurality of regions partitioned by the escape grooves, a cutting blade for cutting the package substrate suctioned and held by the holding table along a division scheduled line; And a receiving mechanism for arranging and receiving a plurality of chip size packages (CSPs), each of which is divided into pieces, on a tray (see Patent Document 1, for example).

Patent Document 1: Japanese Patent Application Laid-Open No. 2001-23936

Thus, the accommodation mechanism for arranging and accommodating the plurality of chip size packages CSP divided into the trays in the dividing apparatus described in Patent Literature 1 on the tray accommodates the plurality of chip size packages CSP divided individually. A shifting table that picks up a pick-up table to be arranged and a plurality of individually divided chip size packages (CSPs) arranged on the pick-up table and arranges them in a tray accommodated in a tray dump. A transfer having a means and conveying a tray filled with a plurality of chip size packages (CSPs) individually divided to a transfer table Since a means etc. are provided, there exists a problem that the structure of the whole apparatus becomes complicated, large sized, expensive, and increases equipment cost. Moreover, since the said accommodating mechanism is a structure which picks up several chip size package CSP divided individually, arranges it in the tray accommodated in the tray dump, and accommodates the several chip size package divided | segmented individually ( Another problem is that the working time for accommodating the CSP is increased.

This invention is made | formed in view of the said fact, The said main technical subject is to provide the dividing apparatus which can accommodate the several chip | tip divided individually by the cutting means easily, and can be miniaturized.

In order to solve the main technical problem, according to the present invention, a plurality of divided scheduled lines are formed in a lattice shape on the surface thereof and a plurality of scheduled workpieces having a plurality of regions partitioned by the plurality of divided scheduled lines are scheduled. A splitting device for dividing along a line,

A cassette arranging area for arranging a cassette accommodating a workpiece before processing;

Workpiece removal means for carrying out a workpiece before processing contained in a cassette disposed in the cassette arrangement area to a temporary arrangement means;

The evacuation groove for evacuating the blade of the cutting blade is formed in a lattice shape in a region corresponding to the plurality of division lines to be formed in the workpiece, and each suction hole is provided in the plurality of regions partitioned by the evacuation groove to suck and hold the workpiece. To keep the table,

Moving means for moving the holding table to an import / export region and a processing region for carrying in and carrying out a workpiece;

Workpiece import means for conveying a workpiece before processing carried out to the temporary placing means to the holding table positioned in the carry-in / out area;

Imaging means for imaging an area to be processed of the workpiece held by the holding table;

Cutting means provided in the processing region and having a cutting blade for cutting the workpiece before processing sucked and held by the holding table;

Drying means for drying the plurality of chips individually divided by the cutting means being cut along a plurality of division scheduled lines by the cutting means;

A suction holding pad having a plurality of suction holes in a region corresponding to each of the plurality of divided chips disposed on the holding table positioned in the loading / exporting region, wherein the holding is positioned in the loading / exporting region; The workpiece conveyance means which conveys the several chip | tip divided individually arrange | positioned at the table to the said drying means,

Bulk accommodating means for bulk accommodating a plurality of chips dried by said drying means;

Chip dropping means for dropping a plurality of chips dried by the drying means into the bulk storage means;

And control means for controlling the workpiece discharging means, the holding table, the moving means, the workpiece loading means, the imaging means, the cutting means, the drying means, the workpiece conveying means, and the chip dropping means. There is provided a splitting device characterized in that there is.

Upper surface cleaning means for cleaning the upper surface of the plurality of divided chips sucked and held by the holding table, and a lower surface for cleaning the lower surface of the plurality of chips divided by the upper surface held by the workpiece conveying means. Cleaning means is provided.

The drying means includes an upper surface drying means for drying the upper surfaces of the plurality of divided chips cleaned by the lower surface cleaning means, and a lower surface drying means for drying the lower surfaces of the plurality of divided chips.

The lower surface drying means includes a drying table for sucking and holding a plurality of chips divided individually, and heating means for heating the drying table, and the drying table includes a table main body formed of a metal plate having suction portions formed of shallow recesses on an upper surface thereof. And a suction holding member made of a fluorine-based rubber having heat resistance provided at a suction part of the table main body and having a plurality of individually divided chips on an upper surface and openings in a region corresponding to the plurality of chips. The plurality of suction holes communicate with suction means.

Further, the control means includes an evacuation groove detecting step of detecting the position of the escape groove formed in the holding table positioned in the carry-in / out area by operating the imaging means, and operating the imaging means to the holding table. The division scheduled line detection step of detecting the position of the scheduled division line formed on the placed workpiece, a shift amount detection step of obtaining a shift amount of the position of the escape groove and the position of the division scheduled line, and the shift amount detection step A workpiece relocation step of repositioning the workpiece on the retention table is performed by correcting the positional relationship between the retention table and the workpiece based on the shift amount.

Moreover, the said control means divides into an operation | movement which presses the workpiece conveyance means, and presses a suction holding pad to the several divided chip | tip currently arrange | positioned at the holding table located in the said carrying in / out area | region. A chip suction holding step of repeating an operation of separating the plurality of chips from the holding surface of the holding table a plurality of times is performed.

The dividing apparatus according to the present invention is configured as described above, and includes bulk accommodating means for bulk accommodating a plurality of chips individually divided by the cutting means, and the plurality of chips divided into individual pieces dried in the drying means. Since it is made to fall to a bulk accommodating means by a chip | tip fall means, compared with the accommodating mechanism which arrange | positions and accommodates the individual divided | segmented chip equipped with the said conventional dividing apparatus in a tray, it is simple and inexpensive, and working time Can shorten.

1 is a perspective view of a splitting device constructed by the present invention.
It is a perspective view of the holding table equipped with the dividing apparatus shown in FIG.
FIG. 3 is a perspective view of a lower surface drying means equipped with the dividing apparatus shown in FIG. 1. FIG.
It is sectional drawing of the lower surface drying means shown in FIG.
FIG. 5: is a perspective view of the chip | tip fall member and the chip | tip accommodation container which comprise the bulk accommodation means equipped with the dividing apparatus shown in FIG.
It is a perspective view seen from the lower side of the suction holding pad which comprises the workpiece conveyance means equipped with the dividing apparatus shown in FIG.
FIG. 7 is a block configuration diagram of control means provided in the division apparatus shown in FIG. 1. FIG.
8 is a perspective view illustrating a state in which the package substrate is suction-held to the holding table shown in FIG. 2.
It is explanatory drawing of the cutting process performed by the dividing apparatus shown in FIG.
It is explanatory drawing which shows the state which positioned on the drying table of the drying means when the individual chip | tip which carried out the suction holding | maintenance to the suction holding pad which comprises the to-be-processed workpiece conveyance means equipped with the dividing apparatus shown in FIG.
11 is a perspective view and a sectional view of a package substrate as a workpiece.

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of the dividing apparatus comprised by this invention is described in detail with reference to an accompanying drawing.

11A and 11B show a perspective view and a cross-sectional view of a package substrate as a workpiece. The package board | substrate 1 shown to FIG. 11 (a) and (b) is equipped with the electrode plate 11, and is planarly divided into several 1st planar parts extended to the surface 11a of the electrode plate 11 in a predetermined direction. The line 111 and the 2nd dividing predetermined line 112 extended in the direction orthogonal to this 1st dividing predetermined line 111 are formed in grid | lattice form. A chip size package (CSP) 113 is disposed in a plurality of areas partitioned by the first division scheduled line 111 and the second division scheduled line 112, and the chip size package (CSP) 113 is provided. Is molded by the synthetic resin part 120 from the back surface side of the electrode plate 11. The package substrate 1 thus formed is divided into chip size packages (CSPs) 113 which are cut along the first division scheduled line 111 and the second division scheduled line 112 and individually packaged.

FIG. 1 shows a perspective view of a dividing apparatus constructed in accordance with the present invention for cutting the package substrate 1 along the first and second dividing lines 111 and 112.

The dividing apparatus shown in FIG. 1 is provided with the apparatus housing 2. In the center part of this apparatus housing 2, the workpiece holding mechanism 3 holding a workpiece, and the cutting means 4 for cutting the workpiece hold | maintained by this workpiece holding mechanism 3 are provided. . The workpiece holding mechanism 3 includes a holding table 31 for sucking and holding the package substrate 1 and a holding table supporting means 32 for supporting the holding table 31. As shown in FIG. 2, the holding table 31 is formed in rectangular shape, and the suction holding | maintenance part 310 which suction-holds the said package board | substrate 1 is provided in the surface center part, and protrudes. A blade of a cutting blade, which will be described later, is evacuated to an area corresponding to the first and second division lines 111 and 112 formed on the package substrate 1 on the upper surface (the holding surface) of the suction holding unit 310. The escape grooves 311 and 312 to be formed are formed in a lattice shape. Moreover, the suction holding part 310 is provided with the suction hole 313 corresponding to the several area | region partitioned by the 1st division planned line 111 and the 2nd division planned line 112, respectively, and this suction The hole 313 communicates with suction means (not shown).

Returning to FIG. 1 and continuing description, the holding table support means 32 which comprises the to-be-processed object holding mechanism 3 does not show the holding table 31 to rotate around the axis perpendicular | vertical to the holding surface which is an upper surface. Rotational drive means. The holding table support means 32 comprised in this way is comprised so that the holding table 31 can be moved to the carry-in / out area | region which carries in and carries out the to-be-processed object shown in FIG. 1, and the process area | region by the cutting means 4. It moves so that it may move to the process feed direction (X-axis direction) shown by the arrow X by the X-axis direction moving means which is not shown in figure.

The cutting means 4 includes a spindle housing 41 provided along an indexing feed direction (Y-axis direction) indicated by an arrow Y orthogonal to the X-axis direction, and a rotating spindle rotatably supported by the spindle housing 41. 42, a cutting blade 43 attached to the distal end of the rotary spindle 42, and cutting water supply nozzles 44 provided on both sides of the cutting blade 43. The spindle housing 41 is comprised so that it may move along a Y-axis direction by the Y-axis direction moving means not shown. The rotary spindle 42 is rotationally driven by a drive source such as a servo motor (not shown). In the cutting blade 43, in the illustrated embodiment, an electroforming blade in which diamond abrasive grains are hardened by nickel plating on a blade base formed in a disc shape of aluminum is used. The cutting water supply nozzle 44 is connected to cutting water supply means (not shown), and supplies the cutting water to the cutting portion by the cutting blade 43.

The upper surface cleaning means 5 for cleaning the upper surface of the to-be-processed object cut | disconnected in the process area and divided | segmented into the individual chip | tip is provided between the process area | region by the above-mentioned cutting means 4, and an import / export area | region have. This upper surface cleaning means 5 is provided above the movement path of the holding table 31 which comprises the to-be-processed object holding mechanism 3, is hold | maintained on the holding table 31, and is cut off by the cutting means 4 The washing water is sprayed on the upper surface of the workpiece to be cut.

On one side of the workpiece holding mechanism 3 in the Y-axis direction, a cassette arrangement region 6a for arranging a cassette containing a workpiece before processing is provided, and the cassette arrangement region 6a is not shown. The cassette table 60 which is moved up and down by the lifting means is provided. On the cassette table 60, a cassette 6 in which a plurality of the package substrate 1 as a workpiece is accommodated is disposed. In front of the cassette placement area 6a, temporary placement means 7 for temporarily positioning and aligning the package substrate 1 housed in the cassette 6 and the package substrate 1 housed in the cassette 6 are temporarily placed. The workpiece | work carrying out means 8 carried out to the mounting means 7 is provided.

Between the temporary placement means 7 and the carry-in / out area, the package substrate 1 which is a workpiece before processing carried out to the temporary placement means 7 and performed alignment is positioned in the carry-in / out area. The workpiece carrying-in means 9 conveyed on the holding surface which is the upper surface of the holding table 31 which comprises the workpiece holding mechanism 3 is provided. The workpiece loading means 9 supports a suction holding pad 91 for holding and holding the upper surface of the package substrate 1, and moves the suction holding pad 91 in the vertical direction while supporting the suction holding pad 91. Air cylinder mechanism 92, an actuating arm 93 supporting the air cylinder mechanism 92, and moving means not shown to move the actuating arm 93 in the Y-axis direction.

The dividing device in the illustrated embodiment is a package which is a workpiece which is mounted on an air cylinder mechanism 92 of the workpiece loading means 9 and held on a holding table 31 positioned in a loading / exporting region. The imaging means 12 which detects the area | region which should be processed of the board | substrate 1 is provided. This imaging means 12 consists of optical means, such as a microscope and a CCD camera, and sends the picked-up image signal to the control means mentioned later.

On the other side in the Y-axis direction of the workpiece holding mechanism 3, a lower surface cleaning means 13 for cleaning the lower surface of the workpiece after cutting processed in the processing region and divided into individual chips is provided. It is installed. The lower surface cleaning means 13 consists of the cleaning roller 131 which consists of a sponge etc. comprised rotatably, and the washing water supply means which is not shown in figure which supplies washing water to this cleaning roller 131. As shown in FIG.

Further, the dividing apparatus in the illustrated embodiment is provided adjacent to the lower surface cleaning means 13 and includes a lower surface drying means 14 for drying the lower surface of the workpiece after processing divided into individual chips. . The lower surface drying means 14 is equipped with the drying table 141 as shown to FIG. 3 and FIG. The drying table 141 consists of a rectangular table main body 142 and the suction holding member 143 provided in the upper surface of this table main body 142. As shown in FIG. The table main body 142 is formed of a metal plate, and the suction part 142a which consists of a rectangular recessed part in the upper surface is formed, and this suction part 142a has the several chip size of the said package board | substrate 1 Suction passages 142b are formed in the plurality of regions corresponding to the package CSP 113, respectively. The suction holding member 143 is formed with a size corresponding to the suction part 142a which consists of the shallow recessed part formed in the said table main body 142 by the fluorine-type rubber | gum which has heat resistance, and is fitted in the suction part 142a. In the suction holding member 143 formed as described above, suction holes 143a are formed in a plurality of regions corresponding to the plurality of chip size packages (CSP) 113 of the package substrate 1, respectively. 143a communicates with the suction passage 142b formed in the table main body 142. As the fluorine-based rubber having heat resistance for forming the suction holding member 143, a Teflon rubber "hem" manufactured and sold by DuPont Corporation can be used.

A suction chamber forming member 144 for forming a suction chamber in which the suction passage 142b communicates is attached to the lower surface of the table main body 142 constituting the drying table 141. The suction chamber forming member 144 is formed in a rectangular shape by a metal plate, and a recessed portion 144a is provided on the upper surface, and the suction passage 142b is formed by the recessed portion 144a and the lower surface of the table main body 142. A suction chamber 144b is formed to communicate with each other. Moreover, the communication path 144c which opens in the recessed part 144a is formed in the suction chamber formation member 144, and this communication path 144c is connected to the suction means which is not shown in figure. The heating heater 145 as a heating means is provided below the suction chamber formation member 144 comprised in this way.

Returning to FIG. 1 and continuing the description, the dividing apparatus in the illustrated embodiment is arranged adjacent to the lower surface drying means 14 and bulk accommodating means 15 for bulk accommodating a plurality of chips individually divided. Equipped with. The bulk accommodating means 15 is equipped with the chip | tip fall member 151 provided with the opening part 151a which adjoins the lower surface drying means 14, and is open. As shown in FIG. 5, the chip dropping member 151 is formed in a funnel form downward from the opening portion 151a. The chip accommodating container 152 is provided below the chip | tip fall member 151 comprised in this way. Thus, as shown in FIG. 1, in the front wall of the apparatus housing | casing 2 in which the bulk accommodating means 15 provided with the chip | tip fall member 151 and the chip accommodating container 152 is provided, the chip accommodating container 152 is stored. Drawer 153 is provided.

With continued description with reference to FIG. 1, the dividing apparatus in the illustrated embodiment dries the upper surface of the workpiece after processing divided into individual chips arranged on the lower surface drying means 14, and the lower surface drying means ( Top drying means and chip drop means 16 for dropping a plurality of chips disposed on the top surface and the bottom surface and dried on the opening 151a of the chip drop member 151 constituting the bulk receiving means 15. Equipped with. The upper surface drying means and the chip drop means 16 include a warm air jet nozzle 161 for ejecting warm air, a chip drop brush 162 mounted on the warm air jet nozzle 161 and projecting downward, and a warm air jet nozzle ( The air cylinder mechanism 163 which supports 161 and moves the warm air blowing nozzle 161 to an up-down direction, the operation arm 164 which supports this air cylinder mechanism 163, and this operation arm 164 are Y A moving means (not shown) for moving in the axial direction is provided.

The dividing apparatus in the illustrated embodiment is a workpiece after processing divided into individual chips arranged on the holding table 31 constituting the workpiece holding mechanism 3 positioned in the carry-in / out area. The workpiece conveyance means 17 conveyed to the lower surface drying means 14 via the said lower surface washing means 13 is provided. This workpiece conveyance means 17 is the suction holding pad 171 which suction-holds the upper surface of the to-be-processed workpiece divided | segmented into the individual chips arrange | positioned at the holding table 31, and this suction holding pad 171 Air cylinder mechanism 172 for supporting the suction holding pad 171 and moving the suction holding pad 171 in the vertical direction, an operating arm 173 for supporting the air cylinder mechanism 172, and the operating arm 173 in the Y-axis direction. It has a moving means not shown to move to. In addition, as shown in FIG. 6, the suction holding pad 171 includes a plurality of chip size packages (CSP) 113 corresponding to the plurality of chip size packages (CSP) 113 of the package substrate 1 on the suction holding surface 171a which is a lower surface. Suction holes 171b are formed in the regions, respectively, and the suction holes 171b communicate with suction means (not shown).

The dividing apparatus in the illustrated embodiment is provided with the control means 20 shown in FIG. 7. The control means 20 is comprised by the computer, The central processing unit (CPU) 201 which performs arithmetic processing according to a control program, the read-only memory (ROM) 202 which stores a control program, etc., and a calculation result And a recordable and readable random access memory (RAM) 203 for storing the back and the like, and an input interface 204 and an output interface 205. The detection signal from the said imaging means 12 etc. is input into the input interface 204 of the control means 20 comprised in this way. From the output interface 205 of the control means 20, the workpiece holding mechanism 3, the cutting means 4, the upper surface cleaning means 5, the workpiece discharging means 8, the workpiece loading means (9) The control signal is output to the lower surface cleaning means 13, the lower surface drying means 14, the upper surface drying means and the chip drop means 16, the workpiece conveyance means 17 and the like.

The division | segmentation apparatus in embodiment shown is comprised as mentioned above, and the said operation | movement is demonstrated below.

The package substrate 1 before processing accommodated in the cassette 6 arranged on the cassette table 60 arranged in the cassette placement area 6a is positioned at the carrying out position by moving up and down by lifting and lowering means (not shown). do. Next, the workpiece unloading means 8 moves forward and backward to unload the package substrate 1 positioned on the unloading position onto the temporary disposing means 7. The package substrate 1 carried out to the temporary placement means 7 is aligned here. Next, the workpiece loading means 9 is operated to suck and hold the upper surface of the package substrate 1 aligned in the temporary placement means 7 by the suction holding pad 91, and to be located in the carry-in / out area. It conveys on the holding surface which is the upper surface of the suction holding part 310 of the holding table 31 which comprises the determined workpiece holding mechanism 3 (a workpiece carry-in process).

In addition, before performing the workpiece loading step, the control means 20 operates the workpiece loading means 9 to position the imaging means 12 mounted on the air cylinder mechanism 92 in the loading / exporting area. Positioning is carried out immediately above the holding table 31 which comprises the determined workpiece holding mechanism 3. Next, the control means 20 operates the imaging means 12 to image the holding surface which is the upper surface of the suction holding | maintenance part 310 of the holding table 31, and inputs the image signal which imaged the escape groove. (Escape groove detection process). Then, the control means 20 obtains the positions of the escape grooves 311 and 312 formed on the holding surface, which is the upper surface of the suction holding part 310, based on the input image signal, and converts the xy coordinate values into a random access memory (RAM). Saved at (203).

If the above-described workpiece loading step has been performed, the control means 20 operates the workpiece loading means 9 to position the image pickup means 12 mounted on the air cylinder mechanism 92 in which the above described escape groove detection step is performed. Decide on your location. Next, the control means 20 operates the imaging means 12, and the first division schedule formed on the package substrate 1 arranged on the holding surface which is the upper surface of the suction holding part 310 of the holding table 31 is performed. The line 111 and the second division scheduled line 112 are imaged, and the captured image signal is input (divisional line detection step). And the control means 20 of the 1st division planned line 111 and the 2nd division planned line 112 formed in the package board | substrate 1 arrange | positioned on the holding table 31 based on the input image signal. The position is obtained and the xy coordinate value is stored in the random access memory (RAM) 203. In this way, if the dividing scheduled line detection step is performed, the control means 20 includes the escape grooves formed on the holding surface which is the upper surface of the holding part 310 of the suction holding table 31 detected by the escape groove detecting step. The shift amounts of the positions of the 311 and 312 and the positions of the first division scheduled line 111 and the second division scheduled line 112 formed on the package substrate 1 disposed on the holding table 31 are obtained (shift amount). Detection process). And the control means 20 stores the shift amount calculated | required by the shift amount detection process in the random access memory (RAM) 203. FIG.

If the above-described shift amount detection step has been performed, the control means 20 operates the workpiece loading means 9 to bring the upper surface of the package substrate 1 disposed on the holding table 31 to the suction holding pad 91. The suction is maintained by suction, and the package substrate 1 is retracted upward from the holding surface of the holding table 31. Next, the control means 20 controls the rotation drive means which is not shown which rotates the holding table support means 32 which comprises the workpiece holding mechanism 3, and moves the holding table 31 in the X-axis direction. The suction holding pad 91 is moved and controlled in the Y-axis direction to position the holding table 31 supported by the holding table support means 32 at a position where the shift amount is corrected. In this way, if the holding table 31 is positioned at the position where the shift amount is corrected, the control means 20 operates the workpiece loading means 9 to lower the suction holding pad 91, and the suction holding is performed. The package substrate 1 suction-held by the pad 91 is arrange | positioned on the holding surface which is the upper surface of the holding part 310 of the holding table 31 (workpiece repositioning process). As a result, the first division scheduled line formed in the escape grooves 311 and 312 formed on the holding surface, which is the upper surface of the holding portion 310 of the holding table 31, and the package substrate 1 disposed on the holding table 31. Reference numeral 111 and the second division schedule line 112 coincide with each other. If the workpiece rearrangement step is performed in this manner, the suction means (not shown) operates the suction of the package substrate 1 to the holding surface that is the upper surface of the holding portion 310 of the holding table 31 as shown in FIG. maintain.

As described above, the escape groove 311 formed on the holding surface, which is the upper surface of the holding portion 310 of the holding table 31, by performing the escape groove detecting step, the division scheduled line detection step, the shift amount detection step, and the workpiece rearrangement step. 312 and the first division scheduled line 111 and the second division scheduled line 112 formed on the package substrate 1 disposed on the maintenance table 31 to match each other, thereby maintaining the holding portion of the maintenance table 31 ( If the package substrate 1 is suction-held on the holding surface which is the upper surface of 310, the control means 20 operates the workpiece loading means 9 to operate the imaging means 12 mounted on the air cylinder mechanism 92. Positioning is carried out on the package substrate 1 held by the holding table 31. Next, the control means 20 operates the imaging means 12, and the first division scheduled line 111 and the second division scheduled line 112 formed on the package substrate 1 held on the holding table 31. And the alignment operation | work which confirms whether the 1st division planned line 111 and the 2nd division planned line 112 is parallel with an X-axis direction and a Y-axis direction. If the first division scheduled line 111 and the second division scheduled line 112 are not parallel to the X-axis direction and the Y-axis direction, the control means 20 constitutes the workpiece holding mechanism 3. The first division scheduled line 111 and the second division scheduled line 112 formed on the package substrate 1 held on the maintenance table 31 by controlling rotation driving means (not shown) for rotating the maintenance table support means 32. ) Is adjusted to be parallel to the X-axis direction and the Y-axis direction (alignment process).

If the alignment process is performed as mentioned above, the holding table 31 is moved to a process area | region, and as shown to Fig.9 (a), one end of the predetermined | prescribed 1st predetermined dividing line 111 will be cut by the cutting blade 43 It is positioned slightly to the right in FIG. 9 (a) than just below. Next, the cutting blade 43 is rotated in the direction indicated by the arrow 43a, and a cut-out conveying means (not shown) is operated to cut a predetermined amount in the direction indicated by the arrow Z1 from the retracted position where the cutting blade 43 is indicated by the two-dot chain lines. Transfer. In addition, the said infeed amount is set in the position which the outer periphery which is the blade of the cutting blade 43 reaches the escape groove 311 (refer FIG. 2) formed in the holding part 310 of the holding table 31. As shown in FIG. Then, the X-axis direction moving means (not shown) is operated to move the holding table 31 at a predetermined cutting feed speed in the direction indicated by the arrow X1 in Fig. 9A, and is held by the holding table 31. If the other end of the first division scheduled line 111 formed on the package substrate 1 has reached slightly to the left of the cutting blade 43 just below, as shown in FIG. 9B, the movement of the holding table 31 is performed. Is stopped, and the cutting blade 43 is raised to the retreat position indicated by the double-dotted line in the direction indicated by the arrow Z2. Then, the cutting process is repeated by indexing and transporting to the first division scheduled line 111 to be cut next. As a result, the package board | substrate 1 is cut | disconnected along the 1st division planned line 111 (cutting process). In addition, when performing a cutting process, cutting water is supplied to the cutting part by the cutting blade 43 from the cutting water supply nozzle 44 (refer FIG. 1).

If the above-mentioned cutting process was performed along all the 1st dividing plan lines 111 formed in the predetermined direction in the package board | substrate 1, the holding table 31 will be rotated 90 degrees. And the above-mentioned cutting process is performed along all the 2nd dividing predetermined lines 112 formed in the holding table 31 in the direction orthogonal to the said predetermined direction. As a result, the package board | substrate 1 hold | maintained by the holding table 31 is cut | disconnected along all the 1st dividing scheduled line 111 and the 2nd dividing scheduled line 112. As shown in FIG. As such, by cutting along all the first and second division lines 111 and 112 of the package substrate 1, the package substrate 1 is individually packaged chip size package (CSP) 113. Is divided into In addition, the chip size package (CSP) 113 divided separately is sucked and held by the suction holding part 310 of the holding table 31, and is hold | maintained in the state of a package board | substrate. However, since the outer peripheral part of the package board | substrate 1 is not attracted and hold | maintained by the holding table 31, it has fallen out of the holding table 31. As shown in FIG.

If the cutting process was performed as described above, the holding table 31 holding the package substrate 1 divided into individual chip size packages (CSPs) 113 by operating the X-axis moving means (not shown) is shown. It moves from a processing area toward an import / export area. At this time, by operating the upper surface cleaning means 5 provided above the movement path of the holding table 31, the package substrate divided into individual chip size packages (CSP) 113 held by the holding table 31 ( The upper surface of 1) is cleaned (upper surface cleaning step).

In this manner, the upper surface cleaning step is performed while the holding table 31 holding the package substrate 1 divided into individual chip size packages (CSPs) 113 is moved from the processing area toward the loading / exporting area. When the holding table 31 reaches the carry-in / out area | region shown in FIG. 1, the movement of the holding table 31 is stopped. Then, the suction holding of the package substrate 1 divided into the individual chip size packages (CSP) 113 held on the holding table 31 is released.

Next, the individual chip | tip which arrange | positions the suction holding pad 171 shown in FIG. 6 on the holding table 31 positioned in the carry-in / out area | region by operating the moving means which is not shown of the workpiece conveyance means 17. FIG. The suction holding surface 171a, which is a lower surface of the suction holding pad 171, is positioned by positioning the package substrate 1 directly divided into the size package (CSP) 113 and operating the air cylinder mechanism 172. The upper surface of the package substrate 1 divided into the chip size package (CSP) 113 is contacted. Then, the suction means, not shown, is sucked and held by the plurality of suction holes 171b provided in the suction holding surface 171a by individually dividing the chip size package (CSP) 113. Moreover, since water adheres to the chip size package (CSP) 113 divided | divided individually by performing the said cutting process and an upper surface cleaning process, it may not hold | maintain by suction. In order to eliminate the influence of this water, the control means 20 controls the air cylinder mechanism 172 of the workpiece conveyance means 17 to move the suction holding pad 171 up and down, and the suction holding pad ( The operation of pressing the 171 onto the chip size package (CSP) 113 divided separately and the operation of separating the chip size package (CSP) 113 divided from the holding surface of the holding table 31 a plurality of times. Repeat. As a result, the chip size package (CSP) 113 divided into pieces on the holding table 31 is sucked and held by the suction holding pad 171 (chip suction holding step).

If the above-described chip suction holding step has been performed, the control means 20 operates the moving means (not shown) of the workpiece conveyance means 17, and the chip size package divided into individual pieces which are sucked and held by the suction holding pad 171 ( CSP) 113 is positioned directly above the cleaning means 13, and the air cylinder mechanism 172 is operated to lower the suction holding pad 171 to suck and hold the suction holding pad 171 individually. The divided chip size package (CSP) 113 is brought into contact with the cleaning roller 131. At this time, the lower surface cleaning means 13 supplies the washing water while rotating the cleaning roller 131. As a result, the lower surface of the individually divided chip size package (CSP) 113 sucked and held by the suction holding pad 171 is washed (lower surface cleaning step).

If the upper surface cleaning step is performed as described above, the control means 20 operates the moving means (not shown) of the workpiece conveyance means 17 to be individually divided chip size packages suctioned and held by the suction holding pad 171. (CSP) 113 is positioned immediately above the drying means 14, the air cylinder mechanism 172 is operated to lower the suction holding pad 171, and the suction holding pad 171 as shown in FIG. The chip size package (CSP) 113 divided by the suction is maintained on the upper surface of the suction holding member 143 constituting the drying table 141 of the drying means 14. Then, the control means 20 operates the suction means (not shown) of the lower surface drying means 14 to release the suction hold by the suction holding pad 171. As a result, the suction path 142b formed in the suction chamber forming member 144, the suction chamber 144b, the table main body 142, and the suction holding member 143 from the suction means which are not shown in figure are shown. The negative pressure acts on the lower surface of the chip size package (CSP) 113 divided individually through the formed suction hole 143a, so that the chip size package (CSP) 113 divided separately is the suction holding member 143. Suction is maintained on the upper surface of the. At this time, since the suction holding member 143 is formed of a fluorine-based rubber having heat resistance, even if there are some irregularities on the lower surface of the chip size package (CSP) 113 divided individually, it is possible to follow the negative pressure to escape. The chip size package (CSP) 113 divided into pieces can be reliably suction-held. In addition, the control means 20 activates (ON) the heating heater 145 of the lower surface drying means 14. As a result, the lower surface of the chip size package (CSP) 113 divided individually through the table main body 142 and the suction holding member 143 constituting the suction chamber forming member 144 and the drying table 141 is formed. Heated to dry. At this time, since the suction holding member 143 is made of fluorine-based rubber having heat resistance, there is no problem even if heated.

At the same time, the control means 20 operates the upper surface drying means and the chip drop means 16 to blow out the warm air from the warm air blowing nozzle 161. Then, the control means 20 controls the moving means (not shown), so that the warm air blowing nozzle 161 is disposed on the upper surface of the lower surface drying means 14 and is individually divided into the chip size package (CSP) 113. Reciprocating motion is performed a plurality of times. At this time, the control means 20 operates the air cylinder mechanism 163 of the upper surface drying means and the chip dropping means 16 to position the chip drop brush 162 attached to the warm air blowing nozzle 161 in the upward retreat position. Decide on it. As a result, the lower surface and the upper surface of the chip size package (CSP) 113, which are disposed on the upper surface of the lower surface drying means 14 and are separately divided, are dried (chip drying process). In this drying process, since the chip size package (CSP) 113 divided | segmented individually is sucked and hold | maintained by the suction holding member 143 which comprises the drying table 141, the warm air is blown off from the warm air blowing nozzle 161. Even if it does not scatter.

If the above-described chip drying step is performed, the control means 20 individually divides the chip size package (CSP) 113 by the suction holding member 143 constituting the drying table 141 of the lower surface drying means 14. Release suction). Next, the control means 20 operates the moving means (not shown) of the upper surface drying means and the chip dropping means 16 to perform the chip drop brush 162 attached to the warm air blowing nozzle 161 and the cleaning means 13. And the lower surface is moved between the drying means 14, and the air cylinder mechanism 163 is operated so that the tip of the chip drop brush 162 contacts the upper surface of the suction holding member 143 constituting the drying table 141. Decide on your location. Then, the control means 20 operates the moving means (not shown) of the upper surface drying means and the chip dropping means 16, so that the chip dropping member 151 constitutes the bulk receiving means 15. It moves toward the opening part 151a. As a result, the individual chip size package (CSP) 113 disposed on the upper surface of the lower surface drying means 14 and subjected to the drying process is accommodated in the chip storage container 152 through the opening 151a. do. At this time, the suction holding member 143 on which the chip size package (CSP) 113 is individually divided is made of fluorine-based rubber having heat resistance, so the friction coefficient is low, so that the chip size package (CSP) is individually divided ( 113) can be moved smoothly.

As described above, the dividing apparatus in the illustrated embodiment includes a bulk accommodating means 15 for bulk accommodating a plurality of chip size packages (CSP) 113 individually divided by the cutting means 4. Since the plurality of divided chip size packages (CSP) 113 dried on the lower surface drying means 14 are dropped on the bulk storage means 15 by the upper surface drying means and the chip dropping means 16, Compared with the accommodating mechanism for accommodating a plurality of individually divided chips arranged in each of the conventional dividing apparatuses on a tray, the configuration is simple and inexpensive, and the working time can be shortened.

1: package substrate
2: device housing
3: workpiece holding mechanism
31: retaining table
4: cutting means
43: cutting blade
5: top cleaning means
6: cassette
6a: cassette placement area
7: temporary placement means
8: Means for exporting work
9: Means for bringing in work
12: imaging means
13: bottom cleaning means
14: when drying means
141: drying table
143: suction holding member
15: bulk receiving means
16: top drying means and chip dropping means
17: workpiece conveyance means
20: control means

Claims (6)

A dividing apparatus for forming a plurality of dividing scheduled lines in a lattice shape on a surface thereof and dividing a workpiece having a plurality of regions partitioned by the plurality of dividing scheduled lines along a plurality of dividing scheduled lines,
A cassette arranging area for arranging a cassette accommodating a workpiece before processing;
Workpiece removal means for carrying out a workpiece before processing contained in a cassette disposed in the cassette arrangement area to a temporary arrangement means;
The evacuation groove for evacuating the blade of the cutting blade is formed in a lattice shape in a region corresponding to the plurality of division lines to be formed in the workpiece, and each suction hole is provided in the plurality of regions partitioned by the evacuation groove to suck and hold the workpiece. To keep the table,
Moving means for moving the holding table to an import / export region and a processing region for carrying in and carrying out a workpiece;
Workpiece import means for conveying the workpiece before processing carried out to the temporary placement means to the holding table positioned in the carry-in / out area;
Imaging means for imaging an area to be processed of the workpiece held by the holding table;
Cutting means provided in the processing region and having a cutting blade for cutting the workpiece before processing sucked and held by the holding table;
Drying means for drying the plurality of chips individually divided by the cutting means being cut along a plurality of division scheduled lines by the cutting means;
A suction holding pad having a plurality of suction holes in a region corresponding to each of the plurality of divided chips disposed on the holding table positioned in the loading / exporting region, wherein the holding is positioned in the loading / exporting region; The workpiece conveyance means which conveys the several chip | tip divided individually arrange | positioned at the table to the said drying means,
Bulk accommodating means for bulk accommodating a plurality of chips dried by said drying means;
Chip dropping means for dropping a plurality of chips dried by the drying means into the bulk storage means;
Control means for controlling said workpiece discharging means, said holding table, said moving means, said workpiece loading means, said imaging means, said cutting means, said drying means, said workpiece conveying means, and said chip dropping means;
Splitting device comprising a. 2. The apparatus according to claim 1, further comprising: upper surface cleaning means for cleaning the upper surfaces of the plurality of divided chips sucked and held by the holding table, and a plurality of chips divided into individual upper surfaces by the workpiece conveyance means. A dividing device comprising lower surface cleaning means for cleaning the lower surface. 3. The drying means according to claim 2, wherein the drying means comprises: an upper surface drying means for drying the upper surfaces of the plurality of divided chips cleaned by the lower surface cleaning means, and a lower surface drying for drying the lower surfaces of the plurality of chips divided individually. Splitting device comprising a means. The said bottom surface drying means is equipped with the drying table which suction-holds the some chip | tip divided individually, and the heating means which heats the said drying table,
The drying table includes a table main body formed of a metal plate on which a suction part consisting of a shallow concave part is formed on an upper surface thereof, and a plurality of openings in a region corresponding to a plurality of chips separately provided on the upper surface of a suction part of the table main body. And a suction holding member made of a fluorine-based rubber having heat resistance provided with suction holes, and the plurality of suction holes communicate with suction means. The evacuation groove according to any one of claims 1 to 4, wherein the control means detects the position of the escape groove formed on the holding table positioned in the carry-in / out area by operating the imaging means. A dividing scheduled line detecting step of detecting a position of a dividing scheduled line formed on the workpiece disposed on the holding table by operating the detection step, the imaging means, and a shift amount of the position of the escape groove and the position of the dividing scheduled line; Performing a workpiece repositioning step of repositioning a workpiece on the holding table by correcting a positional relationship between the holding table and the workpiece based on the shift amount detecting step and the shift amount determined in the shift amount detecting step; Splitting device. The said control means activates the said workpiece conveyance means, and presses the said suction holding pad to the several divided chip | tip currently arrange | positioned at the holding table located in the said carry-in / out area | region. The chip | tip suction holding | maintenance process of repeating an operation | movement and the operation | movement which isolate | separates the several chip divided individually from the holding surface of the said holding table multiple times.

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