JP7294872B2 - processing equipment - Google Patents

Description

The present invention relates to a processing apparatus capable of processing workpieces of at least two sizes.

A wafer in which a plurality of devices such as ICs and LSIs are partitioned by dividing lines and formed on the front surface thereof is ground by a grinding device on the back surface thereof to have a predetermined thickness. It is divided into chips, and each of the divided device chips is used in electrical equipment such as mobile phones and personal computers.

The grinding apparatus includes a chuck table holding a workpiece, grinding means for grinding the workpiece held by the chuck table, a cassette mounting section on which a cassette containing a plurality of workpieces is mounted, An unloading means for unloading a workpiece from a cassette placed on a cassette mounting portion, a temporary placement means for temporarily placing the workpiece unloaded by the unloading means, and a workpiece temporarily placed on the temporary placement means and a conveying means for conveying an object to a chuck table, so that the wafer can be processed to have a desired thickness.

Wafers are available in different sizes such as 5 inches, 6 inches, and 8 inches in diameter, and the size is appropriately selected depending on the type and size of the device.

Then, a cassette corresponding to the size of the wafer is placed on the cassette placing portion of the grinding apparatus (see, for example, Patent Document 1).

JP-A-2005-153090

However, if the cassette mounted on the cassette mounting portion does not correspond to the size of the wafer to be processed, the wafer cannot be unloaded from the cassette or transported within the grinding apparatus, or the wafer may be damaged. There is a problem that The above-described problems can occur not only in grinding machines, but also in various processing machines including dicing machines, laser processing machines, and the like, which are capable of processing according to the size of the wafer.

The object of the present invention, which has been devised in view of the above facts, is that problems such as the inability to unload the workpiece from the cassette or the transfer of the workpiece within the processing apparatus, or damage to the workpiece may occur. It is to provide a processing device that does not have

In order to solve the above problems, the present invention provides the following processing apparatus. That is, a chuck table capable of selectively holding workpieces of at least two different sizes, machining means for machining the workpieces held by the chuck table, and a cassette accommodating a plurality of workpieces are mounted. a cassette mounting portion on which the workpiece is placed, a carrying-out means for carrying out the workpiece from the cassette placed on the cassette placing portion, and a temporary placement means for temporarily placing the workpiece carried out by the carrying-out means. and a conveying means for conveying the workpiece temporarily placed on the temporary placing means to the chuck table, the processing apparatus comprising: a camera for imaging the cassette placed on the cassette placing portion; A size selection unit for selecting a size of a workpiece from at least two stored sizes of the workpiece based on an input operation by an operator, and a workpiece selected by the size selection unit and a control means comprising at least an image storage section for storing an image of the cassette according to the size, the control means storing the image of the cassette captured by the camera and the image of the cassette stored in the image storage section. The processing apparatus is provided with a determination unit that compares the image with the image and determines whether or not the cassette imaged by the camera is a cassette corresponding to the size of the workpiece selected by the size selection unit.

Preferably, the determination unit instructs exchange of the cassette when the cassette imaged by the camera does not correspond to the size of the workpiece selected by the size selection unit. The processing means is preferably grinding means for grinding the workpiece held on the chuck table with a grinding wheel or polishing means for polishing the workpiece held on the chuck table with a polishing pad.

A processing apparatus provided by the present invention comprises a chuck table capable of selectively holding workpieces of at least two different sizes, processing means for processing the workpieces held by the chuck table, and a plurality of workpieces. A cassette mounting portion on which a cassette containing an object is mounted, an unloading means for unloading a workpiece from the cassette mounted on the cassette mounting portion, and a temporary work piece unloaded by the unloading means. a camera for capturing an image of the cassette placed on the cassette placing portion, the camera comprising: temporary placing means for placing the workpiece; A size selection unit that selects a size of a workpiece based on an input operation by an operator from among at least two sizes of workpieces stored in advance, and a workpiece selected by the size selection unit. and a control means comprising at least an image storage section for storing an image of the cassette according to the size of the cassette, wherein the control means stores the image of the cassette captured by the camera and the cassette stored in the image storage section. , and determines whether or not the cassette imaged by the camera corresponds to the size of the workpiece selected by the size selection unit. There is no problem that the workpiece cannot be carried out, the workpiece cannot be transported in the processing apparatus, or the workpiece is damaged.

1 is a perspective view of a processing apparatus constructed in accordance with the present invention; FIG. FIG. 2 is a perspective view of the chuck table shown in FIG. 1; FIG. 2 is a schematic diagram of a top surface image of a cassette according to the size of a workpiece, stored in the image storage section shown in FIG. 1;

A preferred embodiment of a processing apparatus constructed according to the present invention will be described below with reference to the drawings.

FIG. 1 shows a grinding apparatus 2 capable of grinding workpieces of at least two sizes as an example of a processing apparatus constructed according to the present invention. Other examples of the processing apparatus of the present invention include, for example, a dicing apparatus having a rotatable cutting blade for cutting a workpiece, and a laser processing apparatus for performing laser processing on a workpiece. be done.

The grinding apparatus 2 comprises a chuck table 4 capable of selectively holding workpieces of at least two sizes, a machining means 6 for machining the workpieces held on the chuck table 4, and a plurality of workpieces. A cassette mounting portion 10 on which a cassette 8 to be accommodated is mounted, a carrying-out means 12 for carrying out a workpiece from the cassette 8 placed on the cassette placing portion 10, and a workpiece carried out by the carrying-out means 12. and a transfer means 16 for transferring the workpiece temporarily placed on the temporary placement means 14 to the chuck table 4. - 特許庁

As shown in FIG. 1, the grinding device 2 has a rectangular parallelepiped base 18, and a circular turntable 20 is rotatably provided on the upper surface of the base 18. As shown in FIG. The turntable 20 is rotated counterclockwise when viewed from above by a turntable motor (not shown) incorporated in the base 18 . Three chuck tables 4 are rotatably mounted on the peripheral edge of the upper surface of the turntable 20 at equal intervals in the circumferential direction. It is rotated around an axis extending vertically by a motor (not shown). In FIG. 1, each chuck table 4 is sequentially positioned at an attachment/detachment position indicated by symbol A, a rough grinding position indicated by symbol B, and a finish grinding position indicated by symbol C by rotating the turntable 20. ing.

Referring to FIG. 2, at the upper end portion of the chuck table 4, a porous circular first suction chuck 22 and a porous ring-shaped porous chuck 22 concentrically arranged with the first suction chuck 22 are provided. A second suction chuck 24 is provided. Both the first suction chuck 22 and the second suction chuck 24 are connected to suction means (not shown), and the flow path connecting the second suction chuck 24 and the suction means is provided with a valve (shown in the figure). not shown) are provided. Also, in the illustrated embodiment, the diameter of the first suction chuck 22 corresponds to the diameter of the smaller workpiece (for example, a 6-inch diameter wafer) of the two sizes of workpieces, and the second The outer diameter of the suction chuck 24 corresponds to the diameter of the larger workpiece (for example, a wafer with a diameter of 8 inches) among the two sizes of workpieces.

In the chuck table 4, a small workpiece is sucked by the first suction chuck 22 by generating a suction force on the upper surface of the first suction chuck 22 with the valve closed. By generating a suction force on the upper surface of the first suction chuck 22 and the second suction chuck 24 with the suction means holding and opening the valve, the first suction chuck 22 and the second suction chuck 24 are generated. The chuck 24 is adapted to suck and hold a large-sized workpiece.

In this way, the chuck table 4 of the illustrated embodiment can selectively suck and hold workpieces of two different sizes. The chuck table 4 has a plurality of annular suction chucks arranged concentrically with the first suction chuck 22 at the upper end portion, so that workpieces of three or more sizes can be selectively suctioned and held. It can be like this.

Referring to FIG. 1, the processing means 6 includes a mounting wall 26 extending upward from the end of the base 18 (back side end in FIG. 1), and mounted on one side of the mounting wall 26 so as to be vertically movable. a first elevating plate 28 and a second elevating plate 30, a first elevating means 32 for elevating the first elevating plate 28, and a second elevating means 34 for elevating the second elevating plate 30; including.

The first elevating means 32 has a ball screw 36 extending vertically along one side of the mounting wall 26 and a motor 38 for rotating the ball screw 36 . A nut portion (not shown) of the ball screw 36 is connected to the first elevating plate 28 . In the first elevating means 32, the rotary motion of the motor 38 is converted into linear motion by the ball screw 36 and transmitted to the first elevating plate 28. The first elevating plate 28 is moved up and down along the line. The second lifting means 34 may have the same structure as the first lifting means 32, so the same reference numerals as the structure of the first lifting means 32 are given, and the description thereof is omitted.

The processing means 6 also includes a rough grinding unit 40 attached to one side of the first elevator plate 28 and a finish grinding unit 42 attached to one side of the second elevator plate 30 . The rough grinding unit 40 includes a support wall 44 protruding from one side of the first elevating plate 28, a spindle 46 supported by the support wall 44 so as to be rotatable about an axis extending in the vertical direction, and a and a motor 48 mounted thereon for rotating a spindle 46 . A disk-shaped wheel mount 50 is fixed to the lower end of the spindle 46 , and a grinding wheel 52 for rough grinding is fixed to the lower surface of the wheel mount 50 . Regarding the finish grinding unit 42, a grinding wheel 54 for finish grinding formed from abrasive grains having a grain size smaller than that of the grinding wheel 52 for rough grinding is fixed to the lower surface of the wheel mount 50. , and may have the same configuration as the rough grinding unit 40, the same reference numerals as the configuration of the rough grinding unit 40 are given, and the description thereof is omitted.

In the processing means 6, the workpiece held on the chuck table 4 positioned at the rough grinding position B is subjected to rough grinding by the grinding wheel 52 of the rough grinding unit 40, and the workpiece is moved to the finish grinding position C. The workpiece held on the positioned chuck table 4 is finish-ground by the grinding wheel 54 of the finish-grinding unit 42 .

As described above, the processing means 6 of the illustrated embodiment is configured as a grinding means for grinding the workpiece held on the chuck table 4 with the grinding wheels 52 and 54 . The processing means 6 may be composed of polishing means for polishing the workpiece fixed and held on the chuck table 4 with a polishing pad. Alternatively, the grinding wheel may be fixed to one wheel mount 50, and the polishing pad may be fixed to the other wheel mount 50, so that the processing means 6 is composed of both the grinding means and the polishing means.

Adjacent to the attachment/detachment position A, a washing water nozzle 56 for spraying washing water is provided on the upper surface of the base 18 . After rough grinding and finish grinding, washing water is sprayed from the washing water nozzle 56 toward the upper surface (grinding surface) of the workpiece positioned at the attachment/detachment position A. is cleaned.

The cassette mounting portion 10 of the illustrated embodiment mounts a first cassette 8a containing a plurality of disk-shaped workpieces (for example, wafers W having a diameter of 6 inches or 8 inches) before being ground. and a second cassette mounting portion 10b on which a second cassette 8b containing a plurality of workpieces after grinding is mounted. As shown in FIG. 1, the first cassette mounting portion 10a and the second cassette mounting portion 10b are provided on the upper surface end of the base 18 (front side end in FIG. 1) with a space therebetween. there is

Each of the first cassette mounting portion 10a and the second cassette mounting portion 10b has a space in which the cassettes 8 of at least two sizes can be selectively mounted. As the cassettes 8 of at least two sizes, for example, as shown in FIG. It is G4.

As shown in FIG. 1, the carry-out means 12 is arranged between the first cassette mounting portion 10a and the second cassette mounting portion 10b. The carry-out means 12 includes a multi-joint arm 58 supported on the base 18, an electric or air-driven actuator (not shown) for operating the multi-joint arm 58, and a distal end of the multi-joint arm 58. and a holding piece 60 attached. A holding piece 60 having a plurality of suction holes (not shown) formed on one side thereof is connected to a suction means (not shown).

In the carry-out means 12 , the suction means generates a suction force on one side of the holding piece 60 to suck and hold the workpiece on one side of the holding piece 60 , and the multi-joint arm 58 is operated by the actuator. Then, the workpiece before grinding sucked and held on one side of the holding piece 60 is transported from the first cassette 8a to the temporary placement means 14, and the workpiece after grinding sucked and held on one side of the holding piece 60. Objects are carried into the second cassette 8b from a washing means 74, which will be described later.

In the carry-out means 12, at least two sizes of holding pieces 60 are selectively attached to the tip of the multi-joint arm 58, so that at least two sizes of workpieces can be sucked and held. . The holding pieces 60 of at least two sizes are, for example, a 6-inch holding piece for sucking and holding a 6-inch diameter wafer and an 8-inch holding piece for sucking and holding a 8-inch diameter wafer. .

As shown in FIG. 1, the temporary placement means 14 is arranged adjacent to the first cassette placement portion 10a. The temporary placement means 14 includes a substrate 62 mounted on the upper surface of the base 18, and a circular temporary placement table 64 arranged at the center of the upper surface of the substrate 62 and smaller in diameter than the workpiece. A plurality of long holes 62 a extending in the radial direction of the temporary placement table 64 are formed in the substrate 62 at intervals around the temporary placement table 64 . A plurality of pins 66 extending upward through each slot 62a are attached to the base 18 so as to be movable along the slots 62a. A pin moving means (not shown) for moving the pin is mounted.

In the temporary placement means 14 , the plurality of pins 66 are synchronously moved by the pin moving means, and the plurality of pins 66 are brought into contact with the peripheral edge of the workpiece temporarily placed on the temporary placement table 64 . The center of the workpiece is aligned with the center of the temporary placement table 64. - 特許庁

In the temporary placement means 14, by changing the initial position of the pin 66, it is possible to center workpieces of at least two different sizes. For example, when centering a wafer with a diameter of 6 inches, the initial position of the pins 66 is set at the middle of the elongated hole 62a, and when centering a wafer with a diameter of 8 inches, the initial position of the pins 66 is set to It is set at the end of the elongated hole 62a (the radially outer end of the temporary placement table 64). In this way, by setting the initial position of the pin 66 on the circumference slightly larger than the diameter of the workpiece to be centered, the movement of the pin 66 until it abuts against the peripheral edge of the workpiece is reduced. The distance is shortened, and the process time can be shortened.

As shown in FIG. 1, the transport means 16 is arranged between the temporary placement means 14 and the turntable 20 . The conveying means 16 comprises a rotating shaft 68 mounted on the base 18 so as to be rotatable and vertically movable and extending upward from the upper surface of the base 18; an arm 70 extending substantially horizontally from the upper end of the rotating shaft 68; A disk-shaped attracting piece 72 detachably attached to the lower surface, a rotating shaft motor (not shown) for rotating the rotating shaft 68, and an elevating means such as an electric cylinder for raising and lowering the rotating shaft 68 (see figure). not shown). A suction piece 72 having a plurality of suction holes (not shown) formed on its lower surface is connected to suction means (not shown).

In the conveying means 16 , the workpiece temporarily placed on the temporary placement table 64 is sucked and held by the lower surface of the attraction piece 72 by generating a suction force on the lower surface of the attraction piece 72 with the suction means. In addition, the conveying means 16 moves the rotary shaft 68 up and down and rotates it by means of the lifting means and the rotary shaft motor, thereby positioning the workpiece sucked and held by the lower surface of the attracting piece 72 from the temporary placement means 14 to the attachment/detachment position A. It is adapted to be conveyed to the chuck table 4 which is located there.

In the conveying means 16, suction pieces 72 of at least two sizes are selectively attached to the lower surface of the tip of the arm 70, so that workpieces of at least two sizes can be sucked and held. The suction pieces 72 of at least two sizes are, for example, a 6-inch suction piece for sucking and holding a 6-inch diameter wafer and an 8-inch suction piece for sucking and holding a 8-inch diameter wafer. .

In the illustrated embodiment, as shown in FIG. 1, the grinding apparatus 2 includes a cleaning means 74 for cleaning the ground workpiece and a second cleaning means 74 for conveying the ground workpiece from the chuck table 4 to the cleaning means 74. and a transport means 76 .

The cleaning means 74 arranged adjacent to the second cassette mounting portion 10b includes a circular spinner table 78 rotatably mounted on the base 18, and a spinner table motor for rotating the spinner table 78 ( (not shown), a cleaning water nozzle (not shown) for spraying cleaning water onto the workpiece held on the spinner table 78, and dry air to the workpiece held on the spinner table 78. and an air nozzle (not shown) for jetting. A porous circular suction chuck 80 connected to suction means (not shown) is arranged on the upper end portion of the spinner table 78 .

In the cleaning means 74 , the workpiece placed on the upper surface of the spinner table 78 is sucked and held by generating a suction force on the upper surface of the suction chuck 80 with the suction means. Further, the cleaning means 74 cleans the workpiece by injecting cleaning water from the cleaning water nozzle while rotating the spinner table 78 holding the workpiece by suction, and cleaning the workpiece by injecting dry air from the air nozzle. It is designed to dry things.

The diameter of the spinner table 78 is formed smaller than the diameter of the smallest workpiece among the workpieces of at least two sizes. The spinner table 78 is designed to be held by suction to wash and dry.

A second conveying means 76 disposed between the cleaning means 74 and the turntable 20 includes a rotating shaft 82 mounted on the base 18 so as to be rotatable and vertically movable and extending upward from the upper surface of the base 18, and a rotating shaft 82. An arm 84 extending substantially horizontally from the upper end of the shaft 82, a circular plate 86 attached to the lower surface of the tip of the arm 84, a rotating shaft motor (not shown) for rotating the rotating shaft 82, and a rotating shaft. and a lifting means (not shown) such as an electric cylinder for lifting and lowering 82 . A porous suction pad (not shown) connected to suction means (not shown) is arranged in the central portion of the lower surface of the plate 86 .

In the second conveying means 76, the suction means generates a suction force on the lower surface of the suction pad, so that the ground workpiece held on the chuck table 4 positioned at the attachment/detachment position A is plated. The lower surface of 86 is held by suction. The second conveying means 76 lifts and rotates the rotating shaft 82 by means of the lifting means and the rotating shaft motor, thereby moving the workpiece sucked and held on the lower surface of the plate 86 from the chuck table 4 to the spinner of the cleaning means 74 . It is adapted to be transported to the table 78 .

In addition, the diameter of the plate 86 of the second conveying means 76 is formed larger than the diameter of the largest work piece among the work pieces of at least two sizes. , at least two sizes of workpieces can be suction-held by the plate 86 .

As shown in FIG. 1 , the grinding apparatus 2 further includes a camera 88 that takes an image of the cassette 8 placed on the cassette placement portion 10 and a control means 90 electrically connected to the camera 88 . The camera 88 of the illustrated embodiment is arranged on the upper part of the grinding device 2, and is mounted on the first cassette 8a mounted on the first cassette mounting portion 10a and the second cassette mounting portion 10b. An image of the placed second cassette 8b is picked up. Also, the data of the image captured by the camera 88 is sent to the control means 90 . Although a single camera 88 is shown in FIG. 1 , the grinding machine 2 may be equipped with a plurality of cameras 88 .

The control means 90 comprising a computer includes a central processing unit (CPU) that performs arithmetic processing according to a control program, a read-only memory (ROM) that stores control programs and the like, and a readable and writable random access memory that stores arithmetic results and the like. memory (RAM) (neither is shown). The control means 90 is electrically connected to an operation panel 92 and a monitor 94 both of which are arranged at the upper end of the base 18 (front end in FIG. 1). The operation panel 92 can be composed of a keyboard and a touch panel. A touch panel as the operation panel 92 may be displayed on the monitor 94 .

A read-only memory of the control means 90 stores a size selection unit 96 for selecting the size of the workpiece as a control program, and selects a cassette according to the size of the workpiece selected by the size selection unit 96. An image storage unit 98 for storing images is set.

The size selection unit 96 stores in advance at least two sizes of workpieces (for example, 6 inches in diameter and 8 inches in diameter) that can be ground by the grinding device 2 . The size selection unit 96 selects the size of the workpiece from at least two types of sizes of the workpiece stored in advance based on the operation of the operation panel 92 by the operator. there is

The image storage unit 98 stores in advance images of cassettes corresponding to the sizes of at least two types of workpieces that can be ground by the grinding device 2 . For example, as shown in FIG. 3, a plurality of 6-inch cassette images P1, P2, P3, and P4 as cassette top images corresponding to 6-inch diameter wafers, and cassette top images corresponding to 8-inch diameter wafers. A plurality of 8-inch cassette images G1, G2, G3, and G4 are stored in the image storage section 98. FIG. The images stored in the image storage unit 98 may be those captured by the camera 88 of the grinding apparatus 2 or may be those captured by a camera other than the camera 88 . Also, the image stored in the image storage unit 98 may not be an image of the top surface of the cassette, but may be an image captured obliquely.

The read-only memory of the control means 90 further stores the image of the cassette 8 captured by the camera 88 when the grinding process is started in the grinding device 2, and the images P1 to P4 and G1 of the cassette stored in the image storage unit 98. to G4, and determines whether or not the cassette 8 imaged by the camera 88 is a cassette corresponding to the size of the workpiece selected by the size selection unit 96 (see FIG. 1). Stored as a control program.

When grinding wafers as workpieces using the grinding apparatus 2 as described above, first, the first cassette 8a containing a plurality of wafers is placed on the first cassette placing portion 10a, and the grinding is performed. An empty second cassette 8b containing a plurality of processed wafers is placed on the second cassette placing portion 10b.

Next, by operating the operation panel 92, the size of the workpiece to be ground is input, and an operation start instruction for the grinding device 2 is input. Here, it is assumed that a diameter of 6 inches is input as the size of the workpiece. Then, the size selection unit 96 of the control means 90 selects a size of 6 inches as the size of the workpiece from among the sizes of the workpieces that can be ground by the grinding device 2 . Also, the camera 88 captures images of the first and second cassettes 8a and 8b placed on the first and second cassette placement portions 10a and 10b.

When the first and second cassettes 8a and 8b are imaged by the camera 88, the determination unit 100 of the control means 90 stores the images of the first and second cassettes 8a and 8b imaged by the camera 88 and the images stored in advance. A plurality of 6-inch cassette images P1 to P4 stored in the unit 98 are compared, and the first and second cassettes 8a and 8b imaged by the camera 88 are selected by the size selection unit 96. Determine whether the cassette is suitable for the size of the object (6 inches in diameter).

Then, the images of the first and second cassettes 8a and 8b correspond to any of the plurality of 6-inch cassette images P1 to P4, and the first and second cassettes 8a and 8b captured by the camera 88 are of size When the determination unit 100 determines that the cassette is a 6-inch cassette corresponding to the size of the workpiece selected by the selection unit 96, the plurality of wafers accommodated in the first cassette 8a are sequentially carried out, Next, after the wafer is ground, a series of processes are started in which the ground wafer is loaded into the second cassette 8b.

Specifically, a temporary placement step of carrying out the wafers from the first cassette 8a by the carry-out means 12 and temporarily placing them on the temporary placement means 14, and transferring the wafers temporarily placed on the temporary placement means 14 to the loading/unloading positions by the transport means 16. A, a first transfer step of transferring to the chuck table 4; a grinding step of performing rough grinding and finish grinding on the upper surface of the wafer held on the chuck table 4 by the processing means 6; A washing water injection step of injecting washing water from the washing water nozzle 56, a second conveying step of conveying the ground wafer from the chuck table 4 to the washing means 74 by the second conveying means 76, and a ground wafer. A series of steps including a cleaning/drying step of cleaning and drying by the cleaning means 74 and a cassette carrying-in step of carrying out the cleaned wafers from the cleaning means 74 by the carrying-out means 12 and carrying them into the second cassette 8b are carried out in sequence. be implemented.

As a result of comparing both images, it was found that the first and second cassettes 8a and 8b captured by the camera 88 were 6-inch cassettes corresponding to the size of the workpiece selected by the size selection unit 96. When the judgment unit 100 makes a judgment, the fact may be displayed on the monitor 94 .

On the other hand, as a result of comparing both images, it is determined that one or both of the first and second cassettes 8a and 8b imaged by the camera 88 is not a cassette corresponding to the size of the workpiece selected by the size selection section 96. If the determination unit 100 makes a determination, the series of steps described above is not started. Further, in such a case, the determination unit 100 displays on the monitor 94 that one or both of the first and second cassettes 8a and 8b do not correspond to the size of the workpiece, so that the operator can Alternatively, an instruction to replace the cassette may be given.

As described above, in the grinding apparatus 2 of the illustrated embodiment, the first and second cassettes 8a and 8b imaged by the camera 88 correspond to the size of the workpiece selected by the size selection section 96. If the determination unit 100 determines that the workpiece is not a cassette, the series of steps for grinding the workpiece is not started. There is no problem that the workpiece cannot be conveyed or the workpiece is damaged.

2: Grinding device (processing device)
4: Chuck table 6: Processing means 8: Cassette 8a: First cassette 8b: Second cassette 10: Cassette mounting part 10a: First cassette mounting part 10b: Second cassette mounting part 12: Unloading Means 14: Temporary placing means 16: Conveying means 88: Camera 90: Control means 96: Size selection unit 98: Image storage unit 100: Judging unit

Claims (3)

A chuck table capable of selectively holding workpieces of at least two sizes, machining means for machining the workpieces held by the chuck table, and a cassette accommodating a plurality of workpieces are mounted. a cassette mounting portion, a carrying-out means for carrying out the workpiece from the cassette placed on the cassette placing portion, a temporary placement means for temporarily placing the workpiece carried out by the carrying-out means, and the A processing apparatus comprising a conveying means for conveying the workpiece temporarily placed on the temporary placing means to the chuck table,
a camera for imaging the cassette placed on the cassette placing portion;
A size selection unit that selects a size of a workpiece based on an input operation by an operator from among at least two sizes of workpieces stored in advance, and a workpiece selected by the size selection unit. and a control means comprising at least an image storage unit that stores an image of the cassette according to the size of the
The control means compares the image of the cassette imaged by the camera with the image of the cassette stored in the image storage unit, and the cassette imaged by the camera is the workpiece selected by the size selection unit. A processing apparatus comprising a judging section for judging whether or not the cassette is suitable for its size. 2. The processing apparatus according to claim 1, wherein, when the cassette imaged by the camera does not correspond to the size of the workpiece selected by the size selection unit, the determination unit instructs replacement of the cassette. 2. The processing according to claim 1, wherein the processing means is grinding means for grinding the workpiece held on the chuck table with a grinding wheel or polishing means for polishing the workpiece held on the chuck table with a polishing pad. Device.

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