JP7071818B2 - Board processing system - Google Patents

Description

The present invention relates to a substrate processing system for processing a substrate, and more particularly to a substrate processing system for thinning a substrate.

In recent years, in a semiconductor device manufacturing process, a semiconductor wafer (hereinafter referred to as a wafer) in which a plurality of devices such as electronic circuits are formed on the surface thereof may be ground to thin the back surface of the wafer. It is done.

The back surface (processed surface) of the wafer is processed by using, for example, the processing apparatus described in Patent Document 1. The processing device is equipped with a back grinder that grinds the wafer.
The back grinder is provided with a rough grinding stage for rough grinding, a finishing grinding stage for finishing grinding, an alignment stage for aligning wafers before grinding, and a cleaning stage for cleaning wafers after grinding. The rough grinding stage and the finish grinding stage perform rough grinding and finish grinding on the wafer held by the chuck of the rotary table, respectively, and are arranged from the outside in the plan view of the rotary table to the upper side. The alignment stage and the cleaning stage are respectively arranged on the outside of the rotary table in a plan view.
Further, the back grinder is provided with a transfer robot that transfers the wafer from the alignment stage to the chuck of the rotary table, and a transfer arm that transfers the wafer from the chuck of the rotary table to the cleaning stage.

JP-A-2002-343756

However, in the back grinder described in Patent Document 1 described above, two transport means, a transport robot and a transport arm, are provided, but the access range of each transport means is limited. That is, the transfer robot can transfer the wafer to the alignment stage and the chuck, but cannot transfer the wafer to the cleaning stage. Further, the transfer arm can transfer the wafer to the cleaning stage and the chuck, but cannot transfer the wafer to the alignment stage. Therefore, in this back grinder, although there are two transport means, the degree of freedom of movement of each transport means is low, and the efficiency of processing the wafer is low.

The present invention has been made in view of the above circumstances, and an object of the present invention is to efficiently perform a process of thinning a substrate.

The present invention for solving the above problems is a substrate processing system for processing a substrate, in which a first holding portion for holding the substrate and a machined surface of the substrate held by the first holding portion are brought into contact with each other for grinding. The machined portion to be machined, an alignment portion that adjusts the horizontal direction according to the position of the notch portion of the substrate before being held by the first holding portion, and the alignment portion that adjusts the position of the notch portion to perform the machining. A non-machined surface cleaning section for cleaning the non-machined surface on the opposite side of the machined surface of the substrate machined by the section and the machined surface is held by the second holding section, and the second holding section. The delivery position, the alignment portion, and the above, the substrate is held and conveyed by the second holding portion, and the substrate whose notch position is adjusted by the alignment portion is delivered to the first holding portion. It is characterized by having a transport section for transporting the substrate with respect to the non-processed surface cleaning section.

According to the present invention, the wafer can be transported to the delivery position, the alignment section, and the non-processed surface cleaning section by one transport section, and the degree of freedom of movement of the transport section can be increased. Further, since there is only one means for transporting the substrate, the device configuration can be simplified. Therefore, the processing of the substrate can be performed efficiently.

In the substrate processing system, the transport portion has a plurality of arms and a plurality of joint portions connecting the plurality of arms, and the arm at the tip of the plurality of arms has the second holding portion. The joint may be supported and the arm may be swiveled.

In the substrate processing system, the transport unit may be provided on the arm at the tip end and may have a rotating unit for rotating the second holding unit.

In the substrate processing system, the transport unit has a moving mechanism for moving the plurality of arms in the vertical direction, the processed unit is provided in a wet environment region, and the moving mechanism is isolated from the wet environment region . It may be provided in a dry environment area .

In the substrate processing system, the moving mechanism may move the plurality of arms so that the second holding portion is positioned higher than the delivery position when the operation of the transport portion is stopped. good.

The substrate processing system includes a plurality of the first holding portions, and rotates and moves the plurality of the first holding portions between the delivery position and the processing position where the processing by the processing unit is performed. You may have a table.

The substrate processing system has a machined surface cleaning unit for cleaning the machined surface of the substrate processed by the machined unit, and the transport unit may transport the substrate to the machined surface cleaning unit.

In the substrate processing system, the alignment portion and the machined surface cleaning portion may be provided so as to be laminated in the vertical direction.

In the substrate processing system, the alignment portion may be provided on an upper layer of the machined surface cleaning portion.

In the substrate processing system, in the machined surface cleaning unit, the transport unit is configured to be capable of transporting the substrate, and the substrate can be transported by another transport unit from a direction different from the transport direction of the substrate by the transport unit. It may be configured.

In the substrate processing system, the machined surface cleaning unit may have a shutter that separates the inside and the outside of the machined surface cleaning unit, and an elevating mechanism that raises and lowers the shutter.

In the substrate processing system, a device may be formed on the non-processed surface of the substrate, and a protective material for protecting the device may be provided, and the non-processed surface cleaning unit may clean the protective material.

The substrate processing system includes a processing apparatus including the first holding unit, the processing unit, the alignment unit, the non-processed surface cleaning unit, and the transport unit, a mounting table capable of holding a plurality of substrates, and the above-mentioned table. And a transfer device for transporting the substrate to the processing device.

In the substrate processing system, the delivery position, the alignment unit, and the non-processed surface cleaning unit may be arranged in the same direction as the direction in which the transfer device transfers the substrate to the processing device.

According to the present invention, the degree of freedom of movement of the transport unit can be increased, the device configuration can be simplified, and the process of thinning the substrate can be efficiently performed.

It is a top view schematically showing the outline of the structure of the substrate processing system which concerns on this embodiment. It is a perspective view which shows the outline of the structure of the transfer fork and transfer pad of a wafer transfer device. It is a top view which shows the outline of the structure of a processing apparatus. It is a side view which shows the outline of the structure of the processing apparatus in line AA of FIG. It is a side view which shows the outline of the structure of the processing apparatus in line BB of FIG. It is a perspective view which shows the outline of the structure of a transport unit. It is explanatory drawing which shows the wet environment area and the dry environment area in a processing apparatus. It is a top view which shows the outline of the structure of the alignment unit. It is a top view which shows the outline of the structure of the 1st cleaning unit. It is a side view which shows the outline of the structure of the 1st cleaning unit. It is a top view which shows the outline of the structure of the 2nd cleaning unit. It is a flowchart which shows the main process of a wafer processing. It is explanatory drawing which shows the operation of the transfer unit in the main process of a wafer processing. It is explanatory drawing which shows the outline of the structure of the tilting mechanism of a transport pad. It is sectional drawing which shows the outline of the structure of the urging part of a tilting mechanism. It is explanatory drawing which shows the outline of the structure of the fixing mechanism of a transport pad. It is explanatory drawing which shows the state which made the transport pad tiltable. It is explanatory drawing which shows the state that the tilt of a transport pad is fixed. It is a side view which shows the outline of the structure of the fixing mechanism of a transport pad. It is a perspective view which shows the outline of the structure of the fixing mechanism of a transport pad. It is a side view which shows the outline of the structure of the fixing mechanism of a transport pad.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present specification and the drawings, the elements having substantially the same functional configuration are designated by the same reference numerals, so that duplicate description will be omitted.

First, the configuration of the substrate processing system according to the present embodiment will be described. FIG. 1 is a plan view schematically showing an outline of the configuration of the substrate processing system 1. In the following, in order to clarify the positional relationship, the X-axis direction, the Y-axis direction, and the Z-axis direction that are orthogonal to each other are defined, and the Z-axis positive direction is defined as the vertically upward direction.

In the substrate processing system 1 of the present embodiment, the wafer W as a substrate is thinned. The wafer W is a semiconductor wafer such as a silicon wafer or a compound semiconductor wafer. A device (not shown) is formed on the surface of the wafer W (hereinafter referred to as a non-processed surface), and a protective material for protecting the device, for example, a protective tape (not shown) is attached to the surface. It is attached. Then, a predetermined processing process such as grinding is performed on the back surface of the wafer W (hereinafter referred to as a processed surface), and the wafer is thinned.

The substrate processing system 1 stores the wafer W before processing in the cassette C, and carries in the wafer W after processing into the substrate processing system 1 from the outside in units of cassettes, and the wafer W after processing is in the cassette C. After the unloading station 3 that is stored in the wafer W and carries out a plurality of wafers W from the substrate processing system 1 to the outside in cassette units, the processing device 4 that processes the wafer W to thin it, and the wafer W after processing. It has a configuration in which a post-processing device 5 for processing and a transfer station 6 for transporting a wafer W between the carry-in station 2, the processing device 4, and the post-processing device 5 are connected. The carry-in station 2, the transfer station 6, and the processing apparatus 4 are arranged side by side in this order in the Y-axis direction on the negative side of the X-axis. The unloading station 3 and the post-processing device 5 are arranged side by side in this order in the Y-axis direction on the X-axis positive direction side.

The carry-in station 2 is provided with a cassette mounting table 10. In the illustrated example, a plurality of cassettes C, for example, two cassettes C can be freely mounted in a row in the X-axis direction on the cassette mounting table 10. That is, the cassette mounting table 10 is configured to be able to hold a plurality of wafers W.

The carry-out station 3 also has the same configuration as the carry-in station 2. The unloading station 3 is provided with a cassette mounting table 20, and for example, two cassettes C can be freely placed in a row on the cassette mounting table 20 in the X-axis direction. That is, the cassette mounting table 20 is configured to be able to hold a plurality of wafers W. The loading / unloading station 2 and the loading / unloading station 3 may be integrated into one loading / unloading station, and in such a case, a common cassette mounting stand is provided in the loading / unloading station.

In the processing apparatus 4, processing processing such as grinding and cleaning is performed on the wafer W. The configuration of this processing device 4 will be described later.

In the post-processing device 5, post-processing is performed on the wafer W processed by the processing device 4. As the post-treatment, for example, a mounting process for holding the wafer W on the dicing frame via the dicing tape, a peeling process for peeling off the protective tape attached to the wafer W, and the like are performed. Then, the post-processing device 5 transfers the wafer W, which has been post-processed and held in the dicing frame, to the cassette C of the unloading station 3. A known device is used for each of the mounting process and the peeling process performed by the post-processing device 5.

The transfer station 6 is provided with a wafer transfer area 30. The wafer transfer region 30 is provided with a wafer transfer device 32 that is movable on a transfer path 31 extending in the X-axis direction. The wafer transfer device 32 has a transfer fork 33 and a transfer pad 34 as a wafer holding unit for holding the wafer W. The transport fork 33 and the transport pad 34 are configured to be movable in the horizontal direction, the vertical direction, around the horizontal axis, and around the vertical axis, respectively.

As shown in FIG. 2, the tip of the transport fork 33 is branched into two tip portions 33a. Further, for example, three pads 33b are provided on the surface of the transport fork 33. Each pad 33b is connected to a suction mechanism (not shown) that draws a vacuum and sucks the wafer W. As a result, the transport fork 33 adsorbs and holds the wafer W on the pad 33b. The transfer fork 33 conveys the wafer W before grinding.

The transport pad 34 has a circular shape having a diameter longer than the diameter of the wafer W in a plan view. Further, the transport pad 34 has a plurality of suction ports (not shown) formed on the lower surface thereof, and each suction port is connected to a suction mechanism (not shown) for evacuation. As a result, the transport pad 34 attracts and holds the entire surface of the machined surface of the wafer W. The transfer pad 34 conveys the ground wafer W, that is, the thinned wafer W.

As shown in FIG. 1, the substrate processing system 1 is provided with a control unit 40. The control unit 40 is, for example, a computer and has a program storage unit (not shown). The program storage unit stores a program that controls the processing of the wafer W in the substrate processing system 1. Further, the program storage unit also stores a program for controlling the operation of the drive system of the above-mentioned various processing devices and transfer devices to realize the wafer processing described later in the substrate processing system 1. The program is recorded on a computer-readable storage medium H such as a computer-readable hard disk (HD), flexible disk (FD), compact disk (CD), magnet optical desk (MO), or memory card. It may have been installed in the control unit 40 from the storage medium H.

Next, the configuration of the processing apparatus 4 described above will be described. As shown in FIGS. 3 to 5, the processing apparatus 4 includes a rotary table 100, a transfer unit 110 as a transfer unit, an alignment unit 120 as an alignment unit, a first cleaning unit 130 as a machined surface cleaning unit, and a non-machined surface. It has a second cleaning unit 140 as a cleaning unit, a third cleaning unit 150, a rough grinding unit 160 as a processing unit, a medium grinding unit 170 as a processing unit, and a finishing grinding unit 180 as a processing unit. ..

The rotary table 100 is rotatably configured by a rotary mechanism (not shown). On the rotary table 100, four chucks 101 are provided as first holding portions for sucking and holding the wafer W. The chucks 101 are arranged evenly on the same circumference as the rotary table 100, that is, every 90 degrees. The four chucks 101 can be moved to the delivery position A0 and the processing positions A1 to A3 by rotating the rotary table 100.

In the present embodiment, the delivery position A0 is a position on the X-axis positive direction side and the Y-axis negative direction side of the rotary table 100, and the third cleaning unit 150 is arranged. The second cleaning unit 140, the alignment unit 120, and the first cleaning unit 130 are arranged side by side on the Y-axis negative direction side of the delivery position A0. That is, the delivery position A0, the second cleaning unit 140, the alignment unit 120, and the first cleaning unit 130 are arranged side by side in the direction (Y-axis direction) in which the wafer transfer device 32 transfers the wafer W to the processing device 4. To. Further, the alignment unit 120 and the first cleaning unit 130 are stacked and arranged in this order from above. The first machining position A1 is a position on the X-axis positive direction side and the Y-axis positive direction side of the rotary table 100, and the rough grinding unit 160 is arranged. The second machining position A2 is a position on the X-axis negative direction side and the Y-axis positive direction side of the rotary table 100, and the middle grinding unit 170 is arranged. The third machining position A3 is a position on the X-axis negative direction side and the Y-axis negative direction side of the rotary table 100, and the finish grinding unit 180 is arranged.

The chuck 101 is held by the chuck base 102. The chuck 101 and the chuck base 102 are configured to be rotatable by a rotation mechanism (not shown).

As shown in FIG. 6, the transport unit 110 is an articulated robot provided with a plurality of, for example, three arms 111 to 113. Of the three arms 111 to 113, the first arm 111 at the tip is attached with a transport pad 114 as a second holding portion for sucking and holding the wafer W. Further, the third arm 113 at the base end is attached to a vertical movement mechanism 115 that moves the arms 111 to 113 in the vertical direction.

The transport pad 114 has a circular shape having a diameter longer than the diameter of the wafer W in a plan view. A plurality of suction ports (not shown) are formed on the lower surface thereof, and each suction port is connected to a suction mechanism (not shown) for evacuation. As a result, the transport pad 114 attracts and holds the entire surface of the machined surface of the wafer W. Further, the transport pad 114 is supported by the tip end portion of the first arm 111. A rotating portion 111a is built in the tip end portion of the first arm 111, and the rotating portion 111a includes, for example, a motor or the like. The transport pad 114 is rotatably configured by the rotating portion 111a.

The three arms 111 to 113 are connected by joint portions 112a and 113a, respectively. That is, the base end portion of the first arm 111 and the tip end portion of the second arm 112 are connected by a joint portion 112a incorporated in the tip end portion of the second arm 112. The joint portion 112a is provided with, for example, a motor or the like, and the first arm 111 is configured to be rotatable around a base end portion by the joint portion 112a. Similarly, the base end portion of the second arm 112 and the tip end portion of the third arm 113 are connected by a joint portion 113a incorporated in the tip end portion of the third arm 113. The joint portion 113a is also provided with, for example, a motor or the like, and the second arm 112 is configured to be rotatable around the base end portion by the joint portion 113a.

The vertical movement mechanism 115 includes a guide 115a extending in the vertical direction, and a base end portion of the third arm 113 is attached to the guide 115a. Further, the vertical movement mechanism 115 has a built-in drive unit (not shown) including, for example, a motor, and the drive unit causes the third arms 113 (arms 111 to 113) to move vertically along the guide 115a. It is configured to be movable.

Here, as shown in FIG. 7, at the machining positions A1 to A3, water is used when grinding the machined surface of the wafer W by the grinding units 160, 170, 180. Further, at the delivery position A0, a cleaning liquid is used when the machined surface of the wafer W is roughly cleaned by the third cleaning unit 150. Further, the cleaning liquid is also used when cleaning the non-processed surface of the wafer W by the second cleaning unit 140. Therefore, the region where these waters and cleaning liquids are used is the wet environment region R1 (hatched region in FIG. 7) containing moisture. Further, in the wet environment region R1, shavings are also generated when the machined surface of the wafer W is ground by the grinding units 160, 170, 180.

Therefore, it is preferable to arrange the vertical movement mechanism 115 in the dry environment region R2 (dotted line region in FIG. 7) isolated from the wet environment region R1. Specifically, the dry environment region R2 is a region on the Y-axis negative direction side of the support column 184 of the finish grinding unit 180, which will be described later. In such a case, the drive unit of the vertical movement mechanism 115 is not exposed to moisture or the like, and the drive unit can be operated appropriately. Further, although the guide 115a of the vertical movement mechanism 115 is open, a sealing mechanism or the like for protecting the guide 115a which is a sliding portion becomes unnecessary, and the device configuration can be simplified. Further, since the dry environment region R2 is on the transport station 6 side, it is easy to access from the transport station 6, and maintenance of the vertical movement mechanism 115 can be easily performed.

Since the rotating portion 111a and the joint portions 112a and 113a described above are built in and sealed in the arms 111 to 113, respectively, further protection is not required even in the wet environment region R1.

Then, the transfer unit 110 having such a configuration can transfer the wafer W to the delivery position A0, the alignment unit 120, the first cleaning unit 130, and the second cleaning unit 140.

The alignment unit 120 adjusts the horizontal orientation of the wafer W before the grinding process. As shown in FIG. 8, the alignment unit 120 has a processing container 121, and a base 122, a spin chuck 123, and a detection unit 124 are provided inside the processing container 121. The spin chuck 123 attracts and holds the wafer W and is rotatably configured by a rotation mechanism (not shown). The detection unit 124 may detect the position of the notch portion of the wafer W by, for example, imaging the outer peripheral portion of the wafer W, or the notch portion of the wafer W by irradiating the peripheral portion of the wafer W with a laser beam. The position of may be detected. Then, by detecting the position of the notch portion of the wafer W with the detection unit 124 while rotating the wafer W held by the spin chuck 123, the position of the notch portion is adjusted to adjust the horizontal orientation of the wafer W. do.

Although the first cleaning unit 130 is arranged below the alignment unit 120, since the first cleaning unit 130 includes the spin chuck 133 as described later, the spin chuck 133 rotates at high speed during cleaning. Vibrate. Since the horizontal orientation of the wafer W cannot be adjusted appropriately when vibration is transmitted to the alignment unit 120, it is preferable that the processing container 121 is supported independently of the first cleaning unit 130. The method of supporting the processing container 121 is arbitrary, but it may be supported by, for example, a support member provided in the wet environment region R1, or may be supported by a housing (side wall) of the processing apparatus 4. It may be suspended and supported from the ceiling surface of the processing apparatus 4.

In the first cleaning unit 130, the machined surface of the wafer W after the grinding process is cleaned, and more specifically, spin cleaning is performed.

As shown in FIGS. 9 to 10, the first cleaning unit 130 has a rectangular support plate 131. The first arm 111 of the transport unit 110 and the transport pad 114 access the first cleaning unit 130 from both the X-axis positive direction and the Y-axis positive direction. Therefore, the X-axis positive direction and the Y-axis positive direction of the support plate 131 are open.

A shutter 132 is provided around the support plate 131. The upper and lower surfaces of the shutter 132 are open. The shutter 132 is configured to be movable in the vertical direction above and below the support plate 131 by an elevating mechanism (not shown). The shape of the shutter 132 in a plan view is not limited to the rectangular shape shown in the figure, and may be a shape that covers the periphery of the support plate 131, for example, a circular shape.

When the shutter 132 is located above the support plate 131 as shown in FIGS. 9A and 10A, the shutter 132 is arranged with a slight gap from the bottom surface of the processing container 121 of the alignment unit 120. Will be done. Due to this gap, it is possible to suppress the vibration of the first cleaning unit 130 during the cleaning process from being transmitted to the alignment unit 120. Then, the processing space K is formed by the support plate 131, the shutter 132, and the processing container 121. A skirt 121a is provided on the bottom surface of the processing container 121 so as to cover the gap between the bottom surface of the processing container 121 and the shutter 132 on the outside of the shutter 132. Due to this skirt 121a, the cleaning liquid does not scatter to the outside during the cleaning process of the wafer W.

On the other hand, when the shutter 132 is located below the support plate 131 as shown in FIGS. 9 (b) and 10 (b), the processing space K is opened. Then, the wafer W is transferred to the processing space K by the transfer unit 110. Further, the transfer pad 34 of the wafer transfer device 32 can access the open processing space K from a direction different from that of the transfer unit 110, that is, from the transfer station 6 side.

A spin chuck 133 that holds and rotates the wafer W is provided in the central portion of the processing space K. The spin chuck 133 attracts and holds the wafer W. Below the spin chuck 133, for example, a drive unit 134 equipped with a motor or the like is provided. The spin chuck 133 can be rotated to a predetermined speed by the drive unit 134, and can be raised and lowered. Around the spin chuck 133, a cup 135 that receives and collects the liquid scattered or dropped from the wafer W is provided.

The cleaning liquid nozzle 136 supplies a cleaning liquid, for example, pure water, to the processed surface of the wafer W. Further, the cleaning liquid nozzle 136 is configured to be movable in the horizontal direction and the vertical direction by the moving mechanism 137. Then, while rotating the wafer W held by the spin chuck 133, the cleaning liquid is supplied from the cleaning liquid nozzle 136 to the machined surface of the wafer W. Then, the supplied cleaning liquid diffuses on the processed surface of the wafer W, and the processed surface is cleaned.

In the second cleaning unit 140, the unprocessed surface of the wafer W after the grinding process, which is held by the transfer pad 114 of the transfer unit 110, is cleaned, and the transfer pad 114 is also washed. As shown in FIG. 11, the second cleaning unit 140 has a processing container 141, and a sponge cleaning tool 142, an air nozzle 143, a stone cleaning tool 144 (grinding stone), and a brush having a cleaning liquid nozzle inside the processing container 141. A cleaning tool 145 is provided. The sponge cleaning tool 142, the air nozzle 143, the stone cleaning tool 144, and the brush cleaning tool 145 are each configured to be movable in the vertical direction by an elevating mechanism (not shown).

The sponge cleaning tool 142 has, for example, a sponge that extends longer than the diameter of the wafer W, and a cleaning liquid such as pure water can be supplied to the sponge, and is attached to the non-processed surface, more specifically, the non-processed surface. Clean the protective tape. The air nozzle 143 injects air onto the non-processed surface of the wafer W to dry the non-processed surface. Cleaning of the non-processed surface with the sponge and the cleaning liquid and drying of the non-processed surface with air are performed while the wafer W is held by the transport pad 114 and the transport pad 114 (wafer W) is rotated by the rotating portion 111a. Will be. As a result, the entire surface of the unprocessed surface of the wafer W is cleaned.

Each of the stone cleaning tool 144 and the brush cleaning tool 145 is stretched longer than the diameter of the suction surface of the wafer W in the transfer pad 114 of the transfer unit 110, and is in contact with the suction surface for cleaning. Then, the transfer pad 114 is cleaned by the stone cleaning tool 144 and the brush cleaning tool 145 while rotating the transport pad 114 by the rotating portion 111a. As a result, the entire surface of the transport pad 114 is washed.

The third cleaning unit 150 cleans the machined surface of the wafer W and the chuck 101 after the grinding process. As shown in FIGS. 3 and 4, the third cleaning unit 150 has a cleaning liquid nozzle 151, a stone cleaning tool 152 (grinding stone), and a moving mechanism 153. The cleaning liquid nozzle 151 and the stone cleaning tool 152 are configured to be movable in the horizontal direction and the vertical direction by the moving mechanism 153, respectively.

The cleaning liquid nozzle 151 supplies a cleaning liquid, for example, pure water, to the processed surface of the wafer W. Then, while rotating the wafer W held by the chuck 101, the cleaning liquid is supplied from the cleaning liquid nozzle 151 to the machined surface of the wafer W. Then, the supplied cleaning liquid diffuses on the processed surface of the wafer W, and the processed surface is cleaned.

The stone cleaning tool 152 comes into contact with the surface of the chuck 101 for cleaning. At this time, a cleaning liquid, for example, pure water may be supplied from a nozzle (not shown) to the surface of the chuck 101.

In the rough grinding unit 160, the machined surface of the wafer W is roughly ground. The rough grinding unit 160 has an annularly shaped rough grinding wheel 161. The rough grinding wheel 161 is provided with a drive unit 163 via a spindle 162. The drive unit 163 incorporates, for example, a motor (not shown), rotates the rough grinding wheel 161 and moves it in the vertical direction and the horizontal direction (X-axis direction) along the support column 164. Then, the back surface of the wafer W is roughly ground by rotating the chuck 101 and the rough grinding wheel 161 in a state where the wafer W held by the chuck 101 is in contact with a part of the arc of the rough grinding wheel 161. .. At this time, a grinding fluid, for example, water is supplied to the back surface of the wafer W.

In the medium grinding unit 170, the back surface of the wafer W is medium ground. As shown in FIGS. 3 and 5, the configuration of the medium grinding unit 170 is substantially the same as the configuration of the rough grinding unit 160, and includes a medium grinding wheel 171 spindle 172, a drive unit 173, and a support column 174. The grain size of the medium grinding wheel 171 is smaller than the grain size of the coarse grinding wheel 161. Then, while supplying the grinding fluid to the back surface of the wafer W held by the chuck 101, the chuck 101 and the medium grinding wheel 171 are rotated while the back surface is in contact with a part of the arc of the medium grinding wheel 171. This grinds the back surface of the wafer W.

The finish grinding unit 180 finish grinds the back surface of the wafer W. The configuration of the finish grinding unit 180 is substantially the same as the configuration of the rough grinding unit 160 and the medium grinding unit 170, and includes a finishing grinding wheel 181 spindle 182, a drive unit 183, and a support column 184. The particle size of the finishing grinding wheel 181 is smaller than the particle size of the medium grinding wheel 171. Then, while supplying the grinding fluid to the back surface of the wafer W held by the chuck 101, the chuck 101 and the finishing grinding wheel 181 are rotated while the back surface is in contact with a part of the arc of the finishing grinding wheel 181. This grinds the back surface of the wafer W.

Next, the wafer processing performed by using the substrate processing system 1 configured as described above will be described.

First, the cassette C containing the plurality of wafers W is placed on the cassette mounting table 10 of the carry-in station 2. In order to prevent the protective tape from being deformed, the cassette C houses the wafer W so that the surface of the wafer W to which the protective tape is attached faces upward.

Next, the wafer W in the cassette C is taken out by the transfer fork 33 of the wafer transfer device 32 and transferred to the processing device 4. At this time, the front and back surfaces are inverted so that the processed surface of the wafer W faces upward by the transport fork 33.

The wafer W conveyed to the processing apparatus 4 is delivered to the spin chuck 123 of the alignment unit 120. Then, in the alignment unit 120, the horizontal orientation of the wafer W is adjusted (step S1 in FIG. 12).

Next, as shown in FIGS. 13A and 13B, the wafer W is conveyed from the alignment unit 120 to the delivery position A0 by the transfer unit 110, and is delivered to the chuck 101 at the delivery position A0. After that, the rotary table 100 is rotated 90 degrees counterclockwise to move the chuck 101 to the first machining position A1. Then, the machined surface of the wafer W is roughly ground by the rough grinding unit 160 (step S2 in FIG. 12).

Before the wafer W is held by the chuck 101 in this step S2, the chuck 101 is cleaned by using the stone cleaning tool 152 of the third cleaning unit 150 (step T1 in FIG. 12). Cleaning of the chuck 101 is performed at an arbitrary timing up to step S2.

Next, the rotary table 100 is rotated 90 degrees counterclockwise to move the chuck 101 to the second machining position A2. Then, the back surface of the wafer W is medium-ground by the medium-grinding unit 170 (step S3 in FIG. 12).

Next, the rotary table 100 is rotated 90 degrees counterclockwise to move the chuck 101 to the third machining position A3. Then, the back surface of the wafer W is finish-ground by the finish grinding unit 180 (step S4 in FIG. 12).

Next, the rotary table 100 is rotated 90 degrees counterclockwise, or the rotary table 100 is rotated 270 degrees clockwise to move the chuck 101 to the delivery position A0. Then, the machined surface of the wafer W is roughly cleaned by the cleaning liquid using the cleaning liquid nozzle 151 of the third cleaning unit 150 (step S5 in FIG. 12). In this step S5, cleaning is performed to remove stains on the machined surface to some extent.

Next, as shown in FIG. 13 (c), the wafer W is transferred from the delivery position A0 to the second cleaning unit 140 by the transfer unit 110. At this time, although the wafer W is thinned, the transport pad 114 sucks and holds the processed surface of the wafer W on the entire surface. Then, in the second cleaning unit 140, the unprocessed surface of the wafer W is cleaned by the sponge cleaning tool 142 while the wafer W is rotationally held by the transport pad 114 (step S6 in FIG. 12). After that, with the wafer W being rotationally held by the transport pad 114, air is ejected from the air nozzle 143 to the non-processed surface to dry the non-processed surface.

Before the wafer W is conveyed by the transfer unit 110 in this step S6, the transfer pad 114 of the transfer unit 110 is cleaned by using the stone cleaning tool 144 and the brush cleaning tool 145 of the second cleaning unit 140. (Step T2 in FIG. 12). Cleaning of the transport pad 114 by the stone cleaning tool 144 and the brush cleaning tool 145 is performed while rotating the transport pad 114 by the rotating portion 111a. Further, the washing of the transport pad 114 is performed at an arbitrary timing up to step S6.

Next, as shown in FIG. 13D, the wafer W is transferred from the second cleaning unit 140 to the first cleaning unit 130 by the transfer unit 110. When the wafer W is transferred, in the first cleaning unit 130, the shutter 132 is located below the support plate 131, and the processing space K is open. After that, when the wafer W is handed over to the spin chuck 133 and the transport unit 110 exits, the shutter 132 is moved up and down, the shutter 132 is arranged above the support plate 131, and the processing space K is formed. Then, while rotating the wafer W held by the spin chuck 133, the cleaning liquid is supplied from the cleaning liquid nozzle 136 to the processed surface of the wafer W, and the processed surface is finished and cleaned (step S7 in FIG. 12). In this step S7, the machined surface of the wafer W is washed and dried to a desired cleanliness. Then, when the finish cleaning and drying of the processed surface of the wafer W are completed, the shutter 132 is lowered, the shutter 132 is arranged below the support plate 131, and the processing space K is opened.

After that, the wafer W is transferred from the first cleaning unit 130 to the post-processing device 5 by the wafer transfer device 32. At this time, although the wafer W is thinned, the transport pad 34 sucks and holds the processed surface of the wafer W on the entire surface. Then, the post-processing apparatus 5 performs post-processing such as a mounting process for holding the wafer W on the dicing frame and a peeling process for peeling off the protective tape attached to the wafer W (step S8 in FIG. 12).

After that, the wafer W to which all the processing has been performed is transferred to the cassette C of the cassette mounting table 20 of the unloading station 3. In this way, a series of wafer processing in the substrate processing system 1 is completed.

In the processing apparatus 4, when the transfer unit 110 is stopped in the series of wafer processing, the transfer pad 114 of the transfer unit 110 is arranged above the second cleaning unit 140, which is the standby position. There is. At the time of this standby, it is preferable that the transport pad 114 is arranged at a position higher than the chuck 101 (delivery position A0 and processing positions A1 to A3) of the rotary table 100. When the machined surface of the wafer W is ground by the grinding units 160, 170, 180 in steps S2 to S4 described above, shavings are generated, and contaminated air containing the shavings flows from the chuck 101 side. Therefore, by arranging the transport pad 114 higher than the chuck 101 while the transport pad 114 is on standby, it is possible to prevent the transport pad 114 from being contaminated by contaminated air.

According to the above embodiment, in the processing apparatus 4, the transport unit 110 is an articulated robot provided with three arms 111 to 113, and each arm 111 to 113 can be moved independently. , The transport pad 114 can access the delivery position A0, the alignment unit 120, the first cleaning unit 130, and the second cleaning unit 140. Since the wafer W can be conveyed to the delivery position A0 and the units 120, 130, and 140 by one transfer unit 110 in this way, the degree of freedom of movement of the transfer unit 110 can be increased. Further, since there is only one transfer means for the wafer W, the apparatus configuration of the processing apparatus 4 can be simplified. Therefore, the wafer processing can be efficiently performed.

Further, in the processing apparatus 4, the delivery position A0, the second cleaning unit 140, the alignment unit 120, and the first cleaning unit 130 are arranged side by side in the Y-axis direction, so that the access range of the transport unit 110 is reduced. And the wafer W can be efficiently transported.

Further, since the alignment unit 120 and the first cleaning unit 130 are laminated in the processing device 4, the footprint of the processing device 4 can be reduced. As a result, the degree of freedom in installing the processing device 4 is improved. Further, by stacking the alignment unit 120 and the first cleaning unit 130 in this way, maintenance of each of these units 120 and 130 can be easily performed.

Further, the alignment unit 120 and the first cleaning unit 130 are laminated in this order from above, that is, the first cleaning unit 130 for performing liquid treatment is provided in the lower layer of the alignment unit 120. In such a case, the drainage in the first cleaning unit 130 can be easily performed from the lower part of the first cleaning unit 130, and the particles generated in the first cleaning unit 130 do not invade the alignment unit 120. .. However, the stacking order of the alignment unit 120 and the first cleaning unit 130 is not limited to this.

Further, according to the present embodiment, in one substrate processing system 1, a series of processing can be continuously performed on a plurality of wafers W, and the throughput can be improved.

The configuration of the substrate processing system 1 is not limited to the above embodiment. For example, in the processing apparatus 4, the alignment unit 120 and the first cleaning unit 130 are laminated, but they may be arranged side by side in the horizontal direction. However, from the viewpoint of reducing the footprint, it is preferable to stack them. Further, the first cleaning unit 130 may be provided outside the processing device 4, for example, between the processing device 4 and the post-processing device 5.

Further, in the processing apparatus 4, the second cleaning unit 140 was arranged side by side in the horizontal direction with the alignment unit 120 and the first cleaning unit 130, but the alignment unit 120 and the first cleaning unit 130 are laminated. It may be provided. However, since the transport pad 114 of the transport unit 110 always requires a standby position, it is efficient as a layout to arrange the second cleaning unit 140 at the standby position.

Further, in the processing device 4, the vertical movement mechanism 115 of the transport unit 110 is fixedly provided in the dry environment region R2, but may be configured to be movable in the Y-axis direction of FIG. 1, for example. In such a case, any one of the three arms 111 to 113 may be omitted.

Further, in the substrate processing system 1, for example, another wafer transfer device may be provided between the processing device 4 and the post-processing device 5. This wafer transfer device transfers the wafer W from, for example, the first cleaning unit 130 to the aftertreatment device 5.

Further, in the substrate processing system 1, the post-processing apparatus 5 has performed mounting processing and peeling processing, but dicing processing may be performed on the wafer W. Alternatively, the substrate processing system 1 may separately have a dicing device for performing dicing processing in addition to the processing device 4 and the post-processing device 5. Such a dicing process may be performed before the grinding process in the processing apparatus 4, or may be performed after the grinding process. Further, the substrate processing system 1 may omit the post-processing device 5 and perform mounting processing, peeling processing, and dicing processing outside the substrate processing system 1. In such a case, the wafer W ground by the processing device 4 is transferred from the first cleaning unit 130 to the cassette mounting table 10 by the transfer pad 34 of the wafer transfer device 32.

Next, the configuration of the transport unit 110 in the processing apparatus 4 of the substrate processing system 1 of the above embodiment will be described in more detail. That is, the transport pad 114 of the transport unit 110 is configured to be freely switchable between a case where the tilt is movable in the side view and a case where the tilt is fixed in the side view. The mechanism for making the transport pad 114 tiltable (hereinafter referred to as a tilting mechanism) and the mechanism for fixing the transport pad 114 (hereinafter referred to as a fixing mechanism) may each have an arbitrary configuration, and examples thereof will be described below.

14A and 14B are explanatory views showing an outline of the configuration of the tilting mechanism 200 of the transport pad 114, where FIG. 14A is a plan view and FIG. 14B is a side view. The tilting mechanism 200 has a support plate 201 and an urging portion 202. The support plate 201 has a disk shape and is provided concentrically with the transport pad 114 above the transport pad 114. Further, the support plate 201 is supported by the first arm 111.

The urging portion 202 urges the transport pad 114 with respect to the support plate 201 in the separating direction. The urging portions 202 are provided at a plurality of, for example, three locations on the same circumference of the support plate 201 at equal intervals. The transport pad 114 is configured to be tiltable about the central axis C in the vertical direction by the three urging portions 202.

As shown in FIG. 15, the urging portion 202 has a bolt 203, a spring 204, and a case 205. The tip portion 203a of the bolt 203 is fixedly provided to the transport pad 114. On the other hand, the bolt head 203b of the bolt 203 can move up and down on the upper surface side of the support plate 201. A spring 204 is provided on the outer peripheral surface of the bolt 203. The spring 204 is housed in the case 205. With such a configuration, the urging unit 202 can urge the transport pad 114 against the support plate 201.

FIG. 16 is a side view showing an outline of the configuration of the fixing mechanism 210 of the transport pad 114. The fixing mechanism 210 is provided above each urging portion 202. The fixing mechanism 210 has a lock member 211 and a cylinder 212. The lock member 211 is provided above the bolt 203 so as to extend in the vertical direction. The cylinder 212 moves the lock member 211 in the vertical direction. With such a configuration, the fixing mechanism 210 can fix the vertical movement of the transport pad 114 by bringing the lock member 211 into contact with the bolt head 203b of the bolt 203. On the other hand, the fixing mechanism 210 can move the transport pad 114 up and down by arranging the lock member 211 upward so as not to come into contact with the bolt 203.

Next, the operations of the tilting mechanism 200 and the fixing mechanism 210 will be described in line with the wafer processing in the substrate processing system 1 described above. In the following description, making the transport pad 114 tiltable means that the lock member 211 of the fixing mechanism 210 is not brought into contact with the bolt 203 of the tilt mechanism 200, and the transport pad 114 is tilted by the function of the tilt mechanism 200. Is in a free state. Further, fixing the tilt of the transport pad 114 means a state in which the lock member 211 is brought into contact with the bolt 203 and the vertical movement of the transport pad 114 is locked.

First, after the horizontal orientation of the wafer W is adjusted by the alignment unit 120 in step S1, when the wafer W is taken out from the alignment unit 120 by the transfer unit 110, the transfer pad 114 is tilted freely. Thereby, for example, even if the wafer W held by the spin chuck 123 is not horizontal, the transport pad 114 can be tilted along the inclination, and the wafer W can be appropriately received.

After that, when the wafer W is transferred from the alignment unit 120 to the delivery position A0 by the transfer unit 110, the tilt of the transfer pad 114 is fixed. As a result, it is possible to prevent the wafer W from moving up and down irregularly during transportation.

After that, when the wafer W is delivered to the chuck 101 at the delivery position A0 by the transfer unit 110, the transfer pad 114 is tilted freely. Thereby, for example, even when the chuck 101 is not flat (horizontal) as shown in FIG. 17, the transport pad 114 can be tilted along the inclination, and the wafer W can be appropriately delivered.

After that, when the grinding process in steps S2 to S5 is completed and the wafer W is received from the chuck 101 at the delivery position A0 by the transfer unit 110, the transfer pad 114 is tilted freely.

After that, when the wafer W is transferred from the delivery position A0 to the second cleaning unit 140 by the transfer unit 110, the tilt of the transfer pad 114 is fixed.

After that, in step S6, when cleaning the non-processed surface of the wafer W held by the transfer pad 114, the tilt of the transfer pad 114 is fixed. As a result, the wafer W does not move up and down irregularly, so that the non-processed surface can be appropriately cleaned.

Before the wafer W is transported by the transport unit 110 in step S6, the transport pad 114 is cleaned by using the stone cleaning tool 144 and the brush cleaning tool 145 of the second cleaning unit 140 in step T2. When cleaning the transport pad 114, the tilt of the transport pad 114 is fixed as shown in FIG. As a result, the transport pad 114 does not move up and down irregularly, so that the transport pad 114 can be appropriately cleaned.

After that, when the wafer W is transferred from the second cleaning unit 140 to the first cleaning unit 130 by the transfer unit 110, the tilt of the transfer pad 114 is fixed.

After that, when the wafer W is handed over to the spin chuck 133 of the first cleaning unit 130 by the transport unit 110, the transport pad 114 is tilted freely. As a result, even when the spin chuck 133 is not flat (horizontal), the transport pad 114 can be tilted along the inclination of the spin chuck 133, and the wafer W can be appropriately delivered.

After that, step S8 is performed, but since it is a process that does not use the transport unit 110, the description thereof will be omitted.

According to the above embodiment, when the wafer W is delivered (received) using the transport unit 110, the transport pad 114 is tilted freely. Therefore, for example, even if the chuck on the delivery side is not flat (horizontal), the transfer pad 114 can be tilted along the inclination, and the wafer W can be appropriately delivered.

On the other hand, since the tilt of the transfer pad 114 is fixed at times other than the transfer of the wafer W, for example, during transfer or cleaning of the wafer W, or during cleaning of the transfer pad 114, the transfer or cleaning can be performed appropriately. ..

In this way, the wafer processing can be appropriately performed by switching between tilting and fixing of the transport pad 114.

The substrate processing system 1 described above may have a thickness measuring instrument (not shown) for measuring the thickness of the protective tape with respect to the wafer W held by the transfer pad 114 of the transfer unit 110. As the thickness measuring instrument, a known measuring instrument can be used, but for example, a spectroscopic interferometer can be used.

Here, in the protective tape attached to the wafer W, the thickness of the tape itself may vary in the plane. Further, when the protective tape is attached to the wafer W, the tension becomes non-uniform, so that the thickness of the protective tape may vary in the plane. If the grinding process is performed in such a state that the thickness of the tape is not uniform, the grinding becomes uniform in the wafer surface.

Therefore, for example, after the horizontal orientation of the wafer W is adjusted by the alignment unit 120 in step S1, when the wafer W is transferred to the delivery position A0 by the transfer unit 110, the wafer W held by the transfer pad 114 is transferred to the wafer W. Measure the thickness of the protective tape with a thickness measuring instrument. Then, in the grinding process of steps S2 to S4, the method of contacting the grinding units 160, 170, 180 (grinding grindstones 161, 171 and 181) with the machined surface of the wafer W is determined based on the measurement result of the thickness of the protective tape. Adjust. Then, the wafer W can be ground and thinned to a uniform thickness in the wafer surface.

When measuring the thickness of such a protective tape, the tilt of the transport pad 114 is fixed. This makes it possible to appropriately measure the thickness of the protective tape.

The configuration of the tilting mechanism and the fixing mechanism of the transport pad 114 is not limited to the above embodiment.

For example, as shown in FIG. 19, the fixing mechanism 220 has a lock member 221 extending in the horizontal direction and a cylinder 222 for moving the lock member 221 in the horizontal direction. With such a configuration, the fixing mechanism 220 can fix the vertical movement of the transport pad 114 by bringing the lock member 221 into contact with the bolt 203. On the other hand, the fixing mechanism 220 can move the transport pad 114 up and down by arranging the lock member 221 laterally so as not to come into contact with the bolt 203.

Further, for example, as shown in FIG. 20, the fixing mechanism 230 may have a rotatable lock member 231. The lock member 231 has three arms 231a extending radially from the center, and each arm 231a is provided so as to correspond to the bolt 203 of the tilting mechanism 200. With such a configuration, the fixing mechanism 230 can fix the vertical movement of the transport pad 114 by rotating the lock member 231 to bring the arm 231a into contact with the bolt 203. On the other hand, the fixing mechanism 230 can move the transport pad 114 up and down by arranging the arm 231a so as not to come into contact with the bolt 203.

Further, for example, as shown in FIG. 21, the transport unit 110 may have a mechanism 240 (hereinafter referred to as a composite mechanism 240) in which a tilting mechanism and a fixing mechanism are combined. The composite mechanism 240 has a support sphere 241 that supports the transport pad 114, and an adsorbent 242 that evacuates and sucks the support sphere 241. A curved portion 242a along the spherical shape of the support sphere 241 is formed on the lower surface of the adsorbent 242. The support sphere 241 is rotatably configured along the curved portion 242a. The support sphere 241 allows the transport pad 114 to be tilted about the central axis C in the vertical direction. Further, a plurality of suction ports (not shown) are formed in the curved portion 242a, and each suction port is connected to a suction mechanism (not shown) for evacuation.

With such a configuration, in the composite mechanism 240, the curved portion 242a of the adsorbent 242 evacuates the support sphere 241 to adsorb and hold the support sphere 241. As a result, the rotation of the support sphere 241 is fixed, and the tilt of the transport pad 114 can be fixed. On the other hand, by stopping the evacuation of the support sphere 241 by the curved portion 242a of the adsorbent 242, the support sphere 241 can rotate freely. Then, by rotating the support sphere 241 in this way, the transport pad 114 can be tilted about the central axis C.

The tilting mechanism 200 and the fixing mechanisms 210, 220, 230 (composite mechanism 240) of the above embodiment are not limited to the transport pad 114 of the transport unit 110, and are applicable as long as the wafer W is sucked and held and transported. can. For example, the tilting mechanism 200 and the fixing mechanisms 210, 220, 230 (composite mechanism 240) can also be applied to the transfer pad 34 of the wafer transfer device 32.

Although the embodiments of the present invention have been described above, the present invention is not limited to such examples. It is clear that a person skilled in the art can come up with various modifications or amendments within the scope of the technical idea described in the claims, and of course, the technical scope of the present invention also includes them. It is understood that it belongs to.

For example, in the above embodiment, a protective tape is attached to the surface of the wafer W to protect the device, but the protective material for the device is not limited to this. For example, a support substrate such as a support wafer or a glass substrate may be bonded to the surface of the wafer, and the present invention can be applied even in such a case.

1 Board processing system 2 Import station 3 Import station 4 Processing equipment 5 Post-processing equipment 6 Transfer station 10, 20 Cassette mounting table 32 Wafer transfer device 33 Transfer fork 34 Transfer pad 40 Control unit 100 Rotating table 101 Chuck 110 Transfer unit 111 to 113 Arm 111a Rotating part 112a, 113a Joint part 114 Transport pad 115 Vertical movement mechanism 120 Alignment unit 130 First cleaning unit 140 Second cleaning unit 150 Third cleaning unit 160 Rough grinding unit 170 Medium grinding unit 180 Finishing grinding unit 200 Tilt mechanism 210, 220, 230 Fixing mechanism 240 Composite mechanism A0 Delivery position A1 to A3 Machining position R1 Wet environment area R2 Dry environment area W Wafer

Claims (14)

It is a board processing system that processes boards.
The first holding part that holds the substrate,
A machined portion that abuts on the machined surface of the substrate held by the first holding portion and grinds the substrate,
An alignment portion that adjusts the horizontal orientation according to the position of the notch portion of the substrate before being held by the first holding portion.
The non-machined surface on the opposite side of the machined surface of the substrate whose notch position is adjusted by the alignment part and whose machined surface is held by the second holding part is washed. Non-processed surface cleaning part and
A delivery position provided with the second holding portion, the substrate is held and conveyed by the second holding portion, and the substrate whose notch position is adjusted by the alignment portion is delivered to the first holding portion. , A substrate processing system comprising a transport portion for transporting a substrate to the alignment portion and the non-processed surface cleaning portion.
The transport portion has a plurality of arms and a plurality of joint portions connecting the plurality of arms.
The arm at the tip of the plurality of arms supports the second holding portion.
The substrate processing system according to claim 1, wherein the joint portion rotates the arm. The substrate processing system according to claim 2, wherein the transport unit is provided on the arm at the tip end and has a rotating unit for rotating the second holding unit. The transport unit has a moving mechanism for moving the plurality of arms in the vertical direction.
The processed portion is provided in a wet environment area and is provided.
The substrate processing system according to claim 2 or 3, wherein the moving mechanism is provided in a dry environment region isolated from the wet environment region .
The moving mechanism is characterized in that, when the operation of the transport unit is stopped, the plurality of arms are moved so that the second holding unit is located higher than the delivery position. 4. The substrate processing system according to 4. It is characterized by having a plurality of the first holding portions and having a rotary table for rotating and moving the plurality of the first holding portions between the delivery position and the machining position where the machining by the machining section is performed. The substrate processing system according to any one of claims 1 to 5. It has a machined surface cleaning part that cleans the machined surface of the substrate machined by the machined part.
The substrate processing system according to any one of claims 1 to 6, wherein the transport unit transports a substrate to the machined surface cleaning unit. The substrate processing system according to claim 7, wherein the alignment portion and the machined surface cleaning portion are provided so as to be laminated in the vertical direction. The substrate processing system according to claim 8, wherein the alignment portion is provided on an upper layer of the machined surface cleaning portion. The machined surface cleaning unit is configured such that the transport unit can transport the substrate and that another transport unit can transport the substrate from a direction different from the transport direction of the substrate by the transport unit. The substrate processing system according to any one of claims 7 to 9, wherein the substrate processing system is characterized. The machined surface cleaning unit according to any one of claims 7 to 10, wherein the machined surface cleaning unit has a shutter that separates the inside and the outside of the machined surface cleaning unit, and an elevating mechanism that raises and lowers the shutter. Board processing system. A device is formed on the non-processed surface of the substrate, and a protective material for protecting the device is provided.
The substrate processing system according to any one of claims 1 to 11, wherein the non-processed surface cleaning unit cleans the protective material. A processing apparatus including the first holding unit, the processed unit, the alignment unit, the non-processed surface cleaning unit, and the transport unit.
A mounting table that can hold multiple boards and
The substrate processing system according to any one of claims 1 to 12, wherein the substrate processing system comprises the above-mentioned stand and a transfer device for transporting a substrate to the processing apparatus. 13. The substrate according to claim 13, wherein the delivery position, the alignment unit, and the non-processed surface cleaning unit are arranged in the same direction as the direction in which the transfer device conveys the substrate to the processing device. Processing system.

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