JP3227448U - Substrate grinding system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate grinding system in which a plurality of cleaning devices are mounted in an area of high cleanliness and an increase in installation area due to an increase in the number of mounting devices can be suppressed. A substrate grinding system includes a mounting table 20, a first cleaning device 30, a second cleaning device 40, a grinding device 50, a first transfer area 60, and a second transfer area 70. The first transport region is arranged next to the mounting table, the first cleaning device, and the second cleaning device in plan view so as to be surrounded on three sides by the mounting table, the first cleaning device, and the second cleaning device. .. The second transport region is arranged next to the grinding device, the first cleaning device, and the second cleaning device so as to be surrounded on three sides by the grinding device, the first cleaning device, and the second cleaning device. A line connecting the first cleaning device and the second cleaning device intersects with a line connecting the first transfer region and the second transfer region. The first cleaning device and the grinding device are separated by a partition. [Selection diagram] Figure 1

Description

The present disclosure relates to substrate grinding systems.

The processing apparatus described in Patent Document 1 includes a first transfer unit, a position adjusting mechanism, a second transfer unit, a turntable, a chuck table, a processing unit, and a cleaning mechanism. The first transport unit transports the substrate from the cassette to the position adjusting mechanism. The position adjusting mechanism adjusts the position of the substrate. The second transfer unit transfers the substrate from the position adjusting mechanism to the chuck table on the turntable. When the chuck table sucks and holds the substrate, the turntable rotates and the substrate is placed below the processing unit. The processing unit grinds the substrate with a grinding wheel. The second transfer unit sucks and holds the ground substrate, rotates, and transfers the substrate to the cleaning mechanism. The cleaning mechanism cleans the substrate after grinding. The first transport unit transports the cleaned substrate from the cleaning mechanism to the cassette.

JP, 2019-185645, A

One aspect of the present disclosure provides a technique in which a plurality of cleaning devices are mounted in an area with high cleanliness and an increase in installation area due to an increase in the number of mounted devices is suppressed.

A substrate grinding system according to an aspect of the present disclosure includes a mounting table, a first cleaning device, a second cleaning device, a grinding device, a first transfer area, a first transfer device, and a second transfer area. A second transport device. A cassette that accommodates a substrate is placed on the placing table. The first cleaning device cleans the substrate. The second cleaning device also cleans the substrate. The grinding device grinds the substrate. In plan view, the first transport region is adjacent to the mounting table, the first cleaning device, and the second cleaning device on the three sides of the mounting table, the first cleaning device, and the second cleaning device. It is arranged so as to be surrounded. The first transfer device transfers the substrate in the first transfer area. In plan view, the second transfer area is adjacent to the grinding device, the first cleaning device, and the second cleaning device, and is located on three sides of the grinding device, the first cleaning device, and the second cleaning device. It is arranged so as to be surrounded. The second transfer device transfers the substrate in the second transfer area. In a plan view, a line connecting the first cleaning device and the second cleaning device intersects with a line connecting the first transfer region and the second transfer region. The first cleaning device and the grinding device are separated by a partition.

According to one aspect of the present disclosure, a plurality of cleaning devices can be mounted in an area with high cleanliness, and an increase in installation area due to an increase in the number of mounted devices can be suppressed.

FIG. 1 is a plan view showing a substrate grinding system according to an embodiment. FIG. 2 is a side view showing the substrate grinding system of FIG. FIG. 3 is a plan view showing a substrate grinding system according to a modification.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In each drawing, the same or corresponding components are designated by the same reference numerals, and description thereof may be omitted. In this specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are directions perpendicular to each other. The X-axis direction and the Y-axis direction are horizontal, and the Z-axis direction is the vertical direction.

First, the substrate grinding system 10 will be described with reference to FIGS. 1 and 2. Note that, in FIG. 2, in order to illustrate the arrangement of the first cleaning device 30, the detection device 31, and the third cleaning device 32, the illustration of the second transport device 71, the partition wall 82, and the shutter 88 shown in FIG. 1 is omitted. ..

The substrate grinding system 10 includes a mounting table 20, a first cleaning device 30, a second cleaning device 40, a grinding device 50, a first transfer area 60, a first transfer device 61, and a second transfer area 70. , The second transfer device 71 and the control device 90. The substrate grinding system 10 may further include a detection device 31. The substrate grinding system 10 may further include a third cleaning device 32.

The mounting table 20 is one on which the cassette C is mounted. The cassette C accommodates a plurality of substrates W at intervals in the vertical direction. The substrate W includes a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, or a glass substrate. The substrate W may further include a device layer formed on the surface of the semiconductor substrate or the glass substrate. The device layer includes electronic circuits. Further, the substrate W may be a superposed substrate obtained by joining a plurality of substrates. The mounting table 20 includes a plurality of mounting plates 21 arranged in a line in the Y-axis direction. The cassette C is placed on each of the plurality of placing plates 21. The number of the mounting plates 21 is not particularly limited. Similarly, the number of cassettes C is not particularly limited.

The first cleaning device 30 cleans the substrate W. For example, the first cleaning device 30 scrubs and cleans the substrate W after being ground by the grinding device 50. The first cleaning device 30 includes a cleaning body such as a sponge or a brush, and the cleaning body removes particles such as grinding dust. The cleaning body only needs to scrub the ground upper surface of the substrate W and is disposed above the substrate W. However, the cleaning body may be arranged on both the upper and lower sides of the substrate W, and the upper and lower surfaces of the substrate W may be cleaned.

The second cleaning device 40 also cleans the substrate W. For example, the second cleaning device 40 etches the substrate W after being ground by the grinding device 50 with a chemical solution. The second cleaning device 40 includes a spin chuck that holds the substrate W and a nozzle that discharges a chemical solution. The nozzle supplies the chemical liquid to the center of the upper surface of the rotating substrate W. The chemical solution wets and spreads from the center of the upper surface of the substrate W toward the peripheral edge by the centrifugal force. The chemical solution may be a general one, and may be, for example, hydrofluoric nitric acid or an alkaline solution. The chemical solution etches the ground upper surface of the substrate W to remove grinding marks. The second cleaning device 40 may supply the chemical liquid to the lower surface of the substrate W, or may clean the upper and lower surfaces of the substrate W.

The grinding device 50 grinds the substrate W. Grinding includes polishing. Abrasive grains used for grinding may be fixed abrasive grains or free abrasive grains. The grinding device 50 includes, for example, a table 51, four chucks 52, and three grinding mechanisms 53.

The table 51 holds the four chucks 52 at equal intervals around the rotation center line R1 and rotates about the rotation center line R1. Each of the four chucks 52 rotates together with the table 51, and moves to the loading/unloading position A0, the primary grinding position A1, the secondary grinding position A2, the tertiary grinding position A3, and the loading/unloading position A0 in this order. Moving.

The carry-in/carry-out position A0 serves both as a position for carrying in the substrate W and a position for carrying out the substrate W. Although the carry-in position and the carry-out position are the same position in the present embodiment, the carry-in position and the carry-out position may be different positions. The primary grinding position A1 is a position where the primary grinding of the substrate W is performed. The secondary grinding position A2 is a position where the secondary grinding of the substrate W is performed. The tertiary grinding position A3 is a position where the tertiary grinding of the substrate W is performed.

The four chucks 52 are attached to the table 51 so as to be rotatable about their respective rotation center lines. At the primary grinding position A1, the secondary grinding position A2 and the tertiary grinding position A3, the chuck 52 rotates about the respective rotation center lines.

The one grinding mechanism 53 primarily grinds the substrate W at the primary grinding position A1. Another grinding mechanism 53 secondarily grinds the substrate W at the second grinding position A2. The remaining grinding mechanism 53 thirdly grinds the substrate W at the third grinding position A3.

The number of grinding mechanisms 53 may be one or more. Further, the number of chucks 52 may be larger than the number of grinding mechanisms 53. However, the table 51 may be omitted. When the table 51 is not provided, the number of chucks 52 may be the same as the number of grinding mechanisms 53 or may be one.

The first transport region 60 is adjacent to the mounting table 20, the first cleaning device 30, and the second cleaning device 40 in plan view (Z-axis direction), and is next to the mounting table 20, the first cleaning device 30, and the second cleaning device 40. The device 40 and the device 40 are arranged so as to be surrounded on three sides. Specifically, the mounting table 20 is arranged on the X axis direction negative side of the first transfer region 60, the first cleaning device 30 is arranged on the X axis direction positive side of the first transfer region 60, and the second cleaning device 40. Is arranged on the Y axis direction negative side of the first transport region 60.

The first transfer device 61 transfers the substrate W in the first transfer area 60. That is, the first transfer device 61 transfers the substrate W between the plurality of devices arranged next to the first transfer area 60. The first transfer device 61 has a first transfer arm 61a and a second transfer arm 61b that move independently. The first transfer arm 61a and the second transfer arm 61b can move in the horizontal direction (both directions of the X-axis direction and the Y-axis direction) and the vertical direction, and can rotate about the vertical axis, respectively. The first transfer arm 61a and the second transfer arm 61b each hold the substrate W from below.

The first transfer arm 61a takes out the substrate W from the cassette C. On the other hand, the second transfer arm 61b stores the substrate W in the cassette C. Since the first transfer arm 61a and the second transfer arm 61b are separately provided, the extraction of the substrate W from the cassette C and the accommodation of the substrate W in the cassette C can be successively performed. Further, since the first transfer arm 61a and the second transfer arm 61b are provided separately, it is possible to prevent the movement of particles between the substrate W before grinding and the substrate W after grinding via the first transfer device 61. .. The first transfer arm 61a holds the substrate W before cleaning, while the second transfer arm 61b holds the substrate W after cleaning. When the second transfer arm 61b is arranged above the first transfer arm 61a, the substrate W after cleaning is arranged above the substrate W before cleaning. As a result, it is possible to prevent particles from falling from the substrate W before cleaning to the substrate W after cleaning.

The second transport region 70 is adjacent to the grinding device 50, the first cleaning device 30, and the second cleaning device 40 in plan view, and is located on three sides of the grinding device 50, the first cleaning device 30, and the second cleaning device 40. It is arranged so as to be surrounded. Specifically, the grinding device 50 is arranged on the X-axis direction positive side of the second transfer region 70, the first cleaning device 30 is arranged on the Y-axis direction positive side of the second transfer region 70, and the second cleaning device 40. Is arranged on the negative side in the X-axis direction of the second transport region 70.

The second transfer device 71 transfers the substrate W in the second transfer area 70. That is, the second transfer device 71 transfers the substrate W between the plurality of devices arranged next to the second transfer area 70. The second transfer device 71 includes a suction pad 71a that holds the substrate W. The suction pad 71a can move in the horizontal direction (both directions of the X-axis direction and the Y-axis direction) and the vertical direction, and can rotate about the vertical axis. The suction pad 71a sucks and holds the substrate W from above.

The detection device 31 detects the center of the substrate W before being ground by the grinding device 50. The center of the chuck 52 of the grinding device 50 and the center of the substrate W can be aligned with each other in a plan view. The detection device 31 may detect the crystal orientation of the substrate W in addition to the center of the substrate W, and specifically may detect a notch or an orientation flat representing the crystal orientation of the substrate W. In the rotating coordinate system that rotates together with the chuck 52, the crystal orientation of the substrate W can be aligned with a desired orientation.

The detection device 31 may be vertically stacked on the first cleaning device 30 in order to reduce the installation area of the substrate grinding system 10. Although the detection device 31 is arranged above the first cleaning device 30, the detection device 31 and the first cleaning device 30 may be arranged in reverse, and the detection device 31 is arranged below the first cleaning device 30. Good.

Unlike the first cleaning device 30 and the second cleaning device 40, the third cleaning device 32 cleans the substrate W before being ground by the grinding device 50. Since a clean substrate W can be placed on the chuck 52 of the grinding device 50 and foreign matter can be prevented from being caught, the grinding quality of the substrate W can be improved.

The third cleaning device 32 scrubs and cleans the substrate W, similar to the first cleaning device 30, for example. The third cleaning device 32 includes a cleaning body such as a sponge or a brush, and removes foreign matter with the cleaning body. The cleaning body only needs to scrub and wash the lower surface of the substrate W in order to prevent foreign matter from being caught when the substrate W is mounted on the chuck 52 of the grinding device 50, and is disposed below the substrate W. However, the cleaning body may be arranged on both the upper and lower sides of the substrate W, or both the upper and lower sides of the substrate W may be cleaned.

The third cleaning device 32 may be vertically stacked on the first cleaning device 30 in order to reduce the installation area of the substrate grinding system 10. Although the third cleaning device 32 is arranged above the first cleaning device 30, the arrangement of the third cleaning device 32 and the first cleaning device 30 may be reversed, and the third cleaning device 32 may be the first cleaning device 30. May be disposed below. The third cleaning device 32 is arranged between the first cleaning device 30 and the detection device 31 in FIG. 2, but their order is not particularly limited.

The control device 90 is, for example, a computer, and includes a CPU (Central Processing Unit) 91 and a storage medium 92 such as a memory. The storage medium 92 stores programs that control various processes executed in the substrate grinding system 10. The controller 90 controls the operation of the substrate grinding system 10 by causing the CPU 91 to execute the program stored in the storage medium 92.

Next, the operation of the substrate grinding system 10 will be described. The following operation is performed under the control of the control device 90.

First, the first transfer device 61 takes out the substrate W from the cassette C and transfers the taken-out substrate W to the third cleaning device 32. During this time, the substrate W is held by the first transfer arm 61a.

Next, the third cleaning device 32 cleans the substrate W before being ground by the grinding device 50. A clean substrate W can be placed on the chuck 52 of the grinding device 50, and foreign matter can be prevented from being caught. Therefore, the substrate W can be ground flat, and the deterioration of the thickness deviation of the substrate W can be suppressed. The third cleaning device 32 cleans the lower surface of the substrate W. The third cleaning device 32 may clean both upper and lower surfaces of the substrate W. After the substrate W is dried, the first transfer device 61 transfers the substrate W from the third cleaning device 32 to the detection device 31. During this time, the substrate W is held by the first transfer arm 61a.

The third cleaning device 32 may be omitted when the unground substrate W is clean or when the grinding device 50 has a mechanism for cleaning the unground substrate W. In that case, the first transfer device 61 transfers the substrate W from the cassette C to the detection device 31.

Next, the detection device 31 detects the center of the substrate W. The detection device 31 may detect the crystal orientation of the substrate W, and specifically may detect notches and the like. After that, the second transfer device 71 transfers the substrate W from the detection device 31 to the chuck 52 of the grinding device 50. During this time, the control device 90 controls the second transfer device 71 based on the detection result of the detection device 31 to align the center of the chuck 52 with the center of the substrate W. Further, the control device 90 controls the second transfer device 71 based on the detection result of the detection device 31, and aligns the crystal orientation of the substrate W to a desired orientation in the rotation coordinate system that rotates together with the chuck 52.

Next, the grinding device 50 grinds the upper surface of the substrate W. The substrate W rotates together with the table 51 and moves to the loading/unloading position A0, the primary grinding position A1, the secondary grinding position A2, the tertiary grinding position A3, and the loading/unloading position A0 in this order. During this, primary grinding, secondary grinding, and tertiary grinding are performed. Then, the second transfer device 71 transfers the substrate W from the chuck 52 of the grinding device 50 to the first cleaning device 30.

Next, the first cleaning device 30 cleans the upper surface of the substrate W to remove particles such as grinding dust. The first cleaning device 30 may clean both upper and lower surfaces of the substrate W. After drying the substrate W, the first transfer device 61 transfers the substrate W from the first cleaning device 30 to the second cleaning device 40. During this time, the substrate W may be held by the first transfer arm 61a or the second transfer arm 61b.

Next, the second cleaning device 40 etches the upper surface of the substrate W to remove grinding marks. The second cleaning device 40 may clean both upper and lower surfaces of the substrate W. After the substrate W is dried, the first transfer device 61 transfers the substrate W from the second cleaning device 40 to the cassette C and stores the substrate W in the cassette C. During this time, the substrate W is held by the second transfer arm 61b. Then, the process of this time is completed.

By the way, as shown in FIG. 1, in plan view, between the mounting table 20 and the grinding device 50, the first cleaning device 30, the second cleaning device 40, the first transfer area 60, and the second transfer area 70 are provided. Are arranged in a matrix. In a plan view, a line connecting the first cleaning device 30 and the second cleaning device 40 and a line connecting the first transfer area 60 and the second transfer area 70 intersect.

According to the present embodiment, unlike the present embodiment, the dimension of the first transport region 60 in the X-axis direction is shortened compared to the case where the first transport region 60 is extended to the partition 81 on the X-axis direction positive side. The first cleaning device 30 is arranged in the empty area due to the shortening. Therefore, it is possible to suppress an increase in the installation area of the substrate grinding system 10 due to an increase in the number of cleaning devices installed.

Further, according to the present embodiment, the mounting table 20 and the first transfer area 60 are adjacent to each other. Therefore, unlike the present embodiment, between the mounting table 20 and the first transfer area 60, a transition device for temporarily storing the substrate W and a third device sandwiched between the transition device and the mounting table 20 in plan view. The installation area of the substrate grinding system 10 can be reduced as compared with the case where the transport region and the third transport device that transports the substrate W in the third transport region are provided.

By the way, as shown in FIG. 1, the first cleaning device 30 is arranged next to both the grinding device 50 and the second transfer region 70, and the second transfer region 70 is arranged next to the grinding device 50. The substrate W is ground by the grinding device 50 and then transferred from the grinding device 50 to the first cleaning device 30 via the second transfer area 70. The first cleaning device 30 and the grinding device 50 are separated by the partition walls 81 and 82.

The partition wall 81 is arranged between the first cleaning device 30 and the grinding device 50 which are adjacent to each other. On the other hand, the partition wall 82 is arranged between the first cleaning device 30 and the second transfer area 70 which are adjacent to each other. The partition walls 81 and 82 prevent particles such as grinding dust generated in the grinding device 50 from flowing out of the grinding device 50 to the first cleaning device 30.

A transfer port 82a through which the substrate W passes is formed in the partition wall 82. The transfer port 82a is provided with a shutter 88 that opens and closes the transfer port 82a. The shutter 88 basically closes the transfer port 82a and opens the transfer port 82a when the substrate W passes through. It is possible to suppress the outflow of particles from the grinding device 50 to the first cleaning device 30 via the transfer port 82a, as compared with the case where the transfer port 82a is always open.

The partition wall 83 is arranged between the second cleaning device 40 and the second transfer region 70 which are adjacent to each other, separates the second cleaning device 40 and the second transfer region 70 from each other, and by extension, the second cleaning device 40 and the grinding device 50. Isolate. The partition wall 83 suppresses particles such as grinding dust generated in the grinding device 50 from flowing from the grinding device 50 to the second cleaning device 40.

An area having a high degree of cleanliness is formed on the side opposite to the grinding device 50 (negative side in the X-axis direction) with the partition walls 81, 82, 83 as a reference. A plurality of cleaning devices, for example, the first cleaning device 30, the second cleaning device 40, and the third cleaning device 32 can be mounted in an area of high cleanliness. Therefore, the number of cleaning devices mounted is large, and the cleaning performance can be improved. Further, since the cleaning device is mounted in the area of high cleanliness, it is possible to prevent the substrate W after cleaning from being contaminated.

Next, a substrate grinding system 10 according to a modified example will be described with reference to FIG. Hereinafter, differences between the present modification and the above embodiment will be mainly described. In this modification, a partition 84 is provided instead of the partition 82 of the above embodiment. The partition wall 84 is arranged between the second transfer region 70 and the grinding device 50 which are adjacent to each other.

The partition walls 81 and 84 suppress particles such as grinding dust generated in the grinding device 50 from flowing out from the grinding device 50 to the first cleaning device 30. In addition, the partition walls 81 and 84 suppress particles such as grinding dust generated in the grinding device 50 from flowing out from the grinding device 50 to the second cleaning device 40.

A transfer port 84 a through which the substrate W passes is formed in the partition wall 84. The transfer port 84a is provided with a shutter 89 that opens and closes the transfer port 84a. The shutter 89 basically closes the transfer opening 84a and opens the transfer opening 84a when the substrate W passes through. It is possible to suppress the outflow of particles from the grinding device 50 to the first cleaning device 30 via the transfer port 84a.

An area of high cleanliness is formed on the side opposite to the grinding device 50 (negative side in the X-axis direction) with the partition walls 81 and 84 as a reference. A plurality of cleaning devices, for example, the first cleaning device 30, the second cleaning device 40, and the third cleaning device 32 can be mounted in an area of high cleanliness. Therefore, the number of cleaning devices mounted is large, and the cleaning performance can be improved. Further, since the cleaning device is mounted in the area of high cleanliness, it is possible to prevent the substrate W after cleaning from being contaminated.

In this modification, the partition 84 is provided instead of the partition 82 of the above embodiment, but both the partition 84 of this modification and the partition 82 of the above embodiment may be provided.

Although the substrate grinding system according to the present disclosure has been described above, the present disclosure is not limited to the above embodiment and the like. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope described in the utility model registration claim. Naturally, they also belong to the technical scope of the present disclosure.

10 Substrate Grinding System 20 Mounting Table 30 First Cleaning Device 40 Second Cleaning Device 50 Grinding Device 60 First Transfer Area 61 First Transfer Device 70 Second Transfer Area 71 Second Transfer Device

Claims (9)

A mounting table on which a cassette for housing the substrate is mounted,
A first cleaning device for cleaning the substrate;
A second cleaning device for cleaning the substrate;
A grinding device for grinding the substrate,
In plan view, it is arranged next to the mounting table, the first cleaning device, and the second cleaning device so as to be surrounded on three sides by the mounting table, the first cleaning device, and the second cleaning device. A first transport area,
A first transfer device that transfers the substrate in the first transfer region;
The grinding device, the first cleaning device, and the second cleaning device are arranged next to the grinding device, the first cleaning device, and the second cleaning device so as to be surrounded on three sides in a plan view. A second transport area,
A second transfer device that transfers the substrate in the second transfer region,
In a plan view, a line connecting the first cleaning device and the second cleaning device and a line connecting the first transfer region and the second transfer region intersect with each other,
A substrate grinding system in which the first cleaning device and the grinding device are separated by a partition. The substrate grinding system according to claim 1, wherein the second cleaning device and the second transfer region are separated by a partition. The first transfer device has a first transfer arm and a second transfer arm that move independently. The first transfer arm takes out the substrate from the cassette, and the second transfer arm moves the substrate to the cassette. The substrate grinding system according to claim 1 or 2, wherein the substrate grinding system is housed in. A transfer port through which the substrate passes is formed in a partition wall disposed between the first cleaning device and the second transfer region,
The substrate grinding system according to claim 1, wherein the transfer port is provided with a shutter that opens and closes the transfer port. A detection device for detecting the center of the substrate before being ground by the grinding device;
The substrate grinding system according to claim 1, wherein the detection device and the first cleaning device are stacked in a vertical direction. A third cleaning device stacked on the first cleaning device;
The first cleaning device cleans the substrate after being ground by the grinding device before being transferred to the second cleaning device by the first transfer device,
The substrate grinding system according to claim 1, wherein the third cleaning device cleans the substrate before being ground by the grinding device. 7. The substrate grinding system according to claim 1, wherein the second cleaning device etches the substrate after being ground by the grinding device with a chemical solution. The second transfer device sucks and holds the substrate from above,
The substrate grinding system according to claim 1, wherein the first transfer device holds the substrate from below. A transfer port through which the substrate passes is formed in a partition wall disposed between the grinding device and the second transfer region,
The substrate grinding system according to claim 1, wherein the transfer port is provided with a shutter that opens and closes the transfer port.

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