JP7273568B2 - processing equipment - Google Patents

Description

The present invention relates to a processing apparatus capable of processing workpieces of at least two sizes.

A wafer in which a plurality of devices such as ICs and LSIs are partitioned by dividing lines and formed on the front surface is ground by a grinding device on the back surface to have a predetermined thickness. It is divided into chips, and each of the divided device chips is used in electrical equipment such as mobile phones and personal computers.

The grinding apparatus includes a chuck table holding a workpiece, grinding means for grinding the workpiece held by the chuck table, a cassette mounting section on which a cassette containing a plurality of workpieces is mounted, An unloading means for unloading a workpiece from a cassette placed on a cassette mounting portion, a temporary placement means for temporarily placing the workpiece unloaded by the unloading means, and a workpiece temporarily placed on the temporary placement means and a conveying means for conveying an object to a chuck table, so that the wafer can be processed to have a desired thickness.

Wafers are available in different sizes such as 5 inches, 6 inches, and 8 inches in diameter, and the size is appropriately selected depending on the type and size of the device.

The grinding apparatus is configured so that the components such as the chuck table, unloading means, and conveying means can be exchanged according to the size of the wafer so as to correspond to each size of the wafer (see, for example, Patent Document 1).

JP-A-2005-153090

However, there are cases where not all components to be replaced can be replaced according to the size of the wafer due to a mistake. There are problems such as missing or damaging the wafer. The above-described problems can occur not only in grinding machines but also in various processing machines including dicing machines, laser processing machines, and the like, in which components can be exchanged according to the size of the wafer.

The object of the present invention, which has been devised in view of the above facts, is to solve the problem that the workpiece cannot be unloaded from the cassette, the workpiece cannot be transported in the processing apparatus, or the workpiece can be damaged. It is to provide a processing device that does not have

To solve the above problems, the present invention provides the following processing apparatus. That is, a chuck table capable of selectively holding workpieces of at least two different sizes, machining means for machining the workpieces held by the chuck table, and a cassette accommodating a plurality of workpieces are mounted. a cassette mounting portion on which the workpiece is placed, a carrying-out means for carrying out the workpiece from the cassette placed on the cassette placing portion, and a temporary placement means for temporarily placing the workpiece carried out by the carrying-out means. , a conveying means for conveying the workpiece temporarily placed on the temporary placing means to the chuck table, the processing apparatus comprising, as components, a camera for imaging the plurality of components; and the workpiece. and a control means comprising at least a size selection unit that selects the size of the workpiece, and an image storage unit that stores images of a plurality of constituent elements corresponding to the size of the workpiece selected by the size selection unit. , the control means compares the image of the plurality of components captured by the camera with the image of the plurality of components stored in the image storage unit, and the plurality of components captured by the camera is the size The processing apparatus includes a determination unit that determines whether or not there are a plurality of constituent elements according to the size of the workpiece selected by the selection unit.

Preferably, the judging unit points out a component that does not correspond to the size of the workpiece and instructs replacement. The processing means is preferably grinding means for grinding the workpiece held on the chuck table with a grinding wheel or polishing means for polishing the workpiece held on the chuck table with a polishing pad.

A processing apparatus provided by the present invention comprises a chuck table capable of selectively holding workpieces of at least two different sizes, processing means for processing the workpieces held by the chuck table, and a plurality of workpieces. A cassette mounting portion on which a cassette containing an object is mounted, an unloading means for unloading a workpiece from the cassette mounted on the cassette mounting portion, and a temporary work piece unloaded by the unloading means. a camera for imaging a plurality of constituent elements; a control means comprising at least a size selection unit for selecting a size of an object, and an image storage unit for storing images of a plurality of constituent elements according to the size of the workpiece selected by the size selection unit; wherein the control means compares images of the plurality of constituent elements captured by the camera with images of the plurality of constituent elements stored in the image storage unit, and the plurality of constituent elements captured by the camera is compared with the Since the determination unit is provided for determining whether or not there are a plurality of constituent elements according to the size of the workpiece selected by the size selection unit, it is possible to carry out the workpiece from the cassette or to process the workpiece in the processing apparatus. Problems such as not being able to transport objects or damaging the workpieces do not occur.

1 is a perspective view of a processing apparatus constructed in accordance with the present invention; FIG. FIG. 2 is a perspective view of the chuck table shown in FIG. 1; FIG. 2 is a schematic diagram of images of constituent elements corresponding to each size of a workpiece, stored in the image storage unit shown in FIG. 1;

A preferred embodiment of a processing apparatus constructed according to the present invention will be described below with reference to the drawings.

FIG. 1 shows a grinding apparatus 2 capable of grinding workpieces of at least two sizes as an example of a processing apparatus constructed according to the present invention. Other examples of the processing apparatus of the present invention include, for example, a dicing apparatus having a rotatable cutting blade for cutting a workpiece, and a laser processing apparatus for performing laser processing on a workpiece. be done.

The grinding apparatus 2 comprises a chuck table 4 capable of selectively holding workpieces of at least two sizes, a machining means 6 for machining the workpieces held on the chuck table 4, and a plurality of workpieces. A cassette mounting portion 10 on which a cassette 8 to be accommodated is mounted, a carrying-out means 12 for carrying out a workpiece from the cassette 8 placed on the cassette placing portion 10, and a workpiece carried out by the carrying-out means 12. Temporary placement means 14 on which the workpiece is temporarily placed, and transport means 16 for transporting the workpiece temporarily placed on the temporary placement means 14 to the chuck table 4 are provided at least as constituent elements. It should be noted that the cassette 8 is also included in the component of the grinding device 2 in the illustrated embodiment.

As shown in FIG. 1, the grinding device 2 has a rectangular parallelepiped base 18, and a circular turntable 20 is rotatably provided on the upper surface of the base 18. As shown in FIG. The turntable 20 is rotated counterclockwise when viewed from above by a turntable motor (not shown) incorporated in the base 18 . Three chuck tables 4 are rotatably mounted on the peripheral edge of the upper surface of the turntable 20 at equal intervals in the circumferential direction. It is rotated around an axis extending vertically by a motor (not shown). In FIG. 1, each chuck table 4 is sequentially positioned at an attachment/detachment position indicated by symbol A, a rough grinding position indicated by symbol B, and a finish grinding position indicated by symbol C by rotating the turntable 20. ing.

Referring to FIG. 2, at the upper end portion of the chuck table 4, a porous circular first suction chuck 22 and a porous ring-shaped porous chuck 22 concentrically arranged with the first suction chuck 22 are provided. A second suction chuck 24 is provided. Both the first suction chuck 22 and the second suction chuck 24 are connected to suction means (not shown), and the flow path connecting the second suction chuck 24 and the suction means is provided with a valve (shown in the figure). not shown) are provided. Also, in the illustrated embodiment, the diameter of the first suction chuck 22 corresponds to the diameter of the smaller workpiece (for example, a wafer with a diameter of 6 inches) of the two sizes of workpieces, The outer diameter of the suction chuck 24 corresponds to the diameter of the larger workpiece (for example, a wafer with a diameter of 8 inches) among the two sizes of workpieces.

In the chuck table 4, a small workpiece is sucked by the first suction chuck 22 by generating a suction force on the upper surface of the first suction chuck 22 with the valve closed. By generating a suction force on the upper surface of the first suction chuck 22 and the second suction chuck 24 with the suction means holding and opening the valve, the first suction chuck 22 and the second suction chuck 24 are generated. The chuck 24 is adapted to suck and hold a large-sized workpiece.

In this way, the chuck table 4 of the illustrated embodiment can selectively suck and hold workpieces of two different sizes. The chuck table 4 has a plurality of annular suction chucks arranged concentrically with the first suction chuck 22 at the upper end portion, so that workpieces of three or more sizes can be selectively suctioned and held. It can be like this.

Referring to FIG. 1, the processing means 6 includes a mounting wall 26 extending upward from the end of the base 18 (back side end in FIG. 1), and mounted on one side of the mounting wall 26 so as to be vertically movable. a first elevating plate 28 and a second elevating plate 30, a first elevating means 32 for elevating the first elevating plate 28, and a second elevating means 34 for elevating the second elevating plate 30; including.

The first elevating means 32 has a ball screw 36 extending vertically along one side of the mounting wall 26 and a motor 38 for rotating the ball screw 36 . A nut portion (not shown) of the ball screw 36 is connected to the first elevating plate 28 . In the first elevating means 32, the rotary motion of the motor 38 is converted into linear motion by the ball screw 36 and transmitted to the first elevating plate 28. The first elevating plate 28 is moved up and down along the line. The second lifting means 34 may have the same structure as the first lifting means 32, so the same reference numerals as the structure of the first lifting means 32 are given, and the description thereof is omitted.

The processing means 6 also includes a rough grinding unit 40 attached to one side of the first elevator plate 28 and a finish grinding unit 42 attached to one side of the second elevator plate 30 . The rough grinding unit 40 includes a support wall 44 protruding from one side of the first elevating plate 28, a spindle 46 supported by the support wall 44 so as to be rotatable about an axis extending in the vertical direction, and a and a motor 48 mounted thereon for rotating a spindle 46 . A disk-shaped wheel mount 50 is fixed to the lower end of the spindle 46 , and a grinding wheel 52 for rough grinding is fixed to the lower surface of the wheel mount 50 . Regarding the finish grinding unit 42, a grinding wheel 54 for finish grinding formed from abrasive grains having a grain size smaller than that of the grinding wheel 52 for rough grinding is fixed to the lower surface of the wheel mount 50. , and may have the same configuration as the rough grinding unit 40, the same reference numerals as the configuration of the rough grinding unit 40 are given, and the description thereof is omitted.

In the processing means 6, the workpiece held on the chuck table 4 positioned at the rough grinding position B is subjected to rough grinding by the grinding wheel 52 of the rough grinding unit 40, and the workpiece is moved to the finish grinding position C. The workpiece held on the positioned chuck table 4 is finish-ground by the grinding wheel 54 of the finish-grinding unit 42 .

As described above, the processing means 6 of the illustrated embodiment is configured as a grinding means for grinding the workpiece held on the chuck table 4 with the grinding wheels 52 and 54 . The processing means 6 may be composed of polishing means for polishing the workpiece fixed and held on the chuck table 4 with a polishing pad. Alternatively, the grinding wheel may be fixed to one wheel mount 50, and the polishing pad may be fixed to the other wheel mount 50, so that the processing means 6 is composed of both the grinding means and the polishing means.

Further, on the upper surface of the base 18, adjacent to the attachment/detachment position A, a washing water nozzle 56 for spraying washing water is provided. After rough grinding and finish grinding, washing water is sprayed from the washing water nozzle 56 toward the upper surface (grinding surface) of the workpiece positioned at the attachment/detachment position A. is cleaned.

The cassette mounting portion 10 of the illustrated embodiment mounts a first cassette 8a containing a plurality of disk-shaped workpieces (for example, wafers W having a diameter of 6 inches or 8 inches) before being ground. and a second cassette mounting portion 10b on which a second cassette 8b containing a plurality of workpieces after grinding is mounted. As shown in FIG. 1, the first cassette mounting portion 10a and the second cassette mounting portion 10b are provided on the upper surface end of the base 18 (front side end in FIG. 1) with a space therebetween. there is

Further, each of the first cassette mounting portion 10a and the second cassette mounting portion 10b has a space in which at least two sizes of cassettes 8 can be selectively mounted. As the cassettes 8 of at least two sizes, for example, as shown in FIG. be.

As shown in FIG. 1, the carry-out means 12 is arranged between the first cassette mounting portion 10a and the second cassette mounting portion 10b. The carry-out means 12 includes a multi-joint arm 58 supported on the base 18, an electric or air-driven actuator (not shown) for operating the multi-joint arm 58, and a distal end of the multi-joint arm 58. and a holding piece 60 attached. A holding piece 60 having a plurality of suction holes (not shown) formed on one side thereof is connected to a suction means (not shown).

In the carry-out means 12 , the suction means generates a suction force on one side of the holding piece 60 to suck and hold the workpiece on one side of the holding piece 60 , and the multi-joint arm 58 is operated by the actuator. Then, the workpiece before grinding sucked and held on one side of the holding piece 60 is transported from the first cassette 8a to the temporary placement means 14, and the workpiece after grinding sucked and held on one side of the holding piece 60. Objects are carried into the second cassette 8b from a washing means 74, which will be described later.

In the carry-out means 12, at least two sizes of holding pieces 60 are selectively attached to the tip of the multi-joint arm 58, so that at least two sizes of workpieces can be sucked and held. ing. As holding pieces 60 of at least two sizes, for example, as shown in FIG. A C-shaped 8-inch holding piece 60'' for suction holding.

As shown in FIG. 1, the temporary placement means 14 is arranged adjacent to the first cassette placement portion 10a. The temporary placement means 14 includes a substrate 62 mounted on the upper surface of the base 18, and a circular temporary placement table 64 arranged in the central portion of the upper surface of the substrate 62 and smaller in diameter than the workpiece. A plurality of elongated holes 62 a extending along the radial direction of the temporary placement table 64 are formed in the substrate 62 at intervals around the temporary placement table 64 . A plurality of pins 66 extending upward through each slot 62a are attached to the base 18 so as to be movable along the slots 62a. A pin moving means (not shown) for moving the pin is mounted.

In the temporary placement means 14, the plurality of pins 66 are synchronously moved by the pin moving means, and the plurality of pins 66 are brought into contact with the periphery of the workpiece temporarily placed on the temporary placement table 64, thereby The center of the workpiece is aligned with the center of the temporary placement table 64. - 特許庁

Further, in the temporary placing means 14, by changing the initial position of the pin 66, it is possible to center the workpieces of at least two different sizes. For example, as shown in FIG. 3, when centering a 6-inch diameter wafer, the initial position of the pin 66 is set in the middle of the slot 62a, and when centering a 8-inch diameter wafer, The initial position of the pin 66 is set at the end of the elongated hole 62a (the radially outer end of the temporary placement table 64). By setting the initial position of the pin 66 on the circumference slightly larger than the diameter of the workpiece to be centered in this way, the movement of the pin 66 until the pin 66 hits the peripheral edge of the workpiece is reduced. The distance is shortened, and the process time can be shortened.

As shown in FIG. 1, the transport means 16 is arranged between the temporary placement means 14 and the turntable 20 . The conveying means 16 includes a rotary shaft 68 mounted on the base 18 so as to be rotatable and vertically movable and extending upward from the upper surface of the base 18; an arm 70 extending substantially horizontally from the upper end of the rotary shaft 68; A disk-shaped attracting piece 72 detachably attached to the lower surface, a rotating shaft motor (not shown) for rotating the rotating shaft 68, and an elevating means such as an electric cylinder for raising and lowering the rotating shaft 68 (see figure). not shown). A suction piece 72 having a plurality of suction holes (not shown) formed on its lower surface is connected to suction means (not shown).

In the conveying means 16, the suction means generates a suction force on the bottom surface of the suction piece 72, thereby sucking and holding the workpiece temporarily placed on the temporary placement table 64 on the bottom surface of the suction piece 72. By raising and lowering and rotating the rotating shaft 68 by the lifting means and the rotating shaft motor, the workpiece sucked and held by the lower surface of the attracting piece 72 is transported from the temporary placing means 14 to the chuck table 4 positioned at the attaching/detaching position A. It is designed to

In addition, in the conveying means 16, suction pieces 72 of at least two sizes are selectively attached to the bottom surface of the tip of the arm 70, so that workpieces of at least two sizes can be sucked and held. there is As the chucking pieces 72 of at least two sizes, for example, as shown in FIG. 8-inch chucking piece 72'', and the diameter of the 8-inch chucking piece 72'' is larger than the diameter of the 6-inch chucking piece 72'.

In the illustrated embodiment, as shown in FIG. 1, the grinding apparatus 2 includes a cleaning means 74 for cleaning the ground workpiece and a second cleaning means 74 for conveying the ground workpiece from the chuck table 4 to the cleaning means 74. A conveying means 76 is further provided as a component.

The cleaning means 74 arranged adjacent to the second cassette mounting portion 10b includes a circular spinner table 78 rotatably mounted on the base 18, and a spinner table motor for rotating the spinner table 78 ( (not shown), a cleaning water nozzle (not shown) for spraying cleaning water onto the workpiece held on the spinner table 78, and dry air to the workpiece held on the spinner table 78. and an air nozzle (not shown) for jetting. A porous circular suction chuck 80 connected to suction means (not shown) is arranged on the upper end portion of the spinner table 78 .

In the cleaning means 74, the suction means generates a suction force on the upper surface of the suction chuck 80, thereby sucking and holding the workpiece placed on the upper surface of the spinner table 78, and sucking and holding the workpiece. While the spinner table 78 is being rotated, washing water is sprayed from the washing water nozzle to wash the workpiece, and dry air is sprayed from the air nozzle to dry the workpiece.

The diameter of the spinner table 78 is formed smaller than the diameter of the smallest workpiece among the workpieces of at least two sizes. An object can be washed and dried by holding it by suction on the spinner table 78 .

A second conveying means 76 arranged between the cleaning means 74 and the turntable 20 includes a rotating shaft 82 mounted on the base 18 so as to be rotatable and vertically movable and extending upward from the upper surface of the base 18, and a rotating shaft 82. An arm 84 extending substantially horizontally from the upper end of the shaft 82, a circular plate 86 attached to the lower surface of the tip of the arm 84, a rotating shaft motor (not shown) for rotating the rotating shaft 82, and a rotating shaft. and a lifting means (not shown) such as an electric cylinder for lifting and lowering 82 . A porous suction pad (not shown) connected to suction means (not shown) is arranged in the central portion of the lower surface of the plate 86 .

In the second conveying means 76, the suction means generates a suction force on the lower surface of the suction pad, so that the ground workpiece held on the chuck table 4 positioned at the attachment/detachment position A is transferred to a plate. The workpiece sucked and held on the lower surface of the plate 86 is moved from the chuck table 4 to the spinner of the cleaning means 74 by sucking and holding the lower surface of the plate 86 and moving the rotating shaft 82 up and down and rotating it with the lifting means and the rotating shaft motor. It is adapted to be transported to the table 78 .

In addition, the diameter of the plate 86 is formed larger than the diameter of the largest workpiece among the workpieces of at least two sizes. The workpiece can be held by suction with the plate 86 .

As shown in FIG. 1 , the grinding machine 2 further comprises a camera 88 for imaging the plurality of components described above and a control means 90 electrically connected to the camera 88 . The camera 88 is arranged on the upper part of the grinding machine 2 and captures images of each component of the grinding machine 2 . Also, the data of the image captured by the camera 88 is sent to the control means 90 . Although a single camera 88 is shown in FIG. 1 , the grinding machine 2 may be equipped with a plurality of cameras 88 .

The control means 90 is composed of a computer, and includes a central processing unit (CPU) that performs arithmetic processing according to a control program, a read-only memory (ROM) that stores control programs and the like, and a readable and writable random memory that stores arithmetic results and the like. and access memory (RAM) (neither shown). The control means 90 is electrically connected to an operation panel 92 and a monitor 94 both of which are arranged at the top end of the base 18 (front end in FIG. 1). The operation panel 92 can be composed of a keyboard and a touch panel. A touch panel as the operation panel 92 may be displayed on the monitor 94 .

A read-only memory of the control means 90 stores, as a control program, a size selection section 96 for selecting the size of the workpiece, and components corresponding to the size of the workpiece selected by the size selection section 96. An image storage unit 98 is set to store the image of .

The size selection unit 96 stores in advance at least two sizes of workpieces (for example, 6 inches in diameter and 8 inches in diameter) that can be ground by the grinding device 2 . The size selection unit 96 selects the size of the workpiece from at least two types of sizes of the workpiece stored in advance based on the operation of the operation panel 92 by the operator. there is

The image storage unit 98 preliminarily stores images of components corresponding to the sizes of at least two types of workpieces that can be ground by the grinding device 2 . For example, as shown in FIG. 3, an image of the components corresponding to a 6-inch diameter wafer is a 6-inch cassette 8', a 6-inch holding piece 60' of the carrying-out means 12, and a slightly larger than 6-inch diameter wafer. Images of the temporary placement means 14 with the initial positions of the pins 66 set on the circumference and the 6-inch attracting piece 72' of the conveying means 16 are stored in the image storage section 98, respectively.

In the example shown in FIG. 3, as an image of the components corresponding to an 8-inch diameter wafer, an 8-inch cassette 8'', an 8-inch holding piece 60'' of the unloading means 12, and a slightly larger than 8-inch diameter wafer. Images of the temporary placement means 14 with the initial positions of the pins 66 set on the circumference and the images of the 8-inch attracting pieces 72'' of the conveying means 16 are stored in the image storage section 98. As shown in FIG. Each image may be captured by the camera 88 of the grinding apparatus 2 or may be captured by a camera other than the camera 88 .

Further, in the read-only memory of the control means 90, the image of the constituent elements captured by the camera 88 when the grinding process is started in the grinding apparatus 2 is compared with the image of the constituent elements stored in the image storage unit 98. A determination unit 100 (see FIG. 1) for determining whether or not the component imaged by the camera 88 corresponds to the size of the workpiece selected by the size selection unit 96 is stored as a control program. ing.

When grinding wafers as workpieces using the grinding apparatus 2 as described above, first, the first cassette 8a containing a plurality of wafers is placed on the first cassette placing portion 10a, and the grinding is performed. An empty second cassette 8b containing a plurality of processed wafers is placed on the second cassette placing portion 10b.

Next, by operating the operation panel 92, the size of the workpiece to be ground is input, and an operation start instruction for the grinding device 2 is input. Here, it is assumed that a diameter of 6 inches is input as the size of the workpiece. Then, the size selection section 96 of the control means 90 selects a size of 6 inches in diameter as the size of the workpiece from among the sizes of the plurality of workpieces that can be ground by the grinding device 2 . Also, the camera 88 captures an image of the constituent elements attached to the grinding apparatus 2 . Components captured by the camera 88 include, for example, the first and second cassettes 8a and 8b, the holding piece 60 of the carry-out means 12, the temporary placement means 14, and the suction piece 72 of the transport means 16. be done.

Then, the determination unit 100 of the control unit 90 compares the image of the component imaged by the camera 88 immediately before with the image of the component stored in the image storage unit 98 in advance, and It is determined whether or not the selected component corresponds to the size of the workpiece selected by the size selection unit 96 (diameter of 6 inches). In the determination unit 100, for example, images of the first and second cassettes 8a and 8b, the holding pieces 60 of the carry-out means 12, the temporary placement means 14, and the suction pieces 72 of the transport means 16 (immediately before, the images are captured by the camera 88). image), a 6-inch cassette 8', a 6-inch holding piece 60' of the carrying-out means 12, a temporary placement means 14 having pins 66 set at initial positions on a circumference slightly larger than 6 inches in diameter, and a carrying Each image of the 6-inch suction piece 72' of the means 16 (an image stored in advance in the image storage unit 98) is compared.

Then, as a result of comparing both images, when the determination unit 100 determines that the component imaged by the camera 88 immediately before is a component corresponding to the size of the workpiece selected by the size selection unit 96, is a series of processes in which a plurality of wafers housed in the first cassette 8a are sequentially unloaded, and after the wafers are ground, the ground wafers are loaded into the second cassette 8b. is started.

Specifically, a temporary placement step of carrying out the wafers from the first cassette 8a by the carry-out means 12 and temporarily placing them on the temporary placement means 14, and transferring the wafers temporarily placed on the temporary placement means 14 to the loading/unloading positions by the transport means 16. A, a first transfer step of transferring to the chuck table 4; a grinding step of performing rough grinding and finish grinding on the upper surface of the wafer held on the chuck table 4 by the processing means 6; A washing water injection step of injecting washing water from the washing water nozzle 56, a second conveying step of conveying the ground wafer from the chuck table 4 to the washing means 74 by the second conveying means 76, and a ground wafer. A series of steps including a cleaning/drying step of cleaning and drying by the cleaning means 74 and a cassette carrying-in step of carrying out the cleaned wafers from the cleaning means 74 by the carrying-out means 12 and carrying them into the second cassette 8b are carried out in sequence. be implemented.

Note that, as a result of comparing both images, when the determination unit 100 determines that the component imaged by the camera 88 immediately before is a component corresponding to the size of the workpiece selected by the size selection unit 96, may be displayed on the monitor 94 to that effect.

On the other hand, as a result of comparing both images, it is determined that one or more constituent elements among the constituent elements imaged by the camera 88 immediately before are not constituent elements according to the size of the workpiece selected by the size selection unit 96. If the unit 100 determines, the above series of steps are not started. Further, in such a case, the determination unit 100 indicates the component that does not correspond to the size of the workpiece by displaying the component that does not correspond to the size of the workpiece on the monitor 94 or the like. You may make it instruct|indicate exchange with respect to.

As described above, in the grinding apparatus 2 of the illustrated embodiment, the determination unit 100 determines that the component imaged by the camera 88 is not a component corresponding to the size of the workpiece selected by the size selection unit 96. If it is determined, the series of steps for grinding the workpiece is not started, so the workpiece cannot be unloaded from the first cassette 8a or transported within the grinding device 2. Problems such as damaging the workpiece do not occur.

2: Grinding device (processing device)
4: Chuck table 6: Processing means 8: Cassette 8a: First cassette 8b: Second cassette 8': 6-inch cassette 8'': 8-inch cassette 10: Cassette mounting portion 10a: First cassette mounting Placement portion 10b: Second cassette placement portion 12: Unloading Means 14: Temporary Placement Means 16: Transport Means 60: Holding Pieces of Carrying Out Means 60′: 6-inch Holding Piece 60″: 8-inch Holding Piece 72: Transfer Suction piece of means 72′: Suction piece for 6 inches 72″: Suction piece for 8 inches 88: Camera 90: Control means 96: Size selection section 98: Image storage section 100: Judgment section

Claims (3)

A chuck table capable of selectively holding workpieces of at least two sizes, machining means for machining the workpieces held by the chuck table, and a cassette accommodating a plurality of workpieces are mounted. a cassette mounting portion, a carrying-out means for carrying out the workpiece from the cassette placed on the cassette placing portion, a temporary placement means for temporarily placing the workpiece carried out by the carrying-out means, and the A processing apparatus comprising, as a component, at least a conveying means for conveying a workpiece temporarily placed on the temporary placing means to the chuck table,
a camera that images a plurality of components;
a control means comprising at least a size selection unit for selecting a size of a workpiece, and an image storage unit for storing images of a plurality of constituent elements corresponding to the size of the workpiece selected by the size selection unit; , and
The control means compares the images of the plurality of constituent elements captured by the camera with the images of the plurality of constituent elements stored in the image storage unit, and the plurality of constituent elements captured by the camera is compared with the size selection. A processing apparatus comprising a determination unit that determines whether or not there are a plurality of constituent elements according to the size of the workpiece selected by the unit. 2. The processing apparatus according to claim 1, wherein the determination unit points out a component that does not correspond to the size of the workpiece and instructs replacement. 2. The processing according to claim 1, wherein the processing means is grinding means for grinding the workpiece held on the chuck table with a grinding wheel or polishing means for polishing the workpiece held on the chuck table with a polishing pad. Device.

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