TW202303718A - Processing device and method for producing processed product - Google Patents

Abstract

The present invention simplifies the device configuration, reduces the footprint, and miniaturizes the storage space of the singulated object to be processed, and includes: processing tables for holding the sealed substrate; a first holding mechanism holding the sealed substrate in order to transport the sealed substrate to the processing table; a processing mechanism cutting and singulating the sealed substrate that is held on the processing table; a storage box in which the sealed substrate singulated by the processing mechanism is dropped and housed; a second holding mechanism holding the product in order to transport the product from the processing tables to the storage box; a moving mechanism for transporting having a common transfer shaft that extends along an arrangement direction of the processing table and the storage box for moving the first holding mechanism and the second holding mechanism; and a moving mechanism for processing moving the processing mechanism respectively on a horizontal plane in a X direction along the transfer shaft and in a Y direction orthogonal to the X direction.

Description

Processing device, and method for manufacturing processed product

The present invention relates to a processing device and a method for manufacturing a processed product.

Conventionally, a cutting device has been used when cutting and singulating electronic components such as resin-sealed sealed substrates, but a dividing device such as that shown in Patent Document 1 is known, for example.

In this dividing device, the workpiece carrying member moves in the Y-axis direction to transport the package substrate to the holding table, and cuts the package substrate with the cutting blade while moving the holding table in the processing feed direction (X-axis direction). And divided into chip size package (Chip Scale Package, CSP). During this cutting, cutting water is supplied from the cutting water supply nozzle to the cutting portion by the cutting blade. In addition, in this dividing device, in order to reduce the size compared with the structure in which a plurality of chip size packages (CSPs) are arranged and accommodated on a tray, a plurality of chip size packages (CSPs) are dropped into a chip storage container. Bulk containment parts for bulk containment. [Prior art literature] [Patent Document]

[Patent Document 1] Japanese Patent No. 5947010

However, in the above dividing device, not only the package substrate is conveyed in the Y-axis direction, but also the holding table is moved in the processing feed (X-axis direction) in order to cut the package substrate, so the footprint of the device becomes smaller. big.

In addition, in order to protect the moving parts in the X-axis direction from machining chips and cutting water generated by cutting, a protection member is required for the moving parts in the X-axis direction. As the protection member, a bellows member for protecting the X-axis direction moving member, a cover member for protecting the bellows member, and the like are used. As a result, the device structure becomes complicated.

[Problem to be Solved by the Invention]

Therefore, the present invention is made to solve the above-mentioned problems, and its main subject is to simplify the structure of the device, reduce the occupied area, and reduce the size of the storage space for the singulated objects to be processed. [Means to solve the problem]

That is, the processing device of the present invention is characterized in that it includes: a processing table that holds the object to be processed; a first holding mechanism that holds the object to be processed in order to transfer the object to the processing table; and a processing mechanism that holds the object to be processed. The object to be processed held on the processing table is cut and separated into pieces; the storage box drops and accommodates the object to be processed which has been separated into pieces by the processing mechanism; The object to be processed that has been separated into pieces is transferred from the processing table to the storage box to hold the object to be processed that has been separated into pieces; and a common transmission shaft extending in the arrangement direction of the storage boxes and used to move the first holding mechanism and the second holding mechanism; and a moving mechanism for processing, so that the processing mechanism can move along the The transmission shaft moves in a first direction and a second direction orthogonal to the first direction, respectively. [Effect of the invention]

According to the present invention constituted in this way, the structure of the device can be simplified, the occupied area can be reduced, and the storage space for the singulated objects can be reduced in size.

Next, the present invention will be described in more detail with examples. However, the present invention is not limited by the following description.

As described above, the processing apparatus of the present invention is characterized in that it includes: a processing table that holds the object to be processed; a first holding mechanism that holds the object to be processed in order to transfer the object to the processing table; a mechanism for cutting and separating the object to be processed held by the processing table; a storage box for dropping and storing the object to be processed which is separated by the processing mechanism; and a second holding mechanism , in order to transfer the singulated object to be processed from the processing table to the storage box to hold the singulated object to be processed; the moving mechanism for conveyance has a A common transmission shaft extending in the direction of arrangement of the processing table and the storage box and used to move the first holding mechanism and the second holding mechanism; and a moving mechanism for processing, so that the processing mechanism is placed on a horizontal plane respectively move in a first direction along the transmission shaft and in a second direction orthogonal to the first direction.

In the processing device, the first holding mechanism and the second holding mechanism are moved by a common transmission shaft extending along the direction in which the processing table and the storage box are arranged, and the processing mechanism is moved by the moving mechanism for processing. It moves on the horizontal plane in the first direction along the transmission axis and in the second direction perpendicular to the first direction, so that the processing object can be processed without moving the processing table in the first direction and the second direction. Monolithic. Therefore, the processing table can be moved without using the ball screw mechanism or the like, and the bellows member for protecting the ball screw mechanism or the like and the cover member for protecting the bellows member are unnecessary. As a result, the device structure of the processing device can be simplified. In addition, since the processing table does not move in the first direction and the second direction on the horizontal plane, the movement space of the processing table and the useless space around it can be reduced, and the occupied area of the processing device can be reduced. Furthermore, the second holding mechanism holding the singulated object to be processed is transferred to the storage box, and the singulated object to be processed is dropped from the second holding mechanism and stored in the storage box. Compared with the tray storage structure, the storage space can be miniaturized. Thereby, the occupied area of the processing device can also be reduced.

As an aspect of the specific arrangement of the transmission shaft and the moving mechanism for processing, it is desirable that the transmission shaft is arranged so as to traverse the moving mechanism for processing above the moving mechanism for processing. According to this configuration, the first holding mechanism that moves along the transmission shaft can be moved above the processing moving mechanism, and physical interference between the first holding mechanism and the processing moving mechanism can be prevented. In addition, the second holding mechanism that moves along the transmission shaft can be moved above the processing moving mechanism, thereby preventing physical interference between the second holding mechanism and the processing moving mechanism.

As a specific implementation aspect of the second holding mechanism, it is desirable that the second holding mechanism suction-holds the singulated object to be processed.

In order to reliably drop the separated object to be processed from the second holding mechanism to the storage box, it is desirable to further include a scraper for scraping off the separated object to be processed from the second holding mechanism. Fall components.

In order to reliably scrape off and store the singulated object in the storage box while using the movement of the second holding mechanism by the moving conveyance mechanism, it is desirable that the scraping member is fixed to the A storage box for scraping off the singulated objects from the second holding mechanism by moving the second holding mechanism relative to the scraping member by the transport moving mechanism. .

In order to dry the individualized object to be processed, it is desirable that the processing apparatus of the present invention further includes a drying table for drying the individualized object to be processed. In the above configuration, the transfer moving mechanism moves the second holding mechanism from the processing table to the drying table, and from the drying table to the storage table.

As a specific implementation aspect for drying the object to be processed which has been separated into pieces, it is desirable that the processing device of the present invention further includes: a drying mechanism, which injects gas from above the drying table, and separates the single pieces into pieces. drying the sheeted object; and moving the drying mechanism along the drying table for drying.

As a specific implementation aspect of the drying mechanism, it is preferable that the drying mechanism injects gas toward a moving direction of the drying moving mechanism.

As a specific implementation aspect of the moving mechanism that makes the processing mechanism move at least in the X direction as the first direction and the Y direction as the second direction, it is desirable that the moving mechanism for processing includes: a moving part in the X direction, so that The processing mechanism moves linearly in the X direction; and the Y direction moving part makes the processing mechanism move linearly in the Y direction, and the X direction moving part has: a pair of X direction guide rails, separated by the processing table along the and a support body that moves along the pair of X-direction guide rails and supports the processing mechanism via the Y-direction moving portion. According to the said structure, since a pair of X direction guide rail provided in the X direction is provided across a processing table, the pitch of a pair of X direction guide rail can be enlarged. As a result, the influence of the Z-direction positional displacement between the X-direction guide rails on the machining can be reduced. That is, it is possible to reduce the deviation of the orthogonality between the rotating tool (such as a blade) and the processing table, and improve the processing accuracy. In addition, for the X-direction guide rail, a guide rail with a lower specification than before can be used.

Moreover, the manufacturing method of the processed product which manufactures a processed product using the said processing apparatus is also one aspect of this invention.

<An embodiment of the present invention> Hereinafter, an embodiment of the processing apparatus of the present invention will be described with reference to the drawings. It should be noted that any of the drawings shown below are appropriately omitted or exaggerated and schematically drawn for easy understanding. The same symbols are assigned to the same components, and explanations are appropriately omitted.

＜Overall structure of processing equipment＞ The processing apparatus 100 of this embodiment is a cutting apparatus which cuts the sealed substrate W which is an object to be processed, and singulates it into a plurality of products P which are processed products.

Here, the sealed substrate W is a substrate to which electronic components such as a semiconductor chip, a resistor element, and a capacitor element are connected, and resin-molded such that at least the electronic components are resin-sealed. As the substrate constituting the sealed substrate W, lead frames and printed wiring boards can be used, and other than these, semiconductor substrates (including semiconductor wafers such as silicon wafers), metal substrates, ceramic substrates, and glass substrates can also be used. Substrates, resin substrates, etc. In addition, for the substrate constituting the sealed substrate W, wiring may or may not be performed.

In addition, the sealed substrate W and the product P of this embodiment have a structure in which one side of the substrate is molded with resin. In this structure, the resin-molded surface is the resin-sealed surface of the electronic components connected to the substrate, which is called "sealing surface" or "package surface". On the other hand, the non-resin-molded surface on the opposite side to the resin-molded surface exposes the leads that usually function as external connection electrodes of the product, so it is called a lead surface. When the lead wire is a protruding electrode used in electronic components such as a ball grid array (BGA), it may also be called a "spherical surface". Furthermore, the non-resin-molded surface opposite to the resin-molded surface also has a form in which no leads are formed, so it may also be called a "substrate surface". In the description of this embodiment, the resin-molded surface is described as a "sealing surface" or "package surface", and the resin-molded surface opposite to the resin-molded surface is described as a "lead surface".

Specifically, as shown in FIG. 1 , the cutting device 100 includes: two cutting tables (processing tables) 2A and 2B holding the sealed substrate W; and a first holding mechanism 3 for transporting the sealed substrate W to The cutting table 2A and the cutting table 2B hold the sealed substrate W; the cutting mechanism (processing mechanism) 4 cuts the sealed substrate W held on the cutting table 2A and the cutting table 2B; Two holding mechanisms 6 keep a plurality of products P in order to transport a plurality of products P from the cutting table 2A and the cutting table 2B to the storage box 5; and the common transmission shaft 71 that the second holding mechanism 6 moves; The movement of the substrate W is completed. Furthermore, the transport mechanism (loader) for transporting the sealed substrate W is constituted by the first holding mechanism 3 and the transport moving mechanism 7, and the transport mechanism for transporting a plurality of products P is constituted by the second holding mechanism 6 and the transport moving mechanism 7. (uninstaller).

In the following description, the directions perpendicular to each other in the plane (horizontal plane) along the upper surfaces of the table 2A for cutting and the table 2B for cutting are respectively referred to as the X direction as the first direction and as the X direction as the second direction. As for the Y direction, let the vertical direction perpendicular to the X direction and the Y direction be the Z direction. Specifically, let the left-right direction of FIG. 1 be an X direction, and let an up-down direction be a Y direction. Although it will be described later, the X direction is the moving direction of the support body 812, and is also a direction perpendicular to the longitudinal direction (the direction in which the beam portion extends) of the beam portion (beam portion) on which the pair of legs of the door-shaped support body 812 is erected. (Refer to Figure 2 and Figure 3).

<Cutting table 2A, cutting table 2B> The two tables 2A and 2B for cutting are fixedly installed in the X direction, the Y direction, and the Z direction. In addition, the table 2A for cutting is rotatable in the (theta) direction by the rotation mechanism 9A provided under the table 2A for cutting. In addition, the cutting table 2B can be rotated in the θ direction by the rotation mechanism 9B provided under the cutting table 2B.

These two stages 2A and 2B for cutting are installed along the X direction on a horizontal plane. Specifically, the two cutting tables 2A, 2B are arranged so that their upper surfaces are on the same horizontal plane (at the same height position in the Z direction) (see FIG. 4 ), and the centers of these upper surfaces ( Specifically, they are arranged so that the rotation centers of the rotation mechanism 9A and the rotation mechanism 9B are located on the same straight line extending in the X direction (see FIGS. 2 and 3 ).

In addition, the two cutting stages 2A, 2B absorb and hold the sealed substrate W. As shown in FIG. Each vacuum pump 10A, 10B is a water-sealed vacuum pump, for example.

Here, since the table 2A for cutting and the table 2B for cutting are fixed in the XYZ direction, the piping (not shown) connecting the table 2A for cutting and the table 2B for cutting from the vacuum pump 10A, 10B can be shortened. , can reduce the pressure loss of the piping, and prevent the reduction of the adsorption force. As a result, even an extremely small package of, for example, 1 mm square or less can be reliably adsorbed to the table 2A for cutting and the table 2B for cutting. In addition, since the reduction of the adsorption force due to the pressure loss of the piping can be prevented, the capacities of the vacuum pump 10A and the vacuum pump 10B can be reduced, contributing to downsizing and cost reduction.

＜First holding mechanism 3＞ As shown in FIG. 1 , the first holding mechanism 3 holds the sealed substrate W to transfer the sealed substrate W from the substrate supply mechanism 11 to the cutting table 2A and the cutting table 2B. As shown in Figures 5 and 6, the first holding mechanism 3 has: a suction head 31, provided with a plurality of suction parts 311 for suction and holding the sealed substrate W; and a vacuum pump (not shown), connected to the suction The suction part 311 of the head 31 . Then, the suction head 31 is moved to a desired position by the transport moving mechanism 7 described later, thereby transporting the sealed substrate W from the substrate supply mechanism 11 to the cutting table 2A and the cutting table 2B.

As shown in FIG. 1 , the substrate supply mechanism 11 has: a substrate accommodating portion 111 for accommodating a plurality of sealed substrates W from the outside; A holding mechanism 3 absorbs and holds the holding position RP. The holding position RP is set so as to be in line with the two stages 2A and 2B for cutting in the X direction. Furthermore, the substrate supply mechanism 11 may include a heating unit 113 for heating the sealed substrate W sucked by the first holding mechanism 3 so as to make the sealed substrate W sucked by the first holding mechanism 3 into a soft state for easy sucking.

＜Cutting mechanism 4＞ As shown in FIGS. 1 , 2 and 3 , the cutting mechanism 4 as a processing mechanism has two rotary tools 40 including a blade 41A, a blade 41B, and two spindle portions 42A, 42B. The two spindle parts 42A and 42B are provided so that the rotation axes thereof are along the Y direction, and the blades 41A and 41B attached to the spindle parts are arranged to face each other (see FIG. 3 ). The blade 41A of the mandrel part 42A and the blade 41B of the mandrel part 42B cut the sealed substrate W held on each cutting table 2A, 2B by rotating in a plane including the X direction and the Z direction. Furthermore, as shown in FIG. 4, the cutting device 100 of the present embodiment is provided with a liquid supply mechanism 12 having a function of jetting cutting water (processing) in order to suppress the frictional heat generated by the blades 41A and 41B. liquid) spray nozzle 121. The spray nozzle 121 is supported, for example, by a Z-direction moving part 83 described later.

<Second holding mechanism 6> As shown in FIG. 1 , the second holding mechanism 6 holds a plurality of products P in order to transfer the plurality of products P from the cutting table 2A and the cutting table 2B to the drying table 13 or the storage box 5 . As shown in FIG. 8 , the second holding mechanism 6 has: an adsorption head 61 provided with a plurality of adsorption parts 611 for adsorbing and holding a plurality of products P; and a vacuum pump (not shown) connected to the suction head 61 Adsorption part 611. Then, the adsorption head 61 is moved to a desired position by the conveying moving mechanism 7 described later, whereby a plurality of products P are conveyed from the cutting table 2A and the cutting table 2B to the drying table 13, and are automatically dried. The table 13 is transferred to the storage box 5 .

＜Movement Mechanism 7 for Transport＞ As shown in FIG. 1 , the transporting moving mechanism 7 moves the first holding mechanism 3 at least between the substrate supply mechanism 11 and the cutting table 2A and the cutting table 2B, and moves the second holding mechanism 6 at least below the cutting table. It moves between the table 2A, the table 2B for cutting, and the storage box 5 .

Moreover, as shown in FIG. 1 , the moving mechanism 7 for conveyance has a common transmission shaft 71 , and the common transmission shaft 71 is arranged along the arrangement direction (X direction) of the two cutting tables 2A, 2B and the storage box 5 . Extending in a straight line, it is used to move the first holding mechanism 3 and the second holding mechanism 6 .

The transmission shaft 71 is set in the following range, that is: the first holding mechanism 3 can move to the top of the substrate supply part 112 of the substrate supply mechanism 11, and the second holding mechanism 6 can move to the top of the storage box 5 (refer to FIG. 1). In addition, the first holding mechanism 3 , the second holding mechanism 6 , the cutting table 2A, the cutting table 2B, and the storage box 5 are arranged on the same side (near side) in plan view with respect to the transmission shaft 71 . Moreover, the 1st cleaning mechanism 18 and the 2nd cleaning mechanism 19 mentioned later, and the drying table 13 are also installed in the same side (near side) with respect to the transmission shaft 71. As shown in FIG.

Furthermore, as shown in Fig. 5, Fig. 6 and Fig. 8, the moving mechanism 7 for conveyance has: a main moving mechanism 72, which moves the first holding mechanism 3 and the second holding mechanism 6 along the transmission shaft 71 in the X direction; The moving mechanism 73 makes the first holding mechanism 3 and the second holding mechanism 6 move up and down in the Z direction relative to the transmission shaft 71; and the horizontal moving mechanism 74 makes the first holding mechanism 3 and the second holding mechanism 6 move relative to the transmission shaft 71 moves horizontally in the Y direction.

As shown in FIGS. 5-8 , the main moving mechanism 72 has: a common guide rail 721, which is arranged on the transmission shaft 71 and guides the first holding mechanism 3 and the second holding mechanism 6; and a rack and pinion mechanism 722, The first holding mechanism 3 and the second holding mechanism 6 are moved along the guide rail 721 .

The guide rail 721 extends linearly in the X direction along the transfer shaft 71, and is provided in the same range as the transfer shaft 71 so that the first holding mechanism 3 can move above the substrate supply part 112 of the substrate supply mechanism 11, and The second holding mechanism 6 can move to the top of the storage box 5 . The guide rail 721 is slidably provided with a slide member 723 provided with the first holding mechanism 3 and the second holding mechanism 6 via the elevating movement mechanism 73 and the horizontal movement mechanism 74 . Here, the guide rail 721 is shared by the first holding mechanism 3 and the second holding mechanism 6, but the elevating movement mechanism 73, the horizontal moving mechanism 74 and the sliding member 723 are for each of the first holding mechanism 3 and the second holding mechanism 6. Set individually.

The rack and pinion mechanism 722 has: a cam rack 722a shared by the first holding mechanism 3 and the second holding mechanism 6; Rotated by an actuator (not shown). The cam rack 722a is provided on the common transmission shaft 71, and can be changed to various lengths by connecting a plurality of cam rack elements. In addition, the pinion 722b is provided on the sliding member 723, and is called a so-called roller pinion (roller pinion), as shown in FIG. A plurality of roller pins 722b2 are provided at equal intervals in the circumferential direction between the pair of roller bodies 722b1 and are provided so as to be able to roll relative to the roller bodies 722b1. The rack and pinion mechanism 722 of this embodiment uses the above-mentioned roller pinion, so two or more roller pins 722b2 are in contact with the cam rack 722a, and there is no backlash in the forward and reverse directions. When the first holding mechanism 3 and the second holding mechanism 6 move in the X direction, the positioning accuracy becomes better.

As shown in FIGS. 5 and 8 , the elevating movement mechanism 73 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6 , respectively. As shown in Figures 5 and 6, the elevating movement mechanism 73 of the first holding mechanism 3 is provided between the transmission shaft 71 (specifically, the main moving mechanism 72) and the first holding mechanism 3, and has: Z The direction guide rail 73a is provided along the Z direction; and the actuator part 73b moves the first holding mechanism 3 along the Z direction guide rail 73a. In addition, as the actuator part 73b, for example, a ball screw mechanism may be used, an air cylinder may be used, and a linear motor may be used. In addition, as shown in FIG. 8 , the structure of the vertical movement mechanism 73 of the second holding mechanism 6 is the same as that of the vertical movement mechanism 73 of the first holding mechanism 3 .

As shown in FIG. 5 , FIG. 6 and FIG. 8 , the horizontal movement mechanism 74 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6 , respectively. As shown in Figures 5 and 6, the horizontal movement mechanism 74 of the first holding mechanism 3 is arranged between the transmission shaft 71 (specifically, the lifting movement mechanism 73) and the first holding mechanism 3, and has: The Y direction guide rail 74a is arranged along the Y direction; the elastic body 74b imparts force to one side of the first holding mechanism 3 toward the Y direction guide rail 74a; and the cam mechanism 74c makes the first holding mechanism 3 move toward the Y direction guide rail 74a. Move to the other side. Here, the cam mechanism 74c uses an eccentric cam, and by rotating the eccentric cam with an actuator such as a motor, the amount of movement of the first holding mechanism 3 in the Y direction can be adjusted.

Furthermore, as shown in FIG. 8 , the structure of the horizontal movement mechanism 74 of the second holding mechanism 6 is the same as that of the vertical movement mechanism 73 of the first holding mechanism 3 . Moreover, the structure which does not provide the horizontal movement mechanism 74 to the 2nd holding mechanism 6 may be sufficient, and the structure which does not provide the horizontal movement mechanism 74 to both the 1st holding mechanism 3 and the 2nd holding mechanism 6 may be sufficient. Furthermore, similarly to the vertical movement mechanism 73, the horizontal movement mechanism 74 may use, for example, a ball screw mechanism instead of the cam mechanism 74c, may use an air cylinder, or may use a linear motor.

<Moving mechanism 8 for cutting (moving mechanism for processing)> The moving mechanism 8 for cutting linearly moves each of the two spindle parts 42A, 42B independently in the X direction, the Y direction, and the Z direction.

Specifically, as shown in Fig. 2, Fig. 3 and Fig. 9, the moving mechanism 8 for cutting includes: an X direction moving part 81, which moves the mandrel part 42A and the mandrel part 42B linearly in the X direction; The part 82 linearly moves the spindle part 42A and the spindle part 42B in the Y direction; and the Z direction moving part 83 linearly moves the spindle part 42A and the spindle part 42B in the Z direction.

The X-direction moving part 81 is shared by the two cutting platforms 2A and 2B, especially as shown in FIGS. , 2B are provided; and the support body 812 moves along the pair of X-direction guide rails 811 and supports the mandrel part 42A and the mandrel part 42B via the Y-direction moving part 82 and the Z-direction moving part 83 . A pair of X direction guide rail 811 is provided in the side of two cutting tables 2A, 2B provided along the X direction. In addition, the support body 812 is, for example, a gate shape and has a shape extending in the Y direction. Specifically, the support body 812 has a pair of leg portions extending upward from the pair of X-direction rails 811 , and a beam portion (beam portion) spanning the pair of leg portions, and the beam portion extends in the Y direction.

Moreover, the support body 812 linearly reciprocates along the X direction on a pair of X direction guide rails 811 by the ball screw mechanism 813 extended along the X direction, for example. The ball screw mechanism 813 is driven by a drive source (not shown) such as a servo motor. In addition, the supporting body 812 can also be configured to move back and forth by other linear motion mechanisms such as linear motors.

Especially as shown in FIG. 3 , the Y-direction moving part 82 has: a Y-direction rail 821 disposed in the support body 812 along the Y-direction; and a Y-direction slider 822 that moves along the Y-direction rail 821 . The Y-direction slider 822 is driven by, for example, a linear motor 823 and linearly moves back and forth on the Y-direction guide rail 821 . In this embodiment, two Y direction sliders 822 are provided corresponding to the two spindle parts 42A and 42B. Thereby, the two spindle parts 42A, 42B can move in the Y direction independently of each other. In addition, the Y-direction slider 822 may also be configured to move back and forth by using other linear motion mechanisms such as ball screw mechanisms.

As shown in FIGS. 2 to 4 , the Z direction moving part 83 has: a Z direction guide rail 831 arranged along the Z direction in each Y direction slider 822 ; and a Z direction slider 832 arranged along the Z direction guide rail 831 The mandrel part 42A, the mandrel part 42B are moved and supported. That is, the Z direction moving part 83 is provided corresponding to each spindle part 42A, 42B. The Z-direction slider 832 is driven by, for example, an eccentric cam mechanism (not shown), and linearly moves back and forth on the Z-direction guide rail 831 . In addition, the Z-direction slider 832 may also be configured to move back and forth by other linear motion mechanisms such as a ball screw mechanism.

Regarding the positional relationship between the moving mechanism 8 for cutting and the transmission shaft 71, as shown in FIG. 1 and FIG. . Specifically, the transmission shaft 71 is disposed above the support body 812 so as to cross the support body 812 , and the transmission shaft 71 and the support body 812 are in a positional relationship that intersects each other.

<Swarf container 17> In addition, as shown in FIG. 1 , the cutting device 100 of the present embodiment further includes a chip storage unit 17 for storing chips S such as end materials generated by cutting the sealed substrate W.

As shown in FIGS. 2 to 4 , the chip storage unit 17 is provided below the cutting table 2A and the cutting table 2B, and has a guide chute 171 that surrounds the cutting table 2A when viewed from above. , the upper opening 171X of the table 2B for cutting; and the recovery container 172 for recovering the machining chips S guided by the guide chute 171 . The recovery rate of the machining waste S can be improved by providing the machining waste storage unit 17 below the cutting table 2A and the cutting table 2B.

The guide chute 171 guides the machining chips S scattered or dropped from the cutting table 2A and the cutting table 2B to the recovery container 172 . In this embodiment, the upper opening 171X of the guide chute 171 surrounds the table 2A for cutting and the table 2B for cutting (see FIG. 3 ), so it is difficult to miss the machining chips S, and the machining waste S can be further increased. recovery rate. In addition, the guide chute 171 is provided so as to surround the rotation mechanism 9A and the rotation mechanism 9B provided under the table 2A for cutting and the table 2B for cutting (see FIG. 4 ), so as to protect the rotation mechanism 9A and the rotation mechanism 9B. Constructed to avoid the influence of machining chips S and cutting water.

In the present embodiment, the chip storage unit 17 is shared by the two cutting tables 2A and 2B, but may be provided correspondingly to the cutting table 2A and the cutting table 2B, respectively.

The recovery container 172 recovers the machining chips S passing through the guide chute 171 by its own weight, and in this embodiment, as shown in FIG. Furthermore, the two recovery containers 172 are disposed on the near side of the transmission shaft, and are configured to be independently detachable from the near side of the cutting device 100 . With such a configuration, maintainability such as disposal of machining waste S can be improved. In addition, one collection container 172 may be provided as a whole under all the cutting tables in consideration of the size of the sealed substrate W, the size and amount of the processing waste S, and workability, or may be divided into three or more and provided.

In addition, as shown in FIG. 4 and the like, the chip storage unit 17 has a separating portion 173 for separating cutting water and chips S. As shown in FIG. As a structure of the separation unit 173 , for example, a filter such as a perforated plate through which the cutting water passes is provided on the bottom surface of the recovery container 172 . By the separation unit 173, the machining chips S can be recovered without accumulating cutting water in the recovery container 172.

＜First Cleaning Mechanism 18＞ In addition, as shown in FIG. 1 and FIG. 5, the cutting device 100 of the present invention further includes a first cleaning mechanism 18. The upper surface side (lead surface) of the product P is cleaned. The first cleaning mechanism 18 uses spray nozzles 18a (see FIG. 5 ) that spray cleaning liquid and/or compressed air to the upper surfaces of the plurality of products P held on the cutting table 2A and the cutting table 2B, to clean the upper surface side of the product P.

As shown in FIG. 5 , the first cleaning mechanism 18 is configured to be movable along the transmission shaft 71 together with the first holding mechanism 3 . Here, the first cleaning mechanism 18 is provided on a sliding member 723 that slides on a guide rail 721 provided on the transmission shaft 71 . Here, between the first cleaning mechanism 18 and the slide member 723 , there is provided a lifting movement mechanism 181 for moving the first cleaning mechanism 18 up and down in the Z direction. As for the lifting mechanism 181, for example, a rack and pinion mechanism, a ball screw mechanism, or an air cylinder may be used.

＜Second Cleaning Mechanism 19＞ Furthermore, as shown in FIG. 1 , the cutting device 100 of the present invention further includes a second cleaning mechanism 19 for cleaning the lower surface side (packaging surface) of the plurality of products P held by the second holding mechanism 6. ) to clean. The second cleaning mechanism 19 is provided between the table 2B for cutting and the storage box 5 (more specifically, the drying table 13 described later), and cleans the products P held by the second holding mechanism 6 below the plurality of products P. The cleaning solution and/or compressed air are sprayed on the surface to clean the lower surface side of the product P. That is, the second cleaning mechanism 19 cleans the lower surface side of the product P while the second holding mechanism 6 is moving along the transmission shaft 71 .

<Drying function of cutting device 100> The cutting device 100 of the present embodiment has a function of further drying the plurality of products P cleaned by the second cleaning mechanism 19 . Specifically, as shown in FIG. 1, FIG. 9 and FIG. 10, the cutting device 100 includes: a drying table 13 for drying a plurality of products P; a drying mechanism 14 for drying a plurality of products P placed on the drying table 13; P drying; and a moving mechanism 15 for drying, which moves the drying mechanism 14 along the drying table 13 .

The drying table 13 conveys and mounts several products P by the 2nd holding mechanism 6 and the moving mechanism 7 for conveyance. The drying table 13 absorbs and holds a plurality of products P. In addition, the drying table 13 and the two tables 2A and 2B for cutting are arranged in a row along the X direction on the horizontal plane. The drying table 13 of the present embodiment has a rectangular shape in plan view, but may have other shapes.

The drying mechanism 14 sprays compressed air as a gas from above the drying table 13 to dry the plurality of products P adsorbed and held on the drying table 13 . This drying mechanism 14 has spray nozzles 14 a that spray compressed air to a plurality of products P held by the drying table 13 . The spray nozzle 14 a of the present embodiment has a slit-like opening (see FIG. 9 ) extending linearly provided toward the drying table 13 , but may have a plurality of openings intermittently provided along the X direction.

The drying mechanism 14 of the present embodiment is configured to spray compressed air toward the moving direction of the drying moving mechanism 15 (see FIG. 9 ). That is, it is configured such that the spraying direction of the compressed air sprayed from the spraying nozzle 14a is directed toward the moving direction (here, from the front side to the rear side in the Y direction) by the drying moving mechanism 15 .

In addition, as shown in FIG. 9 , the spray nozzles 14 a of the drying mechanism 14 are arranged inclined at, for example, less than 30 degrees with respect to the arrangement direction along the X direction of the plurality of products P held on the drying table 13 . Here, in the drying table 13, a plurality of products P are arranged in a matrix in the X direction and the Y direction, and the spray nozzle 14a of the drying mechanism 14 sprays compressed air obliquely with respect to one side of each product P along the X direction. Thereby, the moisture accumulated between the adjacent products P can be easily blown away from the products P. As shown in FIG. Thereby, drying of a plurality of products P is accelerated. In addition, the slit-shaped opening of the spray nozzle 14 a of the drying mechanism 14 may be installed so as to be slightly inclined toward the drying table 13 so that the compressed air is blown away toward the moving direction of the drying mechanism 14 .

The drying moving mechanism 15 moves the drying mechanism 14 in the Y direction above the drying table 13 . The moving mechanism 15 for drying of this embodiment moves the drying mechanism 14 back and forth in the Y direction with respect to the drying table 13 . Specifically, as shown in Figures 9 and 10, the drying moving mechanism 15 includes: a Y direction guide rail 151 extending along the Y direction; a sliding member 152 moving along the Y direction guide rail 151 and maintaining the drying mechanism 14; part (not shown) to move the slide member 152 along the Y-direction guide rail 151 . In addition, as a drive part, for example, a ball screw mechanism may be used, an air cylinder may be used, and a linear motor may be used.

＜Example of drying operation＞ Next, the drying operation by the drying mechanism 14 and the drying moving mechanism 15 will be described.

Before placing a plurality of products P on the drying table 13, the moving mechanism 15 for drying retracts the drying mechanism 14 to one side (for example, the front side) of the drying table 13 in the Y direction so as not to hinder the loading of the plurality of products P. . Then, when a plurality of products P are placed and held on the drying table 13 , the drying mechanism 14 starts spraying compressed air, and the drying moving mechanism 15 moves the drying mechanism 14 to the other side (for example, the rear side) in the Y direction. Thereby, a plurality of products P held by the drying table 13 are dried. Furthermore, when the drying moving mechanism 15 moves the drying mechanism 14 from the other side (back side) in the Y direction to one side (the front side) in the Y direction, the drying mechanism 14 stops spraying the gas. Furthermore, the drying mechanism 14 may also be configured to inject compressed air not only in the forward path but also in the return path.

<Storage box 5 and scraping member 16> As shown in FIGS. 1 , 9 , and 10 , the storage box 5 stores a plurality of products P in a scattered state (so-called bulk storage). In addition, the storage box 5 and the two cutting tables 2A and 2B are arranged in a row along the X direction on the horizontal plane. The storage box 5 further includes a scraping member 16 for scraping off a plurality of products P from the second holding mechanism 6 .

The storage box 5 has an upper opening 5X having a rectangular shape in plan view (see FIG. 9 ). Furthermore, the scraping member 16 is fixed to one side of the upper opening 5X of the storage box 5 . By moving the second holding mechanism 6 in the X direction relative to the scraping member 16 , the product P is scraped off and dropped, and stored in the storage box 5 .

In addition, the storage box 5 of the present embodiment is installed between the drying table 13 and the plate storage portion 20 for storing the holding plate (not shown) in the X direction, and the scraping member 16 is installed in the upper opening 5X of the storage box 5 On one side of the drying table 13 sides. Thereby, when the product P is scraped off, the second holding mechanism 6 is configured so as not to interfere with the plate housing portion 20 .

Furthermore, the holding plate accommodated in the plate accommodating portion 20 is used to hold the sealed substrate W or the product P, for example, there are a cutting table 2A for cutting the sealed substrate W, and a holding table 2B for cutting the sealed substrate W. plate, a holding plate of the drying table 13 for drying the product P, and a holding plate of the second holding mechanism 6 for holding the product P in order to transfer the product P.

The scraping member 16 extends upward from one side of the upper opening 5X on the drying table 13 side (see FIG. 9 ). In addition, as the scraping member 16, as long as it scrapes off the product P that does not leave the second holding mechanism 6 that has been released by adsorption, for example, it is made of resin such as poly ether ether ketone (poly ether ether ketone, PEEK) material, and its form can be It may be in the shape of a brush, or may be in the shape of a flat plate.

In this embodiment, the storage box 5 is disposed on the near side of the transmission shaft 71, and a handle 51 (referring to FIG. The method of division constitutes. With this configuration, maintainability such as taking out and collecting the product P can be improved. Furthermore, the take-out direction of the storage box 5 is not limited to the front side, for example, it may be taken out from the lateral side of the cutting device 100, or may be taken out from the back side.

<An example of the operation of the cutting device 100> Next, an example of the operation of the cutting device 100 will be described. FIG. 11 shows the movement path of the first holding mechanism 3 and the movement path of the second holding mechanism 6 during the operation of the cutting device 100 . Furthermore, in the present embodiment, the operation of the cutting device 100, for example, the conveyance of the sealed substrate W, the cutting of the sealed substrate W, the drying of the product P, and the scraping operation of the product P are performed or controlled by the controller. Partial CTL (refer to Figure 1) was performed.

The substrate supply unit 112 of the substrate supply mechanism 11 moves the sealed substrate W stored in the substrate storage unit 111 toward the holding position RP held by the first holding mechanism 3 .

Next, the transport moving mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 absorbs and holds the sealed substrate W. Thereafter, the conveyance moving mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting table 2A and the cutting table 2B, and the first holding mechanism 3 releases the adsorption and holding, and the sealed substrate W is placed on the substrate W. Placed on table 2A for cutting and table 2B for cutting. At this time, the position of the sealed substrate W in the X direction is adjusted by the main moving mechanism 72 , and the position of the sealed substrate W in the Y direction is adjusted by the horizontal movement mechanism 74 . Then, the cutting table 2A and the cutting table 2B suck and hold the sealed substrate W.

Here, when the first holding mechanism 3 holding the sealed substrate W is moved to the table 2B for cutting, the elevating movement mechanism 73 raises the first holding mechanism 3 so that it does not contact the moving mechanism 8 for cutting (supported). body 812) until the location where physical interference occurs. Furthermore, when the first holding mechanism 3 holding the sealed substrate W is moved to the table 2B for cutting, when the support body 812 is retracted from the table 2B for cutting to the side of the drying table 13, it is not necessary to do so. As described above, the first holding mechanism 3 is raised and lowered.

In this state, the cutting moving mechanism 8 sequentially moves the two mandrel parts 42A, 42B in the X direction and the Y direction, and the sealed substrate W is cut by the rotation of the cutting tables 2A, 2B. Grid-like and monolithic.

After cutting, the conveyance moving mechanism 7 moves the first cleaning mechanism 18 to clean the upper surface side (lead surface) of the plurality of products P held on the cutting table 2A and the cutting table 2B. After the cleaning, the transport moving mechanism 7 retracts the first holding mechanism 3 and the first cleaning mechanism 18 to predetermined positions.

Next, the conveyance moving mechanism 7 moves the second holding mechanism 6 to the cutting table 2A and the cutting table 2B after cutting, and the second holding mechanism 6 adsorbs and holds a plurality of products P. Thereafter, the conveyance moving mechanism 7 moves the second holding mechanism 6 holding a plurality of products P to the second cleaning mechanism 19 . Thereby, the second cleaning mechanism 19 cleans the lower surface side (sealing surface) of the plurality of products P held by the second holding mechanism 6 .

After cleaning, the conveyance moving mechanism 7 moves the second holding mechanism 6 to the drying table 13 , and the second holding mechanism 6 releases the adsorption and holding, and places a plurality of products P on the drying table 13 . Then, the drying table 13 adsorbs and holds the sealed substrate W. At this time, the transport moving mechanism 7 retreats the second holding mechanism 6 to a position where the movement of the drying mechanism 14 is not hindered.

In this state, the drying mechanism 15 reciprocates the drying mechanism 14 in the Y direction, and the drying mechanism 14 sprays compressed air to dry a plurality of products P. FIG. In addition, the number of times of reciprocation of the drying mechanism 14 by the moving mechanism 15 for drying can be set suitably, and may be one time or multiple times.

After drying, the transport moving mechanism 7 moves the second holding mechanism 6 to the drying table 13 , and the second holding mechanism 6 absorbs and holds a plurality of products P from the drying table 13 . Thereafter, the moving mechanism 7 for conveyance moves the second holding mechanism 6 holding a plurality of products P to the storage box 5 .

Then, the second holding mechanism 6 releases the adsorption and holding of the plurality of products P above the upper opening 5X of the storage box 5 . Thereafter, the conveying moving mechanism 7 moves the second holding mechanism 6 toward the drying table 13 side with respect to the scraping member 16, so that the product P remaining in the second holding mechanism 6 without falling from the second holding mechanism 6 touches it. Scraping member 16 . In this embodiment, in order to scrape off the product P reliably, the second holding mechanism 6 is moved relative to the scraping member 16 so that the scraping member 16 contacts the lower surface which is the adsorption surface of the second holding mechanism 6 . Thereby, several products P fall and are accommodated in the storage box 5. As shown in FIG.

<Effects of this embodiment> According to the cutting device 100 of the present embodiment, the first holding mechanism 3 and the second holding mechanism 3 are connected by the common transmission shaft 71 extending along the direction in which the cutting table 2A, the cutting table 2B, and the storage box 5 are arranged. The structure of the holding mechanism 6 is to move the cutting mechanism 4 on the horizontal plane in the X direction and the Y direction along the transmission shaft 71 by the cutting moving mechanism 8, so there is no need to use the cutting table 2A, cutting The sealed substrate W can be separated into pieces by moving the table 2B in the X direction and the Y direction. Therefore, the cutting table 2A and the cutting table 2B can be moved without a ball screw mechanism or the like, and the bellows member for protecting the ball screw mechanism or the like and the cover member for protecting the bellows member are unnecessary. As a result, the device structure of the cutting device 100 can be simplified.

In addition, since the cutting table 2A and the cutting table 2B do not move in the X direction and the Y direction, the movement space of the cutting table 2A and the cutting table 2B and the useless space around them can be reduced. , the occupied area of the cutting device 100 can be reduced.

Furthermore, the second holding mechanism 6 holding a plurality of products P is transferred to the storage box 5, and the plurality of products P are dropped from the second holding mechanism 6 to be stored in the storage box 5. Therefore, it is different from the previous tray storage structure. In comparison, the storage space can be miniaturized. Thereby, the occupied area of the cutting device 100 can also be reduced.

＜Other modified implementation forms＞ In addition, this invention is not limited to the said embodiment.

For example, in the above-mentioned embodiment, although it has the structure which has the drying table 13, it may be set as the structure which does not have the drying table 13.

In addition, a structure may be adopted in which the scraping member 16 is not provided, and the plurality of products P are dropped by ejecting gas from the second holding mechanism 6 after the second holding mechanism 6 releases the adsorption and holding.

Furthermore, in addition to the structure in which the scraping member 16 is fixed to the storage box 5, the scraping member 16 may also be fixed to another member, or the following structure may be adopted: the scraping member 16 may be moved, and the scraping member 16 may be moved. 16 moves relative to the second holding mechanism 6, whereby a plurality of articles P is scraped off.

In the above-described embodiment, a cutting device with a double-table system and a double-spindle structure has been described, but it is not limited to this, and a cutting device with a single-table system and a single-mandrel structure, or a single-stage cutting device may also be used. Cutting table type and double-spindle structure cutting device, etc.

In addition, since a plurality of cam rack elements constituting the transmission shaft 71 can be connected, for example, the cutting device (processing device) 100 can be separated and connected between the second cleaning mechanism 19 and the drying table 13 ( Can be loaded and unloaded) module structure. In this case, for example, a module for inspecting the product P may be added between the module on the side of the second cleaning mechanism 19 and the module on the side of the drying table 13 . Furthermore, in addition to the structure exemplified here, the cutting device (processing device) 100 may also have a module structure that can be separated and connected (detachable) somewhere, and an additional module may be used as an inspection Modules for various functions other than

In addition, this invention is not limited to the said embodiment, Of course, various deformation|transformation is possible in the range which does not deviate from the summary. [industrial availability]

According to the present invention, the structure of the device can be simplified, the occupied area can be reduced, and the storage space for singulated objects can be reduced in size.

2A, 2B: cutting table (processing table) 3: The first holding mechanism 4: Cutting mechanism (processing mechanism) 5: Containment box 5X, 171X: upper opening 6: The second holding mechanism 7: Moving mechanism for conveying 8: Moving mechanism for processing (moving mechanism for cutting) 9A, 9B: rotating mechanism 10A, 10B: vacuum pump 11: Substrate supply mechanism 12: Liquid supply mechanism 13:Drying table 14: Drying mechanism 14a, 18a, 121: spray nozzles 15:Moving mechanism for drying 16: Scraping components 17: Processing swarf storage unit 18: The first cleaning agency 19: The second cleaning mechanism 20: Plate Containment Department 31, 61: adsorption head 40:Rotary Tool 41A, 41B: Blades 42A, 42B: mandrel part 51: handle 71: Transmission shaft 72: Main moving mechanism 73, 181: Lifting and moving mechanism 73a, 831: Z direction guide rail 73b: Actuator part 74: Horizontal movement mechanism 74a, 151, 821: guide rail in Y direction 74b: Elastomer 74c: Cam Mechanism 81: X direction moving part 82:Y direction moving part 83: Z direction moving part 100: Cutting device (processing device) 111: Substrate storage unit 112: Substrate supply department 113: heating part 152: sliding member 171: guide chute 172: Recycling container 173: Separation Department 311, 611: adsorption part 721: guide rail 722: Pinion mechanism 722a: Cam rack 722b: Pinion 722b1: Roller body 722b2: Roller pin 723: sliding components 811: A pair of X direction guide rails 812: support body 813: Ball screw mechanism 822: Y direction slider 823:Linear motor 832:Z direction slider CTL: control department P: Products (processed products) RP: hold position S: processing chips W: Sealed substrate (object to be processed) X, Y, Z, θ: directions

Fig. 1 is a diagram schematically showing the structure of a cutting device according to an embodiment of the present invention. Fig. 2 is a perspective view schematically showing the table for cutting and its peripheral structure according to the embodiment. FIG. 3 is a view (plan view) seen from the Z direction schematically showing the structure of the table for cutting and its peripheral structures according to the embodiment. FIG. 4 is a view (front view) seen from the Y direction, schematically showing the structure of the table for cutting and its peripheral structures according to the embodiment. 5 is a view (front view) seen from the Y direction, schematically showing the configuration of the first holding mechanism and the moving mechanism for conveyance according to the embodiment. 6 is a view (side view) seen from the X direction schematically showing the configuration of the first holding mechanism and the moving mechanism for conveyance according to the embodiment. 7 is a view (front view) seen from the Y direction, schematically showing the configuration of the second holding mechanism and the moving mechanism for conveyance according to the embodiment. Fig. 8 is a cross-sectional view schematically showing the structure of the rack and pinion mechanism according to the embodiment. 9 is a view (plan view) seen from the Z direction, schematically showing the peripheral structures of the drying table and the storage box according to the embodiment. 10 is a view (front view) seen from the Y direction, schematically showing the peripheral structures of the drying table and the storage box according to the embodiment. Fig. 11 is a schematic diagram showing the operation of the cutting device according to the embodiment.

2A, 2B: Table for cutting (processing table)

3: The first holding mechanism

4: Cutting mechanism (processing mechanism)

5: Containment box

6: The second holding mechanism

7: Moving mechanism for conveying

8: Moving mechanism for processing (moving mechanism for cutting)

9A, 9B: rotating mechanism

10A, 10B: vacuum pump

11: Substrate supply mechanism

13:Drying table

14: Drying mechanism

15:Moving mechanism for drying

16: Scraping components

17: Processing swarf storage unit

18: The first cleaning agency

19: The second cleaning mechanism

20: Plate Containment Department

40:Rotary tool

41A, 41B: Blades

42A, 42B: mandrel part

71: Transmission shaft

100: Cutting device (processing device)

111: Substrate storage unit

112: Substrate supply department

113: heating part

172: Recycling container

812: support body

CTL: control department

RP: hold position

W: Sealed substrate (object to be processed)

X, Y, Z, θ: direction

Claims (10)

A processing device comprising: The processing table holds the object to be processed; a first holding mechanism for holding the object to be processed in order to transfer the object to be processed to the processing table; a processing mechanism that cuts and separates the object to be processed held on the processing table; a storage box for dropping and storing the object to be processed which has been separated into pieces by the processing mechanism; a second holding mechanism for holding the singulated object to be processed in order to transfer the singulated object to be processed from the processing table to the storage box; a moving mechanism for conveyance having a common transmission shaft extending along the direction in which the processing table and the storage box are arranged and for moving the first holding mechanism and the second holding mechanism; and The moving mechanism for processing moves the processing mechanism in a first direction along the transmission shaft and in a second direction perpendicular to the first direction on a horizontal plane. The processing device according to claim 1, wherein the transmission shaft is disposed above the processing moving mechanism so as to traverse the processing moving mechanism. The processing device according to claim 1 or claim 2, wherein the second holding mechanism absorbs and holds the singulated object to be processed. The processing device according to any one of claims 1 to 3, further comprising a scraper member for scraping off the singulated objects to be processed from the second holding mechanism. The processing device according to claim 4, wherein the scraping member is fixed to the storage box, The object to be processed that has been separated into pieces is scraped off from the second holding mechanism by the moving mechanism for conveyance moving the second holding mechanism relative to the scraping member. The processing device according to any one of claim 1 to claim 5, further comprising a drying table for drying the singulated objects to be processed, The transfer moving mechanism moves the second holding mechanism from the processing table to the drying table, and from the drying table to the storage table. The processing device as described in Claim 6, further comprising: a drying mechanism that sprays gas from above the drying table to dry the singulated objects to be processed; and The moving mechanism for drying moves the drying mechanism along the drying table. The processing apparatus according to claim 7, wherein the drying mechanism injects gas in a moving direction of the drying moving mechanism. The processing device according to any one of claim 1 to claim 8, wherein the moving mechanism for processing includes: an X-direction moving part, which makes the processing mechanism move in a straight line in the X direction as the first direction. moving; and a Y-direction moving part that linearly moves the processing mechanism in the Y direction as the second direction, The X-direction moving part has: a pair of X-direction rails disposed along the X direction across the processing table; and a support body that moves along the pair of X-direction rails and supports the processing mechanism. A method of manufacturing a processed product, using the processing device according to any one of claim 1 to claim 9 to manufacture a processed product.

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