CN117581335A - Processing device and method for manufacturing processed product - Google Patents

Processing device and method for manufacturing processed product Download PDF

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Publication number
CN117581335A
CN117581335A CN202280044313.XA CN202280044313A CN117581335A CN 117581335 A CN117581335 A CN 117581335A CN 202280044313 A CN202280044313 A CN 202280044313A CN 117581335 A CN117581335 A CN 117581335A
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CN
China
Prior art keywords
processing
drying
holding
moving
holding mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280044313.XA
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Chinese (zh)
Inventor
深井元树
片冈昌一
堀聡子
坂上雄哉
山本裕子
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Towa Corp
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Towa Corp
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Publication of CN117581335A publication Critical patent/CN117581335A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Dicing (AREA)
  • Details Of Cutting Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention simplifies the structure of the device, reduces the occupied area, miniaturizes the accommodation space of the object to be processed after being singulated, and comprises: a processing stage 2A and a processing stage 2B for holding the sealed substrate W; a first holding mechanism 3 for holding the sealed substrate W so as to convey the sealed substrate W to the processing stages 2A and 2B; a processing mechanism 4 for cutting and singulating the sealed substrates W held on the processing stages 2A and 2B; a housing box 5 for receiving the sealed substrates W singulated by the processing means 4; a second holding mechanism 6 for holding the product P so as to convey the product P from the processing stations 2A and 2B to the storage box 5; the conveying movement mechanism 7 has a common transmission shaft 71 extending along the arrangement direction of the processing table 2A, the processing table 2B, and the housing box 5 and configured to move the first holding mechanism 3 and the second holding mechanism 6; and a processing moving mechanism 8 for moving the processing mechanism 4 in a first direction along the transmission shaft 71 and a second direction orthogonal to the first direction on a horizontal plane.

Description

Processing device and method for manufacturing processed product
Technical Field
The present invention relates to a processing apparatus and a method for manufacturing a processed product.
Background
A cutting device has been used to cut and singulate electronic components such as a resin-sealed substrate, but a dicing device is known, for example, as shown in patent document 1.
In the dividing device, a workpiece carrying-in member moves in a Y-axis direction to convey the package substrate to a holding table, and the holding table is moved in a machining feed direction (X-axis direction) while the package substrate is cut by a cutting blade to divide the package substrate into chip size packages (Chip Scale Package, CSP). In the cutting, cutting water is supplied from a cutting water supply nozzle to a cutting portion using a cutting blade. In addition, the dividing apparatus includes a bulk storage unit that stores a plurality of Chip Scale Packages (CSPs) in bulk in a chip storage container for downsizing compared to a structure in which the plurality of CSPs are arranged and stored in a tray.
Prior art literature
Patent literature
Patent document 1: japanese patent No. 5947010
However, in the dividing device, not only the package substrate is conveyed in the Y-axis direction, but also the holding table is moved in the machine feed direction (X-axis direction) in order to cut the package substrate, and therefore the occupation area (footprint) of the device becomes large.
In addition, in order to protect the X-axis moving member from machining chips or cutting water generated by cutting, a protection member is required in the X-axis moving member. As the protection member, a bellows member for protecting an X-axis direction moving part, a cover member for protecting the bellows member, and the like are used. As a result, the device structure becomes complicated.
Disclosure of Invention
Problems to be solved by the invention
The present invention has been made to solve the above-described problems, and an object of the present invention is to simplify the structure of the apparatus, reduce the occupied area, and miniaturize the accommodation space for the singulated objects.
Technical means for solving the problems
That is, the processing apparatus of the present invention includes: a processing table for holding an object to be processed; a first holding mechanism that holds the object to be processed in order to convey the object to be processed to the processing table; a processing mechanism for cutting and singulating the object held on the processing table; a storage box for storing the objects to be processed, which are singulated by the processing means, by dropping the objects to be processed; a second holding mechanism that holds the singulated objects for transporting the singulated objects from the processing table to the storage box; a transfer movement mechanism having a common transmission shaft extending in the direction in which the processing table and the storage box are arranged and configured to move the first holding mechanism and the second holding mechanism; and a processing moving mechanism that moves the processing mechanism in a first direction along the transmission axis and a second direction orthogonal to the first direction, respectively, on a horizontal plane.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention thus constituted, the device structure can be simplified, the occupied area can be reduced, and the accommodation space for the singulated objects can be miniaturized.
Drawings
Fig. 1 is a diagram schematically showing the structure of a cutting device according to an embodiment of the present invention.
Fig. 2 is a perspective view schematically showing the cutting table and the peripheral structure thereof according to the embodiment.
Fig. 3 is a view (plan view) schematically showing the structure of the cutting table and its peripheral structure according to the embodiment, as viewed from the Z direction.
Fig. 4 is a view (front view) schematically showing the structure of the cutting table and its peripheral structure according to the embodiment, as viewed from the Y direction.
Fig. 5 is a view (front view) schematically showing the structure of the first holding mechanism and the conveying movement mechanism according to the above embodiment, as viewed from the Y direction.
Fig. 6 is a view (side view) schematically showing the structure of the first holding mechanism and the conveying movement mechanism according to the embodiment, as viewed from the X direction.
Fig. 7 is a view (front view) schematically showing the structure of the second holding mechanism and the conveying movement mechanism according to the embodiment, as viewed from the Y direction.
Fig. 8 is a cross-sectional view schematically showing the structure of the rack and pinion mechanism according to the embodiment.
Fig. 9 is a view (plan view) schematically showing the peripheral structure of the drying table and the storage box according to the embodiment, as viewed from the Z direction.
Fig. 10 is a view (front view) schematically showing the peripheral structure of the drying table and the storage box according to the embodiment, as viewed from the Y direction.
Fig. 11 is a schematic diagram showing the operation of the cutting device according to the embodiment.
Detailed Description
The invention will be described in more detail by way of examples. However, the present invention is not limited by the following description.
As described above, the processing apparatus of the present invention includes: a processing table for holding an object to be processed; a first holding mechanism that holds the object to be processed in order to convey the object to be processed to the processing table; a processing mechanism for cutting and singulating the object held on the processing table; a storage box for storing the objects to be processed, which are singulated by the processing means, by dropping the objects to be processed; a second holding mechanism that holds the singulated objects for transporting the singulated objects from the processing table to the storage box; a transfer movement mechanism having a common transmission shaft extending in the direction in which the processing table and the storage box are arranged and configured to move the first holding mechanism and the second holding mechanism; and a processing moving mechanism that moves the processing mechanism in a first direction along the transmission axis and a second direction orthogonal to the first direction, respectively, on a horizontal plane.
In the above-described processing apparatus, the first holding mechanism and the second holding mechanism are moved by the common transmission shaft extending along the arrangement direction of the processing table and the storage box, and the processing mechanism is moved by the processing moving mechanism in the horizontal plane in the first direction along the transmission shaft and in the second direction orthogonal to the first direction, respectively, so that the object to be processed can be singulated without moving the processing table in the first direction and the second direction. Therefore, the processing table can be moved without using a ball screw mechanism or the like, and a bellows member for protecting the ball screw mechanism or the like and a cover member for protecting the bellows member are not required. As a result, the device structure of the processing device can be simplified.
Further, since the processing table is not moved in the first direction and the second direction in the horizontal plane, the movement space of the processing table and the dead space around the processing table can be reduced, and the occupied area of the processing apparatus can be reduced.
Further, the second holding mechanism holding the singulated objects is conveyed to the housing box, and the singulated objects are dropped from the second holding mechanism and housed in the housing box, so that the housing space can be made smaller than the structure of the previous tray housing. This can reduce the occupied area of the processing device.
As a specific arrangement of the transmission shaft and the processing moving mechanism, it is desirable that the transmission shaft is arranged so as to traverse the processing moving mechanism above the processing moving mechanism.
With this configuration, the first holding mechanism that moves along the transmission shaft can be moved above the processing moving mechanism, and physical interference between the first holding mechanism and the processing moving mechanism can be prevented. Further, the second holding mechanism that moves along the transmission shaft can be moved above the processing moving mechanism, and physical interference between the second holding mechanism and the processing moving mechanism can be prevented.
As a specific embodiment of the second holding mechanism, it is preferable that the second holding mechanism adsorbs and holds the singulated object.
In order to reliably drop the singulated objects from the second holding mechanism to the storage box, it is preferable that the apparatus further include a scraping member for scraping the singulated objects from the second holding mechanism.
In order to reliably scrape off and store the singulated objects in the storage box while the second holding mechanism is moved by the moving conveying mechanism, it is desirable that the scraping member is fixed to the storage box, and the second holding mechanism is moved relative to the scraping member by the conveying moving mechanism, so that the singulated objects are scraped off from the second holding mechanism.
In order to dry the singulated objects, it is preferable that the processing apparatus of the present invention further includes a drying stage for drying the singulated objects.
In the above-described configuration, the conveying moving mechanism moves the second holding mechanism from the processing stage to the drying stage, and from the drying stage to the housing stage.
As a specific embodiment for drying the singulated objects, the processing apparatus of the present invention preferably further includes: a drying mechanism that sprays gas from above the drying table to dry the singulated objects; and a drying moving mechanism that moves the drying mechanism along the drying table.
As a specific embodiment of the drying mechanism, it is desirable that the drying mechanism sprays gas in a moving direction by the drying moving mechanism.
In a specific embodiment of the movement mechanism for moving the processing mechanism at least in the X direction as the first direction and the Y direction as the second direction, the processing movement mechanism preferably includes: an X-direction moving unit for linearly moving the processing mechanism in the X-direction; and a Y-direction moving unit for linearly moving the processing mechanism in the Y-direction, wherein the X-direction moving unit includes: a pair of X-direction guide rails disposed along the X-direction with the processing table interposed therebetween; and a support body that moves along the pair of X-direction guide rails and supports the processing mechanism via the Y-direction moving portion.
In the above configuration, since the pair of X-direction guide rails provided in the X-direction are provided across the processing table, the distance between the pair of X-direction guide rails can be increased. As a result, the influence of the positional displacement of the X-direction guide rails in the Z-direction on the processing can be reduced. That is, the deviation of the orthogonality between the rotary tool (e.g., the insert) and the processing table can be reduced, and the processing accuracy can be improved. In addition, for the X-direction guide rail, a guide rail having a lower specification than before may be used.
The method for producing a processed product using the processing apparatus is also an aspect of the present invention.
< one embodiment of the invention >
An embodiment of the processing device according to the present invention will be described below with reference to the drawings. In addition, any of the drawings shown below is schematically and omitted or exaggerated as appropriate for easy understanding. The same reference numerals are given to the same constituent members, and description thereof is omitted as appropriate.
Integral structure of processing device
The processing apparatus 100 according to the present embodiment is a cutting apparatus that cuts a sealed substrate W, which is an object to be processed, to singulate the sealed substrate W into a plurality of products P, which are processed products.
Here, the sealed substrate W is a substrate to which electronic components such as semiconductor chips, resistor elements, and capacitor elements are connected, and is formed by resin molding at least the electronic components in a resin-sealed manner. As the substrate constituting the sealed substrate W, a lead frame and a printed wiring board may be used, and in addition to these, a semiconductor substrate (including a semiconductor wafer such as a silicon wafer), a metal substrate, a ceramic substrate, a glass substrate, a resin substrate, and the like may be used. In addition, the wiring may or may not be performed on the substrate constituting the sealed substrate W.
The sealed substrate W and the product P of the present embodiment have a structure in which one surface of the substrate is resin-molded. In such a structure, the resin molded surface is a surface of the electronic component connected to the substrate, which is sealed with resin, and is referred to as a "sealing surface" or a "sealing surface". On the other hand, the surface not resin-molded opposite to the surface not resin-molded exposes a lead wire that normally functions as an external connection electrode of the product, and is therefore called a lead wire surface. When the lead is a bump electrode used in an electronic component such as a Ball Grid Array (BGA), the lead may be referred to as a "spherical surface". Further, the surface not subjected to resin molding on the opposite side to the surface subjected to resin molding is also sometimes referred to as a "substrate surface" because no leads are formed. In the description of the present embodiment, the resin molded surface is referred to as a "sealing surface" or a "sealing surface", and the surface not resin molded on the opposite side from the resin molded surface is referred to as a "lead surface".
Specifically, as shown in fig. 1, the cutting device 100 includes: two cutting stages (processing stages) 2A and 2B for holding the sealed substrate W; a first holding mechanism 3 for holding the sealed substrate W so as to convey the sealed substrate W to the cutting stages 2A and 2B; a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting stages 2A and 2B; a second holding mechanism 6 for holding the plurality of products P so as to convey the plurality of products P from the cutting tables 2A and 2B to the storage box 5; the conveying movement mechanism 7 has a common transmission shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6; and a cutting movement mechanism (processing movement mechanism) 8 for moving the cutting mechanism 4 relative to the sealed substrate W held on the cutting stages 2A and 2B. The first holding mechanism 3 and the transfer moving mechanism 7 constitute a transfer mechanism (loader) for transferring the sealed substrate W, and the second holding mechanism 6 and the transfer moving mechanism 7 constitute a transfer mechanism (unloader) for transferring the plurality of products P.
In the following description, directions orthogonal to each other along a plane (horizontal plane) of the upper surfaces of the cutting tables 2A and 2B are respectively referred to as an X direction which is a first direction and a Y direction which is a second direction, and a vertical direction orthogonal to the X direction and the Y direction is referred to as a Z direction. Specifically, the left-right direction in fig. 1 is referred to as the X direction, and the up-down direction is referred to as the Y direction. The X direction is a moving direction of the support 812, and is a direction orthogonal to a longitudinal direction (a direction in which the beam portion extends) of a beam portion (a cross beam portion) in which a pair of leg portions are provided in the door-shaped support 812 (see fig. 2 and 3).
< cutting stage 2A, cutting stage 2B >)
The two cutting tables 2A and 2B are fixedly provided in the X direction, the Y direction, and the Z direction. The cutting table 2A is rotatable in the θ direction by a rotation mechanism 9A provided below the cutting table 2A. The cutting table 2B is rotatable in the θ direction by a rotation mechanism 9B provided below the cutting table 2B.
These two cutting tables 2A and 2B are provided along the X direction on the horizontal plane. Specifically, the two cutting tables 2A and 2B are arranged such that the upper surfaces thereof are on the same horizontal plane (at the same height position in the Z direction) (see fig. 4), and such that the centers of the upper surfaces thereof (specifically, the centers of rotation by the rotation mechanisms 9A and 9B) are on the same straight line extending in the X direction (see fig. 2 and 3).
As shown in fig. 1, two vacuum pumps 10A and 10B for suction holding are disposed corresponding to the two cutting tables 2A and 2B, and the two cutting tables 2A and 2B suction hold the sealed substrate W. Each of the vacuum pumps 10A and 10B is, for example, a water seal type vacuum pump.
Here, since the cutting stages 2A and 2B are fixed in XYZ directions, pipes (not shown) connected from the vacuum pumps 10A and 10B to the cutting stages 2A and 2B can be shortened, pressure loss of the pipes can be reduced, and a decrease in suction force can be prevented. As a result, even in a very small package of, for example, 1mm square or less, the package can be reliably adsorbed to the cutting table 2A and the cutting table 2B. Further, since the decrease in the suction force due to the pressure loss of the piping can be prevented, the capacities of the vacuum pump 10A and the vacuum pump 10B can be reduced, contributing to downsizing and cost reduction.
< first holding mechanism 3 >)
As shown in fig. 1, the first holding mechanism 3 holds the sealed substrate W so as to convey the sealed substrate W from the substrate supply mechanism 11 to the cutting stage 2A and the cutting stage 2B. As shown in fig. 5 and 6, the first holding mechanism 3 includes: the suction head 31 having a plurality of suction units 311 for sucking and holding the sealed substrate W; and a vacuum pump (not shown) connected to the suction portion 311 of the suction head 31. The suction head 31 is moved to a desired position by a transfer moving mechanism 7 or the like described later, and thereby the sealed substrate W is transferred from the substrate supply mechanism 11 to the cutting stage 2A and the cutting stage 2B.
As shown in fig. 1, the substrate supply mechanism 11 includes: a substrate housing section 111 for housing a plurality of sealed substrates W from the outside; and a substrate supply unit 112 for moving the sealed substrate W stored in the substrate storage unit 111 to a holding position RP to be sucked and held by the first holding mechanism 3. The holding position RP is set so as to be aligned with the two cutting tables 2A and 2B in the X direction. The substrate supply mechanism 11 may further include a heating portion 113 for heating the sealed substrate W adsorbed by the first holding mechanism 3 so as to facilitate the adsorption thereof.
< cutting mechanism 4 >)
As shown in fig. 1, 2 and 3, the cutting mechanism 4 as a processing mechanism includes two rotary tools 40 including a blade 41A, a blade 41B, and two spindle portions 42A and 42B. The two spindle portions 42A and 42B are provided such that the rotation axes thereof extend in the Y direction, and the blades 41A and 41B attached to the spindle portions are disposed so as to face each other (see fig. 3). The blades 41A and 41B of the spindle portions 42A and 42B rotate in the plane including the X and Z directions to cut the sealed substrate W held by the cutting tables 2A and 2B. As shown in fig. 4, the cutting device 100 of the present embodiment is provided with a liquid supply mechanism 12, and the liquid supply mechanism 12 includes an injection nozzle 121 that injects cutting water (machining liquid) to suppress frictional heat generated by the blades 41A and 41B. The injection nozzle 121 is supported by a Z-direction moving part 83, for example, which will be described later.
< second holding mechanism 6 >)
As shown in fig. 1, the second holding mechanism 6 holds the plurality of products P so as to convey the plurality of products P from the cutting tables 2A and 2B to the drying table 13 or the storage box 5. As shown in fig. 8, the second holding mechanism 6 includes: the suction head 61 is provided with a plurality of suction parts 611 for sucking and holding a plurality of products P; and a vacuum pump (not shown) connected to the suction part 611 of the suction head 61. Then, the suction head 61 is moved to a desired position by a conveyance moving mechanism 7 or the like described later, whereby the plurality of products P are conveyed from the cutting tables 2A and 2B to the drying table 13, and are conveyed from the drying table 13 to the storage box 5.
< moving mechanism for conveying 7 >)
As shown in fig. 1, the conveyance moving mechanism 7 moves the first holding mechanism 3 at least between the substrate supply mechanism 11 and the cutting tables 2A and 2B, and moves the second holding mechanism 6 at least between the cutting tables 2A and 2B and the storage box 5.
As shown in fig. 1, the conveying movement mechanism 7 includes a common transmission shaft 71, and the common transmission shaft 71 extends in a straight line along the arrangement direction (X direction) of the two cutting tables 2A and 2B and the storage box 5 to move the first holding mechanism 3 and the second holding mechanism 6.
The transmission shaft 71 is provided in the following range: the first holding mechanism 3 is movable to above the substrate supply portion 112 of the substrate supply mechanism 11, and the second holding mechanism 6 is movable to above the housing box 5 (refer to fig. 1). The first holding mechanism 3, the second holding mechanism 6, the cutting table 2A, the cutting table 2B, and the housing box 5 are provided on the same side (near front side) in plan view with respect to the transmission shaft 71. The first cleaning mechanism 18, the second cleaning mechanism 19, and the drying table 13, which will be described later, are also provided on the same side (near front side) with respect to the transfer shaft 71.
As shown in fig. 5, 6, and 8, the conveyance moving mechanism 7 includes: a main moving mechanism 72 that moves the first holding mechanism 3 and the second holding mechanism 6 along the transmission shaft 71 in the X direction; a lifting and moving mechanism 73 for lifting and moving the first holding mechanism 3 and the second holding mechanism 6 in the Z direction relative to the transmission shaft 71; and a horizontal movement mechanism 74 for horizontally moving the first holding mechanism 3 and the second holding mechanism 6 in the Y direction with respect to the transmission shaft 71.
As shown in fig. 5 to 8, the main moving mechanism 72 includes: a common guide rail 721 provided on the transmission shaft 71 and guiding the first holding mechanism 3 and the second holding mechanism 6; and a rack and pinion mechanism 722 for moving the first holding mechanism 3 and the second holding mechanism 6 along the guide rail 721.
The guide rail 721 extends along the transmission shaft 71 in a straight line in the X direction, and is provided in the following range, that is, in the same manner as the transmission shaft 71: the first holding mechanism 3 is movable to above the substrate supply portion 112 of the substrate supply mechanism 11, and the second holding mechanism 6 is movable to above the housing box 5. A slide member 723 is slidably provided on the guide rail 721, and the slide member 723 is provided with the first holding mechanism 3 and the second holding mechanism 6 via the elevating and moving mechanism 73 and the horizontal moving mechanism 74. Here, the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6, but the elevating movement mechanism 73, the horizontal movement mechanism 74, and the slide member 723 are provided separately for each of the first holding mechanism 3 and the second holding mechanism 6.
The rack and pinion mechanism 722 has: the cam rack 722a is shared by the first holding mechanism 3 and the second holding mechanism 6; and a pinion 722b provided on the first holding mechanism 3 and the second holding mechanism 6, respectively, and rotated by an actuator (not shown). The cam rack 722a is provided on the common transmission shaft 71, and can be changed to various lengths by connecting a plurality of cam rack elements. The pinion 722b is provided on the sliding member 723, and is called a so-called roller pinion (roller pin), and includes: a pair of roller bodies 722b1 that rotate together with the rotation shaft of the motor; and a plurality of roller pins 722b2 provided between the pair of roller bodies 722b1 at equal intervals in the circumferential direction and provided so as to be capable of rolling with respect to the roller bodies 722b 1. Since the rack and pinion mechanism 722 of the present embodiment uses the roller pinion, two or more roller pins 722b2 contact the cam rack 722a, and backlash (backlash) does not occur in the forward and reverse directions, so that positioning accuracy is improved when the first holding mechanism 3 and the second holding mechanism 6 are moved in the X direction.
As shown in fig. 5 and 8, the elevating and moving mechanism 73 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6, respectively. As shown in fig. 5 and 6, the elevating and moving mechanism 73 of the first holding mechanism 3 is provided between the transmission shaft 71 (specifically, the main moving mechanism 72) and the first holding mechanism 3, and includes: a Z-direction guide rail 73a provided along the Z-direction; and an actuator portion 73b for moving the first holding mechanism 3 along the Z-direction guide rail 73 a. The actuator portion 73b may be, for example, a ball screw mechanism, an air cylinder, or a linear motor. As shown in fig. 8, the elevating and moving mechanism 73 of the second holding mechanism 6 has the same structure as the elevating and moving mechanism 73 of the first holding mechanism 3.
As shown in fig. 5, 6 and 8, the horizontal movement mechanism 74 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6, respectively. As shown in fig. 5 and 6, the horizontal movement mechanism 74 of the first holding mechanism 3 is provided between the transmission shaft 71 (specifically, the elevating movement mechanism 73) and the first holding mechanism 3, and includes: a Y-direction guide 74a provided along the Y-direction; an elastic body 74b that imparts a force to one side of the Y-direction guide 74a on the first holding mechanism 3; and a cam mechanism 74c that moves the first holding mechanism 3 to the other side of the Y-direction guide 74 a. Here, the cam mechanism 74c uses an eccentric cam, and the movement amount of the first holding mechanism 3 in the Y direction can be adjusted by rotating the eccentric cam by an actuator such as a motor.
As shown in fig. 8, the horizontal movement mechanism 74 of the second holding mechanism 6 has the same structure as the lifting movement mechanism 73 of the first holding mechanism 3. The second holding mechanism 6 may be configured not to have the horizontal movement mechanism 74, or the first holding mechanism 3 and the second holding mechanism 6 may be configured not to have the horizontal movement mechanism 74. Further, the horizontal movement mechanism 74 may use, for example, a ball screw mechanism instead of the cam mechanism 74c, a cylinder, or a linear motor, as in the lifting movement mechanism 73.
< cutting movement mechanism 8 (processing movement mechanism) >)
The cutting movement mechanism 8 linearly moves each of the two spindle portions 42A, 42B independently in the X direction, the Y direction, and the Z direction.
Specifically, as shown in fig. 2, 3, and 9, the cutting movement mechanism 8 includes: an X-direction moving unit 81 that linearly moves the spindle units 42A and 42B in the X-direction; a Y-direction moving section 82 that moves the spindle sections 42A, 42B linearly in the Y-direction; and a Z-direction moving unit 83 that moves the spindle units 42A and 42B linearly in the Z-direction.
The X-direction moving unit 81 is common to the two cutting tables 2A and 2B, and includes, as shown in fig. 2 and 3 in particular: a pair of X-direction guide rails 811 provided along the X-direction with two cutting tables 2A, 2B interposed therebetween; and a support body 812 that moves along the pair of X-direction guide rails 811 and supports the spindle portion 42A and the spindle portion 42B via the Y-direction moving portion 82 and the Z-direction moving portion 83. A pair of X-direction guide rails 811 are provided on the sides of the two cutting tables 2A and 2B provided along the X-direction. The support 812 is, for example, a door-shaped member having a shape extending in the Y direction. Specifically, the support body 812 includes a pair of legs extending upward from the pair of X-direction rails 811, and a beam portion (cross beam portion) that extends in the Y-direction and is supported by the pair of legs.
The support 812 is linearly reciprocated in the X direction on the pair of X-direction guide rails 811 by, for example, a ball screw mechanism 813 extending in the X direction. The ball screw mechanism 813 is driven by a driving source (not shown) such as a servo motor. In addition, the support 812 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
As shown in fig. 3 in particular, the Y-direction moving portion 82 includes: a Y-direction guide rail 821 provided in the support 812 along the Y-direction; and a Y-direction slider 822 moving along the Y-direction guide 821. The Y-direction slider 822 is driven by, for example, a linear motor 823, and linearly reciprocates on a Y-direction rail 821. In the present embodiment, two Y-direction sliders 822 are provided corresponding to the two spindle portions 42A and 42B. Thereby, the two spindle portions 42A, 42B can move in the Y direction independently of each other. In addition, the Y-direction slider 822 may be configured to reciprocate by another linear motion mechanism using a ball screw mechanism.
As shown in fig. 2 to 4, the Z-direction moving unit 83 includes: a Z-direction guide rail 831 provided along the Z-direction in each Y-direction slider 822; and a Z-direction slider 832 moving along the Z-direction guide rail 831 and supporting the spindle portion 42A and the spindle portion 42B. That is, the Z-direction moving portion 83 is provided corresponding to each of the spindle portions 42A and 42B. The Z-direction slider 832 is driven by an eccentric cam mechanism (not shown), for example, and linearly reciprocates on the Z-direction guide rail 831. In addition, the Z-direction slider 832 may be configured to reciprocate by another linear motion mechanism such as a ball screw mechanism.
As shown in fig. 1 and 4, the positional relationship between the cutting movement mechanism 8 and the transmission shaft 71 is such that the transmission shaft 71 passes across the cutting movement mechanism 8 above the cutting movement mechanism 8. Specifically, the transmission shaft 71 is disposed so as to cross the support body 812 above the support body 812, and the transmission shaft 71 and the support body 812 are in a positional relationship intersecting each other.
< machining chip accommodating portion 17 >)
As shown in fig. 1, the cutting device 100 according to the present embodiment further includes a processing chip accommodating portion 17, and the processing chip accommodating portion 17 accommodates processing chips S such as end materials generated by cutting the sealed substrate W.
As shown in fig. 2 to 4, the chip accommodating portion 17 is provided below the cutting tables 2A and 2B, and includes: the guide chute 171 has an upper opening 171X surrounding the cutting table 2A and the cutting table 2B in a plan view; and a collection container 172 for collecting the processing scraps S guided by the guide chute 171. By providing the chip accommodating portion 17 below the cutting tables 2A and 2B, the recovery rate of the chips S can be improved.
The guide chute 171 guides the machining chips S scattered or dropped from the cutting tables 2A and 2B to the collection container 172. In the present embodiment, the upper opening 171X of the guide chute 171 is formed so as to surround the cutting table 2A and the cutting table 2B (see fig. 3), so that the machining chips S are less likely to leak out, and the recovery rate of the machining chips S can be further improved. The guide chute 171 is provided so as to surround the rotation mechanisms 9A and 9B provided below the cutting tables 2A and 2B (see fig. 4), and is configured so as to protect the rotation mechanisms 9A and 9B from the machining chips S and the cutting water.
In the present embodiment, the processing chip storage 17 is shared by the two cutting tables 2A and 2B, but may be provided in correspondence with each of the cutting tables 2A and 2B.
The collection container 172 collects the chips S passing through the guide chute 171 by its own weight, and is provided in the present embodiment so as to correspond to the two cutting tables 2A and 2B, respectively, as shown in fig. 4 and the like. The two collection containers 172 are disposed on the front side of the transfer shaft, and are configured to be detachable from the front side of the cutting device 100 independently. With this configuration, maintainability such as disposal of the machining chips S can be improved. The recovery container 172 may be provided entirely below all the cutting stages, or may be divided into three or more pieces depending on the size of the sealed substrate W, the size and amount of the chips S, and workability.
As shown in fig. 4 and the like, the chip accommodating portion 17 includes a separating portion 173 for separating the cutting water from the chips. As a configuration of the separation portion 173, for example, a filter such as a perforated plate that allows cutting water to pass through is provided on the bottom surface of the recovery vessel 172. The separation unit 173 does not collect the machining chips S when the cutting water is stored in the collection container 172.
< first cleaning mechanism 18 >)
As shown in fig. 1 and 5, the cutting apparatus 100 of the present invention further includes a first cleaning mechanism 18, and the first cleaning mechanism 18 cleans the upper surface sides (lead surfaces) of the plurality of products P held on the cutting tables 2A and 2B. The first cleaning mechanism 18 cleans the upper surface side of the product P by spraying a cleaning liquid and/or compressed air to the upper surfaces of the plurality of products P held on the cutting tables 2A and 2B through a spraying nozzle 18a (see fig. 5).
As shown in fig. 5, the first cleaning mechanism 18 is configured to be movable along the transmission shaft 71 together with the first holding mechanism 3. Here, the first cleaning mechanism 18 is provided to a slide member 723, and the slide member 723 slides on a guide rail 721 provided to the transmission shaft 71. Here, between the first cleaning mechanism 18 and the slide member 723, a lifting movement mechanism 181 for lifting and moving the first cleaning mechanism 18 in the Z direction is provided. As the lifting/lowering mechanism 181, for example, a rack and pinion mechanism, a ball screw mechanism, a cylinder, or the like may be used.
< second cleaning mechanism 19 >)
Further, as shown in fig. 1, the cutting device 100 of the present invention further includes a second cleaning mechanism 19, and the second cleaning mechanism 19 cleans the lower surface side (package surface) of the plurality of products P held by the second holding mechanism 6. The second cleaning means 19 is provided between the cutting stage 2B and the storage box 5 (more specifically, a drying stage 13 described later), and sprays cleaning liquid and/or compressed air onto the lower surfaces of the plurality of products P held by the second holding means 6, thereby cleaning the lower surface side of the products P. That is, the second cleaning mechanism 19 cleans the lower surface side of the product P in the middle of the movement of the second holding mechanism 6 along the transfer shaft 71.
< drying function of cutting device 100 >)
The cutting device 100 of the present embodiment has a function of further drying the plurality of products P cleaned by the second cleaning mechanism 19. Specifically, as shown in fig. 1, 9, and 10, the cutting device 100 includes: a drying stage 13 for drying the plurality of products P; a drying mechanism 14 that dries the plurality of products P placed on the drying table 13; and a drying moving mechanism 15 for moving the drying mechanism 14 along the drying table 13.
The drying table 13 carries and places a plurality of products P by the second holding mechanism 6 and the carrying moving mechanism 7. The drying table 13 adsorbs and holds a plurality of products P. The drying table 13 is arranged in a row along the X direction on the horizontal plane with the two cutting tables 2A and 2B. The drying table 13 of the present embodiment has a rectangular shape in plan view, but may have other shapes.
The drying mechanism 14 sprays compressed air as a gas from above the drying table 13, and dries the plurality of products P adsorbed and held on the drying table 13. The drying mechanism 14 includes an injection nozzle 14a for injecting compressed air toward the plurality of products P held on the drying table 13. The spray nozzle 14a of the present embodiment has a slit-shaped opening (see fig. 9) extending in a straight line and provided toward the drying stage 13, but may have a plurality of openings intermittently provided along the X direction.
The drying mechanism 14 of the present embodiment is configured to spray compressed air in a moving direction by the drying moving mechanism 15 (see fig. 9). That is, the injection direction of the compressed air by the injection nozzle 14a is directed in the moving direction (here, from the front side to the rear side in the Y direction) by the drying moving mechanism 15.
As shown in fig. 9, the spray nozzles 14a of the drying mechanism 14 are disposed obliquely, for example, at an angle of less than 30 degrees, with respect to the direction of arrangement of the plurality of products P held on the drying table 13 along the X direction. Here, in the drying stage 13, the plurality of products P are arranged in a matrix in the X direction and the Y direction, and the injection nozzles 14a of the drying mechanism 14 inject the compressed air obliquely to one side of each product P along the X direction. This facilitates the blowing of moisture accumulated between adjacent products P away from the products P. Thereby, drying of the plurality of products P is promoted. In addition, the slit-shaped opening of the spray nozzle 14a of the drying mechanism 14 may be provided so as to be slightly inclined toward the drying table 13, so that the compressed air is blown away in the moving direction of the drying mechanism 14.
The drying moving mechanism 15 moves the drying mechanism 14 in the Y direction above the drying table 13. The drying moving mechanism 15 of the present embodiment moves the drying mechanism 14 back and forth in the Y direction with respect to the drying table 13. Specifically, as shown in fig. 9 and 10, the drying moving mechanism 15 includes: a Y-direction guide rail 151 extending in the Y-direction; a slide member 152 that moves along the Y-direction guide 151 and holds the drying mechanism 14; and a driving unit (not shown) for moving the slide member 152 along the Y-direction guide rail 151. Further, as the driving portion, for example, a ball screw mechanism, a cylinder, or a linear motor may be used.
< one example of drying action >
Next, a drying operation by the drying mechanism 14 and the drying moving mechanism 15 will be described.
Before the plurality of products P are placed on the drying table 13, the drying moving mechanism 15 withdraws the drying mechanism 14 to one side (for example, the near front side) of the drying table 13 in the Y direction so as not to interfere with the placement of the plurality of products P. When a plurality of products P are placed and held on the drying table 13, the drying mechanism 14 starts to inject compressed air, and the drying moving mechanism 15 moves the drying mechanism 14 to the other side (for example, the back side) in the Y direction. Thereby, the plurality of products P held on the drying table 13 are dried. When the drying moving mechanism 15 moves the drying mechanism 14 from the other side (back side) in the Y direction to one side (near front side) in the Y direction, the drying mechanism 14 stops the injection of the gas. The drying mechanism 14 may be configured to inject compressed air not only in the forward path but also in the backward path.
< storage case 5 and scraping member 16 >)
As shown in fig. 1, 9, and 10, the storage box 5 stores a plurality of products P in a scattered state (so-called bulk storage). The storage box 5 and the two cutting tables 2A and 2B are arranged in a row along the X direction on the horizontal plane. The housing box 5 further includes a scraping member 16 that scrapes the plurality of products P from the second holding mechanism 6.
The housing box 5 has an upper opening 5X (see fig. 9) having a rectangular shape in a plan view. The scraping member 16 is fixed to one side of the upper opening 5X of the housing box 5. By moving the second holding mechanism 6 in the X direction relative to the scraping member 16, the product P is scraped off and dropped and stored in the storage box 5.
The housing box 5 of the present embodiment is provided between the drying table 13 and the board housing portion 20 for housing and holding boards (not shown) in the X direction, and the scraping member 16 is provided on one side of the drying table 13 side in the upper opening 5X of the housing box 5. Thus, the second holding mechanism 6 is configured not to interfere with the board storage portion 20 when the product P is scraped off.
The holding plates stored in the plate storing section 20 are used to hold the sealed substrate W or the product P, and include, for example, a cutting stage 2A for cutting the sealed substrate W, a holding plate for the cutting stage 2B, a holding plate for the drying stage 13 for drying the product P, and a holding plate for the second holding mechanism 6 for holding the product P for conveying the product P.
The scraping member 16 extends upward from the side of the upper opening 5X on the drying table 13 side (see fig. 9). The scraping member 16 may be a member that scrapes the product P that does not leave the second holding mechanism 6 after the adsorption release, and may be a member that is made of a resin such as a polyetheretherketone (poly ether ether ketone, PEEK) material, and may be a brush shape or a flat plate shape.
In the present embodiment, the housing case 5 is disposed on the front side of the transmission shaft 71, and a handle 51 (see fig. 9) is provided on the outer surface of the front side of the housing case 5 and is configured to be removable from the front side of the cutting device 100. With this structure, maintainability of the product P such as removal and recovery can be improved. The direction of taking out the storage box 5 is not limited to the near side, and may be, for example, a structure taken out from the lateral side of the cutting device 100 or a structure taken out from the rear side.
< example of the operation of the cutting device 100 >
Next, an example of the operation of the cutting device 100 will be described. Fig. 11 shows a movement path of the first holding mechanism 3 and a movement path of the second holding mechanism 6 during operation of the cutting device 100. In the present embodiment, all operations and controls of the cutting device 100, such as the conveyance of the sealed substrate W, the cutting of the sealed substrate W, the drying of the product P, and the scraping operation of the product P, are performed by the control section CTL (see fig. 1).
The substrate supply section 112 of the substrate supply mechanism 11 moves the sealed substrate W accommodated in the substrate accommodation section 111 toward the holding position RP held by the first holding mechanism 3.
Next, the transfer moving mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 suctions and holds the sealed substrate W. Thereafter, the transfer moving mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting tables 2A and 2B, and the first holding mechanism 3 releases the suction and holding, and places the sealed substrate W on the cutting tables 2A and 2B. At this time, the position of the sealed substrate W in the X direction is adjusted by the main moving mechanism 72, and the position of the sealed substrate W in the Y direction is adjusted by the horizontal moving mechanism 74. The sealed substrate W is sucked and held by the cutting stages 2A and 2B.
Here, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting stage 2B, the lifting/lowering movement mechanism 73 lifts the first holding mechanism 3 to a position where physical interference with the cutting movement mechanism 8 (support 812) does not occur. When the first holding mechanism 3 holding the sealed substrate W is moved to the cutting stage 2B, the first holding mechanism 3 does not need to be lifted up or down as described above when the support 812 is retracted from the cutting stage 2B to the drying stage 13.
In this state, the cutting moving mechanism 8 moves the two spindle portions 42A and 42B in the X direction and the Y direction in order, and cuts the sealed substrate W into a lattice shape and singulates the same by rotating the cutting stages 2A and 2B.
After the cutting, the first cleaning means 18 is moved by the conveying moving means 7 to clean the upper surfaces (lead surfaces) of the plurality of products P held on the cutting tables 2A and 2B. After the cleaning, the conveyance moving mechanism 7 retracts the first holding mechanism 3 and the first cleaning mechanism 18 to predetermined positions.
Next, the conveying moving mechanism 7 moves the second holding mechanism 6 to the cut-off tables 2A and 2B after cutting, and the second holding mechanism 6 suctions and holds the plurality of products P. Thereafter, the conveying moving mechanism 7 moves the second holding mechanism 6 holding the plurality of products P to the second cleaning mechanism 19. Thereby, the second cleaning mechanism 19 cleans the lower surface side (package surface) of the plurality of products P held by the second holding mechanism 6.
After cleaning, the transfer moving mechanism 7 moves the second holding mechanism 6 to the drying table 13, and the second holding mechanism 6 releases the suction holding, and places the plurality of products P on the drying table 13. Then, the drying table 13 holds the sealed substrate W by suction. At this time, the conveying movement mechanism 7 withdraws the second holding mechanism 6 to a position where the movement of the drying mechanism 14 is not hindered.
In this state, the drying moving mechanism 15 moves the drying mechanism 14 back and forth in the Y direction, and the drying mechanism 14 ejects compressed air, thereby drying the plurality of products P. The number of trips of the drying mechanism 14 by the drying moving mechanism 15 may be set as appropriate, and may be one time or a plurality of times.
After drying, the conveying moving mechanism 7 moves the second holding mechanism 6 to the drying table 13, and the second holding mechanism 6 suctions and holds the plurality of products P from the drying table 13. Thereafter, the conveying moving mechanism 7 moves the second holding mechanism 6 holding the plurality of products P to the storage box 5.
Then, the second holding mechanism 6 releases the suction holding of the plurality of products P above the upper opening 5X of the housing box 5. Thereafter, the conveying moving mechanism 7 moves the second holding mechanism 6 to the drying stage 13 with respect to the scraping member 16 so that the product P remaining in the second holding mechanism 6 without falling from the second holding mechanism 6 contacts the scraping member 16. In the present embodiment, in order to reliably scrape off the product P, the second holding mechanism 6 is moved relative to the scraping member 16 so that the scraping member 16 contacts the suction surface, i.e., the lower surface of the second holding mechanism 6. Thereby, the plurality of products P are dropped and stored in the storage box 5.
Effect of the present embodiment >
According to the cutting device 100 of the present embodiment, the first holding mechanism 3 and the second holding mechanism 6 are configured to be moved by the cutting movement mechanism 8 in the X direction and the Y direction along the transfer shaft 71 by the common transfer shaft 71 extending along the arrangement direction of the cutting stage 2A, the cutting stage 2B, and the housing box 5, and therefore the sealed substrate W can be singulated without moving the cutting stage 2A and the cutting stage 2B in the X direction and the Y direction. Therefore, the cutting tables 2A and 2B can be moved without using a ball screw mechanism or the like, and a bellows member for protecting the ball screw mechanism or the like and a cover member for protecting the bellows member are not required. As a result, the device structure of the cutting device 100 can be simplified.
Further, since the cutting tables 2A and 2B are not moved in the X direction and the Y direction, the space for moving the cutting tables 2A and 2B and the dead space around the same can be reduced, and the occupied area of the cutting device 100 can be reduced.
Further, the second holding mechanism 6 holding the plurality of products P is conveyed to the housing box 5, and the plurality of products P are dropped from the second holding mechanism 6 and housed in the housing box 5, so that the housing space can be made smaller than the conventional tray housing structure. This also reduces the occupied area of the cutting device 100.
< other variant embodiments >)
Furthermore, the present invention is not limited to the embodiments.
For example, in the above embodiment, the drying table 13 is provided, but the drying table 13 may not be provided.
The following structure may be used: without the scraping member 16, after the desorption holding by the second holding mechanism 6, the gas is ejected from the second holding mechanism 6, whereby the plurality of products P are dropped.
Further, in addition to the structure for fixing the scraping member 16 to the housing box 5, the scraping member 16 may be fixed to another member, or the following structure may be adopted: the scraping member 16 is configured to be movable, and the scraping member 16 moves relative to the second holding mechanism 6, thereby scraping the plurality of products P.
In the above embodiment, the cutting device of the double-table type and double-spindle structure has been described, but the cutting device is not limited to this, and may be a cutting device of a single-table type and single-spindle structure, a cutting device of a single-table type and double-spindle structure, or the like.
Further, since the cam rack elements constituting the transmission shaft 71 may be configured by connecting a plurality of cam rack elements, for example, the cutting device (processing device) 100 may be configured as a module that can be separated and connected (detachable) between the second cleaning mechanism 19 and the drying table 13. In this case, for example, a module for inspecting the product P may be added between the module on the second cleaning mechanism 19 side and the module on the drying table 13 side. In addition to the configuration illustrated here, the cutting device (processing device) 100 may be configured as a module that can be separated and connected (detachable) at a location, or an additional module may be configured as a module for various functions other than inspection.
In addition, the present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the scope of the present invention.
Industrial applicability
According to the present invention, the device structure can be simplified, the occupied area can be reduced, and the accommodation space for the singulated objects can be miniaturized.
Description of symbols
100: cutting device (processing device)
W: sealed substrate (object)
P: product (processed product)
2A, 2B: cutting table (processing table)
3: first retaining mechanism
4: cutting mechanism (processing mechanism)
5: containing box
6: second holding mechanism
7: moving mechanism for conveying
71: transmission shaft
8: moving mechanism for processing
81: x-direction moving part
82: y-direction moving part
811: a pair of X-direction guide rails
812: support body
13: drying table
14: drying mechanism
15: moving mechanism for drying
16: scraping component

Claims (10)

1. A processing apparatus comprising: a processing table for holding an object to be processed;
a first holding mechanism that holds the object to be processed in order to convey the object to be processed to the processing table;
a processing mechanism for cutting and singulating the object held on the processing table;
a storage box for storing the objects to be processed, which are singulated by the processing means, by dropping the objects to be processed;
A second holding mechanism that holds the singulated objects for transporting the singulated objects from the processing table to the storage box;
a transfer movement mechanism having a common transmission shaft extending in the direction in which the processing table and the storage box are arranged and configured to move the first holding mechanism and the second holding mechanism; and
and a processing moving mechanism that moves the processing mechanism in a first direction along the transfer axis and a second direction orthogonal to the first direction, respectively, on a horizontal plane.
2. The machining apparatus according to claim 1, wherein the transmission shaft is disposed so as to traverse the machining moving mechanism above the machining moving mechanism.
3. The processing apparatus according to claim 1 or 2, wherein the second holding mechanism adsorbs and holds the singulated object.
4. The processing apparatus according to any one of claims 1 to 3, further comprising a scraping member that scrapes the singulated object from the second holding mechanism.
5. The processing apparatus according to claim 4, wherein the scraping member is fixed to the housing box,
The second holding mechanism is moved relative to the scraping member by the conveying moving mechanism, and the singulated object is scraped from the second holding mechanism.
6. The processing apparatus according to any one of claims 1 to 5, further comprising a drying stage for drying the singulated objects,
the transport moving mechanism moves the second holding mechanism from the processing stage to the drying stage and from the drying stage to the housing stage.
7. The processing apparatus of claim 6, further comprising: a drying mechanism that sprays gas from above the drying table to dry the singulated objects; and
and a drying moving mechanism for moving the drying mechanism along the drying table.
8. The processing apparatus according to claim 7, wherein the drying mechanism sprays gas in a movement direction by the drying movement mechanism.
9. The processing apparatus according to any one of claims 1 to 8, wherein the processing movement mechanism includes: an X-direction moving unit that linearly moves the processing mechanism in an X-direction that is the first direction; and a Y-direction moving unit for linearly moving the processing mechanism in a Y-direction as the second direction,
The X-direction moving unit includes: a pair of X-direction guide rails disposed along the X-direction with the processing table interposed therebetween; and a support body that moves along the pair of X-direction guide rails and supports the processing mechanism via the Y-direction moving portion.
10. A method of manufacturing a processed product, using the processing apparatus according to any one of claims 1 to 9.
CN202280044313.XA 2021-07-09 2022-03-08 Processing device and method for manufacturing processed product Pending CN117581335A (en)

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