JP2004235436A - Method and system for separating chip components - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To separate a green sheet cut into chip shape in safety without causing any damage on individual chip components while sustaining the separation rate, and to automate the operation and to save the labor. <P>SOLUTION: The green sheet 80 cut into chip shape is stuck to an adhesive sheet 1 which is then carried to a separating edge section 50 where the green sheet 80 is separated into individual chip components by running the adhesive sheet 1 on a curved surface, and then the chip components are stripped from the adhesive sheet 1 by lowering adhesion thereof at a stripping section 60. Separation of the chip components is accelerated by pressing the green sheet 80 partially and sequentially by means of a roller at a separation accelerating section 40 on this side of the separating edge section 50 thereby applying a shearing force to the cutting part. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a chip component separation method and apparatus for separating a green sheet (unfired ceramic sheet) that has been cut into a chip shape into individual chip components.
[0002]
[Prior art]
Conventionally, in the applicant, a process of placing a laminate green sheet on a mount, cutting the green sheet into a chip shape with a chip cutting machine such as a press cutting machine, and separating it into individual chip parts with a chip separator I was taking. In this case, there were the following problems.
[0003]
(1) The current separation process has a low separation rate, and one worker is working on one separation jig, and there are problems with labor saving, worker safety, work lead time, etc. Remaining.
[0004]
(2) The green sheet mount in the cutting process is also used in the separation process, but it does not necessarily have properties suitable for the separation process. In other words, the paper used for the cutting process is made of ventilated paper, and the vented paper is thin and has no elasticity. However, if a paper board with little elasticity is used in the separation process, almost all the stress generated in the separation process is directly applied to the chip. Adversely affect the product.
[0005]
(3) The property of the mount suitable for the cutting process is that it is required to be non-adhesive in order to avoid deposits on the cutting blade. Bad and hinders automation.
[0006]
In addition, when a press cutting machine is used, there is a problem after chip cutting described below. Conventionally, since a green sheet of a laminated body has to have bonding property between sheets at the time of lamination, a binder is used. Due to the action of this binder, when cutting with a chip cutting machine such as a so-called press cutting machine (a type in which there is no gap between chips during cutting), the cutting process proceeds and the bonding of the chips also proceeds. There is a problem that said. As a result, a state in which two or more chips that should have been cut when the cutting process is completed adheres (Abek). This phenomenon becomes more significant as the chip size becomes smaller and becomes an important problem.
[0007]
In order to solve this problem, the following Patent Document 1 and Patent Document 2 have been proposed as conventional techniques.
[0008]
[Patent Document 1] JP-A-8-330177
[Patent Document 2] JP-A-5-326321
[0009]
The construction method of Patent Document 1 is a method in which a green sheet adhered to an adhesive sheet is cut and separated using a sharp edge and a blade blade (functioning as a scraper).
[0010]
The construction method of Patent Document 2 is a system in which a green sheet adhered to an adhesive sheet is cut, the sheet is wound inside to complete cutting, and then stored in a sheath and separated through a firing furnace.
[0011]
[Problems to be solved by the invention]
The problems in the construction method of Patent Document 1 are as follows.
(1) When cutting with the adhesive sheet attached, the adhesive sheet will completely fix one side of the green sheet, so that the cutting blade volume must escape like a press cutting machine. In this case, the cut shape tends to collapse (particularly in the case of extremely small chip parts).
{Circle around (2)} When a blade blade or the like is used for peeling from the adhesive sheet, there is a high possibility that the chip component is destroyed by the stress received there.
[0012]
Problems in the construction method of Patent Document 2 are as follows.
{Circle around (1)} Like the construction method of Patent Document 1, the tip shape is liable to collapse during cutting.
(2) It is difficult to separate the tiny chips by simply winding the sheet inward.
(3) An inner winding process, a sheath filling process, and a firing process are required, which complicates the process (many manual operations).
[0013]
In the prior art, it is difficult to separate ultra-small chip parts having a size of 0603 (0.6 mm × 0.3 mm × 0.3 mm) or less without breaking them and to increase the separation rate. In addition, in the case of the method considering only separation, there are many elements that require human labor, and it is difficult to save labor such as automation.
[0014]
In view of the above-mentioned points, the present invention allows a green sheet that is cut into a chip shape to be safe without damaging individual chip components (including extremely small chip components to general-shaped chip components), and An object of the present invention is to provide a chip component separation method and apparatus that can be separated without lowering the separation rate (separation process yield) and that are suitable for automation and labor saving.
[0015]
Other objects and novel features of the present invention will be clarified in embodiments described later.
[0016]
[Means for Solving the Problems]
In order to achieve the above object, the chip component separating method according to the first aspect of the present invention transports the pressure-sensitive adhesive sheet to the separation edge portion in a state where the green sheet cut into a chip shape is attached to the pressure-sensitive adhesive sheet. The green sheet is separated into individual chip parts by running the adhesive sheet on a curved surface at the separation edge part, and then the adhesive force of the adhesive sheet is reduced at the peeling part to remove the chip part from the It is characterized by peeling from the adhesive sheet.
[0017]
The chip component separation method according to the second aspect of the present invention is the chip component separation method according to the first aspect, wherein a separation promoting portion is provided in a path for transporting the adhesive sheet having the green sheet attached thereto to the separation edge portion. The green sheets are sequentially pressed partially by a roller and a shearing force is applied to the cutting portion to promote separation of the chip parts.
[0018]
The chip component separating method according to the third aspect of the present invention is characterized in that, in the first or second aspect, the cutting direction of the green sheet is non-parallel and non-perpendicular to the conveying direction of the adhesive sheet.
[0019]
The chip component separation method according to the invention of claim 4 is the method of claim 1, 2, or 3, wherein the cutting direction of the green sheet is non-parallel and non-perpendicular to the moving direction of the roller of the separation promoting portion. It is characterized by.
[0020]
The chip component separating method according to the invention of claim 5 is characterized in that, in claim 1, 2, 3, or 4, the adhesive sheet has an adhesive force that changes according to external parameters such as temperature and light. .
[0021]
The chip component separation method according to the invention of claim 6 is the chip component separation method according to claim 1, 2, 3, 4 or 5, wherein the separation edge portion separates the green sheets into individual chip components. It is characterized by forming a separation gap that can be observed from the outside.
[0022]
The chip component separating apparatus according to the invention of claim 7 is a pressure-sensitive adhesive sheet transport mechanism to which a green sheet cut into a chip shape is attached,
A separation edge portion that is provided in a conveyance path of the pressure-sensitive adhesive sheet by the conveyance mechanism, and separates the green sheet into individual chip parts by running the pressure-sensitive adhesive sheet on a curved surface;
It is provided in the conveyance path of the adhesive sheet that has passed through the separation edge portion, and includes a peeling portion that reduces the adhesive force of the adhesive sheet and separates the chip component from the adhesive sheet. .
[0023]
The chip component separating apparatus according to an eighth aspect of the present invention is the chip component separating apparatus according to the seventh aspect, wherein the chip component separating apparatus is provided on the near side of the separation edge portion in the conveyance path of the pressure-sensitive adhesive sheet, and sequentially presses the green sheets with a roller. It is characterized by including a separation promoting portion that applies a shearing force to the cutting portion.
[0024]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of a chip component separation method and apparatus according to the present invention will be described below with reference to the drawings.
[0025]
A first embodiment of a chip component separation method and apparatus according to the present invention will be described with reference to FIGS. In these drawings, reference numeral 10 denotes a feeding reel portion of a long tape-like adhesive sheet, and 11 denotes a take-up reel portion. The adhesive sheet 1 fed out from the feeding reel portion 10 passes through a guide 12, a reversing guide 13 and the like. The take-up reel unit 11 is configured to take up. Moreover, in order to intermittently feed the adhesive sheet 1, a drive roll unit 14 is provided in the middle of the adhesive sheet conveyance path. The drive roll unit 14 includes a drive roll 15 that is intermittently rotated by a motor or the like and a pressure contact roll 16 that sandwiches the adhesive sheet 1 between the drive rolls 15. The pressure-sensitive adhesive sheet 1 used here is provided with a pressure-sensitive adhesive layer on only one side, and the other side is non-tacky on the substrate surface.
[0026]
As described above, the pressure-sensitive adhesive sheet 1 is transported from the supply reel unit 10 toward the take-up reel unit 11, but is on the conveyance path of the pressure-sensitive adhesive sheet 1 from the supply reel unit 10 to the take-up reel unit 11. Is a supply unit 20 for supplying the laminated green sheet cut into a square chip shape to the adhesive layer side of the adhesive sheet 1, and a recompression unit for ensuring adhesion of the green sheet to the adhesive sheet 1 30. Separation promoting part 40 for promoting the separation into chip parts by pressing the green sheets sequentially and partially by a pressing roller to apply a shearing force to the cutting points, and separating the green sheets into individual chip parts 70 The peeling part 60 which peels the edge part 50 and the chip component 70 from the said adhesive sheet 1 and falls to the chip receiving box 75 is arrange | positioned one by one.
[0027]
The supply unit 20 has a flat bed 21 and a flat receiving plate 22 opposite to the flat bed 21, and at least one of the flat bed 21 and the receiving plate 22 moves up and down so that the facing distance is narrow from the separated state. It has a mechanism that changes to In the illustrated case, the receiving plate 22 is fixed, and the flat bed 21 is driven up and down by an up-and-down means 23 such as an air cylinder. Then, the green sheet 80 placed on the mount 81 and cut in advance into a square chip shape (processed by a chip cutting machine such as a press cutting machine) is placed on the flat bed 21 together with the mount 81, and the adhesive layer faces downward. As an arrangement in which the pressure-sensitive adhesive sheet 1 passes therethrough, the gap between the flat bed 21 and the receiving plate 22 is narrowed and the green sheet 80 is pressed against the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet 1. As a result, the green sheet 80 is supplied to the pressure-sensitive adhesive sheet 1 side, and thereafter, the green sheet 80 is conveyed in a state of being attached to the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet 1. The mount 81 is an underlay sheet used when the green sheet 80 is cut, and is detached from the green sheet 80 at this time. The mount 81 is a material that can be used as an underlay sheet for cutting a green sheet, and any material that can transfer (transfer) the green sheet 80 to the adhesive sheet 1 may be used. For example, a sheet of clean paper or the like having no adhesive force.
[0028]
The recompression bonding part 30 has a set of a receiving roller 31 fixed in position and a pressing roller 32 for pressure bonding. The pressing roller 32 is urged by an urging means 33 such as an air cylinder in a direction in which the pressing roller 32 is pressed against the receiving roller 31. Then, the pressure-bonding process is performed with the pressure-sensitive adhesive sheet 1 having the grease sheet 80 attached between the receiving roller 31 and the receiving roller 31. Thereby, the green sheet 80 transferred to the pressure-sensitive adhesive sheet 1 is pressed from the green sheet surface with a predetermined pressure, and adhesion to the pressure-sensitive adhesive sheet 1 is promoted.
[0029]
As shown in FIGS. 2 to 5, the separation promoting unit 40 is fixed to and supported by a device frame 45 through a cradle block 46, and a fixing plate 41 on the horizontal direction (in FIG. 2, perpendicular to the paper surface). And a cylindrical pressing roller 42 urged by an urging means 43 such as an ascending / descending air cylinder so as to be reciprocally movable and in pressure-contact with the plate 41. The pressing roller 42 can be moved up and down with respect to the plate 41 by an urging means 43 such as a lifting air cylinder.
[0030]
The adhesive sheet 1 to which the green sheet 80 cut into a rectangular chip shape is attached is conveyed onto the fixed plate 41 after the reversing operation by the reversing guide 13 in FIG. At this time, as shown in FIG. 4, the base sheet 2 of the adhesive sheet 1 is on the lower side, the adhesive layer 3 is on the upper side, and further, the gree sheet 80 is attached to the upper side and passes over the fixed plate 41. The plate 41 is a heating plate that is maintained at an appropriate temperature in order to improve the adhesive performance of the adhesive sheet 1 and to soften the green sheet itself. The temperature of the plate 41 is preferably in the range of 50 to 90 ° C. However, when a heat-foamed pressure-sensitive adhesive sheet having a foaming temperature of 90 ° C. (having the property of foaming and reducing the adhesive strength when heated) is used as the pressure-sensitive adhesive sheet 1, the maximum temperature is 70 ° C. or less.
[0031]
Then, the pressing roller 42 moves laterally along the adhesive sheet conveying direction (reciprocates once or a plurality of times) with respect to the grease sheet 80 on the adhesive sheet 1 stopped on the fixed plate 41, The green sheet 80 transferred to the adhesive sheet 1 is partially pressed sequentially from the green sheet surface by a predetermined pressure to promote separation. That is, when the roller 42 moves while pressing on the green sheet 80, the pressing force F acts on the individual chip 70 </ b> A- 1 on the green sheet on which the roller 42 is applied, and is applied onto the adhesive sheet substrate 2. It tries to sink into the adhesive layer 3 (which is an elastically deformable material). On the other hand, the tip 70A-2 on which the roller 42 is not applied is not affected by the applied pressure F. For this reason, a shearing force acts on the cutting portion C at the boundary between the chips 70A-1 and 70A-2, and the separation between the chips is promoted. The moving speed of the roller 42 is 1 mm / S to 50 mm / S, the roller pressing force is 5 N / mm or less (pressure value per 1 mm length at the time of line contact pressing), the roller material is silicon rubber, and its hardness is 50 to 90 °.
[0032]
Here, as shown in FIGS. 3 and 5, when the conveyance direction of the pressure-sensitive adhesive sheet 1 is orthogonal to the center axis direction (or outer peripheral line) of the pressing roller 42, in other words, the movement direction of the roller 42 and the sheet 1. The cutting lines A and B of the green sheet 80 are non-parallel and non-perpendicular to the conveying direction of the adhesive sheet 1, and the cutting line A (the long side of the chip) And the axial direction of the presser roller 42 preferably form a predetermined angle α. The angle α is preferably 20 to 40 °.
[0033]
The reason is that, as shown in the plan view of FIG. 5A, when the cutting line A of the green sheet 80 and the axial direction (or outer peripheral line) of the pressing roller 42 are parallel, the chip 70A along the cutting line A This is because the long side is shear-separated, but the short side of the tip 70A along the cutting line B is not separated. As shown in the plan view of FIG. 5B, a predetermined angle α (0 ° <α <90 ° and preferably 20 ° with respect to the cutting line A of the green sheet 80 where the separation promoting portion 40 is stopped on the plate 41 is used. ≦ α ≦ 40 °), when the pressure roller 42 moves while pressing the green sheet 80 in a state where the angle α is formed, the green sheet 80 is separated over the entire area. Promotion can be done. By providing the angle α, the sides of the tip 70A along the cutting lines A and B are sheared and separated together.
[0034]
3 and FIG. 5B, in order to make the angle α relatively on a plane, the green sheet 80 cut into a square chip shape in the supply unit 20 with respect to the adhesive sheet running direction is used. Then, the cutting lines A and B may be inclined and placed and transferred on a flat surface (on the flat bed 21 in FIG. 1). In that case, the supply unit 20 may be provided with a rotary table that rotates on a plane, and the green sheet 80 cut into a chip shape may be rotated by an angle α.
[0035]
Or, unlike the case shown in the figure, the cutting line A of the green sheet 80 cut into a square chip shape and the conveying direction of the adhesive sheet 1 are orthogonal to each other on the plane, and the pressing roller 42 for promoting separation is used as the adhesive sheet. It may be inclined and moved on the plane by an angle α with respect to one transport direction.
[0036]
When it is desired to increase the separation rate in the separation promoting unit 40, the object is achieved by increasing the pressure of the pressing roller 42, slowing the moving speed of the roller 42, or increasing the number of reciprocations. The plate 41 is heated to a predetermined temperature in order to increase the separation rate. However, heating has the effect of promoting the tip abec at the same time. Therefore, it is desirable to move the green sheet 80 from the plate 41 promptly after the separation promoting operation is completed. The material of the surface of the roller 42 here is preferably a material that does not easily adhere to the adhesive sheet 1.
[0037]
In addition, when the operation of the separation promoting unit 40 is performed on a sheet that does not have a soft layer such as the pressure-sensitive adhesive layer 3, the amount of subsidence of the pressed chip is almost eliminated, so that the separation is hardly promoted. Become.
[0038]
As shown in FIG. 6, the separation edge portion 50 further advances the separation of the green sheet 80 into individual chips 70A, and in order to confirm the separation state, a sharp edge (micro curvature radius Ra) or a small-diameter fixed shaft. The pressure-sensitive adhesive sheet 1 is caused to travel using the curved surface 51 of the body (small radius Ra), and the direction thereof is changed. At this time, a certain tension is applied to the pressure-sensitive adhesive sheet 1, and the chips 70A are separated and separated from each other, and the separation becomes complete.
[0039]
In this case, the sharp edge angle is not particularly defined, but it is desirable to change the radius of curvature of the edge tip or the shaft body radius Ra according to the chip part size, for example, a radius of 3 mm or less. Further, a gap t is formed between the adjacent chips 70 </ b> A by the adhesive force of the adhesive sheet 1 on the separation edge portion 50. _a The tension of the pressure-sensitive adhesive sheet 1 is adjusted so that
[0040]
Also in the separation edge portion 50, as in the case of the separation promoting portion 40, a predetermined angle α is given between the cutting line A of the green sheet 80 and the traveling direction of the adhesive sheet 1. That is, when passing through a curved surface 51 made of a sharp edge or a small-diameter fixed shaft body of the separation edge portion 50, a gap is formed on the cutting surfaces (both cutting lines A and B) of all adjacent chips. A predetermined angle α (20 to 40 °) is provided between the cutting line A of the green sheet 80 and the direction of the separation edge portion 50. Since the separation gap is formed on both sides of the long side and the short side of the chip 70A by the angle α, the effect that the chips are separated by both the long side and the short side of the chip due to the circular arc difference between the outer periphery and the inner periphery is obtained. Separation can be performed automatically. Further, the separation state of each chip can be confirmed by visual observation or observation by an imaging unit over the entire circumference of the chip from the direction facing the curved surface of the separation edge portion 50 by this separation gap.
[0041]
Further, the peeling portion 60 provided at the rear stage of the separation edge portion 50 (downstream side of the adhesive sheet conveyance path) has a radius of curvature Rb (Rb> Ra, preferably 6 mm ≦ which can create a gap so that the chips do not reattach to each other. Heating, cooling, irradiation (including ultraviolet rays and infrared rays) for reducing the adhesive force of the adhesive sheet 1 while moving the adhesive sheet 1 on the curved surface 61 (Rb ≦ 30 mm) to change the green sheet 80 side downward A means for reducing the adhesive strength for performing the above-mentioned treatment. The chip component 70 is separated from the adhesive sheet 1 in a state where the chip component 70 is reliably separated from the grease sheet 80 by the process of reducing the adhesive force of the adhesive sheet 1 by the adhesive strength reducing means. For example, if the pressure-sensitive adhesive sheet 1 is a heat-foamed pressure-sensitive adhesive sheet whose adhesive strength is reduced by heating, a peeling heater as a means for reducing the adhesive strength is built in the peeling portion 60 to heat the curved surface 61 through which the pressure-sensitive adhesive sheet 1 passes. .
[0042]
If the pressure-sensitive adhesive sheet 1 is a heat-foamed pressure-sensitive adhesive sheet whose adhesive strength is reduced by heating, the green sheet 80 cut into a square chip shape passes through the curved surface 61 heated by the heater of the peeling part 60. When the adhesive force of 1 is reduced, the individual chip state, that is, the chip component 70 falls into the chip receiving box 75. The curved surface 61 of the peeling part 60 has a gap t between adjacent chips so as not to promote the averaging between the chips when heating. _b Is set to the radius of curvature Rb at which is formed. Further, when the green sheet 80 stops at this portion, there is a possibility that even the chip of the green sheet 80 not along the curved surface 61 is peeled due to the heat transfer effect. Since the chip at this time is peeled off from the pressure-sensitive adhesive sheet 1 in a state where the Abek state is promoted, it is difficult to obtain a chip component 70 that is reliably separated as an individual product. In order to prevent this phenomenon, when passing the heated curved surface 61 of the peeling unit 60, the green sheet has a temperature and a conveying speed at which the chip component 70 peels on the curved surface, and does not stop. It is necessary to pass 80 sheets.
[0043]
As a specific example of the pressure-sensitive adhesive sheet 1 that can be used, there is a thermal foam release sheet (for example, Riva Alpha manufactured by Nitto Denko Corporation), and its specifications are as follows.
Adhesive strength: 3.7N or 4.9N / 20mm (before foaming)
0.05N / 20mm or less (after foaming)
Foaming temperature: 90 ° C or 120 ° C
Moreover, the peeling temperature (temperature of the curved surface 61) in the peeling part 60 is set to 90-110 degreeC when the foaming temperature of an adhesive sheet is 90 degreeC, and is set to 120-140 degreeC when the foaming temperature is 120 degreeC. do it.
[0044]
The overall operation in the case of the first embodiment will be described.
[0045]
The pressure-sensitive adhesive sheet 1 is fed out from the feeding reel unit 10, conveyed so as to run intermittently by the drive roll unit 14, and taken up by the take-up reel unit 11. A green sheet 80 cut into a square chip shape by a chip cutting machine such as a cutting machine is supplied to the pressure-sensitive adhesive layer 3 side of the pressure-sensitive adhesive sheet 1 in the supply unit 20, where the green sheet 80 adheres to the pressure-sensitive adhesive sheet 1. Can be transferred to this.
[0046]
With the intermittent running of the pressure-sensitive adhesive sheet 1, the gree sheet 80 passes through the recompression bonding section 30, where the green sheet 80 is pressed against the pressure-sensitive adhesive layer 3 side of the pressure-sensitive adhesive sheet 1 to promote close contact with the pressure-sensitive adhesive sheet 1.
[0047]
After the pressure-sensitive adhesive sheet 1 and the green sheet 80 attached thereto pass through the recompression bonding section 30, the pressure-sensitive adhesive sheet 1 is reversed by the reversing guide 13 and travels in a state where the green sheet 80 is on the upper side of the pressure-sensitive adhesive sheet 1. As a result, the separation of each chip is promoted by sequentially applying a predetermined pressure from the green sheet surface by the lateral movement of the pressing roller 42 (a shear force is applied in the thickness direction to the chip cutting portion C in FIG. 4). Added).
[0048]
Then, the pressure-sensitive adhesive sheet 1 and the grease sheet 80 that have reached the separation edge 50 pass through the curved surface 51 of the sharp edge (small curvature radius Ra) or the fixed small-diameter shaft body (minute radius Ra) of the separation part 51 and change direction. Then, the separation is further advanced, and then the process of reducing the adhesive force of the pressure-sensitive adhesive sheet 1 is performed while traveling the peeling portion 60 having a radius of curvature Rb that can create a gap so that the chips do not reattach. Then, it is separated into individual chip components 70 and peeled off from the adhesive sheet 1 and dropped into the chip receiving box 75.
[0049]
According to the first embodiment, the following effects can be obtained.
[0050]
(1) Separation / separation without using a blade blade such as a blade blade, which is not a method using a blade blade of the conventional method (the above-mentioned Patent Document 1, etc.) when separating a microchip component. The method can be realized. In the conventional method, when trying to increase the separation rate, there is a risk that an excessive external force and stress may be applied to the chip. Particularly in the case of extremely small size chips, excessive stress leads to chip breakage and yield in the separation process decreases. According to the present embodiment, since the chip is not damaged, the yield in the separation process is increased, and in particular, the separation rate of the extremely small chip component is greatly improved.
[0051]
(2) By arranging the cutting lines A and B of the cut green sheet 80 at a predetermined angle α with respect to the conveying direction of the adhesive sheet 1, the sharp edge of the separating edge portion 50 or the curved surface of the small-diameter shaft body When passing through 51, the separation state between chips can be easily detected by visual observation or imaging means such as a camera.
[0052]
(3) In the separation promoting unit 40, the cutting has been completed by setting the cutting direction (cutting line A or B) of the cut green sheet 80 to be non-parallel and non-perpendicular to the moving direction of the pressing roller 42. Chip separation along both cutting lines A and B of the green sheet 80 can be promoted.
[0053]
(4) The green sheet 80 cut into a chip shape can be conveyed in the order of the separation promoting part 40, the separation edge part 50, and the peeling part 60 by the reel-type adhesive sheet 1, and particularly a very small chip part such as 1005 (1.0 mm) × 0.5 mm × 0.5 mm) size, 0603 (0.6 mm × 0.3 mm × 0.3 mm) size, 0402 (0.4 mm × 0.2 mm × 02 mm) size Suitable for separation and peeling processing of chip parts, etc. ing.
[0054]
FIG. 7 shows a second embodiment of the present invention. In this case, the separation edge portion 50 travels the adhesive sheet 1 using the outer peripheral surface 52 of the small-diameter rotating shaft (small radius Ra) as a curved surface and changes its direction. At this time, a certain tension is applied to the pressure-sensitive adhesive sheet 1, and the chips 70A are separated and separated from each other, and the separation becomes complete. Here, it is desirable to change the shaft body radius Ra according to the chip component size, for example, a radius of 3 mm or less. Further, a gap t is formed between the adjacent chips 70 </ b> A by the adhesive force of the adhesive sheet 1 on the separation edge portion 50. _a The tension of the pressure-sensitive adhesive sheet 1 is adjusted so that
[0055]
In addition, the peeling portion 60 provided at the subsequent stage of the separation edge portion 50 has a gap t between adjacent chips. _b A pressure-sensitive adhesive sheet is formed on the outer peripheral surface 62 of a rotating cylinder or a cylindrical body having a circumferential surface with a radius of curvature Rb (Rb> Ra, preferably 6 mm ≦ Rb ≦ 30 mm) as a curved surface that does not re-adhere when formed. 1 is moved to change the green sheet 80 side downward, and has adhesive pressure lowering means for performing processing such as heating, cooling, and irradiation of light (including ultraviolet rays and infrared rays) to reduce the adhesive strength of the adhesive sheet 1. . The chip component 70 is separated from the adhesive sheet 1 in a state where the chip component 70 is reliably separated from the grease sheet 80 by the process of reducing the adhesive force of the adhesive sheet 1 by the adhesive strength reducing means. For example, if the pressure-sensitive adhesive sheet 1 is a heat-foamed pressure-sensitive adhesive sheet whose adhesive strength is reduced by heating, a peeling heater is built in the rotating cylinder or column of the peeling portion 60 to heat the outer peripheral surface 62 through which the pressure-sensitive adhesive sheet 1 passes. .
[0056]
Other configurations in the second embodiment are the same as those in the first embodiment described above, and the same or corresponding parts are denoted by the same reference numerals and description thereof is omitted.
[0057]
In the second embodiment of FIG. 7, both the separation edge part 50 and the peeling part 60 rotate, but either one may have a fixed structure as shown in FIG. 6.
[0058]
Note that the mount of clean paper or the like used at the time of cutting the green sheet is in the form of an individual piece, that is, a single sheet in the embodiment, but depending on the use form in the green sheet cutting machine in the previous process, it is a tape (reel) To reel) may be used.
[0059]
Moreover, in the said 1st and 2nd embodiment, although the adhesive sheet 1 illustrated the case where adhesive force fell by heating, if the adhesive sheet 1 falls adhesive force by cooling, in the peeling part 60, If the pressure-sensitive adhesive sheet 1 is cooled (such as spraying cold air) and the adhesive force is reduced by irradiation with light such as ultraviolet rays and infrared rays, light irradiation treatment may be performed.
[0060]
Although the embodiments of the present invention have been described above, it will be obvious to those skilled in the art that the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the claims.
[0061]
【The invention's effect】
As described above, according to the present invention, a green sheet that has been cut into a chip shape can be safely removed without damaging individual chip components, and the separation rate, that is, the separation / peeling process yield can be reduced. In particular, when applied to the processing of extremely small chip parts, it was difficult to improve the yield of the separation / peeling process with the prior art, and the effect is great.
[Brief description of the drawings]
FIG. 1 is an overall configuration diagram showing a first embodiment of a chip component separation method and apparatus according to the present invention.
FIG. 2 is a side sectional view showing a mechanism of a separation promoting part in the first embodiment.
3A and 3B are diagrams illustrating the separation promoting unit, in which FIG. 3A is a plan view for explaining an operation, and FIG. 3B is a front view for explaining the operation;
FIG. 4 is an enlarged view for explaining the operation of the separation promoting unit.
FIG. 5 shows the relationship between the orientation of the green sheet on the pressure-sensitive adhesive sheet and the central axis direction of the pressing roller in the separation promoting portion, and (A) shows the case where the cutting line A of the green sheet and the central axis of the pressing roller are parallel. (B) shows the case where the cutting line A of the green sheet and the center axis of the pressing roller are non-parallel and non-perpendicular and form a predetermined angle α.
FIG. 6 is an explanatory diagram of a separation edge part and a peeling part in the first embodiment.
FIG. 7 is an explanatory diagram of a separation edge part and a peeling part in a second embodiment of the present invention.
[Explanation of symbols]
1 Adhesive sheet
2 Base material
3 Adhesive layer
10 Feeding roll
11 Winding roll
13 Inversion guide
14 Drive roll section
20 Supply section
21 Flatbed
22 Receiving plate
30 Re-bonding part
31 Receiving roller
32, 42 Pressing roller
40 Separation Promotion Department
41 Fixed plate
50 Separation edge
60 Peeling part
70 chip parts
75 chip receiving box
80 green sheet
81 Mount

Claims (8)

The adhesive sheet is transported to the separation edge portion in a state where the green sheet cut into a chip shape is attached to the adhesive sheet, and the adhesive sheet is run on a curved surface at the separation edge portion to individually move the green sheets. A chip component separation method comprising separating the chip component from the pressure-sensitive adhesive sheet by lowering the adhesive strength of the pressure-sensitive adhesive sheet at a peeling portion. A separation promoting part is provided in a path for conveying the adhesive sheet to which the green sheet is adhered to the separation edge part, and the green sheet is sequentially partially pressed by a roller of the separation promoting part to apply a shearing force to the cutting portion. The chip part separation method according to claim 1, wherein the chip part separation is promoted by acting. The chip component separation method according to claim 1 or 2, wherein a cutting direction of the green sheet is non-parallel and non-perpendicular to a conveyance direction of the adhesive sheet. 4. The chip component separating method according to claim 1, wherein the cutting direction of the green sheet is non-parallel and non-perpendicular to the moving direction of the roller of the separation promoting unit. The chip part separating method according to claim 1, 2, 3, or 4, wherein the adhesive sheet has an adhesive force that varies depending on external parameters such as temperature and light. 6. The chip part separation according to claim 1, wherein the separation edge portion forms a separation gap observable from outside between the chip parts when the green sheet is separated into individual chip parts. Method. A conveyance mechanism for the adhesive sheet to which the green sheet cut into a chip shape is attached,
A separation edge portion that is provided in a conveyance path of the pressure-sensitive adhesive sheet by the conveyance mechanism, and separates the green sheet into individual chip parts by running the pressure-sensitive adhesive sheet on a curved surface;
It is provided in the conveyance path of the adhesive sheet that has passed through the separation edge portion, and includes a peeling portion that reduces the adhesive force of the adhesive sheet and separates the chip component from the adhesive sheet. Chip component separator. 8. The chip according to claim 7, further comprising a separation promoting portion that is provided on a front side of the separation edge portion in the conveyance path of the adhesive sheet and that partially presses the green sheets sequentially with a roller to apply a shearing force to a cutting portion. Parts separator.

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