JPH07201948A - Substrate transferring jig - Google Patents
Substrate transferring jigInfo
- Publication number
- JPH07201948A JPH07201948A JP35046893A JP35046893A JPH07201948A JP H07201948 A JPH07201948 A JP H07201948A JP 35046893 A JP35046893 A JP 35046893A JP 35046893 A JP35046893 A JP 35046893A JP H07201948 A JPH07201948 A JP H07201948A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- stage
- jig
- mounting
- carrying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、液晶用のガラス基板や
フォトマスク用のガラス基板、半導体ウエハなどの基板
を搬送する基板搬送治具に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate carrying jig for carrying substrates such as glass substrates for liquid crystals, glass substrates for photomasks and semiconductor wafers.
【０００２】[0002]
【従来の技術】基板を製造工程や検査工程や計測工程な
どで搬送する場合、一般にピンセットや真空吸着機能付
の真空ピンセットを使用することが多く、また、自動搬
送装置を使用する場合は真空吸着アームなどを使用する
ことが多い。2. Description of the Related Art Tweezers or vacuum tweezers with a vacuum suction function are generally used when a substrate is transported in a manufacturing process, an inspection process, a measurement process, or the like, and a vacuum suction is used when an automatic transfer device is used. Often uses an arm.
【０００３】ところが、ピンセットや真空ピンセットを
使う場合、基板の外周縁に近い箇所の一部を掴んだり吸
着したりするため、搬送時に不安定であり、時には不測
に落としてしまう不都合があり、また、ピンセットで掴
む場合には、基板に傷を付けやすい問題があった。However, when the tweezers or the vacuum tweezers are used, a part of the substrate near the outer peripheral edge is gripped or adsorbed, so that it is unstable at the time of transportation and sometimes drops unexpectedly. However, when grasping with tweezers, there is a problem that the substrate is easily scratched.
【０００４】一方、真空吸着アームを使用する場合、基
板の裏面に接触させて吸着・搬送を行うものが多いた
め、傷を付けたり微小な塵埃が付着したりする問題があ
った。また、計測などのために測定ステージに基板を載
置させたり取り出したりする場合に、真空吸着アームを
基板から離間させて退避するスペースを確保するため、
凹部を測定ステージに形成するといったことが必要にな
り、測定ステージの加工が複雑で高価になる不都合があ
った。更に、そのように測定ステージを加工した場合、
その測定ステージが真空吸着によって基板を保持する構
成のものであるときに、基板に対する吸着面積が減少し
てしまうため、例えば、容量−電圧測定のために表面か
ら電圧を印加するような装置においては、基板にクーロ
ン力が働き、それによって基板に反りを生じて測定精度
が低下するといった問題があった。On the other hand, when a vacuum suction arm is used, there are many cases in which the back surface of the substrate is brought into contact with the suction / transportation, so that there is a problem that scratches or minute dust adheres. In addition, in order to secure a space for separating the vacuum suction arm from the substrate and evacuating it when placing or removing the substrate on the measurement stage for measurement or the like,
Since it is necessary to form the concave portion on the measurement stage, the processing of the measurement stage is complicated and expensive. Furthermore, when the measurement stage is processed in that way,
When the measurement stage is configured to hold the substrate by vacuum suction, the suction area for the substrate is reduced, so for example, in a device that applies a voltage from the surface for capacitance-voltage measurement, However, the Coulomb force acts on the substrate, which causes the substrate to warp and lower the measurement accuracy.
【０００５】そこで、その表面や裏面に極力直接的に接
触せずに基板を搬送できるようにしたものとして、従
来、特開昭５９−２３２４３３号公報に開示されている
ものがあった。In view of this, there has been a conventional one disclosed in Japanese Patent Laid-Open No. 232433/1984, which allows the substrate to be transported without directly contacting the front surface and the back surface thereof.
【０００６】この従来例によれば、底部が開口するとと
もに周方向に所定間隔を隔てて係止孔を形成した筒状枠
内に石英リングを収容し、その石英リングに基板を収め
るとともに、その上方から石英押さえ板で蓋をし、更
に、つまみを一体的に設けた吊り金具を係止孔に係止す
るようにして基板搬送治具を構成している。そして、長
溝と横揺れ防止用のリングとを備えた搬送部材を用い、
長溝をつまみに外嵌係止することにより基板搬送治具を
吊り下げて搬送できるように構成されている。According to this conventional example, the quartz ring is housed in a cylindrical frame having an opening at the bottom and a locking hole formed at a predetermined interval in the circumferential direction, and the substrate is housed in the quartz ring. The substrate transfer jig is constructed by covering the quartz pressing plate from above and further locking the suspending metal fitting integrally provided with the knob in the locking hole. Then, using a conveying member having a long groove and a ring for roll prevention,
The substrate transfer jig can be hung and transferred by externally locking the long groove to the knob.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、上述従
来例の基板搬送治具の場合、搬送部材に保持させるため
に、基板の上方につまみを一体的に設けた吊り金具が設
けられているため、測定ステージに基板を搬送して各種
の性能測定を行うような場合には適用できず、汎用性が
低い欠点があった。However, in the case of the above-mentioned conventional board transfer jig, the hanging metal fitting integrally provided with the knob is provided above the board in order to hold it by the transfer member. This method cannot be applied to the case where the substrate is transported to the measurement stage and various performance measurements are performed, and it has a drawback of low versatility.
【０００８】また、基板の上方において、長溝をつまみ
に外嵌係止するため、そこでの摺接に伴って発生したゴ
ミによって基板が汚染されやすい欠点があった。Further, since the long groove is externally fitted and locked on the knob above the substrate, there is a drawback that the substrate is easily contaminated by dust generated by sliding contact there.
【０００９】本発明は、このような事情に鑑みてなされ
たものであって、請求項１に係る発明の基板搬送治具
は、基板の上方から外れた位置で保持できるようにし
て、基板に対する汚染を防止できるようにすることを目
的とし、また、請求項２に係る発明の基板搬送治具は、
基板載置用のステージに対して昇降させることにより、
基板と離間してステージに基板のみを載置できるように
することを目的とし、また、請求項３に係る発明の基板
搬送治具は、基板載置用のステージに容易に安定載置で
きるようにすることを目的とする。The present invention has been made in view of the above circumstances, and the substrate transfer jig of the invention according to claim 1 can be held at a position separated from above the substrate, For the purpose of preventing contamination, and the substrate transfer jig of the invention according to claim 2 is
By raising and lowering with respect to the stage for mounting the substrate,
The purpose is to allow only the substrate to be placed on the stage while being separated from the substrate, and the substrate transfer jig of the invention according to claim 3 can be easily and stably placed on the stage for placing the substrate. The purpose is to
【００１０】[0010]
【課題を解決するための手段】請求項１に係る発明の基
板搬送治具は、上述のような目的を達成するために、基
板の裏面の外周縁を支持する基板支持部と、基板の外周
端面を基板支持部上に案内するガイド部と、そのガイド
部よりも基板の外方に突出して、基板搬送部材または手
によって把持可能な鍔部とを備えて構成する。In order to achieve the above-mentioned object, a substrate carrying jig of the invention according to claim 1 has a substrate supporting portion for supporting the outer peripheral edge of the back surface of the substrate and an outer periphery of the substrate. A guide portion that guides the end surface onto the substrate support portion, and a flange portion that protrudes outward of the substrate beyond the guide portion and that can be gripped by the substrate transfer member or by the hand are configured.
【００１１】また、請求項２に係る発明の基板搬送治具
は、上述のような目的を達成するために、請求項１に係
る発明の基板搬送治具における基板支持部に、基板載置
用のステージによる支持域よりも大きな貫通穴を設けて
構成する。Further, in order to achieve the above-mentioned object, the substrate carrying jig of the invention according to claim 2 is for mounting a substrate on the substrate supporting portion of the substrate carrying jig of the invention according to claim 1. It is configured by providing a through hole larger than the support area of the stage.
【００１２】また、請求項３に係る発明の基板搬送治具
は、上述のような目的を達成するために、請求項１に係
る発明の基板搬送治具における基板支持部の下方に、基
板載置用のステージに外嵌載置する凹部を設けて構成す
る。Further, in order to achieve the above-mentioned object, the substrate transfer jig of the invention according to claim 3 mounts the substrate below the substrate supporting portion in the substrate transfer jig of the invention of claim 1. A mounting stage is provided with a recess for external mounting.
【００１３】[0013]
【作用】請求項１に係る発明の基板搬送治具の構成によ
れば、ガイド部により基板を基板支持部上に案内して支
持させ、その状態で、ガイド部よりも基板の外方の鍔部
を搬送部材や手によって保持して搬送することができ
る。According to the structure of the substrate transfer jig of the invention of claim 1, the guide portion guides and supports the substrate on the substrate support portion, and in this state, the flange outside the substrate than the guide portion. The part can be held and carried by a carrying member or a hand.
【００１４】また、請求項２に係る発明の基板搬送治具
の構成によれば、基板を基板載置用のステージに載置す
るときに、貫通穴がステージを囲むように位置させた状
態で昇降させることにより、治具から離間させて基板を
ステージ上に載置させる状態と、基板を基板支持部に支
持させて持ち上げる状態とを得ることができる。Further, according to the structure of the substrate transfer jig of the invention of claim 2, when the substrate is mounted on the stage for mounting the substrate, the through hole is positioned so as to surround the stage. By raising and lowering, it is possible to obtain a state in which the substrate is placed on the stage while being separated from the jig, and a state in which the substrate is supported by the substrate supporting portion and lifted.
【００１５】また、請求項３に係る発明の基板搬送治具
の構成によれば、基板を基板載置用のステージに載置す
るときに、凹部をステージに外嵌載置させることによ
り、ステージに対して所定の位置に基板を載置すること
ができる。Further, according to the structure of the substrate transfer jig of the third aspect of the present invention, when the substrate is mounted on the stage for mounting the substrate, the concave portion is externally mounted on the stage to mount the stage on the stage. The substrate can be placed at a predetermined position with respect to.
【００１６】[0016]
【実施例】次に、本発明の実施例を図面を用いて詳細に
説明する。Embodiments of the present invention will now be described in detail with reference to the drawings.
【００１７】＜第１実施例＞図１は、本発明の第１実施
例に係る基板搬送治具の全体斜視図であり、基板１の裏
面の外周縁を支持する基板支持部２の外周に、その全周
にわたって一体的に連ねてガイド部３が設けられるとと
もに、そのガイド部３よりも外方に突出してその全周に
わたって鍔部４が一体的に設けられ、全体が環状の基板
搬送治具Ａが構成されている。<First Embodiment> FIG. 1 is an overall perspective view of a substrate carrying jig according to a first embodiment of the present invention, in which an outer periphery of a substrate supporting portion 2 for supporting an outer peripheral edge of a back surface of the substrate 1 is provided. The guide portion 3 is integrally provided over the entire circumference thereof, and the flange portion 4 is integrally provided over the entire circumference of the guide portion 3 so as to project outward from the guide portion 3 so as to integrally cure the substrate. The ingredient A is configured.
【００１８】基板支持部２には、図２の一部切欠側面図
に示すように、基板載置用のステージ５による支持域よ
りも大きな貫通穴６が形成され、図２および図３の平面
図に示すように、ガイド部３により、基板１の外周端面
を基板支持部２上に案内して基板１の裏面の外周縁を基
板支持部２に支持させ、その状態で屈伸ならびに回転可
能な搬送部材７により鍔部４を把持して基板１を基板搬
送治具Ａと共に搬送し、貫通穴６がステージ５を囲むよ
うに位置させ、その状態で下降させることにより、基板
搬送治具Ａから離間させて基板１のみをステージ５上に
載置させることができるようになっている。As shown in the partially cutaway side view of FIG. 2, the substrate supporting portion 2 is formed with a through hole 6 larger than the supporting area of the stage 5 for mounting the substrate. As shown in the drawing, the guide portion 3 guides the outer peripheral end surface of the substrate 1 onto the substrate supporting portion 2 so that the outer peripheral edge of the back surface of the substrate 1 is supported by the substrate supporting portion 2, and bending and stretching and rotation are possible in that state. The substrate 1 is transported together with the substrate transport jig A by gripping the flange portion 4 by the transport member 7, and the through hole 6 is positioned so as to surround the stage 5, and is lowered in this state, so that the substrate transport jig A is removed. Only the substrate 1 can be placed on the stage 5 while being separated.
【００１９】この第１実施例の基板搬送治具によれば、
図４の一部切欠側面図に示すように、扉８を備えた処理
室９内に搬送部材７で基板１を搬入するときに、ステー
ジ５上に基板１を載置させ、その下方に基板搬送治具Ａ
を下降させてから、基板搬送治具Ａをも処理室９内に残
したままで搬送部材７を処理室９外まで移動させ、扉８
を閉じた状態で基板１を処理できる利点を有している。According to the substrate transfer jig of the first embodiment,
As shown in the partially cut-away side view of FIG. 4, when the substrate 1 is loaded into the processing chamber 9 having the door 8 by the transfer member 7, the substrate 1 is placed on the stage 5 and the substrate is placed below the substrate 1. Transfer jig A
After lowering, the transfer member 7 is moved to the outside of the processing chamber 9 while the substrate transfer jig A is also left inside the processing chamber 9, and the door 8 is moved.
This has the advantage that the substrate 1 can be processed in the closed state.
【００２０】また、基板１を基板搬送治具Ａとともにス
テージ５へ搬送する搬送動作が終了した後は、搬送部材
７は、基板搬送治具Ａから離れて自由に動作を行うこと
ができる。したがって、ステージ５へ搬送したその基板
１の処理が行われている間に、例えば別の処理室にある
他の基板搬送治具Ａを受け取りにいく等の動作を行うこ
とができ、装置全体のスループット向上にも寄与するこ
とができる。After the carrying operation for carrying the substrate 1 together with the substrate carrying jig A to the stage 5 is completed, the carrying member 7 can be freely moved away from the substrate carrying jig A. Therefore, while the substrate 1 transferred to the stage 5 is being processed, it is possible to perform an operation such as going to receive another substrate transfer jig A in another processing chamber. It can also contribute to improvement in throughput.
【００２１】また、図５の一部切欠側面図に示すよう
に、防塵手袋１０をすることにより、手１１で鍔部４を
把持し、基板１に直接的に接触せずに、適宜ステージ５
などに搬送することができる。Further, as shown in the partially cut-away side view of FIG. 5, dust-proof gloves 10 are used to hold the collar portion 4 by the hand 11 and not to directly contact the substrate 1, but the stage 5 appropriately.
Can be transported to.
【００２２】この第１の実施例によれば、基板１を真空
吸着アームにより保持して搬送する場合のように、基板
１の搬入搬出時に真空吸着アームが退避する凹部をステ
ージ５に形成する必要がなく、ステージ５の設計、製作
が容易になるとともに、ステージ５が真空吸着により基
板１を保持するものであっても、十分な吸着面積を確保
でき、十分な吸着力を基板１に与えることができる。According to the first embodiment, it is necessary to form a recess in the stage 5 for retracting the vacuum suction arm when the substrate 1 is carried in and out, as in the case where the substrate 1 is held and transported by the vacuum suction arm. In addition to facilitating the design and manufacture of the stage 5, it is possible to secure a sufficient suction area even if the stage 5 holds the substrate 1 by vacuum suction, and to provide a sufficient suction force to the substrate 1. You can
【００２３】＜第２実施例＞図６は、本発明の第２実施
例に係る基板搬送治具の一部切欠側面図であり、第１実
施例と異なるところは次の通りである。すなわち、下面
と鍔部４との間に、搬送部材７や手１１によって把持す
るための段差が形成され、基板加熱装置の加熱プレート
５ａ上に載置可能に構成され、基板支持部２の厚みｔを
所定の厚みに設定することにより、例えば、基板加熱装
置などに適用するときに、プロキシミティボールなどを
備えないステージ５に対しても、均一加熱用のプロキシ
ミティギャップを確保することができる利点を有してい
る。このように基板加熱装置などに適用する場合には、
基板搬送治具Ａを、炭化硅素などを材質とするセラミッ
ク系材料で成形するのが望ましい。<Second Embodiment> FIG. 6 is a partially cutaway side view of a substrate carrying jig according to a second embodiment of the present invention. The difference from the first embodiment is as follows. That is, a step is formed between the lower surface and the collar 4 for gripping by the carrying member 7 or the hand 11, and is configured to be mountable on the heating plate 5a of the substrate heating device. By setting t to a predetermined thickness, for example, when applied to a substrate heating apparatus or the like, a proximity gap for uniform heating can be secured even for the stage 5 that does not include a proximity ball or the like. Have advantages. When applied to a substrate heating device in this way,
It is desirable that the substrate transfer jig A be formed of a ceramic material such as silicon carbide.
【００２４】＜第３実施例＞図７は、本発明の第３実施
例に係る基板搬送治具の全体斜視図であり、第１実施例
と異なるところは次の通りである。すなわち、環状のプ
レート１２の内周面よりも所定距離離れた箇所に、周方
向に所定間隔を隔てて、ガイド部としての４本のガイド
ピン３ａ…が突設され、ガイドピン３ａ…よりも内周側
が基板支持部２ａに、そして、ガイドピン３ａ…よりも
外周側が鍔部４にそれぞれ形成され、ガイドピン３ａ…
により基板１の外周端面を基板支持部２ａ上に案内する
ように構成されている。<Third Embodiment> FIG. 7 is an overall perspective view of a substrate transfer jig according to a third embodiment of the present invention. The difference from the first embodiment is as follows. That is, four guide pins 3a serving as guide portions project from the inner peripheral surface of the annular plate 12 at a predetermined distance apart from each other at predetermined intervals in the circumferential direction, and are provided more than the guide pins 3a. The inner peripheral side is formed on the substrate supporting portion 2a, and the outer peripheral side is formed on the flange 4 more than the guide pins 3a.
Is configured to guide the outer peripheral end surface of the substrate 1 onto the substrate supporting portion 2a.
【００２５】なお、本実施例では、ガイドピン３ａ…は
４本設けられているが、３本以上設ければ基板１の外周
端面を基板支持部２ａに案内できる。また、貫通穴６の
大きさをステージ５の基板支持域よりも大きくすること
で、第１の実施例と同様の効果が得られる。Although four guide pins 3a ... Are provided in this embodiment, the outer peripheral end face of the substrate 1 can be guided to the substrate supporting portion 2a by providing three or more guide pins. Further, by making the size of the through hole 6 larger than the substrate supporting area of the stage 5, the same effect as that of the first embodiment can be obtained.
【００２６】＜第４実施例＞図８は、本発明の第４実施
例に係る基板搬送治具の一部切欠側面図であり、第１実
施例と異なるところは次の通りである。すなわち、貫通
穴６を無くし、基板支持部２の下方に、ステージ５に外
嵌載置する凹部１３が設けられ、ステージ５に対して位
置決めした状態で、基板搬送治具Ａをステージ５上に安
定載置できるように構成されている。なお、貫通穴６を
形成したまま基板支持部２の下方にステージ５に外嵌載
置する凹部を形成することもできる。<Fourth Embodiment> FIG. 8 is a partially cutaway side view of a substrate carrying jig according to a fourth embodiment of the present invention. The difference from the first embodiment is as follows. That is, the through hole 6 is eliminated, and the concave portion 13 for external fitting and mounting on the stage 5 is provided below the substrate supporting portion 2, and the substrate carrying jig A is placed on the stage 5 in a state of being positioned with respect to the stage 5. It is constructed so that it can be placed stably. It should be noted that it is possible to form a concave portion to be externally mounted on the stage 5 below the substrate supporting portion 2 with the through hole 6 formed.
【００２７】また、第２実施例、第３実施例、第４実施
例においても搬送部材７は、基板１を基板搬送治具Ａと
ともにステージ５や加熱プレート５ａに搬送する搬送動
作が終了した後は、第１実施例と同様に基板搬送治具Ａ
から離れて自由に動作を行うことができる。したがっ
て、例えば、処理が行われている間に別の処理室にある
基板搬送治具Ａを受け取りにいく等の動作を行うことが
でき、装置全体のスループット向上にも寄与することが
できる。Also, in the second, third, and fourth embodiments, the carrying member 7 carries the board 1 together with the board carrying jig A to the stage 5 and the heating plate 5a after the carrying operation is completed. Is the substrate transfer jig A as in the first embodiment.
You can move freely away from. Therefore, for example, while the processing is being performed, it is possible to perform an operation such as receiving the substrate transfer jig A in another processing chamber, which can also contribute to an improvement in the throughput of the entire apparatus.
【００２８】本発明は、円形基板１に限らず、角形の基
板を搬送するように構成するものでも良い。The present invention is not limited to the circular substrate 1, but may be configured to convey a rectangular substrate.
【００２９】[0029]
【発明の効果】以上の説明から明らかなように、請求項
１に係る発明の基板搬送治具によれば、ガイド部により
基板を基板支持部上に案内して支持させた状態で、ガイ
ド部よりも基板の外方の鍔部を保持して搬送できるか
ら、基板の上方から外れた位置で保持でき、基板上にゴ
ミを落下させての汚染を防止して良好に基板を搬送でき
るようになった。As is apparent from the above description, according to the substrate transfer jig of the invention of claim 1, the guide portion guides the substrate onto the substrate supporting portion and supports the substrate. Since the outer flange of the substrate can be held and transported, it can be held at a position deviated from above the substrate, and dust can be dropped onto the substrate to prevent contamination and thus the substrate can be favorably transported. became.
【００３０】また、請求項２に係る発明の基板搬送治具
によれば、基板を基板載置用のステージに載置するとき
に、治具の昇降により治具から容易に離間させて基板の
みを載置できるから、各種の性能測定に際して治具に影
響されることを回避でき、測定精度を向上できるように
なった。According to the substrate transfer jig of the second aspect of the invention, when the substrate is mounted on the substrate mounting stage, the jig is moved up and down to easily separate the jig from the jig. Since it can be mounted, it is possible to avoid the influence of jigs on various performance measurements and improve the measurement accuracy.
【００３１】また、請求項３に係る発明の基板搬送治具
によれば、基板を基板載置用のステージに載置するとき
に、凹部をステージに外嵌載置させてステージに対する
所定の位置に基板を載置することができるから、ステー
ジに基板を容易に安定載置できるようになった。According to the substrate transfer jig of the third aspect of the invention, when the substrate is mounted on the stage for mounting the substrate, the concave portion is externally mounted on the stage and the predetermined position with respect to the stage. Since the substrate can be placed on the stage, the substrate can be easily and stably placed on the stage.
【図１】本発明の第１実施例に係る基板搬送治具の全体
斜視図である。FIG. 1 is an overall perspective view of a substrate carrying jig according to a first embodiment of the present invention.
【図２】一部切欠側面図である。FIG. 2 is a partially cutaway side view.
【図３】平面図である。FIG. 3 is a plan view.
【図４】一部切欠側面図である。FIG. 4 is a partially cutaway side view.
【図５】一部切欠側面図である。FIG. 5 is a partially cutaway side view.
【図６】本発明の第２実施例に係る基板搬送治具の一部
切欠側面図である。FIG. 6 is a partially cutaway side view of a substrate carrying jig according to a second embodiment of the present invention.
【図７】本発明の第３実施例に係る基板搬送治具の全体
斜視図である。FIG. 7 is an overall perspective view of a substrate carrying jig according to a third embodiment of the present invention.
【図８】本発明の第４実施例に係る基板搬送治具の一部
切欠側面図である。FIG. 8 is a partially cutaway side view of a substrate carrying jig according to a fourth embodiment of the present invention.
１…基板 ２…基板支持部 ３…ガイド部 ３ａ…ガイド部としてのガイドピン ４…鍔部 ５…ステージ ６…貫通穴 ７…搬送部材 １１…手 １３…凹部 DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Substrate supporting portion 3 ... Guide portion 3a ... Guide pin as guide portion 4 ... Collar portion 5 ... Stage 6 ... Through hole 7 ... Conveying member 11 ... Hand 13 ... Recessed portion
Claims (3)
部と、 前記基板の外周端面を前記基板支持部上に案内するガイ
ド部と、 前記ガイド部よりも前記基板の外方に突出して、基板搬
送部材または手によって把持可能な鍔部とを備えたこと
を特徴とする基板搬送治具。1. A substrate supporting portion that supports an outer peripheral edge of a back surface of the substrate, a guide portion that guides an outer peripheral end surface of the substrate onto the substrate supporting portion, and a portion that protrudes outward of the substrate from the guide portion. A substrate transfer jig, comprising: a substrate transfer member or a flange that can be held by a hand.
置用のステージによる支持域よりも大きな貫通穴を設け
てある基板搬送治具。2. A substrate carrying jig, wherein the substrate supporting part according to claim 1 is provided with a through hole larger than a supporting area by a stage for mounting a substrate.
基板載置用のステージに外嵌載置する凹部を設けてある
基板搬送治具。3. Below the substrate supporting portion according to claim 1,
A substrate transfer jig in which a recess for external fitting and mounting is provided on a substrate mounting stage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35046893A JPH07201948A (en) | 1993-12-29 | 1993-12-29 | Substrate transferring jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35046893A JPH07201948A (en) | 1993-12-29 | 1993-12-29 | Substrate transferring jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07201948A true JPH07201948A (en) | 1995-08-04 |
Family
ID=18410702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35046893A Pending JPH07201948A (en) | 1993-12-29 | 1993-12-29 | Substrate transferring jig |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07201948A (en) |
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| JP2001068541A (en) * | 1999-08-26 | 2001-03-16 | Tatsumo Kk | Processed substrate tray |
| WO2006035484A1 (en) * | 2004-09-27 | 2006-04-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor manufacturing equipment and semiconductor manufacturing method |
| JP2006332278A (en) * | 2005-05-25 | 2006-12-07 | Miraial Kk | Single-wafer storing container and shock absorption supporting member used for the same |
| JP2007265971A (en) * | 2006-02-28 | 2007-10-11 | Sii Nanotechnology Inc | Wafer holder and sample preparation device |
| JP2009105295A (en) * | 2007-10-25 | 2009-05-14 | Topcon Corp | Wafer holding device |
| WO2010067656A1 (en) * | 2008-12-11 | 2010-06-17 | 三菱重工業株式会社 | Normal-temperature bondong device |
| US7780440B2 (en) | 2004-10-19 | 2010-08-24 | Canon Anelva Corporation | Substrate supporting/transferring tray |
| US7834451B2 (en) | 2005-08-31 | 2010-11-16 | Samsung Mobile Display Co., Ltd. | Film tray for fabricating flexible display |
| JP2011009295A (en) * | 2009-06-23 | 2011-01-13 | Sharp Corp | Device and method for conveyance |
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-
1993
- 1993-12-29 JP JP35046893A patent/JPH07201948A/en active Pending
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|---|---|---|---|---|
| JP2001068541A (en) * | 1999-08-26 | 2001-03-16 | Tatsumo Kk | Processed substrate tray |
| US7994067B2 (en) | 2004-09-27 | 2011-08-09 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor manufacturing equipment with an open-topped cassette apparatus |
| EP1691406A4 (en) * | 2004-09-27 | 2007-12-26 | Mitsubishi Electric Corp | Semiconductor manufacturing equipment and semiconductor manufacturing method |
| WO2006035484A1 (en) * | 2004-09-27 | 2006-04-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor manufacturing equipment and semiconductor manufacturing method |
| EP1691406A1 (en) * | 2004-09-27 | 2006-08-16 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor manufacturing equipment and semiconductor manufacturing method |
| JP4597137B2 (en) * | 2004-09-27 | 2010-12-15 | 三菱電機株式会社 | Semiconductor manufacturing apparatus and semiconductor manufacturing method |
| JPWO2006035484A1 (en) * | 2004-09-27 | 2008-05-15 | 三菱電機株式会社 | Semiconductor manufacturing apparatus and semiconductor manufacturing method |
| CN100405569C (en) * | 2004-09-27 | 2008-07-23 | 三菱电机株式会社 | Semiconductor manufacturing device and semiconductor manufacturing method |
| US7780440B2 (en) | 2004-10-19 | 2010-08-24 | Canon Anelva Corporation | Substrate supporting/transferring tray |
| JP2006332278A (en) * | 2005-05-25 | 2006-12-07 | Miraial Kk | Single-wafer storing container and shock absorption supporting member used for the same |
| JP4644035B2 (en) * | 2005-05-25 | 2011-03-02 | ミライアル株式会社 | Single wafer storage container |
| US7834451B2 (en) | 2005-08-31 | 2010-11-16 | Samsung Mobile Display Co., Ltd. | Film tray for fabricating flexible display |
| JP2007265971A (en) * | 2006-02-28 | 2007-10-11 | Sii Nanotechnology Inc | Wafer holder and sample preparation device |
| JP2009105295A (en) * | 2007-10-25 | 2009-05-14 | Topcon Corp | Wafer holding device |
| WO2010067656A1 (en) * | 2008-12-11 | 2010-06-17 | 三菱重工業株式会社 | Normal-temperature bondong device |
| US8906175B2 (en) | 2008-12-11 | 2014-12-09 | Mitsubishi Heavy Industries, Ltd. | Room temperature bonding apparatus |
| JP2011009295A (en) * | 2009-06-23 | 2011-01-13 | Sharp Corp | Device and method for conveyance |
| KR20160120666A (en) * | 2015-04-08 | 2016-10-18 | 가부시기가이샤 디스코 | Workpiece transporting tray |
| CN106057715A (en) * | 2015-04-08 | 2016-10-26 | 株式会社迪思科 | Workpiece transporting tray |
| JP2016201421A (en) * | 2015-04-08 | 2016-12-01 | 株式会社ディスコ | Transfer tray of work-piece |
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