CN106057715A - Workpiece transporting tray - Google Patents
Workpiece transporting tray Download PDFInfo
- Publication number
- CN106057715A CN106057715A CN201610186899.XA CN201610186899A CN106057715A CN 106057715 A CN106057715 A CN 106057715A CN 201610186899 A CN201610186899 A CN 201610186899A CN 106057715 A CN106057715 A CN 106057715A
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- CN
- China
- Prior art keywords
- machined object
- transport tray
- chuck table
- main body
- box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D1/00—Containers having bodies formed in one piece, e.g. by casting metallic material, by moulding plastics, by blowing vitreous material, by throwing ceramic material, by moulding pulped fibrous material, by deep-drawing operations performed on sheet material
- B65D1/34—Trays or like shallow containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/062—Easels, stands or shelves, e.g. castor-shelves, supporting means on vehicles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0235—Containers
- B65G2201/0258—Trays, totes or bins
Abstract
Provided is a workpiece transporting tray whereby the processing cost of a workpiece can be reduced. The transporting tray (5) has a body frame portion (5a) formed in approximately the same outer shape as that of a conventional ring frame, and an opening portion (5b) is provided in the body frame portion (5a). The opening portion (5b) includes an outer peripheral support portion (5d) for supporting the outer peripheral region on the lower surface side of a workpiece, and a movement restriction portion (5e) for restricting the movement of the workpiece in the planar direction. As a result, when the workpiece is not required to be completely cut, the workpiece can be fixed only by placing the workpiece in the opening portion (5b) of the transporting tray (5) without using an adhesive tape.
Description
Technical field
The present invention relates to the transport tray of machined object.
Background technology
The machined object of the tabulars such as semiconductor wafer is being divided into each device chip or it is being formed segmentation
During groove, use the topping machanism using cutting tool or the laser processing device being processed by laser.Fill at these
In putting, using frame unit to make the conveyance to machined object easy, this frame unit is in the peristome of ring-shaped frame
Across splicing tape (dicing tape), machined object is supported (patent documentation 1).
Patent documentation 1: Japanese Unexamined Patent Publication 2002-110777 publication
But, owing to splicing tape is consumable goods, therefore when the process finishing of machined object, re-start stickup every time,
Therefore there is the problem that processing cost increases.
Summary of the invention
Therefore, the present invention completes in view of above-mentioned problem, its object is to provide a kind of transport tray, it is possible to cut
Subtract the processing cost of machined object.
In order to solve above-mentioned problem and realize purpose, the transport tray of the machined object of the present invention has chucking work
In the processing unit (plant) of platform and tooling member, when carrying out moving into relative to this chuck table by the machined object of tabular
Using this transport tray when going out, wherein, described chuck table has the holding face keeping machined object, institute
State tooling member the machined object being maintained on this chuck table is processed, the transport tray of this machined object
Being characterised by having: ring-type main body frame portion, it has the inner circumferential that the profile of the machined object than this tabular is big；
Peripheral branches bearing portion, its inner circumferential from this main body frame portion is prominent towards center, the periphery to the lower face side of machined object
Region supports；And movement limiting portion, it is formed at the border in this main body frame portion and this peripheral branches bearing portion, right
The movement to direction, face of the placed machined object limits.
Further, in the transport tray of above-mentioned machined object, preferably this processing unit (plant) has: box mounting region, it is right
The box receiving multiple frame unit loads, this frame unit in the opening of ring-shaped frame across splicing tape to being added
Work thing supports；And conveyance component, its by be placed in this box mounting region this box and this chuck table it
Between support this ring-shaped frame and this frame unit transported, this main body frame portion is formed as identical with this ring-shaped frame
External diameter, and this box can be accommodated in.
The transport tray of the machined object of the present invention has: peripheral branches bearing portion, outside it is to the lower face side of machined object
All regions support；And movement limiting portion, machined object limits by it to the movement in direction, face, thus,
Splicing tape can not be used machined object to be fixed on transport tray, therefore, it is possible to significantly cut down processing cost.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of the structure example of the processing unit (plant) illustrating embodiment 1.
Fig. 2 is the front view of the structure example of the box illustrating embodiment 1.
Fig. 3 is the axonometric chart of the structure example of the machined object illustrating embodiment 1.
Fig. 4 is the axonometric chart of the structure example of the transport tray illustrating embodiment 1.
Fig. 5 is the axonometric chart of the mounting example being shown in and having loaded machined object in the transport tray of embodiment 1.
Fig. 6 is cuing open of the P-P arrow of the mounting example being shown in and having loaded machined object in the transport tray of embodiment 1
View.
Fig. 7 be illustrate the chuck table to embodiment 1 move into be placed with machined object transport tray move into example
Sectional view.
Fig. 8 is to illustrate the processing example being processed the machined object on the chuck table being maintained at embodiment 1
Sectional view.
Fig. 9 is the sectional view of the mounting example being shown in and having loaded machined object in the transport tray of embodiment 2.
Figure 10 is to illustrate that the chuck table to embodiment 2 moves into the moving into of transport tray being placed with machined object
The sectional view of example.
Figure 11 is to illustrate the processing example being processed the machined object on the chuck table being maintained at embodiment 2
Sectional view.
Label declaration
1: processing unit (plant)；5,6: transport tray；5a, 6a: main body frame portion；5b, 6b: peristome；5d、
6d: peripheral branches bearing portion；5e, 6e: movement limiting portion；10A: chuck table；The chucking work of 10B: convex
Platform；11a, 11b: keep face；50: the 1 conveyance components；60: the 2 conveyance components；91: box；92: box carries
Put component；W (W1, W2): machined object；U: machined object holding unit；U1A, U1B: transport tray
Unit；U2: frame unit.
Detailed description of the invention
About the mode (embodiment) for implementing the present invention, referring to the drawings while explaining.This
The bright content being not limited to described in following embodiment.Further, described below structural element comprises can be easy
The key element that occurs to those skilled in the art or the key element being substantially the same.Additionally, structure set forth below can be fitted
Work as combination.Further, various structure can be omitted without departing from the spirit and scope of the invention, carry out replacing or becoming
More.
(embodiment 1)
The structure example of the processing unit (plant) of embodiment 1 and the transport tray of machined object is illustrated.Fig. 1 is to illustrate
The axonometric chart of the structure example of the processing unit (plant) of embodiment 1.Fig. 2 is the master of the structure example of the box illustrating embodiment 1
View.Fig. 3 is the axonometric chart of the structure example of the machined object illustrating embodiment 1.Fig. 4 is to illustrate embodiment 1
The axonometric chart of structure example of transport tray.Fig. 5 be shown in loaded in the transport tray of embodiment 1 processed
The axonometric chart of the mounting example of thing.Fig. 6 is the mounting being shown in and having loaded machined object in the transport tray of embodiment 1
The sectional view of the P-P arrow of example.
Machined object W is processed by processing unit (plant) 1.As it is shown in figure 1, processing unit (plant) 1 has chuck table
10A, tooling member 20, processing feeding component 30, incision feeding component the 40, the 1st conveyance component the 50, the 2nd are removed
Send component 60, interim place track 70, cleaning element 80, case structure 90, not shown index feed component,
And not shown control member.
Chuck table 10A is can be disposed in the way of moving in the X-axis direction on the upper surface of apparatus main body 2.
Chuck table 10A is formed as discoideus, has holding face 11a and clamping part 12.Chuck table 10A passes through
Not shown rotating member utilizes the rotary shaft vertical with the center keeping face 11a to rotate.Holding face 11a is chuck work
The upper surface of the vertical of station 10A, is with respect to the horizontal plane formed as smooth.Holding face 11a is such as by porous
Ceramic materials etc. are constituted, and (such as, are removed machined object holding unit U by the negative pressure in not shown vacuum attraction source
Send tray unit U1A or frame unit U2) machined object W carry out attracting holding.Clamping part 12 is to being added
Work thing holding unit U clamps, by the outer peripheral edge of machined object holding unit U from clamping up and down and keeping.
The machined object W being maintained on chuck table 10A is processed by tooling member 20.Tooling member 20
It is disposed in the 1st gate frame 3 via index feed component and incision feeding component 40.Here, the 1st gate frame 3
Dress is stood up in the way of the mobile route in the X-direction of chuck table 10A in the Y-axis direction
Put main body 2.Tooling member 20 has: the cutting tool 21 that cuts machined object W, with can load and unload
Mode is installed on the main shaft 22 of cutting tool 21 and is supported by main shaft 22 as the rotary shaft rotation around Y direction
Housing 23 freely.
Processing feeding component 30 makes chuck table 10A and tooling member 20 relative movement in the X-axis direction.Example
As, processing feeding component 30 has the not shown ball-screw extended in the X-axis direction and pulse motor etc. and drives
Dynamic source, makes the not shown X-axis supporting chuck table 10A move base station and moves in the X-axis direction.
Index feed component makes chuck table 10A and tooling member 20 relative movement in the Y-axis direction.Such as,
Index feed component has the driving sources such as the not shown ball-screw extended in the Y-axis direction and pulse motor,
Make the not shown Y-axis that incision feeding component 40 is supported move base station to move in the Y-axis direction.
Incision feeding component 40 makes tooling member 20 at the Z substantially vertical with the holding face 11a of chuck table 10A
Move on direction of principal axis.Such as, incision feeding component 40 has the not shown ball-screw extended in the Z-axis direction
Drive source with pulse motor etc., make the not shown Z axis that tooling member 20 is supported move parts at Z axis
Side moves up.
1st conveyance component 50 so that the 2nd gate frame 4 can be disposed in the way of moving in Y, Z-direction, and
Driven by not shown actuator.Here, the 2nd gate frame 4 in the same manner as the 1st gate frame 3 with in Y-axis
On direction, the mode across the mobile route of chuck table 10A stands up apparatus main body 2.1st conveyance component
50 have clamping part 51 and adsorption section 52.1st conveyance component 50 is clamped also from case structure 90 by clamping part 51
Take out the machined object holding unit U of the machined object W before being fixed with processing, and by machined object holding unit U
It is positioned over the track 70 temporarily placed a pair temporarily.Further, the 1st conveyance component 50 is adsorbed by adsorption section 52
The machined object holding unit U being temporarily placed on track 70 is kept to be transported to chuck table 10A.And
And, the machined object holding unit U of the machined object W after being fixed with cleaning is inhaled by the 1st conveyance component 50
Attached holding and be temporarily placed on track 70.
2nd conveyance component 60 so that the 2nd gate frame 4 can be disposed in the way of X, Y, Z axis side moves up,
And driven by not shown actuator.2nd conveyance component 60 has adsorption section 61, will remain in chuck table 10A
On be fixed with processing after the machined object holding unit U of machined object W be temporarily placed on track 70.And
And, the 2nd conveyance component 60 is protected by the machined object after the processing to being temporarily placed on track 70 of the adsorption section 61
Hold unit U carry out absorption holding and be transported to cleaning element 80.
The machined object W of machined object holding unit U is carried out and makes it be dried by cleaning element 80.Clean
Component 80 has the rotary table 81 keeping machined object holding unit U.Cleaning element 80 is by rotation
Revolving worktable 81 carries out attracting holding and makes its high speed rotating machined object holding unit U, and towards processed
Thing W sprays the cleanout fluid such as pure water and is carried out, and towards the air (compressed air) of machined object W injection cleaning
Deng and make its be dried.
Case structure 90 receives machined object holding unit U, has box 91 and box mounting component 92.Such as, box 91
Receive multiple machined object holding unit U.As in figure 2 it is shown, box 91 have the peristome 91a of carrying-in/carrying-out with
And accepting rack 91b.The peristome 91a of box 91 is disposed of relative with the 1st conveyance component 50, by the 1st conveyance
Component 50 is by machined object holding unit U carrying-in/carrying-out.Accepting rack 91b with from relative sidewall to the width of box 91
The mode spending direction (X-direction) prominent is formed with multiple supporting supporting machined object holding unit U
Plate 91c.Support plate 91c equally spaced arranges in short transverse (Z-direction).Support plate in short transverse
The thickness that the interval of 91c is set to than machined object holding unit U is big.On the width of box 91 relative to
Machined object holding unit U is flatly supported by a pair support plate 91c.In present embodiment 1, at box
It is accommodated with 3 transport tray unit U1A in 91 and is accommodated with 5 conventional frame unit U2, this transport tray
Unit U1A supports machined object W1 by the transport tray 5 of the present invention, and this frame unit U2 is at ring-shaped frame F
Opening in across splicing tape T support machined object W2.
Box 91 is loaded as moving up and down freely in the Z-axis direction by box mounting component 92.Box mounting component 92 has
Box loads region 92a and the not shown lift component making mounting region 92a lift in the Z-axis direction.Carry at box
Put in the 92a of region and load box 91 in the way of peristome 91a and the 1st conveyance component 50 of box 91 is relative.Box carries
Put component 92 to be lifted by the box 91 making to be positioned on box mounting region 92a by lift component, and by fixed for box 91
Position is carrying out the position of carrying-in/carrying-out by the 1st conveyance component 50 to machined object holding unit U.
Transport tray unit U1A is made up of machined object W1 and transport tray 5.Machined object W1 be at silicon or
It is formed with semiconductor device on the substrates such as GaAs or on the substrate such as sapphire or SiC, is formed with the material of optical device
Material, is semiconductor wafer or optical device wafer, inorganic material substrate, ductility resin material substrate, ceramic substrate or glass
The various rapidoprints such as glass plate.As it is shown on figure 3, machined object W1 is formed as the tabular of rectangle.
Transport tray 5 is that to chuck table 10A or cleaning element 80, machined object W1 is being carried out carrying-in/carrying-out
Time the parts that used.As shown in Figure 4, transport tray 5 has the master of the profile being formed as identical with ring-shaped frame F
Body frame section 5a.It addition, about the external diameter of main body frame portion 5a, as long as the 1st, the 2nd conveyance component 50,60 energy
Enough in the way of identical with ring-shaped frame F, it transported and by chuck table 10A, it can be carried out
Keep, be just not limited to external diameter identical with ring-shaped frame F.Main body frame portion 5a has peristome 5b, and this is opened
Oral area 5b has the inner circumferential that the profile than machined object W1 is big.Peristome 5b have machined object W1 is carried out solid
Fixed function, has: upper opening portion 5c, and its opening is that the profile than machined object W1 is slightly larger；Peripheral branches bearing portion
5d, it is formed at the lower section of peristome 5b, supports the peripheral part of machined object W1；And move restriction
Portion 5e, it limits the machined object W1 movement to direction, face.
The peripheral branches bearing portion 5d inner circumferential from the bottom of peristome 5b highlights the length of regulation towards center and is formed.Such as,
As peripheral branches bearing portion 5d, at the inner circumferential wall of the bottom of open pore main body frame portion 5 being carried out opening and obtain
On, the circumference along inner circumferential wall is passed through welding or bonding agent etc. and is fixed with the plate-shaped member of one fixed width.Periphery supports
Portion 5d is formed as the opening that the profile than machined object W1 is slightly smaller.On the bearing-surface 5f of periphery support 5d,
It is formed with the synthetic resin such as silicon in whole region.As shown in Figure 6, peripheral branches bearing portion 5d is to being positioned in peristome 5b
On the outer region of lower face side of machined object W1 support.
Movement limiting portion 5e is formed at peripheral branches bearing portion 5d and the border of main body frame portion 5a, i.e. peristome 5b's is interior
In peripheral wall surfaces.The direction, face that movement limiting portion 5e is formed as relative to main body frame portion 5a is substantially vertical.Mobile restriction
The side W1c of portion 5e and the machined object W1 being positioned on peristome 5b abut and limit machined object W1 to
The movement in direction, face.It addition, there is gap between the side W1c of movement limiting portion 5e and machined object W1,
But owing to implementing alignment when processing machined object W1, even if therefore machined object W1 and machined object W1's
There is gap between the W1c of side, adding man-hour, also there is no problem.
Each structural element of processing unit (plant) 1 is controlled by control member.Such as, control member processes feeding with driving
Component 30, index feed component, the not shown drive circuit of pulse motor of incision feeding component 40 connect,
Control drive circuit and determine the position in the X-direction of chuck table 10A and the Y-axis side of tooling member 20
To and Z-direction on position.
Then, the action example of the processing unit (plant) of embodiment 1 is illustrated.Machined object W is being processed
In the case of, first, the control member of processing unit (plant) 1 controls box mounting component 92, makes box 91 in the Z-axis direction
Lift and be located at the position of regulation.Then, control member controls the 1st conveyance component 50, will be accommodated in box
The machined object holding unit U of the processing object in 91, such as transport tray unit U1A take out and are temporarily placed at
On track 70.Such as, the 1st conveyance component 50 is by the clamping part 51 main body frame to transport tray unit U1A
Portion 5a carries out clamping and taking out transport tray unit U1A from box 91.
Then, control member controls the 1st conveyance component 50, adsorbs holding by adsorption section 52 and is temporarily placed at track
Transport tray unit U1A on 70 is also transported to chuck table 10A.Such as, as it is shown in fig. 7, the 1st transports
Component 50 carries out absorption holding by the absorption layer 52a of adsorption section 52 to the peripheral part of main body frame portion 5a and will remove
Tray unit U1A is sent to be transported to chuck table 10A.Now, the machined object W1 of transport tray unit U1A
Limited the movement on direction, face by movement limiting portion 5e, and be fixed on peristome 5b.Chuck table 10A is by protecting
Hold face 11a and transport tray unit U1A is carried out attracting holding.Further, as shown in Figure 8, as chuck table
10A, the absorption layer 52a in adsorption section 52, after the peripheral part of main body frame portion 5a is released, pass through clamping part
The outer peripheral edge of 12 couples of main body frame portion 5a clamps.Owing to being formed on the bearing-surface 5f of periphery support 5d
Synthetic resin, the holding face 11a of the machined object W1 therefore supported by bearing-surface 5f and chuck table 10A becomes
For airtight conditions.Thus, when to when keeping face 11a negative pressure, machined object W1 is via peripheral branches bearing portion 5d
It is attracted to maintain and is keeping on the 11a of face.
Then, control member implements processed to the transport tray unit U1A being maintained on chuck table 10A
The alignment of thing W1.Further, control member controls tooling member 20, and machined object W1 is carried out machining.
Such as, tooling member 20 utilizes cutting tool 21 entirely not cut machined object W1 but is cut to processed
The midway of thing W1.At the end of the cutting of machined object W1, control member controls the 2nd conveyance component 60, will
The transport tray unit U1A being maintained on chuck table 10A is temporarily placed on track 70.Further, control
Component controls the 2nd conveyance component 60, is transported to clearly by the transport tray unit U1A being temporarily placed on track 70
Wash component 80.Then, control member controls cleaning element 80, the machined object W1 to transport tray unit U1A
It is carried out and makes it be dried.Further, control member controls the 1st conveyance component 50, will be by cleaning element 80 to quilt
The transport tray unit U1A that machining object W1 has carried out cleaning and being dried is temporarily placed on track 70.Further, control
Component processed controls the 1st conveyance component 50 and case structure 90, the transport tray unit that will be temporarily placed on track 70
U1A is accommodated in the accepting rack 91b of the regulation of box 91.
As it has been described above, according to the transport tray 5 of embodiment 1, have outside the lower face side to machined object W1
Region carried out peripheral branches bearing portion 5d that supports and limited the movement limiting portion that machined object W1 moves to direction, face week
5e.Thus, due in the case of need not implement the full cutting for being completely separated from machined object W1, the most logical
Cross to be positioned in transport tray 5 machined object W1 and just can be fixed, therefore can need not splicing tape T,
Processing cost can be cut down significantly.Further, as in the past, splicing tape T was pasted onto ring-shaped frame owing to eliminating
F is upper, paste machined object W2 on the splicing tape T be pasted on ring-shaped frame F and the operation that is fixed, therefore
The labour force of operation can be reduced.Further, due to transport tray 5 be formed as identical with conventional ring-shaped frame F outside
Footpath, therefore, it is possible to transport machined object W1 in the case of not transforming conventional conveyance component, therefore realizes not spending
Import the such effect of cost.
(variation)
Then, the variation of embodiment 1 is illustrated.It is fixed on transport tray to by 1 machined object W1
The example of 5 is illustrated but it also may multiple machined object W1 are fixed on transport tray 5.In this case,
Multiple peristome 5b is such as set on the main body frame portion 5a of transport tray 5, fixing in each peristome 5b
Machined object W1.
Further, about peripheral branches bearing portion 5d, it is at open pore main body frame portion 5 being carried out opening and obtain to it
Bottom inner circumferential wall on, along inner circumferential wall circumference by the plate-shaped member of certain width by welding or bonding
The example of the split molding that agent etc. are fixed and obtain is illustrated, but peripheral branches bearing portion 5d can also be with main body
Frame section 5 is one-body molded.Further, in the case of by peripheral branches bearing portion 5d and main body frame portion 5 split molding,
Can also be in order to firmly fix peripheral branches bearing portion 5d in main body frame portion 5, and at the opening in main body frame portion 5
It is provided for the recess chimeric with peripheral branches bearing portion 5d of plate-shaped member, by peripheral branches on the inner circumferential wall of the bottom in hole
Bearing portion 5d is fixed in the recess in main body frame portion 5.
(embodiment 2)
Then, the structure example of the transport tray of the machined object of embodiment 2 is illustrated.Fig. 9 is to be shown in reality
Execute the sectional view of the mounting example having loaded machined object in the transport tray of mode 2.Figure 10 is to illustrate embodiment party
The sectional view moving into example that the transport tray of machined object is moved into has been loaded on the chuck table of formula 2.Figure 11 is to show
Go out the sectional view to the processing example that the machined object on the chuck table being maintained at embodiment 2 is processed.
The transport tray 6 of embodiment 2 can be applied to be formed as the chuck table 10B of round shape and convex having
The aspect of structure different from embodiment 1.
Transport tray 6 is to be entered relative to chuck table 10B or the cleaning element 80 of convex by machined object W1
The parts used during row carrying-in/carrying-out.As it is shown in figure 9, transport tray 6 has is formed as identical with ring-shaped frame F
The main body frame portion 6a of profile.It addition, about the external diameter of main body frame portion 6a, as long as the 1st, the 2nd conveyance component
50,60 in the way of identical with ring-shaped frame F, transport tray 6 can be transported, just be not limited to and ring-type frame
The identical external diameter of frame F.Main body frame portion 6a has peristome 6b, and this peristome 6b has and compares machined object
The inner circumferential that the profile of W1 is big.Peristome 6b has the function being fixed machined object W1, has: opening
Top 6c, its opening is that the profile than machined object W1 is the biggest；Peripheral branches bearing portion 6d, it is formed at peristome
The lower section of 6b, supports the peripheral part of machined object W1；And movement limiting portion 6e, its restriction is processed
The movement of thing W1.
Peripheral branches bearing portion 6d is formed as the inner circumferential from the bottom of peristome 6b and highlights the length of regulation towards center.Such as,
Peripheral branches bearing portion 6d is edge on the inner circumferential wall of the bottom of open pore main body frame portion 6 being carried out opening and obtain
The plate-shaped member of one fixed width is fixed by welding or bonding agent etc. and is obtained by the circumference inner circumferential wall.Peripheral branches
Bearing portion 6d forms the opening that the profile than machined object W1 is the least.As it is shown in figure 9, peripheral branches bearing portion 6d is to load
The outer region of the lower face side putting the machined object W1 on peristome 6b supports.
Here, being added on by the chuck table 10B of convex to the peristome 6b being fixed on transport tray 6
In the case of work thing W1 carries out attracting holding, the holding face 11b of the chuck table 10B of convex is inserted into conveyance torr
In the peristome 6b of dish 6.Now, carry out owing to keeping the bottom surface of face 11b and machined object W1 directly to abut
Attracting holding, therefore can not also form synthetic resin on the bearing-surface 6f of periphery support 6d.Further, periphery
Length H1 of the width of support 6d is formed as the width of peripheral branches bearing portion 5d than embodiment 1
Length H2 is short.This is because the holding face 11b of the chuck table 10B of convex needs attracting holding securely to be added
Work thing W1, is designed in the way of the region that therefore abuts by the bottom surface with machined object W1 is the biggest, and outer
Week, support 6d needed to make its inner circumferential periphery than holding face 11b big.
Movement limiting portion 6e is formed at peripheral branches bearing portion 6d and the border of main body frame portion 6a, i.e. peristome 6b's is interior
Peripheral wall surfaces.The direction, face that movement limiting portion 6e is formed as relative to main body frame portion 6a is substantially vertical.Movement limiting portion
6e abuts with the side W1c of the machined object W1 being positioned on peristome 6b, and limits machined object W1 to face
The movement in direction.
Then, the conveyance example using transport tray 6 to transport machined object W1 is illustrated.As shown in Figure 10,
1st conveyance component 50 carries out absorption by the absorption layer 52a of adsorption section 52 to the peripheral part of main body frame portion 6a to be protected
Hold and be transported to the chuck table 10B of convex.Now, the machined object W1 of transport tray unit U1B is moved
Dynamic limiting unit 6e limits the movement in direction, face, and is fixed on peristome 6b.As shown in figure 11, the chuck work of convex
Station 10B only carries out attracting holding to the machined object W1 of transport tray unit U1B by keeping face 11b.Example
As, when transport tray unit U1B is placed in the chuck table 10B of convex, keep face 11b from transport tray
6 boost machined object W1, keep the back side of face 11b and machined object W1 to abut and attracting holding machined object W1.
Being attracted to maintain when keeping on the 11b of face at machined object W1, tooling member 20 is to machined object W1
Carry out machining.
As it has been described above, according to the transport tray 6 of embodiment 2, have peripheral branches bearing portion 6d, it is formed as width side
To length H1 shorter than peripheral branches bearing portion 5d of embodiment 1；And movement limiting portion 6e, its restriction is processed
Thing W1, to the movement in direction, face, it is possible to have the effect equal with embodiment 1, and effectively relative to
The chuck table 10B of convex transports machined object W1.Such as, in order to needs attracting holding securely processed
Thing W1 and to expand the feelings designing holding face 11b in the way of the region that the bottom surface of machined object W1 abuts as far as possible
Under condition, it is possible in the case of periphery support 6d will not collide with keeping face 11b, the chuck table to convex
10B moves into machined object W1.
(variation)
Then, the variation of embodiment 2 is illustrated.It is to main body frame portion 6 to periphery support 6d
On the inner circumferential wall of the bottom of the open pore carrying out opening and obtain, the circumference along inner circumferential wall passes through welding or bonding
The example of the split molding that the plate-shaped member of one fixed width is fixed and obtained by agent etc. is illustrated, but peripheral branches bearing portion
6d can also be one-body molded with main body frame portion 6.Further, by peripheral branches bearing portion 6d and main body frame portion 6 split
In the case of molding, it is also possible in order to firmly fix peripheral branches bearing portion 6d in main body frame portion 6, and in main body
It is provided for chimeric with peripheral branches bearing portion 6d of plate-shaped member on the inner circumferential wall of the bottom of the open pore of frame section 6
Recess, and peripheral branches bearing portion 6d is fixed in the recess in main body frame portion 6.
Claims (2)
1. a transport tray for machined object, in there is the processing unit (plant) of chuck table and tooling member,
This transport tray, described chuck is used when the machined object of tabular is carried out carrying-in/carrying-out relative to this chuck table
Workbench has the holding face keeping machined object, and described tooling member is to being maintained on this chuck table
Machined object is processed, and the transport tray of this machined object is characterised by having:
Ring-type main body frame portion, it has the inner circumferential that the profile of the machined object than this tabular is big；
Peripheral branches bearing portion, its inner circumferential from this main body frame portion is prominent towards center, to the lower face side of machined object
Outer region supports；And
Movement limiting portion, it is formed at the border in this main body frame portion and this peripheral branches bearing portion, to placed processed
The thing movement to direction, face limits.
The transport tray of machined object the most according to claim 1, it is characterised in that
This processing unit (plant) has:
Box loads region, and the box receiving multiple frame units is loaded by it, this frame unit opening at ring-shaped frame
Across splicing tape, machined object is supported in Kou；And
Conveyance component, its by be placed in this box mounting region this box and this chuck table between support this ring-type frame
Frame and this frame unit is transported,
This main body frame portion is formed as the external diameter identical with this ring-shaped frame, and can be accommodated in this box.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-079455 | 2015-04-08 | ||
| JP2015079455A JP6491017B2 (en) | 2015-04-08 | 2015-04-08 | Workpiece transport tray |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106057715A true CN106057715A (en) | 2016-10-26 |
| CN106057715B CN106057715B (en) | 2021-05-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610186899.XA Active CN106057715B (en) | 2015-04-08 | 2016-03-29 | Conveying tray for processed object |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6491017B2 (en) |
| KR (1) | KR102348542B1 (en) |
| CN (1) | CN106057715B (en) |
| TW (1) | TWI689027B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231641A (en) * | 2016-12-15 | 2018-06-29 | 株式会社迪思科 | The transport mechanism of processing unit (plant) |
| CN108336007A (en) * | 2017-01-13 | 2018-07-27 | 株式会社迪思科 | Frame unit conveyer |
| CN110014336A (en) * | 2017-12-12 | 2019-07-16 | 株式会社迪思科 | Chip generating means and transport tray |
| CN110429044A (en) * | 2018-05-01 | 2019-11-08 | 株式会社迪思科 | Cutting apparatus |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7374591B2 (en) * | 2019-02-13 | 2023-11-07 | 株式会社東京精密 | Wafer presence detection device |
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| JPH07201948A (en) * | 1993-12-29 | 1995-08-04 | Dainippon Screen Mfg Co Ltd | Substrate transferring jig |
| JP2010073884A (en) * | 2008-09-18 | 2010-04-02 | Fujitsu Microelectronics Ltd | Jig for semiconductor wafer and method of manufacturing semiconductor device |
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| CN108231641A (en) * | 2016-12-15 | 2018-06-29 | 株式会社迪思科 | The transport mechanism of processing unit (plant) |
| CN108231641B (en) * | 2016-12-15 | 2023-04-07 | 株式会社迪思科 | Conveying mechanism of processing device |
| CN108336007A (en) * | 2017-01-13 | 2018-07-27 | 株式会社迪思科 | Frame unit conveyer |
| CN108336007B (en) * | 2017-01-13 | 2023-03-28 | 株式会社迪思科 | Frame unit conveying system |
| CN110014336A (en) * | 2017-12-12 | 2019-07-16 | 株式会社迪思科 | Chip generating means and transport tray |
| CN110429044A (en) * | 2018-05-01 | 2019-11-08 | 株式会社迪思科 | Cutting apparatus |
| CN110429044B (en) * | 2018-05-01 | 2024-02-20 | 株式会社迪思科 | Cutting device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102348542B1 (en) | 2022-01-06 |
| TWI689027B (en) | 2020-03-21 |
| JP2016201421A (en) | 2016-12-01 |
| JP6491017B2 (en) | 2019-03-27 |
| KR20160120666A (en) | 2016-10-18 |
| TW201705339A (en) | 2017-02-01 |
| CN106057715B (en) | 2021-05-25 |
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