JP2018078209A - Conveying device, processing device and conveying method - Google Patents

Conveying device, processing device and conveying method Download PDF

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Publication number
JP2018078209A
JP2018078209A JP2016219619A JP2016219619A JP2018078209A JP 2018078209 A JP2018078209 A JP 2018078209A JP 2016219619 A JP2016219619 A JP 2016219619A JP 2016219619 A JP2016219619 A JP 2016219619A JP 2018078209 A JP2018078209 A JP 2018078209A
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Prior art keywords
frame
unit
cassette
holding
frame unit
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JP6804146B2 (en
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真裕 塚本
Masahiro Tsukamoto
真裕 塚本
謙 富樫
Ken Togashi
謙 富樫
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to JP2016219619A priority Critical patent/JP6804146B2/en
Priority to TW106134032A priority patent/TWI724246B/en
Priority to US15/793,574 priority patent/US10242904B2/en
Priority to CN201711058243.0A priority patent/CN108074849B/en
Priority to KR1020170147243A priority patent/KR102293784B1/en
Publication of JP2018078209A publication Critical patent/JP2018078209A/en
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Publication of JP6804146B2 publication Critical patent/JP6804146B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Laser Beam Processing (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a conveying device that is able to securely convey a frame unit accommodated in a cassette and is also suitable for miniaturization of a processing device.SOLUTION: A conveying device that conveys a frame unit from a cassette accommodating a frame unit supporting a plate-like work piece in a ring-like frame opening via tape and conveys it to a predetermined position, comprises: a holding part having: two pairs of sandwiching parts that are able to vertically grip two separate parts of the front side of the frame; and a contact part that is brought into contact with the frame; a moving part that moves the holding part; and a control part that controls each compositional element. The control part controls each compositional element in such a manner that the frame is gripped with the sandwiching part and partially pulled out from the cassette, gripping by the sandwiching part is cancelled, then, while the contact part is kept in contact with the frame so as to move the frame toward the cassette, and the frame is gripped and lifted by the sandwiching part and conveyed to a predetermined position.SELECTED DRAWING: Figure 1

Description

本発明は、リング状のフレームの開口にテープを介して板状の被加工物が支持されたフレームユニットを搬送するための搬送装置、この搬送装置が組み込まれた加工装置、及びこの搬送装置を用いる搬送方法に関する。   The present invention relates to a transport device for transporting a frame unit in which a plate-like workpiece is supported via a tape to an opening of a ring-shaped frame, a processing device incorporating this transport device, and this transport device. The present invention relates to a transport method to be used.

半導体ウェーハや光デバイスウェーハ、セラミックスパッケージ基板等を複数のチップへと分割する際には、例えば、これら板状の被加工物に設定される分割予定ライン（ストリート）に沿って、レーザービームを照射したり、回転する環状のブレードを切り込ませたりする（例えば、特許文献１，２等参照）。   When dividing semiconductor wafers, optical device wafers, ceramics package substrates, etc. into multiple chips, for example, irradiate laser beams along the division lines (streets) set on these plate-like workpieces. Or cutting a rotating annular blade (see, for example, Patent Documents 1 and 2).

上述のような方法で被加工物を加工する前には、被加工物よりも径の大きいテープを被加工物に貼り、また、テープの外周部分にリング状のフレームを固定してフレームユニットを形成することが多い。フレームユニットを形成することで、搬送、加工時の衝撃等から被加工物を保護し、更に、被加工物の取り扱い易さを高められる。   Before processing the workpiece by the method as described above, a tape having a diameter larger than that of the workpiece is applied to the workpiece, and a ring-shaped frame is fixed to the outer peripheral portion of the tape to attach the frame unit. Often formed. By forming the frame unit, the workpiece can be protected from impact during transportation and processing, and the ease of handling the workpiece can be enhanced.

ところで、被加工物を加工する際には、テープの貼られていない面が上を向くように、被加工物をチャックテーブル等で保持するのが一般的である。一方で、加工の種類によっては、テープの貼られていない面を下に向けることもある。そのため、フレームユニットを搬送する搬送装置には、フレームユニットの上下を反転できる機能が求められる。   By the way, when processing a workpiece, the workpiece is generally held by a chuck table or the like so that the surface to which the tape is not applied faces upward. On the other hand, depending on the type of processing, the surface on which the tape is not applied may be turned downward. For this reason, a transport device that transports the frame unit is required to have a function that allows the frame unit to be turned upside down.

特開２０１２−８４７２０号公報JP 2012-84720 A 特開２０１４−１９２２１５号公報JP 2014-192215 A

上述のような反転機能を持つ搬送装置では、フレームユニットを確実に保持できるように、各部に高い剛性が必要となる。しかしながら、例えば、フレームユニットを保持する保持部を、太く、厚い部材で構成すると、カセットに収容されているフレームユニットの上下の隙間が狭い場合に、この隙間に保持部を挿入してフレームユニットを保持できなくなる。   In the transport apparatus having the reversing function as described above, each part needs to have high rigidity so that the frame unit can be securely held. However, for example, if the holding unit that holds the frame unit is formed of a thick and thick member, when the upper and lower gaps of the frame unit accommodated in the cassette are narrow, the holding unit is inserted into this gap to remove the frame unit. It cannot be held.

また、従来の加工装置では、カセットから搬出されたフレームユニットの位置を、ガイドレール等で構成されるセンタリング機構によって合わせた後に、チャックテーブル等へと搬入していた。ところが、このセンタリング機構は、ある程度のスペースを必要とするので、加工装置を小型化する際の妨げになる。   Further, in the conventional processing apparatus, the position of the frame unit carried out from the cassette is adjusted by a centering mechanism constituted by a guide rail or the like, and then carried into a chuck table or the like. However, since this centering mechanism requires a certain amount of space, it becomes an obstacle when the processing apparatus is downsized.

本発明はかかる問題点に鑑みてなされたものであり、その目的とするところは、カセットに収容されたフレームユニットを確実に保持して搬送でき、加工装置の小型化にも適した搬送装置、この搬送装置が組み込まれた加工装置、及びこの搬送装置を用いる搬送方法を提供することである。   The present invention has been made in view of such problems, and the object of the present invention is to convey and hold the frame unit accommodated in the cassette securely, and is suitable for downsizing the processing apparatus, It is to provide a processing apparatus in which the transport apparatus is incorporated, and a transport method using the transport apparatus.

本発明の一態様によれば、リング状のフレームの開口にテープを介して板状の被加工物が支持されたフレームユニットを収容するカセットから該フレームユニットを搬出し、所定の位置まで搬送する搬送装置であって、該フレームの手前側の離れた２か所を上下に挟んで把持可能な２組の挟持部と、該フレームに突き当てられる突き当て部と、を有する保持部と、該保持部を移動させる移動部と、各構成要素を制御する制御部と、を備え、該制御部は、該挟持部で該フレームを把持して該カセットから部分的に引き出し、該挟持部による把持を解除した後、該フレームを該カセットに向かって移動させるように該突き当て部を該フレームに突き当てた状態で、該挟持部によって該フレームを把持して持ち上げ該所定の位置まで搬送するように各構成要素を制御する搬送装置が提供される。   According to one aspect of the present invention, a frame unit is unloaded from a cassette that houses a frame unit in which a plate-like workpiece is supported via a tape in an opening of a ring-shaped frame, and is conveyed to a predetermined position. A holding device having two sets of sandwiching portions that can be gripped by vertically sandwiching two places on the front side of the frame, and an abutting portion that is abutted against the frame; A moving unit that moves the holding unit; and a control unit that controls each component. The control unit grips the frame by the clamping unit and partially pulls the frame from the cassette, and grips by the clamping unit. After the release, the frame is gripped by the clamping unit and lifted to the predetermined position with the abutting part being abutted against the frame so that the frame is moved toward the cassette. In Transfer device for controlling the components is provided.

また、本発明の一態様によれば、被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物を加工する加工ユニットと、該カセットが載置されるカセット載置領域と、該カセットから該フレームユニットを搬出して該チャックテーブルまで搬送する搬送ユニットと、を備え、該搬送ユニットは、請求項１に記載の搬送装置である加工装置が提供される。   According to another aspect of the present invention, a chuck table that holds a workpiece, a processing unit that processes the workpiece held on the chuck table, and a cassette placement area on which the cassette is placed; A conveying unit that unloads the frame unit from the cassette and conveys the frame unit to the chuck table, wherein the conveying unit is provided with a processing device that is a conveying device according to claim 1.

また、本発明の一態様によれば、リング状のフレームの開口にテープを介して板状の被加工物が支持されたフレームユニットを収容するカセットから該フレームユニットを搬出し、所定の位置まで搬送する搬送方法であって、該フレームの手前側の離れた２か所を上下に挟んで把持可能な２組の挟持部と、該フレームに突き当てられる突き当て部と、を有する保持部と、該保持部を移動させる移動部と、各構成要素を制御する制御部と、を備える搬送装置を用い、該２組の挟持部の一方又は双方で該フレームを把持して該カセットから部分的に引き出し、該２組の挟持部の一方又は双方による把持を解除してから、該フレームを該カセットに向かって移動させるように該突き当て部を該フレームに突き当て、該突き当て部が該フレームに突き当てられた状態で、該２組の挟持部によって該フレームを把持して持ち上げ該所定の位置まで搬送する搬送方法が提供される。   Further, according to one aspect of the present invention, the frame unit is unloaded from the cassette that houses the frame unit in which the plate-shaped workpiece is supported via the tape in the opening of the ring-shaped frame, and is moved to a predetermined position. A holding method having two sets of holding portions that can be gripped by vertically holding two places on the front side of the frame, and an abutting portion that is abutted against the frame. And using a transfer device that includes a moving unit that moves the holding unit and a control unit that controls each component, and grips the frame with one or both of the two sets of clamping units and partially removes the frame from the cassette. And the gripping part is released from one or both of the two sets of clamping parts, and then the abutting part is abutted against the frame so that the frame is moved toward the cassette. Thrust into the frame Temple state, transporting method for transporting to said predetermined raised position by grasping the frame is provided by the two pairs of clamping portions.

本発明の一態様に係る搬送装置は、フレームの手前側の離れた２か所を上下に挟んで把持可能な２組の挟持部と、フレームに突き当てられる突き当て部と、を有している。そのため、挟持部でフレームを把持してカセットから部分的に引き出し、挟持部による把持を解除した後、フレームをカセットに向かって移動させるように突き当て部をフレームに突き当てた状態で、挟持部によってフレームを把持して持ち上げることで、カセットに収容されたフレームユニットを確実に保持して搬送できる。   The conveyance device according to one aspect of the present invention includes two sets of clamping portions that can be gripped by vertically sandwiching two places on the front side of the frame, and an abutting portion that is abutted against the frame. Yes. Therefore, after holding the frame with the holding part and partially pulling it out from the cassette, after releasing the holding by the holding part, the holding part with the abutting part hitting the frame so as to move the frame toward the cassette By gripping and lifting the frame, the frame unit accommodated in the cassette can be securely held and transported.

すなわち、２組の挟持部によってフレームの離れた２か所を把持するので、フレームを１か所で把持する場合に比べてフレームの撓みが抑制され、フレームユニットを安定させることができる。これにより、フレームユニットを確実に保持でき、また、フレームユニットの反転も容易になる。   That is, since the two places of the frame are gripped by the two sets of sandwiching portions, the frame is restrained from being bent as compared with the case where the frame is gripped at one place, and the frame unit can be stabilized. Thereby, the frame unit can be securely held, and the frame unit can be easily reversed.

また、突き当て部をフレームに突き当ててフレームユニットの位置が決まった状態で、挟持部によってフレームを把持して搬送するので、従来のようなセンタリング機構でフレームユニットの位置を合わせる必要がない。つまり、ある程度のスペースを必要とするセンタリング機構を加工装置に設ける必要がなくなるので、加工装置の小型化にも適している。   Further, since the frame is gripped and transported by the holding portion in a state where the abutment portion is abutted against the frame and the position of the frame unit is determined, it is not necessary to align the position of the frame unit with a conventional centering mechanism. That is, since it is not necessary to provide the machining apparatus with a centering mechanism that requires a certain amount of space, it is also suitable for downsizing the machining apparatus.

このように、本発明の一態様によれば、カセットに収容されたフレームユニットを確実に保持して搬送でき、加工装置の小型化にも適した搬送装置、この搬送装置が組み込まれた加工装置、及びこの搬送装置を用いる搬送方法を提供できる。   As described above, according to one aspect of the present invention, a transport device that can reliably hold and transport the frame unit accommodated in the cassette and is suitable for downsizing the processing device, and a processing device in which the transport device is incorporated. And a transport method using the transport device.

レーザー加工装置の構成例を模式的に示す図である。It is a figure which shows typically the structural example of a laser processing apparatus. 図２（Ａ）は、第１形態に係るフレームユニットの構成例を模式的に示す斜視図であり、図２（Ｂ）は、第２形態に係るフレームユニットの構成例を模式的に示す斜視図である。2A is a perspective view schematically showing a configuration example of the frame unit according to the first embodiment, and FIG. 2B is a perspective view schematically showing a configuration example of the frame unit according to the second embodiment. FIG. カセットの構成例を模式的に示す斜視図である。It is a perspective view which shows the structural example of a cassette typically. 図４（Ａ）及び図４（Ｂ）は、フレームユニットがカセットから部分的に引き出される様子を説明するための一部断面平面図である。4A and 4B are partial cross-sectional plan views for explaining a state in which the frame unit is partially pulled out from the cassette. 図５（Ａ）は、第１突き当て面、第２突き当て面、及び第３突き当て面がフレームの手前側に突き当てられる様子を説明するための一部断面平面図であり、図５（Ｂ）は、フレームユニットが搬送される様子を説明するための一部断面平面図である。FIG. 5A is a partial cross-sectional plan view for explaining a state in which the first butting surface, the second butting surface, and the third butting surface are butted against the near side of the frame. (B) is a partial cross-sectional top view for demonstrating a mode that a frame unit is conveyed. 図６（Ａ）は、フレームユニットがカセットから部分的に引き出される際に、フレームを挟持爪によって把持する様子を説明するための一部断面平面図であり、図６（Ｂ）は、一部が薄く形成された挟持爪について説明するための図である。FIG. 6A is a partial cross-sectional plan view for explaining a state in which the frame is gripped by the clamping claws when the frame unit is partially pulled out from the cassette, and FIG. It is a figure for demonstrating the clamping nail | claw formed thinly.

添付図面を参照して、本発明の一態様に係る実施形態について説明する。図１は、本実施形態に係るレーザー加工装置（加工装置）２の構成例を模式的に示す図である。図１に示すように、レーザー加工装置２は、各構成要素を支持する基台４を備えている。基台４の前端部には、複数のフレームユニット１（図２（Ａ）等参照）を収容できるカセット６をそれぞれ載せるための２つのカセット載置領域８が形成されている。   Embodiments according to one aspect of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a diagram schematically illustrating a configuration example of a laser processing apparatus (processing apparatus) 2 according to the present embodiment. As shown in FIG. 1, the laser processing apparatus 2 includes a base 4 that supports each component. At the front end of the base 4, two cassette placement areas 8 are formed for placing cassettes 6 that can accommodate a plurality of frame units 1 (see FIG. 2A, etc.).

２つのカセット載置領域８の後方には、フレームユニット１を搬送するための搬送ユニット（搬送装置）１０が配置されている。搬送ユニット１０は、例えば、各部を昇降させる昇降機構（移動部）１２を備えている。昇降機構１２には、搬送アーム（移動部）１４が連結されている。   A transport unit (transport device) 10 for transporting the frame unit 1 is disposed behind the two cassette placement areas 8. The transport unit 10 includes, for example, an elevating mechanism (moving unit) 12 that raises and lowers each unit. A transport arm (moving unit) 14 is connected to the lifting mechanism 12.

搬送アーム１４は、例えば、昇降機構１２に基端部を接続された第１アーム１６と、第１アーム１６の先端部に基端部を接続された第２アーム１８と、で構成される。第１アーム１６は、昇降機構１２に対して第１アーム１６を旋回できるように構成されており、第２アーム１８は、第１アーム１６の先端部に対して第２アーム１８を旋回できるように構成されている。   The transport arm 14 includes, for example, a first arm 16 whose base end is connected to the lifting mechanism 12 and a second arm 18 whose base end is connected to the tip of the first arm 16. The first arm 16 is configured to be able to turn the first arm 16 with respect to the lifting mechanism 12, and the second arm 18 is capable of turning the second arm 18 with respect to the distal end portion of the first arm 16. It is configured.

また、第２アーム１８の先端部には、フレームユニット１を保持するための保持ハンド（保持部）２０が設けられている。例えば、搬送アーム１４を昇降機構１２によって昇降させるとともに、第１アーム１６及び第２アーム１８を、それぞれ昇降機構１２及び第１アーム１６の先端部に対して旋回させることで、保持ハンド２０を所望の位置へと移動させることができる。   Further, a holding hand (holding portion) 20 for holding the frame unit 1 is provided at the distal end portion of the second arm 18. For example, the transport arm 14 is moved up and down by the lifting mechanism 12 and the first arm 16 and the second arm 18 are swung with respect to the leading ends of the lifting mechanism 12 and the first arm 16, respectively, so that the holding hand 20 is desired. It can be moved to the position.

保持ハンド２０は、搬送アーム１４（第２アーム１６）の先端部に対して上下を反転できるように連結された保持ハンドフレーム２２を有している。この保持ハンドフレーム２２は、第２アーム１８の先端部に接続され、搬送の際にフレームユニット１に突き当てられる直線状の第１部分２４を含む。第１部分２４の側面の一つが、フレームユニット１に突き当てられる第１突き当て面（突き当て部）２４ａとなる。   The holding hand 20 has a holding hand frame 22 connected so as to be turned upside down with respect to the distal end portion of the transport arm 14 (second arm 16). The holding hand frame 22 includes a linear first portion 24 that is connected to the distal end portion of the second arm 18 and is abutted against the frame unit 1 during transportation. One of the side surfaces of the first portion 24 is a first abutting surface (abutting portion) 24 a that abuts against the frame unit 1.

また、保持ハンドフレーム２２は、第１部分２４の第１突き当て面２４ａ側の両端から斜めに突出する第２部分２６及び第３部分２８を有している。第２部分２６及び第３部分２８の第１突き当て面２４ａ側の側面は、それぞれ、搬送の際にフレームユニット１に突き当てられる第２突き当て面（突き当て部）２６ａ及び第３突き当て面（突き当て部）２８ａとなる。   The holding hand frame 22 has a second portion 26 and a third portion 28 that project obliquely from both ends of the first portion 24 on the first abutting surface 24a side. The side surfaces of the second portion 26 and the third portion 28 on the first abutting surface 24a side are respectively a second abutting surface (abutting portion) 26a and a third abutting surface that are abutted against the frame unit 1 during transport. It becomes the surface (butting part) 28a.

第２部分２６の第２突き当て面２６ａ側、及び第３部分２８の第３突き当て面２８ａ側には、それぞれ、フレームユニット１を把持するための挟持爪（挟持部）３０及び挟持爪（挟持部）３２が設けられている。挟持爪３０及び挟持爪３２は、それぞれ、上爪及び下爪を有しており、フレームユニット１内のフレーム２３（図２（Ａ）等参照）を上下に挟んで把持できる。   On the second abutting surface 26a side of the second portion 26 and on the third abutting surface 28a side of the third portion 28, respectively, a clamping claw (clamping portion) 30 and a clamping claw (for holding the frame unit 1) A clamping part) 32 is provided. Each of the holding claws 30 and the holding claws 32 has an upper claw and a lower claw, and can hold the frame 23 (see FIG. 2A, etc.) in the frame unit 1 by holding it vertically.

搬送ユニット１０には、搬送ユニット１０の各構成要素を制御するための制御ユニット（制御部）３４が接続されている。この制御ユニット３４の機能は、後に詳述する。なお、本実施形態では、搬送ユニット１０を制御するための専用の制御ユニット３４を例示しているが、レーザー加工装置２の各構成要素を制御するための制御ユニット（不図示）を搬送ユニット１０の制御に用いることもできる。   A control unit (control unit) 34 for controlling each component of the transport unit 10 is connected to the transport unit 10. The function of the control unit 34 will be described in detail later. In the present embodiment, a dedicated control unit 34 for controlling the transport unit 10 is illustrated, but a control unit (not shown) for controlling each component of the laser processing apparatus 2 is used as the transport unit 10. It can also be used for the control.

搬送ユニット１０の後方には、チャックテーブル移動機構３６が設けられている。チャックテーブル移動機構３６は、Ｙ軸方向（割り出し送り方向）に移動するＹ軸移動テーブル３８と、Ｙ軸移動テーブル３８の上面に配置され、Ｘ軸方向（加工送り方向）に移動するＸ軸移動テーブル４０とを備えている。   A chuck table moving mechanism 36 is provided behind the transport unit 10. The chuck table moving mechanism 36 is disposed on the upper surface of the Y-axis moving table 38 that moves in the Y-axis direction (index feed direction) and the X-axis movement that moves in the X-axis direction (machining feed direction). And a table 40.

Ｘ軸移動テーブル４０の上面側には、フレームユニット１内の被加工物１１を保持するためのチャックテーブル４２が配置されている。また、チャックテーブル４２の周囲には、フレームユニット１を構成するフレーム２３を固定するための複数のクランプ４４が設けられている。   On the upper surface side of the X-axis moving table 40, a chuck table 42 for holding the workpiece 11 in the frame unit 1 is disposed. A plurality of clamps 44 for fixing the frame 23 constituting the frame unit 1 are provided around the chuck table 42.

チャックテーブル４２は、モータ等の回転駆動源（不図示）に連結されており、Ｚ軸方向（鉛直方向）に概ね平行な回転軸の周りに回転する。上述したチャックテーブル移動機構３６でＹ軸移動テーブル３８をＹ軸方向に移動させれば、チャックテーブル４２はＹ軸方向に割り出し送りされ、Ｘ軸移動テーブル４０をＸ軸方向に移動させれば、チャックテーブル４２はＸ軸方向に加工送りされる。   The chuck table 42 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis substantially parallel to the Z-axis direction (vertical direction). If the Y-axis moving table 38 is moved in the Y-axis direction by the chuck table moving mechanism 36 described above, the chuck table 42 is indexed and fed in the Y-axis direction, and if the X-axis moving table 40 is moved in the X-axis direction, The chuck table 42 is processed and fed in the X-axis direction.

チャックテーブル４２の上面は、被加工物１１を保持するための保持面４２ａになっている。この保持面４２ａは、チャックテーブル４２の内部に形成された吸引路（不図示）等を通じて吸引源（不図示）に接続されている。例えば、搬送ユニット１０で搬送されたフレームユニット１（被加工物１１）を保持面４２ａに載せ、吸引源の負圧を作用させれば、被加工物１１をチャックテーブル４２で吸引、保持できる。   The upper surface of the chuck table 42 is a holding surface 42 a for holding the workpiece 11. The holding surface 42 a is connected to a suction source (not shown) through a suction path (not shown) formed inside the chuck table 42. For example, the workpiece 11 can be sucked and held by the chuck table 42 by placing the frame unit 1 (workpiece 11) transferred by the transfer unit 10 on the holding surface 42a and applying a negative pressure of a suction source.

なお、本実施形態では、フレームユニット１を搬送ユニット１０でチャックテーブル４２の保持面４２ａに載せているが、例えば、チャックテーブル４２の手前に仮置きテーブルを配置し、この仮置きテーブルにフレームユニット１を載せるようにしても良い。この場合には、例えば、搬送ユニット１０とは別の搬送ユニットを用いて、フレームユニット１を仮置きテーブルからチャックテーブル４２へと搬送できる。   In this embodiment, the frame unit 1 is placed on the holding surface 42a of the chuck table 42 by the transport unit 10, but for example, a temporary table is arranged in front of the chuck table 42, and the frame unit is placed on the temporary table. 1 may be placed. In this case, for example, the frame unit 1 can be transported from the temporary placement table to the chuck table 42 using a transport unit different from the transport unit 10.

チャックテーブル移動機構３６の側方には、柱状の支持構造４６が設けられている。支持構造４６は、チャックテーブル移動機構３６側に突出する支持アーム４８を備えており、この支持アーム４８の先端部には、下方に向けてレーザービームを照射するレーザー加工ユニット（加工ユニット）５０が配置されている。   A columnar support structure 46 is provided on the side of the chuck table moving mechanism 36. The support structure 46 includes a support arm 48 that protrudes toward the chuck table moving mechanism 36, and a laser processing unit (processing unit) 50 that irradiates a laser beam downward is provided at the tip of the support arm 48. Has been placed.

レーザー加工ユニット５０は、レーザー発振器（不図示）で発振されるレーザービームを集光用のレンズ５２で集光してチャックテーブル４２上の被加工物１１に照射する。そのため、例えば、レーザー加工ユニット５０でレーザービームを照射しながら、チャックテーブル４２をＸ軸方向に加工送りさせることで、被加工物１１をＸ軸方向に沿ってレーザー加工できる。   The laser processing unit 50 condenses a laser beam oscillated by a laser oscillator (not shown) by a condensing lens 52 and irradiates the workpiece 11 on the chuck table 42. Therefore, for example, the workpiece 11 can be laser processed along the X-axis direction by feeding the chuck table 42 in the X-axis direction while irradiating the laser beam with the laser processing unit 50.

なお、レーザー加工ユニット５０の構成等は、採用される加工方法等に応じて適切に設定、変更される。例えば、被加工物１１の内部を多光子吸収で改質して改質された領域（改質層）を形成したい場合には、被加工物１１を透過する波長のレーザービームを発振できるレーザー発振器がレーザー加工ユニット５０に組み込まれる。   The configuration and the like of the laser processing unit 50 are appropriately set and changed according to the processing method employed. For example, when it is desired to form a modified region (modified layer) by modifying the inside of the workpiece 11 by multiphoton absorption, a laser oscillator capable of oscillating a laser beam having a wavelength that passes through the workpiece 11 Is incorporated into the laser processing unit 50.

また、被加工物１１をレーザーアブレーションで加工したい場合には、被加工物１１に吸収される波長のレーザービームを発振できるレーザー発振器がレーザー加工ユニット５０に組み込まれる。加工後の被加工物１１（フレームユニット１）は、例えば、搬送ユニット１０を用いてカセット６に搬入される。   Further, when it is desired to process the workpiece 11 by laser ablation, a laser oscillator capable of oscillating a laser beam having a wavelength absorbed by the workpiece 11 is incorporated in the laser processing unit 50. The processed workpiece 11 (frame unit 1) after processing is carried into the cassette 6 by using the transport unit 10, for example.

上述した搬送ユニット１０（制御ユニット３４）、チャックテーブル移動機構３６、チャックテーブル４２、レーザー加工ユニット５０等の構成要素は、レーザー加工装置２の全体を制御するための制御ユニット（不図示）に接続されている。この制御ユニットは、被加工物１１が適切に加工されるように各構成要素の動作を制御する。   The components such as the transport unit 10 (control unit 34), the chuck table moving mechanism 36, the chuck table 42, and the laser processing unit 50 described above are connected to a control unit (not shown) for controlling the entire laser processing apparatus 2. Has been. This control unit controls the operation of each component so that the workpiece 11 is processed appropriately.

次に、本実施形態の搬送ユニット１０で搬送されるフレームユニット１について説明する。図２（Ａ）は、第１形態に係るフレームユニット１の構成例を模式的に示す斜視図であり、図２（Ｂ）は、第２形態に係るフレームユニット１の構成例を模式的に示す斜視図である。   Next, the frame unit 1 transported by the transport unit 10 of the present embodiment will be described. FIG. 2A is a perspective view schematically illustrating a configuration example of the frame unit 1 according to the first embodiment, and FIG. 2B schematically illustrates a configuration example of the frame unit 1 according to the second embodiment. It is a perspective view shown.

フレームユニット１を構成する被加工物１１は、例えば、シリコン等の半導体材料でなる円盤状のウェーハであり、その表面１１ａは、中央のデバイス領域と、デバイス領域を囲む外周余剰領域とに分けられている。デバイス領域は、格子状に配列された複数の分割予定ライン（ストリート）でさらに複数の領域に区画されており、各領域には、ＩＣ、ＬＳＩ等のデバイス１３が形成されている。   The workpiece 11 constituting the frame unit 1 is, for example, a disk-shaped wafer made of a semiconductor material such as silicon, and the surface 11a is divided into a central device region and an outer peripheral surplus region surrounding the device region. ing. The device region is further divided into a plurality of regions by a plurality of division lines (streets) arranged in a lattice pattern, and devices 13 such as ICs and LSIs are formed in each region.

なお、本実施形態では、シリコン等の半導体材料でなる円盤状の被加工物１１を用いるが、被加工物１１の材質、形状、構造、大きさ等に制限はない。例えば、他の半導体、セラミックス、樹脂、金属等の材料でなる基板を被加工物１１として用いることもできる。同様に、デバイス１３の種類、数量、大きさ、配置等にも制限はない。   In this embodiment, a disk-shaped workpiece 11 made of a semiconductor material such as silicon is used, but the material, shape, structure, size, etc. of the workpiece 11 are not limited. For example, a substrate made of a material such as another semiconductor, ceramics, resin, or metal can be used as the workpiece 11. Similarly, the type, quantity, size, arrangement, etc. of the device 13 are not limited.

図２（Ａ）に示す第１形態では、被加工物１１の表面１１ａ側に、被加工物１１よりも径の大きいテープ（粘着テープ）２１が貼られている。また、テープ２１の外周部分には、リング状のフレーム２３が固定されている。すなわち、フレーム２３の開口２３ａには、テープ２１を介して被加工物１１が支持されており、被加工物１１、テープ２１及びフレーム２３が一体となったフレームユニット１が形成されている。   In the first embodiment shown in FIG. 2A, a tape (adhesive tape) 21 having a diameter larger than that of the workpiece 11 is attached to the surface 11a side of the workpiece 11. A ring-shaped frame 23 is fixed to the outer peripheral portion of the tape 21. That is, the workpiece 11 is supported via the tape 21 in the opening 23 a of the frame 23, and the frame unit 1 in which the workpiece 11, the tape 21, and the frame 23 are integrated is formed.

一方で、図２（Ｂ）に示す第２形態では、被加工物１１の裏面１１ｂ側に、被加工物１１よりも径の大きいテープ２１が貼られている。また、テープ２１の外周部分には、リング状のフレーム２３が固定されている。すなわち、フレーム２３の開口２３ａには、テープ２１を介して被加工物１１が支持されており、被加工物１１、テープ２１及びフレーム２３が一体となったフレームユニット１が形成されている。   On the other hand, in the second embodiment shown in FIG. 2B, a tape 21 having a diameter larger than that of the workpiece 11 is attached to the back surface 11b side of the workpiece 11. A ring-shaped frame 23 is fixed to the outer peripheral portion of the tape 21. That is, the workpiece 11 is supported via the tape 21 in the opening 23 a of the frame 23, and the frame unit 1 in which the workpiece 11, the tape 21, and the frame 23 are integrated is formed.

次に、上述したフレームユニット１を収容するためのカセット６の構成例について説明する。図３は、カセット６の構成例を模式的に示す斜視図である。カセット６は、互いの内側面が向き合うように配置された一対の側板部６２，６４を有している。各側板部６２，６４の内側面には、それぞれ、水平方向に延びる複数の棚板部６２ａ，６４ａが鉛直方向に沿って概ね等しい間隔で配置されている。   Next, a configuration example of the cassette 6 for housing the frame unit 1 described above will be described. FIG. 3 is a perspective view schematically showing a configuration example of the cassette 6. The cassette 6 has a pair of side plate portions 62 and 64 arranged so that the inner side surfaces thereof face each other. On the inner side surfaces of the side plate portions 62 and 64, a plurality of shelf plate portions 62a and 64a extending in the horizontal direction are arranged at substantially equal intervals along the vertical direction.

複数の棚板部６２ａ，６４ａは、各側板部６２，６４の対応する高さの位置に設けられている。対応する高さの一対の棚板部６２ａ，６４ａによって、１個のフレームユニット１が支持される。具体的には、フレームユニット１を構成するフレーム２３の一部が、一対の棚板部６２ａ，６４ａによって支持される。なお、この側板部６２，６４は、天板部６６、底板部６８、及び背板部７０（図４（Ａ）等参照）により接続されている。   The plurality of shelf plates 62a and 64a are provided at corresponding height positions of the side plates 62 and 64, respectively. One frame unit 1 is supported by a pair of shelf boards 62a and 64a having a corresponding height. Specifically, a part of the frame 23 constituting the frame unit 1 is supported by a pair of shelf plates 62a and 64a. The side plate portions 62 and 64 are connected by a top plate portion 66, a bottom plate portion 68, and a back plate portion 70 (see FIG. 4A, etc.).

上述のように構成された搬送ユニット１０でフレームユニット１を搬送する搬送方法について説明する。本実施形態では、まず、カセット６に収容されたフレームユニット１のフレーム２３を２組の挟持爪３０，３２で把持して、フレームユニット１をカセット６から部分的に引き出す（引き出しステップ）。図４（Ａ）及び図４（Ｂ）は、フレームユニット１がカセット６から部分的に引き出される様子を説明するための一部断面平面図である。   A transport method for transporting the frame unit 1 by the transport unit 10 configured as described above will be described. In this embodiment, first, the frame 23 of the frame unit 1 accommodated in the cassette 6 is gripped by the two sets of clamping claws 30 and 32, and the frame unit 1 is partially pulled out from the cassette 6 (drawing step). 4A and 4B are partial cross-sectional plan views for explaining a state in which the frame unit 1 is partially pulled out from the cassette 6.

フレームユニット１をカセット６から部分的に引き出す際には、まず、制御ユニット３４が昇降機構１２を作動させて、対象のフレームユニット１の高さに保持ハンド２０の高さを合わせる。次に、制御ユニット３４は、搬送アーム１４を作動させて、図４（Ａ）に示すように、挟持爪３０，３２でフレーム２３の手前側の離れた２か所を把持できる位置まで保持ハンド２０を移動させる。   When partially pulling out the frame unit 1 from the cassette 6, first, the control unit 34 operates the lifting mechanism 12 to adjust the height of the holding hand 20 to the height of the target frame unit 1. Next, the control unit 34 operates the transfer arm 14 to hold the holding hand to a position where the holding claws 30 and 32 can grip two positions apart on the front side of the frame 23 as shown in FIG. 20 is moved.

その後、制御ユニット３４は、挟持爪３０，３２にフレーム２３の手前側の離れた２か所を把持させる。そして、再び搬送アーム１４を作動させて、図４（Ｂ）に示すように、フレームユニット１をある程度の位置まで引き出す。フレームユニット１の引き出し量は、例えば、挟持爪３０，３２での把持を解除してもフレームユニット１がカセット６から脱落せず、また、後にフレームユニット１に対して第１突き当て面２４ａ等を適切に突き当てられる範囲で調整される。   After that, the control unit 34 causes the holding claws 30 and 32 to grip two positions away from the front side of the frame 23. Then, the transfer arm 14 is operated again, and the frame unit 1 is pulled out to a certain position as shown in FIG. The amount of the frame unit 1 to be pulled out is such that, for example, the frame unit 1 does not fall out of the cassette 6 even if the holding claws 30 and 32 are released, and the first abutting surface 24a etc. Is adjusted within the range that can be properly abutted.

上述のようにフレームユニット１をカセット６から部分的に引き出した後に、制御ユニット３４は、挟持爪３０，３２によるフレーム２３の把持を解除する。また、フレームユニット１（フレーム２３）をカセット６の内部へと向かって移動させるように、保持ハンド２０の第１突き当て面２４ａ、第２突き当て面２６ａ、及び第３突き当て面２８ａを、フレーム２３の手前側に突き当てる（突き当てステップ）。   After partially pulling out the frame unit 1 from the cassette 6 as described above, the control unit 34 releases the gripping of the frame 23 by the clamping claws 30 and 32. Further, the first abutting surface 24a, the second abutting surface 26a, and the third abutting surface 28a of the holding hand 20 are arranged so as to move the frame unit 1 (frame 23) toward the inside of the cassette 6. It abuts on the near side of the frame 23 (abutment step).

図５（Ａ）は、第１突き当て面２４ａ、第２突き当て面２６ａ、及び第３突き当て面２８ａ（以下、第１突き当て面２４ａ等）がフレーム２３の手前側に突き当てられる様子を説明するための一部断面平面図である。第１突き当て面２４ａ等をフレーム２３の手前側に突き当てる際には、制御ユニット３４は、まず、搬送アーム１４を作動させて、保持ハンド２０をカセット６に向かって移動させる。   5A shows a state in which the first butting surface 24a, the second butting surface 26a, and the third butting surface 28a (hereinafter, the first butting surface 24a and the like) are butted against the front side of the frame 23. It is a partial cross section top view for demonstrating. When the first abutting surface 24 a and the like are abutted against the front side of the frame 23, the control unit 34 first operates the transport arm 14 to move the holding hand 20 toward the cassette 6.

その後、図５（Ａ）に示すように、第１突き当て面２４ａ等がフレーム２３の手前側に突き当てられ、フレームユニット１がカセット６の内部へと向かって僅かに移動すると、制御ユニット３４は、搬送アーム１４を停止させる。そして、この状態で、挟持爪３０，３２にフレーム２３の手前側の離れた２か所を把持させる。   Thereafter, as shown in FIG. 5A, when the first abutting surface 24a and the like are abutted against the front side of the frame 23 and the frame unit 1 moves slightly toward the inside of the cassette 6, the control unit 34 Stops the transfer arm 14. Then, in this state, the holding claws 30 and 32 are made to grip two places away from the front side of the frame 23.

このように、本実施形態では、フレームユニット１を部分的に引き出した後に、第１突き当て面２４ａ等をフレーム２３の手前側に突き当てるので、保持ハンド２０をカセット６の内部の深い位置まで侵入させなくても、フレームユニット１を適切に把持できる。つまり、フレームユニット１の上下の隙間が狭い場合等でも、フレームユニット１を適切に保持して搬送できる。   Thus, in this embodiment, after the frame unit 1 is partially pulled out, the first abutting surface 24 a and the like are abutted against the near side of the frame 23, so that the holding hand 20 is brought to a deep position inside the cassette 6. The frame unit 1 can be properly gripped without intrusion. That is, even when the upper and lower gaps of the frame unit 1 are narrow, the frame unit 1 can be appropriately held and transported.

第１突き当て面２４ａ等がフレーム２３の手前側に突き当てられた状態で、挟持爪３０，３２にフレーム２３の手前側の離れた２か所を把持させた後には、フレームユニット１（フレーム２３）を僅かに持ち上げ、所定の位置まで搬送する（搬送ステップ）。図５（Ｂ）は、フレームユニット１が搬送される様子を説明するための一部断面平面図である。   After the first butting surfaces 24a and the like are abutted against the front side of the frame 23, the holding claws 30 and 32 are gripped at two locations apart on the near side of the frame 23, and then the frame unit 1 (frame 23) is slightly lifted and transported to a predetermined position (transport step). FIG. 5B is a partial cross-sectional plan view for explaining how the frame unit 1 is conveyed.

フレームユニット１を所定の位置まで搬送する際には、まず、制御ユニット３４が昇降機構１２を作動させて、フレームユニット１を僅かに上昇させる。その後、図５（Ｂ）に示すように、搬送アーム１４を作動させて、フレームユニット１をカセット６から完全に引き出す。そして、所定の位置（例えば、チャックテーブル４２）までフレームユニット１を搬送する。   When transporting the frame unit 1 to a predetermined position, first, the control unit 34 operates the lifting mechanism 12 to slightly raise the frame unit 1. After that, as shown in FIG. 5B, the transport arm 14 is operated to completely pull out the frame unit 1 from the cassette 6. Then, the frame unit 1 is transported to a predetermined position (for example, the chuck table 42).

以上のように、本実施態様に係る搬送ユニット（搬送装置）１０は、フレーム２３の手前側の離れた２か所を上下に挟んで把持可能な２組の挟持爪（挟持部）３０，３２と、フレーム２３に突き当てられる第１突き当て面（突き当て部）２４ａ、第２突き当て面（突き当て部）２６ａ、及び第３突き当て面（突き当て部）２８ａと、を有している。   As described above, the conveyance unit (conveyance device) 10 according to this embodiment has two sets of clamping claws (clamping portions) 30 and 32 that can be gripped by vertically sandwiching two distant locations on the front side of the frame 23. And a first butting surface (butting portion) 24a butted against the frame 23, a second butting surface (butting portion) 26a, and a third butting surface (butting portion) 28a. Yes.

そのため、挟持爪３０，３２でフレーム２３を把持してカセット６から部分的に引き出し、挟持爪３０，３２による把持を解除した後、フレーム２３をカセット６に向かって移動させるように第１突き当て面２４ａ、第２突き当て面２６ａ、及び第３突き当て面２８ａをフレーム２３に突き当てた状態で、挟持爪３０，３２によってフレーム２３を把持して持ち上げることで、カセット６に収容されたフレームユニット１を確実に保持して搬送できる。   For this reason, the frame 23 is gripped by the clamping claws 30 and 32 and partially pulled out from the cassette 6. After the gripping by the clamping claws 30 and 32 is released, the first abutment is performed so that the frame 23 is moved toward the cassette 6. The frame accommodated in the cassette 6 by gripping and lifting the frame 23 by the clamping claws 30 and 32 in a state where the surface 24a, the second butting surface 26a and the third butting surface 28a are butted against the frame 23. The unit 1 can be securely held and transported.

すなわち、２組の挟持爪３０，３２によってフレーム２３の離れた２か所を把持するので、フレーム２３を１か所で把持する場合に比べてフレーム２３の撓みが抑制され、フレームユニット１を安定させることができる。これにより、フレームユニット１を確実に保持でき、また、フレームユニット１の反転も容易になる。   That is, since the two gripping claws 30 and 32 hold the two places away from the frame 23, the bending of the frame 23 is suppressed compared to the case where the frame 23 is held at one place, and the frame unit 1 is stabilized. Can be made. As a result, the frame unit 1 can be securely held, and the frame unit 1 can be easily reversed.

また、第１突き当て面２４ａ、第２突き当て面２６ａ、及び第３突き当て面２８ａをフレーム２３に突き当ててフレームユニット１の位置が決まった状態で、挟持爪３０，３２によってフレーム２３を把持して搬送するので、従来のようなセンタリング機構でフレームユニット１の位置を合わせる必要がない。つまり、ある程度のスペースを必要とするセンタリング機構を加工装置に設ける必要がなくなるので、レーザー加工装置（加工装置）２の小型化にも適している。   Further, the frame 23 is held by the holding claws 30 and 32 in a state where the position of the frame unit 1 is determined by abutting the first abutting surface 24a, the second abutting surface 26a, and the third abutting surface 28a against the frame 23. Since it is gripped and conveyed, it is not necessary to align the position of the frame unit 1 with a conventional centering mechanism. That is, since it is not necessary to provide a centering mechanism that requires a certain amount of space in the processing apparatus, the laser processing apparatus (processing apparatus) 2 is suitable for downsizing.

なお、本発明は、上記実施形態の記載に制限されず種々変更して実施可能である。例えば、上記実施形態では、フレームユニット１をカセット６から部分的に引き出す際に、フレーム２３を２組の挟持爪３０，３２で把持しているが、挟持爪３０及び挟持爪３２のいずれか一方でフレーム２３を把持することもできる。   In addition, this invention is not restrict | limited to description of the said embodiment, A various change can be implemented. For example, in the above embodiment, when the frame unit 1 is partially pulled out from the cassette 6, the frame 23 is gripped by the two pairs of clamping claws 30 and 32, but either the clamping claw 30 or the clamping claw 32 is held. The frame 23 can also be gripped by.

図６（Ａ）は、フレームユニット１がカセット６から部分的に引き出される際に、フレーム２３を挟持爪３２によって把持する様子を説明するための一部断面平面図である。この場合、制御ユニット３４は、搬送アーム１４を作動させて、挟持爪３２でフレーム２３の手前側の１か所を把持できる位置まで保持ハンド２０を移動させる。   FIG. 6A is a partial cross-sectional plan view for explaining how the frame 23 is gripped by the clamping claws 32 when the frame unit 1 is partially pulled out from the cassette 6. In this case, the control unit 34 operates the transport arm 14 to move the holding hand 20 to a position where the holding claw 32 can grip one position on the near side of the frame 23.

その後、制御ユニット３４は、挟持爪３２にフレーム２３の手前側の１か所を把持させる。そして、再び搬送アーム１４を作動させて、フレームユニット１をある程度の位置まで引き出す。この場合には、カセット６の内部に挟持爪３２の一部を侵入させるだけで良いので、フレームユニット１の上下の隙間がより狭い場合等でも、フレームユニット１を適切に引き出すことができる。   Thereafter, the control unit 34 causes the clamping claw 32 to grip one location on the near side of the frame 23. Then, the transfer arm 14 is operated again, and the frame unit 1 is pulled out to a certain position. In this case, it is only necessary to allow a part of the clamping claws 32 to enter the inside of the cassette 6, so that the frame unit 1 can be properly pulled out even when the upper and lower gaps of the frame unit 1 are narrower.

なお、この場合には、カセット６の内部に侵入させる挟持爪３２の一部を薄く形成しておくと良い。図６（Ｂ）は、一部が薄く形成された挟持爪３２について説明するための図である。図６（Ｂ）に示すように、挟持爪３２は、上爪８２と下爪８４とを有している。上爪８２の中央部８２ａ及び下爪８４の中央部８４ａは、剛性を確保できるように厚く形成されている。   In this case, it is preferable that a part of the clamping claw 32 that enters the inside of the cassette 6 is formed thin. FIG. 6B is a diagram for explaining the sandwiching claws 32 that are partially formed thin. As shown in FIG. 6B, the clamping claw 32 has an upper claw 82 and a lower claw 84. The central portion 82a of the upper claw 82 and the central portion 84a of the lower claw 84 are formed thick so as to ensure rigidity.

一方で、上爪８２の先端部８２ｂ及び下爪８４の先端部８４ｂは、中央部８２ａ及び中央部８４ａに比べて薄く形成されている。フレームユニット１をカセット６から部分的に引き出す際には、この上爪８２の先端部８２ｂと下爪８４の先端部８４ｂとをカセット６の内部に挿入して、先端部８２ｂと先端部８４ｂとでフレーム２３を把持すれば良い。この場合、フレームユニット１の上下の隙間が更に狭い場合等でも、フレームユニット１を適切に引き出すことができる。なお、ここでは、挟持爪３２を用いる場合についてのみ説明したが、反対側の挟持爪３０を用いる場合も同様である。   On the other hand, the front end portion 82b of the upper claw 82 and the front end portion 84b of the lower claw 84 are formed thinner than the central portion 82a and the central portion 84a. When the frame unit 1 is partially pulled out from the cassette 6, the tip 82b of the upper claw 82 and the tip 84b of the lower claw 84 are inserted into the cassette 6, and the tip 82b and the tip 84b The frame 23 may be gripped with In this case, the frame unit 1 can be pulled out appropriately even when the upper and lower gaps of the frame unit 1 are narrower. Here, only the case of using the clamping claws 32 has been described, but the same applies to the case of using the clamping claws 30 on the opposite side.

また、上記実施形態では、加工装置の一例であるレーザー加工装置２について説明したが、本発明の加工装置は、切削装置、研削装置、研磨装置等でもよい。切削装置は、例えば、レーザー加工ユニット５０の代わりに、円環状の切削ブレードが装着される切削ユニット（加工ユニット）を備える。   Moreover, although the laser processing apparatus 2 which is an example of a processing apparatus was demonstrated in the said embodiment, the cutting apparatus of this invention may be a cutting apparatus, a grinding apparatus, a polishing apparatus, etc. The cutting apparatus includes, for example, a cutting unit (processing unit) to which an annular cutting blade is attached instead of the laser processing unit 50.

研削装置は、例えば、レーザー加工ユニット５０の代わりに、研削用の砥石を含む研削ホイールが装着される研削ユニット（加工ユニット）を備える。研磨装置は、例えば、レーザー加工ユニット５０の代わりに、研磨パッドが装着される研磨ユニット（加工ユニット）を備える。   The grinding apparatus includes, for example, a grinding unit (processing unit) on which a grinding wheel including a grinding wheel is mounted instead of the laser processing unit 50. The polishing apparatus includes, for example, a polishing unit (processing unit) on which a polishing pad is mounted instead of the laser processing unit 50.

その他、上記実施形態に係る構造、方法等は、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施できる。   In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

２ レーザー加工装置（加工装置）
４ 基台
６ カセット
８ カセット載置領域
１０ 搬送ユニット（搬送装置）
１２ 昇降機構（移動部）
１４ 搬送アーム（移動部）
１６ 第１アーム
１８ 第２アーム
２０ 保持ハンド（保持部）
２２ 保持ハンドフレーム
２４ 第１部分
２４ａ 第１突き当て面（突き当て部）
２６ 第２部分
２６ａ 第２突き当て面（突き当て部）
２８ 第３部分
２８ａ 第３突き当て面（突き当て部）
３０，３２ 挟持爪（挟持部）
３４ 制御ユニット（制御部）
３６ チャックテーブル移動機構
３８ Ｙ軸移動テーブル
４０ Ｘ軸移動テーブル
４２ チャックテーブル
４２ａ 保持面
４４ クランプ
４６ 支持構造
４８ 支持アーム
５０ レーザー加工ユニット（加工ユニット）
５２ レンズ
６２，６４ 側板部
６２ａ，６４ａ 棚板部
６６ 天板部
６８ 底板部
７０ 背板部
８２ 上爪
８４ 下爪
８２ａ，８４ａ 中央部
８２ｂ，８４ｂ 先端部
１ フレームユニット
１１ 被加工物
１１ａ 表面
１１ｂ 裏面
１３ デバイス
２１ テープ（粘着テープ）
２３ フレーム 2 Laser processing equipment (processing equipment)
4 base 6 cassette 8 cassette mounting area 10 transport unit (transport device)
12 Lifting mechanism (moving part)
14 Transfer arm (moving part)
16 1st arm 18 2nd arm 20 Holding hand (holding part)
22 holding hand frame 24 first part 24a first abutting surface (butting part)
26 2nd part 26a 2nd butting surface (butting part)
28 3rd part 28a 3rd abutting surface (butting part)
30, 32 Claw (clamping part)
34 Control unit (control unit)
36 Chuck table moving mechanism 38 Y-axis moving table 40 X-axis moving table 42 Chuck table 42a Holding surface 44 Clamp 46 Support structure 48 Support arm 50 Laser processing unit (processing unit)
52 Lens 62, 64 Side plate portion 62a, 64a Shelf plate portion 66 Top plate portion 68 Bottom plate portion 70 Back plate portion 82 Upper claw 84 Lower claw 82a, 84a Central portion 82b, 84b Tip portion 1 Frame unit 11 Work piece 11a Surface 11b Back side 13 Device 21 Tape (adhesive tape)
23 frames

Claims (3)

リング状のフレームの開口にテープを介して板状の被加工物が支持されたフレームユニットを収容するカセットから該フレームユニットを搬出し、所定の位置まで搬送する搬送装置であって、
該フレームの手前側の離れた２か所を上下に挟んで把持可能な２組の挟持部と、該フレームに突き当てられる突き当て部と、を有する保持部と、
該保持部を移動させる移動部と、
各構成要素を制御する制御部と、を備え、
該制御部は、
該挟持部で該フレームを把持して該カセットから部分的に引き出し、該挟持部による把持を解除した後、該フレームを該カセットに向かって移動させるように該突き当て部を該フレームに突き当てた状態で、該挟持部によって該フレームを把持して持ち上げ該所定の位置まで搬送するように各構成要素を制御することを特徴とする搬送装置。 A transport device that unloads the frame unit from a cassette that houses a frame unit in which a plate-shaped workpiece is supported via a tape in an opening of the ring-shaped frame, and transports the frame unit to a predetermined position.
A holding part having two sets of holding parts that can be gripped by sandwiching two places on the front side of the frame from above and below, and an abutting part that abuts against the frame;
A moving unit for moving the holding unit;
A control unit for controlling each component,
The control unit
The frame is gripped by the clamping part and partially pulled out from the cassette. After releasing the clamping by the clamping part, the abutting part is abutted against the frame so as to move the frame toward the cassette. In this state, each of the components is controlled so that the frame is gripped by the holding portion and lifted to the predetermined position. 被加工物を保持するチャックテーブルと、
該チャックテーブルに保持された被加工物を加工する加工ユニットと、
該カセットが載置されるカセット載置領域と、
該カセットから該フレームユニットを搬出して該チャックテーブルまで搬送する搬送ユニットと、を備え、
該搬送ユニットは、請求項１に記載の搬送装置であることを特徴とする加工装置。 A chuck table for holding the workpiece;
A processing unit for processing a workpiece held on the chuck table;
A cassette placement area in which the cassette is placed;
A transport unit that unloads the frame unit from the cassette and transports the frame unit to the chuck table,
The processing apparatus according to claim 1, wherein the transport unit is the transport apparatus according to claim 1. リング状のフレームの開口にテープを介して板状の被加工物が支持されたフレームユニットを収容するカセットから該フレームユニットを搬出し、所定の位置まで搬送する搬送方法であって、
該フレームの手前側の離れた２か所を上下に挟んで把持可能な２組の挟持部と、該フレームに突き当てられる突き当て部と、を有する保持部と、
該保持部を移動させる移動部と、
各構成要素を制御する制御部と、を備える搬送装置を用い、
該２組の挟持部の一方又は双方で該フレームを把持して該カセットから部分的に引き出し、
該２組の挟持部の一方又は双方による把持を解除してから、該フレームを該カセットに向かって移動させるように該突き当て部を該フレームに突き当て、
該突き当て部が該フレームに突き当てられた状態で、該２組の挟持部によって該フレームを把持して持ち上げ該所定の位置まで搬送することを特徴とする搬送方法。 A transport method for unloading the frame unit from a cassette housing a frame unit in which a plate-shaped workpiece is supported via a tape in an opening of a ring-shaped frame, and transporting the frame unit to a predetermined position,
A holding part having two sets of holding parts that can be gripped by sandwiching two places on the front side of the frame from above and below, and an abutting part that abuts against the frame;
A moving unit for moving the holding unit;
A control unit that controls each component, and using a transport device,
Gripping the frame with one or both of the two sets of clamping parts and partially pulling it out of the cassette;
After releasing the grip by one or both of the two sets of clamping parts, the abutting part is abutted against the frame so that the frame is moved toward the cassette,
A conveying method comprising: holding the frame by the two sets of sandwiching portions and lifting the frame to the predetermined position in a state where the abutting portion is abutted against the frame.
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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7330606B2 (en) * 2018-11-07 2023-08-22 株式会社ディスコ Processing device and cassette mounting mechanism

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02178948A (en) * 1988-12-29 1990-07-11 Disco Abrasive Syst Ltd Pre-alignment method of wafer loading frame
JPH11204461A (en) * 1998-01-09 1999-07-30 Disco Abrasive Syst Ltd Device and method for frame positioning
JP2013030703A (en) * 2011-07-29 2013-02-07 Mitsuboshi Diamond Industrial Co Ltd Alignment method and alignment mechanism for wafer ring
JP2014032992A (en) * 2012-08-01 2014-02-20 Mitsuboshi Diamond Industrial Co Ltd Substrate holding ring gripping mechanism

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005150177A (en) * 2003-11-12 2005-06-09 Nitto Denko Corp Method and device for sticking adhesive tape on rear of semiconductor wafer
CN102130033B (en) * 2005-07-08 2014-05-14 交叉自动控制公司 Workpiece support structures and apparatus for accessing same
US20090101067A1 (en) * 2005-07-08 2009-04-23 Bonora Anthony C Method and apparatus for wafer support
JP4451854B2 (en) * 2006-03-20 2010-04-14 東京エレクトロン株式会社 Vertical heat treatment apparatus and control method of transfer mechanism in vertical heat treatment apparatus
US20090196724A1 (en) * 2008-02-05 2009-08-06 Chen Hui Fred Edge contact gripper
JP5504641B2 (en) * 2009-02-13 2014-05-28 株式会社安川電機 Substrate transport robot, substrate transport apparatus including the same, and semiconductor manufacturing apparatus
JP2012084720A (en) 2010-10-13 2012-04-26 Disco Abrasive Syst Ltd Work processing method
SG194239A1 (en) * 2012-04-09 2013-11-29 Semiconductor Tech & Instr Inc End handler
TWI625814B (en) * 2012-07-27 2018-06-01 荏原製作所股份有限公司 Workpiece transport device
EP2891173B1 (en) * 2012-08-31 2019-03-27 Semiconductor Technologies & Instruments Pte Ltd. Multifunction wafer and film frame handling system
JP6158551B2 (en) 2013-03-26 2017-07-05 株式会社ディスコ Wafer dividing method
JP6242603B2 (en) * 2013-06-25 2017-12-06 株式会社ディスコ Wafer processing equipment
JP6314157B2 (en) * 2013-12-26 2018-04-18 川崎重工業株式会社 End effector and substrate transfer robot
US10269606B2 (en) * 2014-05-05 2019-04-23 Persimmon Technologies Corporation Two-link arm trajectory
US20150332950A1 (en) * 2014-05-16 2015-11-19 Applied Materials, Inc. On-end effector magnetic wafer carrier alignment
US20150360370A1 (en) * 2014-06-17 2015-12-17 John Mazzocco Thin end effector with ability to hold wafer during motion
US10933532B2 (en) * 2015-02-13 2021-03-02 Kawasaki Jukogyo Kabushiki Kaisha Substrate conveying robot and operation method therefor
US9929034B2 (en) * 2015-09-03 2018-03-27 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02178948A (en) * 1988-12-29 1990-07-11 Disco Abrasive Syst Ltd Pre-alignment method of wafer loading frame
JPH11204461A (en) * 1998-01-09 1999-07-30 Disco Abrasive Syst Ltd Device and method for frame positioning
JP2013030703A (en) * 2011-07-29 2013-02-07 Mitsuboshi Diamond Industrial Co Ltd Alignment method and alignment mechanism for wafer ring
JP2014032992A (en) * 2012-08-01 2014-02-20 Mitsuboshi Diamond Industrial Co Ltd Substrate holding ring gripping mechanism

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