CN111805076A

CN111805076A - Laser processing apparatus

Info

Publication number: CN111805076A
Application number: CN202010257972.4A
Authority: CN
Inventors: 关家一马
Original assignee: Disco Corp
Current assignee: Disco Corp
Priority date: 2019-04-09
Filing date: 2020-04-03
Publication date: 2020-10-23
Also published as: JP2020171961A; JP7449097B2

Abstract

Provided is a laser processing device capable of performing effective laser processing using the characteristics of a laser beam irradiation unit. A laser processing device (1) comprises: two chuck tables (10) which hold a workpiece (100) by a holding surface (11); an X-axis feeding unit (20) which moves the chuck table (10) in a state of being arranged along the X-axis direction; a laser beam irradiation unit (31) which irradiates a workpiece (100) held by the chuck table (10) with a laser beam to perform processing; and a pair of conveying areas (40) which are arranged in an X-axis direction on both sides of the laser beam irradiation unit (31) and carry the workpiece (100) in and out of the chuck table (10). The laser beam irradiation unit (31) includes a laser oscillator, a condenser (38), and a laser beam scanning unit that shifts the irradiation position of the laser beam on the holding surface (11).

Description

Laser processing apparatus

Technical Field

The present invention relates to a laser processing apparatus.

Background

Conventionally, the following cutting devices have been used: various plate-shaped objects to be processed, such as semiconductor wafers, sapphire substrates, SiC substrates, glass substrates, and resin package substrates, are cut by a cutting tool and processed. Laser processing is also used in which a substrate is removed along lines to be divided by irradiating laser beams, or a modified layer is formed inside (see patent document 1). The cutting device performs machining feed in the X-axis direction with respect to a tool fixed to a spindle on a chuck table holding a workpiece, and cuts the workpiece. Further, the main spindle is indexed in the Y-axis direction perpendicular to the X-axis, and all the streets can be processed.

Patent document 1: japanese patent laid-open publication No. 2013-179237

The laser processing apparatus shown in patent document 1 is greatly different from the cutting apparatus described above in that the laser beam can be scanned on the laser beam irradiation unit side. Since the focus point (machining point) can be moved without moving the chuck table, high-speed scanning, which cannot be achieved by the moving speed of the chuck table, can be used to increase the speed of machining.

However, the laser processing apparatus shown in patent document 1 is set based on the idea of the cutting apparatus, and therefore has the following problems: an effective device structure utilizing the characteristics of the laser light irradiation unit cannot be realized.

Disclosure of Invention

Accordingly, an object of the present invention is to provide a laser processing apparatus capable of performing efficient laser processing utilizing the characteristics of a laser beam irradiation unit.

According to the present invention, there is provided a laser processing apparatus comprising: a 1 st chuck table for holding a workpiece by a holding surface; a 2 nd chuck table for holding the workpiece by a holding surface; an X-axis feeding unit which moves the 1 st and 2 nd chuck tables in a state of being arranged in an X-axis direction; a laser beam irradiation unit which irradiates a laser beam to the workpiece held by the chuck table to perform processing; and a pair of conveying areas which are arranged on both sides of the laser beam irradiation unit along the X-axis direction and convey the object to be processed into or out of the chuck table, the laser beam irradiation unit including: a laser oscillator that emits a laser beam; a condenser that condenses the laser beam emitted from the laser oscillator; and a laser beam scanning unit disposed between the laser oscillator and the condenser, and configured to shift an irradiation position of the laser beam on the holding surface of the chuck table.

Preferably, the laser light scanning unit includes any of a galvano scanner, a resonance scanner, an acousto-optic deflecting element, or a polygon mirror.

Preferably, each of the 1 st chuck table and the 2 nd chuck table includes a rotating unit for rotating the holding surface by a rotating shaft perpendicular to the holding surface.

Preferably, the laser processing apparatus further includes a pair of carrying-in and carrying-out units arranged in the carrying region to carry the object to be processed in and out of the chuck table.

The laser processing device of the present invention can perform effective laser processing using the characteristics of the laser beam irradiation unit.

Drawings

Fig. 1 is a perspective view showing a configuration example of a laser processing apparatus according to embodiment 1.

Fig. 2 is a schematic diagram showing a configuration example of the laser beam irradiation unit according to embodiment 1.

Fig. 3 is a plan view showing the operation of the laser processing apparatus according to embodiment 1.

Fig. 4 is a plan view showing the operation of the laser processing apparatus according to embodiment 1.

Fig. 5 is a perspective view showing a configuration example of the laser processing device according to embodiment 2.

Fig. 6 (a) and (B) are plan views showing the operation of the laser processing apparatus according to embodiment 2.

Description of the reference symbols

1. 1-2: a laser processing device; 10: a chuck table; 11: a holding surface; 14: a rotation unit; 20: an X-axis feeding unit; 30: a laser processing unit; 31. 31-2: a laser beam irradiation unit; 341: a laser oscillator; 37: a laser light scanning unit; 38. 38-2: a condenser; 40: a conveying area; 41: a carrying-in/out unit; 100: a workpiece is processed.

Detailed Description

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. The components described below include those that can be easily conceived by those skilled in the art, and substantially the same ones. The following structures may be combined as appropriate. Various omissions, substitutions, and changes in the structure may be made without departing from the spirit of the invention.

[ embodiment 1 ]

A laser processing apparatus according to embodiment 1 of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a configuration example of a laser processing apparatus according to embodiment 1. A laser processing apparatus 1 according to embodiment 1 shown in fig. 1 is an apparatus for processing a workpiece 100 by irradiating the workpiece with a laser beam. In addition, the X-axis direction, the Y-axis direction, and the Z-axis direction used in the following description are perpendicular to each other. In the following description, the X-axis direction is one direction of the horizontal direction, and the Y-axis direction is the other direction of the horizontal direction, but the Y-axis direction may be one direction of the horizontal direction, and the X-axis direction may be the other direction of the horizontal direction. In the following description, the XY plane coincides with the horizontal plane and the Z-axis direction coincides with the vertical direction, but the XY plane may be offset from the horizontal plane and the Z-axis direction may be offset from the vertical direction.

The object 100 to be processed by the laser processing apparatus 1 according to embodiment 1 includes a semiconductor wafer, an optical device wafer, and the like, and is a substrate having various plate shapes such as a silicon substrate, a sapphire substrate, a gallium substrate, a SiC substrate, a glass substrate, and a resin package substrate. Although the object 100 of embodiment 1 is a semiconductor wafer or an optical device wafer having a constant thickness, the object 100 of the present invention may be a so-called TAIKO wafer having a thinned central portion and a thick portion formed on an outer peripheral portion.

In embodiment 1, for example, a plurality of devices (not shown) formed on the front surface of the workpiece 100 are divided into a lattice shape by a plurality of lines to divide (not shown), and laser processing is performed along the lines to divide by the laser processing apparatus 1 into a plurality of device chips.

In embodiment 1, a dicing tape 107, which is an adhesive tape having a larger diameter than a substrate, is attached to the back surface of the workpiece 100, and an annular frame 108 is attached to the outer periphery of the dicing tape 107. That is, the workpiece 100 is supported by the opening of the annular frame 108 via the dicing tape 107. In the present invention, the workpiece 100 is not limited to this embodiment, and the dicing tape 107 and the annular frame 108 may not be attached.

Further, the object 100 is not limited to the above-described embodiment having a plurality of lines to divide, and in the present invention, the object may be configured to include: an epitaxial substrate (not shown); an optical device layer (not shown) stacked on the front surface side of the epitaxial substrate with a buffer layer (not shown) interposed therebetween; and a transfer substrate (not shown) bonded to the front surface of the optical device layer via a bonding layer (not shown), and the buffer layer is laser-processed by the laser processing apparatus 1 so that the optical device layer can be peeled.

As shown in fig. 1, a laser processing apparatus 1 according to embodiment 1 includes: two (a pair of) chuck tables 10, 10; an X-axis feeding unit 20; a laser processing unit 30; a pair of

conveying areas

40, 40; and a control unit 50.

The two chuck tables 10 and 10 have the same configuration except that one is provided on the + X direction side with respect to the other, that is, the other is provided on the-X direction side with respect to the one. In embodiment 1, one of the two chuck tables 10 and 10 corresponds to the 1 st chuck table of the present invention, and the other corresponds to the 2 nd chuck table of the present invention. In addition, the other of the two chuck tables 10 and 10 may correspond to the 1 st chuck table of the present invention, and the other may correspond to the 2 nd chuck table of the present invention.

As shown in fig. 1, the chuck table 10 is in a disk shape, and the chuck table 10 includes: a holding portion 12 formed of porous ceramics or the like, provided with a holding surface 11 for holding the workpiece 100; and an annular frame portion 13 made of conductive metal surrounding the holding portion 12. The chuck table 10 is provided to be movable in the X-axis direction by an X-axis feeding unit 20.

The chuck table 10 is connected to a vacuum suction source, not shown, and the workpiece 100 is sucked and held by the chuck table 10 by suction from the vacuum suction source. The chuck table 10 is connected to a gas supply source, not shown, and the suction and holding of the workpiece 100 are released by supplying a pressurized gas from the gas supply source.

The chuck table 10 includes four jigs 15 arranged on the outer periphery of the holding surface 11, and holds and fixes a frame 108 that supports the workpiece 100 via the dicing tape 107.

The X-axis feed unit 20 is disposed on the upper surface of the horizontal portion of the L-shaped base 2 along the X-axis direction, and moves the two chuck tables 10 and 10 in the X-axis direction simultaneously while being aligned in the X-axis direction. As shown in fig. 1, the X-axis feed unit 20 includes: a pair of X-axis guide rails 21 which are substantially parallel to the X-axis direction; two (a pair of) X-axis moving tables 22 and 22 attached to the X-axis guide rail 21 so as to be slidable in the X-axis direction; an X-axis ball screw 23 screwed to the lower surfaces of the two X-axis moving tables 22 and shared therewith, the X-axis ball screw 23 being parallel to the X-axis guide rail 21; and an X-axis pulse motor 24 connected to one end of the X-axis ball screw 23.

The two X-axis moving tables 22 and 22 have the same configuration except that one is provided on the + X direction side with respect to the other, that is, the other is provided on the-X direction side with respect to one. In embodiment 1, one of the X-axis moving tables 22 supports one of the chuck tables 10 to be rotatable about the Z-axis, and the other X-axis moving table 22 supports the other chuck table 10 to be rotatable about the Z-axis.

The X-axis ball screw 23 is rotated by the X-axis pulse motor 24, and the two X-axis moving tables 22 and 22 are simultaneously moved in the X-axis direction along the X-axis guide rail 21 while being aligned in the X-axis direction. Thereby, the one chuck table 10 supported by the one X-axis moving table 22 and the other chuck table 10 supported by the other X-axis moving table 22 are simultaneously moved in the X-axis direction along the X-axis guide rails 21 while being aligned in the X-axis direction. The X-axis feeding unit 20 is provided with an X-axis measuring unit, not shown, for measuring the positions of the two X-axis moving tables 22 and 22 in the X-axis direction, and the positions of the two chuck tables 10 and 10 in the X-axis direction can be measured based on the measurement of the positions of the two X-axis moving tables 22 and 22 in the X-axis direction.

As shown in fig. 1, a laser processing unit 30 is provided in an upright portion erected from a horizontal portion of an L-shaped base 2, so as to project in the-Y direction above a pair of X-axis guide rails 21 of an X-axis feeding unit 20. The laser processing unit 30 includes: a laser beam irradiation unit 31; and an imaging unit 32 disposed apart from the laser beam irradiation unit 31 in the X-axis direction and facing the-Z direction.

Fig. 2 is a diagram showing a configuration example of the laser beam irradiation unit 31 according to embodiment 1. The laser beam irradiation unit 31 irradiates the workpiece 100 held by the chuck table 10 with a laser beam 301 to perform processing, and as shown in fig. 2, the laser beam irradiation unit 31 includes a laser beam generation unit 34, an optical system 35, a wavelength conversion element 36, a laser beam scanning unit 37, and a condenser 38.

The laser beam generation unit 34 includes a laser oscillator 341 and a repetition frequency setting unit 342. The LASER oscillator 341 is a device that oscillates the LASER beam 300 having a predetermined wavelength, and in embodiment 1, a device that excites a crystal such as YAG doped with neodymium (Nd) ions with a LASER Diode (LD) and oscillates a LASER beam having a wavelength of about 1 μm is preferably used.

Repetition frequency setting section 342 is a section for setting the repetition frequency of the laser beam oscillated by laser oscillator 341, and in embodiment 1, it is preferable to use laser beam generating section 34 for generating laser beam 300 having a wavelength of about 514nm as the second harmonic from the laser beam having a wavelength of about 1 μm with a repetition frequency of 2 times.

In embodiment 1, the laser beam generating unit 34 is controlled by the control unit 50 to generate the laser beam 300, and the laser beam 300 is a pulsed laser beam having a repetition frequency of 50kHz to 200kHz, an average output of 0.1W to 2.0W, and a pulse width of 20ps or less.

The optical system 35 includes at least one of predetermined optical devices such as a beam diameter adjuster and an output adjuster, and transmits the laser beam 300 generated from the laser beam generation unit 34. The wavelength conversion element 36 is an element that converts the wavelength of the laser beam 300 transmitted through the optical system 35, and in embodiment 1, converts the laser beam 300 having a wavelength of about 514nm generated by the laser beam generation unit 34 into a laser beam 301 having a wavelength of about 257nm, which is a second harmonic thereof, that is, a fourth harmonic of the original laser beam having a wavelength of about 1 μm.

In embodiment 1, since the wavelength conversion element 36 is provided downstream of the optical system 35 in the traveling direction of the

laser beams

300 and 301 in the laser beam irradiation unit 31, the wavelength of the laser beam passing through the optical system 35 can be made longer than the wavelength of the laser beam finally irradiated, and thus damage to the optical system 35 can be suppressed.

As shown in fig. 2, the laser beam scanning unit 37 is disposed between the laser oscillator 341 and a condenser 38 described later. More specifically, the optical system 35 and the wavelength conversion element 36 are disposed downstream of the laser beam generation unit 34 having the laser oscillator 341, and the laser beam scanning unit 37 is disposed further downstream than the optical system 35 and the wavelength conversion element 36. The laser beam scanning unit 37 displaces the irradiation position of the laser beam 301 on the XY plane on the holding surface 11 of the chuck table 10.

In embodiment 1, the laser light scanning unit 37 includes any one of a galvano scanner, a resonance scanner, an acousto-optic deflecting element, or a polygon mirror. The laser beam scanning unit 37 is controlled by the control unit 50 to cause the laser beam 301 to swing in the X-axis direction and the Y-axis direction and to be guided to the condenser 85.

The condenser 38 has a circular shape having a diameter equal to or larger than the holding surface 11 of the chuck table 10 on the XY plane, and is provided so as to cover the upper side of the holding surface 11 of the chuck table 10 when positioned below the laser beam irradiation unit 31. The condenser 38 condenses the laser beam 301 emitted from the laser oscillator 341 and scanned by the laser beam scanning unit 37.

The condenser 38 may be exemplified by a large F θ lens having the above-described diameter, or an image-side telecentric objective lens having the above-described diameter, and in any case, the optical axis is arranged along the Z-axis direction. The condenser 38 irradiates the laser beam 301 in a direction parallel to the Z-axis direction, which is the optical axis direction, that is, perpendicular to the holding surface 11 of the chuck table 10, regardless of the incident angle of the laser beam 301 derived from the laser beam scanning unit 37.

As shown in fig. 1, the imaging unit 32 is provided on the XY plane at a position outside the condenser 38 of the laser beam irradiation unit 31 in the-Z direction. Therefore, the imaging unit 32 can image the X-axis moving table 22 supporting the chuck table 10 positioned below the laser beam irradiation unit 31 without being obstructed by the condenser 38. The imaging unit 32 images the workpiece 100 held by the holding surface 11 of the chuck table 10 positioned below the imaging unit 32, obtains an image for performing alignment of the irradiation position of the laser beam 301 of the laser beam irradiation unit 31 with the workpiece 100 held by the holding surface 11 of the chuck table 10, and outputs the obtained image to the control unit 50. In embodiment 1, for example, before the laser processing by the laser beam irradiation unit 31, the chuck table 10 may be positioned below the imaging unit 32 to perform alignment, the chuck table 10 may be moved to below the condenser 38, and then the laser processing by the laser beam irradiation unit 31 may be performed.

As shown in fig. 1, the pair of

conveyance zones

40 and 40 are arranged in the X-axis direction on both sides of the laser beam irradiation unit 31 of the laser processing unit 30. Specifically, the pair of

conveyance areas

40 and 40 are provided on both sides in the X-axis direction of the area where the laser beam irradiation unit 31 is provided. That is, one of the conveying areas 40 is provided on the + X direction side of the area where the laser beam irradiation unit 31 is provided, and the other conveying area 40 is provided on the-X direction side of the area where the laser beam irradiation unit 31 is provided. The pair of conveying

zones

40, 40 have the same configuration except that one is provided on the + X direction side with respect to the other, that is, the other is provided on the-X direction side with respect to one.

As shown in fig. 1, the X-axis direction interval between the one conveying region 40 and the region where the laser beam irradiation unit 31 is provided and the X-axis direction interval between the region where the laser beam irradiation unit 31 is provided and the other conveying region 40 are both set to be equal to the X-axis direction interval between the two X-axis moving tables 22, 22 in the X-axis feeding unit 20, that is, the X-axis direction interval between the two chuck tables 10, 10. Therefore, in the laser processing apparatus 1 according to embodiment 1, when one chuck table 10 is located in the region where the laser beam irradiation unit 31 is provided, the other chuck table 10 is located in the other transport region 40, and when the other chuck table 10 is located in the region where the laser beam irradiation unit 31 is provided, the one chuck table 10 is located in the one transport region 40.

As shown in fig. 1, the conveyance area 40 is provided with a carrying-in/out unit 41, a pair of Y-axis guide rails 43 substantially parallel to the Y-axis direction, a cassette lifter 44, and a cassette 45. The carrying-in and carrying-out unit 41 carries the object 100 in and out of the chuck table 10 located in the conveying area 40. The carrying-in/out unit 41 includes a gripping portion 42, and the gripping portion 42 grips a frame 108 that supports the workpiece 100 via a dicing tape 107. The carrying-in/out unit 41 is controlled by the control unit 50 and moved in the Y-axis direction by a drive mechanism not shown.

As shown in fig. 1, the pair of Y-axis guide rails 43 are supported by the ends of the upper surface of the cassette lifter 44 in the + Y direction, and are provided so as to protrude in the + Y direction above the pair of X-axis guide rails 21 of the X-axis feeding unit 20. The pair of Y-axis guide rails 43 are controlled by the control unit 50 to move away from each other in the X-axis direction or move closer to each other in the X-axis direction, and can perform an operation of changing the distance width of each other.

As shown in fig. 1, the cassette lifter 44 is provided adjacent to the-Y direction side end face of the horizontal portion of the L-shaped base 2. The cassette lifter 44 is a cassette mounting area in which a cassette 45 that stores the workpiece 100 before and after laser processing is mounted on the upper surface and the cassette 45 is moved up and down in the Z-axis direction under the control of the control unit 50.

The magazine 45 separately stores the workpiece 100 before laser processing and the workpiece 100 after laser processing. The cassette 45 is placed on the upper surface of the cassette lifter 44, and is moved up and down by the cassette lifter 44, whereby the workpiece 100 carried out by the carrying-in/out unit 41 can be changed.

The operation of carrying out the workpiece 100 by the carrying-in and carrying-out unit 41 will be described. The carrying-in/out unit 41 moves in the-Y direction, and the frame 108 of the workpiece 100 before laser processing placed in the cassette 45 in the cassette lifter 44 is gripped by the gripping portion 42. Then, the carrying-in/out unit 41 moves in the + Y direction while holding the frame 108 of the workpiece 100 by the holding portion 42, and carries out the workpiece 100 before laser processing from the cassette 45. When the frame 108 is gripped by the grip 42 and carried out, the workpiece 100 is carried out in the + Y direction with both ends of the frame 108 in the X-axis direction supported and guided by the pair of Y-axis guide rails 43. Then, the carry-in/out unit 41 releases the state in which the gripping portion 42 grips the frame 108 of the workpiece 100. Thus, the frame 108 of the workpiece 100, which has been held by the holding portion 42, is supported by the pair of Y-axis guide rails 43.

Then, the pair of Y-axis guide rails 43 perform a centering operation of positioning the frame 108 at a predetermined position in the X-axis direction by narrowing the interval therebetween. Then, the carrying-in/out unit 41 moves upward while sucking and holding the frame 108 positioned at a predetermined position by a vacuum pad, not shown, provided below the carrying-in/out unit 41, thereby raising the workpiece 100 from the pair of Y-axis rails 43. Then, the distance between the pair of Y-axis guide rails 43 is expanded, and the carry-in/out unit 41 that holds the frame 108 by suction is lowered, so that the workpiece 100 and the frame 108 pass between the pair of Y-axis guide rails 43 and are placed on the chuck table 10.

The carrying in operation of the workpiece 100 by the carrying in/out unit 41 will be described. The carrying-in and carrying-out unit 41 moves in the + Y direction, then moves downward to pass between the pair of Y-axis guide rails 43, and the frame 108 of the laser-processed workpiece 100 on the holding surface 11 of the chuck table 10 is sucked and held by a vacuum pad, not shown, provided below the carrying-in and carrying-out unit 41, and moves to a position above the pair of Y-axis guide rails 43. Then, the pair of Y-axis guide rails 43 narrow the gap therebetween, and the carry-in/out unit 41 that suctions and holds the frame 108 is lowered, thereby placing the workpiece 100 and the frame 108 between the pair of Y-axis guide rails 43. Thus, the frame 108 of the workpiece 100 after laser processing is supported by the pair of Y-axis guide rails 43.

Then, after the carrying-in/out unit 41 further moves in the + Y direction, the frame 108 of the laser-machined workpiece 100 supported by the pair of Y-axis guide rails 43 is gripped by the gripping portion 42. Then, the carrying-in/out unit 41 moves in the-Y direction while holding the frame 108 of the workpiece 100 by the holding part 42, and carries the workpiece 100 subjected to laser processing into the magazine 45. When the frame 108 is gripped by the grip 42 and carried in, both ends of the frame 108 in the X-axis direction are supported and guided by the pair of Y-axis guide rails 43, and the workpiece 100 is carried in the-Y direction. Then, the carrying-in/out unit 41 releases the state in which the gripping portion 42 grips the frame 108 of the workpiece 100, and can put the workpiece 100 after laser processing in the magazine 45.

In the present embodiment, the carrying-in/out unit 41 automatically carries out the carrying-in/out operation and the carrying-out operation of the workpiece 100, but the present invention is not limited to this, and the carrying-in/out operation and the carrying-in operation of the workpiece 100 may be manually carried out by an operator.

The control unit 50 controls each unit of the laser processing apparatus 1 to cause the laser processing apparatus 1 to perform the following operations: an operation of moving the chuck table 10 in the X-axis direction by the X-axis feeding unit 20; an operation of performing laser processing on the object 100 held by the holding surface 11 of the chuck table 10 by the laser processing unit 30; an operation of carrying out the workpiece 100 before laser processing from the cassette 45 to the holding surface 11 of the chuck table 10 in the carrying area 40; and an operation of carrying the workpiece 100 after the laser processing from the holding surface 11 of the chuck table 10 into the magazine 45. The control unit 50 is a computer, and the control unit 50 has: an arithmetic processing device having a microprocessor such as a Central Processing Unit (CPU); a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory); and an input/output interface device. The arithmetic processing device of the control unit 50 performs arithmetic processing in accordance with a computer program stored in the storage device, and outputs a control signal for controlling the laser processing apparatus 1 to each unit of the laser processing apparatus 1 via the input/output interface device.

As shown in fig. 1, the control unit 50 has an X-axis feed control section 51 and a processing and conveyance control section 52. The X-axis feed control unit 51 rotates the X-axis ball screw 23 by the X-axis pulse motor 24, and moves the two X-axis moving tables 22 and 22 supporting the two chuck tables 10 and 10 in the X-axis direction along the X-axis guide rail 21 in a state of being aligned in the X-axis direction. The processing and conveying controller 52 performs the laser processing by irradiating the laser beam 301 to the workpiece 100 held by one chuck table 10 positioned below the laser processing unit 30 by the laser processing unit 30, and carries the workpiece 100 after the laser processing held by the other chuck table 10 positioned in the conveying area 40 into the cassette 45 by the carrying-in and carrying-out unit 41, and places the workpiece 100 before the laser processing on the holding surface 11 of the other chuck table 10 from the cassette 45.

Next, the operation of the laser processing apparatus 1 according to embodiment 1 will be described with reference to the drawings. Fig. 3 and 4 are plan views each illustrating an operation of the laser processing apparatus 1 according to embodiment 1.

As shown in fig. 3, when one chuck table 10 is positioned below the laser processing unit 30 and the other chuck table 10 is positioned in the other transport region 40 (after the second moving step 2 described later), the processing and transport control unit 52 performs the laser processing by irradiating the laser beam 301 to the workpiece 100 held by the one chuck table 10 by the laser processing unit 30, carries the workpiece 100 after the laser processing held by the other chuck table 10 into the magazine 45 by the carrying-in and carrying-out unit 41, and places the workpiece 100 before the laser processing on the holding surface 11 of the other chuck table 10 from the magazine 45 (the first processing and transport step 1).

As shown in fig. 3, when one chuck table 10 is positioned below the laser processing unit 30 and the other chuck table 10 is positioned in the other transport region 40 to complete the first processing and transporting step (after the first processing and transporting step), the X-axis feed control unit 51 moves the two X-axis moving tables 22 and 22 supporting the two chuck tables 10 and 10 in the X-axis direction along the X-axis guide 21 while maintaining the X-axis interval therebetween in a state of being aligned in the X-axis direction, thereby positioning the one chuck table 10 in the one transport region 40 and positioning the other chuck table 10 below the laser processing unit 30 as shown in fig. 4 (the 1 st moving step).

As shown in fig. 4, when one chuck table 10 is positioned in one transport region 40 and the other chuck table 10 is positioned below the laser processing unit 30 (after the first movement step described above), the processing and transport control unit 52 performs the laser processing by irradiating the laser beam 301 to the workpiece 100 held by the other chuck table 10 by the laser processing unit 30, carries the workpiece 100 after the laser processing held by the one chuck table 10 into the magazine 45 by the carrying-in and carrying-out unit 41, and places the workpiece 100 before the laser processing on the holding surface 11 of the one chuck table 10 from the magazine 45 (the second processing and transport step).

As shown in fig. 4, when one chuck table 10 is positioned in one transport region 40 and the other chuck table 10 is positioned below the laser processing unit 30 and the 2 nd processing and transport step is finished (in the case after the 2 nd processing and transport step), the X-axis feed control unit 51 moves the two X-axis moving tables 22 and 22 supporting the two chuck tables 10 and 10, respectively, in the X-axis direction along the X-axis guide 21 while maintaining the X-axis direction interval therebetween in a state of being aligned in the X-axis direction, thereby positioning the one chuck table 10 below the laser processing unit 30 and positioning the other chuck table 10 in the other transport region 40 as shown in fig. 3 (the 2 nd moving step).

In embodiment 1, since the processing and conveying controller 52 can scan the laser beam 301 by the laser beam scanning unit 37 over the entire surface in the XY plane direction of the workpiece 100 held by the holding surface 11 of the chuck table 10 covered by the condenser 38 in the 1 st processing and conveying step and the 2 nd processing and conveying step, it is possible to perform a desired laser processing treatment along the entire surface in the XY plane direction of the workpiece 100 by the laser processing unit 30 without moving the chuck table 10 in the X axis direction or the Y axis direction.

The laser processing apparatus 1 according to embodiment 1 can execute a desired laser processing process along the entire XY plane direction of the workpiece 100 by the laser processing unit 30 without moving the chuck table 10 in the X axis direction or the Y axis direction, and therefore can utilize the movement of the chuck table 10 in carrying in and out the workpiece 100 below the laser processing unit 30. In addition, since the laser processing apparatus 1 according to embodiment 1 has the pair of conveyance areas 40 arranged in the X-axis direction on both sides of the laser beam irradiation unit 31, the X-axis feeding unit 20 simultaneously moves the two chuck tables 10 and 10 in the state of being arranged in the X-axis direction, and the workpiece 100 can be carried in and out at a time below the laser processing unit 30. The laser processing apparatus 1 according to embodiment 1 is capable of carrying the workpiece 100 after the laser processing into the cassette 45 and carrying the workpiece 100 before the laser processing out of the cassette 45 while carrying out the laser processing on the chuck table 10 located in the conveyance area 40 retracted from the lower side of the laser processing unit 30 with respect to the chuck table 10 located below the laser processing unit 30. Therefore, the laser processing apparatus 1 according to embodiment 1 can perform effective laser processing utilizing the characteristic that the irradiation region of the laser beam 301 of the laser beam irradiation unit 31 is wide.

In addition, the laser beam scanning unit 37 of the laser processing apparatus 1 of embodiment 1 includes a galvano scanner, a resonance scanner, an acousto-optic deflecting element, or a polygon mirror. Therefore, the laser processing apparatus 1 according to embodiment 1 can appropriately scan the laser beam 301 along the entire surface of the object 100 in the XY plane direction to perform a desired laser processing.

The laser processing apparatus 1 according to embodiment 1 includes a carrying-in/out unit 41 for carrying the object 100 in and out of the chuck table 10 in the carrying area 40. Therefore, the laser processing apparatus 1 according to embodiment 1 can automatically carry the workpiece 100 after the laser processing into the cassette 45 and carry out the workpiece 100 before the laser processing from the cassette 45 by the carrying-in and carrying-out unit 41 with respect to the chuck table 10 in the carrying area 40, and thus can perform more efficient laser processing of the workpiece 100.

[ 2 nd embodiment ]

A laser processing apparatus 1-2 according to embodiment 2 of the present invention will be described with reference to the drawings. Fig. 5 is a perspective view showing a configuration example of the laser processing device 1-2 according to embodiment 2. Fig. 6 is a plan view illustrating the operation of the laser processing apparatus 1-2 according to embodiment 2. In fig. 5 and 6, the same portions as those of embodiment 1 are denoted by the same reference numerals, and description thereof is omitted.

As shown in fig. 5 and 6, the laser processing apparatus 1-2 according to embodiment 2 is similar to embodiment 1 except that the chuck table 10 includes the rotation unit 14 and the laser processing unit 30-2 instead of the laser processing unit 30 in embodiment 1. In embodiment 2, the chuck table 10 is provided such that the holding surface 11 is rotatable about an axial center along the Z-axis direction by the rotating unit 14.

As shown in fig. 5 and 6, the laser processing unit 30-2 has: a laser beam irradiation unit 31-2; and an imaging unit 32-2 which is disposed apart from the laser beam irradiation unit 31-2 in the X-axis direction and faces the-Z direction.

The laser beam irradiation unit 31-2 is the same as the above-described laser beam irradiation unit 31 except that the condenser 38 is provided instead of the condenser 38, and the condenser 38-2 is provided. The condenser 38-2 is formed in a rectangular shape on the XY plane by changing the shape and size of the condenser 38, and is provided so as to cover the upper side of the region around half of the holding surface 11 of the chuck table 10 when positioned below the laser beam irradiation unit 31-2.

As shown in fig. 5 and 6, the photographing unit 32-2 is disposed such that the optical axis in photographing passes through the remaining half or so of the region of the holding surface 11 of the chuck table 10 located below the laser beam irradiation unit 31 that is not covered by the condenser 38-2. Therefore, the imaging unit 32-2 can image the remaining half or the region of the holding surface 11 of the chuck table 10 located below the laser beam irradiation unit 31, which is not covered with the condenser 38-2, without being obstructed by the condenser 38-2. The imaging unit 32-2 images the workpiece 100 held by the holding surface 11 of the chuck table 10 positioned below the laser beam irradiation unit 31 to obtain an image for performing alignment for aligning the irradiation position of the laser beam 301 of the laser beam irradiation unit 31 with the workpiece 100 held by the holding surface 11 of the chuck table 10, and outputs the obtained image to the control unit 50.

Next, the operation of the laser processing apparatus 1-2 according to embodiment 2 will be described with reference to the drawings. In embodiment 2, the processing and conveying controller 52 can scan the laser beam 301 along the half surface on the-X direction side in the XY plane direction of the workpiece 100 held on the holding surface 11 of the chuck table 10 covered by the condenser 38-2 by the laser beam scanning unit 37. Therefore, the processing and conveying controller 52 first arranges one half surface 100-1 of the workpiece 100 in the region covered by the condenser 38-2 as shown in fig. 6 (a), and executes a desired laser processing along the entire surface of the one half surface 100-1 of the workpiece 100. Then, the machining and conveying controller 52 rotates the chuck table 10 by 180 degrees (half a circle) around the Z axis by the rotation unit 14, and arranges the other half surface 100-2 of the workpiece 100 in the region covered by the condenser 38-2 as shown in fig. 6 (B). Then, the machining and conveyance controller 52 performs a desired laser machining process along the entire other half surface 100-2 of the workpiece 100. In this way, in embodiment 2, the processing and conveyance controller 52 performs the laser processing on the half surfaces 100-1 and 100-2 of the workpiece 100 while driving the rotating unit 14.

In the laser processing apparatus 1-2 according to embodiment 2, the chuck table 10 is rotated by 180 degrees at a time by the rotating unit 14, so that a desired laser processing process can be performed along the entire XY plane direction of the workpiece 100 by the laser processing unit 30 without moving the chuck table 10 in the X axis direction or the Y axis direction, and therefore, the movement of the chuck table 10 can be used for carrying in and out the workpiece 100 below the laser processing unit 30. With respect to other configurations and operations, the laser processing apparatus 1-2 according to embodiment 2 is the same as the laser processing apparatus 1 according to embodiment 1, and therefore, the following operational effects can be obtained in the same manner as the laser processing apparatus 1 according to embodiment 1: effective laser processing can be performed by utilizing the characteristic that the irradiation area of the laser beam 301 by the laser beam irradiation unit 31 is wide.

In the laser processing apparatus 1-2 according to embodiment 2, the imaging unit 32-2 can image a part of the holding surface 11 of the chuck table 10 located below the laser beam irradiation unit 31 without being obstructed by the condenser 38-2, and therefore, the alignment accuracy can be further improved as compared with the laser processing apparatus 1 according to embodiment 1.

The present invention is not limited to the above embodiments. That is, various modifications can be made and implemented without departing from the scope of the present invention.

In addition, the X-axis feed unit 20 of the present invention is not limited to the structure using the X-axis pulse motor 24 and the X-axis ball screw 23. For example, the X-axis feed unit 20 may be configured as a linear motion mechanism using a linear servo motor as follows: the X-axis feed control can be independently performed on the 1 st chuck table and the 2 nd chuck table by respectively having a driving source. Thus, while one chuck table is stopped, the other chuck table can be controlled to move, and restrictions on conveyance and processing are significantly reduced.

Claims

1. A laser processing apparatus includes:

a 1 st chuck table for holding a workpiece by a holding surface;

a 2 nd chuck table for holding the workpiece by a holding surface;

an X-axis feeding unit which moves the 1 st and 2 nd chuck tables in a state of being arranged in an X-axis direction;

a laser beam irradiation unit which irradiates a laser beam to the workpiece held by the chuck table to perform processing; and

a pair of conveying areas which are arranged along the X-axis direction at two sides of the laser beam irradiation unit and are used for conveying the object to be processed into or out of the chuck worktable,

the laser beam irradiation unit includes:

a laser oscillator that emits a laser beam;

a condenser that condenses the laser beam emitted from the laser oscillator; and

and a laser beam scanning unit which is disposed between the laser oscillator and the condenser and shifts an irradiation position of the laser beam on the holding surface of the chuck table.

2. The laser processing apparatus according to claim 1,

the laser light scanning unit includes any of a galvano scanner, a resonance scanner, an acousto-optic deflecting element, or a polygon mirror.

3. The laser processing apparatus according to claim 1 or 2,

the 1 st chuck table and the 2 nd chuck table each include a rotating unit that rotates the holding surface by a rotating shaft perpendicular to the holding surface.

4. The laser processing apparatus according to any one of claims 1 to 3,

the laser processing apparatus further includes a pair of carry-in and carry-out units that are disposed in the transfer area and carry in and carry out the object to be processed with respect to the chuck table.