JP2017073442A - Processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing device improved in processing efficiency by reducing time loss that occurs as hold means holding a workpiece moves.SOLUTION: A processing device comprises at least: fist and second hold means having a hold table for holding a workpiece; X-axial feed means for processing and feeding the first and second hold means in an X-axial direction; first and second Y-axial feed means for processing and feeding them in a Y-axial direction orthogonal to the X-axial direction of the first and second hold means; processing means for processing the workpiece held by the first and second hold means; and alignment means for imaging the workpiece held by the first and second hold means and detecting an area to be processed. The first and second hold means are configured such that the angle of the hold table to the X-axial direction can be adjusted. The processing device successively processes workpieces by successively positioning the first hold means and the second hold means to the processing means by the X-axial feed means.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a processing apparatus that performs processing on a workpiece that is held by a holding unit that is movable relative to the processing unit.

  A wafer in which a plurality of devices such as IC, LSI, etc., are defined by dividing lines and formed on the surface is individually divided along the above-described dividing lines called streets arranged in a lattice pattern by a dicing apparatus, a laser processing apparatus, or the like. The divided semiconductor devices are used for electric devices such as mobile phones and personal computers.

  The dicing apparatus described above includes a holding unit that holds a workpiece, a cutting unit that rotatably includes a cutting blade that cuts the workpiece held by the holding unit, and the holding unit. X-axis feed means for machining and feeding, and Y-axis feed means for machining and feeding the holding means in the Y-axis direction orthogonal to the X-axis direction, and dividing the wafer into individual devices with high accuracy (For example, refer to Patent Document 1).

  The laser processing apparatus described above also has a holding means for holding the workpiece, a laser beam irradiation means for irradiating the workpiece held by the holding means with a laser beam, and processing and feeding the holding means in the X-axis direction. At least an X-axis feeding means and a Y-axis feeding means for processing and feeding the holding means in the Y-axis direction orthogonal to the X-axis direction can be provided to perform processing for dividing the wafer into individual devices with high accuracy. (For example, see Patent Document 2).

  As described above, in both the dicing apparatus and the laser processing apparatus, the workpiece is configured to be processed while being held by the holding means for holding the workpiece, and the cutting blade or the laser beam irradiating means is used. On the other hand, the workpiece is fed so as to move relatively.

  In general processing apparatuses such as the above-described dicing apparatus and laser processing apparatus, the workpiece is moved in the X-axis direction and processed from one end to the other end of the workpiece. Processing is fed in the Y-axis direction orthogonal to the X-axis direction, and the same processing is performed from the other end side to the one end side this time. In this way, the reciprocating motion in the X-axis direction is performed by the number of the division-scheduled lines, and deceleration, stop, and re-acceleration are performed at the timing when the moving direction changes at one end and the other end in the X-axis direction. Will repeat. In both the dicing apparatus and the laser processing apparatus, the holding means is moved relative to the processing means such as a cutting blade and a laser beam irradiation means at a predetermined constant speed in order to improve processing stability and processing accuracy. However, the holding means may include a motor, an air supply means, etc., and is often provided with a considerable weight (for example, 30 kg). When the above-mentioned deceleration, stop, and reacceleration are performed after machining from one end to the other end at a predetermined constant speed, a corresponding time is required. In particular, particularly in a laser processing apparatus, the moving speed of the holding means may be high (for example, 100 to 1000 mm / s). When processing one wafer, the number of lines to be divided is reduced. The time required for “stop, acceleration” accumulates, which is a time loss during processing, which hinders improvement in processing efficiency.

JP 2010-110849 A JP 2012-161799 A

  As described above, in a processing apparatus that performs processing by reciprocating the holding means holding the workpiece relative to the processing means, there is a problem that time loss occurs when the holding means reciprocates. Although the moving speed of the holding means by the X-axis feeding means is slower than that of the laser processing apparatus, the dicing apparatus has the same problem.

  The present invention has been made in view of the above-mentioned facts, and its main technical problem is to provide a machining apparatus that improves the machining efficiency by reducing the time loss that occurs in response to the movement of the holding means. It is in.

  In order to solve the above main technical problem, according to the present invention, the processing apparatus is a first holding means having a holding table for holding a workpiece, and a second having a holding table for holding the workpiece. Holding means, X-axis feeding means for machining and feeding the first holding means and the second holding means in the X-axis direction, and machining in the Y-axis direction orthogonal to the X-axis direction of the first holding means The first Y-axis feeding means for feeding, the second Y-axis feeding means for machining and feeding in the Y-axis direction perpendicular to the X-axis direction of the second holding means, and the first holding means Processing means for processing the workpiece and the workpiece held by the second holding means; and imaging and processing the workpiece held by the first holding means and the second holding means Alignment means for detecting a power region, and the first and second holding means The angle of the holding table relative to the X-axis direction can be adjusted, and the first holding means and the second holding means are sequentially positioned on the processing means by the X-axis feeding means. A processing apparatus for sequentially processing objects is provided.

  In the processing apparatus of the present invention, alignment means can be provided corresponding to the first holding means and the second holding means, and as the processing means, a collection for irradiating a workpiece with a laser beam. Laser beam irradiation means including an optical device can be provided.

The processing apparatus according to the present invention includes a first holding unit having a holding table for holding a workpiece, a second holding unit having a holding table for holding a workpiece, the first holding unit, and the first holding unit. An X-axis feed means for machining and feeding the second holding means in the X-axis direction, a first Y-axis feed means for machining and feeding in the Y-axis direction orthogonal to the X-axis direction of the first holding means, and the second A second Y-axis feed means that feeds the workpiece in the Y-axis direction orthogonal to the X-axis direction of the holding means, a workpiece held by the first holding means, and the second holding means Processing means for processing the workpiece, and alignment means for detecting an area to be processed by imaging the workpiece held by the first holding means and the second holding means, The first and second holding means determine the angle of the holding table relative to the X-axis direction. In addition to being configured to be adjustable, the first holding means and the second holding means are sequentially positioned on the processing means by the X-axis feed means to sequentially process the workpiece. The value obtained by dividing the time loss that occurs in each machining feed in the X-axis direction by the number of holding means is the time loss per holding means, so the substantial time loss is reduced compared to a configuration that has only one holding means. The processing efficiency can be improved.
In addition, since a plurality of workpieces can be continuously processed without time loss, production efficiency can be improved and a processing apparatus can be provided at a low cost. That is, by continuously processing the workpiece by providing a plurality of holding means, the cost of the expensive laser oscillator can be reduced according to the number of holding means provided.

The perspective view which shows 1st embodiment of the processing apparatus formed according to this invention. The figure for demonstrating the laser processing performed by 1st embodiment shown in FIG. The perspective view which shows 2nd embodiment of the processing apparatus formed according to this invention.

  Hereinafter, a preferred first embodiment of a processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a perspective view of a laser processing apparatus employing a laser beam irradiation means as a processing means as a processing apparatus configured according to the present invention. A laser processing apparatus 1 shown in FIG. 1 includes a stationary base 2 and first to third holders that hold a workpiece disposed on the stationary base 2 so as to be movable in the X-axis direction indicated by an arrow X. Chuck table mechanisms 3a, 3b, 3c forming means (hereinafter abbreviated as "3a, 3b, 3c" may be abbreviated as "3a-3c") and on the stationary base 2 And a laser beam irradiation unit 4 as a laser beam irradiation means.

  The three chuck table mechanisms 3a to 3c include a pair of guide rails 31 and 31 disposed in parallel along the X-axis direction on the stationary base 2, and the X-axis direction on the guide rails 31 and 31. First slide blocks 32a to 32c arranged to be movable, and first slide blocks 32a to 32c arranged on the first slide blocks 32a to 32c to be movable in the Y-axis direction indicated by an arrow Y orthogonal to the X-axis direction. Two sliding blocks 33a to 33c, cover tables 35a to 35c supported by cylindrical members 34a to 34c on the second sliding blocks 33a to 33c, and a chuck table 36a as a holding table for holding a workpiece. To 36c and arranged in series in the X-axis direction.

  These chuck tables 36a to 36c are provided with suction chucks 361a to 361c made of a porous material, and a suction means (not shown) for operating the workpiece is operated on the holding surface which is the upper surface of each suction chuck 361a to 361c. Is supposed to be held by. The chuck tables 36a to 36c configured in this manner are configured to be rotatable by a pulse motor (not shown) disposed in the cylindrical members 34a to 34c, and the X axis of the workpiece held on the chuck table. The angle with respect to the direction can be adjusted. The chuck tables 36a to 36c are provided with clamps 362a to 362c for fixing an annular frame that supports a semiconductor wafer as a workpiece through a protective tape.

  The first sliding blocks 32a to 32c are provided with a pair of guided grooves 321a, 321a, 321b, 321b, 321c, and 321c fitted to the pair of guide rails 31 and 31 on the lower surfaces thereof, respectively. A pair of guide rails 322a, 322a, 322b, 322b, 322c, and 322c formed in parallel along the Y-axis direction are provided on the respective upper surfaces. The first sliding blocks 32a to 32c configured as described above are configured such that the guided grooves 321a, 321a, 321b, 321b, 321c, and 321c are fitted to the pair of guide rails 31 and 31, thereby the pair of guide rails 31. , 31 are configured to be movable in the X-axis direction. The illustrated chuck table mechanisms 3a to 3c include an X-axis feed means 37 for moving the first sliding blocks 32a to 32c along the pair of guide rails 31 and 31 in the X-axis direction. The X-axis feeding means 37 includes a male screw rod 371 disposed in parallel between the pair of guide rails 31 and 31, and a drive source such as a pulse motor 372 for rotationally driving the male screw rod 371. . One end of the male screw rod 371 is rotatably supported by a bearing block 373 fixed to the stationary base 2, and the other end is connected to the output shaft of the pulse motor 372 by transmission. The male screw rod 371 is screwed into a penetrating female screw hole formed in a female screw block (not shown) provided so as to protrude from the lower surface of the central portion of each of the first sliding blocks 32a to 32c. Accordingly, the first slide blocks 32a to 32c are moved in the X-axis direction along the guide rails 31 and 31 by driving the male screw rod 371 forward and backward by the pulse motor 372.

  The illustrated laser processing apparatus 1 includes X-axis direction position detection means (not shown) for detecting the X-axis direction positions of the chuck tables 36a to 36c. The X-axis direction position detecting means includes a linear scale disposed along one guide rail 31 and a linear scale disposed along the first sliding blocks 32a to 32c along the linear scale. And a reading head (not shown) that moves. The reading head of the X-axis direction position detecting means sends a pulse signal of 1 pulse to a control means (not shown) every 1 μm, for example. The control means detects the positions of the chuck tables 36a to 36c in the X-axis direction by counting the input pulse signals. When a pulse motor is used as the drive source for the X-axis feed means, the X-axis direction positions of the chuck tables 36a to 36c are detected by counting the drive pulses of the control means for outputting a drive signal to the pulse motor. You can also

  The second slide blocks 33a to 33c are fitted on a lower surface with a pair of guide rails 322a, 322a, 322b, 322b, 322c, and 322c provided on the upper surfaces of the first slide blocks 32a to 32c, respectively. Guided grooves 331a, 331a, 331b, 331b, 332c, 332c are provided, and the guided grooves 331a, 331a, 331b, 331b, 332c, 332c are provided with a pair of guide rails 322a, 322a, 322b, 322b, 322c, By being fitted to 322c, it is configured to be movable in the Y-axis direction. The illustrated chuck table mechanisms 3a to 3c are configured so that the second slide blocks 33a to 33c are moved along the Y axis along a pair of guide rails 322a, 322a, 322b, 322b, 322c, and 322c provided on the first slide blocks 32a to 32c. Y-axis feed means 38a to 38c for moving in the direction are provided. The Y-axis feed means 38a to 38c include male screw rods 381a to 381c and parallel male screw rods 381a to 381c disposed in parallel between the pair of guide rails 322a and 322a, 322b and 322b, 322c and 322c, respectively. A drive source such as pulse motors 382a to 382c for rotational driving is included. In FIG. 1, the pulse motors 382a and 382b that rotate the male screw rods 381a and 381b are hidden behind the cover tables 35a, 35b, and 35c. It is arranged at the same position as the pulse motor 382c visible in FIG.

  Each of the male screw rods 381a to 381c is rotatably supported by bearing blocks 383a to 383c having one end fixed to the upper surface of the first sliding blocks 32a to 32c, and the other end to the output shaft of the pulse motor 382. Transmission connected. The male threaded rods 381a to 381c are screwed into penetrating female threaded holes formed in a female thread block (not shown) provided so as to protrude from the lower surface of the central part of the second sliding blocks 33a to 33c. Accordingly, the second sliding blocks 33a to 33c are driven along the guide rails 322a, 322a, 322b, 322b, 322c, and 322c by driving the male screw rods 381a to 381c forwardly or reversely and reversely by the pulse motors 382a to 382c. It is moved in the Y-axis direction.

  The illustrated laser processing apparatus 1 includes Y-axis direction position detection means (not shown) for detecting the Y-axis direction positions of the second sliding blocks 33a to 33c. The Y-axis direction position detecting means includes a linear scale disposed along one of the guide rails 322a, 322b, and 322c, and the second sliding blocks 33a to 33c and the second sliding blocks 33a to 33c. It comprises a read head (not shown) that moves along a linear scale. The reading head of this Y-axis direction position detecting means sends a pulse signal of 1 pulse to a control means (not shown) every 1 μm, for example. And this control means detects the position of the Y-axis direction of chuck table 36a-36c by counting the input pulse signal. When a pulse motor is used as a drive source for the Y-axis feed means, the Y-axis direction positions of the chuck tables 36a to 36c are determined by counting the drive pulses of the control means for outputting a drive signal to the pulse motor. It can also be detected.

  The laser beam unit 4 includes a support member 41 disposed on the stationary base 2, a casing 42 supported by the support member 41 and extending substantially horizontally, and a laser beam irradiation disposed on the casing 42. Means 5 and an imaging means 6 that is disposed at the front end of the casing 42 and detects a processing region to be laser processed are provided. The imaging unit 6 includes an illuminating unit that illuminates the workpiece, an optical system that captures an area illuminated by the illuminating unit, and an imaging device (CCD) that captures an image captured by the optical system. The captured image signal is sent to a control means (not shown).

  The laser beam irradiation means 5 described above includes at least pulse laser beam oscillation means (not shown) housed in the casing 42, and output adjustment means for adjusting the output of the pulse laser beam oscillated from the pulse laser beam oscillation means, And a condenser 51 for condensing the pulse laser beam whose output is adjusted by the output adjusting means and irradiating the workpiece held on the chuck tables 36a to 36c.

  The illustrated laser processing apparatus 1 includes control means (not shown). The control means is configured by a computer, a central processing unit (CPU) that performs arithmetic processing according to a control program, and a read-only memory (a control program). ROM), a readable / writable random access memory (RAM) for storing calculation results and the like, and an input interface and an output interface. Signals from the above-described X-axis direction position detection means, Y-axis direction position detection means, imaging means 6 and the like are input to the input interface of the control means. From the output interface of the control means, control signals are output to the X-axis feed means 37, Y-axis feed means 38a to 38c, laser beam irradiation means 5 and the like.

The operation of the laser processing apparatus constructed according to the present invention will be described below.
FIG. 1 shows a semiconductor wafer W processed by a laser processing apparatus according to an embodiment of the present invention. The semiconductor wafer W is held with respect to the annular frame F via a protective tape T that covers the space of the annular frame F.

  On each of the chuck tables 36a to 36c, the semiconductor wafer W is transported and placed by transport means (not shown). As shown in FIG. 1, the semiconductor wafer W is divided into a plurality of areas by a plurality of streets formed in a lattice pattern on the surface, and devices such as IC and LSI are formed in the divided areas. Yes.

  The semiconductor wafers W placed on the chuck tables 36a to 36c are each sucked and held by suction means (not shown), and the annular frame F that supports the semiconductor wafer W via the protective tape T is fixed by the clamps 362a to 362c. Is done. Among the chuck tables 36 a to 36 c that suck and hold the semiconductor wafer W in this way, the chuck table 36 a is moved to the alignment region below the imaging unit 6 by the operation of the X-axis feeding unit 37, and the imaging unit 6. It is positioned directly below.

  When the chuck table 36a is positioned immediately below the image pickup means 6, the image pickup means 6 and the control means (not shown) operate the Y-axis feed means, the angle adjustment means, etc. of the chuck table 36a, and are held by the chuck table 36a. Image processing such as pattern matching for aligning the streets formed in the predetermined direction of the semiconductor wafer W with the condenser 51 of the laser beam irradiation means 5 is executed, and the streets along the X-axis direction are executed. As a result, the alignment of the semiconductor wafer W held on the chuck table 36a with respect to the laser beam irradiation position is performed.

  In this way, when the alignment of the laser beam irradiation position with respect to the semiconductor wafer W held on the chuck table 36a is performed, the X-axis feed means 37 is operated and the chuck table 36b adjacent to the chuck table 36a is imaged. Position directly below. Then, as in the case of the semiconductor wafer W held on the chuck table 36a, the Y-axis feeding means and the angle adjusting means of the chuck table 36b are operated so that the street is positioned along the X-axis direction. By adjusting, image processing such as pattern matching for aligning the street formed on the semiconductor wafer W held on the chuck table 36b and the condenser 53 is executed, and alignment of the laser beam irradiation position is performed. Is carried out.

  Further, the X-axis feeding unit 37 is operated to position the chuck table 36 c directly below the imaging unit 6. Then, as in the case of the semiconductor wafer W held on the chuck tables 36a and 36b, the Y-axis feeding means and the angle adjusting means of the chuck table 36c are operated, and the street is positioned along the X-axis direction. By adjusting as described above, image processing such as pattern matching for aligning the street formed on the semiconductor wafer W held on the chuck table 36c and the condenser 53 is executed, and the laser beam irradiation position The alignment is performed.

  As described above, when the alignment is performed so that the streets formed on the respective semiconductor wafers W held on the chuck tables 36a to 36c and the laser beam irradiation position coincide with each other, FIG. As shown, the chuck table 36a of the chuck table mechanism 3a as the first holding means is moved to the vicinity of the laser beam irradiation region where the condenser 51 is located. At this time, the chuck tables 36a to 36c are arranged adjacent to each other with almost no distance, and each chuck table 36a to 36c is driven by a single X-axis feed means 37, so that the distance between the chuck tables 36a to 36c. The movement is integrally controlled in the X-axis direction without changing.

  Thereafter, the chuck table mechanisms 3a to 3c are accelerated by the X-axis feed unit 37 so as to achieve a desired processing feed rate, and irradiation of the laser beam from the laser beam irradiation unit 5 to the semiconductor wafer W held on the chuck table 36a is started. At the timing to be performed, the predetermined machining feed rate is set in advance. From there, a pulse laser beam having a wavelength (for example, 355 nm) having an absorptivity with respect to the semiconductor wafer W is oscillated from the pulse laser beam oscillating means of the laser beam irradiating means 5 and directed from the condenser 51 to the street formed on the semiconductor wafer W. The laser beam is irradiated.

  As described above, in a state where the laser beam is irradiated onto the street of the semiconductor wafer W held on the chuck table 36a, the chuck table mechanisms 3a to 3c are already processed and fed in the X-axis direction at a desired processing feed rate. ing. Here, in the embodiment of the present invention, even when the laser beam irradiation to the semiconductor wafer W held on the chuck table 36a is completed, as shown in FIG. Processing feeding by the feeding means 37 is continued, and laser processing is performed on the street formed on the semiconductor wafer W held on the chuck table 36b as it is based on the result obtained in the previous alignment step.

  Further, even after the laser processing on the street of the semiconductor wafer W held on the chuck table 36b is completed, the movement by the X-axis feeding means 37 is continued without decelerating, and the semiconductor wafer W held on the chuck table 36c is transferred to the semiconductor wafer W. Laser processing is also performed on the formed street. Thereafter, when the irradiation of the laser beam onto the street formed on the semiconductor wafer W held on the chuck table 36c is completed, the X-axis feeding unit 37 is controlled to decelerate and stop (see FIG. 2C). .), Each of the Y-axis feeding means 38a to 38c described above is operated, and each chuck table 36a to 36c is processed and fed in the Y-axis direction based on the information obtained by the alignment performed previously. When the machining feed in the Y-axis direction is completed, the machining feed in the X-axis direction is started in the direction opposite to the direction of the arrow shown in FIG. 2, and the chuck table 36c is accelerated to a predetermined machining feed speed. All the streets formed on the semiconductor wafer W held on each of the chuck tables 36a to 36c are performed by irradiating a laser beam to a different (adjacent) street formed on the semiconductor wafer W held on the chuck table 36a to 36c. Laser processing is performed. 2A to 2C, it is described that the laser beam irradiation means 5 moves on the chuck tables 36a to 36c, but as is apparent from the description of FIG. The laser beam irradiation means 5 is fixed on the stationary base 2, and the chuck tables 36 a to 36 c move relative to the laser beam irradiation means 5.

  As described above, in the laser processing for the semiconductor wafer W performed based on the processing apparatus of the present embodiment, acceleration, deceleration, and stop by the X-axis feeding means for the three semiconductor wafers W held on the chuck tables 36a to 36c are performed. The time loss due to the operation is 1/3 per semiconductor wafer W as compared with a processing apparatus having one chuck table for holding a workpiece, which is extremely advantageous in improving the processing efficiency. Further, since only one concentrator 51 and only one image pickup means 6 of the laser beam irradiation means 5 can be used, the configuration of an existing laser processing apparatus that processes the semiconductor wafers W one by one can be used as it is. A plurality of semiconductor wafers W can be processed, and a processing apparatus with improved processing efficiency can be provided at a substantially low cost.

  In the present embodiment, an example of a processing apparatus that continuously performs laser processing on the three semiconductor wafers W held on the chuck tables 36a to 36c of the chuck table mechanisms 3a to 3c has been described. However, the present invention is not limited to this, and as long as it has a holding means for holding at least two or more workpieces, the effect of the present invention can be obtained. It is possible to reduce the time loss per workpiece and to improve efficiency.

Next, a second embodiment configured according to the present invention will be described with reference to FIG.
A laser processing apparatus 1 ′ shown in FIG. 3 corresponds to the laser processing apparatus 1 shown in FIG. 1. In the laser processing apparatus 1 ′ shown in FIG. 3, the same members as those of the laser processing apparatus 1 are used. Are denoted by the same reference numerals, and the description thereof is omitted.

  In the present embodiment, imaging means 6 a to 6 c corresponding to the chuck tables 36 a to 36 c are disposed in the casing 42 of the laser beam unit 4. In the first embodiment, only one imaging means 6 is mounted on the plurality of chuck tables 36a to 36c, whereas in the second embodiment, the imaging means 6 is made to correspond to each of the chuck tables 36a to 36c. An image pickup means is provided.

  More specifically, the chuck tables 36a to 36c that suck and hold the semiconductor wafer W are moved to the alignment region below the imaging means 6a to 6c by the operation of the X-axis feeding means 37, and directly below the imaging means 6a to 6c. Position. Also in the present embodiment, there is only one condenser 51, but the positional relationship between the condensing point of the laser beam irradiated from the condenser 51 and each of the imaging units 6a to 6c is uniquely fixed. Therefore, in the alignment region immediately below the image pickup means 6a to 6c, the position of the semiconductor wafer W held on the chuck tables 36a to 36c, particularly the street position, and the laser beam irradiated from the condenser 51 of the laser beam irradiation means 5 Position adjustment with respect to the irradiation position and angle adjustment can be sequentially performed.

  Thus, when the alignment of the chuck tables 36a to 36c is completed, the laser processing similar to that in the first embodiment is executed.

  In the second embodiment, imaging means 6a to 6c are provided so as to correspond to the chuck tables 36a to 36c, respectively, and each chuck table is sequentially provided for one imaging means as in the first embodiment. Therefore, it is possible to shorten the alignment time executed corresponding to each chuck table, and to quickly shift to the machining process.

  In the above description of the first and second embodiments, an example in which the present invention is applied to a laser processing apparatus that irradiates a workpiece with a laser beam has been described. However, the present invention is not limited to this, The present invention can also be applied to other processing apparatuses. For example, it can be applied to a dicing apparatus that processes a workpiece with a cutting blade. As described above, the X-axis feed means in the dicing apparatus is slower than the laser processing apparatus, but by providing a plurality of holding tables for holding the workpiece on one processing means, The time loss per workpiece when reciprocating and machining can be reduced, and the machining efficiency can be improved as in the first and second embodiments.

1, 1 ': Laser processing device 2: Stationary base 3a-3c: Chuck table mechanism (first to third holding means)
4: Laser beam irradiation unit 5: Laser beam irradiation means 6, 6a to 6c: Imaging means 31, 31: Guide rails 32a to 32c: First sliding block 33a to 33c: Second sliding block 36a to 36c: Chuck table (holding) table)
W: Semiconductor wafer T: Protective tape F: Ring frame

Claims (3)

A processing device,
First holding means having a holding table for holding the workpiece;
A second holding means having a holding table for holding a workpiece;
An X-axis feed means for processing and feeding the first holding means and the second holding means in the X-axis direction;
First Y-axis feed means for machining and feeding in the Y-axis direction orthogonal to the X-axis direction of the first holding means;
Second Y-axis feed means for machining and feeding in the Y-axis direction perpendicular to the X-axis direction of the second holding means;
Processing means for processing the workpiece held by the first holding means and the workpiece held by the second holding means;
An alignment unit that images the workpiece held by the first holding unit and the second holding unit and detects a region to be processed;
The first and second holding means are configured to be capable of adjusting the angle of the holding table with respect to the X-axis direction,
A processing apparatus for sequentially processing a workpiece by sequentially positioning the first holding means and the second holding means on the processing means by the X-axis feeding means.   The processing apparatus according to claim 1, wherein alignment means is disposed corresponding to the first holding means and the second holding means.   The processing apparatus according to claim 1, wherein the processing means is a laser beam irradiation unit including a condenser that irradiates a workpiece with a laser beam.