JP7449097B2 - laser processing equipment - Google Patents

Description

The present invention relates to a laser processing device.

2. Description of the Related Art Cutting apparatuses have been conventionally used to process various plate-shaped workpieces such as semiconductor wafers, sapphire substrates, SiC substrates, glass substrates, and resin package substrates by cutting them with a cutting blade. Laser processing has also come into use, in which a laser beam is irradiated onto the substrate to remove the substrate along the planned dividing line or to form a modified layer inside (see Patent Document 1). The cutting device cuts the workpiece by processing and feeding a chuck table holding the workpiece in the X-axis direction with respect to a blade fixed to a spindle. Furthermore, by indexing and feeding the spindle in the Y-axis direction, all streets can be processed.

Japanese Patent Application Publication No. 2013-179237

A laser processing apparatus as shown in Patent Document 1 has a major difference from the above-mentioned cutting apparatus in that a laser beam can be scanned on the laser beam irradiation unit side. Since the focal point (processing point) can be moved without moving the chuck table, high-speed scanning that cannot be achieved with the moving speed of the chuck table realizes high-speed processing.

However, since the laser processing device shown in Patent Document 1 is set up based on the concept of the above-mentioned cutting device, there is a problem in that it is not possible to realize an efficient device configuration that takes advantage of the characteristics of the laser beam irradiation unit. was there.

The present invention has been made in view of these problems, and an object thereof is to provide a laser processing device that can perform efficient laser processing by utilizing the characteristics of a laser beam irradiation unit.

In order to solve the above problems and achieve the objectives, the laser processing apparatus of the present invention includes a first chuck table that holds the workpiece on a holding surface, and a second chuck table that holds the workpiece on the holding surface. an X-axis feed unit that moves the first chuck table and the second chuck table in a state where they are lined up in the X-axis direction; and a laser beam irradiation unit that processes the workpiece held by the chuck table by irradiating the workpiece with a laser beam. unit, and a pair of conveyance areas arranged in parallel in the X-axis direction on both sides of the laser beam irradiation unit and for carrying the workpiece into or out of the chuck table, the laser beam irradiation unit emitting the laser beam. An oscillator that oscillates, a condenser that condenses light from the oscillator, and a laser beam scanning unit that is disposed between the oscillator and the condenser and displaces the irradiation position of the laser beam on the holding surface of the chuck table. , one of the first chuck table and the second chuck table is positioned in one of the pair of transport areas to carry in or carry out the workpiece, and the first chuck The present invention is characterized in that the other of the table and the second chuck table is positioned below the laser beam irradiation unit to process the workpiece held by the other .
The X-axis feed unit may be a linear motion mechanism in which the first chuck table and the second chuck table each have a drive source and can independently control the X-axis feed.

The laser beam scanning unit may include a galvano scanner, a resonant scanner, an acousto-optic deflection element or a polygon mirror.

The first chuck table and the second chuck table may include a rotation unit that rotates the holding surface about a rotation axis perpendicular to the holding surface.

The transfer area may include a carry-in/out unit for carrying workpieces into and out of the chuck table.

The laser processing apparatus of the present invention can perform efficient laser processing by utilizing the characteristics of the laser beam irradiation unit.

FIG. 1 is a perspective view showing a configuration example of a laser processing apparatus according to a first embodiment. FIG. 2 is a diagram showing a configuration example of a laser beam irradiation unit according to the first embodiment. FIG. 3 is a top view illustrating the operation of the laser processing apparatus according to the first embodiment. FIG. 4 is a top view illustrating the operation of the laser processing apparatus according to the first embodiment. FIG. 5 is a perspective view showing a configuration example of a laser processing apparatus according to the second embodiment. FIG. 6 is a top view illustrating the operation of the laser processing apparatus according to the second embodiment.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Further, the constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Further, various omissions, substitutions, or changes in the configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
DESCRIPTION OF THE PREFERRED EMBODIMENTS A laser processing apparatus according to a first embodiment of the present invention will be described based on the drawings. FIG. 1 is a perspective view showing a configuration example of a laser processing apparatus according to a first embodiment. A laser processing apparatus 1 according to the first embodiment shown in FIG. 1 is an apparatus that processes a workpiece 100 by irradiating it with a laser beam. Note that the X-axis direction, Y-axis direction, and Z-axis direction used in the following description are assumed to be perpendicular to each other. In addition, in the following explanation, the X-axis direction is one direction in the horizontal direction, and the Y-axis direction is another direction in the horizontal direction, that is, the other direction. The direction may be another direction in the horizontal direction, that is, the other direction. Furthermore, in the following description, the XY plane coincides with the horizontal plane and the Z-axis direction coincides with the vertical direction, but the XY plane may deviate from the horizontal plane and the Z-axis direction may deviate from the vertical direction.

The workpiece 100 subjected to laser processing by the laser processing apparatus 1 according to the first embodiment includes a semiconductor wafer, an optical device wafer, etc., and includes, for example, a silicon substrate, a sapphire substrate, a gallium substrate, a SiC substrate, a glass substrate, and a resin substrate. These are various plate-shaped substrates such as package substrates. The workpiece 100 of Embodiment 1 is a semiconductor wafer or an optical device wafer with a constant thickness, but the workpiece 100 of the present invention has a thinner central part and a thicker part formed on the outer periphery. A so-called TAIKO wafer may also be used.

In the first embodiment, the workpiece 100 is, for example, one in which a plurality of devices (not shown) formed on the surface are partitioned into a lattice shape by a plurality of planned dividing lines (not shown), and the planned dividing lines Laser processing is performed by the laser processing device 1 along the lines, and the device is divided into a plurality of devices.

In the first embodiment of the workpiece 100, a dicing tape 107, which is an adhesive tape having a diameter larger than that of the substrate, is attached to the back surface of the workpiece 100, and an annular frame 108 is attached to the outer periphery of the dicing tape 107. That is, the workpiece 100 is supported in the opening of the annular frame 108 via the dicing tape 107. Note that the workpiece 100 is not limited to this form in the present invention, and may have a form to which the dicing tape 107 and the annular frame 108 are not attached.

Further, the workpiece 100 is not limited to the above-mentioned form having a plurality of planned dividing lines, and in the present invention, an epitaxial substrate (not shown) and a buffer layer (not shown) on the surface side of the epitaxial substrate are used. The buffer layer may include a stacked optical device layer (not shown) and a transfer substrate (not shown) bonded to the surface of the optical device layer via a bonding layer (not shown). A laser processing device 1 performs laser processing on the optical device layer so that the optical device layer can be peeled off.

As shown in FIG. 1, the laser processing apparatus 1 according to the first embodiment includes two (pair) chuck tables 10, 10, an X-axis feeding unit 20, a laser processing unit 30, a pair of transport areas 40, 40 and a control unit 50.

The two chuck tables 10, 10 have the same configuration except that one is provided in the +X direction with respect to the other, that is, the other is provided in the −X direction with respect to the other. Be prepared. In the first embodiment, one of the two chuck tables 10 corresponds to the first chuck table according to the present invention, and the other corresponds to the second chuck table according to the present invention. Note that the other of the two chuck tables 10, 10 may correspond to the first chuck table according to the present invention, and one may correspond to the second chuck table according to the present invention.

As shown in FIG. 1, the chuck table 10 includes a holding surface 11 for holding a workpiece 100 and a holding part 12 made of porous ceramic or the like, and a holding part 12 made of a conductive metal surrounding the holding part 12. It has a disk shape including a ring-shaped frame portion 13. The chuck table 10 is provided movably in the X-axis direction by an X-axis feed unit 20.

The chuck table 10 is connected to a vacuum suction source (not shown), and the chuck table 10 suctions and holds the workpiece 100 by suction from the vacuum suction source. The chuck table 10 is connected to a gas supply source (not shown), and pressurized gas is supplied from the gas supply source to release suction and holding of the workpiece 100.

The chuck table 10 includes four clamps 15 that are arranged around the outer periphery of the holding surface 11 and hold and fix a frame 108 that supports the workpiece 100 via a dicing tape 107.

The X-axis feed unit 20 is arranged along the X-axis direction on the upper surface of the horizontal part of the L-shaped base 2, and simultaneously moves the X-axis when the two chuck tables 10, 10 are arranged in the X-axis direction. move in the direction. As shown in FIG. 1, the X-axis feed unit 20 includes a pair of X-axis guide rails 21 that are generally parallel to the X-axis direction, and two (a pair of ), an X-axis ball screw 23 parallel to the X-axis guide rail 21 screwed onto the lower surface of the two X-axis movement tables 22, 22, An X-axis pulse motor 24 connected to one end of a ball screw 23 is provided.

The two X-axis moving tables 22, 22 are the same except that one is provided in the +X direction with respect to the other, that is, the other is provided in the −X direction with respect to the other. Equipped with a configuration. In the first embodiment, one X-axis moving table 22 supports one chuck table 10 rotatably around the Z-axis, and the other X-axis moving table 22 supports the other chuck table 10 around the Z-axis. It is rotatably supported.

By rotating the X-axis ball screw 23 with the X-axis pulse motor 24, the two X-axis moving tables 22, 22 are simultaneously moved in the X-axis direction along the X-axis guide rail 21 while being arranged in the X-axis direction. do. As a result, one chuck table 10 supported by one X-axis moving table 22 and the other chuck table 10 supported by the other X-axis moving table 22 are arranged in the X-axis direction and simultaneously It moves along the axis guide rail 21 in the X-axis direction. This X-axis feeding unit 20 is provided with an X-axis measuring unit (not shown) that measures the position of each of the two X-axis moving tables 22, 22 in the X-axis direction. Based on the measurement of the position of each of the chuck tables 22 in the X-axis direction, the position of each of the two chuck tables 10, 10 in the X-axis direction can be measured.

As shown in FIG. 1, the laser processing unit 30 is mounted on an upright portion of the L-shaped base 2 that is erected from a horizontal portion, and is mounted upwardly on the pair of X-axis guide rails 21 of the X-axis feed unit 20. - Provided to protrude in the Y direction. The laser processing unit 30 includes a laser beam irradiation unit 31 and an imaging means 32 that is spaced from the laser beam irradiation unit 31 in the X-axis direction and is disposed facing in the −Z direction.

FIG. 2 is a diagram showing a configuration example of the laser beam irradiation unit 31 according to the first embodiment. The laser beam irradiation unit 31 processes the workpiece 100 held on the chuck table 10 by irradiating the workpiece 100 with a laser beam 301, and as shown in FIG. It includes an element 36, a laser beam scanning unit 37, and a condenser 38.

The laser beam oscillation means 34 includes an oscillator 341 and a repetition frequency setting means 342. The oscillator 341 is a device that oscillates a laser beam 300 with a predetermined wavelength. In the first embodiment, a laser diode (LASER diode, LD) excites a crystal such as YAG doped with neodymium (Nd) ions, etc. A device that emits a laser beam of about 1 μm is preferably used.

The repetition frequency setting means 342 is a means for setting the repetition frequency of the laser beam oscillated by the oscillator 341, and in the first embodiment, the repetition frequency is set to double and the second repetition frequency is set based on the above-mentioned laser beam with a wavelength of about 1 μm. A device that emits a laser beam 300 having a wavelength of about 514 nm, which is a harmonic wave, is preferably used.

In Embodiment 1, the laser beam oscillation means 34 is controlled by the control unit 50 to generate pulses with a repetition frequency of 50 kHz or more and 200 kHz or less, an average output of 0.1 W or more and 2.0 W or less, and a pulse width of 20 ps or less. A laser beam 300, which is a laser beam, is oscillated.

The optical system 35 includes at least one of predetermined optical equipment such as a beam diameter adjuster and an output adjuster, and transmits the laser beam 300 oscillated from the laser beam oscillation means 34. The wavelength conversion element 36 is an element that converts the wavelength of the laser beam 300 transmitted by the optical system 35. In the first embodiment, the wavelength conversion element 36 converts the laser beam 300 having a wavelength of about 514 nm oscillated by the laser beam oscillation means 34 into its double wave, i.e. It is converted into a laser beam 301 with a wavelength of approximately 257 nm, which is the fourth harmonic of the original laser beam with a wavelength of approximately 1 μm.

In the first embodiment, the laser beam irradiation unit 31 is provided with the wavelength conversion element 36 downstream of the optical system 35 in the traveling direction of the laser beams 300 and 301, so that the wavelength of the laser beam passing through the optical system 35 is finally irradiated. Since the wavelength of the laser beam can be made longer than that of the laser beam, damage to the optical system 35 can be suppressed.

As shown in FIG. 2, the laser beam scanning unit 37 is arranged between the oscillator 341 and a condenser 38, which will be described later. More specifically, the laser beam scanning unit 37 is arranged further downstream than the optical system 35 and the wavelength conversion element 36, which are provided downstream of the laser beam oscillation means 34 including the oscillator 341. The laser beam scanning unit 37 displaces the irradiation position of the laser beam 301 on the holding surface 11 of the chuck table 10 in the XY plane.

In the first embodiment, the laser beam scanning unit 37 includes a galvano scanner, a resonant scanner, an acousto-optic deflection element, or a polygon mirror. The laser beam scanning unit 37 is controlled by the control unit 50 to swing the laser beam 301 in the X-axis direction and the Y-axis direction and guide it to the condenser 85 .

The condenser 38 has a circular shape with a diameter equal to or larger than the holding surface 11 of the chuck table 10 in the XY plane, and is used to hold the chuck table 10 when located below the laser beam irradiation unit 31. It is provided so as to cover the upper side of the surface 11. The condenser 38 condenses the laser beam 301 oscillated by the oscillator 341 and scanned by the laser beam scanning unit 37 .

The condenser 38 is exemplified by a large Fθ lens having the above-mentioned diameter or a large image-side telecentric objective lens having the above-mentioned diameter, and in either case, the optical axis is provided along the Z-axis direction. The condenser 38 does not depend on the incident angle of the laser beam 301 guided from the laser beam scanning unit 37, and is arranged parallel to the Z-axis direction, which is the optical axis direction, that is, orthogonal to the holding surface 11 of the chuck table 10. A laser beam 301 is irradiated in the direction.

As shown in FIG. 1, the imaging means 32 is provided at a position outside the condenser 38 of the laser beam irradiation unit 31 in the XY plane, facing in the −Z direction. Therefore, the imaging means 32 can image the X-axis moving table 22 that supports the chuck table 10 located below the laser beam irradiation unit 31 without being obstructed by the condenser 38. The imaging means 32 images the workpiece 100 held on the holding surface 11 of the chuck table 10 located below the imaging means 32, and combines the workpiece 100 held on the holding surface 11 of the chuck table 10 with the laser beam. An image for performing alignment with the irradiation position of the laser beam 301 by the irradiation unit 31 is obtained, and the obtained image is output to the control unit 50. In the first embodiment, for example, before laser processing by the laser beam irradiation unit 31, the chuck table 10 is positioned below the imaging means 32 to perform alignment, and then the chuck table 10 is moved below the condenser 38, and then, Laser processing may be performed using the laser beam irradiation unit 31.

As shown in FIG. 1, the pair of transport areas 40, 40 are arranged side by side in the X-axis direction on both sides of the laser beam irradiation unit 31 of the laser processing unit 30. Specifically, the pair of transport areas 40, 40 are provided on both sides in the X-axis direction of the area where the laser beam irradiation unit 31 is provided. That is, one conveyance area 40 is provided on the +X direction side of the area where the laser beam irradiation unit 31 is provided, and the other conveyance area 40 is provided on the −X direction side of the area where the laser beam irradiation unit 31 is provided. It is provided. The pair of transport areas 40, 40 have the same configuration except that one is provided in the +X direction with respect to the other, that is, the other is provided in the −X direction with respect to the other. Be prepared.

The distance in the X-axis direction between one transport region 40 and the region where the laser beam irradiation unit 31 is provided, and the distance between the region where the laser beam irradiation unit 31 is provided and the other transport region 40 are shown in FIG. As shown, both are set to be equal to the distance in the X-axis direction between the two X-axis moving tables 22, 22 in the X-axis feed unit 20, that is, to be equal to the distance in the X-axis direction between the two chuck tables 10, 10. It is set in. Therefore, in the laser processing apparatus 1 according to the first embodiment, when one chuck table 10 is located in the area where the laser beam irradiation unit 31 is provided, the other chuck table 10 is located in the other transport area 40. Therefore, when the other chuck table 10 is located in the region where the laser beam irradiation unit 31 is provided, one chuck table 10 is located in one of the transport regions 40.

As shown in FIG. 1, the transport area 40 includes a carry-in/out unit 41, a pair of Y-axis guide rails 43 that are generally parallel to the Y-axis direction, a cassette elevator 44, and a cassette 45. The carry-in/out unit 41 carries the workpiece 100 into and out of the chuck table 10 located in the transfer area 40 . The carry-in/out unit 41 includes a grip portion 42 that grips a frame 108 that supports the workpiece 100 via a dicing tape 107 . The carry-in/out unit 41 is controlled by the control unit 50 and moves along the Y-axis direction by a drive mechanism (not shown).

As shown in FIG. 1, the pair of Y-axis guide rails 43 are supported by the ends of the upper surface of the cassette elevator 44 in the +Y direction, and are directed upwardly in the +Y direction of the pair of X-axis guide rails 21 of the X-axis feed unit 20. It is provided so as to protrude in the direction. The pair of Y-axis guide rails 43 are controlled by the control unit 50 and operate to change the width of separation between them by moving away from each other in the X-axis direction or moving closer to each other in the X-axis direction. be able to.

As shown in FIG. 1, the cassette elevator 44 is provided adjacent to the -Y direction side end surface of the horizontal portion of the L-shaped base 2. The cassette elevator 44 is a cassette loading area in which a cassette 45 that accommodates the workpieces 100 before and after laser processing is placed on the top surface, and is controlled by the control unit 50 to move the cassette 45 up and down in the Z-axis direction. be.

The cassette 45 separately accommodates the workpiece 100 before laser processing and the workpiece 100 after laser processing. The cassette 45 is placed on the upper surface of the cassette elevator 44, and is moved up and down by the cassette elevator 44 to change the workpiece 100 carried out by the carry-in/out unit 41.

The operation of carrying out the workpiece 100 by the carry-in/out unit 41 will be explained. The loading/unloading unit 41 moves in the −Y direction and grips the frame 108 of the workpiece 100 before laser processing in the cassette 45 placed in the cassette elevator 44 with the gripping portion 42 . Then, the carrying-in/out unit 41 carries out the workpiece 100 before laser processing from the cassette 45 by moving in the +Y direction while holding the frame 108 of the workpiece 100 with the gripping part 42 . When the frame 108 is gripped by the gripper 42 and carried out, the workpiece 100 is guided along the +Y direction with both ends of the frame 108 in the X-axis direction supported and guided by a pair of Y-axis guide rails 43. It will be transported out. Thereafter, the carry-in/out unit 41 releases the state in which the frame 108 of the workpiece 100 is held by the grip part 42 . As a result, the frame 108 of the workpiece 100 held by the gripping section 42 is now supported by the pair of Y-axis guide rails 43.

The pair of Y-axis guide rails 43 perform a centering operation to position the frame 108 at a predetermined position in the X-axis direction by narrowing the distance between them. Thereafter, the loading/unloading unit 41 suctions and holds the frame 108 positioned at a predetermined position using a vacuum pad (not shown) provided below the loading/unloading unit 41 and moves it upward, thereby moving the frame 108 along the pair of Y-axes. The workpiece 100 is raised from the guide rail 43. Then, the distance between the pair of Y-axis guide rails 43 is increased, and the carry-in/out unit 41 that holds the frame 108 under suction is lowered, so that the workpiece 100 and the frame 108 are moved between the pair of Y-axis guide rails 43. is passed through and placed on the chuck table 10.

The loading/unloading operation of the workpiece 100 by the loading/unloading unit 41 will be described. After moving in the +Y direction, the loading/unloading unit 41 moves downward, passes between a pair of Y-axis guide rails 43, and is chucked by a vacuum pad (not shown) provided below the loading/unloading unit 41. The frame 108 of the laser-processed workpiece 100 on the holding surface 11 of the table 10 is held under suction and moved above the pair of Y-axis guide rails 43. Then, the pair of Y-axis guide rails 43 narrow the distance between them, and the carry-in/out unit 41 that holds the frame 108 under suction descends, thereby moving the workpiece 100 and the frame 108 between the pair of Y-axis guide rails 43. Place it on. As a result, the frame 108 of the workpiece 100 after laser processing is supported by the pair of Y-axis guide rails 43.

Then, after moving further in the +Y direction, the carry-in/out unit 41 grips the frame 108 of the laser-processed workpiece 100 supported by the pair of Y-axis guide rails 43 with the grip part 42 . Thereafter, the carry-in/out unit 41 carries the laser-processed workpiece 100 into the cassette 45 by moving in the −Y direction while holding the frame 108 of the workpiece 100 with the gripping portion 42. When the workpiece 100 is carried in with the frame 108 being held by the gripping part 42, both ends of the frame 108 in the X-axis direction are supported and guided by a pair of Y-axis guide rails 43, and the workpiece 100 is moved in the -Y direction. It will be transported along the line. Then, the carry-in/out unit 41 can store the workpiece 100 after laser processing in the cassette 45 by releasing the gripping part 42 from holding the frame 108 of the workpiece 100. .

In this embodiment, the carry-in/out unit 41 automatically carries out the carrying-out operation and carrying-in operation of the workpiece 100, but the present invention is not limited to this, and the operator manually carries out the carrying-out operation of the workpiece 100. An operation and loading operation may be performed.

The control unit 50 controls each unit of the laser processing apparatus 1 to move the chuck table 10 in the X-axis direction using the X-axis feed unit 20 and to hold it on the holding surface 11 of the chuck table 10 using the laser processing unit 30. The operation of performing laser processing on the workpiece 100 that has been processed, the operation of carrying out the workpiece 100 before laser processing from the cassette 45 to the holding surface 11 of the chuck table 10 in the transport area 40, and the operation of carrying out the laser processing from the holding surface 11 of the chuck table 10 This causes the laser processing apparatus 1 to carry out the operation of transporting the processed workpiece 100 into the cassette 45. The control unit 50 includes an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input/output interface device. It is a computer having The arithmetic processing device of the control unit 50 performs arithmetic processing according to a computer program stored in a storage device, and transmits a control signal for controlling the laser processing device 1 to the laser processing device 1 via an input/output interface device. output to each unit.

As shown in FIG. 1, the control unit 50 includes an X-axis feed control section 51 and a processing and conveyance control section 52. The X-axis feed control unit 51 rotates the X-axis ball screw 23 with the X-axis pulse motor 24, thereby moving the two X-axis moving tables 22, 22 supporting the two chuck tables 10, 10, respectively, in the X-axis direction. , and are simultaneously moved along the X-axis guide rail 21 in the X-axis direction. The processing and transport control unit 52 causes the laser processing unit 30 to irradiate the workpiece 100 held on one of the chuck tables 10 positioned below the laser processing unit 30 with a laser beam 301 to perform laser processing. At the same time, the carry-in/out unit 41 carries the laser-processed workpiece 100 held on the other chuck table 10 positioned in the transport area 40 into the cassette 45, and also transports the workpiece 100 before laser processing from the cassette 45. The object 100 is placed on the holding surface 11 of the other chuck table 10.

Next, the operation of the laser processing apparatus 1 according to the first embodiment will be explained based on the drawings. 3 and 4 are top views illustrating the operation of the laser processing apparatus 1 according to the first embodiment.

As shown in FIG. 3, the processing and transport control unit 52 operates when one chuck table 10 is positioned below the laser processing unit 30 and the other chuck table 10 is positioned in the other transport area 40. (In the case immediately after the second movement step described below), the laser processing unit 30 irradiates the workpiece 100 held on one of the chuck tables 10 with a laser beam 301 to perform laser processing, and at the same time The unit 41 transports the workpiece 100 after laser processing held on the other chuck table 10 into the cassette 45, and transfers the workpiece 100 before laser processing from the cassette 45 to the holding surface 11 of the other chuck table 10. (first processing and conveyance step).

As shown in FIG. 3, in the X-axis feed control unit 51, one chuck table 10 is positioned below the laser processing unit 30, and the other chuck table 10 is positioned in the other conveyance area 40, When the above-mentioned first processing and transporting step has been completed (immediately after the above-mentioned first processing and transporting step), the two X-axis moving tables 22, 22 supporting the two chuck tables 10, 10, respectively, are By simultaneously moving the chuck table 10 in the +X direction along the X-axis guide rail 21 while maintaining the distance in the X-axis direction from each other while arranging them in the axial direction, one chuck table 10 can be moved to the other side as shown in FIG. The other chuck table 10 is positioned in the transport area 40 and positioned below the laser processing unit 30 (first movement step).

As shown in FIG. 4, the processing and conveyance control unit 52 is configured when one chuck table 10 is positioned in one conveyance area 40 and the other chuck table 10 is positioned below the laser processing unit 30. (In the case immediately after the first movement step described above), the laser processing unit 30 irradiates the workpiece 100 held on the other chuck table 10 with a laser beam 301 to perform laser processing, and at the same time The unit 41 transports the workpiece 100 after laser processing held on one chuck table 10 into the cassette 45, and transfers the workpiece 100 before laser processing from the cassette 45 to the holding surface 11 of the one chuck table 10. (second processing and conveyance step).

As shown in FIG. 4, the X-axis feed control unit 51 has one chuck table 10 positioned in one transport area 40, and the other chuck table 10 positioned below the laser processing unit 30, When the second processing and transportation step described above has been completed (immediately after the second processing and transportation step described above), the two X-axis moving tables 22, 22 supporting the two chuck tables 10, 10, respectively, are By simultaneously moving the chuck table 10 in the -X direction along the X-axis guide rail 21 while maintaining the distance in the X-axis direction from each other while arranging them in the axial direction, one of the chuck tables 10 is moved by the laser as shown in FIG. The other chuck table 10 is positioned below the processing unit 30 and positioned in the other transport area 40 (second movement step).

In the first embodiment, the processing and transport control unit 52 uses the laser beam scanning unit 37 to scan the workpiece held on the holding surface 11 of the chuck table 10 covered by the condenser 38 in the first processing and transport step and the second processing and transport step. Since the laser beam 301 can scan the entire surface of the workpiece 100 in the XY plane direction, the laser processing unit 30 can scan the workpiece 100 in the XY direction without moving the chuck table 10 in the X-axis direction or the Y-axis direction. Desired laser processing can be performed over the entire surface in the plane direction.

The laser processing apparatus 1 according to the first embodiment performs desired laser processing over the entire surface of the workpiece 100 in the XY plane direction using the laser processing unit 30 without moving the chuck table 10 in the X-axis direction or the Y-axis direction. Since the processing can be executed, the movement of the chuck table 10 can be utilized for carrying the workpiece 100 into and out of the laser processing unit 30 below. Further, in the laser processing apparatus 1 according to the first embodiment, since the pair of conveyance areas 40 are arranged in the X-axis direction on both sides of the laser beam irradiation unit 31, the two chuck tables 10 are arranged in the X-axis feed unit 20. , 10 are arranged in the X-axis direction and moved simultaneously, the workpiece 100 can be carried in and out of the laser processing unit 30 at the same time. Further, the laser processing apparatus 1 according to the first embodiment performs laser processing on the chuck table 10 located below the laser processing unit 30, and at the same time performs the laser processing on the chuck table 10 located below the laser processing unit 30. The workpiece 100 after laser processing can be carried into the cassette 45 on the table 10, and the workpiece 100 before laser processing can be carried out from the cassette 45. Therefore, the laser processing apparatus 1 according to the first embodiment can perform efficient laser processing by utilizing the characteristic that the laser beam 301 of the laser beam irradiation unit 31 has a wide irradiation area.

Further, in the laser processing apparatus 1 according to the first embodiment, the laser beam scanning unit 37 includes a galvano scanner, a resonant scanner, an acousto-optic deflection element, or a polygon mirror. Therefore, the laser processing apparatus 1 according to the first embodiment can suitably scan the laser beam 301 over the entire surface of the workpiece 100 in the XY plane direction and perform desired laser processing.

Further, the laser processing apparatus 1 according to the first embodiment includes a carry-in/out unit 41 in the transfer area 40 that carries the workpiece 100 into and out of the chuck table 10 . For this reason, the laser processing apparatus 1 according to the first embodiment transports the workpiece 100 after laser processing to the cassette 45 on the chuck table 10 in the transport area 40, and transports the workpiece 100 before laser processing into the cassette 45. Since the process of carrying out the workpiece 100 from the workpiece 45 can be automatically executed by the carry-in/out unit 41, more efficient laser processing of the workpiece 100 is enabled.

[Embodiment 2]
A laser processing apparatus 1-2 according to a second embodiment of the present invention will be explained based on the drawings. FIG. 5 is a perspective view showing a configuration example of a laser processing apparatus 1-2 according to the second embodiment. FIG. 6 is a top view illustrating the operation of the laser processing apparatus 1-2 according to the second embodiment. In addition, in FIGS. 5 and 6, the same parts as in Embodiment 1 are denoted by the same reference numerals, and the description thereof will be omitted.

As shown in FIGS. 5 and 6, a laser processing apparatus 1-2 according to a second embodiment has a chuck table 10 equipped with a rotation unit 14 in addition to the above-described first embodiment, and a laser processing apparatus 1-2 in place of the laser processing unit 30. This embodiment is the same as the first embodiment except that it includes a processing unit 30-2. In the second embodiment, the chuck table 10 is provided with a holding surface 11 rotatable about an axis along the Z-axis direction by a rotation unit 14.

As shown in FIGS. 5 and 6, the laser processing unit 30-2 is spaced from the laser beam irradiation unit 31-2 in the X-axis direction and is disposed toward the −Z direction. and an imaging means 32-2.

The laser beam irradiation unit 31-2 is the same as the laser beam irradiation unit 31 described above except that the laser beam irradiation unit 38-2 is provided in place of the condenser 38. The condenser 38-2 is a modified condenser 38 in shape and size, and has a rectangular shape in the XY plane, and is a holding surface of the chuck table 10 when located below the laser beam irradiation unit 31-2. It is provided so as to cover the upper half of the area of 11.

As shown in FIGS. 5 and 6, the imaging means 32-2 is configured so that the optical axis for imaging is located on the condenser 38-2 of the holding surface 11 of the chuck table 10 located below the laser beam irradiation unit 31. It is provided so as to pass through the remaining half area that is not covered. For this reason, the imaging means 32-2 is not obstructed by the condenser 38-2, and is covered by the condenser 38-2 on the holding surface 11 of the chuck table 10 located below the laser beam irradiation unit 31. It is possible to image the remaining half of the area that is not covered. The imaging means 32-2 images the workpiece 100 held on the holding surface 11 of the chuck table 10 located below the laser beam irradiation unit 31, and images the workpiece 100 held on the holding surface 11 of the chuck table 10. 100 and the irradiation position of the laser beam 301 by the laser beam irradiation unit 31, an image for performing alignment is obtained, and the obtained image is output to the control unit 50.

Next, the operation of the laser processing apparatus 1-2 according to the second embodiment will be explained based on the drawings. In the second embodiment, the processing and transport control unit 52 uses the laser beam scanning unit 37 to move the workpiece 100 held on the holding surface 11 of the chuck table 10 covered by the condenser 38-2 in the −X direction of the XY plane direction. The laser beam 301 can be scanned over one half of the side. For this reason, the processing and transport control unit 52 first places one half surface 100-1 of the workpiece 100 in the area covered by the condenser 38-2, as shown in FIG. A desired laser processing is performed over the entire surface of one half surface 100-1 of the workpiece 100. Then, the processing and transport control unit 52 causes the rotation unit 14 to rotate the chuck table 10 by 180 degrees (half a turn) around the Z axis, so that the condenser 38-2 is covered, as shown in FIG. 6(B). The other half surface 100-2 of the workpiece 100 is placed in the area. Thereafter, the processing and transport control section 52 performs desired laser processing over the entire surface of the other half surface 100-2 of the workpiece 100. In this way, in the second embodiment, the processing and transport control unit 52 executes laser processing on each of the half surfaces 100-1 and 100-2 of the workpiece 100, making full use of the rotation unit 14.

The laser processing apparatus 1-2 according to the second embodiment rotates the chuck table 10 once by 180 degrees using the rotation unit 14, thereby eliminating the need to move the chuck table 10 in the X-axis direction or the Y-axis direction. Since the laser processing unit 30 can perform desired laser processing over the entire surface of the workpiece 100 in the XY plane direction, the chuck table 10 can be moved below the laser processing unit 30 of the workpiece 100. It can be used for loading and unloading. The laser processing apparatus 1-2 according to the second embodiment has the same structure and operation as the laser processing apparatus 1 according to the first embodiment. The effect is that efficient laser processing can be performed by utilizing the characteristic that the irradiation area of the laser beam 301 of the irradiation unit 31 is wide.

Further, in the laser processing apparatus 1-2 according to the second embodiment, the imaging means 32-2 can be mounted on the holding surface 11 of the chuck table 10 located below the laser beam irradiation unit 31 without being obstructed by the condenser 38-2. Since a portion of the image can be imaged, alignment accuracy can be further improved than in the laser processing apparatus 1 according to the first embodiment.

Note that the present invention is not limited to the above embodiments. That is, various modifications can be made without departing from the gist of the invention.

Note that the X-axis feed unit 20 of the present invention is not limited to the configuration using the X-axis pulse motor 24 and the X-axis ball screw 23. For example, the X-axis feed unit 20, the first chuck table, and the second chuck table each have a drive source, and each has a linear servo motor that can control the X-axis feed independently. It's good as well. As a result, while one chuck table is stopped, it is possible to control the movement of the other chuck table, and restrictions on conveyance and processing are significantly reduced.

1, 1-2 Laser processing device 10 Chuck table 11 Holding surface 14 Rotation unit 20 X-axis feed unit 30 Laser processing unit 31, 31-2 Laser beam irradiation unit 341 Oscillator 37 Laser beam scanning unit 38, 38-2 Concentrator 40 Conveyance Area 41 Loading/unloading unit 100 Workpiece

Claims (5)

a first chuck table that holds the workpiece on a holding surface;
a second chuck table that holds the workpiece on a holding surface;
an X-axis feeding unit that moves the first chuck table and the second chuck table in a state where they are aligned in the X-axis direction;
a laser beam irradiation unit that processes the workpiece held by the chuck table by irradiating the workpiece with a laser beam;
a pair of transport areas arranged side by side in the X-axis direction on both sides of the laser beam irradiation unit and for transporting the workpiece into or out of the chuck table;
The laser beam irradiation unit is
an oscillator that emits a laser beam;
a concentrator that condenses light from the oscillator;
a laser beam scanning unit disposed between the oscillator and the condenser and displacing the irradiation position of the laser beam on the holding surface of the chuck table ;
One of the first chuck table and the second chuck table is positioned in one of the pair of transport areas to carry in or carry out the workpiece, and the first chuck table and the second chuck table A laser processing device that positions the other of the chuck table below the laser beam irradiation unit and processes a workpiece held by the other . 2. The X-axis feeding unit is a linear motion mechanism in which each of the first chuck table and the second chuck table has a drive source and can independently control the X-axis feeding. Laser processing equipment. 3. The laser processing apparatus according to claim 1, wherein the laser beam scanning unit includes a galvano scanner, a resonant scanner, an acousto-optic deflection element, or a polygon mirror. The laser processing apparatus according to any one of claims 1 to 3 , wherein the first chuck table and the second chuck table include a rotation unit that rotates the holding surface about a rotation axis perpendicular to the holding surface. . The laser processing apparatus according to any one of claims 1 to 4 , wherein the transfer area includes a carry-in/out unit that carries the workpiece into and out of the chuck table.

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