CN201931205U - Double-station laser etching machine for touch screen ITO (indium tin oxide) thin films - Google Patents

Double-station laser etching machine for touch screen ITO (indium tin oxide) thin films Download PDF

Info

Publication number
CN201931205U
CN201931205U CN 201120001278 CN201120001278U CN201931205U CN 201931205 U CN201931205 U CN 201931205U CN 201120001278 CN201120001278 CN 201120001278 CN 201120001278 U CN201120001278 U CN 201120001278U CN 201931205 U CN201931205 U CN 201931205U
Authority
CN
China
Prior art keywords
platform
thin film
laser
ito thin
motion
Prior art date
Application number
CN 201120001278
Other languages
Chinese (zh)
Inventor
陈刚
任清荣
辛天才
Original Assignee
武汉吉事达激光技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉吉事达激光技术有限公司 filed Critical 武汉吉事达激光技术有限公司
Priority to CN 201120001278 priority Critical patent/CN201931205U/en
Application granted granted Critical
Publication of CN201931205U publication Critical patent/CN201931205U/en

Links

Abstract

The utility model provides a double-station laser etching machine for touch screen ITO (indium tin oxide) thin films, which comprises a machine frame, a control system, a computer system, a laser generator, an adsorption platform, a two-dimensional vibrating lens, a single-dimensional movement platform and an F-Theta lens group, wherein the control system, the computer system, the adsorption platform and the laser generator are all mounted on the machine frame; the laser generator, the two-dimensional vibrating lens and the F-Theta lens group are mounted above the adsorption platform; the laser light emitting hole of the laser generator and the laser light transmitting hole of the two-dimensional vibrating lens are concentric; the F-Theta lens group is mounted at the lower part of the two-dimensional vibrating lens; the single-dimensional movement platform is mounted between the machine frame and the adsorption platform; and the length of the adsorption platform is greater than twice the width of an ITO membrane material to be etched. The double-station laser etching machine for the touch screen ITO thin films has short auxiliary time and high production efficiency.

Description

Double touch-screen ito thin film etching laser machining

Technical field

The utility model relates to a kind of Laser Processing ito thin film equipment, particularly relates to a kind of double touch-screen ito thin film etching laser machining.

Background technology

Ito thin film is that tin indium oxide (Indium-Tin Oxide) is a kind of transparent conducting film glass, is widely used in liquid crystal touch screen, display (LCD), solar cell, microelectronics ITO electropane, photoelectron and various optical field.Traditional touch-screen ito thin film mainly adopts the method production of chemical etching, but along with of the support of operating systems such as the appearance of condenser type multi-point touch technology among the apple iphone and Window7 to multi-point touch, caused the revolutionary change of touch-screen, traditional method for chemially etching all can't meet the demands in the efficient and the yields of machining accuracy (comprising linear precision and live width precision), processing.

Laser has high coherence, high directivity and high-intensity characteristics, obtains very high pharosage easily, and strong laser beam is focused on the medium, utilizes the process of laser beam and matter interaction to change Substance Properties, Laser Processing that Here it is.

Laser ablation touch-screen ito thin film, speed is fast, technology simply, control, do not have chemical contamination easily, more and more be used.

At present, laser ablation touch-screen ito thin film has two kinds of forms: a kind of is workbench or the motion of laser head two dimensional surface, and the track of etching is workbench or laser head two dimensional surface movement locus; Another kind is to adopt two-dimensional vibration lens and F-θ set of lenses, and the vibrating motor deflection of two-dimensional vibration lens makes the laser beam motion, and the focal track that focuses on through F-θ set of lenses is the track of laser ablation again.

The patent No. is that 201020302494.6 touch-screen ito thin film laser ablation equipment is to adopt two-dimensional vibration lens and F-θ set of lenses, its etching speed is fast, the production efficiency height, but, this equipment service working time is long, the material loading of a rapidoprint, contraposition and blanking time greatly time that accounted for, though laser is very fast to the etching speed of ito thin film, the efficient of entire equipment is still not high.

Summary of the invention

The purpose of this utility model provides a kind of double touch-screen ito thin film etching laser machining, this double touch-screen ito thin film etching laser machining, production efficiency height.

In order to achieve the above object, double touch-screen ito thin film etching laser machining of the present utility model, comprise frame, control system, computer system, laser generator, the absorption platform, two-dimensional vibration lens and F-θ set of lenses, control system, computer system, absorption platform and laser generator all are installed on the frame, laser generator, two-dimensional vibration lens and F-θ set of lenses are installed in absorption platform top, the laser light hole of laser generator is concentric with the laser light well of two-dimensional vibration lens, F-θ set of lenses is installed in the two-dimensional vibration lens bottom, it is characterized in that: also comprise the motion in one dimension platform;

The motion in one dimension platform is installed between frame and the absorption platform, and the length of absorption platform is greater than the twice of institute's etching ito thin film material width.

Because the length of absorption platform is greater than the twice of institute's etching ito thin film material width, on the absorption platform, can place two ito thin film materials simultaneously, and between frame and absorption platform, the motion in one dimension platform has been installed, the motion of motion in one dimension platform moves around absorption platform and absorption ito thin film material thereon, move to part under the F-θ set of lenses and adsorb an ito thin film material on the platform by laser ablation, and the absorption platform partly is not used under F-θ set of lenses, following another ito thin film material, after an ito thin film material etching is intact, the motion of motion in one dimension platform makes another ito thin film material that places carry out etching under moving on to F-θ set of lenses, and the previous good ito thin film material of etching is moved out of under the F-θ set of lenses, carry out blanking again, material loading, so repeatedly, promptly in an ito thin film material laser etching, finish on another ito thin film material, blanking, double work just, non-cutting time is short, the production efficiency height.

Described double touch-screen ito thin film etching laser machining is characterized in that: also comprise the CCD navigation system, the CCD navigation system is installed in absorption platform top, and the CCD navigation system is made up of ccd video camera, industrial lens and analysis and Control system.During work, the CCD navigation system is to the location target shooting on the ito thin film material of placing on the absorption platform, relatively locate the position of target and the difference of normal place on the ito thin film material by pixel analysis, analysis and Control system control etching software is adjusted the etching position, with the deviation of compensation ito thin film material position.

Described double touch-screen ito thin film etching laser machining, it is characterized in that: also comprise transverse moving device, transverse moving device is a straight line motion platform, is installed between frame and the laser generator, and the direction of motion of transverse moving device is vertical with motion in one dimension platform direction.Because adopt the etching laser machining of two-dimensional vibration lens and F-θ set of lenses, for the linear width that makes its etching spreads, the precision height, often select the short F-θ set of lenses of focal length for use, and the etching scope of the F-θ set of lenses of focal length weak point is also just little, the laser generator, two-dimensional vibration lens and the F-θ set of lenses that need to adopt motion in one dimension platform drive absorption platform and transverse moving device to drive on it are moved, thereby realize that several figure splice etching, finally realize little linear width and high-precision etching on the large format.

Described double touch-screen ito thin film etching laser machining is characterized in that: the motion in one dimension platform is linear electric motors actuation movement platform or driven by servomotor motion platform.

Two servo vibrating motors of high speed are arranged in the described two-dimensional vibration lens, on the axle of the servo vibrating motor of each high speed the laser mirror sheet is installed, two servo vibrating motors of high speed intersect to be installed.

Described F-θ set of lenses is a set of contact lenses group, and its effect is that the different angles laser beam through two-dimensional vibration lens is focused on the plane, so the ito thin film that can be opposite on the absorption platform carries out etching processing.

The inside of described absorption platform is two cavitys that do not communicate, table is provided with a plurality of apertures that are communicated with cavity above, the side or the bottom of absorption platform have a plurality of through holes that are connected with cavity, wherein, have at least a through hole to be connected with vacuum plant or extractor fan; Vacuum plant or extractor fan are adsorbed in the absorption platform to ito thin film, make ito thin film lie on the absorption platform, guarantee the etching quality, and two cavitys that do not communicate can be realized separately the ito thin film on it being adsorbed or not adsorbing.

Described frame is a hardware, is the support and the attaching parts of whole double touch-screen ito thin film etching laser machining, and control system, computer system, motion in one dimension platform and laser generator all are installed on the frame.

Described control system comprises industrial computer and operation control software thereof, and its effect is the operation of control double touch-screen ito thin film etching laser machining.

Described computer system comprises main frame, display, keyboard and mouse, wherein on the mainboard of main frame motion control card is installed.Computer system is controlled whole membrane laser etching operation together with control system, and the effect of display is the interface that is used for display operation control software.

The optical maser wavelength that described laser generator sends is 266nm, 1064nm, 532nm or 355nm.

Double touch-screen ito thin film etching laser machining of the present utility model, non-cutting time is short, the production efficiency height.

Description of drawings

Fig. 1 is the structural representation of the utility model embodiment.

Fig. 2 is the schematic diagram of absorption platform motion to another work station.

The specific embodiment

The explanation of Fig. 1 mark: transverse moving device 1, elevating mechanism 2, laser generator 3, two-dimensional vibration lens 4, F-θ set of lenses 5, display 6, control system 7, CCD navigation system 8, absorption platform 9, motion in one dimension platform 10, frame 11, computer system 12.

Referring to Fig. 1, the embodiment of the utility model double touch-screen ito thin film etching laser machining comprises frame 11, control system 7, computer system 12, laser generator 3, absorption platform 9, two-dimensional vibration lens 4 and F-θ set of lenses 5, also comprise motion in one dimension platform 10, among the embodiment, motion in one dimension platform 10 is a linear electric motors actuation movement platform.Control system 7, computer system 12, absorption platform 9 and laser generator 3 all are installed on the frame 11, laser generator 3, two-dimensional vibration lens 4 and F-θ set of lenses 5 are installed in absorption platform 9 tops, the laser light hole of laser generator 3 is concentric with the laser light well of two-dimensional vibration lens 4, F-θ set of lenses 5 is installed in two-dimensional vibration lens 4 bottoms, motion in one dimension platform 10 is installed between frame 11 and the absorption platform 9, and the length of absorption platform 9 is greater than the twice of institute's etching ito thin film material width.

Because the length of absorption platform 9 is greater than the twice of institute's etching ito thin film material width, on absorption platform 9, can place two ito thin film materials simultaneously, and between frame 11 and absorption platform 9, motion in one dimension platform 10 has been installed, the motion of motion in one dimension platform 10 moves around absorption platform 9 and absorption ito thin film material thereon, move to part under the F-θ set of lenses 5 and adsorb an ito thin film material on the platform 9 by laser ablation, and absorption platform 9 partly is not used under F-θ set of lenses 5, following another ito thin film material, after an ito thin film material etching is intact, the motion of motion in one dimension platform 10 makes another ito thin film material that places carry out etching under moving on to F-θ set of lenses 5, and the previous good ito thin film material of etching is moved out of under the F-θ set of lenses 5, carry out blanking again, material loading, so repeatedly, promptly in an ito thin film material laser etching, finish on another ito thin film material, blanking, double work just, non-cutting time is short, the production efficiency height.

Among the embodiment, also be provided with CCD navigation system 8, CCD navigation system 8 is installed in absorption platform 9 tops, and CCD navigation system 8 is made up of ccd video camera, industrial lens and analysis and Control system.During work, location target shooting on the ito thin film material of placing on 8 pairs of absorption platforms 9 of CCD navigation system, relatively locate the position of target and the difference of normal place on the ito thin film material by pixel analysis, analysis and Control system control etching software is adjusted the etching position, with the deviation of compensation ito thin film material position.

Among the embodiment, also be provided with transverse moving device 1, transverse moving device 1 is a straight line motion platform, is installed between frame 11 and the laser generator 3, and the direction of motion of transverse moving device 1 is vertical with motion in one dimension platform 10 directions.Because adopt the etching laser machining of two-dimensional vibration lens 4 and F-θ set of lenses 5, for the linear width that makes its etching spreads, the precision height, often select the short F-θ set of lenses 5 of focal length for use, and the etching scope of the F-θ set of lenses 5 of focal length weak point is also just little, laser generator 3, two-dimensional vibration lens 4 and the F-θ set of lenses 5 that need adopt motion in one dimension platform 10 drive absorption platforms 9 and transverse moving device 1 to drive on it are moved, thereby realize that several figure splice etching, finally realize little linear width and high-precision etching on the large format.

Two servo vibrating motors of high speed are arranged in the two-dimensional vibration lens 4, on the axle of the servo vibrating motor of each high speed the laser mirror sheet is installed, two servo vibrating motors of high speed intersect to be installed.

F-θ set of lenses 5 is a set of contact lenses group, and its effect is that the different angles laser beam through two-dimensional vibration lens 4 is focused on the plane, so the ito thin film that can be opposite on the absorption platform 9 carries out etching processing.

The inside of absorption platform 9 is two cavitys that do not communicate, and table is provided with a plurality of apertures that are communicated with cavity above, and the side or the bottom of absorption platform 9 have a plurality of through holes that are connected with cavity, wherein, have at least a through hole to be connected with vacuum plant or extractor fan; Vacuum plant or extractor fan are adsorbed in absorption platform 9 to ito thin film, make ito thin film lie on absorption platform 9, guarantee the etching quality, and two cavitys that do not communicate can be realized separately the ito thin film on it being adsorbed or not adsorbing.

Frame 11 is a hardware, is the support and the attaching parts of whole double touch-screen ito thin film etching laser machining, and control system 7, computer system 12, motion in one dimension platform 10 and laser generator 3 all are installed on the frame 11.

Control system 7 comprises industrial computer and operation control software thereof, and its effect is the operation of control double touch-screen ito thin film etching laser machining.

Computer system 12 comprises main frame, display 6, keyboard and mouse, wherein on the mainboard of main frame motion control card is installed.Computer system 12 is controlled whole membrane laser etching operation together with control system 7, and the effect of display 6 is the interfaces that are used for display operation control software.

Among the embodiment, the optical maser wavelength that laser generator 3 sends is 355nm.

Adjust laser focal for convenience, between transverse moving device 1 and laser generator 3, be provided with elevating mechanism 2, elevating mechanism 2 is the mechanism of motor-driven energy vertical lift, it can make the laser generator 3, two-dimensional vibration lens 4 and the F-θ set of lenses 5 that are installed on it rise or descend, thereby the focus that reaches after laser focuses on drops on the ito thin film material that adsorbs on the platform.

Double touch-screen ito thin film etching laser machining of the present utility model, non-cutting time is short, the production efficiency height, it apply, to improve ito thin film laser ablation efficient, positive meaning saves production cost.

Claims (5)

1. double touch-screen ito thin film etching laser machining, comprise frame, control system, computer system, laser generator, absorption platform, two-dimensional vibration lens and F-θ set of lenses, control system, computer system, absorption platform and laser generator all are installed on the frame, laser generator, two-dimensional vibration lens and F-θ set of lenses are installed in absorption platform top, the laser light hole of laser generator is concentric with the laser light well of two-dimensional vibration lens, F-θ set of lenses is installed in the two-dimensional vibration lens bottom, it is characterized in that: also comprise the motion in one dimension platform;
The motion in one dimension platform is installed between frame and the absorption platform, and the length of absorption platform is greater than the twice of institute's etching ito thin film material width.
2. double touch-screen ito thin film etching laser machining according to claim 1, it is characterized in that: also comprise the CCD navigation system, the CCD navigation system is installed in absorption platform top, and the CCD navigation system is made up of ccd video camera, industrial lens and analysis and Control system.
3. double touch-screen ito thin film etching laser machining according to claim 1 and 2, it is characterized in that: also comprise transverse moving device, transverse moving device is a straight line motion platform, be installed between frame and the laser generator, the direction of motion of transverse moving device is vertical with motion in one dimension platform direction.
4. double touch-screen ito thin film etching laser machining according to claim 1 and 2 is characterized in that: the motion in one dimension platform is linear electric motors actuation movement platform or driven by servomotor motion platform.
CN 201120001278 2011-01-05 2011-01-05 Double-station laser etching machine for touch screen ITO (indium tin oxide) thin films CN201931205U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201120001278 CN201931205U (en) 2011-01-05 2011-01-05 Double-station laser etching machine for touch screen ITO (indium tin oxide) thin films

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201120001278 CN201931205U (en) 2011-01-05 2011-01-05 Double-station laser etching machine for touch screen ITO (indium tin oxide) thin films

Publications (1)

Publication Number Publication Date
CN201931205U true CN201931205U (en) 2011-08-17

Family

ID=44442744

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201120001278 CN201931205U (en) 2011-01-05 2011-01-05 Double-station laser etching machine for touch screen ITO (indium tin oxide) thin films

Country Status (1)

Country Link
CN (1) CN201931205U (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102500929A (en) * 2011-10-31 2012-06-20 武汉先河激光技术有限公司 Ultraviolet laser etching machine
CN102581492A (en) * 2012-01-31 2012-07-18 武汉吉事达激光技术有限公司 Laser etcher capable of automatically feeding roll materials
CN103286452A (en) * 2012-03-02 2013-09-11 深圳市大族激光科技股份有限公司 Laser micro hole processing method and laser micro hole processing device
CN103447696A (en) * 2013-08-30 2013-12-18 深圳市木森科技有限公司 Double-station fixture and laser processing method
CN104741795A (en) * 2015-03-31 2015-07-01 武汉先河激光技术有限公司 Efficient laser etching device for small OGS
CN105458513A (en) * 2015-12-25 2016-04-06 苏州智合源电子科技有限公司 Display assembly of fully-automatic laser marking machine
CN106112271A (en) * 2016-08-22 2016-11-16 首都师范大学 A kind of Multifunctional laser engraving machine system and engraving process

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102500929A (en) * 2011-10-31 2012-06-20 武汉先河激光技术有限公司 Ultraviolet laser etching machine
CN102581492A (en) * 2012-01-31 2012-07-18 武汉吉事达激光技术有限公司 Laser etcher capable of automatically feeding roll materials
CN103286452A (en) * 2012-03-02 2013-09-11 深圳市大族激光科技股份有限公司 Laser micro hole processing method and laser micro hole processing device
CN103286452B (en) * 2012-03-02 2015-09-09 大族激光科技产业集团股份有限公司 Laser micropore processing method and laser micropore process equipment
CN103447696A (en) * 2013-08-30 2013-12-18 深圳市木森科技有限公司 Double-station fixture and laser processing method
CN103447696B (en) * 2013-08-30 2016-01-06 深圳市木森科技有限公司 Double-station clamp and laser processing
CN104741795A (en) * 2015-03-31 2015-07-01 武汉先河激光技术有限公司 Efficient laser etching device for small OGS
CN105458513A (en) * 2015-12-25 2016-04-06 苏州智合源电子科技有限公司 Display assembly of fully-automatic laser marking machine
CN106112271A (en) * 2016-08-22 2016-11-16 首都师范大学 A kind of Multifunctional laser engraving machine system and engraving process
CN106112271B (en) * 2016-08-22 2017-08-25 首都师范大学 A kind of Multifunctional laser engraving machine system and engraving process

Similar Documents

Publication Publication Date Title
RU2556186C2 (en) Polar plate laser cutter
CN102245340B (en) Laser machining systems and methods with vision correction and/or tracking
JP4948837B2 (en) Scribe head and scribing device
CN203509350U (en) Picosecond laser processing device
EP1800820B1 (en) Method and apparatus for scribing brittle material board and system for breaking brittle material board
TWI248392B (en) Inscribing device for brittle material substrates, processing machine for brittle material substrates, polishing device for brittle material substrates and system for cutting brittle material substrates
US20100233386A1 (en) Precision separation of pv thin film stacks
JP2013012754A (en) Stage with alignment function, processing unit including the stage with alignment function, and substrate alignment method
TW511219B (en) Alignment apparatus
JP2006182009A (en) Cutting device for board, and cutting method for board using it
CN103386388B (en) Full-automatic vision LED point gum machine
CN201567183U (en) Linear reciprocating type lifting device
CN202225657U (en) Computer numerical control (CNC) engraving and milling machine capable of automatically feeding and discharging materials
JPWO2010101060A1 (en) Thin film processing method and thin film processing apparatus for work
CN101581850A (en) Semi-automatic laminating machine and laminating method thereof
CN203471145U (en) Laser processing device
CN101450419B (en) ITO film laser engraving device and method
CN202528550U (en) Screen printing machine
CN201955592U (en) Multifunctional visual sense automatic contraposition applying machine
CN203509351U (en) Multi-head laser etching machine
CN203209853U (en) Machining device applied to large-size light guide plate
JP4571233B1 (en) Dust removal suction device and laser processing machine equipped with the suction device
CN201340501Y (en) Semi-automatic vacuum lining machine
CN102841505B (en) Substrate-precise-positioning workpiece stage
CN201309060Y (en) Amorphous silicon film solar battery laser scribing device and work-piece holder thereof

Legal Events

Date Code Title Description
GR01 Patent grant
C14 Grant of patent or utility model
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: Double-station laser etching machine for touch screen ITO (indium tin oxide) thin films

Effective date of registration: 20120719

Granted publication date: 20110817

Pledgee: Bank of Hankou Limited by Share Ltd Optics Valley branch

Pledgor: Wuhan GStar Laser Technology Co., Ltd.

Registration number: 2012990000389

C56 Change in the name or address of the patentee

Owner name: WUHAN GSTAR TECHNOLOGY CO., LTD.

Free format text: FORMER NAME: WUHAN GSTAR LASER TECHNOLOGY CO., LTD.

CP03 Change of name, title or address

Address after: 430071, No. seven block, Kanto science and Technology Industrial Zone, East Lake Development Zone, Wuhan, Hubei

Patentee after: WUHAN GSTAR TECHNOLOGY CO., LTD.

Address before: 430071, Hubei Wuhan East Lake Development Zone Kanto science and Technology Park (Entrepreneurship Center) No. 7-5

Patentee before: Wuhan GStar Laser Technology Co., Ltd.

PC01 Cancellation of the registration of the contract for pledge of patent right

Date of cancellation: 20131029

Granted publication date: 20110817

Pledgee: Bank of Hankou Limited by Share Ltd Optics Valley branch

Pledgor: Wuhan GStar Laser Technology Co., Ltd.

Registration number: 2012990000389

PLDC Enforcement, change and cancellation of contracts on pledge of patent right or utility model