JP4511706B2 - Workpiece support frame - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a workpiece support frame for supporting a workpiece such as a semiconductor wafer via an adhesive tape.
[0002]
[Prior art]
For example, in a semiconductor device manufacturing process, circuits such as ICs and LSIs are formed in a large number of regions arranged in a lattice pattern on the surface of a substantially disc-shaped semiconductor wafer, and each region where the circuits are formed is predetermined. Individual semiconductor elements are manufactured by dicing along the cutting lines. As described above, when the semiconductor wafer is diced by the dicing apparatus, the semiconductor wafer is previously supported by the support frame via the adhesive tape so that the diced semiconductor elements do not fall apart. The support frame is formed in an annular shape having an opening for housing the semiconductor wafer and a tape attaching portion to which the tape is attached, and supports the semiconductor wafer by attaching the semiconductor wafer to the tape located in the opening. Such a support frame is formed with a positioning mechanism for aligning and transporting a notch portion having a crystal orientation called an orientation flat (so-called orientation flat) formed on the semiconductor wafer in a predetermined direction. The positioning mechanism includes a first positioning portion for positioning with respect to the first direction and a second positioning portion for positioning with respect to a second direction perpendicular to the first direction. Yes. In a conventionally used support frame, the first positioning portion is formed in a V shape, and the second positioning portion is formed in a linear shape.
[0003]
[Problems to be solved by the invention]
In order to support the support frame on the semiconductor wafer via a tape, for example, a tape applicator as disclosed in JP-A-10-189694 is used. That is, in order to support the support frame on the semiconductor wafer via the tape, the support frame and the semiconductor wafer are set in a predetermined positional relationship, and the support frame and the semiconductor wafer are adhered to the belt-like adhesive tape. And, the support frame and the semiconductor wafer are interposed via the adhesive tape by pressing the cutting blade of the cutter against the tape attachment portion and cutting the belt-like adhesive tape attached to the tape attachment portion of the support frame into a circle. It is composed integrally. As a result, when the support frame is repeatedly used, the tape sticking portion of the support frame is damaged by the cutter. Since the cutter is arranged at a predetermined position, the cutter acts at substantially the same position of the tape attaching portion of the support frame, so that the groove due to the scratch formed by the cutter is gradually deepened, and the periphery of this groove is raised. Become unusable. For this reason, the support frame must be discarded after being used a predetermined number of times, which is uneconomical.
[0004]
The present invention has been made in view of the above-mentioned facts, and a main technical problem thereof is that a work support frame that can double the life of the work frame by making both sides of the support frame usable. Is to provide.
[0005]
[Means for Solving the Problems]
In order to solve the main technical problem, according to the present invention, a support frame that supports a workpiece via a tape formed in an annular shape and attached to one side,
The support frame has four straight portions formed on the outer periphery, and two straight portions facing each other are formed in parallel. Two straight portions facing each other or two adjacent straight portions are A pair of a first positioning portion composed of a V-shaped groove for regulating the position in the first direction and a second positioning portion for regulating the position in the second direction that is formed in parallel to the linear portion and orthogonal to the first direction. The first positioning mechanism and the second positioning mechanism are formed in line symmetry,
A workpiece support frame is provided.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of a workpiece support frame configured according to the present invention will be described in detail with reference to the accompanying drawings.
[0007]
FIG. 1 is a perspective view of a dicing apparatus as a cutting apparatus to which a workpiece support frame constructed according to the present invention is applied.
The dicing apparatus in the illustrated embodiment includes a device housing 2 having a substantially rectangular parallelepiped shape. In the apparatus housing 2, a chuck table 3 for holding a workpiece is disposed so as to be movable in a direction indicated by an arrow X that is a cutting feed direction. The chuck table 3 includes a suction chuck support 31 and a suction chuck 32 mounted on the suction chuck support 31, and is a workpiece on a mounting surface that is a surface of the suction chuck 32. For example, a disk-shaped semiconductor wafer is held by suction means (not shown). The chuck table 3 is configured to be rotatable by a rotation mechanism (not shown).
[0008]
The dicing apparatus in the illustrated embodiment includes a spindle unit 4 as cutting means. The spindle unit 4 is mounted on a moving base (not shown) and is adjusted to move in a direction indicated by an arrow Y that is an indexing direction and a direction indicated by an arrow Z that is a cutting direction. A rotary spindle 42 supported and rotated by a rotary drive mechanism (not shown) is provided, and a cutting blade 43 attached to the rotary spindle 42 is provided.
[0009]
The dicing apparatus in the illustrated embodiment images the surface of the workpiece held on the surface of the suction chuck 32 that constitutes the chuck table 3, detects the region to be cut by the cutting blade 43, and cuts the groove. The image pickup mechanism 5 for confirming the state is provided. The imaging mechanism 5 is composed of optical means such as a microscope and a CCD camera. The dicing apparatus also includes display means 6 for displaying an image captured by the imaging mechanism 20.
[0010]
The dicing apparatus in the illustrated embodiment includes a cassette 7 for stocking a semiconductor wafer 8 as a workpiece. The semiconductor wafer 8 is supported on the support frame 9 by the tape 10 and is accommodated in the cassette 7 while being supported by the support frame 9. The support frame 9 will be described in detail later. Further, the cassette 7 is placed on a cassette table 71 that is arranged so as to be movable up and down by a lifting means (not shown). The cassette 7 will be described later in detail.
[0011]
The dicing apparatus in the illustrated embodiment is a workpiece that carries a semiconductor wafer 8 (a state supported by a support frame 9 with a tape 10) as a workpiece housed in a cassette 7 to a workpiece placement region 11. The unloading means 12, the workpiece conveying means 13 for conveying the semiconductor wafer 8 unloaded by the workpiece unloading means 12 onto the chuck table 3, and the semiconductor wafer 8 cut by the chuck table 3 are cleaned. The cleaning means 14 and the cleaning / conveying means 15 for conveying the semiconductor wafer 8 cut by the chuck table 3 to the cleaning means 14 are provided.
[0012]
Next, the relationship between the workpiece placement area 11, the cassette 7, and the workpiece unloading means 12 will be described with reference to FIG.
The workpiece placement area 11 is provided with a guide groove 16 formed perpendicular to the cassette 7 at the center for guiding the movement of the workpiece carry-out means 12. On both sides of the guide groove 16, a pair of workpiece placement members 17 a and 17 b are disposed in parallel with the guide groove 16. The pair of workpiece placement members 17a and 17b are respectively provided with placement portions 171a and 171b for placing both side portions of the support frame 9 for supporting the workpiece and outer edges of the placement portions 171a and 171b. It comprises guide portions 172a and 172b which are formed upright and guide both sides of the support frame 9, and are arranged facing each other. Further, the position restriction in the direction of the arrow X shown in FIG. 1 is performed between the guide groove 16 and the rear ends of the pair of workpiece placement members 17a and 17b (the end opposite to the cassette 7 and the side). A first positioning pin 18 and a second positioning pin 19 for restricting the position in the arrow Y direction shown in FIG. The cassette 7 is provided with a plurality of vertical shelves 70 provided on opposite side walls of the cassette 7 in the vertical direction. A semiconductor wafer supported on the support frame 9 via the tape 10 on the shelves 70. 8 is stored.
[0013]
Next, an embodiment of a support frame 9 that supports a semiconductor wafer 8 as a workpiece through a tape 10 will be described with reference to FIG.
The support frame 9 in the embodiment of FIG. 3 is formed in an annular shape from a metal material such as stainless steel, and includes an opening 91 for housing a semiconductor wafer and a tape attaching portion 92 to which a tape is attached. Four linear portions 93a, 93b, 93c, and 93d are formed on the outer periphery of the support frame 9, and the two linear portions 93a and 93b and 93c and 93d facing each other are formed in parallel. In the embodiment of FIG. 3, the first positioning portions 94 and 94 and the second positioning portions 95 and 95 are provided on both sides of the two linear portions 93a and 93b facing each other on the outer periphery of the support frame 9, respectively. Is formed with an interval corresponding to the interval between the first positioning pin 18 and the second positioning pin 19. The first positioning portions 94, 94 are configured by V-shaped grooves formed at an angle of approximately 60 degrees, and are engaged with the first positioning pins 18 to be positioned in the direction of the arrow X shown in FIG. Regulate. The second positioning portions 95 and 95 are formed in parallel with the linear portions 93a and 93b, and engage with the second positioning pins 19 to restrict the position in the arrow Y direction shown in FIG. In the embodiment of FIG. 3, the first positioning portion 94 and the second positioning portion 95 formed on the linear portion 93b and the first positioning portion 94 and the second positioning portion 95 formed on the linear portion 93a side. The part 95 is provided symmetrically with respect to a line 90 a passing through the center of the annular support frame 9. In the illustrated embodiment, a pair of the first positioning portion 94 and the second positioning portion 95 formed on both sides of the linear portion 93a constitutes a first positioning mechanism, and both sides of the linear portion 93b. A pair of the first positioning portion 94 and the second positioning portion 95 formed in the above constitutes a second positioning mechanism.
[0014]
A semiconductor wafer 8 as a workpiece is supported via a tape 10 on the support frame 9 in the embodiment of FIG. 3 as indicated by a two-dot chain line. At this time, the tape 10 is attached to the tape attaching portion 92 on the back surface of the support frame 9 in FIG. 3, and the semiconductor wafer 8 has the orientation flat (so-called orientation flat) 81 on the surface of the tape 10 in FIG. Affixed to the linear portion 93a side. The support frame 9 supporting the semiconductor wafer 8 in this way is stored in the shelf 70 of the cassette 7 shown in FIG. 2 so that the linear portion 93a side faces the workpiece unloading means 12. Therefore, when the support frame 9 supporting the semiconductor wafer 8 housed in the cassette 7 is carried out to the workpiece placement area 11, the workpiece unloading means 12 holds the linear portion 93a side of the support frame 9 with the workpiece frame. And carry it out. At this time, the first positioning portion 94 provided on the linear portion 93a side of the support frame 9 is engaged with the first positioning pin 18 so that the position restriction in the direction of the arrow X shown in FIG. The two positioning portions 95 are engaged with the second positioning pins 19 to restrict the position in the arrow Y direction shown in FIG.
[0015]
When the support frame 9 reaches the predetermined number of times when the semiconductor wafer 8 is supported in the state shown in FIG. 3, the support frame 9 is turned over and used. At this time, the first positioning portion 94 and the second positioning portion 95 formed on the linear portion 93a side of the support frame 9 and the first positioning portion 94 and the second positioning portion 95 formed on the linear portion 93b are provided. The first positioning portion 94 and the second positioning portion 95 are arranged symmetrically with respect to the line 90a passing through the center of the annular support frame 9, so The positional relationship does not change. Therefore, the support frame 9 can be used under the same conditions regardless of which surface is used.
[0016]
Next, another embodiment of a support frame configured according to the present invention will be described with reference to FIG. In addition, about the support frame 9A of embodiment of FIG. 4, the same code | symbol is attached | subjected to the same part as each part of the support frame 9 in embodiment of the said FIG. 3, and the description is abbreviate | omitted.
The support frame 9A in the embodiment of FIG. 4 includes a first positioning portion 94, 94 and a second positioning portion 95, 95 on the both sides of two adjacent linear portions 93a, 93c, respectively. It is formed with an interval corresponding to the interval between 18 and the second positioning pin 19. The first positioning portion 94 and the second positioning portion 95 formed on the linear portion 93a side of the support frame 9A and the first positioning portion 94 and the second positioning portion 95 formed on the linear portion 93c are, It is symmetrical with respect to a line 90b passing through the center of the annular support frame 9A. Accordingly, the support frame 9A can be used in the state shown in FIG. 4 and the state in which the front and back sides are reversed similarly to the support frame 9 in the embodiment of FIG. In the illustrated embodiment, a pair of the first positioning portion 94 and the second positioning portion 95 formed on both sides of the linear portion 93a constitutes a first positioning mechanism, and both sides of the linear portion 93c. The first positioning portion 94 and the second positioning portion 95 formed in the above form a pair of second positioning mechanisms.
[0017]
Next, the processing operation of the above-described dicing apparatus will be briefly described.
The semiconductor wafer 8 supported by the support frame 9 accommodated in the predetermined shelf 70 of the cassette 7 shown in FIG. 2 via the tape 10 is positioned at the carry-out position by the vertical movement of the cassette table 71 by the lifting means (not shown). It is done. Next, the workpiece unloading means 12 moves forward along the guide groove 16 toward the cassette 7, grips the linear portion 93 a side (see FIG. 3) of the support frame 9 accommodated in the predetermined shelf 70, By retracting along the guide groove 16, the support frame 9 that supports the semiconductor wafer 5 via the tape 10 is carried out to the workpiece placement region 11. At this time, the support frame 9 moves while being guided by the guide portions 172a and 172b of the pair of workpiece placement members 17a and 17b, and the first positioning portion 94 provided on the linear portion 93a side of the support frame 9 is provided. 1 is engaged with the first positioning pin 18 to restrict the position in the direction of arrow X shown in FIG. 1, and the second positioning portion 95 is engaged with the second positioning pin 19 and shown in FIG. Position restriction in the direction of arrow Y is performed. When the support frame 9 is positioned by the first positioning pin 18 and the second positioning pin 19 in this manner, the support frame 9 is released from the pair of workpieces by releasing the gripping by the workpiece unloading means 7. It mounts on the mounting parts 171a and 171b of the object mounting members 17a and 17b.
[0018]
Continuing the description with reference to FIG. 1, the semiconductor wafer 8 supported via the tape 10 on the support frame 9 carried out on the pair of workpiece mounting members 17a and 17b as described above is processed. The object is transported to the mounting surface of the suction chuck 32 constituting the chuck table 3 by the turning operation of the object transport means 13 and is sucked and held by the suction chuck 32. The chuck table 3 that sucks and holds the semiconductor wafer 8 in this way is moved to a position immediately below the imaging mechanism 5. When the chuck table 3 is positioned immediately below the image pickup mechanism 5, a cutting line (street) formed on the semiconductor wafer 8 is detected by the image pickup mechanism 5 and is moved and adjusted in the arrow Y direction that is the indexing direction of the spindle unit 4. Precision alignment work is performed.
[0019]
Thereafter, the semiconductor wafer 8 held by the chuck table 3 is moved by moving the chuck table 3 holding the semiconductor wafer 8 by suction in a direction indicated by an arrow X which is a cutting feed direction (a direction orthogonal to the rotation axis of the cutting blade 43). 8 is cut along a predetermined cutting line (street) by the cutting blade 43. That is, the cutting blade 43 is mounted on the spindle unit 4 that is moved and adjusted in the direction indicated by the arrow Y that is the indexing direction and the direction indicated by the arrow Z that is the cutting direction, and is rotationally driven. Is moved along the lower side of the cutting blade 43 in the cutting feed direction, the semiconductor wafer 8 held on the chuck table 3 is cut along a predetermined cutting line (street) by the cutting blade 43. This cutting may be performed by forming a cutting groove such as a V-groove having a predetermined depth, or by cutting along a cutting line (street). When cut along a cutting line (street), the semiconductor wafer 8 is divided into semiconductor chips. The divided semiconductor chips are not separated by the action of the tape 10, and the state of the semiconductor wafer 8 supported by the frame 9 is maintained. After the semiconductor wafer 8 has been cut in this manner, the chuck table 3 holding the semiconductor wafer 8 is returned to the position where the semiconductor wafer 8 is first sucked and held, and the semiconductor wafer 8 is released from sucking and holding. . Next, the semiconductor wafer 8 supported on the support frame 9 via the tape 10 is transported to the cleaning unit 14 by the cleaning transport unit 15 and cleaned there. The support frame 9 supporting the cleaned semiconductor wafer 8 via the tape 10 is placed on the workpiece placement region 11 by the workpiece transport means 13 on the pair of workpiece placement members 17a and 17b. It is carried out to. The support frame 9 that supports the semiconductor wafer 8 via the tape 10 is accommodated in a predetermined shelf 70 of the cassette 7 by the workpiece unloading means 12.
[0020]
The example in which the workpiece support frame configured according to the present invention is applied to the dicing apparatus has been described above. However, the workpiece support frame according to the present invention can be applied to other machine tools such as a grinding apparatus.
[0021]
【The invention's effect】
Since the support frame of the workpiece according to the present invention is configured as described above, the following effects can be obtained.
[0022]
In other words, the workpiece support frame according to the present invention has a first positioning mechanism and a second positioning mechanism which are paired with the first positioning portion and the second positioning portion on the outer periphery, and are formed in line symmetry. Even if the support frame is reversed, the positional relationship between the first positioning portion and the second positioning portion does not change. Accordingly, since the support frame can be used under the same conditions regardless of the surface, the life of the support frame can be doubled compared to the conventional one.
[Brief description of the drawings]
FIG. 1 is a perspective view of a dicing apparatus as a cutting apparatus to which a workpiece support frame constructed according to the present invention is applied.
FIG. 2 is an enlarged perspective view showing a workpiece placement region of the dicing apparatus shown in FIG.
FIG. 3 is a perspective view of one embodiment of a workpiece support frame constructed in accordance with the present invention.
FIG. 4 is a perspective view showing another embodiment of a workpiece support frame constructed in accordance with the present invention.
[Explanation of symbols]
2: Device housing 3: Chuck table 31: Adsorption chuck support base 32: Adsorption chuck 4: Spindle unit 41: Spindle housing 42: Spindle spindle 43: Cutting blade 5: Imaging mechanism 6: Display means 7: Cassette 70: Cassette shelf 71: Cassette table 8: Semiconductor wafer 9, 9A: Support frame 91: Support frame opening 92: Support frame tape attaching section 94: Support frame first positioning section 95: Support frame second positioning section 10: Tape 12: Workpiece placing area 13: Workpiece conveying means 14: Cleaning means 15: Cleaning conveying means 16: Guide grooves 17a, 17b: Workpiece placing members 171a, 171b: Workpiece placing Member placement portions 172a and 172b: Workpiece placement member guide portion 18: First positioning pin 19: Second Positioning pin

Claims (1)

A support frame that supports a workpiece via a tape formed in an annular shape and attached to one side,
The support frame has four straight portions formed on the outer periphery, and two straight portions facing each other are formed in parallel. Two straight portions facing each other or two adjacent straight portions are A pair of a first positioning portion composed of a V-shaped groove for regulating the position in the first direction and a second positioning portion for regulating the position in the second direction that is formed in parallel to the linear portion and orthogonal to the first direction. The first positioning mechanism and the second positioning mechanism are formed in line symmetry,
A workpiece support frame characterized by that.

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