CN103681418A - A twelve-inch wafer framework - Google Patents
A twelve-inch wafer framework Download PDFInfo
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- CN103681418A CN103681418A CN201210361033.XA CN201210361033A CN103681418A CN 103681418 A CN103681418 A CN 103681418A CN 201210361033 A CN201210361033 A CN 201210361033A CN 103681418 A CN103681418 A CN 103681418A
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- intercepting
- profile
- tooth
- limit
- wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a twelve-inch wafer framework comprising a frame body. The frame body is in an annular shape four parts of which are cut along the outer periphery thereof, wherein four sides at cutting positions are defined as cut sides, and the arc outer periphery parts of the frame body between adjacent cut sides are defined as an arc edges. Every two spaced cut sides are parallel with each other and every two adjacent cut sides are mutually vertical to each other. Two ends of one of the four cut sides are equipped with two tooth-shaped gaps. The frame body is designed in an annular shape four parts of which are cut along the outer periphery thereof, and the two ends of one of the four cut sides are equipped with two tooth-shaped gaps. Thus, a wafer has a good supporting effect when processed and is easy to process. Therefore, purposes of reasonable design, simple structure, firm fixation, and good using effect are achieved.
Description
Technical field
The present invention relates to wafer processing technique field, be specifically related to a kind of 12 cun of wafer frames.
Background technology
Wafer refers to the silicon wafer that Si semiconductor production of integrated circuits is used, because it is shaped as circle, therefore be called wafer; On silicon wafer, can manufacture various circuit component structures, and become, have the IC of certain electric sexual function product.The original material of wafer is silicon, and there is nexhaustible silicon dioxide on earth's crust surface.Silicon dioxide ore refines via arc furnace, chlorination of hydrochloric acid, and after distillation, made highly purified polysilicon, its purity is up to 99.999999999%.Wafer fabrication melts many crystal silicons again, in melting in liquid, plant into seed crystal again, then it is slowly pulled out, to form columned monocrystalline silicon crystal bar, because silicon crystal bar is to be generated gradually in the silicon raw material of molten state by a definite seed crystal of high preferred orientation, this process is called " long brilliant ".Silicon crystal bar passes through segment again, barreling, and section, chamfering, polishing, laser incising, after packing, becomes the base stock-silicon wafer of integrated circuit factory, and Here it is " wafer ".
Yet, because wafer is thinner frangible, in the course of processing of wafer, must support its whole area, to prevent unnecessary damage.A kind of common methods of protecting thin wafer relate to use viscous layer by thin wafer temporary joint to flat board, thereby utilize wafer frame to prevent thin wafer transverse shifting.
Therefore, how designing a kind of effectively to wafer support, be easy to processing, and can firmly be installed to the wafer frame on equipment, is industry technical staff technical problem urgently to be resolved hurrily.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of wafer frame that firm effect is good of installing, by described chassis body being designed to annular, along its outward flange, intercepted the shape after four parts; And the edge of intercepting is parallel between two, and the diameter perpendicular with two is parallel respectively; And four the two ends, a wherein limit in described intercepting limit are provided with two profile of tooth breach, make wafer add man-hour support effect good, be easy to processing.
For achieving the above object, technical scheme of the present invention is as follows:
12 cun of wafer frames, comprise a chassis body, and described chassis body is that annular is intercepted the shape after four parts along its outward flange; At this its interception position four edges, be defined as intercepting limit, the chassis body arc outer edge part between adjacent described intercepting limit is defined as arc-shaped side; Wherein, two described intercepting limits at interval are parallel to each other, and two adjacent described intercepting limits are mutually vertical; And four the wherein intercepting two ends, limit in described intercepting limit are provided with two profile of tooth breach.
Preferably, a profile of tooth notch opening angle in described two profile of tooth breach is 60 °, and another profile of tooth notch opening angle is 120 °.
Preferably, described chassis body internal diameter is 699.96mm, described arc-shaped side is 399.98mm to the distance in the center of circle, article two, the distance between described parallel intercepting limit is 759.95mm, described profile of tooth notch opening angle be 60 ° breach bottom to two profile of tooth breach between the diameter that parallels of intercepting limit between distance be 341.78mm, described profile of tooth notch opening angle be bottom the breach of 120 ° to two profile of tooth breach between the diameter that parallels of intercepting limit between distance be 343.58mm.
From above-mentioned technical scheme, can find out that a kind of 12 cun of wafer frames disclosed in this invention are intercepted the shape after four parts by chassis body being designed to annular along its outward flange; And the edge of intercepting is parallel between two, and the diameter perpendicular with two is parallel respectively; And near the two ends, a wherein limit in four described intercepting limits, be provided with two profile of tooth breach, make wafer add man-hour support effect good, be easy to processing, thereby reached object reasonable in design, simple in structure and that fixation effect is good.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation of the disclosed a kind of 12 cun of wafer frames of the embodiment of the present invention.
The title of the corresponding component that the numeral in figure or letter are represented:
1, chassis body 11, intercepting limit 12,13,60 ° of folders of arc-shaped side
14,120 ° of angle profile of tooth breach of angle profile of tooth breach
Embodiment
Below in conjunction with accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Embodiment based in the present invention, those of ordinary skills are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of protection of the present invention.
The invention discloses a kind of 12 cun of wafer frames, by described chassis body being designed to annular, along its outward flange, intercepted the shape after four parts; And the edge of intercepting is parallel between two, and the diameter perpendicular with two is parallel respectively; And four the two ends, a wherein limit in described intercepting limit are provided with two profile of tooth breach, make wafer add man-hour support effect good, be easy to processing, firm effect is installed good.
Embodiment.
As shown in Figure 1, a kind of 12 cun of wafer frames, comprise a chassis body 1, and described chassis body 1 is intercepted the shape after four parts for annular along its outward flange; At this its interception position four edges, be defined as intercepting limit 11, the arc outer edge part of the chassis body 1 between adjacent described intercepting limit 11 is defined as arc-shaped side 12; Wherein, two described intercepting limits 11 at interval are parallel to each other, and adjacent two described intercepting limits 11 are mutually vertical; And four wherein intercepting 11 two ends, limit in described intercepting limit 11 are provided with two profile of tooth breach, and one in described two profile of tooth breach is 60 ° of angle profile of tooth breach 13, and another is 120 ° of angle profile of tooth breach 14.
Wherein, described chassis body 1 internal diameter is 699.96mm, described arc-shaped side 12 is 399.98mm to the distance in the center of circle, article two, the distance between described parallel intercepting limit 11 is 759.95mm, described 60 ° of angle profile of tooth breach 13 bottoms to two profile of tooth breach between the diameter that parallels of intercepting limit between distance be 341.78mm, described 120 ° of angle profile of tooth breach 14 bottoms to two profile of tooth breach between the diameter that parallels of intercepting limit between distance be 343.58mm.
From above-mentioned technical scheme, can find out that a kind of 12 cun of wafer frames disclosed in this invention are intercepted the shape after four parts by chassis body 1 being designed to annular along its outward flange; And the edge of intercepting is parallel between two, and the diameter perpendicular with two is parallel respectively; And near the two ends, a wherein limit in four described intercepting limits 11, be provided with two profile of tooth breach, make wafer add man-hour support effect good, be easy to processing, thereby reached object reasonable in design, simple in structure and that fixation effect is good.
Be more than the description to a kind of 12 cun of wafer frame embodiment of the present invention, by the above-mentioned explanation to the disclosed embodiments, make professional and technical personnel in the field can realize or use the present invention.To the multiple modification of these embodiment, will be apparent for those skilled in the art, General Principle as defined herein can, in the situation that not departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (3)
1. 12 cun of wafer frames, is characterized in that, comprise a chassis body, and described chassis body is that annular is intercepted the shape after four parts along its outward flange; At this its interception position four edges, be defined as intercepting limit, the chassis body arc outer edge part between adjacent described intercepting limit is defined as arc-shaped side; Wherein, two described intercepting limits at interval are parallel to each other, and two adjacent described intercepting limits are mutually vertical; And four the wherein intercepting two ends, limit in described intercepting limit are provided with two profile of tooth breach.
2. a kind of 12 cun of wafer frames according to claim 1, is characterized in that, a profile of tooth notch opening angle in described two profile of tooth breach is 60 °, and another profile of tooth notch opening angle is 120 °.
3. a kind of 12 cun of wafer frames according to claim 2, it is characterized in that, described chassis body internal diameter is 699.96mm, described arc-shaped side is 399.98mm to the distance in the center of circle, article two, the distance between described parallel intercepting limit is 759.95mm, described profile of tooth notch opening angle be 60 ° breach bottom to two profile of tooth breach between the diameter that parallels of intercepting limit between distance be 341.78mm, described profile of tooth notch opening angle be bottom the breach of 120 ° to two profile of tooth breach between the diameter that parallels of intercepting limit between distance be 343.58mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210361033.XA CN103681418A (en) | 2012-09-25 | 2012-09-25 | A twelve-inch wafer framework |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210361033.XA CN103681418A (en) | 2012-09-25 | 2012-09-25 | A twelve-inch wafer framework |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103681418A true CN103681418A (en) | 2014-03-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210361033.XA Pending CN103681418A (en) | 2012-09-25 | 2012-09-25 | A twelve-inch wafer framework |
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| CN (1) | CN103681418A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0429351A (en) * | 1990-05-25 | 1992-01-31 | Fujitsu Ltd | Moving apparatus for wafer frame |
| JP2002110777A (en) * | 2000-09-26 | 2002-04-12 | Disco Eng Service:Kk | Support frame of object processed |
| JP2002240883A (en) * | 2001-02-16 | 2002-08-28 | Achilles Corp | Dicing wafer storing container |
| CN1420529A (en) * | 2001-11-21 | 2003-05-28 | 株式会社迪思科 | Cutter |
| US6718223B1 (en) * | 1999-05-18 | 2004-04-06 | Lintec Corporation | Method of processing semiconductor wafer and semiconductor wafer supporting member |
| TW201007881A (en) * | 2008-06-26 | 2010-02-16 | Jfe Techno Res Corp | Wafer frame and producing method therefor |
-
2012
- 2012-09-25 CN CN201210361033.XA patent/CN103681418A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0429351A (en) * | 1990-05-25 | 1992-01-31 | Fujitsu Ltd | Moving apparatus for wafer frame |
| US6718223B1 (en) * | 1999-05-18 | 2004-04-06 | Lintec Corporation | Method of processing semiconductor wafer and semiconductor wafer supporting member |
| JP2002110777A (en) * | 2000-09-26 | 2002-04-12 | Disco Eng Service:Kk | Support frame of object processed |
| JP2002240883A (en) * | 2001-02-16 | 2002-08-28 | Achilles Corp | Dicing wafer storing container |
| CN1420529A (en) * | 2001-11-21 | 2003-05-28 | 株式会社迪思科 | Cutter |
| TW201007881A (en) * | 2008-06-26 | 2010-02-16 | Jfe Techno Res Corp | Wafer frame and producing method therefor |
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Application publication date: 20140326 |