KR102597984B1 - Manufacturing method of display panel - Google Patents

Abstract

A method of manufacturing a display panel is provided that can suppress the occurrence of chips and cracks at the edges of a display panel during manufacturing. After cutting the optical film bonded to the outer surface of the opposing mother substrate along the outline of each part that becomes the opposing substrate 2 of the display panel 1, the inner side 5a of each cut part is left and the margin of the optical film is left. A step of peeling and removing a portion from the surface of the opposing mother substrate, a step of cutting the opposing mother substrate along the outline of each portion forming the opposing substrate 2 of the display panel 1, and a device mother substrate. After cutting the optical film bonded to the outer surface of the display panel 1 along the outline of each part of the device substrate 3, the blank portion of the optical film is used to face the other side, leaving the inside 5b of each cut part. It includes a step of peeling and removing from the surface of the mother substrate, and a step of cutting the device mother substrate along the outline of each part that becomes the device substrate 3 of the display panel 1.

Description

Manufacturing method of display panel

The present invention relates to a method of manufacturing a display panel.

For example, a liquid crystal display panel has a structure in which a liquid crystal layer is disposed between device substrates arranged to face each other and an opposing substrate, and an optical film such as a polarizing film (polarizing plate) is bonded to the outer surfaces of the device substrate and the opposing substrate.

When manufacturing such a liquid crystal display panel, a panel production substrate is manufactured on which a plurality of parts (cells) that become the liquid crystal display panel are formed in a row, and then each cell is cut out from this panel production substrate, thereby forming a plurality of liquid crystal display panels at once. Manufacturing is currently being carried out (for example, see Patent Documents 1 and 2).

Patent Document 1: Japanese Patent Publication No. 2004-219755 Patent Document 2: Japanese Patent Publication No. 2007-232911

However, in recent years, as image display devices have become thinner and display screens have become larger, display panels with thinner and narrower frames, or display panels used in smart watches, vehicle meters, etc., have a conventional flat shape. There is an increasing demand for displays with a planar shape other than a rectangle (referred to as heterogeneous display panels), which are different from those that are rectangular (referred to as rectangular display panels).

However, as the display panel becomes thinner, the strength of the panel manufacturing substrate decreases, and when each cell is cut from the panel manufacturing substrate, chips or cracks sometimes occur at the end portion (frame portion) of the display panel. In addition, display panels with chips or cracks at the ends may not be commercialized due to the requirement for high dimensional accuracy due to narrow frames or a decrease in the strength of the ends.

On the other hand, in the case of a conventional rectangular display panel, alignment when bonding the polarizing film can be done based on the four corners (edge portions) of the panel, so alignment of the polarizing film is relatively easy. On the other hand, in the case of a non-shaped display panel, alignment when bonding the polarizing film becomes more difficult than in the case of a rectangular display panel. In particular, in the case of a circular display panel, the inclination of the polarization axis of the polarizing film with respect to the display panel cannot be determined, making alignment when bonding the polarizing film very difficult.

Additionally, when manufacturing a rectangular display panel, it is possible to cut the rectangular display panel in batches by cutting the above-described panel manufacturing substrate into a grid shape. In contrast, when manufacturing a release display panel, it is necessary to cut cells one by one from the panel manufacturing substrate along the outline of the release display panel. In this case, alignment when cutting cells from a panel manufacturing substrate becomes more difficult than when manufacturing a rectangular display panel.

The present invention was proposed in consideration of these conventional circumstances, and can suppress the occurrence of chips and cracks at the edges of the display panel during manufacturing, and also improve the bonding accuracy of the optical film to the unusual display panel. The purpose of the present invention is to provide a method for manufacturing a display panel that can manufacture a heterogeneous display panel with high yield.

As a means for solving the above problem, according to an aspect of the present invention, there is provided a method of manufacturing a display panel, wherein a mother substrate for a display panel and a mother substrate for a device are arranged to face each other, and the display panel After preparing a substrate for manufacturing a panel in which a plurality of cells are formed side by side on the surface, and cutting the optical film bonded to the outer surface of the opposing mother substrate along the outline of each portion that becomes the opposing substrate of the display panel, A process of peeling and removing a blank portion of the optical film from the surface of the opposing mother substrate, leaving the inside of each cut portion, and forming the opposing mother substrate along the outline of each portion that becomes the opposing substrate of the display panel. A step of cutting the opposing substrate by cutting, and a step of cutting the device substrate by cutting the device mother substrate along the outline of each part that becomes the device substrate of the display panel. A method of manufacturing a display panel is provided.

In addition, in the method of manufacturing the display panel of the above embodiment, the optical film bonded to the outer surface of the device mother substrate is cut along the outline of each part that becomes the device substrate of the display panel, and then the inside of each cut part is cut. It may also include a step of peeling and removing the blank portion of the optical film from the surface of the opposing mother substrate.

In addition, in the method of manufacturing the display panel of the above aspect, the counter substrate and the element substrate may be cut into different shapes.

In addition, in the display panel manufacturing method of the above aspect, the outline when cutting the optical film may be smaller than the outline when cutting the opposing substrate or the device substrate.

In addition, in the method of manufacturing the display panel of the above embodiment, the opposing substrate or element of the display panel is made while referring to the first alignment mark indicating the position at which the optical film is bonded and the second alignment mark indicating the position of each cell. The optical film may be cut along the outline of each part of the substrate.

In addition, in the method of manufacturing the display panel of the above aspect, the second alignment marks corresponding to the plurality of cells located around the cell to be cut among the cells may be referred to.

Additionally, in the method for manufacturing a display panel of the above aspect, when cutting the optical film along the outline, the cutting may be started from a position that avoids at least the wiring portion formed on the device substrate.

Additionally, in the display panel manufacturing method of the above aspect, when cutting the optical film along the outline, cutting may be started from at least a corner portion of the outline using a laser beam.

In addition, in the method of manufacturing the display panel of the above aspect, the blank portion may be peeled along the diagonal direction of the optical film.

In addition, in the method of manufacturing the display panel of the above aspect, the planar shape of the display panel may be a shape other than a rectangular shape.

Additionally, in the method for manufacturing a display panel of the above aspect, the optical film may be a polarizing film.

Additionally, in the method for manufacturing a display panel of the above aspect, the display panel may be a liquid crystal display panel.

As described above, according to the aspect of the present invention, it is possible to suppress the occurrence of chips and cracks at the edges of the display panel during manufacturing, and to increase the bonding accuracy of the optical film to the release display panel while also increasing the release accuracy. It is possible to provide a display panel manufacturing method that can manufacture the display panel with high yield.

Figure 1 shows an example of a liquid crystal display panel manufactured by applying the present invention, where (a) is a plan view and (b) is a cross-sectional view.
FIG. 2 is a diagram sequentially explaining the manufacturing process of the liquid crystal display panel shown in FIG. 1, where (a) is a plan view and (b) is a cross-sectional view.
FIG. 3 is a diagram sequentially explaining the manufacturing process of the liquid crystal display panel shown in FIG. 1, where (a) is a plan view and (b) is a cross-sectional view.
FIG. 4 is a diagram sequentially explaining the manufacturing process of the liquid crystal display panel shown in FIG. 1, where (a) is a plan view and (b) is a cross-sectional view.
FIG. 5 is a diagram sequentially explaining the manufacturing process of the liquid crystal display panel shown in FIG. 1, where (a) is a plan view and (b) is a cross-sectional view.
FIG. 6 is a diagram sequentially explaining the manufacturing process of the liquid crystal display panel shown in FIG. 1, where (a) is a plan view and (b) is a cross-sectional view.
FIG. 7 is a diagram sequentially explaining the manufacturing process of the liquid crystal display panel shown in FIG. 1, where (a) is a plan view and (b) is a cross-sectional view.
FIG. 8 is a diagram sequentially explaining the manufacturing process of the liquid crystal display panel shown in FIG. 1, where (a) is a plan view and (b) is a cross-sectional view.
FIG. 9 is a diagram sequentially explaining the manufacturing process of the liquid crystal display panel shown in FIG. 1, where (a) is a plan view and (b) is a cross-sectional view.
Fig. 10 is a plan view showing an example of the arrangement of the first alignment mark and the second alignment mark in the substrate for panel production.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

Meanwhile, in the drawings used in the following description, in order to make the features easier to understand, the featured parts may be enlarged for convenience, and the dimensional ratios of each component cannot be said to be the same as the actual ones. do.

(Display panel)

First, as an example of a display panel manufactured by applying the present invention, for example, the liquid crystal display panel 1 shown in FIGS. 1(a) and 1(b) will be described. Meanwhile, Figure 1(a) is a plan view showing the configuration of the liquid crystal display panel 1. Figure 1(b) is a cross-sectional view showing the configuration of the liquid crystal display panel 1.

As shown in FIGS. 1 (a) and 1 (b), the liquid crystal display panel 1 includes an opposing substrate 2 and a device substrate 3 arranged to face each other, and the opposing substrate 2 and the device substrate ( 3) It is provided with a liquid crystal layer 4 disposed therebetween.

The liquid crystal display panel 1 is a heterogeneous display panel in which the display surface S has a circular shape. Meanwhile, the term “deviant display panel” as used in the present invention refers to a panel whose planar shape (display surface) is other than a rectangle, compared to a conventional display panel whose planar shape (display surface) is rectangular (rectangular display panel). Therefore, in accordance with the shape of the display surface when used in, for example, a smart watch or in-vehicle meter, as a variant display panel, in addition to the above-mentioned circular shape, for example, oval, polygon (e.g., triangle, pentagon, hexagon, octagon, etc.), rectangular shape, etc. It is possible to make it into any free shape, such as a round shape or a cut in at least one of the four corners, or a shape in which a notch or the like is formed in part of a rectangle.

The counter substrate 2 is formed in a circular shape corresponding to the display surface S. Additionally, a counter electrode (not shown) is provided on the inner surface of the counter substrate 2. Meanwhile, a circular polarizing film 5a is bonded to the outer surface of the opposing substrate 2. The polarizing film 5a may have the same diameter (outer appearance) as the opposing substrate 2, but is preferably a slightly smaller diameter (smaller external appearance) than the opposing substrate 2 as in this embodiment.

The element substrate 3 includes an element forming portion 3a formed in a circular shape corresponding to the display surface S, and wiring formed continuously in the element forming portion 3a with a width corresponding to the element forming portion 3a. It has a forming portion 3b. Although not shown, a plurality of pixel electrodes arranged in a matrix and a driving element such as a TFT (not shown) connected to each pixel electrode are installed on the inner surface of the element forming portion 3a. In the wiring forming portion 3b, a plurality of wiring portions 6 connected to each drive element are provided. Meanwhile, a circular polarizing film 5b is bonded to the outer surface of the device substrate 3 (element formation portion 3a). The polarizing film 5b may have the same diameter (outer shape) as the element formation portion 3a, but is preferably a slightly smaller diameter (smaller outer shape) than the element formation portion 3a as in this embodiment.

The liquid crystal layer 4 is formed by sealing the area between the opposing substrate 2 and the element forming portion 3a (element substrate 3) in a circular shape with a sealant 7 and injecting liquid crystal into the inside. It is done. The wiring portion 6 extends outside the area (corresponding to the display surface S) surrounded by the seal material 7.

(Manufacturing method of display panel)

Next, as a method of manufacturing a display panel to which the present invention is applied, a case of manufacturing the liquid crystal display panel 1 will be described with reference to FIGS. 2 to 9 and FIG. 10. Meanwhile, FIGS. 2 to 9 are drawings for sequentially explaining the manufacturing process of the liquid crystal display panel 1, where (a) in each drawing is a plan view showing each process, and (b) in each drawing is a plan view showing each process. This is a cross-sectional view showing. FIG. 10 is a plan view showing an example of the arrangement of the first alignment mark AM1 and the second alignment mark AM2 in the substrate 10 for panel production, which will be described later.

When manufacturing the liquid crystal display panel 1, first, as shown in FIGS. 2(a) and 2(b), the part (hereinafter referred to as cell) (1A) that becomes the liquid crystal display panel 1. A plurality of rectangular (rectangular) shaped substrates 10 for panel production are prepared in this plane. The substrate 10 for panel production includes a rectangular (rectangular) shaped opposing mother substrate 2A and a device mother substrate 3A arranged to face each other. In the opposing mother substrate 2A, a plurality of portions serving as the opposing substrate 2 are formed side by side.

On the other hand, in the device mother substrate 3A, a plurality of portions that become the device substrate 3 are formed side by side.

Additionally, between the opposing mother substrate 2A and the device mother substrate 3A, the circumference of each cell 1A is sealed in a circular shape with a sealant 7, and liquid crystal is injected into the inside, thereby forming a plurality of liquid crystals. Layer 4 is formed.

Next, as shown in FIGS. 3(a) and 3(b), a rectangular polarizing film 5A is bonded to the outer surface of the opposing mother substrate 2A among the panel production substrate 10, and the device A rectangular polarizing film 5B is bonded to the outer surface of the mother substrate 3A.

Here, as shown in FIG. 10, a first alignment mark AM1 indicating the position at which the polarizing film 5A is bonded is formed on the opposing mother substrate 2A. The first alignment mark AM1 may be formed at at least two of the four corners of the opposing mother substrate 2A (three locations in the present embodiment). Specifically, it is preferable to form the first alignment mark AM1 on at least two corners along the same short side among the four corners of the opposing mother substrate 2A.

When bonding the polarizing film 5A to the opposing mother substrate 2A, the position of the polarizing film 5A with respect to the opposing mother substrate 2A is performed while referring to the first alignment mark AM1. As a result, the polarizing film 5A can be accurately and easily bonded to the opposing mother substrate 2A, with the four corners of the opposing mother substrate 2A and the four corners of the polarizing film 5A aligned with each other. there is.

In addition, although not shown, a first alignment mark AM1 is formed on the element mother substrate 3A, similar to the opposing mother substrate 2A, to indicate the position at which the polarizing film 5B is bonded. Then, when attaching the polarizing film 5B to the device mother substrate 3A, the position of the polarizing film 5B with respect to the device mother substrate 3A is adjusted while referring to the first alignment mark AM1. do it As a result, the polarizing film 5B can be accurately and easily bonded to the device mother substrate 3A with the four corners of the device mother substrate 3A and the four corners of the polarizing film 5B aligned with each other. there is.

Next, as shown in FIGS. 4(a) and 4(b), the polarizing film 5A bonded to the outer surface of the opposing mother substrate 2A is aligned along the outline of each portion of the opposing substrate 2. Cut into a circular shape.

When cutting the polarizing film 5A, a laser beam (e.g., carbon dioxide gas laser, wavelength 9.4 μm) (L) is used, and the polarizing film 5A is cut into each polarizing film 5a while scanning the laser beam. Cut along the outline. At this time, the cutting line using the laser light is preferably located slightly inside the outline of the portion that becomes the opposing substrate 2. As a result, when cutting the opposing mother substrate 2A, which will be described later, along the outline of the portion that will become the opposing substrate 2, the blade can be prevented from contacting the polarizing film 5a.

Additionally, when cutting the polarizing film 5A with a laser beam, it overlaps with the wiring portion 6 formed in the portion that becomes the element substrate 3 of each cell 1A (specifically, the wiring forming portion 3b). It is desirable to start cutting from a non-slip position. Since the cutting start position overlaps with the cutting end position, by starting cutting with the laser beam from a position avoiding the wiring portion 6, damage to the wiring portion 6 caused by the laser beam can be prevented.

Additionally, when cutting the polarizing film 5A, it is preferable to start cutting from at least a corner portion of the outline of each polarizing film 5a. Thereby, each polarizing film 5a can be cut cleanly along the outline. However, as in this embodiment, when the outline of each polarizing film 5a is circular, there is no corner part in the outline, so there is no need to specifically define the starting position of cutting.

Meanwhile, in this embodiment, the case of cutting the polarizing film 5A using a laser beam is exemplified. However, in addition to the laser beam, the polarizing film 5A may be cut using, for example, a blade.

However, as shown in FIG. 10, a second alignment mark AM2 indicating the position of each cell 1A is formed on the opposing mother substrate 2A. For example, at least two second alignment marks AM2 (two in this embodiment) may be formed around each cell 1A. Specifically, it is preferable that at least two cells are formed at regular intervals near each cell 1A.

In this embodiment, alignment is performed with respect to the portion that becomes the opposing substrate 2 of each cell 1A, referring to the above-described first alignment mark AM1 and second alignment mark AM2. Specifically, after specifying the position of the first alignment mark AM1, the position of the cell 1A to be cut among the plurality of cells 1A is specified using the second alignment mark AM2. As a result, the position of the laser beam with respect to the cell 1A to be cut can be aligned with high precision.

Additionally, in this embodiment, the second alignment mark AM2 corresponding to the plurality of cells 1A located around the cell 1A to be cut may be referred to. In this case, before specifying the position of the cell 1A to be cut among the plurality of cells 1A, the positions of the plurality of cells 1A located around it are specified, thereby cutting the cell 1A to be cut. The position of the laser beam can be aligned with greater precision.

Next, as shown in FIGS. 5(a) and 5(b), the inside of each cut portion of the polarizing film 5A (polarizing film 5a) is left, and the blank portion of the polarizing film 5A is facing away from the polarizing film 5A. It is removed by peeling from the surface of the mother substrate 2A. Regarding the blank portion of the polarizing film 5A, it is preferable to peel along the diagonal direction of the polarizing film 5A. Thereby, the blank portion of the polarizing film 5A can be peeled cleanly from the surface of the opposing mother substrate 2A.

Next, as shown in FIGS. 6(a) and 6(b), the polarizing film 5B bonded to the outer surface of the device mother substrate 3A is attached to the device substrate 3 (specifically, the device forming portion ( 3a)) Cut into a circular shape following the outline of each part.

When cutting the polarizing film 5B, a laser beam (e.g., carbon dioxide gas laser, wavelength 9.4 μm) (L) is used, and the polarizing film 5B is cut into each polarizing film 5b while scanning the laser beam. Cut along the outline. At this time, the cutting line using the laser light is preferably located slightly inside the outline of the portion that will become the element formation portion 3a. As a result, when cutting the device mother substrate 3A, which will be described later, along the outline of the portion that will become the device substrate 3 (element forming portion 3a), it is possible to prevent the blade from contacting the polarizing film 5b. You can.

Additionally, when the polarizing film 5B is cut with a laser beam, it overlaps with the wiring portion 6 formed in the portion that becomes the element substrate 3 of each cell 1A (specifically, the wiring forming portion 3b). It is desirable to start cutting from a non-slip position. Since the cutting start position overlaps with the cutting end position, by starting cutting with the laser beam from a position avoiding the wiring portion 6, damage to the wiring portion 6 caused by the laser beam can be prevented.

Additionally, when cutting the polarizing film 5B, it is preferable to start cutting from at least a corner portion of the outline of each polarizing film 5b. Thereby, each polarizing film 5b can be cut cleanly along the outline. However, as in this embodiment, when the outline of each polarizing film 5b is circular, there is no corner part in the outline, so there is no need to specifically define the starting position of cutting.

Meanwhile, in this embodiment, the case of cutting the polarizing film 5B using a laser beam is exemplified. However, in addition to the laser beam, the polarizing film 5B may be cut using, for example, a blade.

In addition, when cutting the polarizing film 5B, the positioning of each cell 1A with respect to the portion that becomes the device substrate 3 (element forming portion 3a) is determined by cutting the polarizing film 5A as described above. Same as when

That is, in this embodiment, alignment is performed with respect to the portion that becomes the element substrate 3 of each cell 1A while referring to the first alignment mark AM1 and the second alignment mark AM2. As a result, the position of the laser beam with respect to the cell 1A to be cut can be aligned with high precision.

Next, as shown in FIGS. 7(a) and 7(b), the inside of each cut portion of the polarizing film 5B (polarizing film 5b) is left, and the blank portion of the polarizing film 5B is used as a device. It is removed by peeling from the surface of the mother substrate 3A. Regarding the blank portion of the polarizing film 5B, it is preferable to peel along the diagonal direction of the polarizing film 5B. As a result, the blank portion of the polarizing film 5B can be peeled cleanly from the surface of the device mother substrate 3A.

Next, as shown in FIGS. 8(a) and 8(b), the opposing mother substrate 2A is cut into a circular shape along the outline of each portion of the opposing substrate 2. When cutting the opposing mother substrate 2A, scribe cutting processing using a blade can be adopted. The scribe cutting process is not particularly limited, and a method that can cut the opposing mother substrate 2A along the outline of each opposing substrate 2 may be adopted.

In addition, when cutting the opposing mother substrate 2A, the alignment of each cell 1A with respect to the portion that becomes the opposing substrate 2 is the same as when cutting the polarizing film 5A described above. That is, in this embodiment, alignment is performed with respect to the portion that becomes the opposing substrate 2 of each cell 1A while referring to the first alignment mark AM1 and the second alignment mark AM2. Thereby, it is possible to cut out the opposing substrate 2 of each cell 1A from the opposing mother substrate 2A with high precision.

Next, as shown in FIGS. 9(a) and 9(b), the device mother substrate 3A is cut into a circular shape along the outline of each part of the device substrate 3. When cutting the device mother substrate 3A, scribe cutting processing using a blade can be adopted. There is no particular limitation on the scribe cutting process, and any method that can cut the device mother substrate 3A along the outline of the portion forming each device substrate 3 may be adopted.

Additionally, when cutting the device mother substrate 3A, the alignment of each cell 1A with respect to the portion that becomes the device substrate 3 is the same as when cutting the polarizing film 5A described above. That is, in this embodiment, alignment is performed with respect to the portion that becomes the element substrate 3 of each cell 1A while referring to the first alignment mark AM1 and the second alignment mark AM2. As a result, it is possible to cut the device substrate 3 of each cell 1A from the device mother substrate 3A with high precision.

By going through the above processes, each cell 1A can be cut out from the panel production substrate 10, and a plurality of the liquid crystal display panels 1 can be manufactured in batches.

As described above, when manufacturing a heterogeneous display panel such as the liquid crystal display panel 1, position alignment is required when cutting the cell 1A from the panel manufacturing substrate 10 compared to manufacturing a rectangular display panel. However, alignment when bonding the polarizing films 5a and 5b to the opposing substrate 2 and the device substrate 3 becomes very difficult.

In contrast, in the present embodiment, the rectangular polarizing films 5A and 5B are bonded to the rectangular opposing mother substrate 2A and the device mother substrate 3A, thereby forming the opposing mother substrate 2A and the device mother substrate 3A. The polarizing films 5A and 5B can be accurately and easily bonded to the device mother substrate 3A. Afterwards, since each cell 1A is cut out from the panel production substrate 10, it is possible to maintain the inclination of the polarization axis of the polarizing films 5a and 5b with respect to the liquid crystal display panel 1 with high precision.

In addition, in this embodiment, the opposing substrate 2 and the device substrate 3, which have different shapes, are cut separately from the opposing mother substrate 2A and the device mother substrate 3A, thereby forming the liquid crystal display panel. A variant display panel such as (1) can be manufactured efficiently.

In addition, in this embodiment, the opposing substrate 2 and the device substrate are aligned by aligning the portions of each cell 1A while referring to the first alignment mark AM1 and the second alignment mark AM2. Positional accuracy when attaching the polarizing films 5a and 5b to (3) and when cutting out the opposing substrate 2 and the device substrate 3 from the opposing mother substrate 2A and the device mother substrate 3A. It is possible to increase the positional accuracy.

Therefore, according to the manufacturing method of this embodiment, even when the liquid crystal display panel 1 becomes a special-type display panel, the bonding precision of the polarizing films 5a and 5b to the liquid crystal display panel 1 is increased, and the liquid crystal It is possible to manufacture the display panel 1 with high yield.

Meanwhile, the present invention is not necessarily limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention.

Specifically, in the above embodiment, each polarizing film 5a, 5b is cut in the order of the opposing mother substrate 2A side and the device mother substrate 3A side, and each mother substrate 2A, 3A is cut. Although the cutting is performed in the opposite order, that is, in the order of the device mother substrate 3A side and the opposing mother substrate 2A side, each polarizing film 5b, 5a is cut, and each mother substrate is cut. Cutting of (3A, 2A) may be performed.

Furthermore, in the above embodiment, after producing (preparing) the substrate 10 for panel production, the polarizing films 5a and 5b bonded to the outer surface of the opposing mother substrate 2A or the element mother substrate 3A are Although the case of cutting is exemplified, the polarizing films 5a and 5b bonded to the outer surface of the opposing mother substrate 2A or the device mother substrate 3A before manufacturing the panel production substrate 10 are used in the above embodiment. You may cut it using the same method as the shape.

In this case, after cutting and removing the polarizing films 5a and 5b, the opposing mother substrate 2A and the device mother substrate 3A are bonded through the sealant 7, and liquid crystal is injected to form a substrate for panel production. Produce (10). Thereafter, the opposing mother substrate 2A and the element mother substrate 3A may be cut using the same method as in the above embodiment.

In addition, the polarizing films 5a and 5b are exemplified as the optical film. However, the optical film may include the polarizing films 5a and 5b, and together with the polarizing films 5a and 5b, for example, an optical compensation film. It is also possible to laminate functional films such as brightness improvement film or anti-reflection film.

Additionally, part of the first alignment mark (AM1) and the second alignment mark (AM2) may be shared. That is, a function as a second alignment mark (AM2) indicating the position of the cell 1A is added to a part of the first alignment mark (AM1), or a part of the second alignment mark is added with polarizing films 5a and 5b (optical films). ) can be added to function as a first alignment mark (AM1) indicating the joining position.

In addition, the liquid crystal display panel 1 is not limited to a transmissive type and may be a reflective type. In the case of the reflective type, since the polarizing film 5a (optical film) is disposed only on the opposing substrate 2, the processes shown in FIGS. 6 and 7 are unnecessary.

In addition, in addition to the scribe cutting process using the above-described blade, other cutting methods can be used to cut the opposing mother substrate 2A or the device mother substrate 3A. Specifically, cutting methods such as laser beam cutting processing or water jet cutting processing can be used.

In addition, the present invention is not limited to the case of manufacturing the above-described liquid crystal display panel 1, and the present invention can be widely applied to the case of manufacturing display panels such as organic EL panels, for example.

In addition, the present invention is not limited to the case of manufacturing the above-described unusual display panel, and can also be applied to the case of manufacturing a rectangular display panel having a rectangular (rectangular) planar shape like the conventional one. In particular, according to the present invention, when manufacturing a rectangular display panel with a thinner and narrower frame, it is possible to suppress the occurrence of chips and cracks at the edges of the display panel.

1: Liquid crystal display panel (variant display panel) 1A: Cell
2: Opposing substrate 2A: Opposing mother substrate
3: Device substrate 3A: Mother board for device
3a: element forming part 3b: wiring forming part
4: Liquid crystal layer 5a, 5b: Polarizing film (optical film)
6: Wiring section 7: Seal material
10: Substrate for panel production S: Display surface
AM1: 1st alignment mark AM2: 2nd alignment mark
L: Laser light

Claims (12)

A method of manufacturing a display panel, comprising:
A step of preparing a substrate for manufacturing a panel in which a facing mother substrate forming the display panel and a device mother substrate are arranged to face each other, and a plurality of cells forming the display panel are formed side by side in a plane;
After cutting the optical film bonded to the outer surface of the opposing mother substrate along the outline of each part that becomes the opposing substrate of the display panel, the blank portion of the optical film is cut into the opposing mother substrate, leaving the inside of each cut part. A process of peeling and removing from the surface of the plate,
A step of cutting the opposing substrate by cutting the opposing mother substrate along the outline of each portion that becomes the opposing substrate of the display panel;
A step of cutting the device substrate by cutting the device mother substrate along the outline of each part of the device substrate of the display panel,
The optical film follows the outline of each part that becomes the counter substrate or device substrate of the display panel, referring to the first alignment mark indicating the position of bonding the optical film and the second alignment mark indicating the position of each cell. A method of manufacturing a display panel, characterized in that cutting. The method of claim 1, wherein after the optical film bonded to the outer surface of the device mother substrate is cut along the outline of each part forming the device substrate of the display panel, the inside of each cut part is left and a margin of the optical film is left. A method of manufacturing a display panel, comprising a step of peeling and removing a portion from a surface of the opposing mother substrate. The method of manufacturing a display panel according to claim 1 or 2, wherein the counter substrate and the device substrate are each cut into different shapes. The method of manufacturing a display panel according to claim 1 or 2, wherein the outline when cutting the optical film is made smaller than the outline when cutting the opposing substrate or the device substrate. delete The method of manufacturing a display panel according to claim 1, wherein the second alignment mark corresponding to a plurality of cells located around a cell to be cut is referred to among the cells. The method of manufacturing a display panel according to claim 1 or 2, wherein when cutting the optical film along the outline, cutting is started from a position that avoids at least a wiring portion formed on the device substrate. The method of manufacturing a display panel according to claim 1 or 2, wherein when cutting the optical film along the outline, cutting is started from at least a corner of the outline using a laser beam. The method of manufacturing a display panel according to claim 1 or 2, wherein the blank portion is peeled along a diagonal direction of the optical film. The method of manufacturing a display panel according to claim 1 or 2, wherein the display panel has a planar shape other than a rectangle. The method of manufacturing a display panel according to claim 1 or 2, wherein the optical film is a polarizing film. The method of manufacturing a display panel according to claim 1 or 2, wherein the display panel is a liquid crystal display panel.