JP2010230783A - Method for manufacturing display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a display device, the method suppressing breakage of a substrate in a manufacturing step of a display device and having excellent productivity and low cost. <P>SOLUTION: The method for manufacturing a display device 1, which is obtained by attaching a liquid crystal display panel 2 to a functional panel 3, has the steps of: forming a sealing material 51 which has an inlet 54 of a liquid crystal 50a on either one of an element substrate 10 or a color filter substrate 20; creating a first substrate attachment body by attaching the element substrate 10 to the color filter substrate 20, sandwiching the side where the sealing material 51 is provided; creating a second substrate attachment body by attaching the functional panel 3 to an external surface of one of the substrates having a relatively thinner plate thickness, the element substrate 10 or the color filter substrate 20 constructing the first substrate attachment body; pouring liquid crystal 50a into an interior portion surrounded by the sealing material 51 of the second substrate attachment body from an inlet 54; and sealing the inlet 54 with a sealing material 55. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a display device.

  Conventionally, as a display device such as a display for a personal computer terminal and a display for a portable terminal, a flat panel display (hereinafter referred to as a display) such as a liquid crystal display (hereinafter referred to as a liquid crystal display panel), a plasma display panel, or an organic EL (Electro-Luminescent) display. Panel). Among these, liquid crystal display panels are used for a wide range of applications because they can be easily reduced in thickness and power consumption.

  On the other hand, there is a panel (hereinafter referred to as a function panel) that adds a function to the display on the display panel or changes display characteristics. As the functional panel, for example, a touch panel, a panel for switching between a wide viewing angle and a narrow viewing angle (viewing angle variable panel), a panel for viewing a planar image as a stereoscopic image (2D / 3D variable panel), left and right, There are panels (parallax barrier panels) for displaying different images depending on the viewing direction such as up and down.

  In recent years, development of display devices in which these liquid crystal display panels and functional panels are combined has been actively conducted. In such a display device, these panels need to be fixed in a state where the relative position between the liquid crystal display panel and the functional panel is controlled with high accuracy. As a fixing method capable of controlling the relative position between the liquid crystal display panel and the functional panel with high accuracy, there is a method of bonding the entire surface of the liquid crystal display panel and the functional panel with an adhesive. However, when this method is used, the adhesive may leak from between the liquid crystal display panel and the functional panel.

  For example, Patent Document 1 has a laminated structure in which a liquid crystal display panel and a functional panel are bonded together with an adhesive, and a display area of these panels has been studied. A display device having an adhesive reservoir outside is disclosed.

JP 2008-9189 A

  In the technique of Patent Document 1, it is considered that the relative position between the liquid crystal display panel and the functional panel can be controlled with high accuracy, and problems due to adhesive leakage can be suppressed. There are also problems.

  FIG. 10 is a perspective view showing an inlet sealing step in the manufacturing process of the display device in the prior art. In FIG. 10, reference numeral 1010 is a first substrate, reference numeral 1020 is a second substrate, reference numeral 1050 is a liquid crystal, reference numeral 1051 is a sealing material, reference numeral 1055 is a sealing material, and reference numeral 1100 is a dispenser nozzle.

  As shown in FIG. 10, the plate thickness Ts2 of the second substrate 1020 is thinner than the plate thickness Ts1 of the first substrate 1010. Therefore, after the liquid crystal 1050 is injected from the injection port into the inside surrounded by the sealant 1051 between the pair of substrates, the sealing material 1055 has a thin plate thickness when the injection port is sealed with the sealing material 1055. In some cases, a so-called sealing sagging occurs that hangs down on the surface of the second substrate 1020. Further, the sealing sag generated in this manner is removed by shaving the sagging sealing material 1055. However, when the dripping sealing material 1055 is scraped, there is a possibility that the substrate may be damaged such as a crack or chip of the second substrate 1020. As a result, the yield decreases and the cost increases.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a low-cost display device manufacturing method that suppresses breakage of a substrate in a display device manufacturing process and is excellent in productivity. To do.

  In order to solve the above problems, a method for manufacturing a display device according to the present invention is a method for manufacturing a display device in which a liquid crystal display panel and a functional panel are bonded to each other, and includes either an element substrate or a color filter substrate. A sealing material forming step of forming a sealing material having a liquid crystal injection port on the substrate, and the element substrate and the color filter substrate are bonded to each other with the sealing material provided side interposed therebetween, and a first substrate bonded body The first substrate bonded body manufacturing step for manufacturing the first substrate bonded body, and the functional panel on the outer surface of one of the element substrates or the color filter substrates constituting the first substrate bonded body, the one of which is relatively thin. A second substrate bonded body manufacturing step of bonding and manufacturing a second substrate bonded body; and the inside of the second substrate bonded body surrounded by the sealing material. And having a liquid crystal injection step of injecting the liquid crystal from the mouth, and an inlet sealing step of sealing with a sealing material the inlet.

  According to this manufacturing method, the functional panel is formed on the outer surface of one of the element substrates or the color filter substrates constituting the first substrate bonded body, which is relatively thin, by the second substrate bonded body manufacturing step. Can be pasted together. For this reason, the board | substrate of the side by which the functional panel was bonded together can fully ensure plate | board thickness. Therefore, in the subsequent injection port sealing step, when the injection port is sealed with the sealing material, the sealing material is suppressed from dripping onto the surface of one of the thin substrates. As a result, unlike the conventional case, it is not necessary to cut the sagging sealing material, and damage to the substrate can be suppressed. Therefore, it becomes possible to produce a low-cost display device that is excellent in productivity by suppressing breakage of the substrate in the manufacturing process of the display device.

In the present manufacturing method, the one substrate having the thin plate thickness may be the color filter substrate.
According to this manufacturing method, when the injection port is sealed with the sealing material, the sealing material is drastically suppressed from dripping onto the surface of the one substrate having a small plate thickness. In particular, when one of the thin substrates is a color filter substrate, when attempting to reduce the thickness of the display device, rather than an element substrate that requires a certain degree of strength to load various drive circuits and terminal portions, Since the plate thickness of the color filter substrate has a margin when it is thinned, the plate thickness of the color filter substrate is supposed to be thinned, so that there is a remarkable effect.

In this manufacturing method, the functional panel may be a parallax barrier panel.
According to this manufacturing method, when the injection port is sealed with the sealing material, the sealing material is drastically suppressed from dripping onto the surface of the one substrate having a small plate thickness. In particular, when the functional panel bonded to one thin substrate is a parallax barrier panel, the display light is separated in different directions (for example, left and right directions), and images with different contents depending on the position viewed on one screen are displayed. In order to be able to display, it is necessary to make the substrate on the side where the parallax barrier panel is bonded very thin. For this reason, the plate thickness of the color filter substrate is supposed to be reduced, so that a remarkable effect can be obtained.

In this manufacturing method, the first substrate bonded body includes a first base material substrate including a plurality of element substrate formation regions and a plurality of color filter substrate formation regions via the sealing material. A base material substrate is bonded together, and the second substrate bonded body is relatively thick among the first base material substrate or the second base material substrate constituting the first substrate bonded body. A third base material substrate including a plurality of functional panel formation regions is bonded to an outer surface of a base material substrate having one thin substrate, the second substrate bonded body manufacturing step and the liquid crystal injection A second substrate bonded body dividing step for dividing the second substrate bonded body including a plurality of the formation regions from between the adjacent sealing materials may be included between the steps.
According to this manufacturing method, even when a display device is manufactured by dividing the base material substrate into pieces, the damage to the substrate is suppressed, and a low-cost display device with excellent productivity is produced. Is possible.

In this manufacturing method, the first substrate bonded body includes a first base material substrate including a plurality of element substrate formation regions and a plurality of color filter substrate formation regions via the sealing material. A base material substrate is bonded to the first substrate bonded body including a plurality of the formation regions between the first substrate bonded body manufacturing step and the second substrate bonded body manufacturing step. You may have the 1st board | substrate bonded body parting process which part | segments a bonded body from between the said adjacent sealing materials.
According to this manufacturing method, even when a display device is manufactured by dividing the base material substrate into pieces, the damage to the substrate is suppressed, and a low-cost display device with excellent productivity is produced. Is possible.

It is a schematic diagram which shows schematic structure of the display apparatus of this invention. It is a schematic diagram which shows the principal part cross section of the display apparatus of this invention. It is a flowchart which shows the manufacturing process of a display apparatus. It is a figure which shows the manufacturing process of the display apparatus of 1st Embodiment. FIG. 5 is a diagram illustrating a manufacturing process of the liquid crystal display device continued from FIG. 4. FIG. 6 is a diagram illustrating a manufacturing process of the liquid crystal display device continued from FIG. 5. FIG. 7 is a diagram illustrating a manufacturing process of the liquid crystal display device continued from FIG. 6. It is a figure which shows the manufacturing process of the liquid crystal display device of 2nd Embodiment. FIG. 9 is a diagram illustrating manufacturing steps of the liquid crystal display device following FIG. 8. It is a figure which shows the manufacturing process of the conventional display apparatus.

  Embodiments of the present invention will be described below with reference to the drawings. This embodiment shows one aspect of the present invention, and does not limit the present invention, and can be arbitrarily changed within the scope of the technical idea of the present invention. Moreover, in the following drawings, in order to make each structure easy to understand, an actual structure and a scale, a number, and the like in each structure are different.

(Display device)
FIG. 1 is a schematic diagram showing a schematic configuration of a display device 1 formed by a method for manufacturing a display device in which a liquid crystal display panel and a parallax barrier panel (functional panel) of the present invention are bonded together. FIG. 1A is a plan view showing a schematic configuration of the display device 1, and is a diagram of each component formed on the element substrate 10 including the element substrate 10 as viewed from the color filter substrate 20 side. FIG. 1B is a cross-sectional view taken along the line AA in FIG. 1A including the color filter substrate 20 and the parallax barrier panel 3.

  In FIG. 1B, symbol T <b> 1 is the plate thickness of the element substrate 10, symbol T <b> 2 is the plate thickness of the color filter substrate 20, and symbol T <b> 3 is the plate thickness of the barrier substrate 22 constituting the parallax barrier panel 3. Reference numeral L1 denotes a distance (cell gap) between the pair of substrates 10 and 20, and reference numeral L2 denotes a thickness of the adhesive layer 52 (panel interval). In the following description, the liquid crystal layer side of each component of the display device is referred to as the inner side, and the opposite side is referred to as the outer side. The surface on the liquid crystal layer side of each component of the display device is called an inner surface, and the opposite surface is called an outer surface.

  As shown in FIG. 1, the display device 1 of the present embodiment includes a liquid crystal display panel 2, a parallax barrier panel 3 disposed on the display surface side of the liquid crystal display panel 2, a liquid crystal display panel 2, and a parallax barrier panel 3. And a polarizing plate 61 disposed on the rear side of the liquid crystal display panel 2, and a polarizing plate 62 disposed on the display surface side of the parallax barrier panel 3. Has been.

  In the liquid crystal display panel 2 constituting the display device 1, the element substrate 10 and the color filter substrate 20 are bonded together by a seal material 51. The sealing material 51 is provided in a substantially frame shape on the element substrate 10. A liquid crystal layer 50 is sealed in a region partitioned by the sealing material 51. A part of the sealing material 51 is provided with a sealing port 54 for injecting the liquid crystal 50 a constituting the liquid crystal layer 50. The injection port 54 is sealed with a sealing material 55 made of, for example, acrylic resin. A light shielding film (peripheral parting) 53 made of a light shielding material is formed in a region inside the region where the sealing material 51 is formed.

  The element substrate 10 is a rectangular substrate formed of a transparent material such as glass or quartz. The thickness T1 of the element substrate 10 is about 600 μm, for example. An area inside the formation area of the sealing material 51 is a display area for displaying an image, a moving image, or the like. In the display area, pixel electrodes (not shown) and pixel switching elements (TFTs) 30 are provided in a matrix.

  The color filter substrate 20 is a rectangular substrate formed of a transparent material such as glass or plastic. The plate thickness T2 (T2b) of the color filter substrate 20 is, for example, about 70 μm. A light shielding layer 53 is provided inside the color filter substrate 20, and a color filter having a red layer, a green layer, and a blue layer is provided corresponding to a region (pixel) surrounded by the light shielding layer 53. Yes. Further, an overcoat layer (not shown) is formed inside the color filter substrate 20 so as to cover the color filter, and an alignment film (not shown) is formed on the overcoat layer.

  The display device 1 according to the present embodiment has a configuration in which a color filter substrate 20 and a parallax barrier panel 3 constituting a liquid crystal display panel 2 are bonded together by an adhesive layer 52, and a pair of polarizing plates 61 and 62 are disposed on both sides thereof. Has been.

  As a material for forming the adhesive layer 52, for example, an ultraviolet (UV) curable resin such as an acrylic resin or an epoxy resin is used. The thickness L2 of the adhesive layer 52 is, for example, about 20 μm.

  The pair of polarizing plates 61 and 62 are disposed so that their polarization axes are approximately 45 ° and 135 ° with respect to the azimuth angle of the liquid crystal 50a, for example, and their polarization axes are substantially orthogonal to each other. The polarizing plate 62 may be disposed on the display surface side of the liquid crystal display panel 2.

  The parallax barrier panel 3 is a functional panel for separating transmitted light in the left-right direction. Specifically, the parallax barrier panel 3 includes a barrier substrate 22 and a parallax barrier 21 formed inside the barrier substrate 22. The barrier substrate 22 is a rectangular substrate formed of a transparent material such as glass or plastic. The thickness T3 of the barrier substrate 22 is, for example, about 600 μm. The parallax barrier 21 has a light transmitting portion 21b between the light shielding portions 21a, and is formed in a stripe shape. For the parallax barrier 21, for example, an acrylic resin mixed with a black pigment is applied onto the barrier substrate 22 by using a spin coating method to form a material film, and patterned by a photolithography method to remove a portion that becomes the light transmitting portion 21b. Is formed.

  The parallax barrier 21 is arranged along the pixel arrangement of the liquid crystal display panel 2. On the other hand, the liquid crystal display panel 2 can display a right display image and a left display image for each column corresponding to the parallax barrier 21. Accordingly, the display device 1 can display two images in the left-right direction.

  FIG. 2 is a schematic diagram for explaining a mechanism that allows the display device 1 to visually recognize the light 41R and 41L corresponding to each viewpoint from two different viewpoints VR and VL. FIG. 2A is a cross-sectional view showing a configuration when the plate thickness T2a of the color filter substrate 20 constituting the display device 1 is relatively thick. FIG. 2B is a cross-sectional view showing a configuration when the plate thickness T2b of the color filter substrate 20 constituting the display device 1 is relatively thin.

  As shown in FIG. 2, the light 41R and 41L from the liquid crystal layers 50R and 50L corresponding to the pixel electrodes for displaying the right display image and the left display image on the element substrate 10 are the color filters of the color filter substrate 20. Thus, for example, the wavelength band light corresponds to any one of red light, green light, and blue light. The paths of the light 41R and 41L are limited by the light-shielding part 21a and the light-transmitting part 21b of the parallax barrier 21, and only one light is visible from one viewpoint among different viewpoints. Specifically, the light 41R is visible from the viewpoint VR through the translucent part 21b, but is blocked by the light shielding part 21a and not visible from the viewpoint VL. At this time, the positions (viewing ranges) of the viewpoints VR and VL can be adjusted by adjusting the plate thickness T2 of the color filter substrate 20 and the thickness L2 of the adhesive layer 52.

  For example, as shown in FIG. 2A, when the plate thickness T2a of the color filter substrate 20 is relatively thick, the visual recognition ranges of the viewpoints VR and VL are relatively narrow. For this reason, the overlapping range of the viewing ranges of the viewpoints VR and VL becomes relatively large, and it becomes difficult to see the two images. In this figure, the plate thickness T2a of the color filter substrate 20 is about 600 μm, for example, and is substantially the same as the plate thickness T1 of the element substrate 10 and the plate thickness T3 of the barrier substrate 22 (T2a = T1). = T3).

  On the other hand, as shown in FIG. 2B, when the plate thickness of the color filter substrate 20 is relatively thin, the visual recognition range of the viewpoints VR and VL is relatively wide. That is, the overlapping range of the visual recognition ranges of the viewpoints VR and VL is relatively small, and the two images are easy to see. In this figure, the plate thickness T2b of the color filter substrate 20 is about 70 μm, for example, and is thinner than the plate thickness T1 of the element substrate 10 and the plate thickness T3 of the barrier substrate 22 (T2a <T1, T2a < T3). Further, the thickness L2 of the adhesive layer 52 is, for example, about 20 μm, and is adjusted to be thinner than the thickness of FIG.

  In the present embodiment, the thickness T2 of the color filter substrate 20 is made thinner than the thickness T1 of the element substrate 10 in order to widen the visual recognition range of the viewpoints VR and VL so that two images can be easily seen ( T2 <T1). In order to prevent the sealing that has occurred in the past, a step of attaching the parallax barrier panel 3 to the outer surface of the color filter substrate 20 is provided before the injection port 54 sealing step. Accordingly, the thickness of the element substrate 1 on the color filter substrate 20 side is greater than the plate thickness T1 of the element substrate 10 by adding the plate thickness T2 of the color filter substrate 20 and the plate thickness T3 of the barrier substrate (( T2 + T3)> T1).

(Manufacturing method of display device)
(First Embodiment)
Next, a method for manufacturing the display device 1 configured as described above will be described. FIG. 3 is a flowchart of the manufacturing process of the display device 1, and FIGS. 4 to 8 are process diagrams sequentially illustrating the manufacturing process of the display device 1.

  FIG. 3 is a flowchart showing the manufacturing process of the display device of the present invention. The manufacturing method of the display device of the present invention is a “first base material substrate manufacturing step” in which a TFT, wiring, pixel electrode, alignment film, and the like are formed on a glass substrate to manufacture the first base material substrate 31 (step S1). On the other hand, a “second base material substrate manufacturing step” (step S2) for forming a second base material substrate 32 by forming a light-shielding film, a counter electrode, an alignment film, etc. on the glass substrate; A “third base material substrate manufacturing process” (step S3) in which a parallax barrier is formed on the first base material substrate 33 to form a third base material substrate 33, and a sealing material 51 having an injection port 54 for the liquid crystal 50a on the first base material substrate 31. The first substrate bonded body 111 is manufactured by bonding the first base material substrate 31 and the second base material substrate 32 through the sealing material 51 and the “sealing material forming step” (step S4). First substrate bonded body manufacturing process ”(step S5), A “second substrate bonded body manufacturing step” (step S6) for manufacturing the second substrate bonded body 112 by bonding the third base material substrate 33 to the second base material substrate 32 side of the substrate bonded body 111; A “second substrate bonded body dividing step” (step S7) for dividing the second substrate bonded body 112, and an injection port 54 is provided inside the divided second substrate bonded body 112 surrounded by the sealing material 51. A “liquid crystal injection step” (step S8) for injecting the liquid crystal 50a, and an “injection port sealing step” (step S9) for sealing the injection port 54 with the sealing material 55.

  First, as shown in FIG. 4A, a first base material substrate 31 is prepared (prepared) (step S1 in FIG. 3). The first base material substrate 31 is manufactured by forming TFTs, wirings, pixel electrodes, alignment films, and the like on a glass substrate. The first base material substrate 31 has a plurality of element substrate formation regions (regions where the element substrate 10 is formed) 10A. The plate thickness T1 of the first base material substrate 31 (element substrate 10) is, for example, about 600 μm.

  On the other hand, the second base material substrate 32 is produced (prepared) (step S2 in FIG. 3). The second base material substrate 32 is manufactured by forming a light shielding film, a color filter, a counter electrode, an alignment film, and the like on a glass substrate. The second base material substrate 32 has a plurality of color filter substrate formation regions (regions where the color filter substrate 20 is formed) 20A (see FIG. 4C). The thickness T2 of the second base material substrate 32 (color filter substrate 20) is, for example, about 70 μm, and is thinner than the thickness T1 of the first base material substrate 31 (T2 <T1).

  On the other hand, a third base material substrate 33 is prepared (prepared) (step S3 in FIG. 2). The third base material substrate 33 is produced by forming a parallax barrier on a glass substrate. The third base material substrate 33 has a plurality of parallax barrier panel forming regions (region 3A in which the parallax barrier panel 3 is formed (see FIG. 5C)). The plate thickness T3 of the panel 3) is, for example, about 600 μm, and is substantially the same as the plate thickness T1 of the first base material substrate 31 (T1 = T3).

  Next, as shown in FIG. 4B, a sealing material 51 having an injection port 54 for the liquid crystal 50a is formed in each element substrate forming region 10A of the first base material substrate 31 (step S4 in FIG. 3). The seal material 51 includes a substantially spherical gap control material, and the diameter of the gap control material is formed to be approximately the same as the cell gap L1 of the substrate.

  Next, as shown in FIG.4 (c), the 1st base material substrate 31 and the 2nd base material substrate 32 are bonded together, and the 1st board | substrate bonding body 33 (refer Fig.5 (a)) is produced (refer FIG.5 (a)). Step S5 in FIG. An alignment mark (not shown) is formed on the first base material substrate 31 and the second base material substrate 32. With this alignment mark, the first base material substrate 31 and the second base material substrate 32 are temporarily positioned so that the deviation of the relative position is within an allowable range. Next, the first base material substrate 31 and the second base material substrate 32 are pressed and bonded together by a pressing device (not shown). Thereafter, provisional curing of the sealing material 51 by ultraviolet irradiation, precision alignment, and main curing of the sealing material 51 by ultraviolet irradiation are performed, and the first substrate bonded body 111 is manufactured as shown in FIG. .

  Next, as shown in FIG. 5B, the material for forming the adhesive layer 52 is applied to the outer surface of the second base material substrate 32 of the first substrate bonded body 111 using a slit coater. As a material for forming the adhesive layer 52, an ultraviolet (UV) curable resin such as the acrylic resin described above is used.

  Next, as shown in FIG. 5C, the third substrate substrate 33 is bonded to the second substrate substrate 32 side of the first substrate bonded body 111 to produce the second substrate bonded body 112 (see FIG. 5C). Step S6 in FIG. Due to the alignment marks (not shown) formed on the first substrate bonded body 111 and the third base material substrate 33, the relative position deviation between the first substrate bonded body 111 and the third base material substrate 33 is within an allowable range. It is temporarily positioned so that it is inside. Next, the first substrate bonded body 111 and the third base material substrate 33 are pressed and bonded by a pressing device (not shown). Thereafter, temporary curing of the adhesive layer 52 by ultraviolet irradiation, precision alignment, and main curing of the adhesive layer 52 by ultraviolet irradiation are performed, and the second substrate bonded body 112 is produced as shown in FIG. Is done.

  Next, as shown in FIG. 6B, the second substrate bonded body 112 is divided (step S7 in FIG. 3). Specifically, individual pieces are formed by laser scribing that divides by irradiating a laser beam between the outer surface of the second substrate bonded body 112 (the outer surface of the third base material substrate 33 in this embodiment) and the adjacent sealing material 51. Turn into.

  Thereby, as shown in FIG.6 (c), the 2nd board | substrate bonding body 112 is suitably parted from between the sealing materials 51 which adjoin. Thus, when the first base material substrate 31 is divided, a plurality of element substrates 10 are obtained. Further, when the second base material substrate 32 is divided, a plurality of color filter substrates 20 are obtained. Further, when the third base material substrate 33 is divided, a plurality of parallax barrier panels 3 are obtained.

  Next, as shown in FIG. 7A, the liquid crystal 50a is injected from the injection port 54 into the inside of the divided second substrate bonding body 112 surrounded by the sealing material 51 (step S8 in FIG. 3). . Specifically, the liquid crystal 50a is injected from the injection port 54 into the inside surrounded by the sealing material 51 between the pair of substrates 10 and 20 by using a vacuum injection method.

  Next, as shown in FIG. 7B, the injection port 54 in which the liquid crystal 50a is sealed is sealed with the sealing material 55 using the dispenser 100 (step S9 in FIG. 3). The sealing material 55 is formed with a width larger than the inlet width W and a width larger than the cell gap L1 along the extending direction of the sealing material 51 so as to securely seal the inlet 54. Is done. At this time, the thickness on the side of the color filter substrate 20 to which the parallax barrier panel 3 is bonded is secured to a thickness that does not cause sealing as in the conventional case.

  Specifically, the thickness on the color filter substrate 20 side to which the parallax barrier panel 3 is bonded is obtained by adding the plate thickness T2 of the color filter substrate 20 and the plate thickness T3 of the barrier substrate to obtain the plate thickness T1 of the element substrate 10. (T2 + T3)> T1). For this reason, unlike the conventional case, since sealing does not occur, it is not necessary to scrape the dripping sealing material, and damage to the substrate can be suppressed.

  Next, as shown in FIG. 7C, a cleaning process is performed to remove the protruding portion of the sealing material 55 of the inlet 54 in which the liquid crystal 50a is sealed. A polarizing plate 61 is disposed on the rear side of the element substrate 10, and a polarizing plate 62 is disposed on the display surface side of the parallax barrier panel 3. The display device 1 of the present embodiment can be manufactured through the above steps.

  According to the method for manufacturing the display device 1 of the present embodiment, the first base substrate 31 (element substrate 10) or the second base material constituting the first substrate bonded body 111 is formed by the second substrate bonded body manufacturing step. The third base material substrate 33 (parallax barrier panel 3) is bonded to the outer surface of the second base material substrate 32 (color filter substrate 20) having a relatively small thickness among the substrates 32 (color filter substrate 20). For this reason, the board | substrate of the side by which the parallax barrier panel 3 was bonded together can fully ensure plate | board thickness. Therefore, in the subsequent injection port sealing step, when the injection port 54 is sealed with the sealing material 55, the sealing material 55 is suppressed from dripping onto the surface of the color filter substrate 20 having a small plate thickness. . As a result, unlike the conventional case, it is not necessary to cut the sagging sealing material, and damage to the substrate can be suppressed. Therefore, it is possible to produce a low-cost display device 1 that is excellent in productivity by suppressing breakage of the substrate in the manufacturing process of the display device 1.

  In addition, according to this manufacturing method, since one substrate having a small plate thickness is the second base material substrate 32 (color filter substrate 20), the sealing material 55 is sealed when the injection port 54 is sealed with the sealing material 55. Is drastically suppressed from dripping onto the surface of one of the thin substrates. In particular, when one of the thin substrates is the color filter substrate 20, when the display device 1 is thinned, the element substrate 10 that requires a certain degree of strength to mount various drive circuits and terminal portions is required. In contrast, since the thickness of the color filter substrate 20 has a margin in reducing the thickness, the thickness 20 of the color filter substrate should be reduced, so that a remarkable effect is achieved.

  Moreover, according to this manufacturing method, since the functional panel is the parallax barrier panel 3, when the injection port 54 is sealed with the sealing material 55, the sealing material 55 hangs down on the surface of one of the thin substrates. Is greatly suppressed. In particular, when the functional panel to be bonded to one of the thin substrates is the parallax barrier panel 3, the display light is separated in different directions (for example, left and right directions), and images having different contents depending on the position viewed on one screen. It is necessary to make the thickness of the substrate on which the parallax barrier panel 3 is bonded very thin. For this reason, the plate thickness of the color filter substrate 20 is supposed to be reduced, so that a remarkable effect can be obtained.

  Moreover, according to this manufacturing method, also when manufacturing the display apparatus 1 by dividing | separating a base material board | substrate into pieces, the damage of a board | substrate is suppressed and the low-cost display apparatus 1 excellent in productivity. Can be produced.

  In addition, although the parallax barrier panel is used for the functional panel which concerns on this embodiment, it is not restricted to this. For example, instead of the parallax barrier panel, a touch panel, a viewing angle variable panel, or a 2D / 3D variable panel may be used.

  In the sealing material forming step according to the present embodiment, the sealing material 51 having the injection port 54 for the liquid crystal 50a is formed on the first base material substrate 31 (element substrate forming region 10A), but the present invention is not limited thereto. . For example, instead of the first base material substrate 31, a sealing material 51 having an injection port 54 for the liquid crystal 50a may be formed on the second base material substrate 32 (color filter substrate forming region 20A). That is, the sealing material 51 having the injection port 54 for the liquid crystal 50 a may be formed on either the first base material substrate 31 or the second base material substrate 32.

  In addition, in the 1st board | substrate bonded body preparation process which concerns on this embodiment, although a pair of base material board | substrates 31 and 32 with asymmetric board thickness are bonded together through the sealing material 51, it is not restricted to this. For example, after a pair of base material substrates 31 and 32 having symmetrical plate thicknesses are bonded together via the sealing material 51, only one substrate may be thinned by etching.

  In the second substrate bonded body dividing step according to the present embodiment, the second substrate bonded body 112 is all divided from between the adjacent sealing materials 51 (as shown in FIG. 6C). The combined bodies 112 are all separated into one piece), but the present invention is not limited to this. For example, the second substrate bonded body 112 may first be divided from between the adjacent sealing materials 51 on the side where the injection port 54 of the liquid crystal 50a is provided. In this case, it is divided from the side of the injection port 54, and after the liquid crystal injection process and the injection port sealing process, it is divided from between the adjacent sealing materials 51 on the side where the injection port 54 is not provided. . Accordingly, the liquid crystal 50a can be efficiently injected from the injection port 54 in the liquid crystal injection step, and the injection port 54 can be efficiently sealed by the sealing material 55 in the injection port sealing step. Therefore, production efficiency can be improved.

(Second Embodiment)
FIG. 8 is a process diagram showing manufacturing steps of the display device according to the second embodiment of the display device 1 of the present invention. This process drawing shows a step of dividing the first substrate bonded body 111 from between the adjacent sealing materials 51 between the first substrate bonded body manufacturing step and the second substrate bonded body manufacturing step. . Since other processes are the same as those in the first embodiment, a detailed description thereof will be omitted.

  First, as shown to Fig.8 (a), the 1st board | substrate bonded body 111 is produced (preparation). The first substrate bonded body 111 is obtained by performing the first substrate bonded body manufacturing step (step S5 in FIG. 3) of the above-described first embodiment, Are bonded together through a sealing material 51 having an injection port 54 for the liquid crystal 50a.

  Next, as shown in FIG. 8B, the first substrate bonded body 111 is divided. Specifically, individual pieces are formed by laser scribing, which is performed by irradiating a laser beam between the adjacent sealing material 51 from the outer surface of the first substrate bonded body 111 (the outer surface of the second base material substrate 32 in this embodiment). Turn into.

  Thereby, as shown in FIG.8 (c), the 1st board | substrate bonding body 111 is suitably parted from between the sealing materials 51 which adjoin. Thus, when the first base material substrate 31 is divided, a plurality of element substrates 10 are obtained. Further, when the second base material substrate 32 is divided, a plurality of color filter substrates 20 are obtained.

  Next, as shown in FIG. 9A, a material for forming the adhesive layer 52 is applied to the outer surface of the color filter substrate 20 of the divided first substrate bonded body 111 using a slit coater. As a material for forming the adhesive layer 52, an ultraviolet (UV) curable resin such as the acrylic resin described above is used.

  Next, as shown in FIG. 9B, the parallax barrier panel 3 is bonded to the color filter substrate 20 side of the divided first substrate bonded body 111 to produce the second substrate bonded body 112. Due to the alignment mark (not shown) formed on the divided first substrate bonded body 111 and the parallax barrier panel 3, the relative position shift between the divided first substrate bonded body 111 and the parallax barrier panel 3 is shifted. Temporary positioning is performed so as to be within the allowable range. Next, the divided first substrate bonded body 111 and the parallax barrier panel 3 are pressed and bonded by a pressing device (not shown). Thereafter, temporary curing of the adhesive layer 52 by ultraviolet irradiation, precise alignment, and main curing of the adhesive layer 52 by ultraviolet irradiation are performed, and as shown in FIG. 6 (c), the divided second substrate bonded body 112) is produced.

  According to the method for manufacturing the display device 1 of the present embodiment, as in the case of the first embodiment described above, even when the display device 1 is manufactured by dividing the base material substrate into pieces, the substrate is damaged. This makes it possible to produce a low-cost display device 1 that is excellent in productivity.

DESCRIPTION OF SYMBOLS 1 ... Display apparatus, 2 ... Liquid crystal display panel, 3 ... Parallax barrier panel (functional panel), 3A ... Parallax barrier panel formation area (functional panel formation area), 10 ... Element substrate, 10A ... Element substrate formation area, 20 ... Color filter substrate, 20A ... color filter substrate formation region, 31 ... first base material substrate, 32 ... second base material substrate, 33 ... third base material substrate, 50a ... liquid crystal, 51 ... sealing material, 54 ... inlet, 55: Sealing material, 111: First substrate bonded body, 112: Second substrate bonded body, T1: Plate thickness of first base material substrate, T2: Plate thickness of second base material substrate

Claims (5)

A method of manufacturing a display device in which a liquid crystal display panel and a functional panel are bonded,
A sealing material forming step of forming a sealing material having a liquid crystal injection port on either the element substrate or the color filter substrate;
A first substrate bonded body manufacturing step of manufacturing the first substrate bonded body by bonding the element substrate and the color filter substrate across the side where the sealing material is provided;
A second substrate bonded body is manufactured by bonding the functional panel to the outer surface of one of the element substrates or the color filter substrates constituting the first substrate bonded body and having a relatively thin plate thickness. 2 substrate bonded body production process,
A liquid crystal injection step of injecting the liquid crystal from the injection port into the inside of the second substrate bonded body surrounded by the sealing material;
An injection port sealing step of sealing the injection port with a sealing material.   The method for manufacturing a display device according to claim 1, wherein one of the thin substrates is the color filter substrate.   The method for manufacturing a display device according to claim 1, wherein the functional panel is a parallax barrier panel. The first substrate bonded body is formed by bonding a first base material substrate including a plurality of element substrate formation regions and a second base material substrate including a plurality of color filter substrate formation regions through the sealant. Together
The second substrate bonded body is a base material substrate having one substrate having a relatively thin plate thickness among the first base material substrate and the second base material substrate constituting the first substrate bonded body. A third base material substrate including a plurality of functional panel formation regions is bonded to an outer surface,
A second substrate bonded body that divides the second substrate bonded body including the plurality of formation regions from between the adjacent sealing materials between the second substrate bonded body manufacturing step and the liquid crystal injecting step. The manufacturing method of the display apparatus as described in any one of Claims 1-3 which has a parting process. The first substrate bonded body is formed by bonding a first base material substrate including a plurality of element substrate formation regions and a second base material substrate including a plurality of color filter substrate formation regions through the sealant. It is a combination,
The first substrate bonded body including a plurality of the formation regions is divided between the adjacent sealing materials between the first substrate bonded body manufacturing step and the second substrate bonded body manufacturing step. The manufacturing method of the display apparatus as described in any one of Claims 1-3 which has 1 board | substrate bonded body parting process.

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