JP2014222747A - Housing cassette - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a housing cassette capable of efficiently putting in and out a wafer.SOLUTION: A housing cassette 100 is placed on a cassette pedestal of a laser device. The housing cassette 100 comprises: a first sidewall 101 and a second sidewall 102 which are orthogonal each other; a strut 103; a ceiling part 104; a bottom part 105; and an opening 106. The strut 103 opposes a corner part 107 and is provided at a position opposing the sidewalls 101 and 102. The ceiling part 104 is fixed to upper ends of the sidewalls 101 and 102 and the strut 103, and the bottom part 105 is fixed to lower ends of the sidewalls 101 and 102 and the strut 103. Inside the sidewalls 101 and 102 and inside the strut 103, a plurality of guide rails 108 and 109 supporting a workpiece W are formed from the ceiling part 104 to the bottom part 105 at a predetermined interval. The opening 106 is formed from a first opening portion 106a between the first sidewall 101 and the strut 103 and a second opening portion 106b between the second sidewall 102 and the strut 103.

Description

  The present invention relates to a storage cassette for storing a plurality of annular frames in which plate-like objects attached to a plate-like object or an adhesive tape are integrated.

  In a processing apparatus for processing a workpiece, such as a cutting apparatus or a laser processing apparatus for dicing a workpiece (workpiece) such as a semiconductor wafer, a grinding apparatus for grinding a workpiece, or a polishing apparatus for polishing a workpiece, A storage cassette called a cassette capable of storing a plurality of sheets (for example, see Patent Document 1 and Patent Document 2) is used.

  A guide rail is provided on a side wall of the storage cassette, and an annular frame in which a work or a work is supported by a dicing tape is inserted and stored along the guide rail.

JP 09-027543 A JP 2011-192863 A

  Usually, the accommodation cassette is provided with one opening, and the transport mechanism of the processing apparatus inserts a wafer or a frame straight toward the opening. Therefore, in order to load and remove the wafer and the frame from one direction according to the direction in which the storage cassette is placed, for example, the position of the chuck table used for processing and the position of the cleaning table fixed at the time of cleaning performed immediately before storage are in plan view. Even if it is arranged in a direction different from the cassette, it has been necessary to transport the wafer or the like to a position where it can be inserted straight into the housing cassette and then accommodate it in the housing cassette. For this reason, in the processing apparatus described above, it is desired to efficiently load and unload the wafer in order to improve the throughput.

  The present invention has been made in view of the above, and an object of the present invention is to provide a storage cassette capable of efficiently loading and unloading a wafer.

  In order to solve the above-described problems and achieve the object, the storage cassette of the present invention is a storage cassette for storing a plurality of plate-like workpieces, and includes a first side wall and a second side that are orthogonal to each other. The side wall of the first side wall is opposite to the corner where the first side wall and the second side wall intersect, and the column is provided at a position facing the side wall of two surfaces, and fixed to the upper end of the side wall and the column. A ceiling portion, a bottom portion fixed to the lower end of the side wall and the column, and an opening through which the workpiece is taken in and out, and the workpiece is placed inside the side wall and inside the column. A plurality of supporting guide rails are formed at a predetermined interval between the ceiling and the bottom, and the opening includes a first opening between the first side wall and the column, and And a second opening between the second side wall and the support column.

  Moreover, it is preferable that the said accommodation cassette is a wafer unit with which the said to-be-processed object was supported by the opening of the annular frame with the plate-shaped object with the adhesive tape.

  In the storage cassette, it is preferable that the guide rail of the support column protrudes toward the side wall.

  In the storage cassette, it is preferable that an elastic member for holding the inserted plate-like object from above and below is disposed on the guide rail on the side wall.

  Since the housing cassette of the present invention has two openings that can be carried in and out, when installed in a processing apparatus for processing a workpiece such as a wafer, it is possible to provide two positions for loading and unloading. Can be taken in and out at the same time. Therefore, it is possible to perform smooth loading and unloading, and the workpiece can be loaded and unloaded efficiently. Further, since the two openings can be taken in and out simultaneously, there is an effect that the throughput of the processing apparatus is improved.

FIG. 1 is a diagram illustrating a configuration example of a laser processing apparatus in which an accommodation cassette according to the first embodiment is installed. FIG. 2 is a perspective view illustrating a schematic configuration of the storage cassette according to the first embodiment. 3 is a cross-sectional view taken along line III-III in FIG. FIG. 4 is a cross-sectional view illustrating a state in which the storage cassette according to the first embodiment stores the wafer unit. FIG. 5 is a horizontal sectional view of the storage cassette according to the second embodiment. FIG. 6 is a cross-sectional view illustrating a state in which the housing cassette according to the second embodiment puts and removes the wafer unit. FIG. 7 is a cross-sectional view illustrating a state in which the storage cassette according to the second embodiment stores the wafer unit. FIG. 8 is a horizontal cross-sectional view illustrating a state in which the housing cassette according to the third embodiment puts and removes the wafer unit. FIG. 9 is a cross-sectional view illustrating a state in which the storage cassette according to the third embodiment stores the wafer unit. 10 is a cross-sectional view taken along line XX in FIG.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment 1
The accommodation cassette concerning Embodiment 1 of the present invention is explained based on a drawing. FIG. 1 is a diagram illustrating a configuration example of a laser processing apparatus in which an accommodation cassette according to the first embodiment is installed. FIG. 2 is a perspective view illustrating a schematic configuration of the storage cassette according to the first embodiment. 3 is a cross-sectional view taken along line III-III in FIG. FIG. 4 is a cross-sectional view illustrating a state in which the storage cassette according to the first embodiment stores the wafer unit.

  The accommodation cassette 100 (shown in FIG. 2) according to the first embodiment is for accommodating a plurality of plate-like workpieces W, and is used for various processing apparatuses that use the workpieces W in a semiconductor manufacturing process. It is for conveying between.

  In the first embodiment, the workpiece W is a wafer unit in which a wafer Wa as a plate-like object is supported by an adhesive tape T in an opening of an annular frame F. Here, the wafer Wa is an object to be processed by various processing apparatuses. In the first embodiment, the wafer Wa is a disk-shaped semiconductor wafer or an optical device wafer having silicon, sapphire, gallium, or the like as a base material. In the wafer Wa, a plurality of devices D formed on the surface are partitioned in a lattice pattern by a plurality of streets. Wafer Wa constitutes work piece W by sticking adhesive tape T on the back surface opposite to the surface on which a plurality of devices D are formed, and attaching the outer edge of adhesive tape T to annular frame F. To do.

  The workpiece W is accommodated in the accommodation cassette 100 and placed on, for example, a cassette mounting table 60 of a laser processing apparatus 1 (shown in FIG. 1) as a processing apparatus. In the present invention, in addition to the wafer Wa, a rectangular package substrate having a plurality of devices sealed with resin may be used as the plate-like object. Furthermore, the accommodation cassette 100 of the present invention directly accommodates a wafer Wa, a package substrate, or the like as the workpiece W without accommodating the workpiece W supported by the annular frame F on the wafer Wa as a plate-like object. You may do it.

  The laser processing apparatus 1 shown in FIG. 1 performs ablation processing on the workpiece W by moving the chuck table 10 holding the workpiece W and the laser beam irradiation means 20 relative to each other. A laser processed groove is formed in W. As shown in FIG. 1, the laser processing apparatus 1 is ablated by a chuck table 10, a laser beam irradiation unit 20 that irradiates a workpiece W held on the chuck table 10 with a laser beam, and a laser beam irradiation unit 20. The cleaning means 30 for cleaning the workpiece W and the cassette mounting table 60 on which the storage cassette 100 is mounted are configured.

  The laser processing apparatus 1 also includes an X-axis moving unit 40 that relatively moves the chuck table 10 and the laser beam irradiation unit 20 in the X-axis direction, and a Y that moves the chuck table 10 and the laser beam irradiation unit 20 in the Y-axis direction. The shaft moving unit 50 includes a Z-axis moving unit (not shown) that relatively moves the chuck table 10 and the laser beam irradiation unit 20 in the Z-axis direction.

  Further, the laser processing apparatus 1 includes a first temporary placement means 70 for temporarily placing the workpiece W before ablation processing taken out from the storage cassette 100 and the ablation processing cleaned by the cleaning means 30. And a second temporary placement means 80 for temporarily placing the workpiece W thereon. The first temporary placement means 70 includes a pair of rails 71 for temporarily placing the workpiece W before ablation processing. The second temporary placement means 80 includes a pair of rails 81 on which the workpiece W after cleaning is temporarily placed. The laser processing apparatus 1 also includes an unillustrated unloading means for taking out the workpiece W before ablation from the storage cassette 100 and placing it on the first temporary placement means 70, the first temporary placement means 70, a chuck A conveying means (not shown) that conveys the workpiece W across the table 10, the cleaning means 30, and the second temporary placing means 80, and the workpiece W placed on the second temporary placing means 80. It further includes unloading means (not shown) for loading into the storage cassette 100.

  The accommodating cassette 100 is placed on the cassette placing table 60 of the laser processing apparatus 1 and is provided so as to be movable up and down in the Z-axis direction. As shown in FIG. 2, the storage cassette 100 includes a first side wall 101 and a second side wall 102 that are orthogonal to each other, a column 103, a ceiling part 104, a bottom part 105, and an opening through which a workpiece W is inserted and removed. 106.

  The support column 103 is provided at a position facing the corner portion 107 where the first side wall 101 and the second side wall 102 intersect, and facing the two side walls 101 and 102. The support column 103 is formed in a bar shape parallel to the Z-axis, and, as shown in FIGS. Is provided. Further, the support column 103 is provided at a position facing the side walls 101 and 102 with a space in the horizontal cross section of the storage cassette 100.

  The ceiling 104 is formed in a flat plate shape and is fixed to the upper ends of the side walls 101 and 102 and the column 103. The bottom 105 is formed in a flat plate shape, and is fixed to the lower ends of the side walls 101 and 102 and the column 103. The ceiling part 104 and the bottom part 105 are formed in a flat plate shape parallel to both the X-axis direction and the Y-axis direction, that is, the horizontal direction.

  The opening 106 allows the workpiece W to be taken in and out of the storage cassette 100, and communicates the inside and outside of the storage cassette 100. The opening 106 includes a first opening 106 a between the first side wall 101 and the column 103 and a second opening 106 b between the second side wall 102 and the column 103. A plurality of guide rails 108 and 109 that support the workpiece W are formed between the ceiling portion 104 and the bottom portion 105 at predetermined intervals on the inner side of the side walls 101 and 102 and the inner side of the column 103. The plurality of guide rails 108 and 109 support the workpiece W on which the workpiece W is placed on the surface.

  A plurality of guide rails 108 provided on the side walls 101 and 102 protrude from the inner surfaces of the side walls 101 and 102 to the inside of the storage cassette 100. Moreover, the several guide rail 108 provided in the 1st side wall 101 is provided ranging from the 1st opening part 106a to the 2nd side wall 102, as shown in FIG.3 and FIG.4. The plurality of guide rails 108 provided on the second side wall 102 are provided from the second opening 106b to the first side wall 101 as shown in FIGS. The plurality of guide rails 108 provided on the first side wall 101 and the second side wall 102 are formed with a constant width and extend linearly.

  Further, the support column 103 protrudes from the support column 103 toward the first side wall 101 and protrudes toward the second side wall 102 from the support column 103 and the guide rail 109 disposed in the first opening 106a. A guide rail 109 disposed in the second opening 106b is provided. That is, the guide rail 109 of the support column 103 protrudes toward the side walls 101 and 102.

  The guide rail 109 that protrudes from the column 103 toward the first side wall 101 and is disposed in the first opening 106a is parallel to the second side wall 102 from the column 103 to the center of the first opening 106a. It extends in a straight line. The guide rail 109 that protrudes from the column 103 toward the second side wall 102 and is disposed in the second opening 106b is parallel to the first side wall 101 from the column 103 to the center of the second opening 106b. It extends in a straight line.

  As shown in FIG. 3, the storage cassette 100 having the above-described configuration allows the workpiece W to be taken in and out through both the first opening 106a and the second opening 106b. In addition, as shown in FIG. 4, the storage cassette 100 places the workpieces W on the guide rails 108 and 109 and stores a plurality of workpieces W.

  In the laser processing apparatus 1, the storage cassette 100 has a first opening 106 a that faces the first temporary placement means 70, and a second opening 106 b that faces the second temporary placement means 80, It is mounted on the cassette mounting table 60. In the laser processing apparatus 1, mainly in the housing cassette 100, the workpiece W before ablation processing is taken out through the first opening 106 a and placed on the first temporary placement means 70. The accommodation cassette 100 accommodates the workpiece W after cleaning placed on the second temporary placement means 80 through the second opening 106b.

  In the laser processing apparatus 1 described above, the workpiece W before ablation processing is placed on the first temporary placement means 70 through the first opening 106a, and then the workpiece W before ablation processing is placed on the chuck table 10. Hold. The laser processing apparatus 1 performs ablation processing on the workpiece W while relatively moving the chuck table 10 and the laser beam irradiation means 20, and then cleans the workpiece W with the cleaning means 30 and puts it on the second temporary placement means 80. Place. And the laser processing apparatus 1 accommodates the workpiece W on the 2nd temporary placement means 80 after ablation processing and washing | cleaning in the accommodation cassette 100 through the 2nd opening part 106b.

  As described above, the storage cassette 100 according to the first embodiment has two openings 106a and 106b that can be carried in and out, and is thus installed in a processing apparatus such as the laser processing apparatus 1 that processes the workpiece W such as the wafer Wa. In doing so, it is possible to provide two entry / exit positions, and the two openings 106a and 106b can be taken in / out simultaneously. Therefore, the storage cassette 100 according to the first embodiment can smoothly carry out the workpiece W, and can efficiently carry out the workpiece W. Moreover, since the accommodation cassette 100 according to the first embodiment can be taken in and out simultaneously from the two openings 106a and 106b, there is an effect that the throughput of the processing apparatus is improved.

  In the storage cassette 100 according to the first embodiment, the guide rail 109 protrudes from the support column 103 toward the side walls 101 and 102 and extends to the center of the openings 106a and 106b. For this reason, the storage cassette 100 can reliably support the workpiece W even when the workpiece W is completely stored, even when the outer edge of the workpiece W is circular. .

  In addition, the storage cassette 100 according to the first embodiment stores the wafer unit in which the wafer Wa is supported by the adhesive tape T in the opening of the annular frame F as the workpiece W, so that the wafer Wa or the like is not damaged. can do.

[Embodiment 2]
A storage cassette according to Embodiment 2 of the present invention will be described with reference to the drawings. FIG. 5 is a horizontal sectional view of the storage cassette according to the second embodiment. FIG. 6 is a cross-sectional view illustrating a state in which the housing cassette according to the second embodiment puts and removes the wafer unit. FIG. 7 is a cross-sectional view illustrating a state in which the storage cassette according to the second embodiment stores the wafer unit. 5 to 7, the same parts as those of the first embodiment are denoted by the same reference numerals and the description thereof is omitted.

  In the storage cassette 100 according to the second embodiment, the guide rail 109a provided on the support column 103 is directed from the support column 103 toward the corner portion 107 where the side walls 101 and 102 intersect as shown in FIGS. It protrudes. The width of the guide rail 109 a is formed larger than the width of the column 103. A distance K1 (shown in FIG. 5) from the side walls 101 and 102 at the front end of the guide rail 109a is a distance K2 between the outer edge of the annular frame F and the outer edge of the wafer Wa as a plate-like object across the center of the workpiece W. It is formed slightly larger than (shown in FIG. 5). A distance K1 from the side walls 101 and 102 at the front end of the guide rail 109a is formed smaller than a width H (shown in FIG. 5) across the center of the workpiece W.

  Similar to the first embodiment, the storage cassette 100 according to the second embodiment can smoothly carry out the workpiece W, and can efficiently carry out the workpiece W. Further, the accommodation cassette 100 according to the second embodiment is formed such that the distance K1 from the side walls 101, 102 at the front end of the guide rail 109a is larger than the distance K2 and smaller than the width H of the workpiece W. As shown in FIG. 6, the workpiece W that the guide rail 109a takes in and out can be reliably supported, and the accommodated workpiece W can be reliably supported. Further, since the accommodation cassette 100 according to the second embodiment is formed such that the distance K1 is larger than the distance K2 and smaller than the width H, as shown in FIGS. 6 and 7, the wafer Wa contacts the guide rail 109a. This can be suppressed. Therefore, even after wafer ablation, even when the wafer Wa is in a state where there is no gap between the divided devices D, the wafer Wa comes into contact with the guide rail 109a and the devices D are prevented from being rubbed and damaged. it can.

[Embodiment 3]
A storage cassette according to Embodiment 3 of the present invention will be described with reference to the drawings. FIG. 8 is a horizontal cross-sectional view illustrating a state in which the housing cassette according to the third embodiment puts and removes the wafer unit. FIG. 9 is a cross-sectional view illustrating a state in which the storage cassette according to the third embodiment stores the wafer unit. 10 is a cross-sectional view taken along line XX in FIG. 8 to 10, the same parts as those in the first and second embodiments are denoted by the same reference numerals and description thereof is omitted.

  In the storage cassette 100 according to the third embodiment, as shown in FIGS. 8, 9, and 10, the workpiece to be inserted between the guide rails 108 between the guide rails 108 of the side walls 101 and 102. An elastic member 110 that holds the object W from above and below is disposed. In the third embodiment, the elastic member 110 is provided across both ends of the guide rail 108 in the longitudinal direction. In the third embodiment, the elastic member 110 is configured by a leaf spring curved in cross section, as shown in FIG. The elastic member 110 includes two convex portions 110a that protrude from the side walls 101 and 102 toward the storage cassette 100 and are stacked in the Z-axis direction. The elastic member 110 is elastically deformed so that the interval is widened by inserting the outer edge of the workpiece W between the convex portions 110a, and holds the workpiece W from above and below.

  As in the first and second embodiments, the storage cassette 100 according to the third embodiment can smoothly carry out the workpiece W, and can efficiently carry out the workpiece W. Further, since the accommodation cassette 100 according to the third embodiment is provided with the elastic member 110 between the guide rails 108 of the side walls 101 and 102, the work piece can be processed only by the guide rails 108 provided on the orthogonal side walls 101 and 102. W can be sufficiently supported.

  The present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the scope of the present invention. For example, the present invention may be used not only in the laser processing apparatus 1 but also in a processing apparatus that performs various processes such as a grinding apparatus and a polishing apparatus on various workpieces W. In the present invention, the workpiece W is not limited to the wafer unit, and various workpieces W may be accommodated.

DESCRIPTION OF SYMBOLS 100 Storage cassette 101 1st side wall 102 2nd side wall 103 Column 104 Ceiling part 105 Bottom part 106 Opening part 106a 1st opening part 106b 2nd opening part 107 Corner | angular part 108 Guide rail 109 Guide rail 109a Guide rail 110 Elastic member F Ring frame T Adhesive tape W Workpiece (Wafer unit)
Wa wafer (plate)

Claims (4)

A storage cassette for storing a plurality of plate-shaped workpieces,
A first side wall and a second side wall orthogonal to each other;
A pillar provided at a position facing the corner where the first side wall and the second side wall meet and facing the two side walls,
A ceiling part fixed to the upper end of the side wall and the column;
A bottom portion fixed to the side wall and the lower end of the column;
An opening for taking in and out the workpiece,
A plurality of guide rails that support the workpiece are formed at predetermined intervals between the ceiling and the bottom on the inside of the side wall and the inside of the support column,
The opening is
A first opening between the first side wall and the post;
An accommodation cassette comprising: a second opening between the second side wall and the support column.   2. The storage cassette according to claim 1, wherein the workpiece is a wafer unit in which a plate-like object is supported by an adhesive tape in an opening of an annular frame.   The accommodation cassette according to claim 1, wherein the guide rail of the support column protrudes toward the side wall.   The accommodation cassette according to claim 1, 2 or 3, wherein an elastic member for holding the workpiece to be inserted from above and below is arranged on the guide rail on the side wall.

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