CN216389308U - Wafer adsorption device constructs and weighing device - Google Patents
Wafer adsorption device constructs and weighing device Download PDFInfo
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- CN216389308U CN216389308U CN202121946653.0U CN202121946653U CN216389308U CN 216389308 U CN216389308 U CN 216389308U CN 202121946653 U CN202121946653 U CN 202121946653U CN 216389308 U CN216389308 U CN 216389308U
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Abstract
The application discloses wafer adsorption apparatus constructs and weighing device, wafer adsorption apparatus constructs including bearing piece and elasticity adsorption element. One end of the elastic adsorption piece is connected to the bearing piece, the other end of the elastic adsorption piece is abutted to the wafer, and the elastic adsorption piece can be abutted to and adsorbed by different positions on the wafer so as to adsorb and fix the wafer. According to the change of the angularity of the difference of wafer, elastic adsorption piece can produce elastic deformation according to the change of the angularity of difference to the angularity of the different positions of adaptation wafer changes, and then can laminate with the surface of wafer and adsorb completely. The wafer weighing device comprises a wafer weighing mechanism and the wafer adsorption mechanism, the wafer weighing mechanism comprises a bearing platform used for bearing wafers and a limiting part used for defining a wafer weighing area, the wafer adsorption mechanism is also a mechanical arm used for placing the wafers on the bearing platform, the limiting part limits the wafers in the weighing area, and the situation that the wafers slide out of the bearing platform to cause slide sheets and cards is avoided.
Description
Technical Field
The application relates to the technical field of weighing, especially, relate to a wafer adsorption device constructs and weighing device.
Background
As the number of stacked layers of 3D NAND (a technology for increasing a storage space by stacking a plurality of data storage units) increases, the warpage of a wafer affects the height of the wafer stacked by the stacking technology and the storage performance of the storage space formed by the stacking. During the transferring and processing process of the wafer, the wafer needs to be clamped and fixed. The wafer with high warpage is difficult to clamp and fix, and the wafer slips for many times.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a wafer adsorption device and wafer weighing device, and the wafer that can effectively solve high warpage has the degree of difficulty and the gleitbretter phenomenon problem appears many times when the centre gripping is fixed. The technical scheme is as follows:
in a first aspect, the present application provides a wafer adsorption mechanism, comprising:
the bearing piece is used for bearing the wafer; and
a plurality of elasticity adsorb the piece, elasticity adsorbs piece one end and connects in holding carrier, and the other end that the elasticity adsorbs the piece is used for with the wafer butt, and the elasticity adsorbs the piece configuration to take place elastic deformation according to the surface warping degree of wafer to make elasticity adsorb piece and wafer surface laminating.
According to the wafer adsorption device of the embodiment of the application, one end of each elastic adsorption piece is connected to the corresponding bearing piece, the other end of each elastic adsorption piece is abutted to the corresponding wafer, and the elastic adsorption pieces are abutted to different positions on the corresponding wafer and are adsorbed, so that the wafer is adsorbed and fixed conveniently. Meanwhile, the elastic adsorption piece is configured to be elastically deformed according to the warping degree of the surface of the wafer, so that the elastic adsorption piece is attached to the surface of the wafer. According to the change of the angularity of the difference of wafer, elastic adsorption piece can produce elastic deformation according to the change of the angularity of difference to the angularity of the different positions of adaptation wafer changes, and then can laminate with the surface of wafer and adsorb completely.
In some embodiments, the elastic absorption member is made of a rubber material having elasticity.
Based on the above embodiment, the elastic adsorption piece can elastically deform according to the surface warping degree of the wafer, so that the elastic adsorption piece is completely attached to the surface of the wafer. The elastic adsorption piece made of the rubber material is good in wear resistance, can be contacted with the wafer for adsorption for many times, and prolongs the service life of the elastic adsorption piece.
In some embodiments, the elastic absorbent member comprises:
the connecting end is connected with the bearing piece;
the adsorption end is used for abutting against the wafer;
the elastic telescopic part is connected with the connecting end and the adsorption end.
Based on the embodiment, the elastic adsorption piece comprises the elastic telescopic part, and a connecting end and an adsorption end which are connected with two ends of the elastic telescopic part, the connecting end is convenient for the elastic adsorption piece to be connected with the bearing piece, and the adsorption end is used for being abutted and adsorbed with the wafer; the elastic expansion part between the connecting end and the adsorption end is convenient for the elastic adsorption piece to generate elastic deformation according to the surface warping degree of the wafer.
In some embodiments, the elastic bellows is a folding bellows.
Based on the above embodiment, the elastic expansion part of the folding telescopic structure can be elastically deformed according to the surface warping degree of the wafer, so that the adsorption end on the elastic adsorption piece is attached to and adsorbed by the surface of the wafer.
In some embodiments, the suction end has an abutting surface abutting against the wafer, and the abutting surface includes:
the plane area is arranged in a plane;
the inclined area is arranged around the plane area in an enclosing mode and is inclined from the plane area to the bearing piece.
Based on above-mentioned embodiment, the setting of butt face is convenient for the elasticity adsorbs the piece and is laminated with the surface of wafer and adsorb, and the butt face includes plane district and slope district, and plane district and wafer surface laminating adsorb, and the slope that sets up plane district week side simultaneously can the adaptation be located the change of the slope of plane district and wafer adsorption site's week side to make the butt face laminate with the surface of wafer better and adsorb.
In some embodiments, the lines connecting the at least three elastic suction members form a triangle.
Based on the above embodiment, the connecting lines among the at least three elastic adsorption pieces form a triangle to form a plane, and the plane formed by the connecting lines among the three elastic adsorption pieces is matched with the surface of the wafer, so that the wafer can be firmly adsorbed, and the wafer is prevented from slipping in the adsorption process.
In some embodiments, the elastic suction member has a first suction hole, and the carrier member has a second suction hole communicating with the first suction hole.
Based on above-mentioned embodiment, the first absorption hole on the elastic adsorption piece runs through the plane district on the adsorption end, and the second absorption hole runs through and holds carrier, and the first absorption hole and the second absorption hole are downthehole to be convenient for the plane district with the vacuum to adsorb fixedly the wafer.
In a second aspect, the present application provides a wafer weighing apparatus, which includes a wafer weighing mechanism and the wafer adsorption mechanism; the wafer weighing mechanism includes:
the bearing platform is used for bearing the wafer; and
the limiting piece is convexly arranged on the bearing table and defines a weighing area of the wafer;
the bearing part is a mechanical arm, and the mechanical arm adsorbs the wafer through the elastic adsorption part and places the wafer in the weighing area.
Based on the wafer weighing device in the embodiment of the application, the wafer weighing device comprises a wafer adsorption mechanism and a wafer weighing mechanism; the wafer weighing mechanism comprises a bearing platform for bearing wafers and a limiting part for limiting a wafer weighing area, the wafer adsorption mechanism is that a manipulator places the wafers on the bearing platform, the limiting part limits the wafers in the weighing area, and the wafers are prevented from sliding out of the bearing platform to cause the condition of sliding sheets and cards.
In some embodiments, the number of the stoppers is one or more; when the limiting parts are arranged in a plurality, connecting lines among at least three limiting parts form a triangle.
Based on the above embodiment, when the number of the limiting members is one, the limiting members surround the periphery of the wafer and are set to have a distance from the peripheral position of the wafer, so as to limit the wafer and prevent the wafer from sliding out.
When the limiting parts are arranged in a plurality, the connecting lines among at least three limiting parts form a triangle, and the wafer is clamped in the area among the three limiting parts. The connection lines among the three limiting parts form a triangle, so that the positions of the limiting parts are limited, the wafer can be completely limited in the weighing area, the wafer is limited, and the wafer is prevented from sliding out.
In some embodiments, a third adsorption hole is disposed on the bearing table, and the third adsorption hole is located in the weighing area.
Based on above-mentioned embodiment, the third adsorbs the hole and is located the region of weighing, adsorbs placing the wafer in the region of weighing, and the wafer of being convenient for contacts with the plummer and cools down the wafer to reach the required temperature requirement of weighing.
Due to the application of the technical scheme, compared with the prior art, the application has the following advantages:
according to the wafer adsorption device of the embodiment of the application, one end of each elastic adsorption piece is connected to the corresponding bearing piece, the other end of each elastic adsorption piece is abutted to the corresponding wafer, and the elastic adsorption pieces are abutted to different positions on the corresponding wafer and are adsorbed, so that the wafer is adsorbed and fixed conveniently. Meanwhile, the elastic adsorption piece is configured to be elastically deformed according to the warping degree of the surface of the wafer, so that the elastic adsorption piece is attached to the surface of the wafer. According to the change of the angularity of the difference of wafer, elastic adsorption piece can produce elastic deformation according to the change of the angularity of difference to the angularity of the different positions of adaptation wafer changes, and then can laminate with the surface of wafer and adsorb completely.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic overall structure diagram of a wafer adsorption mechanism in an embodiment of the present application;
FIG. 2 is a schematic structural view of the carrier of FIG. 1;
FIG. 3 is a schematic view of the elastic absorption member shown in FIG. 1;
FIG. 4 is a schematic view of the structure in the direction A (including the wafer placed on the elastic absorption member) in FIG. 1;
FIG. 5 is a schematic view of an overall structure of a wafer weighing apparatus according to an embodiment of the present disclosure;
FIG. 6 is a schematic diagram of the overall structure of the wafer weighing mechanism in FIG. 5;
fig. 7 is a schematic diagram of the overall structure of the wafer weighing mechanism (including the wafer) in fig. 5.
Reference numerals:
10. a wafer adsorption mechanism; 11. a carrier; 111. a second adsorption hole; 12. an elastic adsorption member; 121. a connecting end; 122. an abutting surface; 1221. a planar area; 1222. a sloped region; 123. an elastic expansion part; 124. a first adsorption hole; 125. an adsorption end;
20. a wafer weighing mechanism; 21. a substrate; 211. a recessed portion; 2111. a second escape portion; 22. a bearing table; 221. a first escape portion; 23. a limiting member; 24. a weighing area; 25. a third adsorption hole;
30. a wafer; 50. wafer weighing device.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
Referring to fig. 1 to 4, in a first aspect, the embodiment of the present application provides a wafer adsorbing mechanism 10, which can effectively solve the problem that a wafer 30 with a high warpage is difficult to clamp and fix and has a slip phenomenon many times.
The wafer suction mechanism 10 includes a carrier 11 and an elastic suction member 12. The carrier 11 is used for carrying the wafer 30, one end of the elastic absorption member 12 is connected to the carrier 11, the other end of the elastic absorption member 12 is used for abutting against the wafer 30, and the elastic absorption member 12 is configured to elastically deform according to the warpage of the surface of the wafer 30, so that the elastic absorption member 12 is attached to the surface of the wafer 30.
Specifically, referring to fig. 1 to 3, the supporting member 11 may be Y-shaped, the two short sides and one long side of the Y-shaped supporting member 11 are provided with second adsorption holes 111, one end of the elastic adsorption member 12 is detachably connected in the second adsorption holes 111, meanwhile, the elastic adsorption member 12 is provided with first adsorption holes 124, the first adsorption holes 124 are communicated with the second adsorption holes 111, and the other end of the elastic adsorption member 12 is attached to the wafer 30. The vacuum pump absorbs air at the contact position of the elastic absorption member 12 and the surface of the wafer 30 through the first absorption hole 124 and the second absorption hole 111 to form negative pressure, so that the surface of the wafer 30 attached to the elastic absorption member 12 can be fixed by absorption.
Further, the three elastic absorption members 12 are located at different positions on the Y-shaped carrier 11, and the three different positions are not located on the same line, so as to ensure the firmness of the absorption of the wafer 30.
Further, referring to fig. 4, the elastic absorption member 12 can elastically deform according to the warpage of the surface of the wafer 30, and the elastic absorption member 12 elastically deforms correspondingly according to the warpage of the surface of the wafer 30 contacted by the elastic absorption member 12, so as to adapt to the surfaces of the wafers 30 with different warpage, so that the elastic absorption member 12 completely and tightly adheres to the surface of the wafer 30, and thus no air leakage gap is generated between the elastic absorption member 12 and the wafer 30.
In some embodiments, the shape of the carrier 11 is not limited, and only needs to be satisfied to facilitate the connection of the elastic absorption member 12 with the carrier 11. The number of the elastic absorption members 12 is not limited, and the elastic absorption members 12 may be set according to actual requirements, and it is only necessary that the range defined by the elastic absorption members 12 on the carrier 11 is within the range of the orthographic projection of the wafer 30 on the carrier 11.
In some embodiments, the elastic absorption member 12 is made of a rubber material having elasticity.
Specifically, the elastic absorption member 12 made of a better elastic material can be elastically deformed according to the difference of the warping degrees of the positions where the elastic absorption member 12 is in contact with, so as to adapt to the surfaces of the wafers with different warping degrees, and further, the elastic absorption member 12 is completely attached to the wafer 30.
One end of the elastic adsorption piece 12 far away from the bearing piece 11 needs to be in contact with the wafers 30 with different warping degrees, and the rubber material has better wear resistance and can prolong the service life of the elastic adsorption piece 12.
Referring to fig. 1 and fig. 3, in some embodiments, the elastic absorption member 12 includes a connection end 121, an absorption end 125, and an elastic expansion portion 123, the connection end 121 is connected to the carrier 11, the absorption end 125 is used for abutting against the wafer 30, and the elastic expansion portion 123 connects the connection end 121 and the absorption end 125.
Specifically, elasticity adsorbs piece 12 including link 121, adsorb end 125 and be located the flexible portion 123 of elasticity between link 121 and the absorption end 125, link 121 can adsorb hole 111 threaded connection with the second on the carrier 11, the elasticity of being convenient for adsorbs 12 and the dismantlement that carries carrier 11, can guarantee both hookup location's leakproofness simultaneously. The adsorption end 125 is attached to and adsorbed on the wafer 30, and the elastic expansion portion 123 disposed between the connection end 121 and the adsorption end 125 can deform according to the difference in warpage of the surface of the wafer 30, so that the adsorption end 125 can be attached to the surface of the wafer 30 with different warpage.
In some embodiments, the connection end 121 and the second absorption hole 111 may be connected by a screw connection, a snap connection, or the like, and may be set according to actual requirements.
In some embodiments, referring to fig. 3, the elastic expansion portion 123 is a folding and expanding structure.
Specifically, the adsorption end 125 abuts against the surface of the wafer 30, and the folding telescopic structure of the elastic telescopic part 123 can be deformed in a telescopic manner according to the difference in warping degree between the contact positions of the adsorption end 125 and the wafer 30, so that the integrity of the surface attachment of the adsorption end 125 and the wafer 30 can be ensured, and the sealing property between the surfaces of the adsorption end 125 and the wafer 30 can be further ensured.
In some embodiments, referring to fig. 3 and 4, the suction end 125 has an abutting surface 122 abutting against the wafer 30, and the abutting surface 122 includes a planar area 1221 and a slanted area 1222. The plane area 1221 is arranged in a plane, and the inclined area 1222 is arranged around the plane area 1221 and inclined from the plane area 1221 to the carrier 11.
Specifically, the suction end 125 includes a planar area 1221 and an inclined area 1222 surrounding the planar area 1221 and inclined from the planar area 1221 toward the carrier 11. The plane area 1221 is far away from the elastic expansion part 123 and contacts with the surface of the wafer 30, due to the different warping degrees of the surface of the wafer 30, the inclination angles of the surface of the wafer 30 are different, the plane area 1221 contacts with the surface of the wafer 30, the inclination angles of the positions on the periphery of the contact position on the wafer 30 are different, and the inclined area 1222 inclined from the plane area 1221 to the bearing 11 is arranged to enable the surface of the plane area 1221 to be attached to the surface of the wafer 30 more completely, so as to facilitate the adsorption of the adsorption end 125 to the wafer 30.
In some embodiments, the lines between at least three elastic suction members 12 form a triangle.
Specifically, a triangle formed by connecting lines among the three elastic adsorption members 12 can perform triangular adsorption on the wafer 30, so that the adsorption force applied to the wafer 30 is more uniform, and the wafer 30 is prevented from sliding off from the elastic adsorption members 12 in the adsorption process.
In some embodiments, the elastic absorption member 12 has a first absorption hole 124, and the carrier member 11 has a second absorption hole 111 communicating with the first absorption hole 124.
Specifically, the first suction hole 124 of the elastic suction member 12 penetrates the planar area 1221 of the suction end 125, the second suction hole 111 penetrates the carrier 11, and the first suction hole 124 communicates with the second suction hole 111. The vacuum pump absorbs air at the contact position between the planar area 1221 and the surface of the wafer 30 through the first absorption hole 124 and the second absorption hole 111 to form a negative pressure, so that the surface of the wafer 30 attached to the planar area 1221 can be absorbed. The surface of the wafer 30 is tightly attached to the planar area 1221, and the elastic attaching member 12 can attach and fix the wafer 30.
Further, referring to fig. 4, when the wafer 30 is in a form with a high middle portion and a low periphery, the position of the elastic expansion portion 123 near the periphery of the wafer 30 is lower than the position near the middle of the wafer 30 due to elastic deformation, so that the planar area 1221 is adapted to the warp variation of the wafer 30, and the planar area 1221 is completely and tightly attached to the surface of the wafer 30. When the wafer 30 is in a form with a low middle and a high periphery, the position of the elastic expansion part 123 near the periphery of the wafer 30 is higher than the position near the middle of the wafer 30 due to elastic deformation, so that the planar area 1221 is adapted to the change of the warpage of the wafer 30, and the planar area 1221 is completely, tightly and low-tightly attached to the surface of the wafer 30.
In some embodiments, the elastic absorption member 12 is not limited to match with the shape of the wafer 30 with the middle high edge and the middle low edge, and the elastic absorption member 12 can be attached to the absorption surface on the wafer 30 according to the variation of the warp degree of the surface of the wafer 30.
In a second aspect, referring to fig. 5 and fig. 6, the present application provides a wafer weighing apparatus 50, wherein the wafer weighing apparatus 50 includes a wafer weighing mechanism 20 and the wafer suction mechanism 10; the wafer weighing mechanism 20 includes a susceptor 22 and a stopper 23. The bearing table 22 is used for bearing the wafer 30, and the limiting piece 23 is arranged on the bearing table 22 in a protruding mode and defines a weighing area 24 of the wafer 30; the carrier 11 is a robot, which adsorbs the wafer 30 through the elastic adsorption member 12 and places the wafer 30 in the weighing area 24.
Specifically, the circular weighing mechanism 20 includes a base plate 21, a bearing table 22, and a stopper 23 provided on the bearing table 22. The substrate 21 is a plate with a certain thickness, a recess 211 is formed on one surface of the substrate 21, and the susceptor 22 is configured to be circular and located in the recess 211 for supporting the wafer 30.
The carrier 22 has a first avoiding portion 221, the bottom of the recess 211 has a second avoiding portion 2111, the first avoiding portion 221, the second avoiding portion 2111 and the carrier 11 are contoured, and when the carrier 22 is placed in the recess 211, the first avoiding portion 221 and the second avoiding portion 2111 are disposed correspondingly.
In some embodiments, the shapes of the substrate 21 and the carrier 22 are not limited, and it is sufficient that the carrier 22 can be placed on the substrate 21. The recess 211 is merely to facilitate determination of the position of the carrier table 22, and in some embodiments, the recess 211 may not be provided. The shapes of the first yielding portion 221 and the second yielding portion 2111 are not limited, and it is sufficient to yield the carrier 11.
Referring to fig. 5-7, the wafer adsorbing mechanism 10 transfers the adsorbed wafer 30 onto the susceptor 22, when the wafer adsorbing mechanism 10 transfers the wafer 30, the carrier 11 lifts the wafer 30, the carrier 11 transfers the wafer 30 to the wafer weighing device 50, the carrier 11 corresponds to the first positioning portion 221, and the carrier 11 descends until the wafer 30 contacts the weighing area 24 of the susceptor 22. At this time, the vacuum pump rushes air into the contact position of the planar area 1221 and the surface of the wafer 30 through the first suction hole 124 and the second suction hole 111 to form a positive pressure, the wafer 30 falls on the weighing area 24, the carrier 11 continues to descend into the second relief portion 2111, and at this time, the wafer 30 falling on the weighing area 24 is weighed.
Specifically, the three limiting parts are arranged on the carrier table 22 and detachably connected with the carrier table 22, a connecting line between the three limiting parts 23 forms a triangle, the wafer 30 is placed in the weighing area 24 defined by the three limiting parts 23, the three limiting parts 23 are located at three points which are not on the same straight line to limit the position of the wafer 30, and the wafer 30 can be limited in the weighing area 24. The wafer 30 and the limiting part 23 are arranged at intervals, so that when the wafer adsorption mechanism 10 takes and places the wafer 30, the change of the gas pressure in the third adsorption hole 25 arranged on the bearing table 22 is avoided, the adsorption force on the surface of the wafer 30 is uneven, and the wafer 30 slides out of the weighing area 24; meanwhile, when the wafer adsorption mechanism 10 picks up and places the wafer, the limiting part 23 is prevented from contacting the wafer to damage the wafer. The height of the limiting member 23 is higher than or equal to the height of the wafer 30 in the vertical direction, so that the wafer 30 is prevented from sliding out of the upper part of the limiting member 23.
In some embodiments, the number of the limiting members 23 is not limited, and may be one or more. When the number of the limiting members 23 is one, it is required that the limiting members 23 surround the wafer 30 and have a set distance from the peripheral position of the wafer 30. When the number of the limiting members 23 is plural, two arc-shaped limiting members 23 are required to be arranged on two opposite sides of the wafer 30, and the wafer 30 can be clamped in the area between the two limiting members 23; or the connection line between at least three limiting members 23 forms a triangle, and the wafer 30 can be clamped in the region between the three limiting members 23.
In some embodiments, the connection manner between the limiting member 23 and the bearing platform 22 is not limited, and the limiting member may be integrally formed with the bearing platform 22, or may be connected to the bearing platform 22 by a screw thread, which may be set according to actual situations.
In some embodiments, a third suction hole 25 is disposed on the carrier 22, and the third suction hole 25 is located in the weighing area 24.
Specifically, the third suction holes 25 are located in the weighing area 24, and suck the wafer 30 placed in the weighing area 24, so that the wafer 30 is in contact with the susceptor 22 and the wafer 30 is confined in the weighing area 24. The wafer 30 contacts the susceptor 22 to cool the wafer 30 so as to reach the temperature requirement required for weighing, thereby avoiding the influence of the temperature on the weighing of the wafer 30.
Further, the warpage of the surface of the wafer 30 with high warpage is different, and in the process of adsorbing the wafer 30 by the third adsorption hole 25, since the contact surface between the susceptor 22 and the wafer 30 is a plane, a part of the third adsorption hole 25 cannot completely contact the surface of the wafer 30, so that the adsorption force on the surface of the wafer 30 is different in the adsorption and detachment process of the wafer 30 in the third adsorption hole 25, and the wafer 30 moves. The limiting members 23 are disposed around the wafer 30 and spaced apart from the wafer 30, so as to prevent the wafer 30 from sliding out of the weighing region 24 or the susceptor 22 when the wafer 30 moves.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it is to be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the above terms may be understood by those skilled in the art according to specific situations.
The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.
Claims (10)
1. The utility model provides a wafer adsorption apparatus constructs which characterized in that, wafer adsorption apparatus constructs including:
the bearing piece is used for bearing the wafer; and
a plurality of elasticity adsorb the piece, elasticity adsorb piece one end connect in hold carrier, the other end that elasticity adsorbs the piece be used for with the wafer butt, elasticity adsorbs the piece configuration to be the basis elastic deformation takes place for the surface warping degree of wafer, so that elasticity adsorb the piece with the laminating of wafer surface.
2. The wafer chucking mechanism as recited in claim 1,
the elastic adsorption piece is made of elastic rubber materials.
3. The wafer chucking mechanism as recited in claim 1, wherein said resilient chuck member comprises:
a connecting end connected with the bearing member;
the adsorption end is used for abutting against the wafer;
the elastic telescopic part is connected with the connecting end and the adsorption end.
4. The wafer chucking mechanism as recited in claim 3, wherein said elastic bellows is of a collapsible structure.
5. A wafer chucking mechanism as recited in claim 3, wherein said chuck end has an abutment surface for abutment with the wafer, said abutment surface comprising:
the plane area is arranged in a plane;
and the inclined area is arranged around the plane area and is inclined from the plane area to the bearing piece.
6. The wafer chucking mechanism as recited in any of claims 1-5,
the connecting lines among at least three elastic adsorption pieces form a triangle.
7. The wafer chuck mechanism as claimed in any of claims 1 to 5, wherein the elastic chuck member has a first chuck hole, and the carrier member has a second chuck hole communicating with the first chuck hole.
8. A wafer weighing apparatus, comprising a wafer weighing mechanism and a wafer adsorption mechanism according to any one of claims 1 to 7; the wafer weighing mechanism comprises:
the bearing platform is used for bearing the wafer; and
the limiting piece is convexly arranged on the bearing table and defines a weighing area of the wafer;
the bearing part is a mechanical arm, and the mechanical arm adsorbs the wafer through the elastic adsorption part and places the wafer in the weighing area.
9. The wafer weighing apparatus of claim 8, wherein the number of the stoppers is one or more; when the limiting parts are arranged in a plurality, connecting lines among at least three limiting parts form a triangle.
10. The wafer weighing apparatus of claim 8, wherein a third suction hole is disposed on the susceptor, and the third suction hole is located in the weighing area.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121946653.0U CN216389308U (en) | 2021-08-18 | 2021-08-18 | Wafer adsorption device constructs and weighing device |
| CN202280056213.9A CN117897801A (en) | 2021-08-18 | 2022-08-15 | Apparatus for changing the temperature of a wafer |
| PCT/EP2022/072792 WO2023021007A1 (en) | 2021-08-18 | 2022-08-15 | Device for changing the temperature of a wafer |
| KR1020227040059A KR20240045959A (en) | 2021-08-18 | 2022-08-15 | Device for changing the temperature of the wafer |
| TW111130544A TW202314913A (en) | 2021-08-18 | 2022-08-15 | Device for changing the temperature of a wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121946653.0U CN216389308U (en) | 2021-08-18 | 2021-08-18 | Wafer adsorption device constructs and weighing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216389308U true CN216389308U (en) | 2022-04-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121946653.0U Active CN216389308U (en) | 2021-08-18 | 2021-08-18 | Wafer adsorption device constructs and weighing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216389308U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115178435A (en) * | 2022-09-14 | 2022-10-14 | 上海图双精密装备有限公司 | Automatic wafer glue spreader |
-
2021
- 2021-08-18 CN CN202121946653.0U patent/CN216389308U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115178435A (en) * | 2022-09-14 | 2022-10-14 | 上海图双精密装备有限公司 | Automatic wafer glue spreader |
| CN115178435B (en) * | 2022-09-14 | 2022-12-30 | 上海图双精密装备有限公司 | Automatic wafer glue spreader |
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