CN215451372U - Silicon wafer adsorption device and silicon wafer processing equipment - Google Patents
Silicon wafer adsorption device and silicon wafer processing equipment Download PDFInfo
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- CN215451372U CN215451372U CN202121774509.3U CN202121774509U CN215451372U CN 215451372 U CN215451372 U CN 215451372U CN 202121774509 U CN202121774509 U CN 202121774509U CN 215451372 U CN215451372 U CN 215451372U
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- sucker structure
- fixing plate
- gas pipeline
- suction device
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Abstract
The utility model belongs to the technical field of silicon wafer processing devices, and particularly relates to a silicon wafer adsorption device and silicon wafer processing equipment, wherein the silicon wafer adsorption device comprises: a vacuum pump; a main gas pipeline connected with a vacuum pump; a plurality of branch gas pipelines respectively connected with the main gas pipeline, wherein one end of each branch gas pipeline is provided with a sucker structure; a fixed plate for fixing sucker structure, sucker structure runs through and sets up in the fixed plate. After the sucker structure contacts the silicon wafer, the vacuum pump pumps away air in the inner cavity of the sucker structure, so that the sucker structure adsorbs the silicon wafer, the gravity of the sucker structure and the gravity of the adsorbed silicon wafer are utilized to realize the return of the sucker structure, the adsorption process cannot damage the silicon wafer, and the reliability is high.
Description
Technical Field
The utility model belongs to the technical field of silicon wafer processing devices, and particularly relates to a silicon wafer adsorption device and silicon wafer processing equipment.
Background
At present, in the process of processing a solar cell, a PECVD device is often used for depositing an intrinsic amorphous silicon film on a silicon wafer and forming a PN junction, and in order to improve the production efficiency and reduce manual scratch and misoperation in the whole film coating process, an automatic device is often adopted for realizing the operations of feeding, blanking and turning the silicon wafer.
When the automatic device carries out loading, unloading and piece turning operations on the silicon wafer, the automatic device needs to adsorb the silicon wafer, and then the next process step is executed. The existing automatic device is provided with a spring to realize the return action of the sucker. When the sucking disc is used for taking and placing the silicon wafer, the spring is compressed along with the pressing action of the sucking disc, the elastic force of the spring is in direct proportion to the pressure acting on the silicon wafer at the moment, namely the elastic force is in direct proportion to the damage degree of the silicon wafer, the silicon wafer is easily damaged, and even the bad result of fragments is caused.
SUMMERY OF THE UTILITY MODEL
The utility model provides a silicon wafer adsorption device, and aims to solve the technical problem that a return spring is easy to damage a silicon wafer and even cause adverse consequences of fragments in the process of adsorbing the silicon wafer by a sucker.
The present invention is achieved as described above, and provides a silicon wafer adsorption apparatus, including:
a vacuum pump;
a main gas line connected to the vacuum pump;
a plurality of branch gas pipelines respectively connected with the main gas pipeline, wherein one end of each branch gas pipeline is provided with a sucker structure;
and the fixing plate is used for fixing the sucker structure, and the sucker structure is arranged on the fixing plate in a penetrating way.
Furthermore, the silicon chip adsorption equipment still includes and holds the shell, it is fixed to set up to hold the shell on the fixed plate, it is provided with and is used for supplying the first pipeline through-hole that main gas pipeline passes through and is used for supplying the second pipeline through-hole that branch gas pipeline passes through to hold the shell.
Further, the fixing plate is provided in a polygonal shape.
Further, the fixing plate is provided in a square shape.
Furthermore, the number of the branch gas pipelines is four, and the sucker structures are arranged at the corner positions of the fixing plate.
Furthermore, the sucking disc structure includes the sucking disc and with sucking disc fixed connection's fixed axle, the fixed axle with branch gas pipeline one end is connected and run through set up in the fixed plate.
Furthermore, the perpendicular bisector of the fixed shaft is perpendicular to the plane of the fixed plate, and the suction surfaces of the suckers are located on the same horizontal plane.
Furthermore, the silicon wafer adsorption device further comprises a detector for detecting the silicon wafer, and the detector is fixedly arranged on the fixing plate.
Furthermore, the silicon wafer adsorption device also comprises a vacuum regulating valve arranged on the main gas pipeline.
The utility model also provides silicon wafer processing equipment which comprises the silicon wafer adsorption device.
The silicon wafer adsorption device has the beneficial effects that the vacuum pump, the main gas pipeline, the branch gas pipeline, the sucker structure and the fixing plate are arranged, the sucker structure penetrates through the fixing plate, after the sucker structure contacts a silicon wafer, the vacuum pump pumps away air in an inner cavity of the sucker structure, so that the sucker structure adsorbs the silicon wafer, the sucker structure returns by utilizing the gravity of the sucker structure and the gravity of the adsorbed silicon wafer, the silicon wafer cannot be damaged in the adsorption process, and the reliability is high.
Drawings
FIG. 1 is a schematic view of a silicon wafer adsorption apparatus according to an embodiment of the present invention;
fig. 2 is a schematic view of a fixing plate according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
The utility model provides a silicon wafer adsorption device which is provided with a vacuum pump, a main gas pipeline 1, a branch gas pipeline 2, a sucker structure and a fixing plate 3, wherein the sucker structure penetrates through the fixing plate 3, after the sucker structure contacts a silicon wafer, the vacuum pump pumps away air in an inner cavity of the sucker structure, so that the sucker structure adsorbs the silicon wafer, and the sucker structure is reset by utilizing the gravity of the sucker structure and the gravity of the adsorbed silicon wafer, the silicon wafer cannot be damaged in the adsorption process, and the reliability is high.
Example one
In this embodiment, a silicon wafer adsorbing device is provided, referring to fig. 1, including:
a vacuum pump;
a main gas pipe 1 connected to the vacuum pump;
a plurality of branch gas pipelines 2 respectively connected with the main gas pipeline 1, wherein one end of each branch gas pipeline 2 is provided with a sucker structure;
and the fixing plate 3 is used for fixing the sucker structure, and the sucker structure is arranged on the fixing plate 3 in a penetrating way.
The inner cavity of the main gas pipeline 1 is communicated with the inner cavities of the branch gas pipelines 2 respectively, and after the vacuum pump is started, gas in the inner cavity of the sucker structure is pumped away, so that the sucker structure generates suction force and can adsorb objects in contact with the sucker structure.
After the silicon wafer adsorption device moves to the adsorption position corresponding to the silicon wafer, the sucker structure is in contact with the silicon wafer, the vacuum pump is started at the moment, the vacuum pump sucks air away through the main gas pipeline 1 and the branch gas pipeline 2, so that the sucker structure generates suction to adsorb the silicon wafer, and the sucker structure is returned by utilizing the gravity of the sucker structure and the gravity of the adsorbed silicon wafer. In this silicon chip adsorption device, need not to use the spring, can realize sucker structure's return to avoid the spring to cause pressure damage to absorbent silicon chip when elasticity return, and can reduce device cost.
Before the device is manufactured in a test, the suction force of the suction cup structure needs to be set. The installer mounts the silicon wafer adsorption device in advance, adjusts the fixing plate 3 to be in the horizontal position, and the sucker structure is in the vertical position. And then carrying out suction debugging operation, after the sucker structure is contacted with the silicon wafer, firstly adjusting the suction force of the sucker structure to be large enough, for example, adjusting the suction force to-15 kpa to suck up the silicon wafer, and then gradually reducing the suction force until the suction force is adjusted to be the minimum value enough to suck up all the silicon wafers, and then starting trial production. Through tests, the situation that the silicon wafer is deformed or broken due to the fact that the silicon wafer is pressed down by the sucker structure does not exist in the trial production process, the suction force is reduced to be-7.5 kpa.
Example two
On the basis of the first embodiment, the silicon wafer adsorption device of the second embodiment further comprises an accommodating shell 5, the accommodating shell 5 is fixedly arranged on the fixing plate 3, and the accommodating shell 5 is provided with a first pipeline through hole for the main gas pipeline 1 to pass through and a second pipeline through hole for the branch gas pipeline 2 to pass through. The containing shell 5 has fixing and containing effects on the main gas pipeline 1 and the branch gas pipeline 2, and the gas pipelines are prevented from being placed in a mess.
EXAMPLE III
On the basis of the first and second embodiments, the fixing plate 3 of the third embodiment is configured to be polygonal, such as triangular, square, etc. Preferably, the fixing plate 3 is square and can correspond to the shape of a silicon wafer.
When the fixed plate 3 is set to be square, the number of the branch gas pipelines 2 is four, and the sucker structures are arranged at the corner positions of the fixed plate 3. When the silicon chip is sucked up by the sucker structure, the sucker structure is arranged at four corners of the fixing plate 3 and can correspondingly act on the four corners of the silicon chip, so that the silicon chip can be stably sucked up. It is worth mentioning that the surface area of the fixing plate 3 can be set to be equal to or slightly larger than the surface area of the silicon wafer, which is helpful for the chuck structure fixed on the fixing plate 3 to stably suck up the silicon wafer.
Example four
On the basis of the first and second embodiments, the suction cup structure of the fourth embodiment includes a suction cup 41 and a fixing shaft 42 fixedly connected to the suction cup 41, and the fixing shaft 42 is connected to one end of the branch gas pipe 2 and is disposed through the fixing plate 3. The fixed shaft 42 is fixedly provided to the fixed plate 3 so that the suction cup 41 is fixedly provided.
The perpendicular bisector of the fixed shaft 42 is perpendicular to the plane of the fixed plate 3, so that the perpendicular bisectors of the suction pads 41 are parallel to each other, and the heights of the fixed shafts 42 are controlled to be identical and correspond to each other, so that the suction surfaces of the suction pads 41 are on the same horizontal plane.
In addition, in order to avoid the failure of the suction cup 41 to return due to the large friction force between the fixing shaft 42 and the fixing plate 3, the fixing plate 3 is polished first, that is, the contact part between the fixing plate 3 and the fixing shaft 42 is polished, so that the diameter of the fixing plate 3 penetrating through the fixing shaft 42 is polished to be enlarged to 0.4cm, and the subsequent suction cup 41 is ensured to return successfully.
Tests show that a single suction cup 41 weighs 30.2g, the weight of a silicon wafer is in a range of 15.5g to 16.8g, the suction cup 41 can be returned under the gravity of the suction cup 41, and the weight of the silicon wafer can ensure that the return problem of the suction cup 41 can be solved.
EXAMPLE five
Referring to fig. 2, on the basis of the first embodiment and the second embodiment, the silicon wafer adsorbing device of the fifth embodiment further includes a detector 6 for detecting a silicon wafer, and the detector 6 is fixedly disposed on the fixing plate 3. After the detector 6 detects the silicon wafer, the sucker structure is judged to move to the adsorption position corresponding to the silicon wafer, and the vacuum pump is started at the moment, so that the sucker structure sucks up the silicon wafer.
EXAMPLE six
Referring to fig. 1, on the basis of the first embodiment and the second embodiment, the silicon wafer adsorption device of the sixth embodiment further comprises a vacuum regulating valve 7 arranged on the main gas pipeline 1, the sucker structure contacts the silicon wafer, the vacuum pump pumps away air in the inner cavity of the sucker structure, and the vacuum regulating valve 7 can play a buffering role to stabilize gas pressure, so that the sucker structure can stably adsorb the silicon wafer without excessive suction force, thereby not damaging a plating film on the surface of the silicon wafer, not increasing pollution to the silicon wafer, and ensuring the plating effect.
EXAMPLE seven
On the basis of the first embodiment and the second embodiment, the radius of the main gas pipeline 1 of the seventh embodiment is in the range of 0.6cm to 1cm, and the radius of the branch gas pipeline 3 is in the range of 0.3cm to 0.5 cm. The radius of the main gas pipeline 1 and the radius of the branch gas pipeline 2 are enlarged, the condition that gas flow is blocked in the air exhaust process can be avoided, and when the condition that gas flow of each gas branch pipeline is blocked is the same, the suction force of each sucker structure can be ensured to be the same, so that the effect of stably sucking up a silicon wafer is achieved.
It is worth mentioning that, in the present embodiment, the radius of each branch gas pipe 2 is adjusted to be a uniform length, so as to further improve the effect of stably sucking up the silicon wafer.
Example eight
On the basis of the first embodiment and the second embodiment, the length of the branched gas duct 2 of the eighth embodiment is in the range of 10cm to 14 cm. By shortening the length of the branch gas pipeline 2, the flow resistance of the gas can be greatly reduced, and the effect of stably sucking up the silicon wafer is further ensured.
Example nine
On the basis of the first to eighth embodiments, the ninth embodiment provides a silicon wafer processing apparatus, which includes the silicon wafer adsorbing device as described above. Furthermore, the silicon wafer processing equipment also comprises a driving device, and the driving device can drive the silicon wafer adsorption device to move, so that the sucker structure moves to the adsorption position corresponding to the silicon wafer. In addition, the silicon wafer processing equipment also comprises a processing device for processing the silicon wafer, so that the processing of the silicon wafer is realized.
The utility model provides a silicon wafer adsorption device which is provided with a vacuum pump, a main gas pipeline 1, a branch gas pipeline 2, a sucker structure and a fixing plate 3, wherein the sucker structure penetrates through the fixing plate 3, after the sucker structure contacts a silicon wafer, the vacuum pump pumps away air in an inner cavity of the sucker structure, so that the sucker structure adsorbs the silicon wafer, and the sucker structure is reset by utilizing the gravity of the sucker structure and the gravity of the adsorbed silicon wafer, the silicon wafer cannot be damaged in the adsorption process, and the reliability is high. In addition, silicon chip adsorption equipment still holds shell 5 including holding, holds shell 5 and plays fixed, the effect of holding to main gas pipeline 1 and branch gas pipeline 2, avoids gas pipeline to place in a jumble.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A silicon wafer adsorption apparatus, comprising:
a vacuum pump;
a main gas line connected to the vacuum pump;
a plurality of branch gas pipelines respectively connected with the main gas pipeline, wherein one end of each branch gas pipeline is provided with a sucker structure;
and the fixing plate is used for fixing the sucker structure, and the sucker structure is arranged on the fixing plate in a penetrating way.
2. The silicon wafer adsorbing device according to claim 1, further comprising a housing case fixedly provided on the fixing plate, the housing case being provided with a first pipe through-hole for passing the main gas pipe and a second pipe through-hole for passing the branch gas pipe.
3. The silicon wafer suction device according to claim 1 or 2, wherein the fixing plate is provided in a polygonal shape.
4. The silicon wafer suction device according to claim 3, wherein the fixing plate is provided in a square shape.
5. The silicon wafer suction device according to claim 4, wherein the number of the branched gas pipes is four, and the chuck structures are provided at respective corner positions of the fixing plate.
6. The silicon wafer suction device according to claim 1 or 2, wherein the chuck structure comprises a chuck and a fixing shaft fixedly connected to the chuck, the fixing shaft being connected to one end of the branch gas pipe and penetrating the fixing plate.
7. The silicon wafer suction device according to claim 6, wherein the perpendicular bisector of the fixed shaft is perpendicular to the plane of the fixed plate, and the suction surfaces of the suction cups are located at the same horizontal plane.
8. The silicon wafer suction device according to claim 1 or 2, further comprising a detector for detecting the silicon wafer, the detector being fixedly provided on the fixing plate.
9. The silicon wafer adsorbing device according to claim 1 or 2, further comprising a vacuum regulating valve provided on the main gas pipe.
10. A silicon wafer processing apparatus comprising the silicon wafer suction device according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121774509.3U CN215451372U (en) | 2021-07-30 | 2021-07-30 | Silicon wafer adsorption device and silicon wafer processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121774509.3U CN215451372U (en) | 2021-07-30 | 2021-07-30 | Silicon wafer adsorption device and silicon wafer processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215451372U true CN215451372U (en) | 2022-01-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121774509.3U Active CN215451372U (en) | 2021-07-30 | 2021-07-30 | Silicon wafer adsorption device and silicon wafer processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215451372U (en) |
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2021
- 2021-07-30 CN CN202121774509.3U patent/CN215451372U/en active Active
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