CN204885123U - Wafer bears device and brilliant boat - Google Patents
Wafer bears device and brilliant boat Download PDFInfo
- Publication number
- CN204885123U CN204885123U CN201520682898.5U CN201520682898U CN204885123U CN 204885123 U CN204885123 U CN 204885123U CN 201520682898 U CN201520682898 U CN 201520682898U CN 204885123 U CN204885123 U CN 204885123U
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- China
- Prior art keywords
- wafer
- holddown groove
- bearing device
- supporting part
- wafer bearing
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Abstract
The utility model provides a wafer bears the device, including an open -top's fixed slot has and set up in the inside supporting part that just is used for supporting a wafer of fixed slot, the supporting part arrives fixed slot open -top's distance is greater than the thickness of wafer for after the wafer was put into the wafer and is born the device, the surface of wafer can not surpass the surface of fixed slot. Therefore has avoided the friction and collision of each other between the wafer, plays the guard action. The utility model provides a brilliant boat for bear above -mentioned wafer and bear the device, realized that the safety of a large amount of wafers snatchs and deposits.
Description
Technical field
The utility model relates to semiconductor applications, particularly relates to a kind of wafer bearing device and brilliant boat.
Background technology
Wafer (Wafer) is the carrier producing used in integrated circuits, general significance wafer many fingers monocrystalline silicon disk.Wafer is divided into 4 inches, 5 inches, 6 inches, 8 inches equal-specifications by its diameter, recently develop 12 inches even research and develop more large gauge (14 inches, 15 inches, 16 inches ... 20 inches with first-class).Wafer is larger, and on same disk, producible IC is more, can reduce costs; But it is higher to the requirement of material technology and production technology.
In the manufacture process of wafer, often can relate to the wafer that there is figure on two sides, this type of wafer, when OQC, has following difficulty: 1, because there is figure on the two sides of wafer, and microscope cannot by mechanical arm grasping silicon wafer to carry out microcosmic visual inspection; 2, check at present in the process of wafer, operator needs to use clip to clamp wafer, and then manually wafer is put into (bonding protective film of wafer) on objective table, this operates not only inefficiency, and is very easy to bring damage to wafer.
Utility model content
In order to solve the problems of the prior art, the utility model provides a kind of wafer bearing device, comprise and there is an open-topped holddown groove and the supporting part for supporting a wafer, supporting part is arranged at the inside of described holddown groove, and described supporting part is greater than the thickness of wafer to the open-topped distance of described holddown groove.
Optionally, described wafer bearing device also comprises base, and described base supports the bottom of described holddown groove.
Optionally, the edge of described base exceeds the edge of described holddown groove, and described holddown groove is arranged at the center of described base.
Optionally, the plane parallel at described base place is in the plane at described supporting part place.
Optionally, described base is disc.
Optionally, the side of described holddown groove has recess, and the degree of depth of described recess is greater than described supporting part to the open-topped distance of described holddown groove.
Optionally, the quantity of described recess is two, and the line of two described recesses passes the center of described holddown groove.
Optionally, described holddown groove is annular tubbiness, and described supporting part is arranged on the inwall of described holddown groove.
Optionally, described supporting part is ring-type.
The utility model also provides a kind of brilliant boat, and for accommodating above-mentioned wafer bearing device, described brilliant boat comprises multiple holding part, is all arranged at the inside of described brilliant boat.
Wafer bearing device of the present utility model comprises holddown groove and is arranged at the supporting part of described holddown groove inside, described supporting part is greater than the thickness of wafer to the open-topped distance of described holddown groove, after making wafer put into wafer bearing device, the surface of wafer can not exceed the surface of holddown groove.Thus, avoid the mutual frictional impact between wafer, play a protective role.Brilliant boat of the present utility model is for carrying above-mentioned wafer bearing device, and the safety achieving considerable wafer captures and deposits.
Accompanying drawing explanation
Fig. 1 is the stereogram of wafer bearing device described in the utility model one embodiment;
Fig. 2 is the end view of wafer bearing device described in the utility model one embodiment;
Fig. 3 is the end view of brilliant boat described in the utility model one embodiment.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts the form that simplifies very much and all uses non-ratio accurately, only in order to object that is convenient, aid illustration the utility model embodiment lucidly.
Due to all figuratum wafer in two sides easily capture process in surface sustain damage, therefore need the surface of wafer storage device to wafer to play a protective role.The utility model provides a kind of wafer bearing device, and as depicted in figs. 1 and 2, comprise holddown groove 10 and be arranged at the supporting part 20 of described holddown groove 10 inside, described supporting part 20 is greater than the thickness of wafer to the open-topped distance of described holddown groove 10.When using wafer bearing device described in the utility model, wafer 1 is placed in the inside of holddown groove 10 and is positioned on supporting part 20, because supporting part 20 to be greater than the thickness of wafer to the open-topped distance of described holddown groove 10, therefore wafer 1 is after putting into wafer bearing device of the present utility model, and the surface of wafer 1 can not exceed the surface of holddown groove 10.Therefore, wafer 1 is absorbed in wafer bearing device after placing, and when different wafers is all positioned over this wafer bearing device, can not contact mutually.
In the present embodiment, wafer bearing device also comprises base 30, and described base 30 seals the bottom opening of described holddown groove 10 and supports the bottom of described holddown groove 10, makes the channel-shaped of holddown groove 10 in a sealed bottom.The size of described base 30 is greater than the size of described holddown groove 10, and the edge of base 30 exceeds the edge of described holddown groove 10, and described holddown groove 10 is arranged at the center of described base 30.As shown in Figure 1, the edge of base 30 exceeds the edge of holddown groove 10, makes the placement of wafer bearing device more firm; In addition, when the mobile wafer bearing device of needs, the crawl of mechanical arm to wafer bearing device is also convenient in the marginal portion exceeded.
As depicted in figs. 1 and 2, in preferred version, base 30 is disc, and described holddown groove 10 is annular tubbiness.Therefore, the size of described base 30 is greater than the size of described holddown groove 10, and namely the diameter of collar plate shape is greater than the diameter of annular tubbiness.Described holddown groove 10 is arranged at the center of described base 30, i.e. the point coincides of disc and rounded cylindrical.Described supporting part 20 is also ring-type, and is arranged on the inwall of described holddown groove 10, and namely the external diameter of supporting part 20 equals the internal diameter of holddown groove 10, and supporting part 20 welds together in the inside of holddown groove 10 and holddown groove 10.After wafer 1 is placed in described wafer bearing device inside, the edge of wafer 1 relies on supporting part 20 to prop up.Be understandable that, the diameter of holddown groove 10, slightly larger than the diameter of wafer 1, makes wafer 1 successfully can be placed into wafer bearing device.
In the present embodiment, the plane parallel at described base 30 place is in the plane at described supporting part 20 place, and wafer 1 is being placed into after on supporting part 20, and its surface is parallel to base 30, and the placement of wafer 1 so can be made more firm.
In silicon wafer process, for the ease of the crawl of mechanical arm to wafer, as shown in Figure 1, the side of described holddown groove 10 has recess 11, and the degree of depth of described recess 11 is greater than described supporting part 20 to the open-topped distance of described holddown groove 10.Thus, wafer 1 is after putting into wafer bearing device, and its edge can expose at the side of holddown groove 10.Preferably, the quantity of described recess 11 is two, and the line of two recesses 11 passes the center of described holddown groove 10.When mechanical arm needs to capture wafer, two arms close up from two recesses 11 to centre respectively, can be clamped by wafer 1 from the both sides of wafer 1 and pick up.
Wafer bearing device of the present utility model is for placing single wafer.And be usually positioned in brilliant boat due to a large amount of wafers, therefore the utility model also provides a kind of brilliant boat, for accommodating above-mentioned wafer bearing device, to reach the object holding considerable wafer.Described brilliant boat comprises multiple holding part 100, is arranged at the inside of described brilliant boat.When using described brilliant boat, multiple wafer bearing device being contained with wafer is positioned in each holding part 100 successively.So, be spaced by wafer bearing device between wafer, can not interactive while, wafer bearing device also separated from each other by holding part 100 and can think impact.
In a preferred version, in wafer bearing device of the present utility model, the internal diameter of holddown groove 10 is 202mm, and supporting part 20 is 2mm to the distance at holddown groove 10 top, and the distance bottom holddown groove 10 is 6mm, the Ring Width of ring-type supporting part 20 is 3mm, and the diameter of described base 30 is 216mm.Because brilliant boat of the present utility model is for carrying wafer bearing device of the present utility model, therefore it is larger compared to existing brilliant boat diameter.In preferred version, the inner wall edge of brilliant boat of the present utility model expands outwardly 9mm compared to existing brilliant boat, and the height of holding part 100 is for drawing together to 10mm; Simultaneously, because the height of wafer bearing device of the present utility model is larger, therefore in brilliant boat of the present utility model, the total quantity of holding part 100 is also less than existing brilliant boat, concrete example is as being 13 holding parts 100, to meet wafer bearing device passing in and out safely brilliant boat, thus to realize the automatic capturing of microscope mechanical arm.
The following detailed description of the use procedure of wafer bearing device of the present utility model and brilliant boat.
For wafer bearing device, when needing to place wafer, two mechanical arms clamp from the two ends of wafer and pick up wafer, make crystal circle center aim at holddown groove 10 center and two mechanical arms aim at two recesses 11 respectively, and wafer is put into holddown groove 10, make the periphery of wafer be placed on supporting part 20; When needing to take out wafer, two mechanical arms aim at two recesses 11 respectively, clamp and pick up wafer, and wafer is shifted out wafer bearing device from the two ends of wafer.
For brilliant boat, when needing to place above-mentioned wafer bearing device, mechanical arm clamps the edge of the base 30 of wafer bearing device, and described wafer bearing device is pushed the holding part 100 of brilliant boat.After the placement completing a wafer bearing device, mechanical arm continues by that analogy, goes to capture other wafer bearing devices and puts into other holding part 100.When needing to take out above-mentioned wafer bearing device, mechanical arm clamps the edge of the base 30 of wafer bearing device, and extracts described wafer bearing device the holding part 100 of brilliant boat out.After the taking-up completing a wafer bearing device, mechanical arm continues by that analogy, goes to capture other wafer bearing devices in brilliant boat and the holding part 100 taking out its correspondence.
Wafer bearing device of the present utility model comprises holddown groove and is arranged at the supporting part of described holddown groove inside, described supporting part is greater than the thickness of wafer to the open-topped distance of described holddown groove, after making wafer put into wafer bearing device, the surface of wafer can not exceed the surface of holddown groove.Thus, avoid the mutual frictional impact between wafer, play a protective role.Brilliant boat of the present utility model is for carrying above-mentioned wafer bearing device, and the safety achieving considerable wafer captures and deposits.
Obviously, those skilled in the art can carry out various change and modification to utility model and not depart from spirit and scope of the present utility model.Like this, if these amendments of the present utility model and modification belong within the scope of the utility model claim and equivalent technologies thereof, then the utility model is also intended to comprise these change and modification.
Claims (10)
1. a wafer bearing device, it is characterized in that, comprise and have an open-topped holddown groove and the supporting part for supporting a wafer, supporting part is arranged at the inside of described holddown groove, and described supporting part is greater than the thickness of wafer to the open-topped distance of described holddown groove.
2. wafer bearing device as claimed in claim 1, it is characterized in that, also comprise base, described base supports the bottom of described holddown groove.
3. wafer bearing device as claimed in claim 2, it is characterized in that, the edge of described base exceeds the edge of described holddown groove, and described holddown groove is arranged at the center of described base.
4. wafer bearing device as claimed in claim 2, it is characterized in that, the plane parallel at described base place is in the plane at described supporting part place.
5. wafer bearing device as claimed in claim 2, it is characterized in that, described base is disc.
6. wafer bearing device as claimed in claim 1, it is characterized in that, the side of described holddown groove has recess, and the degree of depth of described recess is greater than described supporting part to the open-topped distance of described holddown groove.
7. wafer bearing device as claimed in claim 6, it is characterized in that, the quantity of described recess is two, and the line of two described recesses passes the center of described holddown groove.
8. wafer bearing device as claimed in claim 1, it is characterized in that, described holddown groove is annular tubbiness, and described supporting part is arranged on the inwall of described holddown groove.
9. wafer bearing device as claimed in claim 8, it is characterized in that, described supporting part is ring-type.
10. a brilliant boat, for accommodating wafer bearing device as described in claim 1-9 any one, is characterized in that, comprises multiple holding part, is arranged at the inside of described brilliant boat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520682898.5U CN204885123U (en) | 2015-09-06 | 2015-09-06 | Wafer bears device and brilliant boat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520682898.5U CN204885123U (en) | 2015-09-06 | 2015-09-06 | Wafer bears device and brilliant boat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204885123U true CN204885123U (en) | 2015-12-16 |
Family
ID=54829470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520682898.5U Expired - Fee Related CN204885123U (en) | 2015-09-06 | 2015-09-06 | Wafer bears device and brilliant boat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204885123U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115489873A (en) * | 2022-10-20 | 2022-12-20 | 滁州钰顺企业管理咨询合伙企业(有限合伙) | Wafer warping packaging method and device |
-
2015
- 2015-09-06 CN CN201520682898.5U patent/CN204885123U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115489873A (en) * | 2022-10-20 | 2022-12-20 | 滁州钰顺企业管理咨询合伙企业(有限合伙) | Wafer warping packaging method and device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151216 Termination date: 20190906 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |