CN201611653U - Semiconductor wafer clamping device - Google Patents

Semiconductor wafer clamping device Download PDF

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Publication number
CN201611653U
CN201611653U CN2009202121715U CN200920212171U CN201611653U CN 201611653 U CN201611653 U CN 201611653U CN 2009202121715 U CN2009202121715 U CN 2009202121715U CN 200920212171 U CN200920212171 U CN 200920212171U CN 201611653 U CN201611653 U CN 201611653U
Authority
CN
China
Prior art keywords
disk
support bar
base
anchor clamps
annulus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009202121715U
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Chinese (zh)
Inventor
汲生泉
钱洪涛
康盛
丁祥君
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Manufacturing International Beijing Corp
Original Assignee
Semiconductor Manufacturing International Shanghai Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Manufacturing International Shanghai Corp filed Critical Semiconductor Manufacturing International Shanghai Corp
Priority to CN2009202121715U priority Critical patent/CN201611653U/en
Application granted granted Critical
Publication of CN201611653U publication Critical patent/CN201611653U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides a semiconductor wafer clamping device used for clamping at least two different wafers in terms of size. The clamping device comprises a disc, the base of the disc and supporting rods, wherein, the disc comprises a first circular ring and a second circular ring which form a cascaded groove structure, the supporting rods are fixed on the base of the disc, and the base of the disc and the supporting rods are positioned at the bottom of the disc. The clamping device is simple in structure, and can be used on one production machine for clamping various wafers with different sizes, thereby eliminating the need for production machines dedicated to wafers with different sizes respectively, reducing cost and boosting productivity.

Description

A kind of anchor clamps of semiconductor crystal wafer
Technical field
The utility model relates to integrated circuit and makes the field, relates in particular to a kind of anchor clamps of semiconductor crystal wafer.
Background technology
Make the field at integrated circuit, be used at present the wafer that the anchor clamps of clamping wafer can only a kind of size of clamping in the industry, if the danger that the another kind of size wafer of clamping is prone to fragmentation or drops, with reference to the accompanying drawings shown in 1, what it adopted is the mechanical clamp arm configuration of traditional type, the opening size of gripper is fixed, so can't the grasp opening size with the wafer of outside dimension, therefore, the wafer of various different sizes can't and be produced on the board and use in a kind of measurement of fixed dimension, cause the idle waste of resource, therefore, provide a kind of can clamping the anchor clamps of the multiple size wafer wafer of realizing various different sizes in a kind of measurement of fixed dimension and produce use on the board, make full use of the resources of production thereby reach, reducing production costs, is very necessary.
The utility model content
The utility model provides a kind of anchor clamps of semiconductor crystal wafer, to solve the problem of the wafer that the existing anchor clamps that are used for the clamping wafer can only a kind of size of clamping.
For solving the problems of the technologies described above, the utility model provides a kind of anchor clamps of semiconductor crystal wafer, comprising:
Disk, this disk comprise first annulus and second annulus, and described first annulus and described second annulus constitute the staged groove structure;
The base of disk and support bar, described support bar are fixed on the base of described disk, and the base of described disk and described support bar are positioned at the bottom of described disk.
Optionally, the quantity of described support bar is at least three, distance between the adjacent described support bar equates, each described support bar equates with distance between the described disc base center of circle and less than the hollow radius of a circle of described first annulus, be beneficial to the stressed even of support bar, and can pass described open circles smoothly.
Optionally, the material of described anchor clamps is a monomer moulding casting nylon.
The utility model provides a kind of anchor clamps of semiconductor crystal wafer, and described clamp structure is simple, but and the wafer of the multiple size of clamping, improved the utilance of different size wafer production board, saved cost, improved production capacity.
Description of drawings
Fig. 1 is the vertical view of anchor clamps of the semiconductor crystal wafer of prior art;
The vertical view of the disk of the semiconductor crystal wafer anchor clamps that Fig. 2 is provided for the utility model one embodiment;
Fig. 3 is the cutaway view of the disk of semiconductor crystal wafer anchor clamps shown in Figure 2 along A direction among Fig. 2;
The base of the disk of the semiconductor crystal wafer anchor clamps that Fig. 4 is provided for the utility model one embodiment and the vertical view of support bar;
Fig. 5 is the base of disk of semiconductor crystal wafer anchor clamps shown in Figure 4 and the support bar cutaway view along B direction among Fig. 4;
Disk and the base of disk and the location diagram of support bar of the semiconductor crystal wafer anchor clamps that Fig. 6 is provided for the utility model one embodiment.
Embodiment
Be described in further detail below in conjunction with the anchor clamps of the drawings and specific embodiments the semiconductor crystal wafer that the utility model proposes.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the purpose of aid illustration the utility model embodiment lucidly.
Core concept of the present utility model is, a kind of anchor clamps of semiconductor crystal wafer are provided, and makes its ability with wafer of the multiple size of clamping, to reach the saving cost, improves the purpose of production capacity.
In the anchor clamps of the semiconductor crystal wafer that the utility model one embodiment is provided, as shown in Figures 2 and 3, the vertical view of the disk of the semiconductor crystal wafer anchor clamps that Fig. 2 is provided for the utility model one embodiment, Fig. 3 is the cutaway view of the disk of semiconductor crystal wafer anchor clamps shown in Figure 2 along A direction among Fig. 2, first annulus, 10 diameters of disk 100 are D2=201mm, so that place 8 cun wafers, second annulus, 20 diameters are D1=300mm, so that place 12 cun wafers, first annulus 10 and second annulus 20 constitute the staged groove structure.As Fig. 4 and shown in Figure 5, the base of the disk of the semiconductor crystal wafer anchor clamps that Fig. 4 is provided for the utility model one embodiment and the vertical view of support bar, Fig. 5 is the base of disk of semiconductor crystal wafer anchor clamps shown in Figure 4 and the support bar cutaway view along B direction among Fig. 4, distance in three support bars 200 between the adjacent supports bar equates, distance between base 300 centers of circle of each support bar and disk equates, and less than first annulus, 10 hollow radius of a circle D3, be beneficial to the stressed even of support bar, and can pass described open circles smoothly.
During use, as shown in Figure 6, can utilize the base 300 of disk to rise, support bar 200 passes the first annulus open circles of disk 100, with 8 cun wafers and 12 cun wafer jack-up, with vacuum WAND wafer is taken out then.Therefore, in the present embodiment, these anchor clamps can 8 cun wafers of clamping again can 12 cun wafers of clamping.
In the utility model one embodiment, disk 100, the material of the base 300 of support bar 200 and disk is a monomer moulding casting nylon, its material has also reached 140 ℃ than light and strong its fusing point simultaneously of rigidity, is fit to do anchor clamps.Preferable, the maximum operation (service) temperature of these anchor clamps is 100 ℃, avoids high temperature to make its fusion.
Will be appreciated that described support bar 200 quantity can be more than three or three.
Please refer to Fig. 2 to Fig. 6.The anchor clamps of the semiconductor crystal wafer that is provided at the utility model one embodiment comprise: disk 100, this disk 100 comprise first annulus 10 and second annulus, 20, the first annulus 10 and second annulus 20 and constitute the staged groove structures; The base 300 of disk and support bar 200, support bar 200 are fixed on the base 300 of disk, and the base 300 of disk and support bar 200 are positioned at the bottom of described disk 100.The quantity of described support bar is at least three, and the distance between the adjacent supports bar equates, the distance between the base center of circle of each support bar and disk equates and less than the hollow radius of a circle D3 of first annulus.Disk 100, the base 300 of support bar 200 and disk adopts monomer moulding casting nylon to make.
In sum, the utility model provides a kind of anchor clamps of semiconductor crystal wafer, and described clamp structure is simple, but and the wafer of the multiple size of clamping, improved the utilance of different size wafer production board, saved cost, improved production capacity.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these changes and modification interior.

Claims (3)

1. the anchor clamps of a semiconductor crystal wafer, the wafer in order at least two kinds of sizes of clamping is characterized in that, comprising:
Disk, this disk comprise first annulus and second annulus, and described first annulus and described second annulus constitute the staged groove structure;
The base of disk and support bar, described support bar are fixed on the base of described disk, and the base of described disk and described support bar are positioned at the bottom of described disk.
2. the anchor clamps of semiconductor crystal wafer as claimed in claim 1, it is characterized in that, the quantity of described support bar is at least three, distance between the adjacent described support bar equates, each described support bar equates with distance between the described disc base center of circle and less than the hollow radius of a circle of described first annulus.
3. the anchor clamps of semiconductor crystal wafer as claimed in claim 1 is characterized in that, adopt monomer moulding casting nylon to make.
CN2009202121715U 2009-11-10 2009-11-10 Semiconductor wafer clamping device Expired - Fee Related CN201611653U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009202121715U CN201611653U (en) 2009-11-10 2009-11-10 Semiconductor wafer clamping device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009202121715U CN201611653U (en) 2009-11-10 2009-11-10 Semiconductor wafer clamping device

Publications (1)

Publication Number Publication Date
CN201611653U true CN201611653U (en) 2010-10-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009202121715U Expired - Fee Related CN201611653U (en) 2009-11-10 2009-11-10 Semiconductor wafer clamping device

Country Status (1)

Country Link
CN (1) CN201611653U (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102983095A (en) * 2012-11-30 2013-03-20 芜湖通和汽车管路系统有限公司 Tool for taking chip from wafer and use method thereof
CN103586246A (en) * 2012-08-16 2014-02-19 沈阳芯源微电子设备有限公司 Clamping mechanism of mask plate cleaning machine
CN103730400A (en) * 2012-10-16 2014-04-16 沈阳芯源微电子设备有限公司 Centring device for wafers of various sizes
CN104600018A (en) * 2013-10-30 2015-05-06 沈阳芯源微电子设备有限公司 Roasting supporting device for base plate
CN105161469A (en) * 2015-09-17 2015-12-16 沈阳拓荆科技有限公司 8-inch/12-inch substrate general platform structure
CN105609463A (en) * 2016-01-25 2016-05-25 中国电子科技集团公司第二十四研究所 Integrated cleaning fixture capable of automatically fixing silicon wafer during rotation
CN112002671A (en) * 2020-08-24 2020-11-27 台州市老林装饰有限公司 Wafer tray device suitable for different sizes
CN112824560A (en) * 2019-11-20 2021-05-21 中国科学院微电子研究所 Sample stage and method for preparing thin-film material

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103586246A (en) * 2012-08-16 2014-02-19 沈阳芯源微电子设备有限公司 Clamping mechanism of mask plate cleaning machine
CN103730400A (en) * 2012-10-16 2014-04-16 沈阳芯源微电子设备有限公司 Centring device for wafers of various sizes
CN102983095A (en) * 2012-11-30 2013-03-20 芜湖通和汽车管路系统有限公司 Tool for taking chip from wafer and use method thereof
CN104600018A (en) * 2013-10-30 2015-05-06 沈阳芯源微电子设备有限公司 Roasting supporting device for base plate
CN104600018B (en) * 2013-10-30 2017-06-30 沈阳芯源微电子设备有限公司 A kind of substrate toasts supporting arrangement
CN105161469A (en) * 2015-09-17 2015-12-16 沈阳拓荆科技有限公司 8-inch/12-inch substrate general platform structure
WO2017045241A1 (en) * 2015-09-17 2017-03-23 沈阳拓荆科技有限公司 General platform structure for 8-inch and 12-inch substrates
CN105609463A (en) * 2016-01-25 2016-05-25 中国电子科技集团公司第二十四研究所 Integrated cleaning fixture capable of automatically fixing silicon wafer during rotation
CN105609463B (en) * 2016-01-25 2018-09-18 中国电子科技集团公司第二十四研究所 The integrated cleaning jig of the automatic fixed silicon wafer of rotation
CN112824560A (en) * 2019-11-20 2021-05-21 中国科学院微电子研究所 Sample stage and method for preparing thin-film material
CN112002671A (en) * 2020-08-24 2020-11-27 台州市老林装饰有限公司 Wafer tray device suitable for different sizes

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING

Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION

Effective date: 20130222

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING

TR01 Transfer of patent right

Effective date of registration: 20130222

Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing

Patentee after: Semiconductor Manufacturing International (Beijing) Corporation

Address before: 201203 No. 18 Zhangjiang Road, Shanghai

Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101020

Termination date: 20181110

CF01 Termination of patent right due to non-payment of annual fee