CN112002671B - Wafer tray device suitable for different sizes - Google Patents
Wafer tray device suitable for different sizes Download PDFInfo
- Publication number
- CN112002671B CN112002671B CN202010853923.7A CN202010853923A CN112002671B CN 112002671 B CN112002671 B CN 112002671B CN 202010853923 A CN202010853923 A CN 202010853923A CN 112002671 B CN112002671 B CN 112002671B
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- Prior art keywords
- wafer
- top surface
- side wall
- annular
- different sizes
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- 235000012431 wafers Nutrition 0.000 abstract description 46
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention discloses a wafer tray device suitable for different sizes, which comprises a main tray body, wherein a plurality of through grooves are formed in the main tray body, a plurality of wafer placing connecting plates are fixed on the top surface of the main tray body, protruding parts are formed in the middle of the top surface of each wafer placing connecting plate, the protruding parts are inserted into the corresponding through grooves, and the outer side walls of the protruding parts are clung to the inner side walls of the through grooves. According to the invention, different annular bodies can be arranged according to the requirements to mount wafers with different specifications, so that the placement and use of the wafers with different specifications are satisfied, and the wafers are pressed against the edge parts of the wafers through the annular bodies, so that the problem of warpage is avoided.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer tray device suitable for different sizes.
Background
Some processes in the fabrication of semiconductor devices require that wafers be carried on wafer trays. The existing wafer tray is integrally formed by a plurality of clamping grooves for placing wafers, has consistent shape, can only place wafers with the same specification, and cannot be placed in common, and in addition, when the wafer tray is used in equipment of a wafer heating process, the wafer tray is easy to warp in a heating process.
Disclosure of Invention
The invention aims at overcoming the defects of the prior art, and provides a wafer tray device suitable for different sizes, which can be used for installing different specifications of wafers according to the requirement, meets the placement and use of the wafers with different specifications, and ensures that the wafer tray device can not generate warping problems when pressed against the edge of the wafer through the annular body.
The technical solution of the invention is as follows:
the wafer tray device suitable for different sizes comprises a main tray body, wherein a plurality of through grooves are formed in the main tray body, a plurality of wafer placing connecting plates are fixed on the top surface of the main tray body, protruding parts are formed in the middle of the top surface of each wafer placing connecting plate and are inserted into the corresponding through grooves, and the outer side walls of the protruding parts are clung to the inner side walls of the through grooves;
the wafer is inserted in the placing through groove and pressed against the top surface of the protruding part, and the lower part of the inner side wall of the annular body is clung to the top surface of the edge of the wafer.
The lateral wall shaping of the bottom of placing logical groove has a plurality of constant head tanks, and the shaping has a plurality of connection bellying on the lateral wall of connecting plate is placed to the wafer, and connection bellying plug bush is in corresponding constant head tank and through bolt fixed connection on the top surface of constant head tank.
The middle part of the bottom surface of the main disc body is provided with a connecting concave hole, the connecting sleeve body is inserted into the connecting concave hole, and the connecting sleeve body is fixed on the main disc body.
The side annular groove is formed on the inner side wall of the lower part of the connecting concave hole, and the radial extending edge formed on the outer side wall of the bottom of the connecting sleeve body is inserted in the side annular groove and fixedly connected to the top surface of the side annular groove through bolts.
The bottom surface of the inner side wall of the annular body is pressed against the top surface of the protruding part, the lower part of the inner side wall of the annular body is formed with an extension ring body part, and the bottom surface of the extension ring body part is tightly attached to the top surface of the edge part of the wafer.
A rectangular connecting through hole is formed in the middle of the connecting sleeve body.
The invention has the beneficial effects that: the wafer clamping device can be used for mounting wafers of different specifications by mounting different annular bodies according to requirements, so that the wafers of different specifications are placed and used, and the wafers are pressed against the edge of the wafers through the annular bodies, so that the problem of warpage cannot be caused.
Drawings
FIG. 1 is a partial top view of the present invention;
FIG. 2 is a partial bottom view of the present invention;
FIG. 3 is a partial cross-sectional view of FIG. 1;
fig. 4 is a partial cross-sectional view of another annular body.
Detailed Description
Example 1: referring to fig. 1 to 3, a wafer tray device suitable for different sizes includes a main tray body 10, wherein a plurality of through slots 11 are formed on the main tray body 10, a plurality of wafer placing connection plates 20 are fixed on the top surface of the main tray body 10, a protruding portion 21 is formed in the middle of the top surface of the wafer placing connection plates 20, the protruding portion 21 is inserted into the corresponding through slots 11, and the outer side walls of the protruding portion 21 are tightly attached to the inner side walls of the through slots 11;
an annular screw sleeve 12 is formed on the top surface of the main disc body 10 corresponding to the placing through groove 11, an annular groove is formed in the middle of the bottom surface of the annular body 30, an internal thread is formed on the inner side wall of the annular groove, the annular screw sleeve 12 is inserted into the annular groove and screwed on the internal thread, the wafer 100 is inserted into the placing through groove 11 and pressed against the top surface of the protruding portion 21, and the lower portion of the inner side wall of the annular body 30 is tightly attached to the top surface of the edge of the wafer 100.
Further, the sidewall of the bottom of the placement through groove 11 is formed with a plurality of positioning grooves 13, the outer sidewall of the wafer placement connection plate 20 is formed with a plurality of connection protrusions 22, and the connection protrusions 22 are inserted into the corresponding positioning grooves 13 and fixedly connected to the top surfaces of the positioning grooves 13 through bolts.
Further, a connecting concave hole 14 is formed in the middle of the bottom surface of the main disc body 10, a connecting sleeve body 15 is inserted into the connecting concave hole 14, and the connecting sleeve body 15 is fixed on the main disc body 10.
Further, a side annular groove is formed on the inner side wall of the lower portion of the connecting concave hole 14, and a radially extending edge 151 formed on the outer side wall of the bottom of the connecting sleeve body 15 is inserted into the side annular groove and fixedly connected to the top surface of the side annular groove through a bolt.
The bolts in this embodiment are graphite bolts.
In this embodiment, each wafer 100 can be detached and installed independently when in use, which is very convenient.
Further, the middle part of the connecting sleeve 15 may be formed with a rectangular connecting through hole 152, or may be formed with a through hole of various shapes such as a flower-shaped through hole. The rectangular connection through-hole 152 is mainly used to connect a rotation shaft to achieve rotation.
In embodiment 2, as shown in fig. 4, the bottom surface of the inner side wall of the ring body 30 is pressed against the top surface of the boss 21, the lower portion of the inner side wall of the ring body 30 is formed with an extended ring body portion 31, and the bottom surface of the extended ring body portion 31 is closely attached to the top surface of the edge of the wafer 100.
The difference from embodiment 2 is that when the mounted wafer 100 is smaller than the diameter of the placement through groove 11, the corresponding ring body 30 needs to be replaced, which is achieved by forming the extension ring body 31 at the lower part of the inner side wall of the ring body 30, and by the bottom surface of the extension ring body 31 being closely attached to the top surface of the edge of the wafer 100, the outer side wall of the wafer 100 is closely attached to the inner side wall of the ring body 30.
The ring body 30 of different types can be replaced according to the requirement to mount wafers 100 of different specifications, so that the effect is good and the universality is good.
Claims (5)
1. Wafer tray device suitable for different sizes, including main disk body (10), its characterized in that: a plurality of through grooves (11) are formed in the main disc body (10), a plurality of wafer placing connecting plates (20) are fixed on the top surface of the main disc body (10), protruding portions (21) are formed in the middle of the top surface of each wafer placing connecting plate (20), the protruding portions (21) are inserted into the corresponding through grooves (11), and the outer side walls of the protruding portions (21) are tightly attached to the inner side walls of the through grooves (11);
An annular screw sleeve (12) is formed on the top surface of the main disc body (10) corresponding to the placing through groove (11), an annular groove is formed in the middle of the bottom surface of the annular body (30), an inner thread is formed on the inner side wall of the annular groove, the annular screw sleeve (12) is inserted into the annular groove and screwed on the inner thread, and a wafer (100) is inserted into the placing through groove (11) and pressed against the top surface of the protruding part (21);
The lower part of the inner side wall of the annular body (30) is clung to the top surface of the edge of the wafer (100); or the bottom surface at the inner side wall of the annular body (30) is pressed against the top surface of the protruding part (21), the lower part of the inner side wall of the annular body (30) is formed with an extending annular body part (31), and the bottom surface of the extending annular body part (31) is tightly attached to the top surface of the edge part of the wafer (100).
2. A wafer pallet apparatus for different sizes according to claim 1, wherein: the side wall of the bottom of the placing through groove (11) is provided with a plurality of positioning grooves (13), the outer side wall of the wafer placing connecting plate (20) is provided with a plurality of connecting convex parts (22), and the connecting convex parts (22) are inserted into the corresponding positioning grooves (13) and fixedly connected to the top surfaces of the positioning grooves (13) through bolts.
3. A wafer pallet apparatus for different sizes according to claim 1, wherein: the middle part of the bottom surface of the main disc body (10) is provided with a connecting concave hole (14), a connecting sleeve body (15) is inserted into the connecting concave hole (14), and the connecting sleeve body (15) is fixed on the main disc body (10).
4. A wafer pallet apparatus according to claim 3 adapted for different sizes, wherein: the inner side wall of the lower part of the connecting concave hole (14) is provided with a side annular groove, and the radial extending edge (151) formed on the outer side wall of the bottom of the connecting sleeve body (15) is inserted in the side annular groove and fixedly connected to the top surface of the side annular groove through bolts.
5. A wafer pallet apparatus according to claim 3 adapted for different sizes, wherein: a rectangular connecting through hole (152) is formed in the middle of the connecting sleeve body (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010853923.7A CN112002671B (en) | 2020-08-24 | 2020-08-24 | Wafer tray device suitable for different sizes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010853923.7A CN112002671B (en) | 2020-08-24 | 2020-08-24 | Wafer tray device suitable for different sizes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112002671A CN112002671A (en) | 2020-11-27 |
| CN112002671B true CN112002671B (en) | 2024-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010853923.7A Active CN112002671B (en) | 2020-08-24 | 2020-08-24 | Wafer tray device suitable for different sizes |
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| CN (1) | CN112002671B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112908908B (en) * | 2021-01-29 | 2024-09-17 | 宁波江丰电子材料股份有限公司 | Back structure of wafer tray and processing method thereof |
| CN116499840B (en) * | 2023-06-28 | 2023-09-08 | 盛吉盛半导体科技(北京)有限公司 | Wafer section system appearance device |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010063342A (en) * | 1999-12-22 | 2001-07-09 | 윤종용 | Device for supporting wafer for semiconductor annealing process |
| TW200301539A (en) * | 2001-12-18 | 2003-07-01 | Advanced Tech Materials | Wafer carrier, process tool system and method of processing a wafer in a process tool |
| CN201611653U (en) * | 2009-11-10 | 2010-10-20 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor wafer clamping device |
| WO2013000428A1 (en) * | 2011-06-28 | 2013-01-03 | 清华大学 | A wafer holding device using a pusher rod drawn by strings and springs |
| CN203026492U (en) * | 2012-11-30 | 2013-06-26 | 芜湖通和汽车管路系统有限公司 | Tool for taking away chips from wafers |
| CN103811401A (en) * | 2014-03-11 | 2014-05-21 | 上海华虹宏力半导体制造有限公司 | Wafer bracket and process cavity comprising wafer bracket |
| KR101496033B1 (en) * | 2013-09-05 | 2015-02-25 | 세메스 주식회사 | Wafer level molding apparatus |
| TWM502958U (en) * | 2014-12-25 | 2015-06-11 | Advanced System Technology Co Ltd | Wafer tray structure |
| CN205508799U (en) * | 2016-03-30 | 2016-08-24 | 西安立芯光电科技有限公司 | A appurtenance for photoetching glue coating process manual positioning wafer and mounting structure thereof |
| CN106341964A (en) * | 2016-09-26 | 2017-01-18 | 东莞市联洲知识产权运营管理有限公司 | Security protection host machine simple to disassemble |
| CN106340485A (en) * | 2015-07-10 | 2017-01-18 | 上海微电子装备有限公司 | Wafer bonding clamping device, aligning machine, bonding machine and warping substrate adsorption method |
| CN107017196A (en) * | 2015-12-11 | 2017-08-04 | 朗姆研究公司 | With anti-skidding and anti-rotational feature wafer support pedestal |
| CN107195579A (en) * | 2016-03-14 | 2017-09-22 | 环球晶圆股份有限公司 | Wafer bearing device |
| CN208706612U (en) * | 2018-09-21 | 2019-04-05 | 锐捷芯盛（天津）电子科技有限公司 | A kind of wafer pressing device |
| CN109797379A (en) * | 2017-11-16 | 2019-05-24 | 三星电子株式会社 | Depositing device including upper nozzle and lower nozzle |
| CN210516691U (en) * | 2019-05-30 | 2020-05-12 | 深圳中科飞测科技有限公司 | Bearing device |
-
2020
- 2020-08-24 CN CN202010853923.7A patent/CN112002671B/en active Active
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010063342A (en) * | 1999-12-22 | 2001-07-09 | 윤종용 | Device for supporting wafer for semiconductor annealing process |
| TW200301539A (en) * | 2001-12-18 | 2003-07-01 | Advanced Tech Materials | Wafer carrier, process tool system and method of processing a wafer in a process tool |
| CN201611653U (en) * | 2009-11-10 | 2010-10-20 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor wafer clamping device |
| WO2013000428A1 (en) * | 2011-06-28 | 2013-01-03 | 清华大学 | A wafer holding device using a pusher rod drawn by strings and springs |
| CN203026492U (en) * | 2012-11-30 | 2013-06-26 | 芜湖通和汽车管路系统有限公司 | Tool for taking away chips from wafers |
| KR101496033B1 (en) * | 2013-09-05 | 2015-02-25 | 세메스 주식회사 | Wafer level molding apparatus |
| CN103811401A (en) * | 2014-03-11 | 2014-05-21 | 上海华虹宏力半导体制造有限公司 | Wafer bracket and process cavity comprising wafer bracket |
| TWM502958U (en) * | 2014-12-25 | 2015-06-11 | Advanced System Technology Co Ltd | Wafer tray structure |
| CN106340485A (en) * | 2015-07-10 | 2017-01-18 | 上海微电子装备有限公司 | Wafer bonding clamping device, aligning machine, bonding machine and warping substrate adsorption method |
| CN107017196A (en) * | 2015-12-11 | 2017-08-04 | 朗姆研究公司 | With anti-skidding and anti-rotational feature wafer support pedestal |
| CN107195579A (en) * | 2016-03-14 | 2017-09-22 | 环球晶圆股份有限公司 | Wafer bearing device |
| CN205508799U (en) * | 2016-03-30 | 2016-08-24 | 西安立芯光电科技有限公司 | A appurtenance for photoetching glue coating process manual positioning wafer and mounting structure thereof |
| CN106341964A (en) * | 2016-09-26 | 2017-01-18 | 东莞市联洲知识产权运营管理有限公司 | Security protection host machine simple to disassemble |
| CN109797379A (en) * | 2017-11-16 | 2019-05-24 | 三星电子株式会社 | Depositing device including upper nozzle and lower nozzle |
| CN208706612U (en) * | 2018-09-21 | 2019-04-05 | 锐捷芯盛（天津）电子科技有限公司 | A kind of wafer pressing device |
| CN210516691U (en) * | 2019-05-30 | 2020-05-12 | 深圳中科飞测科技有限公司 | Bearing device |
Non-Patent Citations (2)
| Title |
|---|
| TAIKO晶圆激光切环研究;李方华;;电子测试(第08期) * |
| 李方华 ; .TAIKO晶圆激光切环研究.电子测试.2019,(第08期), * |
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| CN112002671A (en) | 2020-11-27 |
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Effective date of registration: 20240515 Address after: Room 02, North Area, 1st Floor, Electronic Building, No. 5, No. 777 Guanggu 3rd Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province, 430000 (Free Trade Zone Wuhan Area) Applicant after: WUHAN ETERNAL TECHNOLOGIES CO.,LTD. Country or region after: China Address before: 318050 side of Changpu village vegetable market, Lunan street, Luqiao District, Taizhou City, Zhejiang Province Applicant before: Taizhou Laolin Decoration Co.,Ltd. Country or region before: China |
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