CN111446201A - Bearing device and semiconductor equipment - Google Patents
Bearing device and semiconductor equipment Download PDFInfo
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- CN111446201A CN111446201A CN202010254737.1A CN202010254737A CN111446201A CN 111446201 A CN111446201 A CN 111446201A CN 202010254737 A CN202010254737 A CN 202010254737A CN 111446201 A CN111446201 A CN 111446201A
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- insulating
- ring
- tray
- annular boss
- clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a bearing device and semiconductor equipment, wherein the bearing device comprises a base, a tray, a clamping ring and an insulating connecting component, wherein the tray is positioned on the base; the clamping ring is arranged around the tray in a surrounding mode, a first preset distance is formed between the inner peripheral wall of the clamping ring and the outer peripheral wall of the tray in the horizontal direction, and the first preset distance meets the requirement that the clamping ring and the tray are mutually insulated in the radial direction; the insulating connecting part is arranged between the tray and the clamping ring and used for enabling the clamping ring and the tray to be mutually insulated. The bearing device and the semiconductor equipment provided by the invention can avoid the occurrence of the sparking phenomenon, and can avoid the contact of the pressure ring and the process surface of the workpiece to be processed, thereby improving the process result of the workpiece to be processed.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to a bearing device and semiconductor equipment.
Background
At present, in semiconductor processing equipment, a mechanical chuck is generally used for bearing a highly warped substrate, a bonded substrate and an insulating substrate, and can be applied to a normal-temperature sputtering process of semiconductor processing to bear a wafer.
In the existing semiconductor processing equipment, a base assembling device, a pressure ring and a mechanical chuck are generally arranged in a process chamber, wherein the mechanical chuck comprises a tray arranged on the base assembling device and used for bearing a wafer, and a clamping ring arranged around the tray. When a sputtering deposition process is carried out, the upper surfaces of the wafer, the clamping ring and the pressure ring are exposed in the environment of plasma and are bombarded by charged particles, wherein the upper surface of the wafer can accumulate charges due to poor conductivity of the material, the clamping ring and the pressure ring are usually made of metal materials and are connected with the base assembling device through the tray, so that the charges on the upper surfaces of the clamping ring and the pressure ring can be freely migrated and released, and therefore, a potential difference is generated between the upper surface of the wafer and the upper surface of the clamping ring, a sparking (point discharge) phenomenon occurs between the edge of the wafer and the clamping ring, and a series of serious consequences such as damage to the wafer, excessive particles and poor process performance are caused.
In order to avoid the sparking phenomenon, the pressing ring is pressed against the edge area of the upper surface of the wafer during the sputtering deposition process, so that the charges on the upper surface of the wafer can be released through free migration of the pressing ring, and the potential difference between the wafer and the clamping ring is reduced.
However, since the edge region of the upper surface of the wafer is pressed by the pressing ring, the edge region cannot be deposited during the sputtering deposition process, thereby affecting the subsequent processes (such as electroplating). Moreover, during the continuous process, the heat accumulated on the pressure ring can be transferred to the wafer, which causes the temperature at the edge of the wafer to be too high, thereby affecting the process performance. In addition, in some apparatuses such as Physical Vapor Deposition (PVD), when a rf bias is applied to the susceptor assembly, most of rf energy is introduced to the edge portion of the wafer through the pressure ring, and only a small amount of rf energy is applied to the middle portion of the wafer through the susceptor, so that the rf energy density applied to the wafer is gradually reduced from the edge to the center of the wafer, resulting in a large influence on the uniformity of film Deposition.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art, and provides a bearing device and a semiconductor device, which can avoid the occurrence of sparking phenomenon and can avoid a pressure ring from contacting with a process surface of a workpiece to be processed, so that the process result of the workpiece to be processed is improved.
To achieve the object of the present invention, there is provided a carrier device, including:
a base;
a tray located on the base;
the clamping ring is arranged around the tray in a surrounding mode, a first preset distance is formed between the inner peripheral wall of the clamping ring and the outer peripheral wall of the tray in the horizontal direction, and the first preset distance meets the requirement that the clamping ring and the tray are mutually insulated in the radial direction;
and the insulating connecting part is arranged between the tray and the clamping ring and used for insulating the clamping ring and the tray from each other.
Preferably, the peripheral wall of the tray is provided with an annular boss;
the insulating connecting part is arranged between the annular boss and the clamping ring, a second preset distance is arranged between the lower surface of the clamping ring and the upper surface of the annular boss in the vertical direction, and the second preset distance can enable the clamping ring and the annular boss to be mutually insulated in the axial direction.
Preferably, the insulating connecting part comprises at least two insulating pins, the at least two insulating pins are distributed at intervals along the circumferential direction of the annular boss, and two ends of each insulating pin are respectively connected with the annular boss and the snap ring.
Preferably, each insulating pin comprises a first pin part and a second pin part, wherein the first pin part is tapered, and a first pin groove matched with the first pin part is formed in the lower surface of the clamping ring; the second pin part is fixedly connected with the annular boss.
Preferably, the insulating connection member includes an insulating spacer, and a thickness of the insulating spacer is equal to the second preset distance;
preferably, the bearing device further comprises an insulating fixing member, and the insulating fixing member is used for fixing the snap ring, the insulating gasket and the annular boss.
Preferably, the insulating connection member includes a first insulating ring and a second insulating ring, wherein:
the first insulating ring is positioned on the upper surface of the annular boss and arranged around the tray in a surrounding mode, and the radial size of the first insulating ring is equal to the first preset distance;
the second insulating ring is located on the upper surface of annular boss, and encircle the setting and be in on the periphery wall of first insulating ring, the snap ring sets up on the second insulating ring, and encircle the setting and be in around the first insulating ring, and the thickness of second insulating ring equals the second is preset apart from.
Preferably, the first preset distance is greater than or equal to 1 mm.
Preferably, the second preset distance is greater than or equal to 1 mm.
The invention also provides semiconductor equipment which comprises a process chamber and a bearing device arranged in the process chamber, wherein the bearing device adopts the bearing device provided by the invention and is used for bearing a workpiece to be processed.
The invention has the following beneficial effects:
the bearing device provided by the invention has the advantages that the snap ring is connected with the tray in an insulated manner by the aid of the insulated connecting component arranged between the tray and the snap ring, the snap ring is arranged around the tray in a surrounding manner, and the inner peripheral wall of the snap ring and the outer peripheral wall of the tray are horizontally provided with the first preset distance which can enable the snap ring and the tray to be insulated from each other in the radial direction, so that the snap ring and the tray are insulated from each other in the radial direction, charged particles bombarded on the snap ring cannot migrate to the tray in the semiconductor processing process, the charged particles can be accumulated on the snap ring, the snap ring and a workpiece to be processed can simultaneously accumulate charges in the processing process, the potential difference between the workpiece to be processed and the snap ring is approximate or even the same, and the occurrence of an ignition phenomenon can be avoided. In addition, as the charge on the workpiece to be processed does not need to be transferred, the pressure ring does not need to be in contact with the process surface of the workpiece to be processed, the process surface of the workpiece to be processed can be comprehensively deposited in the deposition process, so that the influence on the subsequent process of the workpiece to be processed is avoided, the influence on the process performance of the workpiece to be processed due to overhigh temperature caused by the fact that the heat accumulated on the pressure ring is transferred to the workpiece to be processed can also be avoided, the pressure ring can also be prevented from leading a large amount of radio frequency energy into the workpiece to be processed, the uniformity of the radio frequency energy on the workpiece to be processed is improved, the uniformity of film deposition is improved, and the process result of the workpiece to be processed can be improved.
According to the semiconductor device provided by the invention, the bearing device provided by the invention is used for bearing the workpiece to be processed, the occurrence of the sparking phenomenon can be avoided, and the contact between the pressure ring and the process surface of the workpiece to be processed can be avoided, so that the process result of the workpiece to be processed is improved.
Drawings
Fig. 1 is a schematic structural diagram of a carrying device provided in a first embodiment of the present invention, which is disposed on a base;
fig. 2 is a schematic partial enlarged structural view of a carrying device according to a first embodiment of the present invention;
fig. 3 is a schematic structural diagram of a carrying device according to a first embodiment of the present invention;
fig. 4 is a schematic partial enlarged structural view of a carrying device according to a second embodiment of the present invention;
fig. 5 is a schematic partial enlarged structural view of a carrying device according to a third embodiment of the present invention;
description of reference numerals:
11-a tray; 12-a snap ring; 13-an annular boss; 14-an insulating pin; 141-a first pin portion; 142-a second pin portion; 151-insulating nail; 152-an insulating spacer; 161-a first insulating ring; 162-a second insulating ring; 2-a workpiece to be processed; 3, pressing a ring; 4-base.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the carrying device and the semiconductor processing chamber provided by the present invention are described in detail below with reference to the accompanying drawings.
As shown in fig. 1 to 3, a first embodiment of the present invention provides a carrying device, which comprises a base 4, a tray 11, a snap ring 12 and an insulating connecting component, wherein the tray 11 is located on the base 4; the snap ring 12 is arranged around the tray 11 in a surrounding manner, and the inner peripheral wall of the snap ring 12 and the outer peripheral wall of the tray 11 have a first preset distance (as shown by a distance a in fig. 1) in the horizontal direction, and the first preset distance is sufficient to enable the snap ring 12 and the tray 11 to be insulated from each other in the radial direction; the insulating connection member is provided between the tray 11 and the snap ring 12 for insulating the snap ring 12 and the tray 11 from each other.
The carrying device provided by the embodiment is characterized in that the clamping ring 12 and the tray 11 are connected in an insulated way by the insulating connecting component arranged between the tray 11 and the clamping ring 12, the snap ring 12 is arranged around the tray 11 in a surrounding manner, and the inner peripheral wall of the snap ring 12 and the outer peripheral wall of the tray 11 have a first preset distance in the horizontal direction, which can enable the snap ring 12 and the tray 11 to be mutually insulated in the radial direction, so that the retainer ring 12 and the tray 11 are radially insulated from each other, which prevents charged particles bombarded on the retainer ring 12 from migrating to the tray 11 during a semiconductor processing process, thereby leading charged particles to be accumulated on the clamping ring 12, leading the clamping ring 12 and the workpiece 2 to be processed to simultaneously accumulate electric charges in the processing process, further, the potential difference between the workpiece 2 to be processed and the snap ring 12 is similar or even identical, so that the occurrence of the ignition phenomenon can be avoided. Moreover, as the charges on the workpiece 2 to be processed do not need to be transferred, the pressure ring 3 does not need to be in contact with the process surface of the workpiece 2 to be processed, the process surface of the workpiece 2 to be processed can be comprehensively deposited in the deposition process, thereby avoiding the influence on the subsequent process of the workpiece 2 to be processed, and further avoiding the influence on the process performance caused by overhigh temperature of the workpiece 2 to be processed due to the fact that the heat accumulated on the pressure ring 3 is transferred to the workpiece 2 to be processed, and further avoiding the pressure ring 3 from leading a large amount of radio frequency energy to the workpiece 2 to be processed, thereby improving the uniformity of the radio frequency energy on the workpiece 2 to be processed, improving the uniformity of film deposition, and improving the process result of the workpiece 2 to be processed.
In the present embodiment, the workpiece 2 to be processed may be a wafer.
In the present embodiment, the outer peripheral wall of the tray 11 is provided with an annular boss 13; the insulating connecting part is arranged between the annular boss 13 and the snap ring 12, and the lower surface of the snap ring 12 and the upper surface of the annular boss 13 have a second preset distance (as shown by a distance B in fig. 2) in the vertical direction, and the second preset distance is sufficient to enable the snap ring 12 and the annular boss 13 to be mutually insulated in the axial direction.
Specifically, the annular boss 13 surrounds the tray 11 and is connected to the outer circumferential wall of the tray 11 to support the insulating connection member provided thereon, so that the snap ring 12 connected to the insulating connection member is supported by the insulating connection member. Since the annular boss 13 is connected to the outer circumferential wall of the tray 11, the lower surface of the snap ring 12 and the upper surface of the annular boss 13 have a second predetermined distance in the vertical direction, which enables the snap ring 12 and the annular boss 13 to be axially insulated from each other, so that the snap ring 12 and the annular boss 13 are axially insulated from each other, thereby allowing the snap ring 12 and the tray 11 to be axially insulated from each other.
In the present embodiment, the insulating connection member includes at least two insulating pins 14, the at least two insulating pins 14 are distributed at intervals along the circumferential direction of the annular boss 13, and both ends of each insulating pin 14 are connected to the annular boss 13 and the snap ring 12, respectively.
Specifically, insulating round pin 14 can be two, also can be three or more, and the one end of every insulating round pin 14 all is connected with annular boss 13, and the other end all is connected with snap ring 12, with a plurality of insulating round pins 14 along annular boss 13's circumference interval distribution, can improve insulating round pin 14 to the homogeneity that snap ring 12 supported to improve snap ring 12's stability.
Preferably, each of the insulating pins 14 includes a first pin portion 141 and a second pin portion 142, wherein the first pin portion 141 is tapered, and a first pin groove matched with the first pin portion 141 is formed on the lower surface of the snap ring 12; the second pin portion 142 is fixedly connected to the annular boss 13.
When the snap ring 12 is connected with the annular boss 13, the first pin groove on the lower surface of the snap ring 12 is aligned with the first pin portion 141 of the insulating pin 14, and the first pin portion 141 is inserted into the first pin groove, and at this time, the second pin portion 142 is located outside the first pin groove, so that the lower surface of the snap ring 12 and the upper surface of the annular boss 13 have a second preset distance in the vertical direction through the second pin portion 142. That is, the insulating pin 14 includes a first pin portion 141 and a second pin portion 142, wherein the first pin portion 141 can be inserted into the first pin groove when the snap ring 12 is connected to the annular boss 13, the second pin portion 142 is exposed outside the first pin groove and is located between the lower surface of the snap ring 12 and the upper surface of the annular boss 13, and the height of the second pin portion 142 is equal to a second predetermined distance (i.e., the two are equal in value). When dismantling snap ring 12 and annular boss 13, only need lift up snap ring 12 can, annular boss 13 and the dismouting of snap ring 12 can be convenient for to this kind of detachable connected mode of snap ring 12 to be convenient for to annular boss 13 and the maintenance or the change of snap ring 12.
As shown in fig. 4, a second embodiment of the present invention provides a carrying device, which is different from the first embodiment in the specific form of the insulating connecting member. The present embodiment mainly describes the insulating connection member in detail, and specifically, in the second embodiment, the insulating connection member includes an insulating pad 152, and a thickness of the insulating pad 152 is equal to a second preset distance (as shown by a distance B in fig. 4). Insulating gasket 152 is placed on the upper surface of annular boss 13, and the lower surface of insulating gasket 152 and the upper surface contact of annular boss 13, snap ring 12 are placed on the upper surface of insulating gasket 152, and the upper surface of insulating gasket 152 and the lower surface contact of snap ring 12 to make the lower surface of snap ring 12 and the upper surface of annular boss 13 have the second preset distance in the vertical direction through insulating gasket 152.
In the present embodiment, the inner circumferential wall of the snap ring 12 and the outer circumferential wall of the tray 11 also have a first preset distance (as indicated by a distance a in fig. 4) in the horizontal direction.
In this embodiment, the carrying device further includes an insulating fixing member 151, and the insulating fixing member 151 is used for fixing the snap ring 12, the insulating gasket 152 and the annular boss 13.
Alternatively, the insulating fixing member 151 may be an insulating nail, a through hole through which the insulating nail passes is formed in the annular boss 13, an insertion groove into which the insulating nail is inserted is formed in the lower surface of the snap ring 12, and the insulating nail can penetrate through the thickness of the insulating gasket 152. When the snap ring 12 is connected with the annular boss 13, the insulating nail penetrates through the through hole formed in the annular boss 13, penetrates through the thickness of the insulating gasket 152, and then inserts the insulating nail 151 into the insertion groove, so that the snap ring 12, the insulating gasket 152 and the annular boss 13 are fixed. At this time, the insulating spacer 152 is located between the lower surface of the snap ring 12 and the upper surface of the annular boss 13, so that the lower surface of the snap ring 12 and the upper surface of the annular boss 13 have a second preset distance in the vertical direction by the insulating spacer 152.
Optionally, the insulating nail may be a screw having an external thread, and an internal thread capable of being screw-fitted with the external thread is provided in the insertion groove, and the insulating nail is screwed into the insertion groove to be screw-fitted with the external thread through the internal thread, so that the insulating nail is connected with the insertion groove.
As shown in fig. 5, a third embodiment of the present invention provides a carrier apparatus, which is different from the first and second embodiments in the specific form of the insulating connecting member. Specifically, in the third embodiment, the insulating connection member includes a first insulating ring 161 and a second insulating ring 162, wherein the first insulating ring 161 is located on the upper surface of the annular boss 13 and is circumferentially disposed around the tray 11, and the radial dimension of the first insulating ring 161 is equal to the first preset distance (as indicated by distance a in fig. 5); the second insulating ring 162 is located on the upper surface of the annular boss 13 and is circumferentially disposed on the outer circumferential wall of the first insulating ring 161, the snap ring 12 is disposed on the second insulating ring 162 and is circumferentially disposed around the first insulating ring 161, and the thickness of the second insulating ring 162 is equal to a second predetermined distance (as indicated by a distance B in fig. 5).
In the third embodiment, when the snap ring 12 is connected to the annular boss 13, the snap ring 12 is simply placed on the upper surface of the second insulating ring 162 and surrounds the first insulating ring 161, so that the lower surface of the snap ring 12 and the upper surface of the annular boss 13 have a second predetermined distance in the vertical direction through the second insulating ring 162, and the inner circumferential wall of the snap ring 12 and the outer circumferential wall of the tray 11 have a first predetermined distance in the horizontal direction through the first insulating ring 161. This can further facilitate the attachment and detachment of the annular boss 13 and the snap ring 12, compared to the first embodiment, thereby further facilitating the maintenance or replacement of the annular boss 13 and the snap ring 12.
In the above embodiments, the inner circumferential wall of the snap ring 12 and the outer circumferential wall of the tray 11 have a first predetermined distance in the horizontal direction, the first predetermined distance is sufficient to enable the snap ring 12 and the tray 11 to be insulated from each other in the radial direction, the lower surface of the snap ring 12 and the upper surface of the annular boss 13 have a second predetermined distance in the vertical direction, and the second predetermined distance is sufficient to enable the snap ring 12 and the annular boss 13 to be insulated from each other in the axial direction.
Preferably, the first preset distance may be greater than or equal to 1 mm.
Preferably, the second preset distance may be greater than or equal to 1 mm.
Specifically, in the second embodiment, the thickness of the insulating spacer 152 may be set to be greater than or equal to 1mm, so that the second preset distance in the vertical direction between the lower surface of the snap ring 12 and the upper surface of the annular boss 13 is greater than or equal to 1 mm. In the third embodiment, the radial dimension of the first insulating ring 161 may be set to be greater than or equal to 1mm so that a first preset distance in the horizontal direction between the inner circumferential wall of the snap ring 12 and the outer circumferential wall of the tray 11 is greater than or equal to 1mm, and the thickness of the second insulating ring 162 may be set to be greater than or equal to 1mm so that a second preset distance in the vertical direction between the lower surface of the snap ring 12 and the upper surface of the annular boss 13 is greater than or equal to 1 mm.
In the above embodiments, the insulating connection member may be made of an insulating material such as ceramic, quartz, or high temperature resistant rubber.
As another technical solution, the present invention further provides a semiconductor apparatus, which includes a process chamber and a carrying device disposed in the process chamber, wherein the carrying device is the carrying device provided in any of the above embodiments, and the carrying device is used for carrying a workpiece 2 to be processed.
According to the semiconductor device provided by the embodiment of the invention, the bearing device provided by the invention is used for bearing the workpiece 2 to be processed, so that the occurrence of an ignition phenomenon can be avoided, and the contact between the pressure ring 3 and the process surface of the workpiece 2 to be processed can be avoided, so that the process result of the workpiece 2 to be processed is improved.
In summary, the bearing device and the semiconductor process chamber provided by the embodiment of the invention can avoid the occurrence of the sparking phenomenon, and can avoid the contact between the pressure ring 3 and the process surface of the workpiece 2 to be processed, so as to improve the process result of the workpiece 2 to be processed.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A load bearing device, comprising:
a base;
a tray located on the base;
the clamping ring is arranged around the tray in a surrounding mode, a first preset distance is formed between the inner peripheral wall of the clamping ring and the outer peripheral wall of the tray in the horizontal direction, and the first preset distance meets the requirement that the clamping ring and the tray are mutually insulated in the radial direction;
and the insulating connecting part is arranged between the tray and the clamping ring and used for insulating the clamping ring and the tray from each other.
2. The carrier according to claim 1 wherein the outer peripheral wall of the tray is provided with an annular boss;
the insulating connecting part is arranged between the annular boss and the clamping ring, a second preset distance is arranged between the lower surface of the clamping ring and the upper surface of the annular boss in the vertical direction, and the second preset distance can enable the clamping ring and the annular boss to be mutually insulated in the axial direction.
3. The carrying device as claimed in claim 2, wherein the insulating connecting part comprises at least two insulating pins, the at least two insulating pins are distributed at intervals along the circumferential direction of the annular boss, and two ends of each insulating pin are respectively connected with the annular boss and the snap ring.
4. The carrying device as claimed in claim 3, wherein each of the insulating pins comprises a first pin portion and a second pin portion, wherein the first pin portion is tapered, and a first pin groove matched with the first pin portion is formed in the lower surface of the snap ring; the second pin part is fixedly connected with the annular boss.
5. The carrier as claimed in claim 2 wherein the insulating connecting member includes an insulating spacer having a thickness equal to the second predetermined distance.
6. The carrier in accordance with claim 5 further comprising an insulating fixture for securing the snap ring, the insulating spacer, and the annular boss.
7. The carrier in accordance with claim 2 wherein the insulating connection member comprises a first insulating ring and a second insulating ring, wherein:
the first insulating ring is positioned on the upper surface of the annular boss and arranged around the tray in a surrounding mode, and the radial size of the first insulating ring is equal to the first preset distance;
the second insulating ring is located on the upper surface of annular boss, and encircle the setting and be in on the periphery wall of first insulating ring, the snap ring sets up on the second insulating ring, and encircle the setting and be in around the first insulating ring, and the thickness of second insulating ring equals the second is preset apart from.
8. The carrying device according to claim 1, wherein the first preset distance is greater than or equal to 1 mm.
9. The carrier device as claimed in claim 2 wherein the second predetermined distance is greater than or equal to 1 mm.
10. A semiconductor device, comprising a process chamber and a carrying device disposed in the process chamber, wherein the carrying device is the carrying device according to any one of claims 1 to 9, and the carrying device is used for carrying a workpiece to be processed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010254737.1A CN111446201B (en) | 2020-04-02 | 2020-04-02 | Bearing device and semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010254737.1A CN111446201B (en) | 2020-04-02 | 2020-04-02 | Bearing device and semiconductor equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111446201A true CN111446201A (en) | 2020-07-24 |
| CN111446201B CN111446201B (en) | 2023-07-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010254737.1A Active CN111446201B (en) | 2020-04-02 | 2020-04-02 | Bearing device and semiconductor equipment |
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| CN (1) | CN111446201B (en) |
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| CN113192876A (en) * | 2021-04-30 | 2021-07-30 | 北京北方华创微电子装备有限公司 | Semiconductor equipment and bearing device thereof |
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| CN113322440A (en) * | 2021-05-26 | 2021-08-31 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and process chamber thereof |
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| CN113186501A (en) * | 2021-03-17 | 2021-07-30 | 北京北方华创微电子装备有限公司 | Semiconductor device |
| CN113192876A (en) * | 2021-04-30 | 2021-07-30 | 北京北方华创微电子装备有限公司 | Semiconductor equipment and bearing device thereof |
| CN113322440A (en) * | 2021-05-26 | 2021-08-31 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and process chamber thereof |
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| Publication number | Publication date |
|---|---|
| CN111446201B (en) | 2023-07-14 |
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