CN114496896A - Wafer cleaning platform for wet process - Google Patents
Wafer cleaning platform for wet process Download PDFInfo
- Publication number
- CN114496896A CN114496896A CN202111677835.7A CN202111677835A CN114496896A CN 114496896 A CN114496896 A CN 114496896A CN 202111677835 A CN202111677835 A CN 202111677835A CN 114496896 A CN114496896 A CN 114496896A
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- CN
- China
- Prior art keywords
- clamping
- wafer
- platform
- clamping part
- bearing platform
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Abstract
The invention discloses a wafer cleaning platform for a wet process, which comprises: the wafer clamping device comprises a bearing platform and a plurality of clamping assemblies, wherein the plurality of clamping assemblies are all arranged on the bearing platform and are used for clamping a wafer together; the wafer clamping device comprises a first blowing pipeline, wherein the first blowing pipeline is arranged in the bearing platform, the first blowing pipeline penetrates through the upper surface of the bearing platform and is provided with a plurality of first blowing holes, and the axis of each first blowing hole is arranged towards the position where a clamping assembly is contacted with a wafer. By applying the wafer cleaning platform applicable to the wet process, the crystal accumulation of the cleaning liquid between the clamping assembly and the wafer is greatly reduced through the special sharp bulge design of the clamping assembly, and meanwhile, the air blowing cleaning of the cleaning liquid at the contact position of the clamping assembly and the wafer is realized by matching with the first air blowing pipeline, so that the wet cleaning quality of the wafer is ensured, and the residue of dirt is reduced.
Description
Technical Field
The invention relates to the technical field of wafer cleaning, in particular to a wafer cleaning platform for a wet process.
Background
At present, the wafer that accomplishes preliminary production process often need carry out corresponding cleaning work, manufacturing enterprise generally can adopt wet process to wash the wafer surface, centre gripping wafer to cleaning equipment in through the manipulator promptly, cleaning equipment is including corresponding spray assembly and pivoted plummer, and generally be through installing corresponding wafer clamping structure on the plummer to the spacing support of wafer, this kind of wafer clamping structure often is the hoop setting along the outer fringe of plummer, thereby make the outer fringe of wafer and the inboard counterbalance of a plurality of clamping structure realize the centre gripping fixed. However, in the actual wet process cleaning process, the existing wafer clamping structure often blocks part of the cleaning solution thrown off by the wafer, so that the cleaning solution forms crystal accumulation between the clamping structure and the edge of the wafer, and can also contaminate the upper surface of the susceptor, thereby causing adverse effects on the wafer cleaning operation.
Disclosure of Invention
In view of the above, the present invention provides a wafer cleaning platform for wet process, comprising:
the bearing platform is arranged on the base plate,
the clamping components are all arranged on the bearing platform and are used for clamping the wafer together;
the wafer clamping device comprises a first air blowing pipeline, wherein the first air blowing pipeline is arranged in the bearing platform, the first air blowing pipeline penetrates through the upper surface of the bearing platform and is provided with a plurality of first air blowing holes, and the axis of each first air blowing hole faces to one position where the clamping component is contacted with a wafer.
In another preferred embodiment, the clamping assembly comprises: the wafer clamping device comprises an installation part and a clamping head, wherein the installation part is fixedly connected with the bearing platform, the clamping head is arranged at the upper end of the installation part, and the clamping head is abutted to the outer edge of the lower surface of the wafer.
In another preferred embodiment, the mounting portion and the gripping head are of unitary construction.
In another preferred embodiment, the outer edge of the bearing platform is provided with a plurality of mounting grooves, each mounting portion is fixedly mounted in one of the mounting grooves, and the upper surface of the mounting portion is flush with the upper surface of the bearing platform.
In another preferred embodiment, the gripping head comprises: first clamping part, second clamping part and the third clamping part that from top to bottom connects gradually, the horizontal outline of first clamping part is less than the horizontal outline of second clamping part, the horizontal outline of second clamping part is less than the horizontal outline of third clamping part, the third clamping part with the upper surface connection of installation department, the wafer support in first clamping part with the junction of second clamping part.
In another preferred embodiment, the first clamping portion is provided in an upwardly projecting, pointed configuration.
In another preferred embodiment, the horizontal outer profile of the second clamping portion is gradually increased from top to bottom.
In another preferred embodiment, the horizontal outer profile of the third clamping portion is gradually increased from top to bottom.
In another preferred embodiment, an inclined surface is formed on an outer side of the second clamping portion, and an axis of the first blowing hole is disposed through the inclined surface.
In another preferred embodiment, the outer edge of the upper surface of the carrying platform is formed with an annular rim, and the level of the outer edge of the annular rim is lower than that of the inner edge of the annular rim.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the following positive effects: by applying the wafer cleaning platform applicable to the wet process, the crystal accumulation of the cleaning liquid between the clamping assembly and the wafer is greatly reduced through the special sharp bulge design of the clamping assembly, and meanwhile, the air blowing cleaning of the cleaning liquid at the contact position of the clamping assembly and the wafer is realized by matching with the first air blowing pipeline, so that the wet cleaning quality of the wafer is ensured, and the residue of dirt is reduced.
Drawings
FIG. 1 is a partial schematic view of a wafer cleaning platform for wet processing according to the present invention.
In the drawings:
1. a load-bearing platform; 2. a clamping assembly; 3. a wafer; 4. a first blow line; 5. an installation part; 6. a clamping head; 7. mounting grooves; 8. a first clamping portion; 9. a second clamping portion; 10. a third clamping part; 11. annular rim, 12, second blowing line.
Detailed Description
The invention is further described with reference to the following drawings and specific examples, which are not intended to be limiting.
As shown in fig. 1, a wafer cleaning platform for wet process according to a preferred embodiment is provided, which includes: the wafer clamping device comprises a bearing platform 1 and a plurality of clamping components 2, wherein the plurality of clamping components 2 are all arranged on the bearing platform 1, and the plurality of clamping components 2 are jointly used for clamping a wafer 3; the first blowing pipeline 4 is arranged in the bearing platform 1, the first blowing pipeline 4 penetrates through the upper surface of the bearing platform 1 and is provided with a plurality of first blowing holes, and the axis of each first blowing hole is arranged towards the position where one clamping component 2 contacts with the wafer 3. Further, through the cooperation of first gas blowing hole and clamping component 2 for first gas blowing hole sweeps towards the contact position of wafer 3 with clamping component 2, has avoided wafer 3 to throw off the crystallization of the washing liquid down through centrifugal force at the rotation in-process and has piled up, and a plurality of clamping component 2 set gradually along the outer fringe of the upper surface of load-bearing platform 1.
Further, as a preferred embodiment, a plurality of first blowing holes are sequentially arranged along the outer edge ring of the upper surface ring of the bearing platform 1.
Further, as a preferred embodiment, each clamping assembly 2 is aligned with at least one blowing hole.
Further, as a preferred embodiment, the first blowing pipe 4 is connected with a gas supply device for providing a strong gas flow into the first blowing pipe 4.
Further, as a preferred embodiment, the gas supply device is used for supplying nitrogen gas.
Further, as a preferred embodiment, the plurality of clamping assemblies 2 are arranged at equal intervals along the circumferential direction of the upper surface of the carrying platform 1.
Further, as a preferred embodiment, the clamping assembly 2 comprises: the wafer mounting structure comprises a mounting portion 5 and a clamping head 6, wherein the mounting portion 5 is fixedly connected with the bearing platform 1, the clamping head 6 is arranged at the upper end of the mounting portion 5, and the clamping head 6 abuts against the outer edge of the lower surface of the wafer 3.
Further, as a preferred embodiment, the mounting portion 5 and the gripping head 6 are of a unitary construction.
Further, as a preferred embodiment, the outer edge of the bearing platform 1 is provided with a plurality of mounting grooves 7, each mounting portion 5 is fixedly mounted in one of the mounting grooves 7, and the upper surface of the mounting portion 5 is flush with the upper surface of the bearing platform 1.
Further, as a preferred embodiment, the horizontal section of the mounting groove 7 is quadrilateral.
Further, as a preferred embodiment, the gripping head 6 comprises: the wafer clamping device comprises a first clamping part 8, a second clamping part 9 and a third clamping part 10 which are sequentially connected from top to bottom, wherein the horizontal outer contour of the first clamping part 8 is smaller than that of the second clamping part 9, the horizontal outer contour of the second clamping part 9 is smaller than that of the third clamping part 10, the third clamping part 10 is connected with the upper surface of the mounting part 5, and the wafer 3 is abutted to the joint of the first clamping part 8 and the second clamping part 9.
Further, as a preferred embodiment, the horizontal outer contour refers to an outer contour corresponding to a cross section of the structure along the horizontal direction.
Further, as a preferred embodiment, the horizontal cross section of the first clamping portion 8, the horizontal cross section of the second clamping portion 9 and the horizontal cross section of the third clamping portion 10 are all circular.
Further, as a preferred embodiment, the first clamping portion 8 is disposed in a sharp structure protruding upward.
Further, as a preferred embodiment, the horizontal outer profile of the first clamping portion 8 is gradually increased from top to bottom.
Further, as a preferred embodiment, the upper end of the first clamping portion 8 is disposed in a spherical shape.
Further, as a preferred embodiment, the horizontal outer profile of the second clamping portion 9 is gradually increased from top to bottom.
Further, as a preferred embodiment, the horizontal outer profile of the third clamping portion 10 is gradually increased from top to bottom.
Further, as a preferred embodiment, the outer wall of the third clamping portion 10 is arc-shaped.
Further, as a preferred embodiment, an inclined surface is formed on the outer side of the second clamping portion 9, and the axis of the first blowing hole is arranged through the inclined surface.
Further, as a preferred embodiment, the axis of the first blowing hole is parallel to and flush with the inclined surface.
Further, as a preferred embodiment, the outer edge of the upper surface of the loading platform 1 is formed with an annular rim 11, and the level of the outer edge of the annular rim 11 is lower than that of the inner edge of the annular rim 11.
Further, as a preferred embodiment, the clamping assembly 2 is disposed inside the annular rim 11.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope and the implementation manner of the present invention.
The present invention also has the following embodiments in addition to the above:
in a further embodiment of the present invention, the method further comprises: the second air blowing pipeline 12 is arranged in the bearing platform 1, the second air blowing pipeline 12 penetrates through the upper surface of the bearing platform 1 to form a plurality of second air blowing holes, and the axis of each second air blowing hole is obliquely and upwards arranged.
In a further embodiment of the invention, the axis of the second gas blowing holes is arranged towards the outer edge of the lower surface of the wafer 3.
In a further embodiment of the invention, the axis of the second blowing hole is arranged parallel to the axis of the first blowing hole.
In a further embodiment of the present invention, the first blowing holes are disposed in a first ring shape, and the second blowing holes are disposed in a second ring shape.
In a further embodiment of the invention, the diameter of the first ring is larger than the diameter of the second ring.
In a further embodiment of the invention, both the first blow line 4 and the second blow line 12 are used for blowing out nitrogen.
In a further embodiment of the invention, the second blow line 12 and the first blow line 4 can be connected to the same gas supply device by means of further lines.
In a further embodiment of the present invention, the first blowing pipe 4 comprises a plurality of first branch pipes, and one end of the plurality of first branch pipes is formed with the first blowing holes.
In a further embodiment of the present invention, each first branch pipeline includes a first horizontal pipeline, a vertical pipeline and a first inclined pipeline, which are connected in sequence, the first horizontal pipeline is disposed along the horizontal direction, the vertical pipeline is disposed along the vertical direction, the first inclined pipeline is disposed inclined with respect to the horizontal plane, and a higher end of the first inclined pipeline penetrates through the upper surface of the bearing platform 1 to form the first air blowing hole
In a further embodiment of the present invention, the other ends of the first branch pipes are connected in parallel to an air supply channel, and the air supply channel is used for connecting with an air supply device.
In a further embodiment of the present invention, the second blowing pipeline 12 includes a plurality of second branch pipelines, and one end of the plurality of second branch pipelines is formed with the second blowing hole.
In a further embodiment of the present invention, each of the second branch pipes includes a second horizontal pipe and a second inclined pipe, which are connected in sequence, the second horizontal pipe is arranged along the horizontal direction, the second inclined pipe is arranged in an inclined manner with respect to the horizontal plane, and a higher end of the second inclined pipe penetrates through the upper surface of the bearing platform 1 and forms the second air blowing hole.
In a further embodiment of the present invention, the other ends of the second branch pipes are connected in parallel and arranged with a gas supply channel.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (10)
1. A wafer cleaning platform for wet processes, comprising:
the bearing platform is arranged on the base plate,
the clamping assemblies are all arranged on the bearing platform and are used for clamping the wafer together;
first gas blowing pipeline, first gas blowing pipeline set up in the load-bearing platform, first gas blowing pipeline runs through load-bearing platform's upper surface is formed with a plurality of first gas blowing holes, each the axis of first gas blowing hole all faces one the position setting that centre gripping subassembly and wafer contacted.
2. The wafer cleaning platform of claim 1, wherein the clamping assembly comprises: the wafer clamping device comprises an installation part and a clamping head, wherein the installation part is fixedly connected with the bearing platform, the clamping head is arranged at the upper end of the installation part, and the clamping head is abutted to the outer edge of the lower surface of the wafer.
3. The wafer cleaning platform of claim 2, wherein the mounting portion and the clamping head are of a unitary construction.
4. The wafer cleaning platform for wet processes according to claim 2, wherein a plurality of mounting grooves are formed in the outer edge of the supporting platform, each mounting portion is fixedly mounted in one of the mounting grooves, and the upper surface of the mounting portion is flush with the upper surface of the supporting platform.
5. The wafer cleaning platform for wet processes of claim 2, wherein the clamping head comprises: first clamping part, second clamping part and the third clamping part that from top to bottom connects gradually, the horizontal outline of first clamping part is less than the horizontal outline of second clamping part, the horizontal outline of second clamping part is less than the horizontal outline of third clamping part, the third clamping part with the upper surface connection of installation department, the wafer support in first clamping part with the junction of second clamping part.
6. The wafer cleaning platform for wet processes according to claim 5, wherein the first clamping portion is provided in a sharp structure protruding upwards.
7. The wafer cleaning platform of claim 5, wherein the horizontal outer profile of the second clamping portion is gradually increased from top to bottom.
8. The wafer cleaning platform of claim 5, wherein the horizontal outer profile of the third clamping portion is gradually increased from top to bottom.
9. The platen as claimed in claim 7, wherein an inclined surface is formed on an outer side of the second clamping portion, and an axis of the first blowing hole is disposed through the inclined surface.
10. The platen as claimed in claim 1, wherein the outer edge of the upper surface of the platen has an annular rim formed thereon, and the outer edge of the annular rim has a lower level than the inner edge of the annular rim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111677835.7A CN114496896A (en) | 2021-12-31 | 2021-12-31 | Wafer cleaning platform for wet process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111677835.7A CN114496896A (en) | 2021-12-31 | 2021-12-31 | Wafer cleaning platform for wet process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114496896A true CN114496896A (en) | 2022-05-13 |
Family
ID=81510666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111677835.7A Pending CN114496896A (en) | 2021-12-31 | 2021-12-31 | Wafer cleaning platform for wet process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114496896A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115178435A (en) * | 2022-09-14 | 2022-10-14 | 上海图双精密装备有限公司 | Automatic wafer glue spreader |
-
2021
- 2021-12-31 CN CN202111677835.7A patent/CN114496896A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115178435A (en) * | 2022-09-14 | 2022-10-14 | 上海图双精密装备有限公司 | Automatic wafer glue spreader |
| CN115178435B (en) * | 2022-09-14 | 2022-12-30 | 上海图双精密装备有限公司 | Automatic wafer glue spreader |
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