CN214848565U - Sucking disc for adsorbing solar silicon wafer - Google Patents
Sucking disc for adsorbing solar silicon wafer Download PDFInfo
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- CN214848565U CN214848565U CN202121289810.5U CN202121289810U CN214848565U CN 214848565 U CN214848565 U CN 214848565U CN 202121289810 U CN202121289810 U CN 202121289810U CN 214848565 U CN214848565 U CN 214848565U
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- China
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- cover plate
- silicon wafer
- sucker body
- solar silicon
- sucker
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
The utility model relates to a solar energy silicon chip production apparatus. The purpose is to improve the sucking disc of the existing solar silicon wafer, and the improved sucking disc can effectively solve the problem that the cover plate surface adsorbs the silicon wafer due to air leakage, so that the silicon wafer is ensured to be smoothly positioned when being placed. The technical scheme is as follows: a sucker for adsorbing solar silicon wafers comprises a sucker body with a first side surface provided with an airflow groove and a cover plate which is arranged into a flat plate shape and covers the first side surface of the sucker body to seal the airflow groove; the method is characterized in that: the cover plate is provided with a plurality of small adsorption holes so as to adsorb the solar silicon wafer; the positions of the adsorption small holes correspond to the positions of the airflow grooves.
Description
Technical Field
The utility model relates to a solar energy silicon chip production apparatus specifically is an absorption solar energy silicon chip's sucking disc.
Background
Currently, the suction cups used for picking and placing solar silicon wafers on the market are generally used by stacking a plurality of suction cups (as shown in fig. 3) together to increase the working efficiency. When the silicon wafer sucking machine works, the sucker group is connected with a vacuum pump (not shown in the figure), and then silicon wafers are sucked in a quartz boat or a flower basket and conveyed to each production process.
The structure of a common sucker is shown in fig. 2 and mainly comprises a sucker body 1 and a cover plate 2, wherein an airflow groove 102 is formed in the sucker body, a plurality of adsorption pores 201 are formed in the bottom surface of the airflow groove, and after the airflow groove and the adsorption pores are processed, the cover plate is fixed on the sucker body through glue, so that the airflow groove is sealed, and only a port connected with a vacuum pump is reserved. However, in the process of coating the glue, more glue is coated and less glue is coated; the suction force is influenced by blocking the air flow groove or the small adsorption hole more, and the air leakage is easily caused at the connecting seam 3 between the cover plate and the sucker body when the suction force is too small. In the process of actually carrying the silicon wafer, the cover plate surface of the air-leaking sucker sometimes adsorbs the silicon wafer (as shown in fig. 4), so that the silicon wafer cannot be normally positioned and broken when being placed subsequently. Accordingly, there is a need for improvements to existing chuck constructions.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the not enough of above-mentioned background art, improved the sucking disc of current solar energy silicon chip, the sucking disc after the improvement should be able to effectively solve the problem that the apron face adsorbs the silicon chip because of leaking gas to guarantee that the silicon chip goes into the position smoothly when placing.
The utility model provides a technical scheme is:
a sucker for adsorbing solar silicon wafers comprises a sucker body with a first side surface provided with an airflow groove and a cover plate which is arranged into a flat plate shape and covers the first side surface of the sucker body to seal the airflow groove; the method is characterized in that: the cover plate is provided with a plurality of small adsorption holes so as to adsorb the solar silicon wafer; the positions of the adsorption small holes correspond to the positions of the airflow grooves.
The adsorption surface of the cover plate coincides with the first side surface of the sucker body.
The first side surface of the sucker body is provided with a concave platform positioned around the opening of the airflow groove so as to accommodate the cover plate; the depth of the concave platform is the same as the thickness of the cover plate.
The cover plate is fixedly connected with the sucker body through glue.
The utility model has the advantages that:
the utility model provides an among the sucking disc, adsorb the aperture and set up on the apron, make the apron face as the adsorption plane, after the air in the air current inslot is extracted by the vacuum pump, adsorb aperture department and form the negative pressure, the silicon chip is adsorbed on the apron, even the gas leakage takes place for the joint line between apron and the sucking disc body, the joint line is also the same with the adsorption affinity direction of adsorbing aperture department, the joint line acts as the effect of adsorbing the aperture this moment, thereby the problem of apron face adsorption silicon chip because of gas leakage has been solved, guaranteed the silicon chip in the position smoothly when subsequently placing, reduce the breakage rate of silicon chip.
Drawings
Fig. 1 is a schematic view of the structure of the middle suction cup of the present invention.
Fig. 2 is a schematic perspective view of a conventional suction cup.
FIG. 3 is a schematic view of a conventional suction cup set in a working state when the connecting seam is not air-leaking.
FIG. 4 is a schematic view of the prior art suction cup set in a working state when the connecting seam leaks air.
Reference numerals:
1. a suction cup body; 101. a first side surface; 102. an air flow groove; 103. a concave platform; 104. a second side surface; 2. a cover plate; 201. adsorption pores; 3. connecting seams; 4. and (3) a silicon wafer.
Detailed Description
The following further description is made with reference to the embodiments shown in the drawings.
The sucker for sucking the solar silicon wafer as shown in fig. 1 comprises a sucker body 1 and a cover plate 2. The sucker body and the cover plate are both plate-shaped, wherein the thickness of the sucker body is larger than that of the cover plate. The first side surface 101 of the sucker body is provided with an airflow groove 102, and a port of the airflow groove connected with the vacuum pump is positioned on the second side surface 104 of the sucker body (namely, the side surface of the sucker body vertical to the first side surface); the cover plate covers the first side face of the sucker body to seal the airflow groove. Preferably, the cover plate is fixedly connected with the sucker body through glue; other fixing modes can be adopted, such as the matching and fixing of a bolt and a positioning hole, the fixing of a screw and the like.
The first side surface of the sucker body is provided with a concave platform 103 positioned around the opening of the airflow groove so as to position and contain the cover plate, and meanwhile, the connecting seam of the cover plate and the sucker body is ensured to be positioned in the direction of the first side surface of the sucker body; the depth of concave station is the same with the thickness of apron to guarantee that the adsorption plane of apron coincides mutually with the first side of sucking disc body, prevent that the apron from protruding or sunken at the first side of sucking disc body, fish tail silicon chip surface when avoiding the sucking disc to adsorb silicon chip 4.
The cover plate is provided with a plurality of small adsorption holes 201; the positions of the adsorption small holes correspond to the positions of the airflow grooves. When the silicon chip cleaning device works, a vacuum pump (not shown in the figure) extracts air in the airflow groove, negative pressure is generated at the adsorption small holes, and therefore the silicon chip is adsorbed on the cover plate; because the sucking disc adopts the apron face as the adsorption plane, even the gas leakage takes place for connecting seam 3 between apron and the sucking disc body, the adsorption affinity direction that the connecting seam produced with absorption aperture department is also the same, and the connecting seam has acted as the effect of absorption aperture this moment, can guarantee that each silicon chip all is adsorbed at the homonymy (the first side direction of sucking disc body promptly) of corresponding sucking disc body, the smooth income position of follow-up silicon chip of being convenient for.
Finally, it should be noted that the above-mentioned embodiments illustrate only specific embodiments of the invention. Obviously, the present invention is not limited to the above embodiments, and many variations are possible. All modifications which can be derived or suggested by a person skilled in the art from the disclosure of the invention should be considered as within the scope of the invention.
Claims (4)
1. A sucker for absorbing solar silicon wafers comprises a sucker body (1) with a first side surface (101) provided with an airflow groove (102) and a cover plate (2) which is arranged into a flat plate shape and covers the first side surface of the sucker body to seal the airflow groove; the method is characterized in that: the cover plate is provided with a plurality of small adsorption holes (201) so as to adsorb the solar silicon wafer (4); the positions of the adsorption small holes correspond to the positions of the airflow grooves.
2. The chuck for adsorbing solar silicon wafers as claimed in claim 1, wherein: the adsorption surface of the cover plate coincides with the first side surface of the sucker body.
3. The chuck for adsorbing solar silicon wafers as claimed in claim 2, wherein: the first side surface of the sucker body is provided with a concave platform (103) positioned around the opening of the airflow groove so as to accommodate the cover plate; the depth of the concave platform is the same as the thickness of the cover plate.
4. The chuck for adsorbing solar silicon wafers as claimed in claim 3, wherein: the cover plate is fixedly connected with the sucker body through glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121289810.5U CN214848565U (en) | 2021-06-09 | 2021-06-09 | Sucking disc for adsorbing solar silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121289810.5U CN214848565U (en) | 2021-06-09 | 2021-06-09 | Sucking disc for adsorbing solar silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214848565U true CN214848565U (en) | 2021-11-23 |
Family
ID=78804783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121289810.5U Active CN214848565U (en) | 2021-06-09 | 2021-06-09 | Sucking disc for adsorbing solar silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214848565U (en) |
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2021
- 2021-06-09 CN CN202121289810.5U patent/CN214848565U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A suction cup for adsorbing solar silicon wafers Effective date of registration: 20220804 Granted publication date: 20211123 Pledgee: China Construction Bank Corporation Jiaxing Nanhu Sub-branch Pledgor: JIAXING NICEWAY PRECISION MACHINERY Co.,Ltd. Registration number: Y2022330001569 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |