CN212182293U - Film stripping tool for chip cutting - Google Patents
Film stripping tool for chip cutting Download PDFInfo
- Publication number
- CN212182293U CN212182293U CN202020978548.4U CN202020978548U CN212182293U CN 212182293 U CN212182293 U CN 212182293U CN 202020978548 U CN202020978548 U CN 202020978548U CN 212182293 U CN212182293 U CN 212182293U
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- China
- Prior art keywords
- lasso
- porous ceramic
- ceramic panel
- lateral surface
- bottom plate
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- Expired - Fee Related
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Abstract
The utility model discloses a chip cutting membrane stripping frock, including rectangular base, the spiro union has the location protective structure who cup joints at ceramic vacuum chuck lateral surface on the circular fixed station at rectangular base top, ceramic vacuum chuck includes porous ceramic panel, outer loop sealing washer, sucking disc bottom plate, trachea, central authorities adsorb the hole and peripheral absorption hole, location protective structure is including cup jointing at the first lasso of sucking disc bottom plate lateral surface, cup jointing at outer loop sealing washer lateral surface and with first lasso integrated into one piece's second lasso and fixed locate the inboard and crimping in the annular top ring at outer loop sealing washer top of second lasso top, be equipped with the opening on the annular top ring, first lasso is fixed on locating circular fixed station through the screw spiro union that the annular equidistance was arranged and is set up. The utility model discloses be applied to automatic membrane machine of shelling, to the fixed convenience of wafer location, and can effectively improve the wafer and shell membrane efficiency.
Description
Technical Field
The utility model belongs to the technical field of the membrane is shelled to the chip, concretely relates to membrane frock is shelled in chip cutting.
Background
The process worker of chip processing production need shell the membrane to the wafer, and traditional technique is shelled the membrane to the wafer and is adopted manual membrane machine of shelling to shell the membrane, and the anchor clamps of manual membrane machine of shelling adopt manual anchor clamps to press from both sides dress, operate inconveniently, if the manual anchor clamps that will press from both sides tight fixed wafer are applied to the automatic membrane machine of shelling of prior art, can make the wafer press from both sides tight fixed inconvenient, and fixed effect is slow, and production efficiency is low, and inconvenient membrane machine of shelling moreover.
Therefore, the chip cutting and film stripping tool applied to the automatic film stripping machine is convenient to position and fix a wafer and can effectively improve the film stripping efficiency of the wafer so as to solve the problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a film frock is shelled in chip cutting to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a film frock is shelled in chip cutting, includes the rectangular base, the spiro union has the location protective structure who cup joints at ceramic vacuum chuck lateral surface on the circular fixed station at rectangular base top, ceramic vacuum chuck including cup joint at the outer ring seal circle of porous ceramic panel lateral surface, locate porous ceramic panel bottom and through bolt and outer ring seal circle spiro union fixed sucking disc bottom plate, run through in the trachea that sucking disc bottom plate and porous ceramic panel put through mutually and locate central absorption hole and peripheral absorption hole on the porous ceramic panel, location protective structure including cup joint at the first lasso of sucking disc bottom plate lateral surface, cup joint at outer ring seal circle lateral surface and with first lasso ring integrated into one piece's second lasso and fixed locate the inboard annular top ring of crimping at outer ring seal circle top of second lasso ring top, be equipped with the opening on the annular top ring, first lasso ring is fixed to be located on the circular fixed station through the spiro union screw that the annular equidistance was arranged and was.
Preferably, an epoxy resin bonding layer is arranged between the outer ring sealing ring and the porous ceramic panel.
Preferably, the circular fixing table is provided with an inserting groove inserted with the air pipe.
Preferably, the bottom surface of the porous ceramic panel is provided with an arc-shaped strip inserted on the sucking disc bottom plate.
Preferably, the cross section of the annular top ring is triangular.
Preferably, the upper surface of the second ferrule is flush with the upper surface of the porous ceramic face plate.
The utility model discloses a technological effect and advantage: this membrane frock is shelled in chip cutting, can the vacuum adsorption wafer through setting up central authorities' absorption hole and peripheral absorption hole, realize the quick location and the fixing of wafer, conveniently shell the membrane of membrane machine, can effectual improvement shell membrane efficiency, the setting of the inserting groove on the circular fixed station, make things convenient for tracheal direction and place, cup joint location protective structure at ceramic vacuum chuck lateral surface and crimping at the top of circular fixed station, can fix a position ceramic vacuum chuck, the annular top ring on the location protective structure cup joints the top at porous ceramic panel lateral surface, can protect the wafer of placing at the porous ceramic panel top, the annular top ring upper shed open-ended sets up, the convenient dyestripping.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the ceramic vacuum chuck of the present invention;
FIG. 3 is a schematic structural view of the back side of the porous ceramic panel according to the present invention;
fig. 4 is a schematic structural view of the positioning protection structure of the present invention.
In the figure: 1. a rectangular base; 2. a circular fixed table; 3. a ceramic vacuum chuck; 4. positioning a protective structure; 5. a porous ceramic faceplate; 6. an outer ring seal ring; 7. a bolt; 8. a suction cup bottom plate; 9. an air tube; 10. a central adsorption hole; 11. peripheral adsorption holes; 12. an arc-shaped strip; 13. a first ferrule; 14. a second ferrule; 15. an annular top ring; 16. an opening; 17. and (4) screws.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a chip cutting and membrane stripping tool as shown in figures 1-4, which comprises a rectangular base 1, a circular fixed platform 2 at the top of the rectangular base 1 is screwed with a positioning protection structure 4 sleeved on the outer side surface of a ceramic vacuum chuck 3, the ceramic vacuum chuck 3 comprises an outer ring sealing ring 6 sleeved on the outer side surface of a porous ceramic panel 5, a chuck bottom plate 8 arranged at the bottom of the porous ceramic panel 5 and fixed with the outer ring sealing ring 6 by a bolt 7, an air pipe 9 penetrating through the chuck bottom plate 8 and communicated with the porous ceramic panel 5, and a central adsorption hole 10 and a peripheral adsorption hole 11 arranged on the porous ceramic panel 5, an epoxy resin bonding layer is arranged between the outer ring sealing ring 6 and the porous ceramic panel 5, an inserting groove inserted with the air pipe 9 is arranged on the circular fixed platform 2, an arc strip 12 inserted on the chuck bottom plate 8 is arranged on the bottom surface of the porous ceramic panel 5, the wafer can be adsorbed in vacuum by arranging the central adsorption hole 10 and the peripheral adsorption holes 11, so that the wafer can be quickly positioned and fixed, the film stripping of the film stripping machine is facilitated, the film stripping efficiency can be effectively improved, and the air pipe 9 can be conveniently guided and placed by arranging the insertion groove on the circular fixing table 2;
the positioning protection structure 4 comprises a first ferrule 13 sleeved on the outer side surface of the sucker bottom plate 8, a second ferrule 14 sleeved on the outer side surface of the outer ring seal ring 6 and integrally formed with the first ferrule 13, and an annular top ring 15 fixedly arranged on the inner side of the top of the second ferrule 14 and crimped on the top of the outer ring seal ring 6, wherein an opening 16 is formed in the annular top ring 15, the first ferrule 13 is fixedly arranged on the circular fixing table 2 through screws 17 arranged at equal intervals in an annular mode, the cross section of the annular top ring 15 is triangular, the upper surface of the second ferrule 14 is flush with the upper surface of the porous ceramic panel 5, the positioning protection structure 4 is sleeved on the outer side surface of the ceramic vacuum sucker 3 and crimped on the top of the circular fixing table 2, the ceramic vacuum sucker 3 can be positioned and fixed, and the annular top ring 15 on the positioning protection structure 4 is sleeved on the outer side surface of the porous ceramic panel 5, can protect placing the wafer at porous ceramic panel 5 top, the setting of annular top ring 15 upper shed 16 makes things convenient for the dyestripping.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (6)
1. The utility model provides a film stripping frock is cut to chip, includes rectangle base (1), its characterized in that: the utility model discloses a ceramic vacuum chuck (5) and porous ceramic panel (5) are connected in the middle of the round fixing platform (2) at rectangle base (1) top spiro union has cup joint in location protective structure (4) of ceramic vacuum chuck (3) lateral surface, ceramic vacuum chuck (3) including cup joint outer ring seal circle (6) at porous ceramic panel (5) lateral surface, locate porous ceramic panel (5) bottom and through central authorities adsorption hole (10) and peripheral adsorption hole (11) on bolt (7) and outer ring seal circle (6) spiro union fixed sucking disc bottom plate (8), run through trachea (9) that sucking disc bottom plate (8) and porous ceramic panel (5) put through mutually and locate porous ceramic panel (5), location protective structure (4) including cup joint first lasso (13) at sucking disc bottom plate (8) lateral surface, cup joint in outer ring (6) lateral surface and with first lasso (13) integrated into one piece's second lasso (14) and fixed locating second lasso (14) top inboard and crimping in outer ring seal up the outer ring The top ring (15) is arranged at the top of the ring (6), an opening (16) is formed in the top ring (15), and the first ring (13) is fixedly arranged on the circular fixing table (2) through screws (17) which are arranged in an annular and equidistant mode in a threaded mode.
2. The die cutting and stripping tool as claimed in claim 1, wherein: an epoxy resin bonding layer is arranged between the outer ring sealing ring (6) and the porous ceramic panel (5).
3. The die cutting and stripping tool as claimed in claim 1, wherein: the round fixing table (2) is provided with a plug-in groove which is plugged with the air pipe (9).
4. The die cutting and stripping tool as claimed in claim 1, wherein: the bottom surface of the porous ceramic panel (5) is provided with an arc-shaped strip (12) which is inserted on the sucker bottom plate (8).
5. The die cutting and stripping tool as claimed in claim 1, wherein: the section of the annular top ring (15) is triangular.
6. The die cutting and stripping tool as claimed in claim 1, wherein: the upper surface of the second ferrule (14) is flush with the upper surface of the porous ceramic panel (5).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202020978548.4U CN212182293U (en) | 2020-06-02 | 2020-06-02 | Film stripping tool for chip cutting |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202020978548.4U CN212182293U (en) | 2020-06-02 | 2020-06-02 | Film stripping tool for chip cutting |
Publications (1)
Publication Number | Publication Date |
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CN212182293U true CN212182293U (en) | 2020-12-18 |
Family
ID=73789238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202020978548.4U Expired - Fee Related CN212182293U (en) | 2020-06-02 | 2020-06-02 | Film stripping tool for chip cutting |
Country Status (1)
Country | Link |
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CN (1) | CN212182293U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112720119A (en) * | 2020-12-19 | 2021-04-30 | 华中科技大学 | Device and method for quickly positioning wafer |
CN115069639A (en) * | 2022-05-31 | 2022-09-20 | 江苏卓玉智能科技有限公司 | Cleaning device for semiconductor wafer |
CN116103628A (en) * | 2023-04-13 | 2023-05-12 | 华羿微电子股份有限公司 | Wafer evaporation auxiliary loading device |
-
2020
- 2020-06-02 CN CN202020978548.4U patent/CN212182293U/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112720119A (en) * | 2020-12-19 | 2021-04-30 | 华中科技大学 | Device and method for quickly positioning wafer |
CN112720119B (en) * | 2020-12-19 | 2021-11-30 | 华中科技大学 | Device and method for quickly positioning wafer |
CN115069639A (en) * | 2022-05-31 | 2022-09-20 | 江苏卓玉智能科技有限公司 | Cleaning device for semiconductor wafer |
CN115069639B (en) * | 2022-05-31 | 2023-11-14 | 江苏卓玉智能科技有限公司 | Cleaning device for semiconductor wafer |
CN116103628A (en) * | 2023-04-13 | 2023-05-12 | 华羿微电子股份有限公司 | Wafer evaporation auxiliary loading device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201218 Termination date: 20210602 |
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CF01 | Termination of patent right due to non-payment of annual fee |