CN212230405U

CN212230405U - Sucker applied to manipulator for transferring silicon wafers

Info

Publication number: CN212230405U
Application number: CN202021264597.8U
Authority: CN
Inventors: 刘国彬
Original assignee: Shenzhen De Aomei Technology Co ltd
Current assignee: Shenzhen De Aomei Technology Co ltd
Priority date: 2020-06-30
Filing date: 2020-06-30
Publication date: 2020-12-25
Anticipated expiration: 2030-06-30

Abstract

The utility model belongs to the technical field of the technique that the silicon chip shifted and specifically relates to a be applied to silicon chip and shift sucking disc with manipulator is related to, including adsorption part and installation department, the sword type limit has been seted up to the one end that the installation department was kept away from to the adsorption part. The present application has the following effects: the blade-shaped edge is arranged, so that the sucker can be more easily inserted into a gap between the silicon wafers, the requirement on the moving precision of a manipulator in the machining process is lowered, and the fault tolerance in the machining process is improved.

Description

Sucker applied to manipulator for transferring silicon wafers

Technical Field

The application relates to the technical field of silicon wafer transfer, in particular to a sucker applied to a manipulator for silicon wafer transfer.

Background

At present, silicon wafers need to be diffused after being subjected to texturing, and the diffusion process needs to transfer the silicon wafers in a flower basket into a quartz boat, and then the quartz boat is placed into a diffusion furnace. The silicon wafer is small in mass and thin in thickness, so that the silicon wafer is moved by adopting a sucking disc adsorption mode.

Referring to fig. 1, currently, a suction cup commonly used on a silicon wafer transfer robot has an airflow groove 400 thereon, one side of the suction cup has a vent hole 410 communicated with the airflow groove 400, a groove cover 420 is sealed at a notch of the airflow groove 400, a vacuum pump is used as a power source, the airflow groove 400 on each suction cup is communicated with the vacuum pump through an air pipe, and thus the vacuum pump is started to realize that the vent hole 410 on the suction cup adsorbs and fixes a silicon wafer.

The technical scheme has the following defects: when the sucker moves towards the silicon wafer, the sucker needs to be completely aligned with a gap between the silicon wafer and the silicon wafer, so that the sucker can be inserted between the silicon wafer and the silicon wafer to complete adsorption of the silicon wafer, and the precision requirement in the machining process is further improved.

SUMMERY OF THE UTILITY MODEL

The application aims to provide the sucker applied to the manipulator for transferring the silicon wafer, so that the sucker can be inserted into a gap between the silicon wafer and the silicon wafer more easily, the precision requirement in the machining process is reduced, and the fault tolerance is improved.

The technical purpose of the application is realized by the following technical scheme: the utility model provides a be applied to sucking disc of silicon chip transfer with manipulator, includes adsorption part and installation department, the edge type limit has been seted up to the one end that the installation department was kept away from to the adsorption part.

By adopting the technical scheme, when the sucker moves towards the silicon wafer, the edge-shaped edge is arranged to enable the sucker to be embedded into a gap between the silicon wafer and the silicon wafer more easily, so that the possibility of deformation of the silicon wafer caused by collision between the sucker and the silicon wafer is reduced, the precision requirement when the sucker is embedded into the gap between the silicon wafer and the silicon wafer is further reduced, and the fault tolerance in the machining process is improved.

The present application may be further configured in a preferred example to: the blade-shaped edge is obliquely arranged, and a first inclined plane is formed on the short side edge of the adsorption part.

Through adopting above-mentioned technical scheme, when the slope on sword type limit made the sucking disc to the space removal between silicon chip and the silicon chip, the one end far away from the installation department on sword type limit will inlay earlier and establish into the space to make the silicon chip part more easily, the sucking disc will inlay more easily and establish into the space, seting up on first inclined plane will make the sucking disc can follow the side embedding to the space of silicon chip, and then the sucking disc will have multiple embedding mode, has improved the suitability of sucking disc.

The present application may be further configured in a preferred example to: the long side of the adsorption part is far away from one end of the installation part and is provided with a bevel edge towards the blade edge, and two opposite side walls of the bevel edge are provided with second bevel surfaces.

By adopting the technical scheme, the matching of the edge-shaped edge and the bevel edge enables the sucker to be embedded into a gap between the silicon wafer and the silicon wafer more easily, and the precision requirement on the embedding direction of the sucker in the processing process is further reduced.

The present application may be further configured in a preferred example to: the thickness of installation department is greater than the thickness of adsorption part, the third inclined plane has been seted up with the junction of adsorption part to the installation department.

Through adopting above-mentioned technical scheme, when a plurality of sucking disc was arranged together, will form the space that supplies the silicon chip embedding between the absorption portion of two sucking discs, made things convenient for the entering of silicon chip, and offering on third inclined plane will reduce the probability that the silicon chip embedding bumps with the installation department behind the space to the damaged possibility of silicon chip has been reduced.

The present application may be further configured in a preferred example to: the sucking disc is kept away from and is seted up the seal groove on the one side on third inclined plane, the air channel has been seted up on the tank bottom of seal groove, set up the communicating gas pocket with the sucking disc opposite side on the tank bottom of air channel, the embedded closing plate that is equipped with of seal groove.

Through adopting above-mentioned technical scheme, can keep away from one of gas pocket at the air channel and draw air to air channel and gas pocket can produce the negative pressure on one side of adsorption part, make the silicon chip because of the local negative pressure on the adsorption part is adsorbed on the adsorption part, and then accomplish the transfer of silicon chip.

The present application may be further configured in a preferred example to: the adsorption part is provided with an adsorption groove communicated with the air hole, and the air hole is positioned at the bottom of the adsorption groove.

Through adopting above-mentioned technical scheme, the gas pocket can make and form the negative pressure state in the adsorption tank to can adsorb the silicon chip in the adsorption part, and because of seting up of adsorption tank, the silicon chip can laminate better in the adsorption part, and then has reduced the probability that the silicon chip dropped from the adsorption part when removing.

The present application may be further configured in a preferred example to: the adsorption tank is annular.

By adopting the technical scheme, the adsorption tank can better match the shape of the silicon wafer, so that the silicon wafer can be tightly attached to the adsorption part when being adsorbed on the adsorption part, and the falling probability of the silicon wafer is further reduced.

The present application may be further configured in a preferred example to: the installation part is provided with an air exhaust through groove, and the vent groove is communicated with the air exhaust through groove.

Through adopting above-mentioned technical scheme, when using the sucking disc to adsorb the silicon chip, can bleed the air channel through leading to the groove of bleeding to form the negative pressure in gas pocket department, thereby made things convenient for the use of sucking disc.

The present application may be further configured in a preferred example to: and mounting holes are formed at four top corners of the mounting part.

Through adopting above-mentioned technical scheme, the sucking disc can be installed on the manipulator through the mounting hole to the sucking disc can remove along with the removal of manipulator, and then accomplish the transfer to the silicon chip.

In summary, according to the present application, at least one of the following beneficial technical effects can be obtained:

1. the edge-shaped edge is arranged, so that the sucking disc can be more easily inserted into a gap between the silicon wafers, the requirement on the moving precision of a manipulator in the machining process is reduced, and the fault tolerance in the machining process is improved;

2. the slope on sword type limit, seting up of first inclined plane and absorption groove and make the sucking disc can reduce the probability that takes place the extrusion between sucking disc and the silicon chip when imbedding the space between silicon chip and the silicon chip more easily, ensured the structural integrity of silicon chip, and improved the adsorption effect to the silicon chip, suitable silicon chip is difficult for dropping from the sucking disc at the transfer in-process.

Drawings

Fig. 1 is an overall structural view of the related art;

FIG. 2 is a schematic diagram of the overall structure of the present application;

fig. 3 is an exploded view of the present application.

Reference numerals: 100. an adsorption part; 110. a blade-shaped edge; 120. a first inclined plane; 130. a bevel edge; 140. a second inclined plane; 150. an adsorption tank; 200. an installation part; 210. a third inclined plane; 220. an air extraction through groove; 230. mounting holes; 300. a sealing groove; 310. a sealing plate; 320. a vent channel; 330. air holes; 400. an air flow groove; 410. a vent hole; 420. and (4) a groove cover.

Detailed Description

The present application is described in further detail below with reference to the attached drawings.

Referring to fig. 2, the present application discloses a chuck applied to a robot for transferring a silicon wafer, which can be more easily inserted into a gap between silicon wafers, thereby reducing the requirement on the moving precision of the robot during the processing and improving the fault tolerance. It includes adsorption part 100 and installation department 200, and edge type limit 110 has been seted up to the one end that adsorption part 100 kept away from installation department 200 to when the sucking disc removes at random the manipulator and when inlaying to the space between silicon chip and the silicon chip, edge type portion can make two silicon chips that are close to each other separately, thereby the sucking disc will be more easily embedded into in the space between silicon chip and the silicon chip, and then required when having reduced the manipulator and removing, has improved the fault-tolerance in the course of working.

Referring to fig. 2 and 3, in the present embodiment, the blade edge 110 is obliquely disposed, and when the blade edge 110 moves to a gap between a silicon wafer and a silicon wafer, one end of the blade edge 110 is inserted first, which reduces a contact area between the blade edge 110 and the silicon wafer, so that the blade edge 110 can be better inserted between the silicon wafer and the silicon wafer. And first inclined plane 120 has been seted up to the short side edge of adsorption part 100 to sword type limit 110 can be more than can follow the top of silicon chip and imbed in the space between silicon chip and the silicon chip, can also be along with the removal of manipulator and imbed from the side top, and then has increased the embedding mode of sucking disc, has improved the suitability of sucking disc to different operating modes.

Referring to fig. 2, the long side of the absorption portion 100 is far away from one end of the installation portion 200 and is provided with an inclined edge 130 towards the edge-shaped edge 110, the two opposite side walls of the inclined edge 130 are provided with second inclined surfaces 140, when the suction cup moves from the upper side of the silicon wafer to the silicon wafer, the connection point of the edge-shaped edge 110 and the inclined edge 130 is embedded into the gap first, the two adjacent silicon wafers are separated easily due to the cooperation of the edge-shaped edge 110 and the second inclined surfaces 140, so that the suction cup is inserted into the gap between the two silicon wafers more easily, and the requirement for precision in the processing process is further reduced. In this embodiment, the thickness of installation department 200 is greater than the thickness of adsorption part 100, third inclined plane 210 has been seted up to installation department 200 and adsorption part 100's junction, arrange when fixing on the manipulator when a plurality of sucking discs, will form the space that supplies the silicon chip embedding between the two adjacent sucking discs, thereby make things convenient for sucking the silicon chip behind the space between two silicon chips of sucking disc embedding, third inclined plane 210 has then reduced the probability that the sucking disc bumps with the silicon chip at the embedding in-process, and then has ensured the structural integrity of silicon chip.

Referring to fig. 2 and 3, in order to adsorb the silicon wafer, a sealing groove 300 is formed on one side of the chuck away from the third inclined plane 210, a sealing plate 310 for maintaining air tightness is bonded on a notch of the sealing groove 300, an air vent 320 is formed on a bottom of the sealing groove 300, an air hole 330 communicated with the other side of the chuck is formed on the bottom of the air vent 320, and when the chuck is used, the air vent 320 can be evacuated, so that a negative pressure is formed at the air hole 330, and the silicon wafer is adsorbed on the chuck by using an air pressure difference. In order to improve the adsorption effect of the adsorption part 100 on the silicon wafer, the adsorption part 100 is provided with an adsorption groove 150 communicated with the air hole 330, the air hole 330 is displaced on the bottom of the adsorption groove 150, when the vent groove 320 exhausts air to form negative pressure at the air hole 330 and the silicon wafer is adsorbed on the adsorption part 100, the silicon wafer covers the adsorption groove 150, so that the air hole 330 forms negative pressure in the adsorption groove 150, the effective adsorption area of the adsorption part 100 on the silicon wafer is increased, and the adsorption effect of the suction disc on the silicon wafer is improved.

Referring to fig. 2, the adsorption groove 150 is annular, in this embodiment, two adsorption grooves 150 are formed on the adsorption part 100, and one air hole 330 is formed at each of the bottoms of the two adsorption grooves 150. In order to improve the adsorption effect on the special-shaped silicon wafer, the two adsorption grooves 150 are arranged in a staggered manner, and the two air holes 330 in the two adsorption grooves 150 are close to each other, so that the adsorption part 100 of the adsorption part 100 on the special-shaped silicon wafer corresponds to the regular part in the special-shaped silicon wafer, and the possibility that the special-shaped silicon wafer falls off from the adsorption part 100 is reduced.

Referring to fig. 2 and 3, simultaneously, in order to conveniently bleed air into the air duct 320, the installation part 200 is provided with a through groove 220 for bleeding, one end of the air duct 320 is communicated with the through groove 220 for bleeding, and four vertex angles of the installation part 200 are provided with the installation holes 230, so that the sucker can be conveniently installed on the manipulator, the sucker is installed on the manipulator through the installation holes 230, and the manipulator can bleed air into the air duct 320 through the through groove 220 for bleeding, thereby controlling the sucker to suck and put down the silicon wafer.

The embodiments of the present invention are preferred embodiments of the present application, and the scope of protection of the present application is not limited by the embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. The utility model provides a be applied to sucking disc of silicon chip transfer with manipulator, includes absorption portion (100) and installation department (200), its characterized in that: one end of the adsorption part (100) far away from the installation part (200) is provided with a blade-shaped edge (110).

2. The chuck applied to a robot for transferring a silicon wafer as set forth in claim 1, wherein: the blade-shaped edge (110) is obliquely arranged, and a first inclined surface (120) is formed on the short side of the adsorption part (100).

3. The chuck applied to a robot for transferring a silicon wafer as set forth in claim 2, wherein: one end of the long side edge of the adsorption part (100) far away from the installation part (200) faces the edge-shaped edge (110) and is provided with a bevel edge (130), and two opposite side walls of the bevel edge (130) are provided with second bevel surfaces (140).

4. The chuck applied to a robot for transferring a silicon wafer as set forth in claim 1, wherein: the thickness of installation department (200) is greater than the thickness of adsorption part (100), third inclined plane (210) have been seted up to installation department (200) and the junction of adsorption part (100).

5. The chuck applied to a robot for transferring a silicon wafer as set forth in claim 4, wherein: the sucking disc has been kept away from and has been seted up seal groove (300) on the one side of third inclined plane (210), air channel (320) have been seted up on the tank bottom of seal groove (300), set up on the tank bottom of air channel (320) with the communicating gas pocket (330) of sucking disc opposite side, the embedded closing plate (310) that is equipped with of seal groove (300).

6. The chuck applied to a robot for transferring a silicon wafer as set forth in claim 5, wherein: the adsorption part (100) is provided with an adsorption groove (150) communicated with the air hole (330), and the air hole (330) is positioned at the bottom of the adsorption groove (150).

7. The chuck applied to a robot for transferring a silicon wafer as set forth in claim 6, wherein: the adsorption tank (150) is annular.

8. The chuck applied to a robot for transferring a silicon wafer as set forth in claim 7, wherein: the installation part (200) is provided with an air exhaust through groove (220), and the vent groove (320) is communicated with the air exhaust through groove (220).

9. The chuck applied to a robot for transferring a silicon wafer as set forth in claim 8, wherein: four top corners of the mounting part (200) are provided with mounting holes (230).