JPS62249446A - Holder and usage of the same - Google Patents

Abstract

PURPOSE:To improve workability by a method wherein grooves, holding parts for respective pellets and suction inlets for the respective pellet holding parts are provided in a holder. CONSTITUTION:When the suction pipe 11 of a holder 4 is connected to a negative pressure source, a wafer 1 is put on the holder 4 in such a manner that the main surface 1b of the wafer 1 touches the holding surface 6 and scribe lines 3 are matched with grooves 7. When the negative pressure is supplied by opening a switching valve 12, the wafer 1 is held by the main part 5 of the holder 4 by vacuum suction through respective suction inlets 9. In this state, the wafer 1 is cut into pellets 2A by a grinder 16. If the switching valve 12 is closed while the pellets 2A are being sucked and held by respective holding parts 8, the sucking and holding state is fixed and the operations such as washing and drying are carried out under the condition that all the pellets 2A are held together by the holder 4. After that, by inserting ejector pins 17 into respective through-holes 13 from the bottom of the main part 5, the respective pellets 2A are pushed up altogether from the respective holding parts 8 and transferred to a tray or the like by a scooping jig 18. With this constitution, workability can be improved and damages caused by the breaking operation can be avoided.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a holding technique and a technique that directly uses the same, particularly a technique for holding an object by vacuum suction, and a technique for holding an object by vacuum suction. The present invention relates to a technique for separating a wafer into small pieces in a state that is effective for use in, for example, a guising process in which a wafer is divided into pellets in the manufacture of semiconductor devices.

[Conventional technology]

In the manufacture of semiconductor devices, a method of dicing wafers into pellets involves attaching the wafers to adhesive tape.
There is a method of cutting the wafer along the scribe line with a diamond grindstone and then applying a bending load to the wafer to completely divide the wafer into pellets (pre-king).

An example that describes dicing technology is "Electronic Materials November 1982 Special Issue" published by Kogyo Research Association Co., Ltd.
Published on November 18, 1981, pages 67-68 are available.

[Problem that the invention seeks to solve]

However, in this dicing method, the braking depends on natural phenomena, which may result in incorrect cutting into pellets, the occurrence of unexpected fragments and FM scratches, and product defects such as disconnections and short circuits. The present inventor has discovered that there is a problem in that this occurs.

SUMMARY OF THE INVENTION An object of the present invention is to provide a holding device that enables complete division work while holding an object.

Another object of the present invention is to provide a dicing method that can completely divide a wafer into pellets by using the holding device.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means for solving problems]

An overview of typical inventions disclosed in this application is as follows.

That is, a main body having a holding surface that attracts the object to be held;
A groove carved in the holding surface of the main body, a suction port opened in each of the divided piece holding parts surrounded by the groove, a suction furnace connected to each suction port, and a suction furnace that opens and closes. A valve body is provided.

[Effect]

According to the above means, since the groove is cut in the holding device, the object to be held can be completely separated while the object is held in the main body. Furthermore, since the suction ports are provided in each divided piece holding section, each completely divided divided piece is held separately. Moreover, by closing the valve, the adsorption and holding state of each divided piece is maintained fixedly, so the divided piece group can be handled as one with the main body, ensuring ease of handling in subsequent processes. can.

〔Example〕

FIG. 1 is a perspective view showing a wafer holding device which is an embodiment of the present invention, FIG. 2 is an enlarged partial vertical sectional view showing one step of a dicing method which is an embodiment of the method of using the device, and FIG. Similarly, FIG. 4 is an enlarged partial vertical cross-sectional view showing another process, and a perspective view showing a jig used in the method.

In this embodiment, this wafer holding device is configured to hold a wafer 1. This wafer 1 has a plurality of pellet parts 2 each having an integrated circuit built therein.
It is provided on the main surface 1a, and each pellet portion 2 is defined by a scribe line 3.

The holding device 4 includes a main body 5 formed in a substantially disk shape, and the main body 5 has a holding surface 6 formed in a planar shape substantially equal to that of the wafer 1 . A plurality of grooves 7 are cut in the holding surface 6 and are arranged in a checkerboard pattern so as to correspond to the scribe lines 3 of the wafer 1. f! ! Depending on the department,
Pellet holding portions that hold two pellets (described later) as divided pieces are respectively arranged and opened in a substantially square frame shape, and a suction path 10 is fluidly connected to each suction port 9, respectively. Each suction path 10 is connected to a suction pipe 11 as a main path, and the suction pipe 11 is configured to be connectable to a negative pressure source (not shown) such as a vacuum pump, and is also configured to be connected to a negative pressure source (not shown) such as a vacuum pump or the like. The flow path is configured to be opened and closed by an on-off valve 12.

A plurality of insertion holes 13 are arranged in the main body 5 so as to correspond to the approximate center of each pellet holding portion 8, and are bored through the main body 5 in the thickness direction. The ejector pin is inserted through the ejector pin.

Further, a male fitting portion 14 is provided on the outside of the holding surface 6 of the main body 5.
are cut concentrically and to a constant depth, and a female fitting part 15 is cut concentrically and to a constant depth on the end surface of the main body 5 opposite to the holding surface 6. The parts 14 and 15 are set so that they can fit into each other, so that a plurality of parts can be held.

Next, an example of the method of use according to the present invention will be explained by describing an example of a dicing method using the wafer holding device having the above configuration.

When the holding device 4 connects its suction tube 11 to a negative pressure source,
The wafer 1 is held such that the second main surface 1b is in contact with the holding surface 6.
And scribe line 3? a 7 and placed on the holding device 4. When the on-off valve 12 is opened and negative pressure is supplied, each suction port 9 vacuum-chucks the second main surface lb to the holding surface 6 and holds the wafer 1 in the main body 5.

While held by the main body 5, the wafer 1 is cut along the scribe line 3 by a diamond grindstone 16.

At this time, what happens to the holding surface 6 of the main body 5? Since R7 is cut, the wafer 1 can be completely divided. By this division, the berets/tooth 2A are each cut out.

Each separated pellet 1-2A is each pellet 1
Since the suction ports 9 are arranged in each of the temple parts 8, the suction ports 9 are held independently by each holding part 8, but since the main body 5 is integrated, their integrity is maintained.

At this time, if the suction port 9 is annularly disposed on the outer edge, the pellet 2A will be strongly adsorbed, and the pellet 2A will be strongly held.

When the on-off valve 12 is closed while the pellet 1-2A is adsorbed and held by the holding portion 8, the negative pressure state is maintained, so that the adsorption and holding state for the pellet 1-2A is fixed. In this manner, cleaning, drying, etc. are carried out with the pellets 1-2A group being collectively held in the holding device 4.

Thereafter, as shown in FIG. 4, the ejector pins 17 are inserted into the respective insertion holes 13 from below the main body 5, so that the pellets 2A are raised from the respective holders 8 at once. The Beret 2A group that was presented to me was
The pellets are scooped out by a scooping jig 18 as shown in FIG. 4, and transferred to a tray or the like that accommodates each pellet separately. This jig 18 is equipped with a scooping member 19 in the shape of a comb tooth with a pitch corresponding to the scribe line 3 of the wafer 1 and the ds7 of the holding device 4, and the ejector pin 17 is inserted between the adjacent scooping members 19 and 19. By doing so, the pellets 2A are bridged between adjacent slotting members 19 and 19.

According to the embodiment described above, the following effects can be obtained.

+11 By providing a groove in the holding device, each pellet holding part, and a suction port for each holding part, it is possible to completely separate the wafer into pellets while holding the wafer by suction during the guising process, so that the subsequent pre-king is possible. The work can be simplified, and as a result, workability can be improved, and the occurrence of obstacles associated with the pre-king work can be avoided.

(2) The separated pellets are configured to be independently adsorbed and held by each suction port, and an on-off valve is provided so that the adsorbed and held state can be fixedly maintained. Even after the pellets are separated, the pellets can be held in their wafer form using a holding device, making it possible to handle the pellets all at once during subsequent operations, which reduces work efficiency due to complete separation. can be prevented.

(3) By providing an ejector pin insertion hole for each holding part, when removing the pellet from the holding device, the pellet can be scooped out without contacting the first main surface. Compared to the case where the main surface is held by suction, it is possible to suppress the occurrence of troubles such as scratches on the pellets.

(4) By arranging the suction port annularly around the outer edge of the pellet holding part, the suction is increased, making it possible to firmly hold the pellet, and providing an ejector pin insertion hole in the pellet holding part. can be made possible.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, the means for removing the pellet from the holding device is not limited to scooping up the pellet using a jig as shown in FIG. 4, but may also be carried out by suctioning and holding the pellet with a vacuum suction collet and lifting it. therefore,
The ejector pin insertion hole can be omitted.

The suction ports are not limited to being arranged in an annular shape, but may be large in the center.

The means for dividing the wafer into pellets is not limited to cutting using a diamond grindstone, but may also include cutting using a laser.

The holding device according to the present invention is not limited to being used to hold a wafer in a dicing process, but can also be used in other processes and other fields.

The above explanation has mainly explained the case where the invention made by the present inventor is applied to wafer holding technology, which is the background application field, but it is not limited thereto, and is applicable to general article holding devices. INDUSTRIAL APPLICABILITY The present invention exhibits remarkable effects when used to hold a plate-like object when it is divided into small pieces.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

By providing the holding device with a groove, each pellet holding part, and a suction port for each holding part, the object to be held can be completely divided into multiple pieces while being held by suction. The work can be simplified, and as a result, workability can be improved, and the occurrence of obstacles associated with the pre-king work can be avoided.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing a wafer holding device which is an embodiment of the present invention, Fig. 2 is an enlarged partial longitudinal sectional view showing one step of a dicing method which is an embodiment of its usage, and Fig. 3 is a perspective view showing a wafer holding device which is an embodiment of the present invention. Similarly, an enlarged partial vertical sectional view showing another process ＼ FIG. 4 is a perspective view showing a jig used in the method. 1... Wafer (object to be held), 1a... First principal surface, 1
b...Second main surface, 2...Pellet part, 2 people...Pellet (divided piece), 3...Scripe line, 4...
・Wafer holding device, 5...Main body, 6...Holding surface, 7
...Groove, 8...Bellet holding part, 9...Suction port,
DESCRIPTION OF SYMBOLS 10... Suction path, 11... Suction pipe, 12... Open/close valve, 13... Ejector pin insertion hole, 14... Male fitting part, 15... Female fitting part, 16... ... Diamond enemy, 17... Ejector bin, 18... Pellet scooping jig, 19... Scooping member. Main Agent Patent Attorney Yoshio Ogawa Figure 1 Figure 2 Figure 3 Figure 4

Claims (1)

[Claims] 1. A main body having a holding surface that attracts objects to be held, a groove carved in the holding surface of the main body, and a suction provided in each of the divided piece holding parts surrounded by the groove. A holding device comprising an opening, a suction path communicating with each suction port, and a valve for opening and closing the suction path. 2. The holding device according to claim 1, wherein the main bodies are configured to be stacked in parallel to the holding surfaces of the other parties. 3. The holding device according to claim 1, wherein a plurality of grooves are arranged in a grid pattern. 4. The holding device according to claim 1, wherein the suction port is arranged in an annular manner around the outer periphery of the divided piece holding portion. 5. The holding device according to claim 1, wherein the main body is provided with a pin insertion hole in each divided piece holding portion. 6. A main body having a holding surface that attracts objects to be held, a groove carved in the holding surface of the main body, suction ports respectively interposed in the divided piece holding parts surrounded by the groove, and each suction A method for using a holding device comprising suction passages each communicating with a mouth, and a valve for opening and closing the suction passage, wherein an object to be held is brought into contact with the holding surface of the main body, and a negative is applied to the suction passage. A step of supplying pressure to hold the object by vacuum suction through each of the suction ports, a step of dividing the object to be held into separate pieces along the grooves, and a step of closing the valve to maintain the vacuum suction holding state. A method for using a holding device, comprising the step of immobilizing it. 7. Holding according to claim 6, characterized in that the divided piece held by suction on the holding surface is scooped out in a state pushed up by a pin through an insertion hole provided in the divided piece holding part. How to use the device.