CN103219259B - A kind of wafer processing jig - Google Patents
A kind of wafer processing jig Download PDFInfo
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- CN103219259B CN103219259B CN201210015670.1A CN201210015670A CN103219259B CN 103219259 B CN103219259 B CN 103219259B CN 201210015670 A CN201210015670 A CN 201210015670A CN 103219259 B CN103219259 B CN 103219259B
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- carrying platform
- adsorption holes
- round recessed
- wafer
- regulation
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Abstract
The present invention relates to wafer processing techniques field, and in particular to a kind of processing jig.A kind of wafer wafers processing jig, including carrying platform, carrying platform are provided with adsorbing mechanism, and adsorbing mechanism includes a plurality of regulation adsorption holes being arranged in the middle part of carrying platform and a plurality of fixed adsorption holes for being arranged on carrying platform periphery.A plurality of fixed adsorption holes are arranged on carrying platform in annular, and a plurality of regulation adsorption holes are arranged on the inside of fixed adsorption hole.A plurality of fixed adsorption holes fix getter device by gas passage connection one.A plurality of regulation adsorption holes adjust getter device by gas passage connection one, and the absorption air pressure of adsorption hole is adjusted by adjusting getter device.The present invention solves wafer in stage clamping fixation problem of processing and draw a design, it is ensured that the state consistency of intermediate region and periphery when wafer is processed so that crudy is consistent.
Description
Technical field
The present invention relates to wafer processing techniques field, and in particular to a kind of processing jig.
Background technology
With developing rapidly for semiconductor and chip technology, all kinds of specification product wafers are more and more, and product diversification must
Requirements at the higher level so are proposed to product wafer manufacturing process and quality control.Product wafer general requirements has 4 inches, 6 inches, 8 English
Very little, 12 inches even more big specification, generally circular plate, thickness is typically in below 3mm.Its material is fragility material
Material, in wafer transmission and the fixation of process clamping, easily causes Wafer wafer fragmentations to scrap.
Traditional wafer processing tool is skive high speed circumgyration incision, with the increase of device integration, chip
Size, Cutting Road are wide, the distance of active area to edge constantly reduces.Other wafer thickness is thinned increasingly, and chip chipping, warpage become
Shape, particulate pollution, roughness, damage layer, stress rupture, cracky, the problems such as production capacity declines, fragment rate and blade are lost with
.Grinding mode can not meet present wafer process requirements.
Laser machine as contactless wafer cutting processing, laser energy by obtaining high-energy-density after optical focus,
Directly silicon chip corrosion is gasified, the silicon chip section of cutting has the surface of certain roughness and the heat etching area of bottom line.In addition,
Laser can be effectively absorbed by silicon materials, therefore it can carry out fine micro Process in very narrow width regions, reach to material point
The rupture failure of sub-key level.
Traditional wafer fixed platform, for the ease of transfer operation, normally only supports crystal circle center region, and by outer peripheral areas
Vacate so that transport mechanism can touch bottom and be held up, the method for this clamping wafer will necessarily cause its clamping
Rear stability is difficult to ensure that, and intermediate region and peripheral state are inconsistent in wafer fabrication processes, and whole Zhang Jingyuan processes matter
Amount is difficult to ensure that consistent.
The content of the invention
It is an object of the present invention to provide a kind of wafer processing jig, solves above technical problem.
Technical problem solved by the invention can be realized using following technical scheme：
A kind of wafer processing jig, including a carrying platform, it is characterised in that the carrying platform is provided with an adsorption machine
Structure, a plurality of regulation adsorption holes that the adsorbing mechanism includes being arranged in the middle part of the carrying platform are put down with the carrying is arranged on
A plurality of fixed adsorption holes on platform periphery；
A plurality of fixed adsorption holes are arranged on the carrying platform in annular, a plurality of regulation adsorption holes
It is arranged on the inside of the fixed adsorption hole；
A plurality of fixed adsorption holes fix getter device by gas passage connection one；
A plurality of regulation adsorption holes adjust getter device by gas passage connection one, are adjusted by adjusting getter device
Save the absorption air pressure of adsorption hole.
The characteristics of present invention is for crystal round fringes thickness intermediate thin, designs two sets of independent adsorbing mechanisms, in the webbing of wafer
Adsorb and fix at edge, residue is adsorbed inside wafer.The fixed adsorbing mechanism suction of absorption is stronger and without regulatory function, absorption
The adsorbing mechanism of residue can adjust the power for adsorbing residue by gas passage., can be by adjusting air-breathing during present invention work
Device regulation absorption air pressure, the power for adjusting internal cutting absorption residue, preventing suction, excessive to cause wafer to burst apart broken.
The carrying platform surface is additionally provided with a cutting groove mechanism, the cut-in groove mechanism include a big round recessed,
A plurality of small round recesseds, the internal diameter of the big round recessed is more than the external diameter of the small round recessed, and the small round recessed is uniformly arranged
In the middle part of the carrying platform, the big round recessed is arranged on the roundlet recessed circumferential.In the place design groove with cutting,
It is overhead to ensure cutting path, this ensure that the absorption of residue is excluded in process.
A plurality of small round recesseds are interconnected by gas passage, a plurality of regulations of gas passage UNICOM
Adsorption hole.To be further implemented in cutting process, the purpose of residue is adsorbed.
A plurality of fixed adsorption holes are arranged on the outside of the big round recessed.So as under the absorption of fixed adsorption hole,
When cutting great circle groove, still ensure that absorption is fixed.
The periphery of the carrying platform is arranged on the fixed adsorption hole provided with material breach, the material breach that picks and places is picked and placeed
Outside.During for manual feeding, facilitate the placement of wafer, can easily be picked and placeed from material indentation, there is picked and placeed.
The rectangular body of carrying platform, the big round recessed, the small round recessed are arranged on the upper of the carrying platform
Surface, it is described to pick and place the left and right sides that material breach is arranged on the carrying platform.
Tool, which is additionally provided with, on the top and bottom sidewall of the carrying platform picks and places groove.In order to install and remove the present invention.
The present invention can close absorption residue when processing is completed using the fixed design worked independently with absorption residue of absorption
Air-flow, easily with sucker take out finished product；On the one hand the design of cut-in groove mechanism ensure that the smooth discharge of residue, while
So that needing the position tool processed not contacted with wafer, laser will not be acted on tool, would not also there is the problem of being welded,
So the material to tool does not have particular/special requirement, cost of manufacture greatly reduces, and can be truly realized quality-high and inexpensive.In addition, this hair
The bright wafer that also solves is in stage clamping fixation problem of processing and draw a design, it is ensured that the shape of intermediate region and periphery when wafer is processed
State is consistent so that crudy is consistent.
Brief description of the drawings
Fig. 1 is outer surface structure schematic diagram of the invention；
Fig. 2 is internal structure schematic diagram of the invention；
Fig. 3 is dimensional structure diagram of the invention.
Embodiment
In order that the technical means, the inventive features, the objects and the advantages of the present invention are easy to understand, tie below
Conjunction, which is specifically illustrating, is expanded on further the present invention.
Reference picture 2, Fig. 3, a kind of wafer processing jig, including a carrying platform 1, carrying platform 1 are provided with an adsorption machine
Structure, adsorbing mechanism includes being arranged on a plurality of regulation adsorption holes 2 at the middle part of carrying platform 1 and is arranged on the periphery of carrying platform 1
A plurality of fixed adsorption holes 3.A plurality of fixed adsorption holes 3 are arranged on carrying platform 1 in annular, a plurality of regulation adsorption holes
2 are arranged on the fixed inner side of adsorption hole 3.A plurality of fixed adsorption holes 3 fix getter device by gas passage connection one.It is a plurality of
Adjust adsorption hole 2 and getter device is adjusted by the connection of gas passage 21 one, the absorption of adsorption hole 2 is adjusted by adjusting getter device
Air pressure.The characteristics of present invention is for crystal round fringes thickness intermediate thin, designs two sets of independent adsorbing mechanisms, at the thick rim of wafer
Absorption is fixed, and residue is adsorbed inside wafer.The fixed adsorbing mechanism suction of absorption is stronger and without regulatory function, adsorbs residue
Adsorbing mechanism can by gas passage adjust adsorb residue power., can be by adjusting getter device during present invention work
Regulation absorption air pressure, the power for adjusting internal cutting absorption residue, preventing suction, excessive to cause wafer to burst apart broken.
Reference picture 1, the surface of carrying platform 1 is additionally provided with a cutting groove mechanism, and it is recessed that cut-in groove mechanism of institute includes a great circle
Groove 4, a plurality of small round recesseds 5, the internal diameter of big round recessed 4 are more than the external diameter of small round recessed 5, and small round recessed 5, which is uniformly arranged on, to be held
The middle part of carrying platform 1, big round recessed 4 is arranged on the small periphery of round recessed 5.In the place design groove with cutting, it is ensured that cutting path
It is overhead, this ensure that the absorption of residue is excluded in process.A plurality of small round recesseds 5 are mutual by gas passage 51
Connection, a plurality of regulation adsorption holes 2 of gas passage UNICOM.To be further implemented in cutting process, the purpose of residue is adsorbed.
A plurality of fixed adsorption holes 3 are arranged on the big outside of round recessed 4.Under the absorption of fixed adsorption hole 3, to cut big round recessed
When at 4, still ensure that absorption is fixed.
Reference picture 1, Fig. 3, the periphery of carrying platform 1 pick and place material breach 6 and are arranged on fixed absorption provided with material breach 6 is picked and placeed
The outside in hole 3.During for manual feeding, facilitate the placement of wafer, can easily be picked and placeed at material breach 6 from picking and placeing.
The rectangular body of carrying platform 1, big round recessed 4, small round recessed 5 are arranged on the upper surface of carrying platform 1, pick and place material and lack
Mouth 6 is arranged on the left and right sides of carrying platform 1.Tool is additionally provided with the top and bottom sidewall of carrying platform 1 and picks and places groove 7.In order to
Install and remove the present invention.
The present invention can close absorption residue when processing is completed using the fixed design worked independently with absorption residue of absorption
Air-flow, easily with sucker take out finished product；On the one hand the design of cut-in groove mechanism ensure that the smooth discharge of residue, while
So that needing the position tool processed not contacted with wafer, laser will not be acted on tool, would not also there is the problem of being welded,
So the material to tool does not have particular/special requirement, cost of manufacture greatly reduces, and can be truly realized quality-high and inexpensive.In addition, this hair
The bright wafer that also solves is in stage clamping fixation problem of processing and draw a design, it is ensured that the shape of intermediate region and periphery when wafer is processed
State is consistent so that crudy is consistent.
Reference picture 3, carrying platform 1 of the invention picks and places material breach 6 provided with four, and four pick and place material breach 6 and uniformly set
Put in the left and right sides of carrying platform 1.The gas passage 21 of the side of carrying platform 1 and a plurality of regulation adsorption hole 2 UNICOMs, pass through
Outside regulation getter device regulation absorption air pressure.
The general principle and principal character and advantages of the present invention of the present invention has been shown and described above.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the simply explanation described in above-described embodiment and specification is originally
The principle of invention, without departing from the spirit and scope of the present invention, various changes and modifications of the present invention are possible, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (6)
1. a kind of wafer processing jig, including a carrying platform, it is characterised in that the carrying platform is provided with an adsorption machine
Structure, a plurality of regulation adsorption holes that the adsorbing mechanism includes being arranged in the middle part of the carrying platform are put down with the carrying is arranged on
A plurality of fixed adsorption holes on platform periphery；
A plurality of fixed adsorption holes are arranged on the carrying platform in annular, and a plurality of regulation adsorption holes are set
On the inside of the fixed adsorption hole；
A plurality of fixed adsorption holes fix getter device by gas passage connection one；
A plurality of regulation adsorption holes adjust getter device by gas passage connection one, by adjusting getter device regulation suction
The absorption air pressure in attached hole；
The carrying platform surface is additionally provided with a cutting groove mechanism, and the cut-in groove mechanism includes a big round recessed, plural number
Individual small round recessed, the internal diameter of the big round recessed is more than the external diameter of the small round recessed, and the small round recessed is uniformly arranged on institute
State in the middle part of carrying platform, the big round recessed is arranged on the roundlet recessed circumferential.
2. a kind of wafer processing jig according to claim 1, it is characterised in that a plurality of small round recesseds pass through gas
Body passage is interconnected, and the gas passage connects a plurality of regulation adsorption holes.
3. a kind of wafer processing jig according to claim 1 or 2, it is characterised in that a plurality of fixed adsorption holes
It is arranged on the outside of the big round recessed.
4. a kind of wafer processing jig according to claim 3, it is characterised in that the periphery of the carrying platform is provided with and taken
Blowing breach, it is described to pick and place the outside that material breach is arranged on the fixed adsorption hole.
5. a kind of wafer processing jig according to claim 4, it is characterised in that the rectangular body of carrying platform, institute
State big round recessed, the small round recessed and be arranged on the upper surface of the carrying platform, the material breach that picks and places is arranged on described hold
The left and right sides of carrying platform.
6. a kind of wafer processing jig according to claim 5, it is characterised in that on the top and bottom sidewall of the carrying platform
It is additionally provided with tool and picks and places groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210015670.1A CN103219259B (en) | 2012-01-19 | 2012-01-19 | A kind of wafer processing jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210015670.1A CN103219259B (en) | 2012-01-19 | 2012-01-19 | A kind of wafer processing jig |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103219259A CN103219259A (en) | 2013-07-24 |
| CN103219259B true CN103219259B (en) | 2017-09-12 |
Family
ID=48816943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210015670.1A Expired - Fee Related CN103219259B (en) | 2012-01-19 | 2012-01-19 | A kind of wafer processing jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103219259B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103801843A (en) * | 2014-01-22 | 2014-05-21 | 李丰 | Multifunctional sucker used for cutting |
| TWI590355B (en) * | 2016-02-25 | 2017-07-01 | 南茂科技股份有限公司 | Wafer testing fixture, wafer dynamic test fixture and wafer testing method |
| CN109360804B (en) * | 2018-09-28 | 2023-02-10 | 上海微松工业自动化有限公司 | Leveling and fixing device for 12-inch wafer |
| CN109624109A (en) * | 2019-02-20 | 2019-04-16 | 广州安特激光技术有限公司 | A kind of plummer of wafer cutter device |
| TWI773368B (en) * | 2021-06-08 | 2022-08-01 | 環球晶圓股份有限公司 | Wafer fixture structure and processing apparatus for causing high-temperature creep deformation |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101221920A (en) * | 2007-12-25 | 2008-07-16 | 中国电子科技集团公司第四十五研究所 | Wafer adsorption mechanism |
| CN101794726A (en) * | 2009-02-02 | 2010-08-04 | 优志旺电机株式会社 | Workpiece stage and exposure apparatus using the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6722642B1 (en) * | 2002-11-06 | 2004-04-20 | Tokyo Electron Limited | High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism |
| US20100111650A1 (en) * | 2008-01-31 | 2010-05-06 | Applied Materials, Inc. | Automatic substrate loading station |
| CN101992507B (en) * | 2009-08-13 | 2013-06-12 | 中芯国际集成电路制造(上海)有限公司 | Wafer cutting tool and method for cutting wafer by using same |
| CN102082206B (en) * | 2010-12-15 | 2012-09-05 | 沈阳仪表科学研究院 | Special scribing and cutting worktable for solar cell chip |
-
2012
- 2012-01-19 CN CN201210015670.1A patent/CN103219259B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101221920A (en) * | 2007-12-25 | 2008-07-16 | 中国电子科技集团公司第四十五研究所 | Wafer adsorption mechanism |
| CN101794726A (en) * | 2009-02-02 | 2010-08-04 | 优志旺电机株式会社 | Workpiece stage and exposure apparatus using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103219259A (en) | 2013-07-24 |
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Granted publication date: 20170912 Termination date: 20200119 |