CN219267629U - Double-sided suction pen for silicon wafer - Google Patents

Abstract

The utility model provides a double-sided suction pen for a silicon wafer, which belongs to the field of solar cells and comprises a pen holder and a sucker fixedly arranged at the end part of the pen holder, wherein two vacuumizing vent holes are formed in the pen holder, and two vacuum suction holes communicated with the vent holes are symmetrically formed in two opposite end surfaces of the sucker so as to enable the sucker to be adsorbed on two sides. According to the utility model, two vent holes are arranged, and vacuum suction holes are arranged on both sides of the suction cup, when the silicon wafers facing the inner surface of the graphite boat are required to be sucked, the suction cup stretches into the space between two adjacent silicon wafers, after a piece of silicon wafer is sucked, the suction cup or the suction pen does not need to be rotated, and the suction cup only needs to stretch into the suction cup in the original direction, and the other side of the suction cup can suck the silicon wafers; when the silicon wafers at different positions in the graphite boat are required to be sucked, the sucking disc or the sucking pen does not need to be rotated, so that the sucking disc pollution problem caused by personnel contacting the sucking disc is reduced, the situation that the silicon wafers are polluted is avoided, the defective rate of the production line is reduced, the operation procedure is reduced to a certain extent, and the production efficiency is improved.

Description

Double-sided suction pen for silicon wafer

Technical Field

The utility model belongs to the technical field of solar cell manufacturing, and particularly relates to a silicon wafer double-sided suction pen.

Background

In the coating process of the solar cell, a silicon wafer suction pen is required to be used for sucking up the silicon wafer and then placing the silicon wafer in a graphite boat, and after coating is finished, the silicon wafer is required to be taken out by the suction pen. The graphite boat is a carrier commonly used in the solar battery coating process, and the suction pen continuously repeatedly acts between the film taking and the film placing.

When the suction pen is used for taking out the silicon wafer, the graphite boat is used for loading the silicon wafer on two sides, so that an operator is required to rotate the suction pen by 180 degrees after the silicon wafer on one side is taken out, and then the silicon wafer on the other side is taken out. Because the pen holder of inhaling the pen is connected with the external vacuum tube, the operation of rotating the pen holder is inconvenient, and an operator is required to pinch the suction pen head (the sucking disc) by hand to rotate, so that the operation process is increased, pollution is inevitably brought to the sucking disc, silicon wafer pollution is caused when the suction pen is taken out again, and defective products of a production line are increased.

Disclosure of Invention

The embodiment of the utility model provides a double-sided suction pen for a silicon wafer, which aims to solve the problems that the single-sided suction pen is inconvenient to operate and causes silicon wafer pollution.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a two-sided pen of inhaling of silicon chip, include: the vacuum chuck comprises a pen holder and a sucker fixedly arranged at the end part of the pen holder, wherein two vent holes for vacuumizing are formed in the pen holder, and vacuum suction holes which are respectively communicated with the vent holes are symmetrically formed in two opposite end surfaces of the sucker, so that two vacuum ventilation channels are formed, and the sucker can be adsorbed on two surfaces.

In one possible implementation manner, the sucker comprises a sucker body and adsorption tables arranged on two opposite end surfaces of the sucker body, the sucker body is provided with a communication hole communicated with the vent hole, and the vacuum suction hole is arranged on the adsorption tables.

In one possible implementation, the pore diameter of the communication hole is smaller than the pore diameter of the vacuum suction hole.

In one possible implementation, the vacuum suction hole is a flare.

In one possible implementation, the surface of the adsorption stage is further provided with a flexible buffer layer.

In one possible implementation manner, two pipe joints are arranged on the side surface of the lower end of the pen holder, and the pipe joints are respectively communicated with the ventilation holes.

In one possible implementation manner, a Y-shaped three-way valve is arranged at the lower end of the pen holder, and the Y-shaped three-way valve is communicated with each vent hole.

In one possible implementation, the pen holder is in a cuboid shape, and the width W of the pen holder (5) is smaller than the thickness D of the sucker body (11).

In one possible implementation, the pen holder is sleeved with an anti-slip sleeve.

Compared with the prior art, the silicon wafer double-sided suction pen has the beneficial effects that: two vent holes are formed in the pen holder, vacuum suction holes communicated with the vent holes are formed in two sides of the suction cup, when a silicon wafer opposite to the inner side of the graphite boat needs to be sucked, the suction cup stretches into the space between two adjacent silicon wafers, after a piece of silicon wafer is sucked, the suction cup or the suction pen does not need to be rotated, and the suction cup only needs to stretch into the space in the original direction, so that the silicon wafer can be sucked by the other side of the suction cup; when the silicon wafers at different positions in the graphite boat are required to be sucked, the sucking disc or the sucking pen does not need to be rotated, so that the sucking disc pollution problem caused by the fact that personnel contact the sucking disc is reduced, the situation that the silicon wafers are polluted is avoided, the defective rate of a production line is further reduced, meanwhile, the operation procedure is reduced due to the fact that the sucking disc or the sucking pen does not need to be rotated, the production efficiency is improved, and the production period is shortened.

Drawings

Fig. 1 is a schematic structural diagram of a silicon wafer double-sided suction pen according to an embodiment of the present utility model;

FIG. 2 is a schematic side view of the dual-sided suction pen of the silicon wafer provided in FIG. 1;

fig. 3 is a schematic structural diagram II of a silicon wafer double-sided suction pen according to an embodiment of the present utility model;

FIG. 4 is a schematic side view of the dual-sided suction pen of the silicon wafer shown in FIG. 3;

reference numerals illustrate:

1. a suction cup; 11. a suction cup body; 12. an adsorption table; 2. a flexible buffer layer; 3. a communication hole; 4. vacuum suction holes; 5. a penholder; 51. a vent hole; 6. a pipe joint; 7. an anti-skid sleeve; 8. y-shaped three-way valve.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

Referring to fig. 1 to 4, a description will now be given of a dual-sided suction pen for silicon chips according to the present utility model. The double-sided suction pen for the silicon wafer comprises a pen holder 5 and a suction cup 1 fixedly arranged at the end part of the pen holder 5, wherein two vent holes 51 for vacuumizing are formed in the pen holder 5, vacuum suction holes 4 which are respectively communicated with the vent holes 51 are symmetrically formed in two opposite end surfaces of the suction cup 1, and two vacuum ventilation channels are formed so that the suction cup 1 can be adsorbed on the two sides.

According to the double-sided suction pen for the silicon wafers, two parallel vent holes which are not communicated with each other are formed in the pen holder, the vacuum suction holes 4 which are communicated with the vent holes 51 are formed in the two sides of the suction cup 1, when the silicon wafers opposite to the inner surface of the graphite boat are required to be sucked, the suction cup 1 stretches into the space between the two adjacent silicon wafers, after one silicon wafer is sucked, the suction cup 1 does not need to be rotated or the suction pen does not need to be rotated, the suction cup 1 only stretches into the space in the original direction, and the silicon wafers can be sucked by the other side of the suction cup 1; when the silicon wafers at different positions in the graphite boat are required to be sucked, the sucking disc 1 or the sucking pen does not need to be rotated, the pollution problem of the sucking disc 1 caused by the fact that personnel contact the sucking disc 1 is reduced, the situation that the silicon wafers are polluted is avoided, the defective rate of a production line is further reduced, meanwhile, the operation procedures and the operation times are reduced to a certain extent due to the fact that the sucking disc 1 or the sucking pen does not need to be rotated, the production efficiency is improved, and the production period is shortened.

The other ends of the two vent holes are communicated with an external vacuum pump, and the vacuum pump forms vacuum at the vacuum suction hole 4 of the suction cup 1 through a pen holder to adsorb the silicon wafer on the suction cup 1. When adsorbing the silicon chip, the sucking disc butt is on the silicon chip surface, and the silicon chip is with vacuum suction hole shutoff, then through the air vent bleed, and the internal atmospheric pressure of vacuum suction hole is less than external atmospheric pressure, and the sucking disc can be with the silicon chip suction, and after placing the silicon chip in predetermined position, stop the vacuum pump work, the atmospheric pressure of vacuum suction hole department is unanimous with external atmospheric pressure, and the sucking disc no longer has adsorption affinity, can make silicon chip and sucking disc separate. Arrows in fig. 1 and 3 show the direction of the vacuuming airflow.

In some embodiments, as shown in fig. 1 to 4, the suction cup 1 includes a suction cup body 11 and suction tables 12 disposed on opposite end surfaces of the suction cup body 11, and the suction cup body 11 is provided with a communication hole 3 communicating with the vent hole 51; the vacuum suction hole 4 is provided on the suction table 12. Through the adsorption platform that sets up, reduce sucking disc and silicon chip area of contact, reduce the wearing and tearing of sucking disc to the silicon chip.

In some embodiments, as shown in fig. 1 to 4, the aperture of the communication hole 3 is smaller than that of the vacuum suction hole 4, and this design can increase the suction surface, raise the suction force, and avoid the problem of silicon wafer slipping caused by insufficient suction force.

In some embodiments, as shown in fig. 3 to 4, the vacuum suction hole 4 is a horn-shaped mouth, so that a larger vacuum cavity can be formed between the silicon wafer and the suction cup, the suction area is increased, and the suction force is further improved.

In some embodiments, as shown in fig. 1 to 4, the surface of the adsorption table 12 is further provided with a flexible buffer layer 2, and when the wafer is adsorbed and taken out, the flexible buffer layer 2 is in direct contact with the silicon wafer, so that damage to the silicon wafer during adsorption can be avoided. The flexible buffer layer 2 may be made of rubber, fiber, or the like.

In some embodiments, as shown in fig. 1 and 2, two pipe joints 6 are disposed on the side of the lower end of the pen shaft 5, and the pipe joints 6 are respectively connected to the ventilation holes 51. The pen holder is made of hard materials such as stainless steel or aluminum alloy, and the vent hole of the pen holder is connected with the vacuum pump by a hose so as to facilitate the operation of the pen holder. The hose is directly inserted into the pipe joint, and of course, a valve is also required to be arranged on the hose to respectively control the on-off of each vacuum ventilation channel, when one surface of the suction pen adsorbs, the valve for controlling the vacuum ventilation channel is opened, and the other valve is required to be closed.

Alternatively, the pipe joint is directly replaced by a ball valve.

Alternatively, as shown in fig. 3, a Y-shaped three-way valve 8 is installed at the lower end of the pen holder, and the on-off of the two vacuum ventilation channels is realized by rotating the operating rod of the Y-shaped three-way valve 8. The vacuum pump is directly connected to the Y-shaped three-way valve 8 through a hose.

In some embodiments, taking fig. 1 and 2 as an example, the pen shaft 5 is in a rectangular parallelepiped shape, and the width W of the pen shaft 5 is smaller than the thickness D of the sucker body 11. Wherein H is the height of the pen holder, and L is the length of the pen holder. The pen holder is flat, so that two vent holes are conveniently arranged in parallel.

In some embodiments, the pen shaft 5 is sleeved with an anti-slip sleeve 7, as shown in fig. 3 to 4. The pen holder 5 is the part that operating personnel held by hand, through the anti-skidding sleeve 7 that sets up, can avoid holding the time hand slip and cause the unstable problem of getting the piece process, promotes the security of getting the piece operation. Wherein, the anti-slip sleeve 7 is a rubber sleeve provided with anti-slip protruding points.

In the foregoing embodiments, the descriptions of the embodiments are emphasized, and in part, not described or illustrated in any particular embodiment, reference is made to the related descriptions of other embodiments.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.

Claims (9)

1. The utility model provides a two-sided suction pen of silicon chip which characterized in that includes: the novel vacuum chuck comprises a pen holder (5) and a sucker (1) fixedly arranged at the end part of the pen holder (5), wherein two vent holes (51) for vacuumizing are formed in the pen holder (5), and vacuum suction holes (4) respectively communicated with the vent holes (51) are symmetrically formed in two opposite end surfaces of the sucker (1) to form two vacuum ventilation channels so that the sucker (1) can be adsorbed on two surfaces.

2. The double-sided suction pen for silicon wafers according to claim 1, wherein the suction cup (1) comprises a suction cup body (11) and suction tables (12) arranged on two opposite end surfaces of the suction cup body (11), and a communication hole (3) for communicating the vent hole (51) is arranged on the suction cup body (11); the vacuum suction holes (4) are arranged on the adsorption table (12).

3. The double-sided suction pen for silicon wafers according to claim 2, wherein the pore diameter of the communication hole (3) is smaller than the pore diameter of the vacuum suction hole (4).

4. The double-sided suction pen for silicon wafers according to claim 2, wherein the vacuum suction hole (4) is a horn-shaped mouth.

5. The double-sided suction pen for silicon wafers according to claim 2, wherein the surface of the suction table (12) is further provided with a flexible buffer layer (2).

6. The silicon wafer double-sided suction pen as claimed in claim 1, wherein two pipe joints (6) are arranged on the side surface of the lower end of the pen holder (5), and the pipe joints (6) are respectively communicated with the vent holes (51).

7. The double-sided absorbing pen for silicon chips according to claim 1, wherein a Y-shaped three-way valve (8) is arranged at the lower end of the pen holder (5), and the Y-shaped three-way valve (8) is communicated with each vent hole (51).

8. The silicon wafer double-sided suction pen as claimed in claim 2, wherein the pen holder (5) is in a cuboid shape, and the width W of the pen holder (5) is smaller than the thickness D of the suction cup body (11).

9. The silicon wafer double-sided suction pen as claimed in claim 1, wherein the pen holder (5) is sleeved with an anti-slip sleeve (7).

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